JP2008277689A - Light emitting device and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light emitting device in which a vertical electrode version light emitting diode is connected between a metal board and an upper metal plate, and a method of manufacturing the light emitting device. <P>SOLUTION: In the light emitting device, between the metal board connecting a power supply and the upper metal plate, there is bonded a reflective frame which has a reflective opening and is composed of an insulating member. With respect to the upper metal plate, there are formed an irradiation opening having almost the same capacity as the reflective opening and at least one bending connecting piece which is bent from the irradiation opening and continuously arranged. On the metal board, at least one vertical electrode version light emitting diode is connected in the reflective frame. One side of a conductive connecting member is connected to an upper part electrode of the vertical electrode version light emitting diode, and the other side is connected to the bending connecting piece. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a light emitting device in which upper and lower electrode type light emitting diodes are connected between a metal substrate and a metal plate, and a method for manufacturing the light emitting device. The present invention is easy to manufacture and allows a large current to flow through the upper and lower electrode type light emitting diodes. The light emission taking into consideration the heat dissipation generated at that time or the expansion and contraction of the metal member due to the thermal stress due to the heat. The present invention relates to a device and a method for manufacturing a light-emitting device. In addition, the present invention can prevent damage to the light emitting layer due to vibration or heat by connecting a gold wire to a conductive connecting member made of a metal plate member by eutectic solder instead of connecting by wire bonding. The present invention relates to a light emitting device including a light emitting diode and a method for manufacturing the light emitting device.

  FIG. 7 is a diagram for explaining a conventional example, and is an example in which upper and lower electrode type light emitting diodes are provided in a reflection frame. In FIG. 7, the lower electrode of the upper and lower electrode type light emitting diode 41 is bonded on one metal substrate 72. The upper electrode of the upper and lower electrode type light emitting diode 71 is joined to the other metal substrate 74 separated by the one metal substrate 72 and the insulating member 73 by wire bonding 75. The separated metal substrates 72 and 74 are integrally held by a reflection frame 76.

  The upper and lower electrode type light emitting diodes 71 are sealed in the reflection frame 76 by a sealing material 77. The sealing material 77 is filled up to the upper surface of the reflection frame 76, and a fluorescent film 78 and a transparent protective film 79 are formed thereon.

In a light emitting device described in Japanese Patent Application Laid-Open No. 2007-27585, a light emitting diode is provided on a substrate, and after sealing the light emitting diode with a sealing material, a phosphor layer is provided on the sealing material. ing.
JP 2007-27585 A

  When the sealing materials described in the conventional example and the patent publication are shrunk by heat or the like, a space is formed between the sealing material and the phosphor film. When the air in the space expands due to heat generated from the light emitting diode, there is no escape route, and the phosphor film is cracked or turned up. Further, when the light emitting diode is not filled in the entire reflective frame with the sealing material, but only the upper part is sealed, the distance of light passing through the phosphors of different colors is different, resulting in color unevenness. Does not emit light in the desired color.

  The light emitting diode attached to the metal substrate having the slits shown in FIG. 7 is sealed with a transparent resin, and one having high hardness is used in order to give strength with the transparent resin. However, the sealing material having a high hardness has a problem that the thermal stress generated from the light emitting diode is large. The thermal stress may break the wiring that supplies power to the light emitting diode.

  In the light emitting device shown in FIG. 7, the sealing material and the fluorescent film, and the fluorescent film and the transparent protective film are bonded to each other in a semi-cured state. In the light-emitting device, the sealing material, the fluorescent film, and the transparent protective film are each adhered well, but when being in a cured state, stress based on shrinkage is applied. That is, the sealing material is bent during the contraction. Since the fluorescent film is pulled in accordance with the curvature of the sealing material, a crack may be generated, turned up, or ruptured.

  In order to solve the problems as described above, the present invention is based on the fact that the phosphor-containing film cracks or is caused by the stress or by the expansion of the air accumulated in the space formed between the sealing material and the phosphor-containing film. It is an object of the present invention to provide a light-emitting device in which no turning or the like occurs and a method for manufacturing the light-emitting device. An object of the present invention is to provide a light-emitting device and a method for manufacturing the light-emitting device that are excellent in assembly and mass productivity, can withstand a large current and thermal stress, and are held at high strength.

(First invention)
The light-emitting device of the present invention is attached to the upper part of the reflective frame made of a metal substrate, an insulating member having a reflective opening bonded to the metal substrate, and substantially the same size as the reflective opening. And an upper metal plate composed of an irradiation opening for irradiating the light and at least one bent connection piece provided continuously to the irradiation opening, and at least a lower electrode is attached to the metal substrate inside the reflection frame One upper and lower electrode type light emitting diode, at least one conductive connecting member connecting the upper electrode of the upper and lower electrode type light emitting diode and the bent connecting piece, the lower electrode of the metal substrate and the upper and lower electrode type light emitting diode The upper electrode of the upper and lower electrode type light emitting diodes and the conductive connection member, and eutectic solder for connecting the conductive connection member and the bent connection piece. Characterized in that it is.

(Second invention)
In the light emitting device of the second invention, a plurality of the reflection frames of the first invention are bonded to the metal substrate, and the upper metal plate of the first invention corresponds to each of the reflection frames and the irradiation opening and at least one bent connection. A piece is formed, and at least one upper and lower electrode type light emitting diode is attached to a metal substrate inside each reflection frame.

(Third invention)
A light emitting device according to a third aspect is characterized in that the bent connection piece according to the first aspect or the second aspect comprises a plate-like member bent along the inner surface of the reflection frame.

(Fourth invention)
The light emitting device of the fourth invention is characterized in that the conductive connecting member of the first to third inventions comprises a gold wire ribbon.

(Fifth invention)
The light emitting device of the fifth invention is characterized in that the light emitting unit units composed of one reflecting frame in the first to fourth inventions are connected in series, parallel, or series-parallel.

(Sixth invention)
The light emitting device of the sixth invention is characterized in that a material for sealing the upper and lower electrode type light emitting diodes is provided in the reflection frame of the first to fifth inventions.

(Seventh invention)
In the light emitting device of the seventh invention, at least one phosphor that converts light emitted from the upper and lower electrode type light emitting diodes into substantially white is contained in the irradiation opening or the upper surface of the upper metal plate of the first to sixth inventions. A fluorescent film is attached.

(Eighth invention)
According to an eighth aspect of the present invention, there is provided a method for manufacturing a light emitting device, comprising: attaching a reflective frame made of an insulating member having a reflective opening on a metal substrate; and irradiating a metal plate with light having substantially the same size as the reflective opening. A step of attaching an upper metal plate having an irradiation opening and a bent connecting piece provided continuously to the irradiation opening to the upper part of the reflection frame, a metal substrate inside the reflection frame, and upper and lower electrode type light emitting diodes The lower electrode, the upper electrode of the upper and lower electrode type light emitting diode and the conductive connecting member, and the step of connecting the conductive connecting member and the bent connecting piece with eutectic solder are at least configured. .

(9th invention)
According to a ninth aspect of the present invention, there is provided a light emitting device manufacturing method in which a plurality of reflecting frames in the eighth invention are bonded to the metal substrate, and the upper metal plate has the irradiation opening and the bent connecting piece corresponding to each reflecting frame. An upper and lower electrode type light emitting diode is mounted on a metal substrate on the inner surface of each reflector.

(10th invention)
According to a tenth aspect of the present invention, there is provided a method for manufacturing a light emitting device, comprising the step of filling a sealing material for sealing the upper and lower electrode type light emitting diodes in the reflection frame of the eighth or ninth aspect.

(11th invention)
According to an eleventh aspect of the present invention, there is provided a method for manufacturing a light emitting device, wherein at least one of the light emitted from the upper and lower electrode type light emitting diodes is converted into substantially white light on the irradiation opening or the upper surface of the upper metal plate of the eighth to tenth aspects. It has the process to which the fluorescent film containing a fluorescent substance is attached.

  According to the present invention, since the upper and lower electrode type light emitting diodes are provided so as to be sandwiched between the metal substrate and the upper metal plate, the heat dissipation is excellent, a large current can be passed, and the light emission with high luminance is achieved. A device can be obtained. In addition, since the conductive connecting member and the bent connecting piece for joining the upper metal plate and the upper electrode of the upper and lower electrode type light emitting diode are not a wire bonding but a plate-like member, heat dissipation is good, A high-luminance light-emitting device can be obtained. Further, since the conductive connecting member and the bent connecting piece are made of plate-like members, they are resistant to vibrations, and even if the sealing material is omitted, the connecting portion does not break.

  According to the present invention, fabrication of a package made of a metal substrate, a reflective frame, and an upper metal plate, bonding of upper and lower electrode type light emitting diodes, conductive connection members, or bent connection pieces by eutectic solder, In addition to providing a sealing material and / or a phosphor-containing film separately, the light emitting device and the method for manufacturing the light emitting device can be obtained efficiently and reliably. By changing the capacitance of the upper and lower electrode type light emitting diodes or the phosphor-containing film, a light emitting device that emits light of a color that meets the needs can be obtained.

  According to the present invention, a space can be provided between the phosphor-containing film and the sealing material, and there is a thermal stress generated when the phosphor-containing film and the sealing material are cured from a semi-cured state. However, it is possible to eliminate cracks, turns, ruptures, and the like in the phosphor-containing film.

  According to the present invention, since wire bonding or the like is not used, it is possible to obtain a light-emitting device that is not only highly reliable for a long period of time but also inexpensive and excellent in mass production.

  According to the present invention, since eutectic solder is used for each joint, for example, normal solder can be used for connection to other printed wiring boards and the like, and the joint and / or the light emitting layer can be used. Thus, a light-emitting device composed of upper and lower electrode type light-emitting diodes free from defective products can be obtained.

(First invention)
In the light emitting device of the first invention, the upper and lower electrode type light emitting diodes are provided between the metal substrate to which the power source is connected and the upper metal plate. A reflective frame made of an insulating member having a reflective opening is bonded between the metal substrate and the upper metal plate by an adhesive made of, for example, a thermosetting resin. The reflection frame is provided with a member that reflects on the inner surface, and irradiates light from the upper and lower electrode type light emitting diodes forward. The upper metal plate is attached to an upper portion of the reflection frame, and has an irradiation opening portion having substantially the same size as the reflection opening portion, and at least one plate-like bent continuously provided to be bent from the irradiation opening portion. The connecting piece is molded.

  On the metal substrate inside the reflection frame, at least one lower electrode type light emitting diode lower electrode is attached by eutectic solder, for example. The upper electrode of the upper and lower electrode type light emitting diode is connected to one of at least one conductive connecting member by eutectic solder. The other of the conductive connecting members is connected to the bent connecting piece by eutectic solder. The connection process using the eutectic solder can be performed simultaneously. The reflection frame is filled with a sealing material as necessary, and the upper and lower electrode type light emitting diodes and the conductive connection member are sealed. If necessary, a phosphor-containing film is provided on the opening surface of the reflection frame, and light emitted from the upper and lower electrode type light emitting diodes can be converted into light of a desired color.

  The light-emitting device can separate a package portion made of a metal substrate, a reflection frame, and an upper metal plate from a light-emitting portion made of an upper and lower electrode type light-emitting diode, a conductive connection member, and a phosphor-containing film. You can make use of your expertise.

(Second invention)
In the light emitting device of the second invention, a plurality of reflection frames are bonded on a metal substrate. The upper metal plate is formed with an irradiation opening and at least one bent connection piece corresponding to each reflection frame. Further, each reflection frame has at least one upper and lower electrode type light emitting diode mounted on an internal metal substrate. That is, in the second light emitting device, a plurality of reflecting frames are bonded between the metal substrate and the upper metal plate, and at least one upper and lower electrode type light emitting diode is provided in each reflecting frame via at least one bent connecting piece. It has been. The light emitting device can obtain a line light source or a surface light source.

(Third invention)
In the light emitting device according to the third aspect of the invention, the bent connecting piece formed continuously from the upper metal plate is bent along the inner surface of the reflecting frame. Since the bent connecting piece is provided along the inner surface of the reflecting frame, it does not interfere with the light emitted from the upper and lower electrode type light emitting diodes, so that the efficiency is high.

(Fourth invention)
In the light emitting device according to the fourth aspect of the present invention, the conductive connecting member according to the first to third aspects of the present invention is composed of a substantially rectangular gold wire ribbon. For example, the gold wire ribbon can be formed in a thin strip shape instead of having two arm-shaped connecting portions. The gold wire ribbon has less processing effort, is easy to bend, and has eutectic solder more easily than a gold-plated copper. In addition, since the gold wire ribbon has a narrow width that can be easily processed by eutectic soldering, it does not create a shadow of light emitted from the upper and lower electrode type light emitting diodes, but also has an advantage that a large current can flow reliably. is there. The gold wire ribbon has a width of 0.1 mm to 0.2 mm and a thickness of 0.025 mm, for example. The gold ribbon is easily formed into a shape that can be easily connected to the bent connection piece or the upper electrode of the upper and lower electrode type light emitting diode.

(Fifth invention)
A light emitting device according to a fifth aspect of the present invention is provided with a plurality of light emitting unit units composed of a single reflection frame between the metal substrate and the upper metal plate, and these light emitting unit units are electrically connected in series, in parallel, Or it can be easily made the thing of desired brightness or a magnitude | size by connecting in series and parallel. In the light emitting device according to the fifth aspect of the present invention, a package including a reflection frame attached between the metal substrate and the upper metal plate is a unit of the light emitting unit. The light emitting unit of one unit can be a light emitting device with high luminance by providing a plurality of upper and lower electrode type light emitting diodes and connecting them in parallel. Further, the light emitting unit composed of the upper and lower electrode type light emitting diodes, the conductive connection member, the sealing material, and the phosphor-containing film can be attached in a plurality of rows and / or columns. can do.

(Sixth invention)
In the light emitting device according to the sixth aspect of the invention, since the inside of the reflection frame is filled with a sealing material for sealing the upper and lower electrode type light emitting diodes and the conductive connecting member and / or the bent connecting piece is fixed, Can be strong.

(Seventh invention)
A light emitting device according to a seventh aspect of the present invention includes at least one phosphor that converts light emitted from the upper and lower electrode type light emitting diodes into substantially white light on an irradiation opening of an upper metal plate or on an upper surface of the upper metal plate. A fluorescent film is attached. The light emitting device can be used as a normal lighting device because the fluorescent film converts the light of the upper and lower electrode type light emitting diodes into white. In addition, the fluorescent film may be attached to the upper metal plate after being attached to the frame.

(Eighth invention)
The light emitting device manufacturing method according to the eighth aspect of the present invention is such that the assembly of the package, the attachment of the upper and lower electrode type light emitting diodes, and the like can be performed by companies in their respective specialized fields. In the first step, a reflective frame made of an insulating member having a reflective opening that reflects light on a metal substrate made of copper, aluminum, iron, or an alloy thereof is bonded with, for example, an adhesive made of a thermosetting resin. Glued. In the second step, at least one bent connecting piece continuously provided downward from the irradiation opening and the irradiation opening having the same size as the reflection opening is formed on the upper metal plate by, for example, pressing. Molded.

  Moreover, the upper metal plate shape | molded at the 2nd process is attached on the reflective frame obtained at the 1st process. In the third step, the lower electrode of the lower electrode type light emitting diode is placed on the metal substrate inside the reflecting frame, and the upper electrode of the upper and lower electrode type light emitting diode and the bent connection piece are shared by the conductive connecting member. Each is connected using crystal solder. In addition, the upper and lower electrode type light emitting diodes, the bent connection pieces, and the conductive connection members in the reflection frame may be plural. In the second step, the pressing step and the upper metal plate attaching step can be performed separately.

(9th invention)
The method for manufacturing a light emitting device according to the ninth invention differs from that according to the ninth invention in that a plurality of reflecting frames are bonded on a metal substrate. That is, the upper metal plate is formed with bent connection pieces corresponding to the number of the upper and lower electrode type light emitting diodes provided in the reflection frame and the irradiation opening for irradiating light corresponding to each of the reflection frames. Thereafter, the upper and lower electrode type light emitting diodes are connected to the inside of each of the reflection frames by a bent connection piece of the upper metal plate and a conductive connection member.

(10th invention)
According to a tenth aspect of the present invention, there is provided a light emitting device manufacturing method comprising: a sealing material for fixing an upper electrode, a conductive connecting member, and a bent connecting piece of the upper and lower electrode type light emitting diodes in the reflecting frame; Is filled.

(11th invention)
According to an eleventh aspect of the present invention, there is provided a method for manufacturing a light emitting device, wherein a phosphor-containing film is provided on an irradiation opening of the upper metal plate or on the upper metal plate. The phosphor-containing film converts light emitted from the upper and lower electrode type light emitting diodes into almost white, and is composed of at least one phosphor film. The upper and lower electrode type light emitting diodes are blue light emitting diodes or ultraviolet light emitting diodes, and in the case of blue light emitting diodes, by using a fluorescent film containing a phosphor that absorbs blue and colors green and red, Combined with blue, almost white light comes out. In the case of an ultraviolet light emitting diode, a phosphor film containing a phosphor that absorbs ultraviolet rays and develops blue, green, and red colors produces a substantially white color, or a phosphor that absorbs ultraviolet rays and colors blue. Even if a phosphor that absorbs ultraviolet rays and the blue color to develop green and red is used, almost white light can be emitted.

  FIGS. 1A to 1C show a first embodiment of the present invention. FIG. 1A is a schematic cross-sectional view for explaining a light emitting device in which upper and lower electrode type light emitting diodes are mounted between a metal substrate and an upper metal plate. FIGS. 4A and 4B are plan views of the light emitting device, and FIG. 3C is a schematic cross-sectional view of a modified example for explaining a state where two upper and lower electrode type light emitting diodes are attached. Schematic diagrams according to embodiments of the present invention may differ from actual dimensional ratios. 1 (a) and 1 (b), a light emitting device 11 includes a package made up of a metal substrate 12, a reflection frame 13, and an upper metal plate 14, and upper and lower electrode type light emission bonded onto the metal substrate 12 inside the package. The diode 15, the bent connection piece 142 that is bent and provided along the reflection frame 13 from the upper metal plate 14, and the bent connection piece 142 and the upper electrode 152 of the upper and lower electrode type light emitting diode 15 are connected. At least the conductive connecting member 16, the sealing material 17, and the phosphor-containing film 18 are configured. The upper metal plate 14 is made thinner than the metal substrate 12, but has a thickness that does not burn out even when a current of about 1 A is applied. The conductive connecting member 16 can be, for example, a strip-shaped gold wire ribbon.

  The metal substrate 12, the upper metal plate 14, and the conductive connecting member 16 are made of iron, aluminum, copper, or an alloy thereof, and are plated with gold and / or silver as necessary. The plating not only can efficiently irradiate light from the upper and lower electrode type light emitting diodes, but is also suitable for eutectic solder processing, and a highly reliable light emitting device can be obtained. Gold and / or silver plating at the joint not only improves wettability, but can simultaneously achieve three things: improved electrical conductivity and light reflectivity.

  In addition, the metal substrate 12 has a reflection frame 13 made of an insulating member such as a circle, an ellipse, or a rectangle connected to the top thereof by, for example, a thermosetting adhesive. An upper metal plate 14 is similarly connected to the upper part of the reflection frame 13 by a thermosetting adhesive. The reflection frame 13 may be coated with a member that reflects light on the inner surface thereof as necessary. The upper metal plate 14 has an irradiation opening substantially the same size as the reflection opening of the reflection frame 13, and is a bent connection continuously provided so as to be bent along the reflection frame 13 from the irradiation opening. The piece 142 is formed by pressing, for example. The shape of the bent connecting piece 142 is arbitrary, but it is a plate shape that can be easily connected to a conductive connecting member, which will be described later, and light irradiation from the upper and lower electrode type light emitting diodes does not get in the way.

  The bent connecting piece 142 is joined to the upper electrode 152 of the upper / lower electrode type light emitting diode 15 by eutectic solder or the like through the conductive connecting member 16 which is plate-shaped at the time of molding. The shapes of the conductive connecting member 16 and the bent connecting piece 142 have the following modifications. The upper metal plate 14 forms the bent connection piece 142 and at the same time forms an irradiation opening having the same size as the reflection opening of the reflection frame 13 so that light from the upper and lower electrode type light emitting diodes is emitted. It is molded into a shape that does not reduce it.

  The reflection frame 13 is filled with a translucent sealing material 17 that seals the upper and lower electrode type light emitting diodes 15 and the conductive connection member 16. The reflection frame 13 is provided with a phosphor-containing film 18 and the like. Since the sealing material 17 and the phosphor-containing film 18 are filled or attached in a semi-cured state, the sealing material 17 and the phosphor-containing film 18 may be pulled with each other during the curing, and may be cracked or turned up. Therefore, it is preferable to provide a space between the sealing material 17 and the phosphor-containing film 18 that does not contact each other after being cured.

  One or both of the sealing material 17 and the phosphor-containing film body 18 can be omitted as necessary. For example, since the conductive connecting member 16 and the bent connecting piece 142 are plate-shaped, the adhesive material made of eutectic solder is not peeled off against normal vibration, so the sealing material 17 can be omitted. it can. The phosphor-containing film 18 can be omitted when the color of light emitted from the upper and lower electrode type light emitting diodes is a desired color.

  When the one-pack or two-pack condensation type liquid silicone adhesive blended with a special filler is used to increase the thermal conductivity, the sealing material 17 is in a paste state when uncured and reacts with moisture in the air to form a trace amount. It cures while releasing the condensate. Moreover, the said sealing material 17 can use Shin-Etsu Chemical Co., Ltd. transparent sealing resin SCR-1011 for photo devices, for example. The sealing material 17 may be an elastomer or a resin type. The elastomer or resin type resin should have a hardness of Shore A (rubber hardness) of 15 to 85, preferably 20 to 80. Furthermore, the sealing material 17 is preferably an elastomer or resin type made of a silicon-based resin.

  The metal substrate 12 and the upper metal plate 14 are, for example, square 10 mm × 10 mm, and the size of the upper and lower electrode type light emitting diodes 11 is 1.0 mm × 1.0 mm, 0.7 mm × 0.7 mm, or 0 .5 mm x 0.5 mm and a thickness of 0.15 mm.

  The metal substrate 12 is subjected to gold and / or silver plating on the surface as necessary. Next, the upper metal plate 14 is formed with the opening 141 and the bent connection piece 142. Then, the metal substrate 12 and the upper metal plate 14 are bonded with a thermosetting adhesive so that the reflective frame 13 can be inserted into a package.

  A lower electrode 151 of the upper and lower electrode type light emitting diode 15 is mounted on the metal substrate 12 through eutectic solder or the like. The conductive connecting member 16 is disposed on the upper electrode 152 of the upper and lower electrode type light emitting diode 11 through eutectic solder. Further, eutectic solder or the like is placed between the other end of the conductive connecting member 16 and the bent connecting piece 142. The eutectic solder is heated and melted by passing through a reflow furnace, and the respective joints are joined simultaneously.

  Next, the sealing material 17 is sealed inside the reflection frame 13, a space is provided on the upper portion thereof, and the phosphor-containing film 18 is provided. The light emitting device 11 can obtain light of a desired color by changing the phosphor-containing film 18.

  The light emitting device described in FIG. 1C is an example different from FIGS. 1A and 1B, and the number of upper and lower electrode type light emitting diodes provided in the package is different. In FIG. 1C, the lower electrodes of the upper and lower electrode type light emitting diodes 15 and 15 ′ are joined to the upper surface of the metal substrate 12. Conductive connection members 16, 16 'are joined to the upper electrodes of the upper and lower electrode type light emitting diodes 15, 15'. Further, the bent connection pieces 142 and 142 'of the upper metal plate 14 are joined to the conductive connection members 16 and 16'. Since the upper and lower electrode type light emitting diodes 15 and 15 'are connected in parallel to the metal substrate 12 and the upper metal plate 14, the number thereof can be arbitrarily increased and the luminance can be increased. Can do. The light-emitting device shown in FIG. 1C has two upper and lower electrode type light-emitting diodes, but the number can be increased as necessary.

  FIG. 2 is a schematic sectional view for explaining an example in which a package having at least one upper and lower electrode type light emitting diode is provided between a metal substrate and an upper metal plate in a second embodiment of the present invention. In FIG. 2, in the light emitting device 21, reflection frames 23-1, 23-2, 23-3, and 23-4 are attached between a metal substrate 22 and an upper upper metal plate 24 by a thermosetting adhesive. . In addition, the upper metal plate 24 is formed into bent connection pieces 24-1, 24-2, 24-3, and 24-4 that are plate-like and bent along the slope of the reflecting frame, for example, by pressing. ing. The upper upper metal plate 24 irradiates light from the upper and lower electrode type light emitting diodes 25 when forming the bent connection pieces 24-1, 24-2, 24-3, 24-4. Are molded simultaneously or in multiple stages.

  Lower electrodes of upper and lower electrode type light emitting diodes 25-1, 25-2, 25-3, and 25-4 are bonded to the upper surface of the metal substrate 22 through eutectic solder. The upper electrodes of the upper and lower electrode type light emitting diodes 25-1, 25-2, 25-3, and 25-4 are bent and connected through conductive connection members 26-1, 26-2, 26-3, and 26-4. The pieces 24-1, 24-2, 24-3, and 24-4 are bonded to each other by eutectic solder. The light emitting device 21 shown in FIG. 2 can be provided with at least one upper and lower electrode type light emitting diode as a unit in columns and / or rows.

  FIGS. 3 (a) and 3 (b) show a third embodiment of the present invention. FIG. 3 (a) shows a light emitting device in which at least one upper and lower electrode type light emitting diode is attached between a metal substrate and an upper metal plate. (B) is a plan view of the light emitting device. 3A and 3B, the light emitting device 31 is a first embodiment in that a metal substrate 32 made of a heat sink and a phosphor-containing film mounting frame 38 provided with a phosphor-containing film 381 are provided. This is different from the example and the second embodiment. The metal substrate 32 has a large number of heat dissipating fins 321 at a lower portion thereof to serve as a heat sink. A well-known or publicly known metal substrate with a heat sink can be used.

  The phosphor-containing film attachment frame 38 includes, for example, a phosphor-containing film body attachment concave portion 382 for attaching the phosphor-containing film body 381 to the upper portion and an attachment concave portion 383 for attaching to the upper metal plate 34 at the lower portion. The phosphor-containing film attachment frame 38 is previously attached with a phosphor-containing film 381 that produces a desired color. The light emitting device 31 is completed by covering the phosphor-containing film mounting frame 38 from above after the upper and lower electrode type light emitting diodes 35 and the like are mounted on the package. The shape of the phosphor-containing film attachment frame 38 may be any shape as long as the phosphor-containing film 381 is attached and attached to the upper metal plate 34 or the reflection frame 13.

  The light emitting device 31 is electrically conductive with the bent connection piece 342 formed on the metal substrate 32 and the upper metal plate 34 formed of a heat sink even when a large current flows through at least one of the upper and lower electrode type light emitting diodes 35. Since the connection member 36 has a plate shape, heat dissipation is good, a large current can flow, and high luminance can be obtained.

  FIG. 4 is a schematic sectional view for explaining an example in which a package having at least one upper and lower electrode type light emitting diode is provided between a metal substrate and an upper metal plate in a fourth embodiment of the present invention. In FIG. 4, the light emitting device 41 includes metal substrates 42-1 and 42-2 in which reflection frames 43-1, 43-2, 43-3, and 43-4 are heat sinks, and the upper metal plates 44-1, 44. -2 and 44-3 are different from the second embodiment of the present invention in that they are attached by a thermosetting adhesive.

  The metal substrate 42-1 and the metal substrate 42-2 are electrically separated by an insulating member. The upper metal plates 44-1, 44-2, 44-3 are electrically separated by insulating members 444, 445. The electrical separation is only different when connecting the upper and lower electrode type light emitting diodes 45 in series and / or in parallel. The insulating members 444 and 445 are portions without a package, and only one of the upper and lower sides is separated, and therefore, the insulating members 444 and 445 are connected to one of the metal substrate 42 and the upper metal plate 44 via an insulating member (not shown). In the light emitting devices according to the first to fourth embodiments, the metal substrate, the upper metal plate, the number of upper and lower electrode type light emitting diodes, the phosphor-containing film mounting frame, and the package are connected in series and / or in parallel. These forms can be arbitrarily combined.

  FIG. 5 is a schematic plan view for explaining an example of a surface light source in which at least one upper and lower electrode type light emitting diode is mounted between a metal substrate and an upper metal plate according to a fifth embodiment of the present invention. It is. In FIG. 5, for example, the metal substrates 52-1, 52-2, and 52-3 are electrically separated by an insulating member (not shown). Similarly, the upper metal plates 54-1, 54-2, 54-3 are electrically separated by insulating members 54-4, 54-5. Further, between the metal substrates 52-1, 52-2, 52-3 and the upper metal plates 54-1, 54-2, 54-3, reflection frames 53-1 to 53-12, upper and lower Electrode light emitting diodes 55-1 to 55-12 are mounted in the same manner as in the other examples.

  The current flows from the input terminal 52-6 through a metal substrate (not shown) to the lower electrode of each upper / lower electrode type light emitting diode, the upper / lower electrode type light emitting diode, the upper electrode of the upper / lower electrode type light emitting diode, the conductive connection member, The bent connecting piece flows to the upper metal plate 54-1. The upper metal plate 54-1 is connected to the electrically separated upper metal plate 54-2 by a connection terminal 54-7. The upper metal plate 54-2 is connected to a metal substrate (not shown) through the upper and lower electrode type light emitting diodes. The metal substrate is connected to a metal substrate (not shown) by a connection terminal 52-8. The current flows from a metal substrate (not shown) from the upper metal plate 54-3 to the output terminal 54-9 via the upper and lower electrode type light emitting diodes.

  In Example 1 to Example 5, the connection between the upper metal plate 14 and the upper electrode 152 of the upper and lower electrode type light emitting diode 15 is performed by connecting the bent connection piece 142 formed on the upper metal plate 14 and the conductive connection member 16. However, the conductive connecting member 16 may be omitted, and the bent connecting piece 142 may be directly connected to the upper electrode 152 of the upper and lower electrode type light emitting diode 15.

  FIGS. 6A and 6B are perspective views for explaining a connection state between the bending connection piece of the present invention and the conductive connection member. In FIG. 6A, an upper metal plate 14 includes an opening 141, a bent portion 142 provided continuously from the opening 141, bent along a reflection frame, and a substantially horizontal portion provided continuously to the bent portion 142. 143. The conductive connecting member 16 is composed of an end portion 161 that is formed substantially at a right angle to a portion that is connected to the substantially horizontal portion 143. The conductive connection member 16 includes two arm-shaped connection portions 163 and an opening 162 provided between the arm-shaped connection portions 163. The two arm-like connection parts 163 and the opening parts 162 efficiently irradiate the upper part with light emitted from the side parts of the upper and lower electrode type light emitting diodes 15.

  In FIG. 6B, an upper metal plate 64 includes an opening 61, a bent portion 65 provided continuously from the opening 61, bent along a reflection frame, and a substantially horizontal portion provided continuously to the bent portion 65. 66, and a curved portion 67 connected to the horizontal portion 66. The conductive connecting member 68, a curved portion 681 having substantially the same shape connected to the curved portion 67, and an L-shaped contact portion 682 formed at a substantially right angle from the curved portion 681. The conductive connecting member 68 is provided with two arm-shaped connecting portions and an opening at the tip of the L-shaped contact portion 682. The two arm-shaped connection portions and the opening portion efficiently irradiate the light emitted from the side portion of the upper and lower electrode type light emitting diode 15 to the upper portion.

  The conductive connecting members 16 and 68 are shaped so as to easily come into contact with the bent connecting pieces and the electrodes of the upper and lower electrode type light emitting diodes 15 and light emitted from the side portions of the upper and lower electrode type light emitting diodes 15. Is radiated to the outside, and the light is efficiently radiated to the outside. Since the conductive connecting members 16 and 68 are plate-like members, they can flow a large current and are themselves reflective members.

  The upper and lower electrode type light emitting diode 15 is a gallium nitride based upper and lower electrode type light emitting diode, and has, for example, an active layer between a p-type gallium nitride semiconductor layer and an n-type gallium nitride semiconductor layer. The gallium nitride-based upper / lower electrode type light emitting diode can obtain high luminance by flowing a large current.

Comparative example

  The conventional gallium nitride upper / lower electrode type light emitting diode in which gold wires are connected by ultrasonic waves and the gallium nitride upper / lower electrode type light emitting diode of the present invention joined by eutectic solder and a metal member will be compared. In the conventional example, two gold wires with a diameter of 30 μm are used, and light emission failure is caused by ultrasonic vibration of a wire bonder in which the upper electrode of the gallium nitride upper and lower electrode type light emitting diode and the other of the metal substrate are connected by ultrasonic wire bonding. About 10% of defective products occurred. Furthermore, when 350 mA was energized, burning due to an energization abnormality of about 4% occurred. In the examples of the present invention, no defective product was generated even in the connection step and in the energization of 350 mA to 500 mA.

  As mentioned above, although the Example of this invention was explained in full detail, this invention is not limited to the said Example. The present invention can be modified in various ways without departing from the scope of the claims. Although this embodiment has been described with a pair of insulated metal substrates or substrate electrodes, it goes without saying that a plurality of light emitting diodes and metal substrates, etc., can be used to form a light emitting device connected in series and / or in parallel. It is not. The upper and lower electrodes of the upper and lower electrode type light emitting diode of the present invention, the metal substrate, the metal member, etc. are connected by eutectic solder, eutectic solder paste, eutectic solder and flux, gold-tin eutectic solder paste, indium eutectic solder A publicly known or well-known thing can be used. The eutectic solder includes, for example, gold and tin (20%), gold and tin (90%), gold and silica (3.15%), gold and germanium (12%), and others, tin-copper-nickel system , Tin-silver, tin-silver-copper, tin-silver-bismuth-indium, and tin-zinc eutectic solder. As the upper and lower electrode type light emitting diodes of the present invention, known or known ones can be used as described above. A well-known or well-known hard resin part, sealing material, phosphor-containing film, and upper and lower electrode type light emitting diodes used in the present invention can be used.

(A) to (c) is a first embodiment of the present invention, and (b) is a schematic cross-sectional view for explaining a light emitting device in which upper and lower electrode type light emitting diodes are attached between a metal substrate and an upper metal plate, (B) is a plan view of the light-emitting device, and (C) is a schematic cross-sectional view of a modified example for explaining a state in which two upper and lower electrode type light-emitting diodes are attached. Example 1 FIG. 6 is a schematic cross-sectional view for explaining an example in which a package having at least one upper and lower electrode type light emitting diode is provided between a metal substrate and an upper metal plate in a second embodiment of the present invention. (Example 2) (A) and (B) are the third embodiment of the present invention, and (B) is an outline for explaining a light emitting device in which at least one upper and lower electrode type light emitting diode is attached between the metal substrate and the upper metal plate. Sectional drawing (B) is a plan view of the light emitting device. (Example 3) FIG. 10 is a schematic cross-sectional view for explaining an example in which a package having at least one upper and lower electrode type light emitting diode is provided between a metal substrate and an upper metal plate in a fourth embodiment of the present invention. Example 4 FIG. 10 is a schematic plan view for explaining an example of a surface light source in which a package having at least one upper / lower electrode type light emitting diode is provided between a metal substrate and an upper metal plate in a fifth embodiment of the present invention. (Example 5) (A) And (b) is a perspective view for demonstrating the connection state of the bending connection piece and electroconductive connection member of this invention. This is for explaining a conventional example, in which an upper and lower electrode type light emitting diode is provided on a reflection frame.

Explanation of symbols

11, 21, 31, 41, 51 ... Light-emitting device 12, 22, 32, 42, 52 ... Metal substrate 13, 23, 33, 43, 53 ... Reflecting frame 14, 24, 34, 44, 54 ... upper metal plate 141 ... opening 142, 47 ... bent connection piece 15, 25, 35, 45, 55 ... upper and lower electrode type light emitting diode 151 ... lower electrode 152 ... upper part Electrodes 16, 26, 36, 46 ... conductive connecting members 17, 27, 37 ... sealing material 18, 28, 381, 481 ... phosphor-containing film (phosphor-containing film mounting frame)
38 ... Phosphor-containing film mounting frame 39 ... Space

Claims (11)

A metal substrate;
A reflective frame made of an insulating member having a reflective opening bonded to the metal substrate;
An upper metal plate, which is attached to the upper part of the reflection frame, and which includes an irradiation opening for irradiating light having substantially the same size as the reflection opening, and at least one bent connecting piece provided continuously to the irradiation opening; ,
At least one upper and lower electrode type light emitting diode having a lower electrode attached to a metal substrate inside the reflective frame;
At least one conductive connection member connecting the upper electrode of the upper and lower electrode type light emitting diode and the bent connection piece;
The metal substrate and the lower electrode of the upper and lower electrode type light emitting diode, the upper electrode of the upper and lower electrode type light emitting diode and the conductive connecting member, and the eutectic solder for connecting the conductive connecting member and the bent connecting piece; ,
A light emitting device comprising: A plurality of the reflective frames are bonded to the metal substrate;
The upper metal plate is formed with the irradiation opening and at least one bent connection piece corresponding to each reflection frame, and at least one upper and lower electrode type light emitting diode is attached to a metal substrate inside each reflection frame. The light-emitting device according to claim 1.   3. The light emitting device according to claim 1, wherein the bent connection piece includes a plate-like member bent along an inner surface of the reflection frame.   The light emitting device according to any one of claims 1 to 3, wherein the conductive connection member is made of a gold wire ribbon.   The light emitting device according to any one of claims 1 to 4, wherein the light emitting unit composed of the one reflecting frame is connected in series, parallel, or series-parallel.   The light emitting device according to claim 1, wherein a material for sealing the upper and lower electrode type light emitting diodes is provided in the reflection frame.   A fluorescent film containing at least one phosphor that converts light emitted from the upper and lower electrode type light emitting diodes into substantially white light is attached to an irradiation opening of the upper metal plate or an upper surface thereof. The light emitting device according to any one of claims 1 to 6. Bonding a reflective frame made of an insulating member having a reflective opening on a metal substrate;
A step of attaching an upper metal plate having an irradiation opening of substantially the same size as the reflection opening to the upper metal plate and a bent connection piece provided continuously to the irradiation opening on the upper part of the reflection frame;
The metal substrate inside the reflection frame and the lower electrode of the upper and lower electrode type light emitting diode, the upper electrode of the upper and lower electrode type light emitting diode and the conductive connection member, and the conductive connection member and the bent connection piece are connected by eutectic solder. And a process of
A method for manufacturing a light emitting device, comprising: A plurality of the reflective frames are bonded to the metal substrate;
The upper metal plate is formed with the irradiation opening and the bent connection piece corresponding to each reflection frame, and upper and lower electrode type light emitting diodes are attached to the metal substrate on the inner surface of each reflection frame. Item 9. A method for manufacturing a light-emitting device according to Item 8.   10. The method for manufacturing a light emitting device according to claim 8, wherein the reflective frame includes a step of filling a sealing material for sealing the upper and lower electrode type light emitting diodes. 11.   And a step of attaching a fluorescent film containing at least one phosphor for converting light emitted from the upper and lower electrode type light emitting diodes to substantially white light on an irradiation opening of the upper metal plate or on an upper surface thereof. The manufacturing method of the light-emitting device described in any one of Claims 8-10.

Images