JP2008229682A - Manufacturing method of package component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a package component by which the package component can be inexpensively cut and can be manufactured without requiring a process such as washing because carbide is hardly produced. <P>SOLUTION: The manufacturing method of the package component is provided in which a substrate 31 mounted with components is further joined with another electronic component 32 and covered with resin, wherein the substrate 31 having a size corresponding to a plurality of package components is joined with the other electronic component 32 and after covered with the resin 36, separated into pieces corresponding to individual components by a cutting process. In this cutting process, the workpiece to be processed is arranged on an air-cooled or water-cooled stage 4, irradiated with a laser beam while being cooled on the stage, and cut while an inert gas is applied at least to the laser irradiation portions. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an improvement in a method of manufacturing a package component in which an electronic component is bonded to a substrate and covered with a resin.

For example, a large number of package parts that are electronic component modules such as piezoelectric oscillators, which are mounted on a wiring board with IC and other parts, joined with other electronic parts such as piezoelectric vibrators and covered with resin, are used. Has been.
In the manufacturing process of such a package component, a large number of ICs are mounted on a large substrate, and after bonding the piezoelectric vibrator to the substrate corresponding to each IC, a resin is applied to the whole, and after the resin is cured, Each part is cut and separated by dicing or the like.
Examples of performing the cutting process by dicing in manufacturing the package component in this way include Patent Document 1 (see Paragraph No. 0025) and Patent Document 2 (see Paragraph No. 0031).

However, the cutting process by dicing has the following problems.
In other words, it is necessary to perform the cutting work while applying water in order to prevent the generation of static electricity or to flow chips (chips), and the moisture at this time may cause the quality of the product to deteriorate later. is there.
Further, since the blade by dicing causes blade spillage deterioration by work, high cost is required to replace the blade.
Furthermore, the overall equipment is large and the equipment costs are high.
On the other hand, a technique of cutting a workpiece by irradiating a laser beam without using dicing has been proposed (see Patent Document 3).

JP 2006-54784 A JP 2006-238210 A JP 2000-277550 A

  However, the technique of Patent Document 3 uses a polishing liquid for chemical polishing to remove carbides and the like adhering to the laser machined surface, and then requires a cleaning process with pure water, which has many drawbacks. is there.

  The present invention has been made to solve the above problems, and can be cut at a low cost, and since there is almost no carbide, a package component that can be manufactured without requiring a step such as cleaning. An object is to provide a manufacturing method.

  In order to achieve the above-described object, a method for manufacturing a package component according to the present invention is a method for manufacturing a package component in which an electronic component is mounted on a substrate and covered with a resin, and has a size corresponding to a plurality of package components. In the cutting process in which the electronic component is mounted on the substrate and the electronic component is covered with the resin and then separated into individual pieces corresponding to the individual components by cutting, the work to be processed is air-cooled or It arrange | positions on a liquid-cooled stage, irradiates a laser beam, cooling on this stage, It cuts, applying an inert gas to the said laser beam irradiation location at least.

According to this configuration, since cutting is performed with laser light without using dicing, chips are not generated unlike dicing, and thus it is not necessary to clean it.
The equipment is not as large as a dicing machine, and it is not necessary to replace the blade.
In addition, since the workpiece is placed on the stage in the cutting process and processed while being cooled, it is possible to prevent deterioration and failure of the product due to the heat of cutting.
Furthermore, since cutting is performed while applying an inert gas to the laser light irradiation location, oxides such as soot can be blown off by the heat of the laser, and such oxides do not adhere, so the carbide is used in the polishing liquid. No cleaning process with pure water is required.
Thus, according to the present invention, it is possible to provide a method for manufacturing a package component that can be cut at low cost and hardly produces carbides, and can be manufactured without requiring a step such as cleaning. It is.

In another configuration of the present invention, the laser beam is a harmonic of a YAG laser.
According to this configuration, since energy can be concentrated in a narrow area in a short time, generation of heat that adversely affects the product can be suppressed as much as possible.

In another configuration of the present invention, at least the laser light irradiation portion of the workpiece is processed while being applied with an inert gas obliquely from above.
According to this configuration, since the inert gas is applied obliquely from above the laser beam irradiation location, it is possible to prevent the position of the workpiece from being displaced and appropriately scatter the soot generated at the time of cutting.

In another configuration of the present invention, a coolant is circulated inside the stage, whereby the workpiece placed on the stage is cooled during processing.
According to this configuration, the workpiece can be reliably cooled during processing only by being set on the stage, and a chamber or the like is not required, so that the equipment is not large and the cost can be reduced.

In another configuration of the present invention, a vent hole is provided in the work placement surface of the stage to suck the work.
According to this configuration, not only the soot is scattered but also sucked and removed, so that the soot can be reliably removed.

In another configuration of the present invention, an attachment / detachment member attached to / detached from the stage is provided, and the attachment / detachment member sucks and holds the workpiece after cutting.
According to this configuration, since the workpiece after cutting can be sucked and held, a transfer operation or the like in a subsequent process becomes easy.

Further, in another configuration of the present invention, the laser beam is irradiated from the substrate side of the package component which is the workpiece, and the resin is left with a small thickness without completely penetrating the laser beam. It is characterized by.
According to this structure, what is called a chocolate break is realizable by leaving resin material with slight thickness.

Further, in another configuration of the present invention, when the laser beam is irradiated along the line for each of the vertical and horizontal cutting lines, the workpiece having a size corresponding to the plurality of package parts, The laser light is irradiated in any order with respect to the positions of the vertical and horizontal cutting lines.
According to this configuration, the concentration of heat in one place can be reliably prevented by randomly changing the laser light irradiation region.

FIG. 1 shows an electronic component module as an example of a package component to which the present invention is applied. More specifically, FIG. 1 shows a workpiece 30 processed to form a piezoelectric oscillator.
First, the work 30 will be described.
The workpiece 30 is obtained by bonding the piezoelectric vibrator 10 to a substrate 31 on which an integrated circuit chip 32 is mounted and covering the substrate 30 with a resin 36.

First, the piezoelectric vibrator 10 will be described.
The piezoelectric vibrator 10 is formed by housing a piezoelectric vibrating piece 13 in an insulating package 11 as a housing container and sealing it with a lid 12.
In this embodiment, the package 11 is formed to be, for example, a rectangular box, and the internal space S <b> 1 is a housing space for housing the piezoelectric vibrating piece 13.
Further, the electrode portion 23 is formed on the ceramic substrate constituting the bottom portion of the package 11, for example, the conductive adhesive 28 is applied, and the vicinity of the base end of the piezoelectric vibrating piece 13 is placed thereon, By heating, the conductive adhesive 28 is cured and bonded.

  Here, in this embodiment, a box-shaped package is formed to accommodate the piezoelectric vibrating reed 13. For example, a single ceramic substrate is prepared as an insulating base, An electrode portion is formed on the substrate, the piezoelectric vibrating piece 13 is bonded, and a thin box-shaped lid or lid is covered and sealed to constitute a package for accommodating the piezoelectric vibrating piece 13 as a whole. You may do it.

A pair of electrode portions 23 of the package 11 is actually provided one by one at an end in the width direction of the package 11.
The electrode portion 23 is connected to a mounting terminal 25 as a connection terminal portion exposed to the outside on the bottom surface of the package 11 by a conductive through hole (not shown) provided in the package 11. The electrode portion 23 supplies a driving voltage applied from the outside to the piezoelectric vibrating piece 13.

  The piezoelectric vibrating piece 13 is formed of, for example, quartz, and a piezoelectric material such as lithium tantalate or lithium niobate can be used in addition to quartz. In the case of this embodiment, the piezoelectric vibrating piece 13 may be, for example, a quartz vibrating piece formed by cutting a crystal into a rectangle or a tuning-fork type quartz vibrating piece.

Next, the structure of the substrate side joined to the piezoelectric vibrator 10 will be described.
The substrate 31 is connected to the mounting terminals 25 on the bottom surface of the piezoelectric vibrator 10 by using conductive metal balls 24.
The substrate 31 has such a size that a large number of package components, that is, electronic component modules (piezoelectric oscillators) can be formed simultaneously.
An integrated circuit chip 32 is die-bonded to one surface of the substrate 31, and the integrated circuit chip 32 is wire-bonded to an electrode pad 33 on the surface of the substrate 31.
On the other surface of the substrate 31, external mounting terminals for mounting an external substrate are formed.

Further, as described above, the piezoelectric vibrator 10 is connected by using the metal balls 24 obtained by solder plating the spherical copper surface using the electrode pads 33 formed on the surface of the substrate 31. The metal ball 24 functions as a support part that secures a sufficient space for accommodating the integrated circuit chip 32 between the piezoelectric vibrator 10 and the substrate 31. The metal ball 24 is, for example, a gold bump.
Thus, the integrated circuit chip 32 is electrically connected to the mounting terminals (connection terminals) 25 of the piezoelectric vibrator 10 via the electrode pads 33 and the metal balls 24. The integrated circuit chip is a semiconductor chip, and includes, for example, a temperature compensation circuit for a piezoelectric vibrator.
Further, the substrate 31 is covered with a resin 36 in a state where a large number of piezoelectric vibrators 10 are bonded to the substrate 31.

(Manufacturing method of package parts)
Next, an embodiment of a method for forming such a workpiece 10 and further cutting the workpiece 10 to manufacture a package component will be described.
FIG. 2 is a flowchart showing an example of an embodiment of a method for manufacturing a package component.
In FIG. 2, first, the package 11 and the substrate 31 side are formed separately.

The package 11 that is a container for the piezoelectric vibrating piece 13 is, for example, an aluminum oxide ceramic green sheet that is used as an insulating material to provide a housing space S1.
That is, the package 11 is formed by laminating a plurality of substrates made of ceramic green sheets, and sintering in a state where cavities are formed by removing the material inside some of the substrates (ST11).
Moreover, the electrode part and terminal provided in the inside of the package 11 and the bottom surface are formed by, for example, applying a conductive paste such as tungsten metallization to a necessary portion after forming a green sheet and gold plating after sintering.

Next, a conductive adhesive 28 is applied on the electrode part 23 of the package 11. As the conductive adhesive 28, a synthetic resin agent as an adhesive component that exhibits bonding strength can be used containing conductive particles such as silver fine particles. Silicone, epoxy-based, or polyimide-based conductive materials can be used. An adhesive or the like can be used.
Or when not using a conductive adhesive, you may make it join using metal bumps, such as a gold bump.
Then, the base portion (end portion) of the piezoelectric vibrating piece 13 is placed on the applied conductive adhesive 28, and after lightly applying a load, the conductive adhesive 28 is cured by heating. Thereby, the piezoelectric vibrating piece 13 is joined (ST12).
Next, the piezoelectric vibrator 10 is completed by bonding the lid 12 to the package 11 by brazing or the like (ST13).

Apart from this, the substrate 31 side in FIG. 1 is prepared.
That is, the substrate 31 is formed of, for example, a relatively flexible polyimide substrate, a hard glass epoxy substrate, a ceramic substrate, or the like, so that a large number of package components, that is, electronic component modules (piezoelectric oscillators) can be formed simultaneously. ing. That is, one substrate 31 is made to have a size corresponding to the number of packaged component products formed simultaneously in the manufacturing process.
Conductive patterns are formed on the front and back surfaces of the substrate 31 according to the type and purpose of the substrate.
The substrate 31 has die pads (not shown) arranged at a predetermined interval, and the integrated circuit chip 32 is die-bonded to the die pads. Further, the control terminals of each integrated circuit chip 32 are connected to the electrode pads 33 on the surface of the substrate 31 by wire bonding (ST21).

Next, the metal ball 24 is disposed on the electrode pad 33 of the substrate 31 (including the case where the metal ball 24 is preformed on the substrate 31 side or the piezoelectric vibrator 10 side), and the piezoelectric vibrator 10 is interposed via the metal ball 24. Are joined (ST31).
Next, the resin 36 is applied in a state where a large number of piezoelectric vibrators 10 are bonded to the substrate 31. As the resin 36, for example, a synthetic resin for sealing a semiconductor chip is used, and for example, epoxy or the like is applied by a technique such as potting (ST32).

Subsequently, a cutting process is performed on the portion indicated by the arrow D in FIG. 1, and the electronic component module (piezoelectric oscillator) which is an individual package component is separated (ST33).
FIG. 3 is an explanatory diagram for explaining the cutting process.
In the figure, the cutting process can be basically performed at normal temperature and normal pressure without requiring a special vacuum chamber or the like.

In FIG. 3, the work 30 described in FIG. 1 is placed on a stage 41 which is a mounting (object) placing table.
In order to cut the workpiece 30 along the arrow D described with reference to FIG. 1, the laser beam B is irradiated from the laser module 44. At least while the laser beam B is being irradiated, an inert gas is injected from the inert gas injection means 43 to the irradiated portion.

Here, the stage 41 includes a horizontal stage surface 42 that is not easily damaged by the laser beam B, and the workpiece 30 is arranged on the stage surface (mounting surface) 42. Note that the work 30 may be fixed on the stage 41 via a predetermined jig, if necessary.
Further, for example, at least the stage surface 42 of the stage 41 is formed of a metal having good thermal conductivity, and a pipe is drawn around the stage 41 so as to be in contact with the stage surface 42, and the pipe is routed to the forward pipe 43 and the return pipe 44. Connected to. A cooling liquid is supplied to the forward pipe 43 from the outside and recovered from the return pipe 44, so that a liquid-cooled (water-cooled) stage 41 can be obtained. Thereby, it can prevent that the workpiece | work 30 irradiated with the laser beam B raises temperature more than necessary, and can prevent that the workpiece | work 30 is damaged by a heat | fever.
Note that an air-cooled (air-cooled) stage 41 may be provided by supplying a cooling gas instead of the coolant.

In this embodiment, the laser module 44 that is a laser oscillation unit uses a laser module that generates laser light B using, for example, a YAG (yttrium, aluminum, garnet) (YVO?) Laser.
Specifically, the laser module 44 includes, for example, a YAG laser rod made of a YAG crystal, an excitation source made of a krypton lamp or a laser diode bar that supplies light to the YAG laser rod as an excitation source, and the excitation source. And a control means (not shown) including a power source for supplying a driving voltage to the power source.

Since the YAG laser rod is formed of a YAG crystal, when light is supplied from the excitation source, neodymium ions are excited, and the excited neodymium ions generate laser light having a wavelength of 1064 nm (nanometer) (fundamental wave). . The laser light is reflected between the total reflection mirror and the output mirror, returned to the YAG laser rod, and amplified.
As a result of such pumping, the laser light with sufficient output is emitted as laser light in accordance with the extremely low transmittance set by the output mirror.

The laser light having a wavelength of 1064 nm passes through optical means (not shown) made of a nonlinear crystal such as KDP or KTP, so that the second harmonic (532 nm), the third harmonic (355 nm), and the fourth harmonic of the YAG laser. It is oscillated as a harmonic such as a wave (266 nm).
Note that the laser beam B can be reduced in diameter by using a mask when emitted from the laser module 44. Further, the laser beam emitted from the laser module 44 can be easily scanned in the depth direction of the paper along the arrow D in FIG.

The inert gas injection means 43 is preferably configured to apply an inert gas obliquely from above as shown in the drawing to at least a portion irradiated with the laser beam B during cutting of the workpiece 30.
The inert gas injection means 43 is connected to an inert gas supply means, and for example, nitrogen gas can be used as the inert gas. Accordingly, since oxidation during processing is appropriately prevented and wind is applied from the direction of pressing against the stage surface 42, it is possible to prevent positional displacement of the work 30 and to appropriately disperse soot and the like generated during cutting.
Thus, the piezoelectric oscillator (electronic component module) which is a piezoelectric device as a package component can be manufactured by appropriately cutting and separating the workpiece 30.

Since this embodiment is configured as described above and cuts with the laser beam B without using dicing, no chips are generated unlike dicing, so that it is not necessary to wash it.
The equipment is not as large as a dicing machine, and it is not necessary to replace the blade.
In addition, since the workpiece 30 is placed on the stage 41 and processed while being cooled in the cutting process, it is possible to prevent deterioration and failure of the product due to the heat of cutting.
In particular, when a carbon dioxide laser is used as the laser beam B, there is a problem that harmful heat is generated because the absorption rate absorbed by the resin 36 is increased.
For this reason, it is preferable not to use a carbon dioxide laser as the laser beam B. If the laser type is a YAG laser or its harmonics, energy can be concentrated in a narrow area in a short time, which adversely affects the product. Heat generation can be suppressed as much as possible.
Furthermore, since cutting is performed while applying an inert gas to the laser light irradiation location, oxides such as soot can be blown off by the heat of the laser, and such oxides do not adhere, so the carbide is used in the polishing liquid. No cleaning process with pure water is required.

FIG. 4 shows an explanatory diagram of the cutting process as a main part of the second embodiment, and the portions denoted by the same reference numerals as those of the embodiment of FIG. Explained.
In this embodiment, what is different from FIG. 3 is the configuration of the stage.
In FIG. 4, the stage 41-1 of the present embodiment is used when such a package component is shipped as a product and mounted on a user-side board when the soot generated by heat from the cutting process adheres to the work 30. In particular, it is configured to prevent the occurrence of poor conduction.

That is, the stage 41-1 is formed with a space 48 on the back side of the stage surface 42, that is, on the back side of the placement area of the work 30, and the space 48 and the stage surface are, for example, a plurality or many exhausts formed at equal intervals. The through-hole 46 which is a hole is connected. The space 48 is connected to the exhaust pipe 47.
The present embodiment is configured as described above. In addition to exhibiting the same operational effects as those of the first embodiment, the oxide generated by the heat during the cutting process through the exhaust hole 46 and the exhaust pipe 47. Soot can be discharged. In particular, when cutting is performed with the external mounting terminal 34 of the work 30 facing the stage surface 42, soot is discharged through the exhaust hole 46 and the exhaust pipe 47, so that the surface of the external mounting terminal 34 is soaked. And the like can be prevented from sticking.

FIG. 5 shows an explanatory view of the cutting process as a main part of the third embodiment, and the portions denoted by the same reference numerals as those of the embodiment of FIG. Explained.
In this embodiment, what is different from FIG. 3 is the configuration of the stage.

A space 48 is formed inside the stage 41-2.
A plurality of pipes 45 are erected in the space 48, and each pipe 45 can adsorb the work 30 by negative pressure.
The space 48 is set to a negative pressure so that oxides such as soot can be discharged.
FIG. 6 is a plan view of the workpiece 30 after being cut, that is, the open end 45a of the pipe 45 positioned below the workpiece 30 is indicated by a broken line. The workpiece 30 is separated into individual electronic component modules by a plurality of cutting lines TC (vertical cutting lines) and YC (horizontal cutting lines) orthogonal to each other. Then, by disposing the open end 45a of each pipe 45 at a position corresponding to the central portion of each electronic component module, the separated electronic component module can be sucked and held.
As a result, the third embodiment can not only exhibit the same effects as the first embodiment, but also can hold the workpiece 30 after cutting, so that the separated electrons can be separated in the subsequent steps after cutting. Parts modules do not fall apart, and work such as transfer of workpieces 30 becomes easy.

7 and 8 show the state of the cutting process as the main part of the fourth embodiment.
FIG. 7 is a plan view of the workpiece 30 in the cutting process (the state shown in FIG. 1, ie, before being cut), and FIG. 8 is a cross-sectional view thereof.
As shown in FIG. 7, the laser beam B is irradiated as indicated by vertical and horizontal dotted lines of the work 30. In this case, when the work 30 is arranged on the stage 41 as shown in FIG. 1, the laser beam B is irradiated with the substrate 31 facing upward.

In this case, as shown in FIG. 8 with emphasis with a larger groove width than actual, each groove 61, 62, 63 along the arrow D in FIG. Leave the bottom of the groove a little. Thus, the substrate 31 is surely cut, and a part of the resin 36 is left with a small thickness.
In this way, after the cutting process, the work 30 can be handled in a size before being cut off, and the process such as transfer can be handled. A thin resin portion can be broken and separated into individual pieces. Other functions and effects are the same as those of the first embodiment.

FIG. 9 shows a cutting process as a main part of the fifth embodiment.
FIG. 9 is a plan view of the workpiece 30 in the cutting process (the state shown in FIG. 1, that is, the one before separation) as viewed from above.
And the arrow displayed vertically and horizontally with respect to the workpiece | work 30 has shown the direction which scans the laser beam B for a cutting | disconnection.

In other words, the laser beam B is scanned along each arrow shown in the figure, so that the area surrounded by the scanning lines becomes a piece.
In this case, for example, the scanning order of the laser beam B is determined so that the positions irradiated with the laser beams are not continuously adjacent to each other so that the numbers indicated by the arrows indicate the order.
Thereby, it can prevent effectively that heat concentrates on a part of workpiece | work 30, and the damage by the heat | fever with respect to the workpiece | work 30 can be avoided as much as possible. Other functions and effects are the same as those of the first embodiment.

The present invention is not limited to the above-described embodiment. Each configuration of each embodiment can be appropriately combined or omitted, and can be combined with other configurations not shown.
Further, the shape of the package of the piezoelectric vibrator 10 is not limited to the illustrated one, and various forms can be applied. Package parts that are targets of the manufacturing method of the present invention include all package parts including a substrate and a resin to be cut in a workpiece state, and are not limited to piezoelectric oscillators, piezoelectric devices such as gyro sensors, and other Various names such as electronic component modules are targeted.

The schematic sectional drawing which shows an example of the workpiece | work for forming the package component which is the object of the manufacturing method of this invention. The flowchart which shows an example of the manufacturing method of the package components obtained by processing the workpiece | work of FIG. The figure which shows 1st Embodiment of the cutting process of the workpiece | work of FIG. The figure which shows 2nd Embodiment of the cutting process of the workpiece | work of FIG. The figure which shows 3rd Embodiment of the cutting process of the workpiece | work of FIG. The schematic plan view of the workpiece | work in the process of FIG. The schematic plan view of the workpiece | work in 4th Embodiment of the cutting process of the workpiece | work of FIG. The schematic sectional drawing of the workpiece | work in 4th Embodiment of the cutting process of the workpiece | work of FIG. The schematic plan view of the workpiece | work in 5th Embodiment of the cutting process of the workpiece | work of FIG.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 ... Piezoelectric vibrator, 11 ... Package, 13 ... Piezoelectric vibrating piece, 24 ... Metal ball, 30 ... Workpiece, 31 ... Substrate, 32 ... Integrated circuit chip, 33 ... Electrode pads, 36 ... Resin

Claims (8)

A method of manufacturing a package component in which an electronic component is mounted on a substrate and covered with a resin,
In the cutting step of mounting the electronic component on a substrate having a size corresponding to a plurality of package components, covering the electronic component with the resin, and separating into individual pieces corresponding to the individual components by cutting processing,
The workpiece to be processed is placed on an air-cooled or liquid-cooled stage,
Irradiate laser light while cooling on the stage,
Cutting process while applying an inert gas to at least the laser beam irradiation portion.   2. The method of manufacturing a package component according to claim 1, wherein the laser beam is a harmonic of a YAG laser.   3. The method of manufacturing a package component according to claim 1, wherein at least the laser light irradiation portion of the workpiece is processed while applying an inert gas obliquely from above.   4. The package component according to claim 1, wherein the workpiece placed on the stage is cooled during processing by circulating a coolant inside the stage. 5. Production method.   4. The method of manufacturing a package component according to claim 1, wherein a vent hole is provided on a work placement surface of the stage to adsorb the work.   6. The method of manufacturing a package component according to claim 1, further comprising a detachable member attached to and detached from the stage, wherein the detachable member sucks and holds the workpiece after the cutting process.   The laser beam is irradiated from the substrate side of the package component which is the workpiece, and the resin is left in a slight thickness without completely penetrating the laser beam. The manufacturing method of the package components in any one.   When the laser beam is irradiated along the vertical and horizontal cutting lines for the workpieces having a size corresponding to the plurality of package parts, the positions of the vertical and horizontal cutting lines are in any order. The method of manufacturing a package component according to claim 1, wherein the laser beam is irradiated onto the package component.

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