JP2008309518A - Method and apparatus for inspecting ic part connecting part - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an IC part inspection apparatus capable of verifying operations in a loaded state without breaking IC chips or electrodes. <P>SOLUTION: The IC part inspection apparatus communicates with reader/writer 32 via an antenna part 31 while an ultrasonic oscillator 41 loads vibrations on a strap substrate 22 to which an IC chip 23 is connected via electrodes 24a and 24b. The state of connection between the IC chip 23 and the strap substrate 22 is judged on the basis of the propriety of the communication. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an IC component connection portion inspection method and an IC component connection portion inspection device for inspecting a connection state between an electrode of an IC chip and a substrate circuit, and in particular, an IC component connection portion inspection method and an IC used for inspection of an RFID tag inlet. The present invention relates to a component connection inspection apparatus.

  Conventionally, in manufacturing RFID tag inlets, it is important whether the electrodes of the IC chip and the substrate circuit are firmly connected. As an inspection method, a physical load or a temperature change load is applied to the IC chip mounting portion, and the operation of the IC chip is confirmed before and after that.

  However, in the conventional method, since it is impossible to confirm the presence / absence of a change in the characteristics of the inlet that is physically loaded, there is a problem in that a poor contact product is determined as a non-defective product. As a solution to this problem, there is a method as shown in FIG. Referring to FIG. 8, when IC chip 101 is connected to substrate 103 via electrode 102, IC chip 101 is applied while applying a direct load using a predetermined device 104 as indicated by an arrow in the figure. Is confirmed by a reader / writer.

  However, in this method, since one inspection takes too much time, only inspection by sampling can be performed, and there is a problem of overlooking defective products. In addition, there is a method in which a total load is inspected by applying a constant load to the IC chip body using a machine to reduce the inspection time and man-hours. However, in this method, a load is directly applied to the IC chip and the electrode, and there is a possibility that a good chip is damaged.

  The present invention has been made paying attention to the above-mentioned problems, and in an IC component such as an RFID tag inlet, the operation in a state where a load is applied without damaging the IC chip or the electrode is confirmed. An object of the present invention is to provide an IC component connection portion inspection apparatus and an IC component connection portion inspection method that can be performed.

  The IC component connection portion inspection method according to the present invention inspects a connection state between an electrode and a substrate in an IC component having a substrate to which an IC chip is connected via an electrode and an antenna connected to the substrate. In the IC component connection portion inspection method, a connection state between an electrode and a substrate is determined based on whether or not communication with an external device is possible via an antenna while applying a vibration load to the substrate to which the IC chip is connected via the electrode.

  According to the present invention, the IC chip and the substrate are connected to each other through the antenna and the connection state between the IC chip and the substrate can be determined while applying a vibration load to the substrate to which the IC chip is connected via the electrode. There is no direct load on the tip and electrode.

  As a result, it is possible to provide an IC component inspection method capable of confirming the operation in a loaded state without damaging the IC chip or the electrode.

  During the joining operation for joining the substrate to the antenna, the connection state between the electrode and the substrate may be determined depending on whether or not communication with an external device is possible via the antenna while applying a load to the substrate. After joining, the connection state between the electrode and the substrate may be determined based on whether or not communication with an external device is possible via the antenna while applying a load to the substrate to which the antenna is joined.

  Preferably, the IC component is an RFID tag inlet, and the IC component connection portion inspection method is an RFID tag inlet inspection method.

  More preferably, the vibration load applied to the substrate is ultrasonic vibration.

  According to one embodiment of the present invention, when the substrate is bonded to the antenna, the ultrasonic vibration under the first vibration condition is applied, and the connection between the electrode and the substrate is determined depending on whether or not communication with an external device is possible via the antenna. The vibration load applied to the substrate when determining the state is also the first vibration condition.

  In another embodiment of the present invention, when the substrate is joined to the antenna, ultrasonic vibration under the first vibration condition is applied, and the connection state between the electrode and the substrate is determined depending on whether or not communication with an external device is possible via the antenna. The vibration load applied to the substrate when determining is a second vibration condition different from the first vibration condition.

  In another aspect of the present invention, an IC component connection portion inspection apparatus is configured to display a connection state between an electrode and a substrate in an IC component having a substrate to which an IC chip is connected via an electrode and an antenna connected to the substrate. inspect. The IC component connection portion inspection apparatus includes a holding unit that holds a substrate to which an IC chip is connected via an electrode, a vibration load unit that applies a vibration load to the substrate held by the holding unit, and a vibration load unit that vibrates the substrate. Connection state determining means for determining a connection state between the electrode and the substrate based on whether or not communication with an external device is possible via the antenna while applying a load.

  Preferably, the connection state determination means determines the connection state between the electrode and the substrate based on whether or not communication with an external device via the antenna is possible during the bonding operation for bonding the substrate to the antenna.

  More preferably, the holding means holds the substrate to which the antenna is bonded.

  The IC component may be an RFID tag inlet, and the vibration load means may be an ultrasonic vibration device.

  The vibration load means applies ultrasonic vibration of the first vibration condition when the substrate is joined to the antenna, but determines the connection state between the electrode and the substrate based on whether or not communication with an external device is possible via the antenna. The vibration load applied to the substrate may be a first vibration condition or a second vibration condition different from the first vibration condition.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a block diagram showing an overall configuration of an RFID tag inlet manufacturing apparatus 50 in which an IC component connection portion inspection apparatus is incorporated according to an embodiment of the present invention, and processing performed in each component device. Here, a case where an RFID tag inlet as an IC component is inspected will be described. In addition, a reference number is attached | subjected about a component apparatus, and a step is attached | subjected and numbered about a process.

  With reference to FIG. 1, the RFID tag inlet manufacturing apparatus 50 includes a mounting machine 10, a strap inspection machine 20 connected to the mounting machine 10, and a bonding machine 30 connected to the strap inspection machine 20.

  The mounting machine 10 prepares a chip from a chip wafer or a tray (Steps S11 and S12, and the following steps are omitted), and prepares a strap substrate supplied in a roll shape (S13). Next, a chip is mounted on the strap substrate (S14), and a strap portion is created (S15). In the mounting step of S14, an ultrasonic wave is applied.

  The manufactured strap part is sent to the strap inspection machine 20 and inspected (S21). If the inspection result is OK, it is conveyed to the bonding machine 30 (S22). If the inspection result is NG, it is punched out and discarded (S23, S24).

  In the bonding machine 30, the antenna unit is bonded to the strap unit. Therefore, a separate antenna unit and reader / writer are prepared (S31, S32). The strap portion that is OK in the strap inspection and the antenna portion are metal-bonded to create an inlet (S33). At the time of creating the inlet (when the strap portion and the antenna portion are metal-joined), at the same time, the communication with the inlet in the mounted state is inspected using a reader / writer as an external device (S34).

  In the joining and mounting state inspection (including the inlet communication inspection performed at the same time), if it is OK (OK in S34), the lot number is marked on the inlet (S35) and wound on the roll (S37). If there is an abnormality in the bonding and mounting state inspection (NG in S34), a bad mark is attached to the inlet and the roll 39 is wound (S36, S37). The above steps are basically performed continuously for a plurality of strap portions.

  FIG. 2 is a schematic diagram showing an inspection method in the bonding and mounting state inspection performed in S33 and S34. Here, for ease of understanding, a single strap portion will be described, but a plurality of strap portions may be performed simultaneously.

  FIG. 2A is a diagram illustrating an IC component connection portion inspection apparatus provided in the bonding machine 30. The IC component connection portion inspection device includes anvils (holding means) 43a and 43b that hold the strap portion 21, an ultrasonic vibration device (vibration load means) 40 having a portal ultrasonic transducer 41, and a reader / writer 32. Including.

  2A shows a state in which the strap portion 21 placed on the anvils 43a and 43b is carried into a state where the antenna portion 31 is held using the portal ultrasonic transducer 41. FIG. Horns 42a and 42b are attached to both ends of the portal ultrasonic transducer 41, respectively, and an antenna portion 31 having connection portions 44a and 44b is held at lower ends thereof. A reader / writer 32 is installed at the lower part of the bonding machine 30.

  The strap unit 21 includes a strap substrate 22 and an IC chip 23. The strap substrate 22 and the IC chip 23 are metal-bonded by electrodes 24 a and 24 b provided on the IC chip 23 and contacts 25 a and 25 b provided on the strap substrate 22. Here, the case where the electrodes 24a and 24b are made of gold will be described, but this may be Ni or the like. The contacts 25a and 25b are made of aluminum. Here, the metal junction between the electrodes 24a and 24b and the contacts 25a and 25b is referred to as a financial attachment portion.

  FIG. 2B shows a state in which the inlet 34 is formed by metal-joining the strap portion 21 carried in as shown in FIG. 2A using the antenna portion 31 and the ultrasonic vibration device 40. FIG. At this time, a load due to vibration is applied from the ultrasonic transducer 41 via the horns 42a and 42b and the connection portions 42a and 42b to the strap substrate 22 via the connection portions 44a and 44b as indicated by an arrow A in the figure. . As shown in the figure, the position where vibration is applied by the horns 42a and 42b is different from the position where the IC chip 23 is provided. Therefore, the IC chip 23 is not damaged. This vibration is propagated to the financial arrival part as indicated by an arrow B in the figure. On the other hand, at this time, the reader / writer 32 and the inlet 34 communicate with each other as indicated by an arrow C in the figure.

  The reader / writer 32 determines whether or not the communication is performed by performing communication using the reader / writer 32 while applying the vibration for bonding and bonding the antenna unit 31 and the strap unit 21 in this manner. To do. That is, the vibration for joining is given to the financial arrival part of the strap part 21 via the connection parts 44a and 44b provided in the antenna part 31 from the horns 42a and 42b. If the IC chip 23 and the strap substrate 22 are not sufficiently connected at the financial arrival part, the connection part is separated and communication with the reader / writer 32 becomes impossible. Therefore, according to this embodiment, it is possible to inspect the mounting state of the inlet formed by the bonding and the communication inspection with the reader / writer 32 simultaneously with the bonding. That is, the reader / writer 32 operates as a connection state determination unit.

  As described above, in this embodiment, the reader / writer 32 can determine whether there is a change in communication characteristics in a state where a physical load due to vibration is applied to the financial arrival part.

  In this embodiment, in the bonding and mounting state inspection shown in S34 of FIG. 1, the vibration load condition when the antenna unit 31 and the strap unit 21 are metal-bonded using the ultrasonic vibration device 40 is as follows. It is predetermined.

  Next, another embodiment of the present invention will be described. FIG. 3 is a block diagram showing an overall configuration of an RFID tag inlet manufacturing apparatus 50 incorporating an IC component connection portion inspection apparatus according to another embodiment of the present invention and processes performed in each component device. It is a figure corresponding to FIG. 1 in the embodiment. Here, the case of inspecting the RFID tag inlet will be described.

  In the previous embodiment, the bonding and mounting state inspection is performed by the bonding machine 30. However, in this embodiment, the mounting state inspection is performed at an arbitrary position within the range indicated by A in the figure. I made it. The other parts are the same as those in the previous embodiment, and therefore, the same reference numerals as those in the previous embodiment are attached and the description of the same parts is omitted.

  Referring to FIG. 3, S11 to S15 performed in mounting machine 10 and S21 to S24 performed in strap inspection machine 20 are the same as those in the previous embodiment. In this embodiment, the processing in the bonding machine 30 is different. That is, although the point which prepares an antenna by S41 (S42) is the same, first, joining of a strap part and an antenna part is first performed (S42), and an inlet is created (S43). With the inlet completed, an inlet communication inspection is performed using a reader / writer (S45).

  In this embodiment, the contents of the inspection can be changed depending on which stage the inspection of the mounting state is performed. That is, if the inspection of the mounting state is performed before the antenna portion is attached (before S22), the joint portion between the strap substrate 22 and the IC chip 23 is inspected, and if the inspection is performed after the antenna portion is attached, the mounting state as the inlet 34 is performed. Inspection becomes possible.

  Next, a state where the mounting state inspection and the inlet communication inspection are performed after the inlet 34 is formed will be described. FIG. 4 is a diagram showing this state, and corresponds to FIG. 2 in the previous embodiment. Therefore, portions corresponding to the previous embodiment are denoted by the same reference numerals and description thereof is omitted.

  4A shows a state in which the inlet 34 completed in S43 is conveyed to the bonding machine 30, and FIG. 4B shows the inlet 34 using the ultrasonic vibration device 40 and the reader / writer 32 as in FIG. FIG.

  After this, if the communication with the inlet and the inspection of the mounting state are completed without any problem, a lot number is assigned. If either the communication with the inlet or the inspection of the mounting state is NG, bad marking It is removed and wound up as a roll (S45 to S48) is the same as in the previous embodiment.

  As described above, in this embodiment, the inlet 34 is first created after the strap inspection, and the mounting state inspection and the inlet communication inspection are performed using the reader / writer 32 at an arbitrary stage thereafter. Inspection is possible.

  Next, the conditions of the vibration load applied in this embodiment will be described. In this embodiment, since the joining of the antenna unit 31 and the strap unit 21 and the inspection of the mounting state of the IC chip and the strap substrate are separately performed, the vibration condition is set to the antenna as in the previous embodiment. It is not necessary to limit to those for metal bonding of the portion 31 and the strap portion 21. Therefore, a vibration load that simulates a desired state can be applied.

  5 and 6 are schematic diagrams illustrating an example of a waveform of a vibration load. Here, the vibration waveform is determined by, for example, frequency, amplitude, and application time.

  FIG. 5A shows a normal vibration wave. This may be, for example, a vibration wave (vibration wave having a first vibration condition) used when the strap part 21 and the antenna part 31 are joined. On the other hand, in order to shorten the inspection time, the applied frequency may be increased. In this way, the number of waves that reach the financial arrival part per unit time increases, and the inspection time can be shortened accordingly. For example, when the frequency is doubled, the number of waves that reach the financial arrival part per unit time is doubled, so that vibrations with the same wave number can be applied even if the time is halved.

  Specifically, when a 20 kHz wave is applied for 1 second, a wave of 20000 cycles is applied. On the other hand, as shown in FIG. 5B, when the application time is halved to 0.5 seconds, only a wave of 10,000 cycles is applied. Further, as shown in FIG. 5C, by applying the frequency to be doubled to 40 kHz, waves for 20000 cycles can be applied even if the time is 0.5 seconds. Thus, the waveform of the vibration wave is not limited to the vibration having the first vibration condition used when the strap portion 21 and the antenna portion 31 are joined, and any vibration having a different second vibration condition can be applied.

  FIG. 6 is a diagram illustrating another example of the vibration load. Contrary to the case of FIG. 5, it is possible to increase the number of waves reaching the financial arrival part per unit time by lowering the frequency and increasing the time. For example, as shown in FIG. 6B, when the frequency is halved, the wave number reaching the financial arrival part per unit time is also halved. However, as shown in FIG. 6C, if the vibration application time is doubled, the vibration having the same wave number can be applied to the financial arrival part.

  That is, when a 20 kHz wave is applied for 1 second, a wave of 20000 cycles is applied. When the applied frequency is halved to 10 kHz, only a wave of 10,000 cycles is applied. Even in this case, a wave for 20000 cycles is applied by setting the application time to 2 seconds, which is twice as long.

  Next, another example of vibration will be described. The vibration load may be a load closer to the vibration to be simulated, and is not necessarily an ultrasonic wave. As a method for increasing the vibration load, the amplitude is increased (the width of the vibration is increased), the frequency is increased (the number of vibrations to be applied is increased), and the time for applying the vibration is increased (the number of vibrations to be applied). There will be more).

  A schematic diagram of these vibration loads is shown in FIG. (A) is the original waveform, (B) is the waveform when the amplitude is increased, (C) is the waveform when the frequency is increased, and (D) is the time to apply the vibration. Waveform of the case.

  In the above embodiment, the case where the RFID tag inlet is inspected as an IC component has been described. However, the present invention is not limited to this, and the connection portion of an arbitrary IC component having a substrate to which an IC chip is connected via an electrode. Can be used for inspection.

  In each of the above-described embodiments, only the vibration has been described as an example of the load. However, the present invention is not limited to this, and heat may be loaded together.

  As mentioned above, although embodiment of this invention was described with reference to drawings, this invention is not limited to the thing of embodiment shown in figure. Various modifications and variations can be made to the illustrated embodiment within the same range or equivalent range as the present invention.

1 is a block diagram illustrating an overall configuration of a system in which an IC component inspection apparatus is incorporated and processing performed in each component device according to an embodiment of the present invention. It is a schematic diagram which shows the test | inspection procedure in a joining and mounting state test | inspection. It is a block diagram which shows the process performed in the whole structure of the system in which the inspection method of the other joining and mounting states was integrated, and each component apparatus. It is a schematic diagram which shows the test | inspection procedure in the joining and mounting state test | inspection in other embodiment. It is a schematic diagram which shows the vibration waveform by an ultrasonic vibration apparatus. It is a schematic diagram which shows the vibration waveform by an ultrasonic vibration apparatus. It is a schematic diagram which shows the vibration waveform by an ultrasonic vibration apparatus. It is a figure which shows the method of confirming operation | movement of the conventional IC chip.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 Mounting machine, 20 Strap inspection machine, 21 Strap part, 22 Strap board, 23 IC chip, 24 terminal, 25 Financial attachment part, 30 Bonding machine, 31 Antenna part, 32 Reader / writer, 34 inlet, 40 Ultrasonic vibration apparatus 41 Ultrasonic vibrator, 42 Horn, 43 Anvil, 44 Connection part, 50 RFID tag inlet manufacturing apparatus.

Claims (14)

An IC component connection portion inspection method for inspecting a connection state between an electrode and a substrate in an IC component having a substrate to which an IC chip is connected via an electrode and an antenna connected to the substrate,
An IC component connection part inspection method for determining a connection state between an electrode and a substrate based on whether or not communication with an external device is possible via an antenna while applying a vibration load to the substrate to which the IC chip is connected via the electrode. 2. The IC component connection according to claim 1, wherein during the joining operation for joining the substrate to the antenna, the connection state between the electrode and the substrate is determined based on whether or not communication with an external device is possible via the antenna while applying a load to the substrate. Department inspection method. The IC component according to claim 1, wherein after connecting the substrate to the antenna, the connection state between the electrode and the substrate is determined based on whether or not communication with an external device is possible via the antenna while applying a load to the substrate to which the antenna is bonded. Connection inspection method. The IC component connection portion inspection method according to claim 1, wherein the IC component is an RFID tag inlet, and the inspection method is an RFID tag inlet inspection method. The IC component connection part inspection method according to claim 1, wherein the vibration load applied to the substrate is ultrasonic vibration. When joining the substrate to the antenna, apply ultrasonic vibration of the first vibration condition,
The IC according to any one of claims 3 to 5, wherein the vibration load applied to the substrate when determining the connection state between the electrode and the substrate based on whether or not communication with an external device is possible via the antenna is also the first vibration condition. Component connection inspection method. When joining the substrate to the antenna, apply ultrasonic vibration of the first vibration condition,
The vibration load applied to the substrate when judging the connection state between the electrode and the substrate based on whether or not communication with an external device is possible via the antenna is a second vibration condition different from the first vibration condition. The IC component connection part inspection method according to any one of the above. An IC component connection portion inspection apparatus for inspecting a connection state between an electrode and a substrate in an IC component having a substrate to which an IC chip is connected via an electrode and an antenna connected to the substrate,
Holding means for holding a substrate to which the IC chip is connected via an electrode;
Vibration loading means for applying a vibration load to the substrate held by the holding means;
IC component connection including connection state determination means for determining a connection state between the electrode and the substrate according to whether or not communication with an external device is possible via the antenna while applying a vibration load to the substrate by the vibration load unit. Department inspection device. The connection state determination means determines a connection state between the electrode and the substrate according to whether or not communication with an external device via the antenna is possible during a bonding operation of bonding the substrate to the antenna. The IC component connection portion inspection apparatus described. The IC component connection part inspection apparatus according to claim 8, wherein the holding unit holds a substrate to which the antenna is bonded. The IC component connection portion inspection apparatus according to claim 8 or 9, wherein the IC component is an RFID tag inlet. The IC component connection portion inspection device according to claim 8, wherein the vibration load means is an ultrasonic vibration device. The vibration load means applies ultrasonic vibration under a first vibration condition when joining the substrate to the antenna, and determines the connection state between the electrode and the substrate depending on whether or not communication with the external device is possible via the antenna. The IC component connection part inspection apparatus according to claim 10, wherein a vibration load applied to the substrate when making the determination is also the first vibration condition. The vibration load means applies ultrasonic vibration under a first vibration condition when joining the substrate to the antenna, and determines the connection state between the electrode and the substrate depending on whether or not communication with the external device is possible via the antenna. The IC component connection part inspection apparatus according to claim 10, wherein the vibration load applied to the substrate when making the determination is a second vibration condition different from the first vibration condition.

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