JP2008227547A - Lithography equipment and fabrication process of device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method and equipment for cleaning the interior of oil immersion lithographic equipment. <P>SOLUTION: Cleaning fluid can be introduced into a space between the projection system and the substrate table of lithographic equipment by especially using the liquid supply system of the lithographic equipment. Additionally or alternatively, a cleaning device may be provided on the substrate table, and an ultrasonic emitter may be provided in order to produce ultrasonic liquid. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a lithographic apparatus and a device manufacturing method. In particular, the apparatus relates to a cleaning device for an immersion lithographic apparatus and a method for cleaning a projection system and / or a substrate table of an immersion lithographic apparatus.

  A lithographic apparatus is a machine that applies a desired pattern onto a substrate, usually onto a target portion of the substrate. A lithographic apparatus can be used, for example, in the manufacture of integrated circuits (ICs). In this case, a patterning device, alternatively referred to as a mask or a reticle, may be used to generate a circuit pattern to be formed on a separate layer of the IC. This pattern can be transferred onto a target portion (eg including part of, one, or several dies) on a substrate (eg a silicon wafer). Pattern transfer is generally accomplished through imaging onto a layer of synchrotron radiation-sensitive material (resist) formed on the substrate. In general, a single substrate will contain a network of adjacent target portions that are successively patterned. A known lithographic apparatus scans a pattern through a so-called stepper, in which each target portion is irradiated by exposing the entire pattern onto the target portion at once, and a radiation beam in a predetermined direction ("scanning" direction). A so-called scanner in which each target portion is irradiated by synchronously scanning the substrate parallel or anti-parallel to this direction at the same time. It is also possible to transfer the pattern from the patterning device to the substrate by imprinting the pattern onto the substrate.

  It has also been proposed to immerse the substrate in the lithographic projection apparatus in a liquid having a relatively high refractive index, for example water, so as to fill a space between the final element of the projection system and the substrate. The gist of this is that the wavelength of the exposure radiation becomes shorter in the liquid, so that smaller features can be imaged. (The effect of the liquid may be viewed as increasing the effective NA of the system and also increasing the depth of focus.) Other immersion liquids, including water with solid particles (eg quartz) suspended therein Has also been proposed.

  However, immersing the substrate or substrate table in a liquid bath (see, eg, US Pat. No. 4,509,852, which is incorporated herein by reference in its entirety) can cause a large amount of liquid to be accelerated during a scanning exposure. It means to exist. This requires an additional or more powerful motor, and turbulence in the liquid can cause undesirable and unexpected effects.

  One proposed solution for the liquid supply system is to use the liquid supply system to supply liquid between the final element of the projection system and the substrate only in a localized area of the substrate. (The substrate generally has a larger surface area than the final element of the projection system). One method proposed to be prepared for this is disclosed in PCT patent application WO 99/49504, which is incorporated herein by reference in its entirety. As illustrated in FIGS. 2 and 3, the liquid is supplied onto the substrate by at least one inlet IN, preferably along the direction of movement of the substrate relative to the final element, and at least after passing under the projection system. Removed by one outlet OUT. That is, as the substrate is scanned under the element in the −X direction, liquid is supplied on the + X side of the element and taken out on the −X side. FIG. 2 schematically shows an arrangement in which liquid is supplied through the inlet IN and taken out on the other side of the element by an outlet OUT connected to a low pressure source. In the illustration of FIG. 2, the liquid is supplied along the direction of movement of the substrate relative to the final element, but this need not be the case. Various orientations and numbers of inlets and outlets can be located around the final element, an example of which is shown in FIG. 3, where four sets of inlets and outlets are around the final element. Be prepared on either side with a regular pattern.

  Ideally, cleaning the projection system of a lithographic apparatus is a complex and delicate operation that may require lithographic apparatus downtime and lithographic apparatus disassembly, and this need never be present. However, due to the liquid supplied to the space between the final element of the projection system and the substrate, for example in an immersion lithography apparatus, the final element may be contaminated as a result of a chemical reaction or drying dirt. Additionally or alternatively, the substrate plate of the lithographic apparatus may be contaminated, particularly in the outer region where the substrate is held on the substrate plate.

  The cleaning of the projection system and / or substrate table can also be performed manually by a person using a mild solvent by wiping the projection system and / or substrate table with a soft tissue. Along with the problem of interruption time, this method can scratch the parts of the lithographic apparatus, such as the final element of the projection system, or create undesirable dose fluctuations over the projection area, for example, when cleaning the final element. There is a risk that there will be uneven cleaning.

  Accordingly, it would be advantageous to provide a method for cleaning the final element and / or substrate table of a projection system that does not require disassembly of the liquid supply system and / or does not risk the creation of scratches. .

According to one aspect of the invention,
A substrate table configured to hold a substrate;
A projection system configured to project a patterned radiation beam onto a substrate and including a final element adjacent to the substrate;
A liquid supply system configured to supply liquid to a space between the projection system and the substrate table;
A lithographic apparatus is provided that includes a final optical element, a substrate table, or a cleaning device configured to clean at least one of a surface of a component or structure that is exposed to the liquid.

According to another aspect of the invention,
A substrate table configured to hold a substrate;
A projection system configured to project a patterned radiation beam onto a substrate and including a final element adjacent to the substrate;
A liquid supply system configured to supply liquid to a space between the projection system and the substrate table;
A lithographic apparatus is provided that includes a final optical element, a substrate table, or a coater configured to coat at least one of a surface of a component or structure that is exposed to the liquid.

  According to yet another aspect of the invention, (i) a cleaning fluid, (ii) a coating fluid, (iii), a coating stripper, or (iv) any combination of (i)-(iii) is applied to lithography. There is provided the use of a fluid supply system in a lithographic apparatus for serial application in a space between the projection system of the apparatus and a substrate table.

  According to yet another aspect of the invention, there is provided a spray unit configured to spray a cleaning fluid onto a final optical element of a projection system of a lithographic apparatus.

  According to yet another aspect of the invention, an ultrasonic emitter configured to entrap liquid confined in a space between a projection system of a lithographic apparatus and a substrate table into an ultrasonic cleaning liquid is provided. Is done.

  According to yet another aspect of the invention, in a lithographic apparatus configured to have a liquid in a space between an optical element and a substrate table, for cleaning the optical element of the projection system, the substrate table, or both A method comprising circulating a cleaning fluid through the space.

  According to yet another aspect of the invention, in a lithographic apparatus configured to have a liquid in a space between an optical element and a substrate table, for covering the optical element of the projection system, the substrate table, or both A method comprising circulating a coating fluid through the space.

  Embodiments of the invention will now be described, by way of example only, with reference to the accompanying schematic drawings. Corresponding reference characters indicate corresponding parts in the drawings.

FIG. 1 schematically depicts a lithographic apparatus according to one embodiment of the invention. This device
An illumination system (illuminator) IL configured to condition a emitted light beam B (eg UV or DUV radiation);
A support structure (eg mask mask) made to support the patterning device (eg mask) MA and coupled to a first positioner PM configured to accurately position the patterning device according to certain parameters Table) MT,
A substrate table (eg, a wafer table) made to hold a substrate (eg, resist coated wafer) W and coupled to a second positioning device PW configured to accurately position the substrate according to certain parameters When,
A projection system (eg, refraction) configured to project the pattern imparted to the radiation beam B by the patterning device MA onto a target portion C (eg, including one or more molds) of the substrate W. Projection lens system) PS.

  The illumination system directs, shapes, or controls the emitted light, such as refractive, reflective, magnetic, electromagnetic, electrostatic, or other types of optical components, or any combination thereof Various types of optical components can be included.

  The support structure supports the patterning device, i.e. bears the weight of the patterning device. This holds the patterning device in a manner that depends on the orientation of the patterning device, the design of the lithographic apparatus, and other conditions, such as for example whether or not the patterning device is held in a vacuum environment. The support structure can use mechanical, vacuum, electrostatic, or other clamping techniques to hold the patterning device. The support structure may be, for example, a frame or table that can be fixed or movable as required. The support structure may ensure that the patterning device is at a desired position, for example with respect to the projection system. Any use of the terms “reticle” or “mask” herein may be considered synonymous with the more general term “patterning device.”

  As used herein, the term “patterning device” refers to any device that can be used to dispense a pattern to a cross-section of a emitted light beam so as to create a pattern on a target portion of a substrate. Should be interpreted widely. It should be noted that, for example, if the pattern includes phase shift characteristics or so-called assist characteristics, the pattern applied to the emitted light beam may not exactly correspond to the desired pattern at the target portion of the substrate. In general, the pattern imparted to the radiation beam will correspond to a particular functional layer in a device being created in the target portion, such as an integrated circuit.

  The patterning device may be transmissive or reflective. Examples of patterning devices include masks, programmable mirror arrays, and programmed LCD panels. Masks are well known in lithography and include mask types such as binary alternating phase shift and attenuated phase shift, as well as various hybrid mask types. One example of a programmable mirror array uses a matrix arrangement of small mirrors, and each mirror can be individually tilted to reflect the incoming radiation beam in various directions. The tilted mirror imparts a pattern into the emitted light beam reflected by the mirror matrix.

  As used herein, the term “projection system” refers to any type of projection, including refractive, reflective, catadioptric, magnetic, electromagnetic, and electrostatic optical, or any combination thereof. It should be broadly interpreted as encompassing the system, as appropriate for the exposure radiation used, or for other factors such as the use of immersion or the use of vacuum. Any use of the term “projection lens” herein may be considered as synonymous with the more general term “projection system”.

  As illustrated here, the apparatus is in a transmissive format (eg, using a transmissive mask). Alternatively, it may be of a reflective type (using a programmable mirror array of the type referred to above, or using a reflective mask).

  The lithographic apparatus may be of a type having two (dual stage) or more substrate tables (and / or two or more support structures). In such a “multi-stage” machine, additional tables can be used in parallel, or one or more other tables can be exposed at the same time while performing a preparatory step on one or more tables. May be used for

  Referring to FIG. 1, the illuminator IL receives a radiation light beam from a radiation source SO. The radiation source and the lithographic apparatus are separate components, for example when the radiation source is an excimer laser. In such a case, the radiation source is not considered to form part of the lithographic apparatus, and the radiation light beam is produced, for example, with the aid of a beam distribution system BD including suitable directing mirrors and / or beam expanders. The radiation source SO is passed to the illuminator IL. In other cases the radiation source may be an integral part of the lithographic apparatus, for example when the radiation source is a mercury lamp. The radiation source SO and the illuminator IL may be called a radiation light system together with the beam distribution system BD if necessary.

  The illuminator IL may include an adjuster AD for adjusting the angular intensity distribution of the radiation light beam. In general, it is possible to adjust at least the outer and / or inner radial extent (usually referred to as σ out and σ inside, respectively) of the intensity distribution on the pupil plane of the illuminator. Furthermore, the illuminator IL may include various other components such as an integrator IN and a condenser lens CO. An irradiator can also be used to adjust the emitted light beam to have the desired uniformity and intensity distribution in its cross section.

  The emitted light beam B is an incident beam on a patterning device (eg mask MA) held on a support structure MT (eg mask table) and is patterned by the patterning device. When traversing the patterning device MA, the emitted light beam B passes through the projection system PS, which focuses the beam onto the target portion C of the substrate W. With the aid of a second positioning device PW and a position sensor IF (for example an interferometer device, linear encoder or capacitive sensor), the substrate table WT is positioned to position various target portions C, for example in the path of the emitted light beam B. Can move accurately. Similarly, patterning using the first positioning device PM and another position sensor (not explicitly shown in FIG. 1), for example after mechanical acquisition from a mask library or during scanning The device MA can be accurately positioned with respect to the path of the emitted light beam B. In general, the support structure MT can also be moved using a long stroke module (coarse positioning) and a short stroke module (fine positioning) that form part of the first positioning device PM. Similarly, the movement of the substrate table WT can be performed using a long stroke module and a short stroke module that form part of the second positioning device PW. In the case of a stepper (as opposed to a scanner) the support structure MT may be connected to a short stroke actuator only, or may be fixed. Patterning device MA and substrate W may be aligned using patterning device alignment marks M1, M2 and substrate alignment marks P1, P2. These substrate alignment marks occupy dedicated target portions as shown, but these marks may be in the space between the target portions (these are known as scribe lane alignment marks). Similarly, in situations where a plurality of molds are provided on the patterning device MA, patterning device alignment marks may be placed between the molds.

The illustrated apparatus can be used in at least one of the following modes: That is,
1. In step mode, the support structure MT and the substrate table WT are essentially placed to project the entire pattern imparted to the emitted light beam onto the target portion at once (ie, a single static exposure). The substrate table WT is then shifted in the X and / or Y direction so that different target portions C can be exposed. In step mode, the maximum size of the exposure area limits the size of the target portion C imaged in a single static exposure.

  2. In scan mode, the pattern imparted to the radiation beam is projected onto a target portion C (ie, a single dynamic exposure) while scanning the support structure MT and the substrate table WT synchronously. The speed and direction of the substrate table WT relative to the support structure MT can also be determined by the (reduction) enlargement characteristics and image reversal characteristics of the projection system PS. In scan mode, the maximum size of the exposure area limits the width (in the non-scan direction) of the target portion in a single dynamic exposure, and the length of the scan movement determines the height (in the scan direction) of the target portion.

  3. In another mode, the support structure MT is essentially placed to hold the programmed patterning device and move the substrate table WT while the pattern applied to the emitted light beam is projected onto the target portion C. That is, scan. In this mode, a pulsed radiation source is generally used and the programmed patterning device is updated as necessary after each movement of the substrate table WT or during successive radiation light pulses. This mode of operation is readily applicable to maskless lithography that utilizes programmable patterning device, such as a programmable mirror array of a type as referred to above.

  Combinations and / or variations on the above described modes of use or even entirely different modes of use may be employed.

  Yet another immersion lithography solution with a localized liquid supply system is shown in FIG. Liquid is supplied by two groove inlets IN on either side of the projection system PL and discharged by a plurality of separate outlets OUT arranged radially outwardly of the inlet IN. The inlet IN and outlet OUT can be arranged in a plate with one hole in the center, through which the projection beam is projected. The liquid is supplied by one groove inlet IN on one side of the projection system PL and discharged by a plurality of separate outlets OUT on the other side of the projection system PL, and the liquid between the projection system PL and the substrate W is discharged. Create a thin film flow. The selection of which combination of one inlet IN and multiple outlets OUT to use can be determined by the direction of substrate movement (other combinations of one inlet IN and multiple outlets OUT are not active).

  Yet another immersion lithography solution with a proposed localized liquid supply system includes a liquid confinement structure that extends along at least a portion of the boundary of the space between the final element of the projection system and the substrate table. Having a liquid supply system. The liquid confinement structure is substantially stationary relative to the projection system in the XY plane, although there may be some relative movement in the Z direction (in the direction of the optical axis). A seal is formed between the liquid confinement structure and the surface of the substrate. In some embodiments, the seal is a contactless seal such as a gas seal. Such a system with a gas seal is disclosed in US patent application US 10 / 705,783, which is incorporated herein by reference in its entirety.

  FIG. 5 illustrates a liquid supply system including a liquid confinement structure (sometimes referred to as an immersion hood or showerhead) according to one embodiment of the present invention. In particular, FIG. 5 shows the arrangement of a reservoir 10, which reservoir 10 is non-relative to the substrate around the image area of the projection system so as to confine liquid to fill the space between the substrate surface and the final element of the projection system. Form a contact seal. A liquid confinement structure 12 located below and around the final element of the projection system PL forms a reservoir. The liquid is guided into a space in the liquid confinement structure 12 under the projection system. The liquid confinement structure 12 extends slightly above the final element of the projection system, and the liquid level rises above the final element, resulting in a liquid buffer area. The liquid confinement structure 12 has an inner periphery, which preferably closely follows the shape of the projection system or its final element at the upper end, for example round. At the bottom, the inner periphery closely follows the shape of the image area and is not required in this case, for example rectangular.

  The liquid is confined in the reservoir by a gas seal 16 between the bottom of the liquid confinement structure 12 and the surface of the substrate W. The gas seal is formed by a gas such as air, synthetic air, N 2 or inert gas supplied under pressure through the inlet 15 between the liquid confinement structure 12 and the substrate and taken out through the outlet 14. The overpressure on the gas inlet 15, the vacuum on the outlet 14, and the gap geometry are determined so that the high velocity gas flow into the interior confines the liquid. Those skilled in the art will appreciate that other types of seals can be used to contain the liquid, such as a mere outlet for removing liquid and / or gas.

  Referring to FIG. 5, the liquid confinement structure 12 and the projection system PL are positioned such that the substrate is exposed over the entire substrate W and the patterned radiation beam passes from the projection system PL to the substrate W through the liquid 11. is doing.

  In FIG. 6, the liquid confinement structure 12 and the substrate table WT are moved relative to each other such that the opening that holds the liquid in the liquid confinement structure 12 no longer completely covers the substrate W. Although the opening of the liquid confinement structure extends beyond the surface of the substrate W, for example, the immersion liquid 11 can be replaced with the cleaning fluid 110, and the cleaning fluid 110 is transferred to the liquid confinement structure through the same outlet 13 as the immersion liquid 11. You may supply. In this case, the cleaning device is a liquid confinement structure.

  The cleaning fluid 110 can be used to remove contaminants from both the final element of the projection system PL and / or the substrate table WT. Furthermore, a pressurized gas flow can be used through the outlet 14 and the inlet 13 to clean the substrate table. The contaminants are washed away or disintegrated and removed when the cleaning fluid 110 is removed and replaced by the immersion liquid 11 and is ready to expose the next substrate. The cleaning fluid 110 that can be supplied by the liquid confinement structure may itself be a solvent, a cleaning agent, a liquefied gas such as carbon dioxide, or a dissolved gas such as oxygen, ozone, or nitrogen.

  A liquid confinement structure may be used to contain the cleaning gas as well as the cleaning liquid. The gap between the projection system PL and the liquid confinement structure 12 may be temporarily closed during the cleaning operation, and even gases that are potentially harmful to people or other parts of the lithographic apparatus may be used. .

  This reduction in particle contamination due to different uses of liquid confinement structures can be beneficial for the quality of processing of the lithographic apparatus. The cleaning action using the liquid confinement structure can be part of the exposure or it can be part of the maintenance action, for example when required by the level of contamination. The advantage of this measure is that there is no need to disassemble the lithographic apparatus to be cleaned.

  Software can also be used to guide the movement of the substrate table in all directions or in a desired direction, rather than the direction required for simple exposure of the substrate. In this way, all or a desired part of the substrate table WT is cleaned because all or a desired part may be at some point under the liquid confinement structure.

  Another cleaning device configured to supply a cleaning fluid to the liquid confinement structure, referring to FIG. 7, is a cleaning station 20 provided in the substrate table WT. When the final element of the projection system PL and / or the substrate table WT needs to be cleaned, the cleaning station 20 is moved relative to the liquid confinement structure so that it is located below the final element. In this method, cleaning liquid 110 is supplied from the cleaning station 20 by a sprayer configured to spray the cleaning liquid 110 into the reservoir of the liquid confinement structure 12 and onto the final element of the projection system PL. Accordingly, the cleaning liquid 110 can clean the final element. Additionally or alternatively, the cleaning liquid 110 can fill the reservoir so that the substrate table WT can be cleaned. Once cleaning is complete, the liquid confinement structure 12 is then activated to completely wash away the cleaning liquid left with ultrapure water or another suitable liquid. Instead of the cleaning liquid, the cleaning station may supply a cleaning gas such as ozone or plasma. In some embodiments, the cleaning liquid may be liquid CO 2 (this cleaning may be referred to as “snow cleaning”).

  The cleaning fluid used will depend on the contaminant to be removed. The soil to be dried is usually a salt deposit and a high pH solution or a low pH solution may be used depending on the exact salt. Other cleaning agents may be used to remove metal deposits. Organic contaminants, organic solvents such as heptane, hexane (nonpolar), alcohols such as ethanol, or acetone (polar) can also be used.

  Furthermore, the projection beam may be projected through the final element PL during cleaning to destroy certain organic contaminants.

  In some embodiments, it is desirable to avoid any mechanical contact with the final element to reduce the risk of scratching the final element. However, if necessary, the liquid confinement structure 12 and / or the substrate table WT may include a brush on the motor.

  The cleaning station 20 may be placed anywhere in or on the substrate table WT or in or on the liquid confinement structure 12 so that the liquid confinement structure itself and the closure plate, etc. can also be cleaned. Many surfaces in immersion lithographic apparatus are at risk of contamination due to dirt that dries, organic contaminants from the resist evaporating from the substrate, contaminants from the immersion liquid itself, and the like. Accordingly, the cleaning fluid 110 is supplied to all the same surfaces that may be exposed to the immersion liquid, whether supplied by the liquid confinement structure 12 or supplied by the cleaning station 20.

  FIG. 8 shows another embodiment in which the final element of the immersion system, in particular the projection system PL, can be cleaned. In this case, the cleaning fluid 110 is not introduced or is introduced and the fluid in the liquid confinement structure 12 is incorporated into the substrate table WT and / or the ultrasonic emitter 30 as a cleaning device in the liquid confinement structure 12, Can be transferred into an ultrasonic cleaning bath.

  Ultrasonic cleaning is particularly good for removing contaminants that have dried and hardened, for example, salts on the final elements of the projection system PL. Ultrasonic cleaning is also useful for cleaning areas where brushes or tissues cannot reach, such as small protrusions on the substrate table WT and bumpy plate irregularities.

  In yet another embodiment, a megasonic transmitter that emits megahertz frequencies is incorporated into the substrate table WT and / or the liquid confinement structure 12, which causes the liquid in the liquid confinement structure 12 to pass through the megasonic cleaning liquid. It is configured to point inward. This is advantageous in that it is less harmful to the hardware and the sound waves can further propagate through the liquid supply system.

  The coating may be introduced into the reservoir of the liquid confinement structure 12 through the liquid confinement structure 12 and / or through the cleaning station 20 with or instead of the cleaning fluid 110. In this case, the liquid confinement structure and / or the cleaning station may be referred to as a coater. It will be apparent to those skilled in the art that this coating may be used to protect liquid confinement structures, final devices, or other surfaces, or may be subjected to other applications. The coating remover can also be introduced into the liquid confinement structure in the same manner.

  Another cleaning device that can be used to clean microbiological contamination (ie bacterial cultures) is UV radiation. Other radiation sources can be used to supply this UV radiation, but the radiation source of the lithographic apparatus may be used. For example, a radiation source of a lithographic apparatus may emit a 193 nm line, one type of this radiation being bacteria that may be present in the liquid confinement structure, on the substrate table, and / or on the final element. Kill.

  There are at least two ways in which UV radiation from the projection system PL itself can be used to kill bacteria on the substrate table. The first method is by means of a closure plate that is transparent to UV radiation, which retains the liquid in the liquid confinement structure 12, but still the UV radiation reaches the substrate table WT to dispose of bacteria thereon. Can kill. The second method does not use a closed disc, but irradiates the bacteria and at the same time wash away dead bacteria due to the flow of liquid in the liquid confinement structure 12.

  If bacteria are to be removed from the final element of the projection system PL or the surface of the liquid confinement structure 12, UV radiation may be supplied from the projection system PL itself, as described above, or from a separate optical element. May be. For example, an optical element located at the same location as the ultrasonic emitter 30 in FIG. 8 can be used to provide UV radiation to the final element of the projection system PL and / or the surface of the liquid confinement structure 12. In this case, the UV rays can enter the liquid confinement structure 12 via a closing plate that is transparent to UV rays, for example.

  The use of UV radiation has the advantage of keeping microbiological contamination low and preventing prolonged pauses that may occur due to the need to perform wet chemical disinfection using, for example, hydrogen peroxide or ozone water. This treatment can be implemented as a prophylactic or therapeutic strategy.

  European Patent Application No. 03257072.3 discloses the concept of a two-stage or double-stage immersion lithographic apparatus. Such an apparatus is provided with two tables for supporting the substrate. Leveling measurements are performed by the table without immersion liquid at the first position, and exposure is performed by the table at the second position where immersion liquid is present. As an alternative, the device has only one table.

  Although the text specifically refers to the use of lithographic apparatus in IC manufacturing, the lithographic apparatus described herein is an integrated for magnetic domain memory, flat panel display, liquid crystal display (LCD), thin film magnetic head, etc. It should be understood that there are other application areas, such as manufacturing optical systems, inductive patterns, and sensing patterns. In connection with such alternative applications, any use of the terms “wafer” or “mold” herein is synonymous with the more general terms “substrate” or “target portion”, respectively. You may think. The substrate referred to herein may be processed before or after exposure, for example, in a track (typically a tool that applies a resist layer to the substrate and develops the exposed resist), metrology tool, and / or inspection tool. May be. Where applicable, what is disclosed herein may be applied to such and other substrate processing tools. Further, a substrate can be processed multiple times, for example to create a multi-layer IC, so the term substrate as used herein may refer to a substrate that already contains multiple processed layers.

  As used herein, the terms “radiant light” and “beam” refer to any type of electromagnetic radiation, including ultraviolet (UV) radiation (eg, having a wavelength of about 365, 248, 193, 157, or 126 nm). Include.

  The term “lens” allowed in this context refers to any one or combination of various types of optical components, including refractive and reflective optical components.

  While specific embodiments of the invention have been described above, it will be appreciated that the invention may be practiced otherwise than as described. For example, the invention may be in the form of a computer program comprising a machine-readable sequence or sequence of instructions describing the method disclosed above, or a data storage medium having such a computer program stored therein ( For example, it may take the form of a semiconductor memory, a magnetic disk, or an optical disk.

  One or more embodiments of the invention can be applied to any immersion lithographic apparatus, such as the type described above, where the immersion liquid is applied in the form of a bath or localized surface area of the substrate. Applies only to. A liquid supply system is any mechanism that supplies liquid to the space between the projection system and the substrate and / or substrate table. This includes any combination of one or more structures, one or more liquid inlets, one or more gas inlets, one or more gas outlets, and / or one or more liquid outlets. However, this combination supplies and confines liquid in the space. In some embodiments, the surface of this space may be limited to a portion of the substrate and / or substrate table, or the surface of this space may completely cover the substrate and / or substrate table, or The substrate and / or the substrate table may be enclosed.

  The above description is intended to be illustrative and not limiting. Thus, it will be apparent to one skilled in the art that modifications may be made to the invention as described without departing from the scope of the claims set out below.

1 shows a lithographic apparatus according to one embodiment of the invention. FIG. 1 shows a liquid supply system for use in a lithographic projection apparatus. FIG. 1 shows a liquid supply system for use in a lithographic projection apparatus. FIG. 5 shows another liquid supply system for use in a lithographic projection apparatus. It is a figure which shows the liquid supply system by one Example of this invention. FIG. 6 shows the liquid confinement structure of FIG. 5 located on a substrate table. FIG. 3 shows a cleaning station in a substrate table according to an embodiment of the present invention. It is a figure which shows the ultrasonic cleaning bath by one Example of this invention.

Explanation of symbols

B Radiation beam BD Beam distribution system C Target part IF Position sensor IL Irradiation system (Irradiator)
IN entrance M1, M2 patterning device alignment mark MA patterning device MT support structure OUT exit P1, P2 substrate alignment mark PM first positioning device PS projection system PW second positioning device SO radiation source W substrate WT substrate table 10 reservoir DESCRIPTION OF SYMBOLS 11 Liquid, immersion liquid 12 Liquid confinement structure 13 Outlet 14 Outlet 15 Inlet 16 Gas seal 20 Cleaning station 30 Ultrasonic emitter 110 Cleaning fluid, cleaning liquid

Claims (30)

A substrate table configured to hold a substrate;
A projection system configured to project a patterned radiation beam onto the substrate and including a final optical element adjacent to the substrate;
A liquid supply system configured to supply liquid to a space between the projection system and the substrate table;
A lithographic apparatus, comprising: a cleaning device configured to clean at least one of the final optical element, the substrate table, or a surface of a component or structure exposed to the liquid.   The apparatus of claim 1, wherein the cleaning device includes a liquid confinement structure of the liquid supply system and is configured to clean the final optical element in series with a lithographic apparatus.   2. The cleaning device includes a sonic transmitter selected from the group of an ultrasonic transmitter and a megasonic transmitter configured to change the liquid in the space to an ultrasonic cleaning liquid or a megasonic cleaning liquid, respectively. The device described in 1.   The apparatus of claim 1, wherein the cleaning device includes an optical element configured to provide low wavelength ultraviolet radiation.   The apparatus of claim 4, wherein the liquid supply system includes a surface that transmits low wavelength ultraviolet light.   The apparatus of claim 4 wherein the low wavelength ultraviolet radiation has a wavelength of 193 nm.   The apparatus of claim 1, wherein the cleaning device is configured to supply a cleaning fluid to the space.   The apparatus of claim 7, wherein the cleaning fluid comprises a solvent.   The apparatus of claim 7, wherein the cleaning fluid comprises a cleaning agent.   The apparatus of claim 7, wherein the cleaning fluid comprises dissolved gas.   The apparatus of claim 10, wherein the gas is selected from oxygen, ozone, or nitrogen.   The apparatus of claim 1, wherein the cleaning device is in a substrate table.   The apparatus of claim 12, wherein the cleaning device includes a spray unit.   The apparatus of claim 13, wherein the spray unit is configured to spray a cleaning fluid onto an optical element, a substrate table, or both.   The apparatus of claim 14, wherein the cleaning fluid comprises ozone.   The apparatus of claim 14, wherein the cleaning fluid comprises a plasma.   The apparatus of claim 14, wherein the cleaning fluid comprises liquid carbon dioxide.   The apparatus of claim 14, wherein the cleaning fluid comprises a nonpolar organic solvent.   The apparatus of claim 14, wherein the cleaning fluid comprises a polar organic solvent.   15. An apparatus according to claim 14, wherein the cleaning device is configured to clean only the final optical element or to clean only the substrate table. A substrate table configured to hold a substrate;
A projection system configured to project a patterned radiation beam onto the substrate and including a final optical element adjacent to the substrate;
A liquid supply system configured to supply liquid to a space between the projection system and the substrate table;
A lithographic apparatus comprising: the final optical element; the substrate table; or a coater configured to cover at least one surface of a component or structure exposed to the liquid.   The apparatus of claim 21, wherein the coater includes a spray unit in a substrate table.   The apparatus of claim 21, wherein the coater includes a liquid confinement structure of the liquid supply system, and the coating device is configured to cover the final optical element in series with a lithographic apparatus.   The apparatus of claim 21, wherein the coating device is configured to coat only the final optical element or to clean only the substrate table.   (I) a cleaning fluid, (ii) a coating fluid, (iii) a coating stripper, or (iv) any combination of (i) to (iii) in the space between the projection system of the lithographic apparatus and the substrate table Use of a fluid supply system in a lithographic apparatus for serial application.   A spray unit configured to spray a cleaning fluid onto a final optical element of a projection system of a lithographic apparatus.   An ultrasonic emitter configured to entrap a liquid confined in a space between a projection system of a lithographic apparatus and a substrate table into an ultrasonic cleaning liquid.   A megasonic emitter configured to entrain liquid confined in a space between a projection system of a lithographic apparatus and a substrate table into a megasonic cleaning liquid.   In a lithographic apparatus configured to have a liquid in a space between an optical element and a substrate table, including circulating a cleaning fluid through the space for cleaning the optical element of the projection system, the substrate table, or both Method.   In a lithographic apparatus configured to have a liquid in a space between an optical element and a substrate table, including circulating a coating fluid through the space for coating the optical element of the projection system, the substrate table, or both Method.

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