JP2009065030A - Photoelectric converting device, and manufacturing method for the photoelectric converting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide technique for easily installing an ID mark, even on a substrate having an end surface polished into a curved surface, for reading. <P>SOLUTION: This photoelectric conversion device is provided with a substrate, where a photoelectric conversion unit is formed and the ID mark stuck on the end surface of the substrate; and the end surface of the substrate is the curved surface, the ID mark has a sheet stuck on the end surface of the substrate, and identification information for identifying the substrate is drawn on the sheet. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a photoelectric conversion device, and more particularly to a solar cell.

  A photoelectric conversion device exemplified by a solar cell is manufactured through a number of processes. When mass-producing photoelectric conversion devices, in the middle of the manufacturing process, ensure traceability so that individual photoelectric conversion devices can be identified and manage the manufacturing process. It is desirable that the inspection performance can be confirmed. In order to identify the photoelectric conversion device, a mark (hereinafter referred to as an ID mark) in which an identification ID number is described is used.

  In the case of a photoelectric conversion device in which a photoelectric conversion unit is formed on a substrate, a technique for providing an ID mark on the substrate is known. Patent documents 1-4 are mentioned as literature which indicated such a technique.

  Patent Document 1 describes that an identification mark is attached to a substrate. As the mark, it is described that a metal film such as chromium or silver is printed by transferring by a laser or vapor deposition by a laser to give a resistance to a subsequent process, and used as an identification mark.

  Patent Document 2 describes that a mark is attached to a surface opposite to a surface on which a solar cell film is formed. It also describes that marks are attached to the peripheral area of the substrate and the side surface of the substrate. If a mark is attached to such a position, there is no influence of laser scribing in the process of forming the solar cell film, and the mark is not damaged. Moreover, if a mark is attached to the side surface of the substrate, it can be easily read even when the substrates are stacked.

  Similarly, Patent Document 3 describes a technique for marking a side surface of a substrate. That is, Patent Document 3 describes that a notch is provided on the side surface of the substrate to obtain identification information.

  Patent Document 4 describes that a marker is arranged in the vicinity of the center line of the substrate (see FIG. 1). The solar cell film may be manufactured through a treatment process under high temperature conditions. When the substrate becomes high temperature, the position of the marker shifts due to thermal expansion, and it becomes difficult to read the marker during transportation. If the marker is arranged in the vicinity of the center line, even if the substrate is thermally expanded, the marker is kept in the vicinity of the center line of the substrate, so that the marker can be read stably.

JP 2001-111071 A JP 2001-102604 A JP-A-5-309552 JP-A-2005-235920

  By the way, as a substrate for a photoelectric conversion device, for example, there is a substrate using a translucent glass substrate. For a thick plate (for example, 3 mm or more) and a large size (for example, 1 m square or more), glass from an end surface is used. In order to prevent damage to the substrate, the end face may be processed into a curved surface by polishing (see Japanese Patent Application Laid-Open No. 2004-207575). The substrate end surface after being curved by normal grinding wheel polishing has a rough surface roughness and irregularities on the μm level. On this rough surface, as described in Patent Document 1, it is difficult to dispose the metal film directly and stably even if the metal film is deposited or transferred. Further, even if the ID mark can be directly arranged on such a surface, the surface state of the ID mark portion becomes rough. For this reason, at the time of reading, light is diffusely reflected at the ID mark portion, and an identification error is likely to occur. For this reason, in order to provide the ID mark on the end face of the substrate, it is necessary to deposit or transfer the metal film after smoothing the end face surface by polishing with a finer grindstone after the curved end face is polished, resulting in an increase in cost. Therefore, it was in a situation where it could not be practically dealt with.

  For this reason, it is difficult to attach an ID mark to the end surface of the substrate as described in Patent Document 2 with respect to the substrate whose end surface is processed into a curved surface. Further, the substrate side surface incision as described in Patent Document 3 is a simple technique, but cannot be used because it causes a reduction in substrate strength. Therefore, the ID mark by vapor deposition or transfer of a heat-resistant metal film must be provided on the front or back surface of the substrate. When the substrates are stacked and stored, the reading is performed after the substrates are pulled out once. Was forced to work.

  Accordingly, an object of the present invention is to provide a technique for simply installing and reading an ID mark even on a substrate whose end surface is polished to a curved surface.

  [Means for Solving the Problems] will be described below using the numbers and symbols used in [Best Mode for Carrying Out the Invention]. These numbers and symbols are added in parentheses in order to clarify the correspondence between the description of [Claims] and [Best Mode for Carrying Out the Invention]. However, these numbers and symbols should not be used for the interpretation of the technical scope of the invention described in [Claims].

  The photoelectric conversion device of the present invention comprises a substrate (20) on which a photoelectric conversion unit (2) is formed, and an ID mark (5) attached to an end face of the substrate (20) for identifying the substrate. It has. The end surface of the substrate (20) is a curved surface. The ID mark (5) includes a sheet attached to the end face of the substrate (20). Identification information for identifying the substrate is drawn on the sheet. Further, it is preferable that the back side of the sheet has a weak adhesive force that can be temporarily fixed to the end surface of the substrate.

  As described above, if an ID mark (5) using identification information on a sheet is used, the ID mark (5) can be arranged by sticking the sheet to the end face of the substrate. Here, when the end surface of the substrate is processed into a curved surface, the surface roughness of the end surface is rough at the μm level by curved surface polishing. For this reason, when fixing the sheet of the ID mark (5), it is suitable for firmly attaching and fixing the sheet to the end face of the substrate due to the anchor effect with the adhesive substance. In addition, since the background of the identification information can be a sheet and a mark written on the sheet, not the substrate end face with a rough surface, it can prevent irregular reflection of light at the time of reading and cause a reading error. And the ID mark (5) can be easily read. Further, if the ID mark (5) is arranged on the curved surface, the ID mark (5) can be read even from an oblique direction. As a result, there are less restrictions when laying out the apparatus for reading the ID mark (5), and the production line can be saved. In addition, by making the substrate end surface curved, the probability of damage to the substrate decreases and the strength increases substantially, making it difficult to break when handling the substrate, transporting between processing devices, and inside the processing device, and improving productivity. .

  Unlike the method of vapor-depositing or transferring a metal film as described in Patent Document 1, since the sheet is used in the above-described invention, the ID mark (5) can be stably attached even to a rough curved surface. Can be arranged. In addition, in Patent Document 2 described above, it is not described that the ID mark (5) is attached to the end surface processed into a curved surface. However, according to the above-described invention, the end surface is processed into a curved surface to prevent damage. Above, an ID mark (5) can be attached to the end face. Further, in the above-mentioned Patent Document 3, there is a possibility that the strength of the substrate is reduced because the end face is cut, but according to the above-described invention, the substrate itself is not processed. The ID mark (5) can be attached without reducing the strength. In addition, Patent Document 4 described above does not describe that the ID mark (5) is attached to the end face, and it is difficult to perform reading when the substrates are overlapped. Is provided with an ID mark (5), so that reading can be performed even when the substrates are stacked.

  Here, the sheet contains ceramics or glass as a component and can be fixed to the substrate by heating. The identification information is drawn with heat-resistant ink, and the sheet and the heat-resistant ink have a heat resistance of 500 ° C. or more. Preferably there is.

  If the ID mark (5) is provided by a sheet containing ceramics or glass as a component and heat-resistant ink, the ID mark (5) is not exposed to high temperatures in the manufacturing process of the photoelectric conversion unit (2). It will not disappear. Further, compared to the case where a metal film is directly formed on the substrate as the ID mark (5), an inexpensive ID mark (5) equal to or lower than that can be formed.

  Further, assuming that the photoelectric conversion unit (2) is provided on the main surface of the substrate (20), the ID mark (5) is disposed on the side opposite to the main surface on the end surface of the substrate (20). It is preferable.

  When the photoelectric conversion unit (2) is formed on the main surface of the substrate, in the film forming apparatus, a part of the film constituting the photoelectric conversion unit may be attached not only to the main surface but also to the end surface. As a result, there is a possibility that the ID mark (5) arranged on the end face is hidden by the attached film and cannot be read. As the main surface side of the substrate is closer to the end surface, the film is more likely to adhere. As described above, by arranging the ID mark (5) on the opposite side of the main surface, it is possible to prevent the ID mark (5) from being hidden by the film attached to the end surface.

  Moreover, it is preferable that the ID mark (5) is arrange | positioned in the center part of either side of a board | substrate (20).

  Depending on the formation process of the photoelectric conversion unit, there are a substrate (20) on which the photoelectric conversion unit (2) is provided with a main surface on the upper side and a substrate (20) with the main surface on the upper and lower sides. In either case, the ID mark (5) may be read. Also, in the substrate processing process, the substrate may be carried out in a state where the substrate temperature is high, and the size of the substrate may change due to thermal expansion. Many. When the main surface of the substrate (20) may be either the upper side or the lower side, or when the substrate thermally expands due to temperature change, depending on the position of the ID mark (5), from the substrate center to the ID mark (5) The distance may be shifted. As described above, if the ID mark (5) is arranged at the center of the side, the position of the ID mark (5) continues to be the substantially central part of the side. Accordingly, there is almost no change in the distance from the substrate center to the ID mark (5) even during various manufacturing processes. As a result, the ID mark (5) can be read stably.

  The identification information preferably includes a bar code or a two-dimensional code from one viewpoint. From another viewpoint, it is preferable to include at least one type of information among a numeric string, a character string, and a symbol string.

  Information including ID numbers of many digits can be described by a bar code or a two-dimensional code. Further, by using a numeric string, a character string, and a symbol string, the ID number can be visually confirmed without using a special reading device.

  The photoelectric conversion device further includes a gasket (11) that covers the end of the substrate (20), and a frame (12) that supports the end of the substrate (20) from the outside of the gasket (11). It has. At this time, the gasket (11) and the frame (12) are provided with ID mark identification openings (11-1, 12-1). The openings (11-1, 12-1) are provided at positions corresponding to the ID mark (5) so that the ID mark (5) can be identified from the outside.

  When the photoelectric conversion device is installed outdoors, the end of the substrate (20) may be supported by a frame frame (12) installed around the substrate (20). At that time, a gasket is interposed between the frame and the substrate to provide a cushioning material that does not apply a local load to the substrate (20). When the end of the substrate is covered with the gasket (11) and the frame (12), the ID mark (5) provided on the end surface of the substrate (20) is hidden and cannot be read. As described above, the ID mark (5) can be read even after the gasket and the frame are mounted by providing the gasket and the frame with ID mark (5) identification openings (11-1, 12-1). Things are possible. In addition, when the photoelectric conversion device is installed outdoors, water accumulates inside the frame frame (12) or the gasket (11), and moisture may enter the photoelectric conversion device, which may cause long-term deterioration. is there. By providing an opening for identifying the ID mark (5), there is an effect of easily discharging such water.

  In the method for manufacturing a photoelectric conversion device of the present invention, the polishing step (step S10) for polishing the end surface of the substrate (20) to be a curved surface, and the substrate (20) after the polishing step (S10) are identified. ID mark forming step (steps S20 and 30-1) for placing the ID mark (5) on the end surface of the substrate (20), and photoelectric conversion unit formation for forming the photoelectric conversion unit (2) on the substrate (20) Steps (steps S30-2 to S50). Here, the ID mark (5) includes a sheet attached to the end face of the substrate (20) and identification information drawn on the sheet.

  Here, from the viewpoint of heat resistance, the sheet is preferably a sheet containing ceramics or glass as a component, and the ID mark (5) forming step places the sheet on which the identification information is drawn on the end face of the substrate (20). It is preferable to include a step of pasting (step S20) and a firing step (step S30-1) of fixing the sheet by firing the sheet attached to the substrate (20) by heating.

  When the photoelectric conversion unit forming step includes a transparent electrode film forming step (step S30-2) for forming a transparent electrode film on the substrate (20) by a thermal CVD method, a baking step by heating (S30-1). Is preferably performed in the same process as the transparent electrode film forming step (S30-2).

  The transparent electrode film forming process by the thermal CVD method may be performed at a high temperature process of about 500 ° C. In such a case, firing of the sheet and film formation of the transparent electrode film can be performed in the same process. That is, it is not necessary to add a new step of firing the sheet to provide the ID mark (5).

  The method for manufacturing a photoelectric conversion device preferably further includes a step of determining the color of the sheet based on the manufacturing conditions of the photoelectric conversion unit or the use conditions of the photoelectric conversion device. In this case, the sheet of the determined color is used in the ID mark (5) formation step (S20, S30-1).

  In this way, if the color of the sheet is determined according to the manufacturing conditions and usage conditions, it is possible to easily identify the substrate visually, so it is easy to make a mistake in moving and sorting the substrates in the manufacturing process. Can be confirmed.

  The photoelectric conversion unit (2) is provided on the main surface of the substrate. In the ID mark (5) formation step (S20), the ID mark (5) is formed on the end surface of the substrate (20). It is preferable to be arranged on the opposite side.

  In addition, the method for manufacturing the photoelectric conversion device is further performed after the ID mark (5) formation step (step S30-1), the step of reading the information indicated by the identification information, and the manufacturing process based on the read information. And a management step for performing management.

  According to the present invention, a technique is provided in which an ID mark (5) is simply installed and stably read even on a substrate whose end surface is polished to a curved surface.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. Note that in this specification, a solar cell is described as an example of the photoelectric conversion device. In addition, a solar cell module is obtained by forming a solar cell film as a photoelectric conversion unit on a substrate and enabling power generation. And what attached the back sheet | seat and the terminal box to the solar cell module and enabled the use outdoors etc. is set as a solar cell panel.

(First embodiment)
FIG. 2 is a perspective view of the solar cell module 1 of the present embodiment. The solar cell module 1 includes a rectangular substrate 20, a photoelectric conversion unit 2 provided on the main surface of the substrate 20, and an ID mark 5 attached to the end surface 3 of the substrate 20.

  As the substrate 20, for example, a translucent substrate such as a glass substrate is used. The photoelectric conversion unit 2 of the substrate 20 is formed on the main surface, and the photoelectric conversion unit 2 is not provided in the peripheral region on the main surface of the substrate. This is for securing an adhesion / seal surface of the back sheet when the back sheet is attached to the solar cell module 1.

  The end surface 3 of the substrate 20 is a curved surface. FIG. 3 is a schematic cross-sectional view for explaining the shape of the end surface 3 of the substrate 20. The end surface 3 of the substrate 20 has a curved surface by polishing processing that performs R chamfering. This curved surface does not necessarily have to be a curved surface having the thickness of the substrate as a diameter, and may be a curved surface in which pseudo-Rs having different curvatures are combined. The boundary between the substrate surface and the end surface may be corner cut by R chamfering, and the vicinity of the center of the substrate end surface in the thickness direction may be a substantially flat surface without curvature. Since the end surface of the substrate 20 is curved by R chamfering, the probability of breakage from the peripheral portion of the substrate is reduced, so that the substantial strength is improved. The fact that the strength of the substrate 20 is improved by the R chamfering process is described in, for example, Japanese Patent Application Laid-Open No. 2004-207575. Further, the surface roughness of the end face 3 of the substrate is rougher than the main surface of the substrate due to the polishing process at the time of the R chamfering process, and there are irregularities of μm level.

  The ID mark 5 is for identifying the substrate and is attached to the end surface 3 of the substrate 20. Therefore, the ID mark 5 is affixed along the curved surface. As a result, the ID mark 5 can be read even when the reading device 6 is positioned obliquely with respect to the substrate 20.

  Further, the ID mark 5 is provided in the vicinity of the central portion on any side of the substrate 20 (see FIG. 2). The ID mark 5 may be installed on two or more sides of the substrate 20 as necessary. Usually, the ID mark 5 is installed on one of the sides at a unified position over the entire substrate.

  As the ID mark 5, a bar code (identification information) printed with heat-resistant ink on a sheet containing a ceramic or glass as a component from the viewpoint of heat resistance is used. Since the end surface 3 of the substrate 20 is rough at a micrometer level by curved surface polishing, the temporarily fixed adhesive is lost when the sheet is fixed by heating, and an adhesive substance (glass frit or the like) contained in the sheet Is melted and fixed to the end face 3, it is firmly attached to the end face 3 by the anchor effect.

  The bar code includes, for example, an ID number and board information at the time of production (manufacturing date / recipe code of each apparatus / delivery destination number, etc.).

  As the heat-resistant ink, ink that is resistant to processing under vacuum or high temperature (thermal CVD, P-CVD, sputtering, etc.) in the manufacturing process of the solar cell module is used.

  As described above, the ID mark 5 in which the barcode is drawn on the heat-resistant sheet with the heat-resistant ink is less than or equal to the case where the metal film is directly transferred to the substrate by a laser or the like. When the metal film is directly transferred to the substrate, an expensive transfer plate is required, which causes a high running cost. As in this embodiment, the use of a sheet having identification information (barcode) drawn with heat-resistant ink on a heat-resistant sheet can reduce running costs.

  The identification information drawn on the ID mark 5 may be a two-dimensional code instead of using a barcode. Moreover, you may use a numerical string, a character string, and a symbol string. When a two-dimensional code is used, the amount of information increases, and information can be read even if a part of the code is lost. In addition, when a character string or a symbol is used, it can be read by the human eye and visibility is improved. If a bar code, two-dimensional code, number string, character string, symbol, etc. are used in combination, it can be read both by the reading device and visually, and even when part of the ID mark 5 is missing. It becomes like this. As a result, reading reliability is improved, which contributes to an improvement in the operating rate of the manufacturing process.

  The sheet color is preferably selected according to the production conditions of the substrate. For example, a sheet colored in white, yellow, red or the like is prepared as a sheet. And by using white ceramic sheets for normal production products, yellow for custom-made products, and red ceramic sheets for test evaluation products, it becomes possible to easily determine the type of substrate even visually, movement of the substrate in the manufacturing process, The sorting work can be easily confirmed without making a mistake, and the production reliability is improved.

  The above-described ID mark 5 is read by the barcode reading device 6. At that time, illumination light using a single wavelength laser beam or the like is irradiated to the ID mark 5 portion. As shown in FIG. 3, the barcode reader 6 reads the ID mark 5 with reading light that is reflected light of illumination light. Here, when the surface of the end surface 3 of the substrate is smooth, unnecessary illumination light is reflected even at the base portion (portion other than the ID mark 5), and is easily incident on the barcode reader 6. . As a result, the barcode reader 6 is liable to generate a reading error. In order to prevent reading errors, the wavelength and direction of illumination must be devised according to the type of substrate. On the other hand, in the present embodiment, the surface state of the end surface 3 is roughened by polishing so as to be a curved surface, so that the illumination light is likely to be irregularly reflected around the ID mark 5. Therefore, unnecessary light reflected around the ID mark 5 is unlikely to enter the barcode reader 6. As a result, the reflected light at the ID mark 5 portion is likely to be selectively incident on the bar code reader 6 and it is difficult to cause a reading error.

  Further, when a metal film or the like is disposed directly on the end face of the substrate without providing a sheet, the underlying irregularities are also transferred to the ID mark 5 portion. In that case, the illumination light is likely to be diffusely reflected at the ID mark 5 portion, and the reflected light of necessary information cannot be received, and a reading error is likely to occur. On the other hand, in the present embodiment, since a sheet containing ceramic or glass is used, the unevenness in the ID mark 5 is small, and the surface is finer than the μm level to impregnate the heat-resistant ink. There are minute irregularities, and the sheet surface does not show strong reflection characteristics. Therefore, irregular reflection of light is reduced at the ID mark 5 portion. From this point of view, the barcode reader 6 is less likely to cause a reading error.

  In the present embodiment, since the ID mark 5 is provided on the curved end surface of the substrate, the ID mark 5 can be read even from an oblique direction with respect to the substrate surface. Can be reduced. FIG. 4 is an explanatory diagram showing a state in which the above-described ID mark 5 is read in-line during substrate transport. At the time of manufacturing the solar cell module, the substrate 20 is transported by a transport line having a plurality of transport rollers 7. In FIG. 4, the board | substrate 20 is conveyed in a horizontal state by making the edge | side in which the ID mark 5 was provided into the conveyance direction side. The ID mark 5 is read by the barcode reading device 6. The bar code reader 6 is disposed below the plurality of transport rollers 7. The barcode reader 6 is installed to be inclined with respect to the surface of the substrate 20 so as to face the end surface 3 of the substrate 20 being conveyed. In this way, since the barcode reader 6 can be attached to the substrate 20 being conveyed so as to be inclined, it becomes easier to place the barcode reader 6 at a position that does not interfere with other devices, The conveyance line can be saved in space.

  In the present embodiment, the ID mark 5 is affixed near the center of the side of the substrate 20 (center distribution position of the substrate), so that reading can be performed more reliably. As shown in FIG. 4, when the substrate 20 is transferred by the transfer line, the position of the substrate 20 is determined based on the center distribution position. The board | substrate 20 is conveyed, for example, making the center distribution position (centerline of a board | substrate) correspond with the centerline of a conveyance line. When the ID mark 5 is provided at a position away from the center distribution position, the substrate installation state in which the main surface of the substrate 20 on which the photoelectric conversion unit 2 is provided is transported upward or downward, The distance from the center distribution position to the ID mark 5 may be shifted due to thermal expansion due to the temperature rise of the substrate. When the barcode reading device 6 is fixed with respect to the transport line, reading cannot be performed if the distance of the ID mark 5 from the center sorting position is greatly deviated. On the other hand, as described above, if the ID mark 5 is arranged in the vicinity of the center distribution position, it is assumed that the main surface of the substrate is thermally expanded due to the conveyance state in the upward direction or the downward direction, or due to the temperature rise. However, the distance from the center distribution position to the ID mark 5 does not change much. Therefore, the ID mark 5 can be read accurately regardless of the state of the substrate.

  Next, reading of the ID mark 5 when the solar cell module is stored will be described. FIG. 5 is an explanatory diagram showing a state in which the substrate 20 stored in the substrate cassette 10 is identified. In the manufacturing process of the solar cell module, the substrate 20 may be stored in the substrate cassette 10 for the purpose of primary storage when absorbing the tact difference between the processing apparatuses. At this time, the plurality of substrates 20 are stacked and stored in the surface direction in order to save space. When the ID mark 5 is arranged on the front or back surface of the substrate, reading cannot be performed if a plurality of substrates are stacked and stored. In order to read the substrate, it is necessary to pull out the substrate from the substrate cassette 10 once, and the work required for the line substrate management becomes complicated. On the other hand, in the present embodiment, since the ID mark 5 is attached to the end surface 3, reading can be performed without pulling out the substrate 20. Further, when the substrate 20 is stored in the substrate cassette 10, the ID mark is located near the center of the side of the substrate 20 (the center distribution position of the substrate) regardless of the substrate installation state in which the substrate main surface faces upward or downward. Since 5 is pasted, the position of the ID mark 5 does not change. Therefore, even if the direction of the main surface of the substrate 20 is opposite to the upward direction and the downward direction, reading can be performed by the barcode reading device 6 fixed to the conveyance line.

  Then, the manufacturing method of the solar cell module 1 of this embodiment is demonstrated. FIG. 6 is a flowchart showing a method for manufacturing a solar cell module. FIG. 7 is a schematic block diagram showing a manufacturing apparatus for the solar cell module 1. As shown in FIG. 7, the solar cell module 1 manufacturing apparatus includes a substrate carry-in device 21, a substrate cleaner 22, an ID mark sticking device 23, a transparent electrode film forming device 24, a substrate cleaner 25, and a substrate transporter 26. , And a transparent electrode film laser etching device 27. In addition, although a film forming apparatus for a photoelectric conversion layer and the like are further arranged on the downstream side of the transparent electrode film laser etching apparatus 27, the illustration in this drawing is omitted. In the solar cell module manufacturing apparatus, as described above, the bar code reader 6 (not shown in FIG. 7) is fixedly arranged with respect to the transport line at a predetermined required position, and the substrate ID The manufacturing status can be managed. In manufacturing processes and intermediate inspection processes that require management, necessary information such as processing date and time and intermediate inspection results is sent to the process management computer for each ID number attached to the board, and the manufacturing status is monitored. It can be managed, stored, and it is possible to carry out highly reliable production with traceability.

Step S10: Polishing of substrate end surface First, the end surface of the substrate 20 is polished and processed into a curved surface. The processing of the end surface is performed, for example, by polishing a disk-shaped polishing jig having an arcuate recess on the outer peripheral portion thereof in contact with the end surface of the substrate 20. The board | substrate 20 by which the end surface was processed into the curved surface is carried in from the board | substrate carrying-in apparatus 21 in the manufacturing apparatus of a solar cell module. Then, the substrate is cleaned by the substrate cleaner 22 and transferred to the ID mark pasting device 23.

Step S20: Affixing the identifier Next, the ID mark affixing device 23 affixes the ID mark 5 on which the barcode is drawn on the heat-resistant sheet to the end face of the substrate 20. At this time, as described above, a weak adhesive force is given to the back side of the sheet, and the ID mark 5 is pasted and temporarily fixed to the central portion (center distribution position) of the side of the substrate 20.

Steps S30-1, 2; Firing, Formation of Transparent Electrode Film The substrate 20 with the ID mark 5 attached is then sent to the transparent electrode film forming apparatus 24. The transparent electrode film forming apparatus 24 is, for example, an atmospheric pressure type thermal CVD apparatus that forms a film at about 500 ° C. A transparent electrode film is formed on the main surface of the substrate 20 by the transparent electrode film forming apparatus 24. At this time, since film formation is performed in a high temperature atmosphere of about 500 ° C., the ID mark 5 is baked, the temporarily fixed adhesive material disappears, and the adhesive substance (glass frit or the like) contained in the sheet melts. , And fixed to the end face of the substrate 20. As described above, since the baking of the ID mark 5 and the film formation of the transparent electrode film are performed in the same process, it is not necessary to newly add a process of fixing the ID mark 5 to the end face of the substrate 20. Further, since the surface roughness of the end face of the substrate is rough to the μm level, the ID mark 5 is more firmly fixed by the anchor effect.

  The substrate 20 on which film formation has been completed by the transparent electrode film forming device 24 is cleaned by the substrate cleaning device 25 and transferred to the transparent electrode film laser etching device 27 by the substrate transfer device 26. The transparent electrode film laser etching apparatus 27 performs laser etching so that the formed transparent electrode film is divided into strips corresponding to the solar cells.

Steps S40-60;
Thereafter, a photoelectric conversion layer is formed on the transparent electrode film (step S40). Further, a back electrode film is formed on the photoelectric conversion layer (step S50). After the series of laser etching steps, the film formed on the outer peripheral portion of the main surface of the substrate 20 is polished and removed to form a peripheral region (step S60).

  The solar cell module 1 is manufactured through the above steps S10 to S60. Here, after the ID mark 5 is affixed in step S20, the ID mark 5 is read by the barcode reader as necessary, and the substrate is managed based on the read information. In addition, as described above, the substrate 20 may be temporarily stored in the substrate cassette 10 between the processes.

  As described above, according to the present embodiment, when the end face of the substrate is processed into a curved surface by using the sheet on which the barcode is drawn, the ID mark 5 is firmly attached to the end face. Can do. Thereby, even when the substrates are stacked and stored, the ID mark 5 can be easily read.

  Further, since the ID mark 5 is attached to the curved surface, the ID mark 5 can be read from an oblique direction. For this reason, the freedom degree of the installation position of a barcode reader increases, and a manufacturing line can be saved.

  If the sheet is fired and fixed and the transparent electrode film is formed in the same process, an additional process for providing the ID mark 5 is not required, and the manufacturing process can be simplified.

  Next, an embodiment of a method for manufacturing a solar cell panel of the present invention will be described. Here, an example in which a single-layer amorphous silicon thin film solar cell is used as the solar cell photoelectric conversion layer 14 on a glass substrate as the substrate 20 will be described. 8A to 8D are schematic views showing an embodiment of a method for manufacturing a solar cell panel according to the present invention.

(1) FIG. 8A (a):
A soda float glass substrate (1.4 m × 1.1 m × plate thickness: 4 mm) is used as the substrate 20. As described above, the end face of the substrate is curved by corner chamfering or R chamfering to prevent breakage. As described above, the ID mark 5 is pasted and temporarily fixed to the end surface processed into a curved surface near the center of the specified side of the substrate 20 (center distribution position of the substrate). The ID mark 5 has a bar code printed with black heat-resistant ink containing chromium metal on a white sheet containing a ceramic component by alumina, and the size is about width 3.5 mm × length: 40 mm × thickness. : 0.2 mm.
(2) FIG. 8A (b):
A transparent electrode film mainly composed of a tin oxide film (SnO ₂ ) is formed as the transparent electrode layer 13 at a temperature of about 500 nm to 800 nm at about 500 ° C. using a thermal CVD apparatus. At this time, a texture with appropriate irregularities is formed on the surface of the transparent electrode film. As the transparent electrode layer 13, in addition to the transparent electrode film, an alkali barrier film (not shown) may be formed between the substrate 1 and the transparent electrode film. As the alkali barrier film, a silicon oxide film (SiO ₂ ) is formed at a temperature of about 500 ° C. in a thermal CVD apparatus at 50 nm to 150 nm. At this time, as described above, the sheet of the ID mark 5 is baked and fixed to the end face of the substrate 20.
(3) FIG. 8A (c):
Thereafter, the substrate 20 is placed on an XY table, and the first harmonic (1064 nm) of the YAG laser is incident from the film surface side of the transparent electrode film as indicated by the arrow in the figure. The laser power is adjusted so as to be suitable for the processing speed, and the transparent electrode film is moved relative to the direction perpendicular to the series connection direction of the solar cells 19 to move the substrate 20 and the laser beam to form the groove 16. Laser etching is performed in a strip shape with a width of about 6 mm to 15 mm.
(4) FIG. 8A (d):
Using a plasma CVD apparatus, a p layer film / i layer film / n layer film made of an amorphous silicon thin film as the photoelectric conversion layer 14 is sequentially formed in a reduced pressure atmosphere: 30 to 1000 Pa and a substrate temperature: about 200 ° C. The photoelectric conversion layer 14 is formed on the transparent electrode layer 13 using SiH ₄ gas and H ₂ gas as main raw materials. The p-layer, i-layer, and n-layer are stacked in this order from the sunlight incident side. In the present embodiment, the photoelectric conversion layer 14 is a p-layer: B-doped amorphous SiC and a film thickness of 10 nm to 30 nm, an i-layer: an amorphous Si mainly, a film thickness of 200 to 350 nm, and an n-layer: p-doped microcrystalline Si. The film thickness is 30 nm to 50 nm. A buffer layer may be provided between the p layer film and the i layer film in order to improve the interface characteristics.

(5) FIG. 8A (e):
The substrate 20 is placed on an XY table, and the second harmonic (532 nm) of the laser diode-pumped YAG laser is incident from the film surface side of the photoelectric conversion layer 14 as indicated by an arrow in the figure. Pulse oscillation: 10 to 20 kHz, the laser power is adjusted so as to be suitable for the processing speed, and laser etching is performed so that the groove 17 is formed on the lateral side of the laser etching line of the transparent electrode layer 13 about 100 to 150 μm. . The position of the laser etching line is selected in consideration of positioning intersection so as not to intersect with the etching line in the previous process.

(6) FIG. 8B (a):
As the back electrode layer 15, an Ag film / Ti film is sequentially formed by a sputtering apparatus at about 150 ° C. in a reduced pressure atmosphere. In this embodiment, the back electrode layer 15 is formed by stacking an Ag film: 200 to 500 nm and a Ti film having a high anticorrosive effect: 10 to 20 nm in this order as a protective film. For the purpose of reducing the contact resistance between the n layer and the back electrode layer 4 and improving the light reflection, a GZO (Ga doped ZnO) film is formed between the photoelectric conversion layer 14 and the back electrode layer 15 to a thickness of 50 to 100 nm, a sputtering apparatus. May be provided by forming a film.
(7) FIG. 8B (b):
The substrate 20 is placed on an XY table, and the second harmonic (532 nm) of the laser diode-pumped YAG laser is incident from the substrate 20 side as indicated by the arrow in the figure. The laser light is absorbed by the photoelectric conversion layer 14, and the back electrode layer 15 is exploded and removed using the high gas vapor pressure generated at this time. Pulse oscillation: 1 to 10 kHz, the laser power is adjusted so as to be suitable for the processing speed, and laser etching is performed on the lateral side of about 250 to 400 μm of the laser etching line of the transparent electrode layer 13 so as to form the groove 18. .
(8) FIG. 8B (c) and FIG. 8C (a):
The power generation region is divided to eliminate the influence that the serial connection portion due to laser etching is likely to be short-circuited at the film edge around the substrate edge. The substrate 20 is placed on an XY table, and the second harmonic (532 nm) of the laser diode pumped YAG laser is incident from the substrate 20 side. The laser light is absorbed by the transparent electrode layer 13 and the photoelectric conversion layer 14, and the back electrode layer 15 is exploded using the high gas vapor pressure generated at this time, so that the back electrode layer 15 / photoelectric conversion layer 14 / transparent electrode layer 13 is removed. Pulse oscillation: 1 to 10 kHz, the laser power is adjusted so as to be suitable for the processing speed, and the position of 5 to 20 mm from the end of the substrate 20 is placed in the X-direction insulating groove 31 as shown in FIG. Laser etching to form At this time, the Y-direction insulating groove does not need to be provided because the film surface polishing removal process in the peripheral region of the substrate 20 is performed in a later step. FIG. 8B (c) shows a cross section in the X direction and a cross section in the Y direction for convenience in order to show the laser irradiation position.
The insulating groove 31 exhibits an effective effect in suppressing external moisture intrusion into the solar cell module 6 from the end of the solar cell panel by terminating the etching at a position of 5 to 10 mm from the end of the substrate 20. Therefore, it is preferable.
In addition, although the laser beam in the above process is made into a YAG laser, there exists what can use a YVO4 laser, a fiber laser, etc. similarly.

(9) FIG. 8C (a: view seen from the solar cell film side, b: view seen from the substrate side of the light receiving surface):
In order to secure a healthy adhesion / seal surface with the back sheet 33 through EVA or the like in a later process, the laminated film around the substrate 20 (peripheral region 4) has a step and is easy to peel off. Remove. When removing the film over the entire periphery of the substrate 1 at 5 to 20 mm from the end of the substrate 20, the X direction is closer to the substrate end than the insulating groove 31 provided in the step of FIG. The back electrode layer 15 / photoelectric conversion layer 14 / transparent electrode layer 13 are removed by using grinding stone polishing, blast polishing, or the like on the substrate end side with respect to the groove 16 near the side portion.
Polishing debris and abrasive grains were removed by cleaning the substrate 20.
(10) FIG. 8D (a):
At the terminal box mounting portion, an opening through window is provided in the back sheet 33 and the current collecting plate 67 is taken out. A plurality of layers of insulating materials are installed in the opening through window portion to suppress intrusion of moisture and the like from the outside.
It processes so that it can collect electric power from the photovoltaic cell 19 of the one end and the photovoltaic cell 19 of the other end part which were arranged in series using copper foil, and can take out electric power from the terminal box part of a photovoltaic panel back side. In order to prevent a short circuit with each part, the copper foil arranges an insulating sheet wider than the copper foil width.
After the current collecting copper foil or the like is disposed at a predetermined position, an adhesive filler sheet made of EVA (ethylene vinyl acetate copolymer) or the like is disposed so as to cover the entire solar cell module and not protrude from the substrate 20.
A back sheet 33 having a high waterproof effect is installed on the EVA. In the present embodiment, the back sheet 33 has a three-layer structure of PET sheet / AL foil / PET sheet so that the waterproof and moisture proof effect is high.
The EVA sheet is placed in a predetermined position until the back sheet 33 is deaerated with a laminator in a reduced pressure atmosphere and pressed at about 150 to 160 ° C., and EVA is crosslinked and brought into close contact.

(11) FIG. 8D (b):
Attach the terminal box to the back of the solar cell module with adhesive. The copper foil and the output cable of the terminal box are connected with solder or the like, and the terminal box is filled with a sealing agent (potting agent) and sealed. Thus, the solar cell panel 40 is completed.
(12) FIG. 8D (c):
A power generation inspection and a predetermined performance test are performed on the solar cell panel 40 formed in the steps up to FIG. 8D (b). The power generation inspection is performed using a solar simulator of AM1.5 and solar radiation standard sunlight (1000 W / m ² ).
(13) FIG. 8D (d):
Before and after the power generation inspection (FIG. 8D (c)), a predetermined performance inspection is performed including an appearance inspection.

In the above embodiment, a solar cell using a single layer amorphous silicon solar cell has been described. However, the present invention is not limited to this example.
For example, crystalline silicon solar cells including microcrystalline silicon as a solar cell, silicon germanium solar cells, and amorphous silicon solar cells and crystalline silicon solar cells or silicon germanium solar cells are laminated in one to a plurality of layers. Other types of thin film solar cells such as multi-junction type (tandem type) solar cells and compound semiconductor solar cells that form a photoelectric conversion layer on a substrate other than silicon solar cells The same applies to solar cells.
Furthermore, the present invention can be applied to a solar cell that is manufactured on a non-transparent substrate such as a metal substrate and receives light from the side opposite to the substrate, as long as the ID mark 5 can be attached. The same applies.

(Second Embodiment)
Next, the second embodiment will be described. In the present embodiment, the position where the ID mark 5 is affixed is further devised compared to the first embodiment. Since other points can be the same as those in the first embodiment, a detailed description thereof will be omitted.

  FIG. 9 is an explanatory diagram for explaining a pasting position of the ID mark 5 in the present embodiment. As shown in FIG. 9, the ID mark 5 is affixed near the surface (reference numeral 9) opposite to the main surface 8 on the substrate end surface. Here, the main surface 8 is a surface on the side where the photoelectric conversion unit is formed. A part of the ID mark 5 extends to a part on the opposite surface 9.

When the photoelectric conversion unit 2 is formed, film formation is performed by a plasma CVD apparatus, sputtering, or the like. At this time, depending on the substrate support state and film forming conditions of the film forming apparatus, the film may wrap around not only on the main surface 8 but also on the end surface of the substrate. In the case of a thin-film solar cell, the Si film of the photoelectric conversion layer, the metal film (Ag film or Ti film) of the back electrode layer, etc. may adhere to the end surface of the substrate, which may cause a reading error of the ID mark 5. is there.
The adhesion of the film on the substrate end surface increases toward the main surface 8 side. Therefore, by arranging the ID mark 5 on the opposite side of the main surface 8 as described above, it is possible to eliminate a reading error due to the influence of the film that wraps around the substrate end surface. Thereby, the ID mark 5 can be read stably.

(Third embodiment)
Subsequently, a third embodiment will be described. In the present embodiment, the structure of the solar cell panel is further devised with respect to the above-described embodiments. Since the other points can be the same as those of the above-described embodiment, detailed description thereof is omitted.

  FIG. 10 is a schematic configuration diagram showing the configuration of the solar cell panel according to the present embodiment. As shown in FIG. 10, a frame frame 12 is attached to the end portion of the solar cell module 1 via a gasket 11 to form a panel.

  The frame 12 is a metal frame such as an aluminum alloy. The frame 12 supports the end of the solar cell module 1 and fixes the solar cell module 1.

  The gasket 11 has a buffering property and is attached for the purpose of protecting the peripheral edge of the solar cell module 1. For example, a rubber frame or the like is used as the gasket 11.

  In the present embodiment, the gasket 11 and the frame frame 12 are provided with an opening 11-1 and an opening 12-1, respectively. These openings 11-1 and 12-1 are for reading the ID mark 5 from the outside. Accordingly, the openings 11-1 and 12-1 are provided so as to correspond to the positions where the ID marks 5 are attached.

  When the ID mark 5 is provided on the end face of the substrate, the ID mark 5 is hidden after the gasket 11 and the frame 12 are attached. Therefore, an identification mark may be separately attached to the back side of the solar cell module 1 or the like. On the other hand, according to this embodiment, the ID mark 5 can be read even after the frame 12 is attached, and there is no need to separately attach an identification mark or the like.

  Moreover, a solar cell panel is mainly used outdoors and is assumed to be exposed to rain and snow. In this case, moisture may accumulate inside the gasket 11. Moisture stored inside the gasket 11 inside 11 may be one of the factors that cause moisture to enter the solar cell module 1, and may deteriorate power generation characteristics over a long period of time. By providing the opening 11-1 in the gasket 11, the water accumulated inside the gasket 11 can be easily drained through the opening 11-1. When the solar cell panel is installed, if the opening 11-1 and the opening 12-1 provided in the gasket 11 and the frame frame 12 are directed downward, respectively, moisture stored inside can be easily discharged, which is more preferable.

  The first to third embodiments have been described above. However, these embodiments are not independent of each other, and can be used in combination within a consistent range as necessary.

It is explanatory drawing which shows the position of the conventional ID mark. It is explanatory drawing which shows the position of the ID mark of 1st Embodiment. It is a schematic sectional drawing which shows the position of ID mark of 1st Embodiment. It is explanatory drawing which shows the mode at the time of reading an ID mark in-line. It is explanatory drawing which shows a mode at the time of reading the ID mark of the board | substrate accommodated in the board | substrate cassette. It is a flowchart which shows the manufacturing method of a solar cell module. It is a schematic block diagram which shows the structure of the manufacturing apparatus of a solar cell module. It is process sectional drawing which shows the manufacturing method of a solar cell panel. It is process sectional drawing which shows the manufacturing method of a solar cell panel. It is process sectional drawing which shows the manufacturing method of a solar cell panel. It is process sectional drawing which shows the manufacturing method of a solar cell panel. It is a figure which shows the sticking position of the ID mark in 2nd Embodiment. It is the schematic which shows the structure of the solar cell panel of 3rd Embodiment.

Explanation of symbols

1 Solar cell module 2 Photoelectric conversion unit (power generation area)
DESCRIPTION OF SYMBOLS 3 Side surface 4 Surrounding area 5 Bar code 6 Bar code reader 7 Roller 8 Main surface 9 Back surface 10 Substrate cassette 11 Gasket 11-1 Opening 12 Frame frame 12-1 Opening 13 Transparent electrode layer 14 Photoelectric conversion layer 15 Back surface electrode layer 16 Groove 17 Groove 18 Groove 19 Solar Cell 20 Substrate 21 Substrate Loading Device 22 Substrate Cleaning Device 23 ID Mark Pasting Device 24 Transparent Electrode Film Forming Device 25 Substrate Cleaning Device 26 Substrate Transporter 27 Transparent Electrode Film Laser Etching Device 30 Photoelectric Conversion Unit Formation Device 31 Insulating groove 32 Current collector plate 33 Back sheet 34 Terminal box 35 Cable 40 Solar panel

Claims (13)

A substrate on which a photoelectric conversion unit is formed;
An ID mark affixed to an end face of the substrate;
Comprising
The end surface of the substrate is a curved surface,
The ID mark includes a sheet attached to an end face of the substrate,
Identification information for identifying the substrate is drawn on the sheet. The photoelectric conversion device according to claim 1,
The sheet contains ceramics or glass as a component, and can be fixed to the substrate by heating,
The identification information is drawn with heat-resistant ink, and the sheet and the heat-resistant ink have a heat resistance of 500 ° C. or more. The photoelectric conversion device according to claim 1 or 2,
The photoelectric conversion unit is provided on the main surface of the substrate,
The photoelectric conversion device according to claim 1, wherein the ID mark is attached to an end surface of the substrate on a side opposite to the main surface. A photoelectric conversion device according to any one of claims 1 to 3,
The substrate is rectangular,
The photoelectric conversion device according to claim 1, wherein the ID mark is arranged at a central portion of any one side of the substrate. A photoelectric conversion device according to any one of claims 1 to 4, wherein
The photoelectric conversion device, wherein the identification information includes a bar code or a two-dimensional code. A photoelectric conversion device according to claim 1,
The identification information includes at least one kind of information of a number string, a character string, and a symbol string. A photoelectric conversion device according to any one of claims 1 to 6,
Furthermore,
A gasket covering the end of the substrate;
A frame that supports the end of the substrate from the outside of the gasket;
Comprising
The gasket and the frame are provided with openings for identifying ID marks,
The photoelectric conversion device, wherein the opening is provided at a position corresponding to the ID mark so that the ID mark can be identified from the outside. A polishing step for polishing the end surface of the substrate to be a curved surface;
After the polishing step, an ID mark forming step for arranging an ID mark for identifying the substrate on an end surface of the substrate;
A photoelectric conversion unit forming step of forming a photoelectric conversion unit on the substrate;
Comprising
The method of manufacturing a photoelectric conversion device, wherein the ID mark includes a sheet attached to the substrate and identification information drawn on the sheet. It is a manufacturing method of the photoelectric conversion device according to claim 8,
The sheet is a sheet containing ceramics or glass as a component,
The ID mark forming step includes:
Affixing a sheet on which identification information is drawn to an end face of the substrate;
And a baking step of fixing the sheet to an end face of the substrate by baking the sheet attached to the substrate by heating. It is a manufacturing method of the photoelectric conversion device according to claim 9,
The photoelectric conversion unit forming step includes a transparent electrode film forming step of forming a transparent electrode film on the substrate by a thermal CVD method,
The method for manufacturing a photoelectric conversion device, wherein the firing step is performed in the same process as the transparent electrode film forming step. It is a manufacturing method of the photoelectric conversion device according to any one of claims 8 to 10,
Furthermore,
Determining the color of the sheet based on the formation conditions of the photoelectric conversion unit or the use conditions of the photoelectric conversion device;
In the ID mark forming step, the sheet having the determined color is used. It is a manufacturing method of the photoelectric conversion device according to any one of claims 8 to 11,
The photoelectric conversion unit is provided on a main surface of the substrate, and in the ID mark forming step, the ID mark is disposed on an end surface of the substrate opposite to the main surface. A method for manufacturing a photoelectric conversion device. A method for manufacturing a photoelectric conversion device according to any one of claims 8 to 12,
Furthermore,
Performed after the ID mark forming step, and reading information indicated by the identification information;
A management step for managing a manufacturing process based on the read information;
A process for producing a photoelectric conversion device, comprising:

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