JP2008300852A - Manufacturing method of airtight terminal and electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of an airtight terminal for preventing the generation of double defects by the fitting of the lead of another airtight terminal between the leads of a certain airtight terminal, bending of the lead and the dispersion of the thickness of a plating layer between the leads, when plating many airtight terminals altogether by a barrel plating method. <P>SOLUTION: The manufacturing method of the airtight terminal comprises a process of fixing the lower ends of the leads 3A and 3A by a fixing material 5 while keeping a prescribed interval for each airtight terminal Ao, a process of forming the plating layer 4 on the fixed leads, and a process of cutting the plated leads 3A and 3A from the part near the fixing material 5. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a hermetic terminal and an electronic component manufactured by the method, and more specifically, manufacturing a cylindrical hermetic terminal in which, for example, two lead surfaces are formed by applying a barreling method. Regarding the method.

  Conventionally, there are various types of hermetic terminals depending on the application, and a plating layer of a material and thickness corresponding to the application is formed on an exposed portion of a metal member such as a metal outer ring or a lead. FIG. 13 is a perspective view showing a part of a cylindrical airtight terminal C for a quartz crystal unit for wristwatches in cross section. In FIG. 13, reference numeral 61 denotes a cylindrical metal outer ring, and leads 63 and 63 are hermetically sealed through a glass 62 therein. On the exposed surfaces of the metal outer ring 61 and the leads 63, 63, plated layers 64, 64 of Ni, Au, solder, etc. are formed for rust prevention and solderability.

The airtight terminal C is manufactured by the manufacturing method shown in the manufacturing process block diagram of FIG. First, a metal outer ring 61, a glass tablet 62a obtained by kneading and granulating glass fine powder together with an organic binder, and pre-baking the glass tablet 62a and leads 63, 63 having a predetermined length l are prepared [FIG. a)], these are assembled in a predetermined positional relationship using a graphite sealing jig [FIG. 14 (b)], and the whole is heated at 980-1000 ° C. in a neutral or weakly reducing atmosphere, The metal outer ring 61 and the leads 63 and 63 are insulated and hermetically sealed through the glass 62 in which the glass tablet 62a is melted [FIG. 14 (c)]. Thereafter, plating layers 64 and 64 are formed on the exposed portions of the metal outer ring 61 and the leads 63 and 63. Then, the airtight terminal C as shown in FIG. 13 can be manufactured [FIG. 14D]. For example, Patent Documents 1 and 2 disclose this type of lead plating method.
Japanese Patent Laid-Open No. 61-216349 Japanese Patent Laid-Open No. 01-096395

  By the way, although the plating layer 64 is formed on the exposed portions of the metal outer ring 61 and the leads 63 and 63, the outer diameter of the metal outer ring 61 is 0 in the cylindrical airtight terminal C for a quartz resonator for a wristwatch. .90-0.95 mm, which is very small, in order to increase the working efficiency of the plating process, a so-called barrel plating method in which a large number of hermetic terminals C are accommodated in a barrel and plated at once is performed. desired. However, as described above, the cylindrical airtight terminal C for a quartz crystal for a wristwatch has a very small outer diameter of the metal outer ring 61 of about 0.90 to 0.95 mm, and the leads 63 and 63 accordingly. The outer diameter d is also reduced to about 0.13 to 0.17 mm, and the distance g between the leads 63 and 63 is about 0.10 to 0.20 mm, which is substantially equal to the outer diameter d of the leads 63 and 63. Therefore, when the barrel plating method is employed, the lead 63 of one hermetic terminal C1 fits between the leads 63 and 63 of the other hermetic terminal C2, and the plating layer 64 is formed in this state. For this reason, there is a problem that so-called Abeck failure, in which the lead 63 of one hermetic terminal C1 and the lead 63 of another hermetic terminal C2 are adhered to each other by the plating layer 64, occurs. Further, as described above, since the leads 63 and 63 are thin and the waist is weak, there is a problem that the leads 63 and 63 are bent, so-called lead bending failure is likely to occur. Furthermore, since the leads 63 and 63 are insulated from each other by the glass 62, the formation conditions (plating conditions) of the plating layer 64 between the one lead 63 and the other lead 63 are slightly different from each other. In addition, there is a problem that uniform plating layers 64 and 64 are difficult to form.

  In order to prevent the above-mentioned Abeck failure between the leads, for example, as described in Japanese Patent Application Laid-Open No. 61-216349 of Patent Document 1, a plurality of airtight terminal leads 63 and 63 are connected to a common connection conductive wire. However, in the case of a very small cylindrical airtight terminal C as in the above-described quartz resonator for wristwatches, the leads 63 and 63 are connected to the common connection conductive material. The operation of welding with a wire is extremely complicated, and the formation cost of the plating layer is remarkably increased, so that it cannot be adopted as an inexpensive hermetic terminal C for a quartz resonator for wristwatches. In addition, when each hermetic terminal C is welded by the common connection conductive wire, when the hermetic terminal C is to be plated by the barrel plating method, the common connection conductive wire becomes an obstacle and the hermetic terminal C enters the barrel. Capacity is limited. Furthermore, since the leads 63 and 63 that are thin and weak are easily bent when the leads 63 and 63 are welded to the same potential by welding the common connection conductive wires, the formation process of the plating layers 64 and 64 is performed. Later, it is necessary to correct the leads 63 and 63. Therefore, from this point of view, the cost is soared that it cannot be used for an inexpensive hermetic terminal C for a quartz watch. Furthermore, the common connection conductive wires used for fixing the leads must be disposed of as metal scraps after the leads are cut, resulting in a problem of increased material costs and disposal costs. Japanese Patent Application Laid-Open No. 01-096395 of Patent Document 2 discloses a method for plating which prevents lead bending or Abeck failure in a plating process of an airtight terminal in which a plurality of leads are drawn out in the same direction. A manufacturing method of an airtight terminal is described in which a resin material is used between a plurality of leads immersed in a liquid solution and bridged and fixed integrally, and plating is performed while holding the leads constant.

  The object of the present invention is to prevent the above-mentioned conductive material from causing bad Abeck or bending of leads even in a small electronic component such as the above-described cylindrical airtight terminal C for a quartz crystal for a wristwatch. Alternatively, an airtight terminal component that is preliminarily fixed short-circuited or bridged using a resin material is prepared, and an electronic component is provided as an airtight terminal for barrel-plating the airtight terminal component. That is, when forming a brazing filler metal layer on the lead surface of a large number of hermetic terminal parts by barrel plating, leads of other hermetic terminals are fitted between the leads of a certain hermetic terminal, causing an Abeck failure, An object of the present invention is to provide a method for manufacturing an airtight terminal that does not bend or the thickness of a plating layer does not vary between leads, and an electronic component manufactured by the method.

  The present invention relates to a hermetic terminal component including a plurality of leads that are separated from each other through an insulating material and hermetically sealed through a metal outer ring, and the steps of fixing the lower ends of each lead with a fixing material And a barrel plating process in which a plurality of hermetic terminal components are accommodated in a barrel and a plating layer is formed on a plurality of leads, and a lead is cut at a predetermined position after the plating layer is formed, and a fixing material is removed. A method for manufacturing an airtight terminal is provided, in which a uniform plating layer is provided on a lead portion extending through the metal outer ring. Here, the plating layer is a brazing material layer with good solderability. If the plating layer is a brazing material layer, this brazing layer can be used to easily braze electronic components such as crystal vibrating pieces to the leads or braze the leads to the printed circuit board. Can be. The fixing material has a ball-shaped lump having an outer diameter larger than a distance between leads. If the outer diameter of the ball-shaped fixing material is larger than the distance between the leads of the electronic component, the lower end of the lead of the electronic component can be easily and reliably placed on the ball-shaped fixing material, resulting in high manufacturing efficiency. Become.

  According to another aspect of the present invention, an airtight terminal having hermetically sealed leads penetrating the outer metal ring with a glass insulating material interposed therebetween, and forming plating layers on the extended portions above and below the lead The plating layer is prepared by preparing a hermetic terminal component fixed with a fixing material while keeping the lower end portions of the leads at a predetermined interval, and housing a number of prepared hermetic terminal components in a barrel and batch plating. Thus, an electronic component is provided in which a plating layer is formed on the surface of the lead and the fixing material is removed by cutting the lower end portion of the lead after the plating process. Preferably, the hermetic terminal is a cylindrical hermetic terminal for a crystal unit having lead spacing of about 0.1 to 0.2 mm. The hermetic terminal has an outer diameter of 0.90 to 0.95 mm in which the metal outer ring is made of low carbon steel, Fe—Ni alloy or Fe—Ni—Co alloy, and the lead is Fe—Ni alloy or Fe— This is a cylindrical airtight terminal for a crystal resonator having an outer diameter of 0.13 to 0.17 mm made of a Ni—Co alloy. Thus, when the electronic component is a cylindrical hermetic terminal for a crystal resonator, the outer diameter is small, the leads are thin and the waist is weak, and the distance between the leads is almost equal to the outer diameter of the leads. Even in this case, it is possible to provide an electronic component using a manufacturing method of an airtight terminal having no lead failure between leads, no lead bending, and a uniform plating layer.

  In order to fix the lower end portions of the leads to each hermetic terminal while maintaining the mutual spacing, a fixing device that bridges the leads is used. This fixing device, for example, holds a box-shaped container for containing a resin or conductive material used as a fixing material in a molten state, a heater arranged at the bottom of the container so as to keep the molten state, and airtight terminal components at predetermined intervals. A fixing jig that moves up and down and a stopper that prevents the fixing jig from descending above a certain level are provided. The fixing jig uses comb teeth having a large number of slits in which the airtight terminal lead can move in the X direction and cannot move in the Y direction in a plane. The width w of the slit is larger than the outer diameter of the lead. Is set to be slightly larger and smaller than the outer diameter of the metal outer ring. A taper is provided at the open end of each slit to facilitate lead insertion. The fixing jig holding a number of airtight terminal parts in a suspended state is lowered to a position where it is stopped by a stopper, and the lower end of the lead Only the part is immersed in the molten fixing material. After dipping and holding in the fixing material for a predetermined time, the fixing jig is pulled up.

  The fixing of the lead with the fixing material of the conductive material is performed by placing the lower end portions of the leads of the many airtight terminal parts on the ball-shaped fixing material using a fixing jig and heating the same at or above the melting point of the fixing material. Is called. In this way, when the lower end of the lead is placed on a ball-shaped low melting point alloy and heated to the melting point or higher of the low melting point alloy, the leads of a large number of hermetic terminal parts are fixed together by a fixing material. Compared to the conventional method of welding the common connection conductive wire at the lower end of each lead, the workability is remarkably superior and suitable for mass production. The same effect can be expected even if the fixing material is a resin material.

  The process of fixing the lower ends of the leads of a large number of airtight terminal parts can be performed continuously or intermittently in addition to the batch method described above. In addition, the fixing step includes a storage container that stores the fixing material in a molten state, and a lower heater that adjusts the temperature if necessary. The fixing material storage container contains the fixing material in a molten state. A baffle plate is installed on the storage container. In addition, the molten fixing material is supplied onto the rectifying plate by a pump to create a laminar flow with the molten fixing material having a predetermined thickness. Furthermore, a conveyor is installed above the laminar flow with a predetermined gap, and is configured to be transferred continuously or intermittently.

  A feature of the present invention is that a large number of hermetic terminal parts with leads fixed by a fixing material are accommodated in a barrel and collectively plated. In particular, the lower end portion of the lead plated in the subsequent process is cut to fix the fixing material. Is to remove. That is, as shown in FIG. 2, after preparing an airtight terminal component, the steps of fixing by the fixing material 5, forming the plating layer 4 by barrel plating, and cutting the lead 3 to remove the fixing material 5 are included. A method for manufacturing an airtight terminal is disclosed, and a new and improved electronic component manufactured by this method is provided.

  In the present invention, since the plating layer is formed by barrel plating after the lower ends of the leads are fixed to each other with a fixing material such as a conductive material or a resin material, the lead of the hermetic terminal, which is a plating process, is between the leads of the other hermetic terminals. The fitting is prevented and so-called Abeck failure does not occur. Further, since the leads are fixed to each other by the fixing material, the strength of each lead is apparently increased, so that the bending failure of the leads does not occur. In particular, since the lead plating layer is formed by the barrel plating method, a large amount of hermetic terminal parts can be plated at a time, and the productivity is improved. Further, the distance between the leads is kept at a predetermined dimension, the leads are not bent, and a uniform plating layer is provided between the leads. In addition, when the leads are fixed with a ball-shaped fixing material, the outer diameter of the lead is larger than the distance between the leads, so that the tip of the lead of a certain airtight terminal can be fitted between the other leads. Not only can the occurrence of Abeck defects be reduced, but even thin and weak leads can be fixed by a fixing material, and the strength increases apparently, leading to a reduction in the occurrence of lead bending defects, and further by insulation. When the insulated lead is fixed by the fixing material, the same plating conditions are obtained, and the remarkable effect is obtained that variation in plating thickness between the leads is reduced.

  In addition, according to the method for manufacturing an airtight terminal of the present invention, in order to form a uniform plating layer on a pair of elongated leads extending from the hermetic terminal component, a bridge is formed between the ends of the elongated leads prior to the plating process. In addition, since the barrel plating method is adopted, it is possible to provide an electronic component with little or no variation in Abeck, lead bending and plating thickness variation between leads.

Embodiments of the present invention will be described below with reference to the drawings.
FIG. 1 shows a first embodiment of the electronic component of the present invention. Specifically, a perspective view of a cylindrical airtight terminal A for a quartz resonator for a wristwatch is shown. In the figure, reference numeral 1 denotes a cylindrical metal outer ring, and two leads 3 and 3 are hermetically sealed through a glass 2 therein. The metal outer ring 1 is made of, for example, low carbon steel, Fe—Ni alloy, Fe—Ni—Co alloy or the like, and has an outer diameter dimension d1 of 0.90 to 0.95 mm and a height dimension of 0.75 to 0.00. 85 mm. The glass 2 is made of soda lime glass, soda barium glass, borosilicate glass, or the like. The leads 3 and 3 are made of Fe-Ni alloy, Fe-Ni-Co alloy or the like, and have an outer diameter d3 of 0.13 to 0.17 mm and a length l of 7.0 to 8.0 mm. The distance g between the leads 3 and 3 is 0.10 to 0.20 mm. Plated layers 4 and 4 are formed on exposed portions of the metal outer ring 1 and the leads 3 and 3.

  FIG. 2 shows a brazing material layer 4, 4 having a thickness of, for example, 20 to 30 μm as an example of the plating layers 4, 4 on the exposed portion of the metal member of the airtight terminal A, ie, the metal outer ring 1 and the leads 3, 3. It is sectional drawing of the state which formed Sn-90 wt% Pb layer which is. The brazing filler metal layers 4 and 4 serve as a sealing material between the metal outer ring 1 and the metal cap when the metal outer ring 1 is pressed and sealed as will be described later, and serve for airtight sealing. . Further, in the leads 3 and 3, the brazing material layer 4 in the upper part of the leads 3 and 3 is useful for brazing electronic component elements such as a crystal vibrating piece, and the brazing material in the lower part of the leads 3 and 3. The layer 4 serves to ensure brazing properties when the leads 3 and 3 are brazed to a printed circuit board or the like. Here, the brazing filler metal layers 4 and 4 of the leads 3 and 3 are formed only on the peripheral surface portion of the leads 3 and 3, and are not formed on the lower end surfaces 3a and 3a thereof. This reason originates in the manufacturing method of this invention mentioned later. Even if the lower end surfaces 3a and 3a of the leads 3 and 3 are not provided with the brazing material layers 4 and 4, the lower ends of the leads 3 and 3 of the airtight terminal A are generally inserted into through holes such as a printed circuit board. Since it is cut off after being brazed, there is no problem.

  Hereinafter, a first embodiment of the method for manufacturing the hermetic terminal A of the present invention described above will be described with reference to the drawings. FIG. 3 shows a manufacturing process block diagram of the first embodiment of the manufacturing method of the present invention. First, a metal outer ring 1 is manufactured by extruding and punching a metal plate of iron / nickel alloy or the like having a predetermined thickness. In addition, glass fine powder such as borosilicate glass and an organic binder are kneaded and granulated to a predetermined particle size, then press-formed into a predetermined shape, calcined to bind the glass particles together, and the organic binder is baked. Fly to make a glass tablet 2a. Further, a metal wire such as an Fe—Ni—Co alloy having a predetermined outer diameter is cut into an appropriate length dimension la (= l + Δl) longer than the length l of the leads 3 and 3 of the airtight terminal A, Leads 3A and 3A are manufactured [FIG. 3A].

  Then, these metal outer ring 1, glass tablet 2a and leads 3A, 3A are assembled at predetermined positions using a graphite sealing jig (not shown) [FIG. 3 (b)], neutral to weak The glass tablet 2a is melted by heating at about 980 to 1000 ° C. in a reducing atmosphere, and the leads 3A and 3A are hermetically sealed with the glass 2 [FIG. 3 (c)]. 3A to 3C, the airtight terminal component Ao that is the original form of the airtight terminal A of FIGS. 1 and 2 is manufactured.

  Next, the outer ends of the leads 3A and 3A of the hermetic terminal component Ao are fixed with the fixing material 5 made of a conductive material while maintaining the distance g between the leads 3A and 3A [FIGS. 3 (d) and 4]. . A method of fixing the lower ends of the leads 3A, 3A of the hermetic terminal component Ao with the fixing material 5 will be described in detail later.

  Next, as shown in FIG. 4, a number of hermetic terminal parts Ao having the lower ends of the leads 3A and 3A fixed by the fixing material 5 are accommodated in a barrel (not shown), and this barrel is immersed in a plating bath. Then, the brazing material layers 4 and 4 are formed on the exposed portions of the metal outer ring 1 and the leads 3A and 3A by a so-called barrel plating method [FIG. 3 (e), FIG. 5].

  Next, the lower portions of the leads 3A and 3A of the airtight terminal Ao on which the brazing filler metal layers 4 and 4 are formed are cut from the upper end at a position 6 having a predetermined dimension 1 [FIG. 3 (f) and FIG. 5]. Then, the fixing material 5 to which the leads 3A and 3A are fixed is cut and removed, and an airtight terminal A having leads 3 and 3 having a predetermined length l as shown in FIG. 2 is obtained. The brazing filler metal layers 4 and 4 are formed on the exposed surfaces of the metal outer ring 1 and the leads 3 and 3 of the airtight terminal A thus obtained. As described above with reference to FIG. , 3 have no brazing filler metal layers 4 on the lower end surfaces 3a, 3a.

  In this type of airtight terminal A for a quartz oscillator for a wristwatch, a quartz crystal vibrating piece (not shown) is fixed to the upper ends of the leads 3 and 3. 4 increases the brazing performance of the crystal vibrating piece and helps to ensure brazing. Further, after the quartz crystal vibrating piece is fixed, as shown in FIG. 6, a metal cap 7 is sealed by press fitting to form a quartz crystal resonator 8. At this time, the brazing filler metal layer 4 of the metal outer ring 1 is made of metal. Filling the space between the outer ring 1 and the metal cap 7 helps to ensure a hermetic seal.

  Further, in the crystal resonator 8 using the airtight terminal A, as shown in FIG. 6, the leads 3 and 3 are inserted into the through holes 11 of the printed circuit board 10, and the through holes 11 are formed by the jet plating method. The leads 3 and 3 are brazed with a brazing material 14 to the conductive layer 13 exposed from the resist layer 12 and assembled. At this time, the brazing material layers 4 a and 4 a on the peripheral surface portions of the leads 3 and 3 are useful for securing brazing properties by the brazing materials 14 and 14. The lower end surfaces 3a and 3a of the leads 3 and 3 of the airtight terminal A do not have the brazing material layers 4 and 4. However, even if the brazing material layers 4 and 4 are not provided at this position, in most cases there is no problem. Absent. That is, after the leads 3 and 3 of the crystal resonator 8 are brazed to the printed circuit board 10, the leads 3 and 3 are cut from the illustrated alternate long and short dash line position 15 near the brazed portion. Therefore, even if the lower end surfaces 3a and 3a of the leads 3 and 3 are not provided with the brazing material layers 4 and 4, no problem is caused in practice.

  However, if the brazing filler metal layers 4 and 4 are also required on the lower end surfaces 3a and 3a of the leads 3 and 3, in the manufacturing process block diagram of FIG. 3, the cutting process of the leads 3A and 3A [FIG. ], As additionally indicated by a chain line, a plating step may be added to the lower end surfaces 3a and 3a of the leads 3 and 3 [FIG. 3 (g)]. When such a method is employed, as shown in FIG. 7, thick brazing material layers 4a and 4a are formed on the peripheral surfaces of the leads 3A and 3A, and the lower end surfaces 3a and 3a of the leads 3 and 3 are thin. The airtight terminal B on which the brazing filler metal layers 4b and 4b are formed is obtained as an electronic component.

  Next, a first embodiment in which the lower ends of the leads 3A and 3A of the hermetic terminal component Ao are fixed by the fixing material 5 will be described. FIG. 8 is a schematic cross-sectional view of the fixing material fixing device 20 of the first embodiment used in the fixing process of the leads 3A and 3A by the fixing material 5. In FIG. 8, 21 is a material to which the fixing material 5 is not fused, for example, a lower jig made of graphite. The lower jig 21 has a large number of recesses 22 having a mortar shape at the bottom, with a size enough for a single ball-shaped fixing material 5a, which will be described later, to enter, and the opening 23 of each recess 22 is tapered. ing. Reference numeral 24 denotes an upper jig, which is made of, for example, the same material as that of the lower jig 21 and has a through hole 25 having a size that allows the airtight terminal Ao to enter the position corresponding to each recess 22 of the lower jig 21. The lower end opening 26 of each through hole 25 is tapered.

  Next, one ball-shaped fixing material 5 a is accommodated in each recess 22 of the lower jig 21. In this case, various methods can be employed. For example, the lower jig 21 is put into a frame that rises from the periphery by a predetermined dimension, and a large number of ball-shaped fixing members 5a are accommodated in the recesses formed by the lower jig 21 and the wall surface of the frame, By swinging the lower jig 21, one ball-shaped fixing material 5 a can be accommodated in each recess 22. At this time, the tapered opening 23 of the concave portion 22 functions to smoothly move the ball-shaped fixing material 5 a into the concave portion 22. When one ball-shaped fixing material 5 a is accommodated in each recess 22, the excess fixing material 5 a is discharged from the lower jig 21.

  Alternatively, a fixing material supply auxiliary tool 30 as shown in FIG. 9 can be used. In FIG. 9, the fixing material supply assisting tool 30 has an upper plate 31 and a lower plate 33 having through holes 32 and 34 at positions corresponding to the concave portions 22 of the lower jig 21 at predetermined intervals. Three sides of the upper plate 31 and the lower plate 33 are connected by a side plate 35. The side plate 35 has frame portions 36 and 37 that protrude by a predetermined dimension above the upper plate 31 and below the lower plate 33, respectively. Further, a slidable shutter 38 having a through hole 39 is disposed between the upper plate 31 and the lower plate 33 in an arrangement corresponding to the through holes 32 and 34, that is, an arrangement corresponding to the concave portions 22 of the lower jig 21. It has an intervening configuration.

  A method for supplying the fixing material 5a using the fixing material supply auxiliary tool 30 will be described. First, the lower jig 21 is positioned and arranged using the frame body portion 37 below the lower plate 33 of the fixing material supply assisting tool 30. Next, as shown in FIG. 9, the shutter 38 has its through holes 39 positioned so as not to coincide with the through holes 32 and 34 of the upper plate 31 and the lower plate 33, and a large number of the shutters 38 are formed on the upper plate 31. The ball-shaped fixing material 5a is supplied. Then, one ball-shaped fixing material 5a is accommodated in each through hole 32 of the upper plate 31 by swinging in the same manner as described above. When one ball-shaped fixing material 5 a is accommodated in each through hole 32 of the upper plate 31, the shutter 38 is moved to the left in FIG. 9 so that the through hole 39 passes through each of the upper plate 31 and the lower plate 33. Align with the through holes 32 and 34. Then, each fixing member 5 a accommodated in the through hole 32 of the upper plate 31 passes through the through hole 39 of the shutter 38 and the through hole 34 of the lower plate 33 and is accommodated in each recess 22 of the lower jig 21. The

  Next, one airtight terminal component Ao is accommodated in each through hole 25 of the upper jig 24. First, an auxiliary plate (not shown) is placed on the upper jig 24 so that the opening 26 is turned upside down and the airtight terminal component Ao is transferred into each through hole 25. At this time, since the center of gravity of the airtight terminal part Ao is biased due to the metal outer ring 1 and the glass 2, the metal outer ring 1 side is naturally transferred downward. At this time, since the opening 26 of the through hole 25 of the upper jig 24 is tapered, the airtight terminal component Ao is smoothly transferred to the through hole 25.

  Next, the upper jig 24 in which the airtight terminal parts Ao are accommodated one by one in the respective through holes 25 is turned upside down, and the lower jig 21 in which the fixing material 5a is accommodated one by one in each recess 22. Put on top. Then, the airtight terminal Ao accommodated in the through hole 25 of the upper jig 24 comes down by its own weight, and the lower ends of the leads 3A and 3A ride on the ball-shaped fixing material 5a. FIG. 8 shows this state.

  In this state, it heats more than the melting point of the adhering material 5a. Then, the fixing material 5a is melted, and the lower ends of the leads 3A and 3A of the airtight terminal Ao are mechanically fixed by the fixing material 5 and electrically fixed as shown in FIG. . Here, as shown in FIG. 4, the diameter d5 of the fixing material 5 formed into a ball shape by the surface tension is larger than the distance g between the leads 3A and 3A (d5> g). This dimensional relationship functions effectively during plating described later.

  Next, a second embodiment in which the lower ends of the leads 3A and 3A of the airtight terminal component Ao are fixed by the fixing material 5 will be described. FIG. 10 is a schematic cross-sectional view of a fixing material fixing device 40 according to the second embodiment. A box-shaped fixing material storage container 41, a heater 42 disposed at the bottom of the storage container 41, and the inside of the storage container 41 A fixing member 5b accommodated in a molten state, a fixing jig 43 that moves up and down while holding a large number of hermetic terminals Ao at predetermined intervals, and a stopper 44 that prevents the fixing jig 43 from descending more than a certain level. It has. The fixing material 5b is a brazing material having a melting point higher than the plating bath temperature for forming the plating layers, for example, the brazing material layers 4 and 4 on the leads 3A and 3A of the airtight terminal Ao, for example, a melting point higher by about 100 to 150 ° C. Sn-60 wt% Pb is preferred.

  FIG. 11 is a perspective view of an example of the fixing jig 43. The leads 3A and 3A of the airtight terminal component Ao have a large number of slits 43a that can move in the X direction and cannot move in the Y direction in a plane. It is comb-shaped. Therefore, the width w of the slit 43a is set to be slightly larger than the outer diameter d3 of the leads 3A and 3A and smaller than the outer diameter d1 of the metal outer ring 1 (d3 <w <d1). In addition, a taper 43b is provided at the open end of each slit 43a in order to facilitate the insertion of the leads 3A and 3A.

  As shown in FIG. 10, the fixing jig 43 holding a large number of hermetic terminal parts Ao in a suspended state is lowered to a position where it is stopped by a stopper 44, and the leads 3A, 3A of the hermetic terminal parts Ao are lowered. Only the lower end is immersed in the molten fixing material 5b and held for a predetermined time, and then the fixing jig 43 is pulled up.

  Then, as shown in FIG. 4, the fused fixing material 5b fused to the lower ends of the leads 3A and 3A of each hermetic terminal component Ao is spheroidized and solidified by surface tension to form a ball-shaped fixing material 5. The leads 3A and 3A are fixed while maintaining a predetermined gap dimension g. Here, as shown in FIG. 4, the diameter d5 of the fixing material 5 formed into a ball shape by the surface tension is larger than the distance g between the leads 3A and 3A (d5> g).

  In the first embodiment and the second embodiment of the fixing method using the fixing material of the present invention, the step of fixing the lower ends of the leads 3A and 3A of a large number of airtight terminal parts Ao with the fixing material 5 such as a conductive material is performed in a batch. Although the case where it carries out by a system was demonstrated, as a 3rd embodiment of the adhering method by an adhering material, it can also process continuously or intermittently. FIG. 12 is a schematic cross-sectional view of a fixing device 50 for explaining a third embodiment of the manufacturing method of the present invention. In FIG. 12, 51 is a container for fixing material, and has a heater 52 in the lower part thereof. In the fixing material container 51, a molten fixing material 5b is accommodated. Further, a rectifying plate 53 is installed on the fixing material container 51, and the molten fixing material 5b is supplied onto the rectifying plate 53 by a pump 54 so that the molten material has a predetermined thickness. The laminar flow 5c is formed by the fixing material 5b. Further, a conveyor 55 is installed above the laminar flow 5c with a predetermined gap, and is configured to be continuously or intermittently transferred from the left side to the right side as shown by the arrows in FIG. Yes.

  Accordingly, in the fixing material fixing device 50, a large number of hermetic terminal parts Ao having leads 3A and 3A having a length dimension la longer than the predetermined length dimension l are held on the conveyor 55 in a suspended state. If the leads 3A and 3A of the airtight terminal component Ao come above the device 50, they are immersed in the laminar flow 5c by the molten fixing material 5b. Therefore, when the fixing material 5b in the molten state gets wet and the leads 3A and 3A come out of the laminar flow 5c, the fixing material 5b fused to the leads 3A and 3A is spheroidized and solidified by surface tension, As shown in FIG. 4, the leads 3 </ b> A and 3 </ b> A are fixed to each other by a ball-shaped fixing material 5 while maintaining a predetermined gap dimension g. According to such an apparatus 50 and a method, since it can work continuously or intermittently compared with the case where the fixing material adhering apparatus 40 and method shown in FIG. 10 are used, production efficiency improves.

  Next, as an embodiment of the brazing material layer formation, as described above, a large number of hermetic terminal parts Ao in which the leads 3A and 3A are fixed by the fixing material 5 are accommodated in a barrel (not shown), and this barrel is plated. The brazing filler metal layers 4 and 4 are formed on the exposed portions of the metal outer ring 1 and the leads 3A and 3A by so-called barrel plating, which is immersed in a bath and rotated. At this time, as described above, since the outer diameter dimension d5 of the fixing material 5 is larger than the distance dimension g between the leads 3A and 3A (d5> g), between the leads 3A and 3A of the airtight terminal A1 in the plating process. The leads 3A and 3A of the other airtight terminal A2 are not easily fitted. Therefore, the leads 3A and 3A of the airtight terminals A1 and A2 are prevented from being entangled with each other, and the so-called Abeck failure in which the leads 3A and 3A are adhered to each other by the plating layer is less likely to occur. Further, as described above, since the leads 3A and 3A are fixed by the fixing material 5, the strength of the leads 3A and 3A is apparently increased as compared with the case where each of the leads 3A and 3A is single. 3A and 3A bending defects are less likely to occur. Further, since the leads 3A and 3A are electrically fixed by the fixing material 5 and have the same potential, that is, the same plating conditions, the uniform brazing material layers 4 and 4 on the leads 3A and 3A insulated by the glass 2 are used. Is formed. Since the melting point of the fixing material 5 is set higher than the temperature of the plating bath, the fixing material 5 does not melt at the temperature of the plating bath during the plating process.

Next, examples of the present invention will be described.
Airtight terminal parts Ao
Metal outer ring 1 Material: Fe-Ni alloy,
Dimensions: Outer diameter 0.92mm x Height 0.8mm x Thickness 0.1mm
Glass 2 Material: Borosilicate glass
Lead 3A Material: Fe-Ni-Co alloy,
Dimensions: Outer diameter 0.15mm x Length 9.65mm
Lead interval: 0.15mm
According to the first embodiment of the fixing method using the fixing material shown in FIG. 8, the ball-shaped fixing material 5a has a diameter of 0.5 mm.
Material: Sn-60 wt% Pb alloy was fixed, and the lower ends of the leads 3A, 3A were fixed with the conductive fixing material 5 having an outer diameter d5 = 0.5 mm. Next, a large number of hermetic terminal parts Ao in which the leads 3A, 3A are fixed by the fixing material 5 are accommodated in a barrel and plated by a barrel plating method in which the lead is immersed in a plating bath,
Brazing material layer 4 Material: Sn-90 wt% Pb alloy,
Thickness: 20μm
Formed. In the step of forming the brazing material layer 4 by the barrel plating method, the leads 3A and 3A of a certain hermetic terminal A1 are fitted between the leads 3A and 3A of the other hermetic terminal A2 and fixed by the brazing material layer 4. The so-called Abeck defect occurrence rate and the bending defect occurrence rates of the leads 3A and 3A were 10% and 3%, respectively. The variation in the thickness of the brazing filler metal layers 4 and 4 between the leads 3A and 3A was 0.1 to 0.3 μm.

Comparative example

  On the other hand, when the brazing material layer 4 is formed by barrel plating under the same conditions as described above except that the above leads 3A and 3A are not fixed by the fixing material 5, the leads 3A and 3A of a certain airtight terminal A1. Of the other airtight terminal A2 is fitted between the leads 3A and 3A and fixed by the brazing material layer 4, so-called Abeck failure occurrence rate and lead 3A and 3A bending failure occurrence rate are 60% and 10%, respectively. %Met. Further, the variation in the thickness of the brazing filler metal layers 4 and 4 between the leads 3A and 3A was 2 to 3 μm.

  From the results of the examples of the present invention and the comparative examples, the manufacturing method of the present invention has a remarkable Abeck defect occurrence rate, a bending defect occurrence rate of the leads 3A and 3A, and the brazing material layers 4 and 4 between the leads 3A and 3A. It is clear that the thickness variation is small. This is because, according to the manufacturing method of the present invention, the lead 3A, 3A of the hermetic terminal Ao is first fixed by the fixing material 5 so that the outer diameter d5 of the fixing material 5 is the distance between the leads 3A, 3A. Due to the fact that it is larger than the dimension g, the lower ends of the leads 3A, 3A are less likely to fit between the leads 3A, 3A of the other airtight terminals Ao, so that the leads 3A, 3A are entangled with each other. In this state, the so-called Abeck defect that is fixed by the brazing material layer 4 is less likely to occur, and secondly, the leads 3A and 3A of the airtight terminal Ao are fixed by the fixing material 5 so that the leads 3A and 3A are independent. The lead 3A, 3A is less likely to be bent due to an increase in its apparent strength as compared with the above case, and thirdly, it is insulated by the glass 2. Leads 3A that are, due to the 3A is fixed by a fixing member 5, leads 3A, 3A plating conditions is the same, due to the fact that leads 3A, a variation in plating thickness between 3A does not occur.

  Finally, the leads 3A and 3A of the hermetic terminal Ao on which the adhesive layers 4 and 4 are formed are cut from the upper end at a position 6 having a dimension l as shown in FIG. 5, and the hermetic terminal A shown in FIGS. Was made.

  In addition, although the said embodiment and Example of this invention demonstrated the cylindrical airtight terminal A for quartz crystal units for wristwatches as an example of an electronic component, this invention is limited to the said embodiment and Example. However, it is needless to say that the present invention can be applied to various electronic components and manufacturing methods thereof as other embodiments without departing from the spirit of the present invention.

  For example, in the above-described embodiment, the airtight terminal A for the press-fitting type quartz crystal resonator in which the shape of the metal outer ring 1 is a right cylindrical shape has been described as an example of the electronic component. The shape of the ring 1 may be formed on an inclined surface such that the diameter decreases from the middle part of the height dimension to the upper part from the upper part, and the lower part may be formed in a cylindrical shape from the middle part. According to such a shape, there is an advantage that the initial insertion operation and press-fitting operation into the metal cap of the metal outer ring are easy and smooth.

  Further, the fixing material 5 for fixing the leads 3A and 3A is not limited to the conductive material shown in the above embodiment, and other materials such as a resin material can be applied. However, the material of the fixing material 5 should not be melted at the temperature of the plating bath when the brazing material layers 4 and 4 are formed on the metal outer ring 1 and the leads 3A and 3A. More specifically, the melting point of the fixing material 5 is desirably higher by 100 ° C. or more than the temperature of the plating bath.

  Further, in the above embodiment, the airtight terminal for the press-fit sealing type quartz crystal unit has been described, but the same applies to the airtight terminal for the resistance welding sealed type and the cold pressure sealed type crystal unit. It can be done.

  Furthermore, in the above-described embodiment, the airtight terminal for the crystal resonator has been described. However, the present invention can be similarly applied to an airtight terminal for electronic components other than the airtight terminal for the crystal resonator.

  Further, in the above embodiment, the case where the brazing material layer 4 is formed as the plating layer formed on the exposed surface of the metal outer ring 1 and the leads 3 and 3 has been described. However, other adhesive layers such as Ni and Au are formed. The same applies to the case.

The perspective view of the cylindrical airtight terminal A for crystal oscillators of an example of the electronic component manufactured by the manufacturing method of this invention The expanded sectional view of the cylindrical airtight terminal A for crystal oscillators of an example of the electronic component manufactured by the manufacturing method of this invention Manufacturing process block diagram in the electronic component manufacturing method of the present invention The front view which shows a part of airtight terminal Ao of the state which fixed the lower end parts of the lead with the adhering material in the manufacturing method of this invention in a cross section The expanded sectional view which showed a part of airtight terminal A after forming the plating layer in the metal outer ring and the exposed part of a lead by this invention in the front Sectional drawing which shows the state which assembled | attached the crystal resonator as an example of the electronic component by this invention to the printed circuit board The enlarged front view which showed the principal part of the other airtight terminal B manufactured by the 2nd embodiment of the manufacturing method of this invention in the cross section. 1 is a schematic cross-sectional view of a fixing material fixing device according to a first embodiment used in a process of fixing lower end portions of leads with a fixing material in a manufacturing method of the present invention. The principal part expanded sectional view of the auxiliary tool of the fixing material fixing device of the 1st embodiment used for the process which fixes the lower end parts of a lead with fixing material in the manufacturing method of the present invention. Schematic sectional view of a fixing material fixing device of a second embodiment for fixing the lower ends of leads of the present invention with a fixing material. The perspective view of an example of the fixing jig used with the fixing material fixing device of the 2nd embodiment which fixes the lower end parts of the lead of this invention with a fixing material. Schematic sectional view of a fixing material fixing device according to a third embodiment for fixing the lower ends of leads of the present invention with a fixing material. The perspective view which showed a part of airtight terminal C as an example of the conventional electronic component in the cross section Manufacturing process block diagram of hermetic terminal C as an example of a conventional electronic component

Explanation of symbols

A, B Electronic components (airtight terminals)
Ao Airtight terminal parts 1 Metal outer ring 2 Insulation material (glass)
3 Lead 3A Lead 3a before cutting Lead lower end surface 4 Plating layer (brazing material layer)
4a Thick plating layer (brazing material layer)
4b Thin plating layer (brazing material layer)
5 Fixing material (conductive material or resin material)
5a Ball-shaped adhesive material 5b Molten adhesive material 5c Laminar flow 6 by molten adhesive material Lead cutting position 7 Metal cap 8 Crystal resonator 10 Printed circuit board 11 Through hole 12 Resist layer 13 Conductive layer 14 Brazing material 15 Lead Cutting position 20 fixing device (ball-shaped fixing material)
21 Lower jig 22 Recess 23 Opening 24 Upper jig 25 Through-hole 26 Opening 30 Supply auxiliary tool 31 Upper plate 32, 34, 39 Through-hole 33 Lower plate 35 Side plate 36, 37 Frame body 38 Shutter 40 Fixing device ( Batch type)
41, 51 Adhering material container 42, 52 Heater 43 Adhering jig 43a Slitting 43b Taper 44 Stopper 50 Adhering device (continuous or intermittent)
53 Current plate 54 Pump 55 Conveyor

Claims (5)

  In connection with a hermetic terminal component having a plurality of leads that are separated from each other through an insulating material and hermetically sealed and passed through an outer metal ring, a process of fixing the lower ends of each lead with a fixing material, and a number of hermetic terminals A barrel plating step of housing a part in a barrel and forming a plating layer on the plurality of leads; and a step of cutting the lead at a predetermined position after the plating layer is formed to remove the fixing material; A method for manufacturing an airtight terminal, characterized in that a uniform plating layer is provided on a lead portion extending through an outer ring.   The method for manufacturing an airtight terminal according to claim 1, wherein the plating layer is a brazing material layer having good solderability.   2. The method of manufacturing an airtight terminal according to claim 1, wherein the fixing material has an outer diameter dimension of a ball-shaped lump larger than a distance dimension between the leads.   An airtight terminal in which leads that penetrate through a metal outer ring with a glass insulating material interposed therebetween are hermetically sealed, and a plating layer is formed on a portion extending above and below the lead, the plating layer being a lead Preparing a hermetic terminal part fixed with a fixing material while keeping the lower end portions of each at a predetermined interval, accommodating a number of prepared hermetic terminal parts in a barrel and forming a plating layer on the lead surface by batch plating, An electronic component, wherein the fixing material is removed by cutting a lower end portion of the lead after plating. The hermetic terminal has an outer diameter of 0.90 to 0.95 mm in which the metal outer ring is made of low carbon steel, Fe—Ni alloy or Fe—Ni—Co alloy, and the lead is Fe—Ni alloy or Fe— 5. The electronic component according to claim 4, wherein the electronic component is a cylindrical airtight terminal for a crystal resonator having an outer diameter of 0.13 to 0.17 mm made of a Ni—Co alloy.

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