JP2008210926A - Suction nozzle - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a suction nozzle excellent in versatility, which can be used for both reflective recognition and transmissive recognition while commonly utilizing components. <P>SOLUTION: The suction nozzle is replaceably attached to a mounting head of an electronic component mounter, and used to hold an electronic component by vacuum suction. The suction nozzle comprises a plurality of kinds of nozzle chips having a suction surface abutting on an electronic component to suck it, and a common nozzle main body 20 having the nozzle chips attached thereto. A reflection plate 21 and an infrared ray transmitting filter 22 are stuck on the lower surface of a flange portion provided on the nozzle main body 20, a selective reflection portion for selectively reflecting or absorbing two kinds of illumination lights to be emitted from the lower part in response to either of the recognition methods, i.e. the transmissive recognition or reflection recognition is formed, and a first nozzle chip 23A(1) and a second nozzle chip 23A(2) having surface characteristic having the light reflection characteristic depending on the recognition method are selectively used depending on the method of recognizing an electronic component to be targeted. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a suction nozzle for holding an electronic component by vacuum suction in an electronic component mounting apparatus.

  As a method of holding an electronic component in an electronic component mounting apparatus for mounting the electronic component on a substrate, a method using vacuum suction is widely used, and the shape and size of the target electronic component is mounted on the mounting head of the electronic component mounting apparatus. Various suction nozzles corresponding to the above are mounted interchangeably. These suction nozzles are mounted in combination with a reflector that illuminates from below and reflects the illumination light from the back of the electronic component when the electronic component is imaged from below to detect misalignment of the electronic component. In many cases, the head is mounted on the head (for example, see Patent Documents 1 and 2).

  In the example shown in Patent Document 1, two types of recognition methods, that is, reflection recognition for acquiring and recognizing a terminal or lead of an electronic component as a bright image by reflected light, and the outer shape of the electronic component by transmitted light from behind. Combined with a suction nozzle, a reflector that reflects illumination light and a filter that selectively transmits illumination light so that the same suction nozzle can be used for transmission recognition that is acquired and recognized as a dark image I use it.

In addition, in the example shown in Patent Document 2, a reflector is combined with the main body of the suction nozzle, and the main nozzle can be replaced according to the type of electronic component for the individual nozzle portion that contacts the electronic component in the suction nozzle. The example of a structure made to fit in is shown. With such a configuration, even when many types of suction nozzles are required for high-mix low-volume production, parts can be shared as much as possible, and parts management at the production site is streamlined. Thus, it is possible to quickly respond to small lot production.
Japanese Patent Application Laid-Open No. 06-043102 JP 2000-153486 A

  However, in the above-mentioned patent document examples, there have been the following problems in promoting the generalization of the suction nozzle and the common use of parts in response to the recent progress in small-lot production of various varieties. That is, in any of Patent Document Examples 1 and 2, when the electronic component to be suction-held is a component that is subject to reflection recognition and is smaller than the suction surface of the nozzle tip, the electronic component is held. In this state, the adsorption surface is partially exposed. For this reason, the illumination light irradiated from below is reflected by the exposed portion and then enters the camera and acts as noise, which may hinder recognition processing for correctly recognizing the electronic component. As described above, in the prior art, it has been impossible to realize a suction nozzle that is compatible with both reflection recognition and transmission recognition while sharing parts and is excellent in versatility.

  Accordingly, an object of the present invention is to provide a suction nozzle that is compatible with both reflection recognition and transmission recognition while sharing parts and is excellent in versatility.

A suction nozzle according to a first aspect of the present invention is a suction nozzle that is replaceably mounted on a nozzle mounting portion provided in a mounting head of an electronic component mounting apparatus, and holds the electronic component by vacuum suction. A nozzle chip provided with a suction surface that is in contact with the electronic component and held by vacuum suction, and a fitting portion that is replaceably mounted on the nozzle mounting portion is provided on the upper surface of the disk-shaped flange portion, A nozzle body portion provided with a tip mounting portion to which an upper end portion of the nozzle tip is attached to a lower surface of the flange portion, and an electronic component held on the suction surface is imaged from below on the lower surface of the flange portion. When recognizing by a recognition method of transmission recognition or reflection recognition, irradiation is performed at the time of transmission recognition among two types of illumination light selectively irradiated from below according to the recognition method. A selective reflection surface is formed which selectively reflects the first illumination light to be selectively reflected and selectively absorbs the second illumination light irradiated at the time of reflection recognition. The surface property has a first light reflection characteristic for reflecting illumination light.

  A suction nozzle according to a second aspect of the present invention is a suction nozzle that is replaceably mounted on a nozzle mounting portion provided in a mounting head of an electronic component mounting apparatus, and holds the electronic component by vacuum suction. A nozzle chip provided with a suction surface that is in contact with the electronic component and held by vacuum suction, and a fitting portion that is replaceably mounted on the nozzle mounting portion is provided on the upper surface of the disk-shaped flange portion, A nozzle body portion provided with a tip mounting portion to which an upper end portion of the nozzle tip is attached to a lower surface of the flange portion, and an electronic component held on the suction surface is imaged from below on the lower surface of the flange portion. When recognizing by a recognition method of transmission recognition or reflection recognition, irradiation is performed at the time of transmission recognition among two types of illumination light selectively irradiated from below according to the recognition method. A selective reflection surface that selectively reflects the first illumination light to be selectively reflected and selectively absorbs the second illumination light that is irradiated during reflection recognition, and at least the suction surface of the nozzle tip is It has a surface property having a second light reflection characteristic for absorbing the second illumination light.

  A suction nozzle according to a second aspect of the present invention is a suction nozzle that is replaceably mounted on a nozzle mounting portion provided in a mounting head of an electronic component mounting apparatus, and holds the electronic component by vacuum suction. A nozzle chip provided with a suction surface that is in contact with the electronic component and held by vacuum suction, and a fitting portion that is replaceably mounted on the nozzle mounting portion is provided on the upper surface of the disk-shaped flange portion, A nozzle body portion provided with a tip mounting portion to which an upper end portion of the nozzle tip is attached to a lower surface of the flange portion, and an electronic component held on the suction surface is imaged from below on the lower surface of the flange portion. When recognizing by a recognition method of transmission recognition or reflection recognition, irradiation is performed at the time of transmission recognition among two types of illumination light selectively irradiated from below according to the recognition method. A selective reflection surface is formed that selectively reflects the first illumination light that is reflected and selectively absorbs the second illumination light that is irradiated during reflection recognition, and the side surface of the nozzle chip is the first illumination light. A first nozzle chip having a surface property having a first light reflection characteristic for reflecting illumination light, and a surface property having a second light reflection characteristic for at least the suction surface to absorb the second illumination light. Any one of the second nozzle chips is selectively attached to the nozzle body according to the recognition method.

  According to the present invention, the suction nozzle that sucks and holds the electronic component, the nozzle chip provided with the suction surface that comes into contact with and sucks the electronic component, and the nozzle that is attached to the mounting head with the nozzle chip attached thereto are interchangeable. It consists of a main body part, and selectively reflects or absorbs two types of illumination light irradiated from below according to the recognition method of either transmission recognition or reflection recognition on the lower surface of the flange part provided in the nozzle main body part. By forming the selective reflection part to be used and having the light reflection characteristics according to the recognition method for the surface properties of the nozzle chip, it can be used for both reflection recognition and transmission recognition while sharing parts. It is possible to realize a suction nozzle having excellent properties.

Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a diagram showing a configuration of a mounting head of the electronic component mounting apparatus according to an embodiment of the present invention, and FIGS. FIG. 5 is a diagram illustrating the configuration of a suction nozzle used in the electronic component mounting apparatus according to the embodiment of the invention. FIG. 5 is a diagram illustrating the configuration of the component recognition unit disposed in the electronic component mounting apparatus according to the embodiment of the present invention. FIG. 7 is an explanatory diagram of a component recognition method in the electronic component mounting apparatus according to the embodiment of the present invention.

  First, the structure of the electronic component mounting apparatus will be described with reference to FIG. In FIG. 1, a conveyance path 2 is disposed in the center of the base 1 in the X direction. The transport path 2 transports the substrate 3 and positions the substrate 3 on the component mounting stage set in the transport path 2. On both sides of the conveyance path 2, component supply units 4 are arranged, and each component supply unit 4 has a plurality of tape feeders 5 arranged in parallel. The tape feeder 5 stores electronic components held on the tape, and pitches the tape to supply the electronic components to a pickup position by a mounting head described below.

  Y-axis tables 6A and 6B are disposed on both ends of the upper surface of the base 1, and two X-axis tables 7A and 7B are installed on the Y-axis tables 6A and 6B. By driving the Y-axis table 6A, the X-axis table 7A moves horizontally in the Y direction, and by driving the Y-axis table 6B, the X-axis table 7B moves horizontally in the Y direction. Mounted on the X-axis tables 7A and 7B are a mounting head 8 and a camera 9 that moves integrally with the mounting head 8, respectively. The camera 9 that has moved onto the substrate 3 captures and recognizes the substrate 3.

  By driving the Y-axis table 6A, the X-axis table 7A, the Y-axis table 6B, and the X-axis table 7B in combination, the mounting head 8 moves horizontally, and the electronic components are picked up from the respective component supply units 4 by suction nozzles 12 (FIG. 2), and picks up by vacuum suction and mounts on the substrate 3 positioned on the component mounting stage of the transport path 2. The Y-axis table 6A, the X-axis table 7A, the Y-axis table 6B, the X-axis table 7B, and the mounting head 8 constitute a component mounting mechanism for mounting electronic components on the substrate 3.

  Here, the mounting head 8 will be described with reference to FIG. As shown in FIG. 2, the mounting head 8 is a multiple head, and has a configuration including a plurality of unit mounting heads 8a. Each of the unit mounting heads 8a includes a nozzle mounting portion 8b to which the suction nozzle 12 is detachably mounted at the lower end portion. The suction nozzle 12 mounted on the nozzle mounting portion 8b can be moved up and down individually by a lifting mechanism built in each unit mounting head 8a, and is further rotated around the nozzle axis by a Θ-axis motor 13 provided in common. Rotate to.

  A component recognition unit 10 and a nozzle stocker 11 are disposed on the route from the component supply unit 4 to the conveyance path 2. The nozzle stocker 11 stores and holds suction nozzles 12 corresponding to different types of electronic components in a grid arrangement, and the mounting head 8 accesses the nozzle stocker 11 to perform a nozzle replacement operation, so that the target electronic component is obtained. The suction nozzle 12 corresponding to the type can be mounted on the mounting head 8. In this nozzle replacement operation, the presence or absence of the suction nozzle 12 is detected by the nozzle detection sensor 14 provided in the mounting head 8.

  The component recognition unit 10 captures an image of the electronic component held by each unit mounting head 8a from below and recognizes the electronic component held by the suction nozzle 12 by recognizing the imaging result. As a result, the electronic component held by the suction nozzle 12 is identified, and the displacement in the XY direction and the rotation direction with respect to the suction nozzle 12 is detected. When the electronic component is mounted on the substrate 3 by the mounting head 8, the position and orientation of the electronic component are corrected based on the detection result of the displacement, and the electronic component is transferred and mounted on the substrate.

Next, the configuration of the suction nozzle 12 used in the electronic component mounting apparatus of the present embodiment will be described with reference to FIG. As shown in FIG. 3, the suction nozzle 12 is mainly composed of a nozzle body 20 and a nozzle tip 23 attached to the nozzle body 20. The nozzle body 20 has a shape in which a fitting portion 20a is provided on the upper surface of a disk-shaped flange portion 20b, and the fitting portion 20a is exchanged by fitting into a mounting hole provided in the nozzle mounting portion 8b. Can be installed freely. A concave attachment hole 20d for attaching the nozzle tip 23 is provided on the lower surface of the flange part 20b. The fitting hole 20d is provided through the fitting part 20a and the flange part 20b vertically. The suction hole 20c communicates.

  The upper end portion of the nozzle chip 23 is provided with a fitting end portion 23a shaped to fit into the mounting hole 20d. The lower end portion is in contact with the target electronic component and is held by vacuum suction 23b. Is provided. A suction hole 23c is provided in the suction surface 23b so as to penetrate the nozzle chip 23 vertically. The nozzle tip 23 is attached to the nozzle body 20 by fitting the fitting end 23a into the attachment hole 20d. Accordingly, the concave mounting hole 20d into which the fitting end portion 23a is fitted is provided on the lower surface of the flange portion 20b, and serves as a tip mounting portion to which the upper end portion of the nozzle tip 23 is attached. Then, with the nozzle tip 23 attached to the nozzle body 20 and the suction nozzle 12 assembled, the suction nozzle 12 is inserted by fitting the fitting portion 20a into the mounting hole provided in the nozzle mounting portion 8b. The unit mounting head 8a is replaceably mounted.

  That is, the suction nozzle 12 used in the present embodiment includes a nozzle chip 23 provided with a suction surface 23b that is in contact with an electronic component at the lower end and held by vacuum suction, and a nozzle on the upper surface of the disk-shaped flange portion 20b. A configuration including a nozzle body 20 provided with a fitting portion 20a that is replaceably mounted on the mounting portion 8b, and provided with a tip mounting portion to which the upper end portion of the nozzle tip 23 is attached on the lower surface of the flange portion 20b. It has become.

  In addition, as a structure of the chip | tip attachment part which attaches the nozzle chip | tip 23 to the nozzle main-body part 20, various structures can be used other than the structure which fits the fitting edge part 23a in the concave attachment hole 20d. For example, instead of the concave mounting hole 20d, a convex mounting convex portion is provided on the lower surface of the suction surface 20b to form a tip mounting portion, and this mounting convex portion is fitted into a fitting hole provided in the upper end portion of the nozzle tip 23. Further, a configuration in which an external thread portion provided at the upper end portion of the nozzle tip 23 is screwed into an internal thread portion as a tip mounting portion provided on the lower surface of the suction surface 20b may be employed.

  A detection surface that can be detected by the nozzle detection sensor 14 (see FIG. 2), which is a reflective optical sensor, is provided on the upper surface of the fitting portion 20a. As a method of providing this detection surface, when the material of the nozzle body 20 is a metal and the surface is a metallic glossy surface that reflects light, or when the material is a white ceramic, the material surface itself is used. It can be used as a detection surface. When a coating that scatters or absorbs light is formed on the nozzle body 20, the coating is partially peeled to expose the surface of the material, or the detection surface is formed with a white coating or the like.

  A reflection plate 21 and an infrared transmission filter 22 are laminated and attached to the lower surface of the flange portion 20b below the fitting portion 20a. The reflector 21 is made of a mirror-finished metal such as stainless steel. The infrared transmission filter 22 is an infrared transmission filter such as an acrylic resin, and has a function of transmitting only infrared light and absorbing red light. By laminating the reflection plate 21 and the infrared transmission filter 22, the illumination light emitted from the two light sources provided in the component recognition unit 10 is selectively used, and the outer shape of the electronic component is darkened by the transmitted light from behind. It is possible to selectively execute either a recognition method that is acquired and recognized as a transmission recognition or a reflection recognition that is acquired and recognized as a bright image of reflected light such as a terminal or lead of an electronic component. .

Here, the types of nozzle tips 23 used in combination with the nozzle body 20 in the suction nozzle 12 shown in the present embodiment will be described. A plurality of types of nozzle chips 23 with different width dimensions of the suction surface 23b are prepared according to the shape and size of the target electronic component. Here, as shown in FIG. 3, an example is shown in which two types of nozzle chip 23 </ b> A having a suction width B <b> 1 for a large part and a nozzle chip 23 </ b> B having a suction width B <b> 2 for a small part are prepared. In the actual example, various types of nozzle chips 23 having different sizes are prepared as necessary.

  As shown in FIG. 4A, by fitting the fitting end portion 23a into the mounting hole 20d and attaching the nozzle tip 23 (here, the nozzle tip 23A) to the nozzle body portion 20, the suction hole 20c becomes the suction hole. The electronic component can be sucked and held on the suction surface 23b by being in a state of communicating with the head 23c and being vacuum sucked from the suction hole 20c. In the present embodiment, two types of nozzle chips of different sizes (here, two types of nozzle chips 23A and 23B) having the same shape and different surface properties are prepared, and the target electronic component It is designed to be used according to the recognition method.

  That is, for each of the nozzle chips 23A and 23B, the first nozzle chip 23A (1), in which the suction surface 23b and the side surface 23d are processed into a surface property having a first light reflection characteristic that reflects the irradiated light. The nozzle chip 23B (1), and the second nozzle chips 23A (2) and 23B (2) in which the suction surface 23b and the side surface 23d are processed into a surface property having a second light reflection characteristic for absorbing the irradiated light. ) Is prepared. Specific examples of the surface property having the first light reflection property include a metallic glossy surface, a white ceramic material surface, a silver-white surface treatment coating such as metal plating, and a white coating with paint. Further, as a specific example of the surface property having the second light reflection characteristic, any method capable of forming a dark (preferably black) film may be used. For example, a surface treatment film exhibiting a black color or a black paint film by a paint is used. Can be used.

  When the first nozzle chips 23A (1) and 23B (1) are attached to the nozzle body 20 as shown in FIG. 4B, the suction nozzle 12 can be used for transmission recognition. In the transmission recognition, since the suction surface 23b is covered with the held electronic component, the surface property having the first light reflection characteristic is required for the side surface 23d. For convenience, it is desirable to have the same surface properties including the adsorption surface 23b. When the second nozzle chips 23A (2) and 23B (2) are attached to the nozzle body 20 as shown in FIG. 4C, the suction nozzle 12 can be used for reflection recognition. In this reflection recognition, as will be described later, it is essential that the suction surface 23b has a surface property having the second light reflection characteristic, and similarly, it is desirable that the same surface property is included including the suction surface 23b.

  Next, the configuration of the component recognition unit 10 will be described with reference to FIG. The component recognition unit 10 irradiates two types of light source units obliquely above the camera 25, that is, an infrared light source unit 26 that irradiates infrared light as first illumination light and red light as second illumination light. The red light source unit 27 is arranged. Infrared light is irradiated when the electronic component is recognized by transmission recognition, and red light is irradiated when the electronic component is recognized by reflection recognition.

  That is, by positioning the suction nozzle 12 holding the electronic component to be recognized above the component recognition unit 10 and operating either the red light source unit 26 or the infrared light source unit 27, the camera 25 can detect the electronic device to be recognized. An image for recognizing a part by a recognition method of either transmission recognition or reflection recognition is acquired. The acquired image is subjected to recognition processing by the recognition processing unit 28, whereby identification and position detection of the electronic component are performed. The infrared light source unit 26 includes an infrared LED as a light source, and irradiates infrared light having a wavelength near 850 nm. The red light source unit 27 includes a red LED as a light source, and irradiates red light having a wavelength near 690 nm.

Here, the reflection characteristics when the above-described infrared light / red light is applied to the selective reflection surface formed on the lower surface of the flange portion 20b of the suction nozzle 12 will be described. The infrared light emitted from the infrared light source unit 26 has a light intensity peak near 850 nm, and the red light emitted from the infrared light source unit 27 has a light intensity peak around 690 nm. The infrared transmission filter 22 has a transmission characteristic in which the transmittance rapidly decreases with respect to light having a wavelength of 750 nm or less. That is, the infrared light emitted from the infrared light source unit 26 passes through the infrared transmission filter 22 and is reflected downward by the reflecting plate 21, while the red light emitted from the red light source unit 27 is reflected by the infrared transmission filter. Since the light does not pass through 22, it is absorbed by the reflecting plate 21 without being reflected downward.

  The lower surface of the flange portion 20b on which the reflection plate 21 and the infrared transmission filter 22 are laminated and adhered forms a selective reflection surface that selectively reflects or absorbs two types of illumination light selectively irradiated from below. Therefore, in the suction nozzle 12 shown in the present embodiment, the electronic component held on the suction surface 23b is imaged from below on the lower surface of the flange portion 20b of the nozzle main body portion 20, and transmission recognition or reflection recognition is performed. Of the two types of illumination light selectively irradiated from below according to the recognition method, the infrared light that is the first illumination light irradiated at the time of transmission recognition A selective reflection surface that selectively reflects light and selectively absorbs red light, which is the second illumination light irradiated at the time of reflection recognition, is formed. The side surfaces of the first nozzle chips 23A (1) and 23B (1) have a surface property having a first light reflection characteristic that reflects the infrared light that is the first illumination light. At least the suction surface 23b of the nozzle chips 23A (2) and 23B (2) has a surface property having a second light reflection characteristic that absorbs red light as the second illumination light.

  Then, by using the suction nozzle 12 having a configuration in which the nozzle chip 23 having such light reflection characteristics is attached to the nozzle main body portion 20, the electronic component by either transmission recognition or reflection recognition using the same nozzle main body portion 20 is used. Can be recognized. That is, when the electronic component 30 to be recognized is recognized by transmission recognition, the suction nozzle 12 having a configuration in which the first nozzle chip 23A (1) is attached to the nozzle body 20 is used as shown in FIG. The electronic component 30 is imaged by the camera 25 in a state where infrared light is irradiated by the infrared light source unit 26.

  The irradiated infrared light (arrow a) is transmitted through the infrared transmission filter 22, reflected by the reflecting plate 21, irradiated downward (arrow b), and received by the camera 25. At this time, since the reflected light is blocked by the electronic component 30 in the portion where the electronic component 30 exists, the portion of the electronic component 30 and the lead 30a is placed on the light receiving surface 25a of the camera 25 as shown in FIG. A silhouette image having a dark image and a surrounding background portion as a bright image can be obtained. In the image recognition of the electronic component 30 by this transmission recognition, the side surface of the nozzle chip 23A (1) has the first light reflection characteristic that reflects infrared light, and is reflected downward by the selective reflection surface described above. Of the light, infrared light incident on the side surface of the nozzle chip 23A (1) is further reflected downward and contributes to imaging as transmitted illumination light.

  When recognizing the electronic component 30 to be recognized by reflection recognition, as shown in FIG. 7, the suction nozzle 12 having a configuration in which the second nozzle chip 23A (2) is attached to the nozzle body 20 is used. The electronic component 30 is imaged by the camera 25 with the red light source 27 irradiating red light. At this time, since the irradiated red light (arrow c) does not pass through the infrared transmission filter 22, there is almost no reflected light from the reflecting plate 21.

In this case, of the red light irradiated on the electronic component 30, the light incident on the lower surface of the lead 30 a is reflected downward (arrow d) and enters the camera 21. Since this reflected light is significantly different in contrast from diffusely reflected light from other parts, an image having the lead 30a of the electronic component 30 as a bright image and the other part as a dark image is formed on the light receiving surface 25a of the camera 25. can get. In the image recognition of the electronic component 30 by this reflection recognition, since at least the suction surface 23b of the nozzle chip 23A (2) has the second light reflection characteristic that absorbs red light, the suction surface 23b is partially electronic component. Even in the case where there is an exposed portion not covered with 30, there is no reflected light from the exposed portion, and therefore noise due to the presence of the exposed portion occurs in the recognition image with the lead 30a as a bright image. Absent.

  As shown in the present embodiment, as an actual example of component management in the case where the suction nozzle 12 is configured by combining different types of nozzle chips 23 with the common nozzle body 20, there are two types as follows: Operational examples are possible. In one operation example, the first nozzle chips 23A (1) and 23B (1) and the second nozzle chips 23A (2) and 23B (2) are fixedly attached to the nozzle main body 20 and transmitted through the nozzles. In this example, the suction nozzle 12 dedicated to recognition and the suction nozzle 12 dedicated to reflection recognition are used.

  That is, in this case, the nozzle chip 23 is the first nozzle chip 23A (1), 23B (1), and the side surface of the nozzle chip 23 has the first light reflection characteristic that reflects the first illumination light. The suction nozzle 12 dedicated to transmission recognition having the surface properties and the nozzle chip 23 are the second nozzle chips 23A (2) and 23B (2), and at least the suction surface of the nozzle chip 23 is the second illumination light. The suction nozzle 12 exclusively for reflection recognition, which has a surface property having the second light reflection characteristic that absorbs light, is always included.

  Another example of operation is that the first nozzle chips 23A (1) and 23B (1) and the second nozzle chips 23A (2) and 23B (2) are changed according to the method of recognizing the target electronic component. In this example, the nozzle body 20 is selectively replaced and attached to the common nozzle body 20 each time and is selectively used as the suction nozzle 12 for transmission recognition and the suction nozzle 12 for reflection recognition.

  That is, in this case, as the nozzle chip 23, the first nozzle chip 23A (1) whose side surface has the first light reflection characteristic that reflects the infrared light that is the first illumination light, 23B (1), and second nozzle chips 23A (2) and 23B (2) having at least a surface property having a second light reflection characteristic that absorbs red light, which is the second illumination light, on the adsorption surface. Any one of these is selectively attached to the nozzle body 20 in accordance with the electronic component recognition method.

  As described above, according to the present invention, the suction nozzle 12 for sucking and holding electronic components is replaced with the nozzle chip 23 provided with the suction surface for contacting and sucking the electronic components, and the nozzle chip 23 is attached to the mounting head. The nozzle main body 20 is freely mounted, and the lower surface of the flange 20b provided on the nozzle main body 20 is irradiated with two types of irradiation from below according to either the recognition method of transmission recognition or reflection recognition. A selective reflection portion that selectively reflects or absorbs illumination light is formed, and the surface properties of the nozzle chip 23 have light reflection characteristics according to the recognition method. Accordingly, it is possible to realize the suction nozzle 12 that is compatible with both reflection recognition and transmission recognition and has excellent versatility while sharing the parts of the nozzle body 20.

  The suction nozzle for sucking electronic components according to the present invention has an effect that it can be used for both reflection recognition and transmission recognition while being shared and has excellent versatility, and electronic components are mounted on a substrate by suction holding. It can be used in the field of electronic component mounting.

The top view of the electronic component mounting apparatus of one embodiment of this invention The figure which shows the structure of the mounting head of the electronic component mounting apparatus of one embodiment of this invention Structure explanatory drawing of the suction nozzle used for the electronic component mounting apparatus of one embodiment of this invention Explanatory drawing of the measured value of the flow sensor in the electronic component mounting apparatus of one embodiment of this invention Structure explanatory drawing of the component recognition part arrange | positioned at the electronic component mounting apparatus of one embodiment of this invention Explanatory drawing of the component recognition method in the electronic component mounting apparatus of one embodiment of this invention Explanatory drawing of the component recognition method in the electronic component mounting apparatus of one embodiment of this invention

Explanation of symbols

DESCRIPTION OF SYMBOLS 8 Mounting head 8b Nozzle mounting part 10 Component recognition part 12 Adsorption nozzle 20 Nozzle main body part 20a Fitting part 20b Flange part 21 Reflecting plate 22 Infrared transmission filter 23, 23A, 23B Nozzle chip 23A (1), 23B (1) 1st No. 1 nozzle chip 23A (2), 23B (2) Second nozzle chip 23a Fitting end 23b Suction surface 25 Camera 26 Infrared light source 27 Red light source 30 Electronic component

Claims (4)

A suction nozzle that is replaceably mounted on a nozzle mounting portion provided in a mounting head of an electronic component mounting apparatus and holds electronic components by vacuum suction,
A nozzle chip provided with a suction surface that is in contact with the electronic component at the lower end and held by vacuum suction;
A nozzle in which a fitting portion that is replaceably mounted on the nozzle mounting portion is provided on the upper surface of the disk-shaped flange portion, and a tip mounting portion in which the upper end portion of the nozzle tip is attached on the lower surface of the flange portion A main body,
On the lower surface of the flange portion, when the electronic component held on the suction surface is imaged from below and recognized by either a recognition method of transmission recognition or reflection recognition, it is selectively selected from below according to the recognition method. Of the two types of illumination light applied to the light, the first illumination light applied during transmission recognition is selectively reflected and the second illumination light applied during reflection recognition is selectively absorbed. A selective reflection surface is formed,
The side surface of the nozzle chip has a surface property having a first light reflection characteristic for reflecting the first illumination light. A suction nozzle that is replaceably mounted on a nozzle mounting portion provided in a mounting head of an electronic component mounting apparatus and holds electronic components by vacuum suction,
A nozzle chip provided with a suction surface that is in contact with the electronic component at the lower end and held by vacuum suction;
A nozzle in which a fitting portion that is replaceably mounted on the nozzle mounting portion is provided on the upper surface of the disk-shaped flange portion, and a tip mounting portion in which the upper end portion of the nozzle tip is attached on the lower surface of the flange portion A main body,
On the lower surface of the flange portion, when the electronic component held on the suction surface is imaged from below and recognized by either a recognition method of transmission recognition or reflection recognition, it is selectively selected from below according to the recognition method. Of the two types of illumination light applied to the light, the first illumination light applied during transmission recognition is selectively reflected and the second illumination light applied during reflection recognition is selectively absorbed. A selective reflection surface is formed,
At least the suction surface of the nozzle tip has a surface property having a second light reflection characteristic for absorbing the second illumination light. A suction nozzle that is replaceably mounted on a nozzle mounting portion provided in a mounting head of an electronic component mounting apparatus and holds electronic components by vacuum suction,
A nozzle chip provided with a suction surface that is in contact with the electronic component at the lower end and held by vacuum suction;
A nozzle in which a fitting portion that is replaceably mounted on the nozzle mounting portion is provided on the upper surface of the disk-shaped flange portion, and a tip mounting portion in which the upper end portion of the nozzle tip is attached on the lower surface of the flange portion A main body,
On the lower surface of the flange portion, when the electronic component held on the suction surface is imaged from below and recognized by either a recognition method of transmission recognition or reflection recognition, it is selectively selected from below according to the recognition method. Of the two types of illumination light applied to the light, the first illumination light applied during transmission recognition is selectively reflected and the second illumination light applied during reflection recognition is selectively absorbed. A selective reflection surface is formed,
As the nozzle chip, a first nozzle chip having a surface property having a first light reflection characteristic whose side surface reflects the first illumination light, and at least the suction surface absorbs the second illumination light. Any one of the second nozzle chips having a surface property having the second light reflection characteristic is selectively attached to the nozzle body according to the recognition method.   The suction nozzle according to claim 1, wherein a detection surface that can be detected by a reflective optical sensor is provided on an upper surface of the nozzle body.

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