JP2008300447A - Heat dissipation device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a heat radiation device capable of improving a heat radiation capacity while suppressing a pressure loss of a cooling medium. <P>SOLUTION: A cut portion is formed nearby the reverse surface 12b of a heat radiation plate 12 of a heat radiation fin 14 disposed on the back side of a heating body 30 where a heating value is large, and then a local flow passage 18 is formed which makes cooling medium flow passages 16 and 26 adjacent communicate with each other across the heat radiation fin 14. A hear radiation wall 20 that the cooling medium flowing in the cooling medium flow passage 16 collides against is stood nearby the local flow passage 18 on the reverse surface 12b of the heat radiation plate 12. The cooling medium having collided against the heat radiation wall 20 flows to the cooling medium flow passage 26 through the local flow passage 18. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a heat dissipation device for releasing heat generated by a heating element.

  As an example of a heat radiating device for releasing heat generated by a heat generator, a microchannel heat radiating device is known (for example, Patent Document 1 and Non-Patent Document 1). In the microchannel type heat radiating device, a large number of micro flow channels (microchannels) through which a coolant flows are formed inside, thereby increasing the heat radiating area and increasing the heat transfer coefficient. In Patent Document 1, each of the plurality of microchannels is formed by overlapping at least a first and second plate-like laminate, and a microchannel channel portion and a second plate of the first plate-like laminate. The microchannel channel portion of the laminated laminate is formed so as to be shifted in position so as to form a continuous passage in the coolant flow direction. In this way, a micro vortex is created using the meandering channel structure to improve the heat exchange capability.

JP 2007-12719 A Jurgen J. Brandner et al., "A new Enhanced Microstructure Heat Exchanger with Reduced Pressure Drop", 4th International Workshop on Micro Chemical Process Technology, Forschungszentrum Karlsruhe, January 26,2006

  In the microchannel heat dissipation device, a large number of microchannels are formed to increase the heat dissipation area and increase the heat transfer coefficient. However, since the flow path area of the refrigerant flow path (microchannel) through which the refrigerant flows is small, Pressure loss increases. When the pressure loss increases, the refrigerant flow rate in the microchannel cannot be increased, and the temperature rise amount of the refrigerant flowing through the microchannel increases. As a result, it is difficult to dissipate heat uniformly, leading to a reduction in heat dissipation capability.

  An object of this invention is to provide the thermal radiation apparatus which can improve the thermal radiation capability, suppressing the pressure loss of a refrigerant | coolant.

  The heat dissipation device according to the present invention employs the following means in order to achieve the above-described object.

  A heat dissipating device according to the present invention includes a heat dissipating plate having a heating element mounted on one main surface, and a plurality of heat dissipating fins standing on the back surface of one main surface of the heat dissipating plate, spaced apart from each other. A plurality of heat dissipating fins in which refrigerant flow paths are formed between adjacent heat dissipating fins, near the back surface of the heat dissipating plate of the heat dissipating fin located on the back side of the region where the heat generation amount of the heat generating element is large Is formed with a communication channel that communicates between the refrigerant channels adjacent to each other with the heat radiating fin interposed therebetween, and is provided in the vicinity of the communication channel on the back surface of the heat radiating plate. A refrigerant wall that abuts against the refrigerant flowing through one of the refrigerant channels, and the refrigerant that abuts against the heat radiation wall flows out to the other of the adjacent refrigerant channels through the communication channel.

  According to the present invention, it is possible to improve the heat dissipation capability while suppressing the pressure loss of the refrigerant by using the expansion effect of the heat transfer area by the heat dissipation fin and the local heat dissipation effect in the region where the heat generation amount is large. it can.

  In one aspect of the present invention, the channel area of the communication channel is equal to or less than the channel area of the adjacent refrigerant channel, and the channel length of the communication channel is the It is preferable that the length is shorter than the channel length. According to this aspect, the flow rate of the refrigerant flowing through the communication channel can be increased, and heat exchange can be further promoted.

  In one aspect of the present invention, it is preferable that a collision surface for guiding the refrigerant flowing in one of the adjacent refrigerant flow paths to the communication flow path is formed in the heat radiating wall portion. According to this aspect, the refrigerant that collides with the collision surface of the heat radiating wall can be efficiently guided to the communication channel. Furthermore, the heat exchange between the heat radiation wall portion and the refrigerant can be promoted by the refrigerant flowing through one of the adjacent refrigerant flow paths colliding with the collision surface of the heat radiation wall portion.

  In one aspect of the present invention, in the radiating fin in which the communication channel is formed, it is preferable that the thickness of the portion where the communication channel is formed is thinner than the thickness of the other portion. According to this aspect, the length of the communication channel can be reduced, and the pressure loss of the refrigerant can be reduced.

  In one aspect of the present invention, the heat dissipating fin in which the communication flow path is formed faces the communication flow path, and the distance from the back surface of the heat dissipation plate increases from one of the adjacent refrigerant flow paths to the other. It is preferable that an inclined surface that gradually decreases is formed. According to this aspect, the refrigerant flowing into the communication channel can be efficiently guided to the back surface of the heat radiating plate, and heat exchange can be further promoted.

  In one aspect of the present invention, it is preferable that the refrigerant flow directions are opposite to each other in the adjacent refrigerant flow paths. According to this aspect, it becomes possible to reduce the temperature distribution of the refrigerant in the region below the heating element, and the heating element can be cooled uniformly.

  DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments for carrying out the present invention (hereinafter referred to as embodiments) will be described with reference to the drawings.

  1-7 is a figure which shows schematic structure of the thermal radiation apparatus 10 which concerns on embodiment of this invention. 1 shows an internal schematic configuration viewed from the upper surface side, FIGS. 2 and 3 show an internal schematic configuration viewed from the side surface side, FIG. 4 shows an approximate configuration viewed from the lower surface side, and FIGS. The perspective view of an internal schematic structure is shown. A heating element 30 is placed on the surface (one main surface) 12 a of the heat radiating plate 12. The surface area of the heat radiating plate 12 (the area of the surface 12a) is set larger than the area of the heating element 30. On the back surface (back surface of one main surface) 12b of the heat radiating plate 12, a plurality of heat radiating fins 14 are erected at intervals with respect to the thickness direction (vertical direction in FIG. 1). The standing direction of each radiating fin 14 (vertical direction in FIGS. 2 and 3) is perpendicular to the back surface 12b of the radiating plate 12, and the longitudinal direction of each radiating fin 14 (left and right direction in FIG. 1) is each radiating fin. 14 is a direction perpendicular to the standing direction and the thickness direction. A bottom plate 22 is joined to the tip of each radiating fin 14, and the bottom plate 22 faces the radiating plate 12 (back surface 12 b) with the radiating fin 14 interposed therebetween. Between the heat radiation fins 14 adjacent to each other in the thickness direction, refrigerant flow paths 16 and 26 through which the refrigerant flows are formed. In addition, as a specific example of the heat generating body 30 here, for example, a semiconductor element (power device) such as an IGBT or a power MOSFET can be cited, but other electronic components may be used. Moreover, as a specific example of a refrigerant | coolant here, liquid refrigerants, such as water and a fluorocarbon, can be mentioned, for example.

  In the present embodiment, a notch portion is formed in the vicinity of the back surface 12b of the heat radiating plate 12 of the heat radiating fin 14 located on the back side of the region where the heat generation amount of the heat generating element 30 is large. A local flow path (communication flow path) 18 is formed which communicates between the refrigerant flow paths 16 and 26 adjacent to each other with the sandwich. The local flow path 18 here faces the heat radiating plate 12 (back surface 12b), and the cross-sectional area thereof is set to be equal to or smaller than the cross-sectional areas of the refrigerant flow paths 16 and 26. That is, the flow channel area of the local flow channel 18 is set to be equal to or smaller than the flow channel area of the refrigerant flow channels 16 and 26 adjacent to each other with the heat radiation fin 14 on which the local flow channel 18 is formed. The flow path length of the local flow path 18 (the length in the heat radiation fin thickness direction) is set shorter than the flow path length of the refrigerant flow paths 16 and 26 (the length in the heat radiation fin longitudinal direction). Further, a heat radiating wall portion 20 is erected in the vicinity of the local flow path 18 on the back surface 12 b of the heat radiating plate 12. The standing direction of the heat radiating wall portion 20 (vertical direction in FIGS. 2 and 3) is perpendicular to the back surface 12b of the heat radiating plate 12, and the longitudinal direction of the heat radiating wall portion 20 (vertical direction in FIG. 1) is the heat radiating wall portion. The vertical direction of 20 and the longitudinal direction of each radiating fin 14. The front end of the heat radiating wall 20 is joined to the bottom plate 22.

  In the example of the calorific value distribution of the heating element 30 shown in FIG. 8, the calorific value of the heating element 30 increases at the center of the surface 12 a of the heat radiating plate 12. In that case, the local flow path 18 (notch part) is formed in the radiation fin 14 located in the at least center part in the back surface 12b of the heat sink 12, and its vicinity. Further, FIG. 1 shows that a plurality of local flow paths 18 are formed at intervals in the direction of the thickness of the heat radiating fins at the central part in the longitudinal direction of the heat radiating fins, and a heat radiating wall 20 is provided in the vicinity of the plurality of local flow paths 18. The example which has arrange | positioned from one end part to the other end part regarding the radiation fin thickness direction is shown. In the example shown in FIG. 1, the refrigerant flow paths 16 and 26 are partitioned by the heat radiating wall 20, and the shapes of the refrigerant flow paths 16 and 26 and the local flow path 18 are symmetrical with respect to the heat radiating wall 20.

  The radiating fins 14 here can be formed integrally with the radiating plate 12 as shown in FIG. 9, for example, or can be formed and joined separately from the radiating plate 12 as shown in FIG. it can. The heat radiating wall portion 20 can be formed integrally with the heat radiating plate 12 and the heat radiating fins 14 as shown in FIG. 9, for example, or separately from the heat radiating plate 12 and the heat radiating fins 14 as shown in FIG. It can also be formed and joined. For the heat radiation fin 14 in which the local flow path 18 (notch portion) is formed, for example, as shown in FIG. 9, a portion 14a in which the local flow path 18 is formed and the other portion 14b are integrally formed. Alternatively, for example, as shown in FIG. 10, these portions 14a and 14b can be formed separately and joined. 9 shows an example in which the heat radiating plate 12, the heat radiating fins 14 (parts 14a and 14b), and the heat radiating wall portion 20 are integrally formed. FIG. 10 shows the heat radiating plate 12 and the heat radiating fins 14 (parts 14a and 14b). ) And the heat radiating wall portion 20 are separately formed and joined.

An example of the surface area of the heat radiating plate 12 varies depending on the ease of heat diffusion in the heat radiating plate 12, specifically, the thickness and heat conductivity of the heat radiating plate 12, and the heat transfer coefficient on the refrigerant flow paths 16 and 26 side. The value is approximately 1.0 to 1.5 times the area of the heating element 30. An example of the thickness of each radiating fin 14 has a value of about 0.5 mm, and an example of the thickness of the radiating wall portion 20 has a value of about 1 mm. Further, as shown in FIG. 11, an example of the height of the refrigerant flow paths 16 and 26 (the length in the direction in which the radiating fins are erected) is about 5 mm, and the width of the refrigerant flow paths 16 and 26 (the thickness of the radiating fins). An example of the length in the vertical direction is a value of about 1 mm. As shown in FIG. 12, an example of the height of the local flow path 18 (the length in the radiating fin standing direction) is a value of about 1 mm, and the width of the local flow path 18 (the length in the radiating fin longitudinal direction). ) Is a value of about 4 mm, and an example of the length of the local flow path 18 (the length in the direction of the thickness of the radiating fin) is about 0.5 mm (the same as the thickness of the radiating fin 14). . That is, an example of the cross-sectional area (flow area) of the refrigerant flow paths 16 and 26 is a value of about 5 mm ² , and an example of the cross-sectional area (flow area) of the local flow path 18 is a value of about 4 mm ² . For this reason, in the present embodiment, the flow passage areas of the refrigerant flow passages 16 and 26 are set to be sufficiently larger than those of the microchannel heat dissipation device. However, the structure of the heat radiating plate 12, the heat radiating fin 14, the heat radiating wall portion 20, the refrigerant flow paths 16, 26, and the local flow path 18 is not limited to the numerical values shown above.

  The heat radiating plate 12, the heat radiating fins 14, the heat radiating wall portions 20, and the bottom plate 22 are accommodated in a box-shaped container 24. It is joined to the side plate 24a. A refrigerant inlet 36 communicating with the refrigerant flow path 16 is provided at both ends of the heat radiating device 10 in the longitudinal direction of the heat radiating fins, and the refrigerant (liquid refrigerant) is supplied from the refrigerant inlet 36 to the refrigerant flow path 16. The Furthermore, the refrigerant | coolant outflow port 46 connected with the refrigerant | coolant flow path 26 is provided in the both ends of the heat radiating device 10 regarding a radiation fin longitudinal direction, and the refrigerant | coolant which flows through the refrigerant | coolant flow path 26 flows out out of the refrigerant | coolant outflow port 46. Further, a refrigerant discharge passage 28 communicating with the refrigerant outlet 46 is formed between the bottom plate 22 and the bottom plate 24b of the vessel 24 (below the refrigerant passages 16 and 26). Is formed with a refrigerant discharge port 24 c communicating with the refrigerant discharge passage 28. The refrigerant that has flowed out of the refrigerant outlet 46 passes through the refrigerant discharge passage 28 and is discharged to the outside from the refrigerant outlet 24c. FIG. 4 shows an example in which the refrigerant discharge port 24c is formed at the center of the bottom plate 24b. However, the refrigerant discharge port 24c can be formed to be shifted from the center of the bottom plate 24b. In FIG. 1, the illustration of the container 24 is omitted for convenience of explanation.

  The heat generated in the heating element 30 is transmitted to the heat radiating plate 12 and further transmitted to the heat radiating fins 14 and the heat radiating wall portion 20. The refrigerant (liquid refrigerant) supplied from the refrigerant inlet 36 to the refrigerant flow path 16 (one of the refrigerant flow paths adjacent to each other with the heat radiation fin 14 having the local flow path 18 interposed therebetween) forms the refrigerant flow path 16. The heat generating body 30 is radiated by exchanging heat with the radiating fins 14. And the refrigerant | coolant which flows toward the thermal radiation wall part 20 through the refrigerant | coolant flow path 16 collides with the thermal radiation wall part 20, as shown in FIG. . This heat exchange also releases heat from the heating element 30. The refrigerant flows into the local flow path 18 after colliding with the heat radiating wall portion 20. As shown in FIGS. 13 and 14, the refrigerant passing through the local flow path 18 collides (buts against) the back surface 12 b of the heat radiating plate 12 (directly below the heating element 30), thereby exchanging heat with the heat radiating plate 12. Do. This heat exchange also releases heat from the heating element 30. Here, in order for the refrigerant passing through the local flow path 18 to collide with the back surface 12b of the heat radiating plate 12, the height of the local flow path 18 (indicated by the dimension B in FIG. 13) is made sufficiently smaller than the height of the heat radiating fins 14. Is preferred. The refrigerant that has collided with the back surface 12b of the heat radiating plate 12 (passed through the local flow path 18) flows out to the refrigerant flow path 26 (the other of the adjacent refrigerant flow paths with the heat radiation fin 14 on which the local flow path 18 is formed). To do. The refrigerant flowing through the refrigerant flow path 26 performs heat exchange with the heat radiating fins 14 forming the refrigerant flow path 26, so that the heat generating body 30 is radiated. As shown in FIGS. 1 and 6, the direction of the refrigerant flowing through the refrigerant flow path 26 is opposite to the direction of the refrigerant flowing through the refrigerant flow path 16 adjacent (communication via the local flow path 18) with the radiation fin 14 interposed therebetween. Direction. As shown in FIG. 3, the refrigerant that has passed through the refrigerant flow path 26 flows out from the refrigerant outlet 46 and is further discharged from the refrigerant discharge port 24 c through the refrigerant discharge flow path 28. In the example shown in FIG. 1, the refrigerant flow paths 16 and 26 and the local flow path 18 are arranged symmetrically with the heat radiating wall portion 20 interposed therebetween, and the refrigerant flow is symmetric with respect to the heat radiating wall portion 20.

  In the present embodiment described above, the heat transfer area from the heat radiation fins 14 to the refrigerant flowing through the refrigerant flow paths 16 and 26 can be increased by erecting the plurality of heat radiation fins 14 on the rear surface 12b of the heat radiation plate 12. Therefore, even when the heat generating area of the heating element 30 is large, a sufficient heat dissipation effect can be obtained. Further, by selectively forming the local flow path 18 facing the heat radiating plate 12 in a region where the heat generation amount of the heating element 30 is large, the pressure loss of the refrigerant can be reduced without forming a large number of micro flow paths as in the micro channel. Can be reduced. Then, by disposing the heat radiating wall portion 20 near the local flow path 18 (region where the amount of heat generation is large), the refrigerant flowing through the refrigerant flow path 16 collides with the heat radiating wall section 20 to promote heat exchange. The temperature of the heating element 30 can be reduced. Furthermore, heat exchange can also be promoted when the refrigerant that has collided with the heat radiating wall portion 20 and has flowed into the local flow path 18 collides with the rear surface 12b of the heat radiating plate 12 (region where the amount of heat generation is large). Also, in the lower region of the heating element 30, the refrigerant flow direction is reversed between the refrigerant flow path 16 and the refrigerant flow path 26, so that heat is generated even if the temperature of the refrigerant rises due to heat removal from the heating element 30. The refrigerant temperature in the lower region of the body 30 can be made uniform. As a result, the temperature distribution of the heating element 30 can be made uniform, and the thermal expansion of the heating element 30, that is, thermal stress can be reduced. As described above, according to the present embodiment, by combining the effect of expanding the heat transfer area by the heat radiating fins 14 and the local heat dissipation effect in the region where the heat generation amount is large, the heat dissipation is performed while suppressing the pressure loss of the refrigerant. Ability can be improved. Note that Patent Document 1 and Non-Patent Document 1 do not show a technique for combining the effect of expanding the heat transfer area by the heat radiating fins and the local heat radiating effect in a region where the heat generation amount is large.

  Furthermore, in this embodiment, the flow area of the local flow path 18 is made smaller than the flow path area of the refrigerant flow path 16, so that the flow rate of the refrigerant flowing through the local flow path 18 (collising directly below the heating element 30) is increased. The heat exchange can be further promoted.

  Further, in the present embodiment, the pressure loss of the refrigerant is achieved by using the refrigerant discharge flow path 28 from which the refrigerant is discharged to the entire surface between the bottom side of the refrigerant flow paths 16 and 26 (between the bottom plate 22 and the bottom plate 24b of the vessel 24). Furthermore, the temperature distribution can be made uniform by using the refrigerant discharge flow path 28 in almost the entire lower region of the refrigerant flow paths 16, 26.

  Further, in the present embodiment, by making the area of the heat radiating plate 12 larger than the area of the heat generator 30, heat can be radiated in consideration of the heat spread of the heat generator 30.

  Next, another configuration example of this embodiment will be described.

  In this embodiment, for example, as shown in FIG. 15, the widths (flow channel areas) of the plurality of refrigerant channels 16 and 26 arranged in the thickness direction of the radiating fins (vertical direction in FIG. 15) are changed, that is, the heat is radiated. The pitch (interval) of the fins 14 can be varied. In the example shown in FIG. 15, the width (flow path area) of the refrigerant flow paths 16 and 26 is set to be smaller in the center portion than in the both end portions with respect to the direction of the radiation fin thickness. In other words, the pitch of the radiating fins 14 is set so that the center portion is narrower than the both end portions in the radiating fin thickness direction. According to the example shown in FIG. 15, the heat transfer area in the central part can be expanded, and the heat radiation amount in the central part can be increased.

  Moreover, in this embodiment, as shown, for example in FIG. 16, 17, the width | variety (channel area) of the local flow path 18 (notch part) formed in the radiation fin 14 can also be varied. In the example shown in FIGS. 16 and 17, the width of the local flow path 18 (flow path area) is set to be smaller in the center than the both ends in the thickness direction of the radiating fin (up and down direction in FIGS. 16 and 17). For example, as shown in FIGS. 18 and 19, the refrigerant flow paths 16 and 26 and the local flow path 18 can be arranged asymmetrically with the heat radiating wall portion 20 interposed therebetween. In the example shown in FIGS. 18 and 19, the radiating fins 14 arranged with the radiating wall portion 20 interposed therebetween are formed with their positions in the thickness direction (vertical direction in FIGS. 18 and 19) shifted from each other. Further, for example, as shown in FIG. 20, the local flow paths 18 do not necessarily have to be formed in all the radiation fins 14, and the number of the local flow paths 18 can be arbitrarily set.

  Moreover, about the thermal radiation wall part 20, as shown, for example in FIG. 21, it does not necessarily need to adjoin to all the local flow paths 18. Moreover, about the shape of the heat radiating wall part 20, it does not necessarily need to be a plate shape with constant thickness, for example, as shown in FIG. 22, the thickness of the heat radiating wall part 20 can also be changed. In the example shown in FIG. 22, the thickness of the heat radiating wall portion 20 is set so that the central portion is thinner than both end portions in the longitudinal direction (vertical direction in the figure), and gradually decreases from both end portions toward the central portion. is doing.

  Moreover, in this embodiment, as shown, for example in FIGS. 23-25, the position regarding the longitudinal direction (left-right direction of FIGS. 23-25) of the local flow path 18 (notch part) of each radiation fin 14 is shifted mutually. It is also possible to form the heat radiating wall portion 20 with which the refrigerant flowing through the refrigerant flow paths 16 collide (striking) with the positions in the longitudinal direction of the radiating fins shifted from each other. In the example shown in FIGS. 23 to 25, the refrigerant flow directions are the same in the refrigerant flow paths 16 and 26 adjacent (communication through the local flow path 18) with the heat radiation fin 14 having the local flow path 18 interposed therebetween. Direction. Further, the number of the refrigerant outlets 46 can be arbitrarily set, and the refrigerant discharge channel 28 below the refrigerant channels 16 and 26 may not be formed.

  Moreover, in this embodiment, as shown, for example in FIG.26, 27, about the shape of the surface (collision surface) 20a where the refrigerant | coolant collides in the thermal radiation wall part 20, it does not necessarily need to be a plane. In the example shown in FIG. 26, the collision surface 20a formed on the heat radiating wall 20 has a concave curved surface shape. In the example shown in FIG. 27, the collision surface 20a formed on the heat radiating wall portion 20 is directed in the direction of the refrigerant flowing through the refrigerant flow path 16 so as to guide the refrigerant flowing through the refrigerant flow path 16 into the local flow path 18. It is slanted. According to the example shown in FIG. 27, the refrigerant that collides with the collision surface 20 a of the heat radiating wall portion 20 can be efficiently guided to the local flow path 18.

  Further, in the present embodiment, for example, as shown in FIG. 28, in the radiating fin 14 in which the local flow path 18 (notch) is formed, the thickness of the portion 14a in which the local flow path 18 is formed (in FIG. 28). It can also be made thinner than the thickness of the other part 14b. According to the example shown in FIG. 28, the length of the local flow path 18 can be reduced, and the pressure loss of the refrigerant can be reduced.

  In the present embodiment, for example, as shown in FIG. 29, the radiation fin 14 (the portion 14 a where the local flow path 18 is formed) faces the local flow path 18, and the refrigerant flow path 16 to the refrigerant flow path 26. An inclined surface 14c in which the distance from the back surface 12b of the heat radiating plate 12 gradually decreases may be formed as it goes toward (from one side of the refrigerant flow path communicating via the local flow path 18 to the other). Here, for example, as shown in FIG. 29B, the height of the local flow path 18 can be minimized at the outlet of the local flow path 18, or as shown in FIG. 29C, for example. In addition, the height of the local flow path 18 can be minimized in the middle of the local flow path 18. According to the example shown in FIG. 29, the refrigerant that has flowed into the local flow path 18 can be efficiently guided to the back surface 12b of the heat radiating plate 12 (directly under the heating element 30), and heat exchange can be further promoted. In this embodiment, for example, as shown in FIG. 30, a curved surface (concave surface) 18 a can be formed on the inner wall surface of the local flow path 18.

  Further, in the present embodiment, for example, as shown in FIG. 31, the refrigerant discharge port 24 c can be formed in the side plate 24 a of the container 24 (on the side of the heating element 30). And the number of the refrigerant | coolant discharge ports 24c can also be set arbitrarily.

  As mentioned above, although the form for implementing this invention was demonstrated, this invention is not limited to such embodiment at all, and it can implement with a various form in the range which does not deviate from the summary of this invention. Of course.

It is a figure which shows schematic structure of the thermal radiation apparatus which concerns on embodiment of this invention. It is a figure which shows schematic structure of the thermal radiation apparatus which concerns on embodiment of this invention. It is a figure which shows schematic structure of the thermal radiation apparatus which concerns on embodiment of this invention. It is a figure which shows schematic structure of the thermal radiation apparatus which concerns on embodiment of this invention. It is a figure which shows schematic structure of the thermal radiation apparatus which concerns on embodiment of this invention. It is a figure which shows schematic structure of the thermal radiation apparatus which concerns on embodiment of this invention. It is a figure which shows schematic structure of the thermal radiation apparatus which concerns on embodiment of this invention. It is a figure which shows an example of the heat_generation | fever distribution of a heat generating body. It is a figure which shows schematic structure of the thermal radiation apparatus which concerns on embodiment of this invention. It is a figure which shows the other schematic structure of the thermal radiation apparatus which concerns on embodiment of this invention. It is a figure which shows an example of the dimension of a refrigerant flow path. It is a figure which shows an example of the dimension of a local flow path. It is a figure explaining the flow of the refrigerant | coolant in the thermal radiation apparatus which concerns on embodiment of this invention. It is a figure explaining the flow of the refrigerant | coolant in the thermal radiation apparatus which concerns on embodiment of this invention. It is a figure which shows the other schematic structure of the thermal radiation apparatus which concerns on embodiment of this invention. It is a figure which shows the other schematic structure of the thermal radiation apparatus which concerns on embodiment of this invention. It is a figure which shows the other schematic structure of the thermal radiation apparatus which concerns on embodiment of this invention. It is a figure which shows the other schematic structure of the thermal radiation apparatus which concerns on embodiment of this invention. It is a figure which shows the other schematic structure of the thermal radiation apparatus which concerns on embodiment of this invention. It is a figure which shows the other schematic structure of the thermal radiation apparatus which concerns on embodiment of this invention. It is a figure which shows the other schematic structure of the thermal radiation apparatus which concerns on embodiment of this invention. It is a figure which shows the other schematic structure of the thermal radiation apparatus which concerns on embodiment of this invention. It is a figure which shows the other schematic structure of the thermal radiation apparatus which concerns on embodiment of this invention. It is a figure which shows the other schematic structure of the thermal radiation apparatus which concerns on embodiment of this invention. It is a figure which shows the other schematic structure of the thermal radiation apparatus which concerns on embodiment of this invention. It is a figure which shows the other schematic structure of the thermal radiation apparatus which concerns on embodiment of this invention. It is a figure which shows the other schematic structure of the thermal radiation apparatus which concerns on embodiment of this invention. It is a figure which shows the other schematic structure of the thermal radiation apparatus which concerns on embodiment of this invention. It is a figure which shows the other schematic structure of the thermal radiation apparatus which concerns on embodiment of this invention. It is a figure which shows the other schematic structure of the thermal radiation apparatus which concerns on embodiment of this invention. It is a figure which shows the other schematic structure of the thermal radiation apparatus which concerns on embodiment of this invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 Radiation device, 12 Radiation plate, 14 Radiation fin, 16, 26 Refrigerant flow path, 18 Local flow path, 20 Radiation wall part, 22 Bottom plate, 24 units, 24c Refrigerant discharge port, 28 Refrigerant discharge flow path, 30 Heating element, 36 refrigerant inlet, 46 refrigerant outlet.

Claims (6)

A heat sink with a heating element mounted on one main surface;
A plurality of heat dissipating fins erected on the back surface of one main surface of the heat dissipating plate, with a plurality of heat dissipating fins forming a refrigerant flow path between the heat dissipating fins adjacent to each other;
A heat dissipation device comprising:
In the vicinity of the back surface of the heat radiating plate located on the back side of the region where the heat generation amount of the heat generating element is large, a communication flow path is formed that connects adjacent refrigerant flow paths with the heat radiating fin interposed therebetween. ,
A heat dissipating wall portion that is erected in the vicinity of the communication flow path on the back surface of the heat dissipating plate, and against which the refrigerant flowing through one of the adjacent refrigerant flow paths hits;
The heat radiating device, wherein the refrigerant hitting the heat radiating wall flows out to the other of the adjacent refrigerant flow paths through the communication flow path. The heat dissipating device according to claim 1,
Heat dissipation in which the flow channel area of the communication flow channel is equal to or less than the flow channel area of the adjacent refrigerant flow channel, and the flow channel length of the communication flow channel is shorter than the flow channel length of the adjacent refrigerant flow channel. apparatus. The heat dissipating device according to claim 1 or 2,
The heat radiating device, wherein the heat radiating wall is formed with a collision surface for guiding the refrigerant flowing through one of the adjacent refrigerant flow paths to the communication flow path. The heat dissipation device according to any one of claims 1 to 3,
The heat dissipating fin in which the communication channel is formed, wherein the thickness of the portion where the communication channel is formed is thinner than the thickness of the other portion. The heat dissipation device according to any one of claims 1 to 4,
The radiating fin formed with the communication channel has an inclined surface that faces the communication channel and gradually decreases in distance from the back surface of the heat radiating plate as it goes from one of the adjacent refrigerant channels to the other. A heat dissipation device is formed. The heat dissipation device according to any one of claims 1 to 5,
The heat dissipation device, wherein the refrigerant flows in opposite directions in the adjacent refrigerant flow paths.

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