JP2008270415A - Underfill composition for flip chip type semiconductor device, flip chip type semiconductor device using same, and method for producing device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain flip chip bonding with an excellent bonding characteristic at room temperature via an under fill composition by evading warp in a substrate or a semiconductor chip. <P>SOLUTION: Flip chip bonding is performed at room temperature by imposing a load and also applying ultrasonic wave through the use of the under fill composition which is composed of an epoxy base resin, a microcapsulated curing agent for curing the epoxy base resin, and a filler containing a fractured filler having at least a fixed amount or more amount of acute angle shape. By applying the ultrasonic wave, the microcapsulated curing agent has contact with the fractured filler so as to break the capsule. Then, the curing agent exudes. Thus, the epoxy base resin is effectively cured, thereby keeping strong bonding. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an underfill composition used as a sealant for a gap between a semiconductor element such as a semiconductor chip and a circuit board on which the semiconductor element is flip-chip bonded to form a semiconductor device. In particular, the present invention relates to a composition that can be carried out at room temperature at the time of forming a bond and that provides good bonding characteristics, a Philip chip type semiconductor device using the composition, and a method for manufacturing the same.

  In recent years, along with the downsizing and high performance of electronic devices, the downsizing, high performance and high integration of semiconductor devices mounted on them have progressed. As a result, the number of I / O pins has increased, the package size has been reduced, and the distance between pins. With the reduction in size, a flip chip mounting method in which mounting is performed on a substrate electrode via a solder bump of a semiconductor chip has been widely used instead of the lead frame method.

  In this method, in order to improve the reliability of the semiconductor device, the gap between the semiconductor chip and the substrate is filled with a resin-based composition to prevent mutual contact and circuit surface deterioration, The entire semiconductor device including the chip and the substrate is sealed with a resin-based composition to protect the entire semiconductor device from the outside, whereby packaging is achieved. Here, the composition interposed in the void is referred to as an underfill (for) composition, and the composition for sealing the whole is referred to as a sealing (for) composition.

  The packaging method of the flip chip mounting method is roughly classified as follows: (A) After the semiconductor chip and the substrate are connected via the bumps, the composition mainly composed of the same resin is used to fill the gap and seal the whole. A method of performing (for example, Patent Document 1), (B) after connecting the semiconductor chip and the substrate through bumps, and filling the void with an underfill composition <so-called underfilling method of the underfill composition> After that, a method of sealing and packaging the whole with different sealing compositions (for example, Patent Document 2), (C) filling the voids with the underfill composition on the substrate surface, and then connecting the semiconductor chip and the substrate via bumps There is a method (for example, Patent Document 3) in which the whole is sealed and packaged with a different sealing composition.

  The underfill composition and the sealing composition are often different in desired properties. For example, the underfill composition needs to protect the circuit surface of the chip from moisture and the like, prevent the destruction of the bump due to the expansion coefficient between the silicon of the chip and the substrate, and adhere and fix the both. On the other hand, since the sealing composition covers the non-circuit surface, not so much circuit protection function and heat cycle resistance are required, but rather, moldability, external shock resistance, light shielding property, etc. are generally required.

  Regarding the method of filling the underfill composition first, as described above, there are (B) a last-in method and (C) a first-in method. In general, an advantageous method is selected depending on the manufacturing process and required device characteristics. However, when the bump density is high and the chip surface is close to the substrate surface (low bumps are applied), the last insertion method is used. Then, for example, depending on the viscosity of the underfill composition, the void may not be sufficiently filled with the composition, and the possibility of generating voids may increase. Therefore, in the high-density flip chip mounting, a first-in method is often desired.

As the material of the underfill composition, a liquid epoxy resin composition is usually used, which is composed of an epoxy resin, a curing agent, an inorganic material filler (inorganic filler), etc., and various materials and composition ratios thereof. Underfill compositions suitable for applications are being studied. In addition, for inorganic fillers using, for example, alumina or silica, an attack failure or the like caused by contact with the chip surface or the like due to the filler that is simply crushed solid inorganic material is avoided. Therefore, in recent years, fine spherical inorganic material fillers have been used (for example, Patent Documents 1 and 3).
JP 2002-348438 A JP 2000-297201 A JP 2007-56070 A

  4 and 5, a flip-chip bonding method using a conventional underfill composition first-in method will be described.

  As shown in FIG. 4, in the flip chip bonding, a circuit substrate 103 in which an electrode 102 made of gold, for example, is formed on a substrate 101, and a bump 105, for example made of gold, is formed around the circuit surface side of the semiconductor chip 104. The bump-formed semiconductor chip 106 is aligned with the electrodes 102 and the bumps 105 as shown by arrows in the drawing, and is heated and pressurized and bonded. At this time, in the first-in method, the underfill composition 107 is previously applied on the bonding surface side of the circuit board 103 as shown in the drawing. Here, when an underfill composition made of a conventional material composition is used, the circuit board 103 is heated to, for example, 50 to 100 ° C. at the time of application of the underfill composition 107, and heated to, for example, 200 to 250 ° C. Press (for example, Patent Document 3).

  By applying such a heat cycle load, the semiconductor chip 104 and the substrate 101 after bonding are warped, as shown schematically in the cross-sectional view of FIG. In the case of flip-chip bonding of chips using bumps, the gap between the two becomes even smaller as shown by the approach area A in the figure, and finally touches and damages the circuit surface facing the substrate. Such a problem occurs.

  As a countermeasure against such a case, a technique of lowering the bonding temperature and performing bonding may be considered, but the length of the connection process is long to ensure solidification of the underfill composition and to ensure the stability of flip chip bonding. Time is unavoidable, and of course, the tact time in production is increased, and in terms of quality, insufficient heat is likely to be applied due to insufficient application of heat.

  In view of the above, an object of the present invention is to provide an underfill composition capable of reliably realizing flip-chip bonding without increasing the processing temperature during bonding, and thus suppressing the occurrence of warpage in a semiconductor chip or substrate. Another object of the present invention is to provide a semiconductor device using the same and a manufacturing method thereof.

The underfill composition for a flip chip type semiconductor device of the present invention comprises:
Epoxy resin,
A microencapsulated resin curing agent;
An inorganic filler having an acute angle shape;
It is characterized by including.

  The microencapsulated resin curing agent has a curing action at room temperature.

  Furthermore, it is characterized by containing a spherical inorganic material filler.

And the flip chip type semiconductor device of the present invention is
A semiconductor element and a substrate are bonded using the underfill composition for a flip chip type semiconductor device.

And the manufacturing method of the flip chip type semiconductor device of the present invention is as follows:
A step of covering the region including the electrodes of the substrate having a plurality of electrodes on the main surface with the underfill composition according to any one of claims 1 to 3,
Aligning a semiconductor element having a plurality of bumps so that the bumps and the electrodes face each other;
Bonding the bump and the electrode by pressing and applying ultrasonic waves to each other at room temperature; and
It is characterized by including.

  By applying the underfill composition for a flip chip type semiconductor device, the flip chip type semiconductor device using the same, and the manufacturing method therefor according to the present invention, flip chip bonding at room temperature is possible. In addition, it is possible to obtain a semiconductor device having good connection characteristics between the electrode on the substrate and the bump on the semiconductor chip, which can avoid the occurrence of warpage in the semiconductor chip and can sufficiently withstand a large number of temperature cycle tests.

  Embodiments of the present invention will be described below with reference to the accompanying drawings.

(Example)
(1) Production of Underfill Composition FIG. 1 shows a schematic image diagram of the produced underfill composition in a container. The underfill composition 1 is a liquid epoxy resin composition, and is a bisphenol F type epoxy resin (trade name: EXA830LVP, manufactured by Dainippon Ink and Chemicals) as a liquid type epoxy resin (epoxy main agent 2) at room temperature, the above-mentioned Epoxy As a curing agent for curing the resin at room temperature, a microencapsulated resin curing agent (microcapsule type curing agent 3) is used. Specifically, a microcapsule type curing agent having a core of imidazole (trade name) : HX-3721, manufactured by Asahi Kasei Chemicals Corporation). Furthermore, a silane coupling agent (trade name: KBM403, manufactured by Shin-Etsu Chemical Co., Ltd.) is used as the coupling agent 4 for improving the binding of each composition component, and the spherical alumina powder of the spherical filler 51 (trade name) is used as the filler 5. : AO802, manufactured by Admatex) and a crushed filler 52 made of crushed alumina prepared by crushing solid alumina.

  The above spherical alumina powder (trade name: AO802) is a substantially circular powder as shown in the SEM diagram of the spherical filler 51 in the figure, and the average particle diameter is about 0.7 μm. On the other hand, the pulverized alumina is a powder having an average size substantially the same level as the spherical alumina as shown in the SEM diagram of the pulverized filler 52, each having a three-dimensional square shape or pyramid shape, and an acute angle shape.

  In Table 1, the composition ratio is the same as each composition material described above, and the mixing ratio of spherical filler (spherical alumina) and crushed filler (crushed alumina) in the filler is 0:10 (crushed alumina only) to 9: 1. The sample group composition table | surface of the produced underfill composition about the sample of the comparative example 1 of the samples 1-5 which changed and the same mixing ratio 10 to 0 (only conventionally used spherical alumina) is shown.

（２）評価用の回路基板およびバンプ形成半導体チップの作製
図２に、上記のように作製したアンダーフィラー組成物１を用いてフリップチップ接合の評価をするための、回路基板６とバンプ形成半導体チップ９を示す。図中基板７は、縦１２ｍｍ、横１２ｍｍ、厚さ０．３５ｍｍのトリアジン系樹脂（商品名：ＢＴレジン、三菱瓦斯化学製）からなり、その上に、金からなる電極８を、電極径３５μｍ、電極ピッチ５０μｍで４００個作製したものを用いた。

(2) Production of circuit board for evaluation and bump-formed semiconductor chip FIG. 2 shows a circuit board 6 and a bump-formed semiconductor for evaluating flip-chip bonding using the underfiller composition 1 produced as described above. The chip 9 is shown. In the figure, the substrate 7 is made of a triazine resin (trade name: BT resin, manufactured by Mitsubishi Gas Chemical) having a length of 12 mm, a width of 12 mm, and a thickness of 0.35 mm, and an electrode 8 made of gold having an electrode diameter of 35 μm. 400 pieces having an electrode pitch of 50 μm were used.

  As for the bump-formed semiconductor chip 9 to be bonded on the circuit board 6, the semiconductor chip 10 uses an LSI chip having a length of 6.64 mm, a width of 6.64 mm, and a thickness of 0.2 mm. Corresponding to No. 8, 400 gold electrodes having an electrode diameter of 35 μm and an electrode pitch of 50 μm were used.

(3) Flip Chip Bonding Then, as shown in FIG. 2, the underfill composition 1 (6 mg) produced as described above is applied to a region including the electrode 7 of the circuit board 6. next. Positioning is performed in a face-down state so that the circuit board 6 and each electrode of the bump-mounted semiconductor chip are in contact with each bump.

  As shown in FIG. 3, using the semiconductor chip base 12 on which the semiconductor chip 10 is mounted, the load applied for bonding is 5 g per bump, the ultrasonic amplitude is about 4 μm, and the bonding time is 1 second. Ultrasonic bonding was performed under the conditions described above. The bonding temperature at this time was room temperature (the temperature of the heating head for bonding (not shown) was room temperature).

  Then, each joined sample was put in a thermostat and afterbaked at 150 ° C. for 1 hour.

(4) Test evaluation To prepare 15 flip-chip chip joint samples for evaluation using the underfiller compositions of the respective sample numbers shown in Table 1, and to evaluate the bondability at the connection points in each sample A continuity test was conducted. The test was performed under the following two conditions.
(A) Initial continuity test after after baking;
Samples that conduct at a low resistance at all connection points of each sample are considered good, and samples that have a high resistance connection point are considered defective.
(B) a temperature cycle test at -55 to 125 ° C;
For the sample that passed the initial continuity test, the process of -55 ° C for 30 minutes cooling → room temperature for 10 minutes → 125 ° C for 30 minutes heating was defined as one cycle, and this was repeated for a total of 500 cycles. A sample with a resistance increase of 10% or less at each connection point before and after the temperature cycle is a non-defective product, and a sample with a connection point exceeding that is a defective product.

  Table 2 shows the test evaluation results of the samples of the underfill composition thus produced. In Table 2, the results of the initial continuity and the results of performing the temperature cycle test on the sample that was good by the initial continuity for 100 cycles were tested, and the temperature cycle test was further performed for 400 cycles, and thus a total of 500 cycles. Results are shown. In the column of the test result, for example, a number indicated as 3/15 indicates that 3 defects occurred in 15 evaluation samples.

この表２から、フィラー混合比が、球状アルミナ／破砕アルミナに関し、７／３よりも破砕アルミナの混合比が大きいアンダーフィル組成物を適用した接合試料であるサンプル１〜４において、初期導通試験・温度サイクル試験のいずれにおいても良好な結果（不良０）が得られていることがわかる。比較例１の従来のアンダーフィル組成物のようなフィラーが球状フィラーのみの場合、本作製条件においては、初期・熱サイクル何れの試験においても不良接続点を有する試料が発生している。

From Table 2, the initial continuity test in Samples 1 to 4, which are joint samples to which an underfill composition in which the filler mixing ratio is spherical alumina / crushed alumina and the crushed alumina mixture ratio is larger than 7/3, is applied. It can be seen that good results (defect 0) were obtained in any of the temperature cycle tests. When the filler like the conventional underfill composition of Comparative Example 1 is only a spherical filler, a sample having a defective connection point is generated in both the initial and thermal cycle tests under the present production conditions.

  In other words, in flip chip bonding using an underfill composition, an epoxy resin and room temperature are added to the underfill composition in order to avoid occurrence of warpage of the substrate and chip when this is performed by applying a normal thermal cycle. It contains a microencapsulated resin curing agent (microcapsule type resin curing agent) that undergoes a curing reaction at the same time, and includes not only a commonly used spherical inorganic material filler but also an inorganic material filler (crushed filler) having an acute angle shape. At the time of bonding at room temperature, flip-chip bonding is performed by applying ultrasonic waves together with pressure. In particular, in order to obtain good bonding characteristics, it is necessary that the ratio of the inorganic material filler having an acute-angled shape (crushed filler) in the inorganic material filler is not less than a certain level (not possible only with the spherical inorganic material filler). It shows that there is.

  Such a test result can be considered as follows.

  As shown in FIG. 2, a microcapsule-type curing agent 3 in which a liquid curing agent is enclosed in a small capsule for curing a room temperature liquid epoxy resin not shown in the underfill composition 1, and a crushed filler 52 and a spherical filler not shown. Needless to say, in the microcapsule type curing agent 3, the capsule is cracked in some form and the liquid curing agent inside oozes out (in the case of normal heating connection, the capsule melts as a result of heating, and if it is a room temperature liquid curing agent, If it is a room temperature solid curing agent, it will melt and elute), and it will react with the epoxy resin to cure it.

  In this state, as shown in FIG. 3, in order to join the aligned electrode 8 and bump 11, a load is applied between the two and through the semiconductor chip base, US Ultrasonic waves are applied as indicated by the arrows of and bonding is performed at room temperature.

  By applying ultrasonic waves, the vibration amplitude of the microcapsule-type curing agent 3 having a relatively low specific gravity is small, but the vibration amplitude of the microcapsule-type curing agent 3 having a relatively low specific gravity is large. 3 collides with the filler. If the microcapsule-type curing agent 3 that does not crack at room temperature is a crushing filler with an acute-angled shape, the probability that the capsule collides with this is high, and the capsule breaks when the collision target is a spherical filler Probability drops significantly. Therefore, the underfill composition having a filler with a high content ratio of the crushed filler has a higher probability of breaking the capsule of the microcapsule-type curing agent at the time of applying the ultrasonic wave, so that the bleeding of the curing agent is more efficiently performed The curing reaction with the epoxy resin proceeds reliably. As a result, uniform and good adhesion between the substrate and the semiconductor chip can be realized even under room temperature conditions, and the strong bonding between the electrodes and bumps can be maintained. Even in severe temperature cycle evaluation results, sufficiently satisfactory results are obtained. It has been.

  In addition, since each sample obtained with good results is bonded at room temperature, neither thermal deformation nor warpage is observed on the substrate side or the semiconductor chip side, and there is a concern about contact between the two. Can be resolved.

  The constituent material of the underfill composition used in this example is not limited to this. For example, as a liquid type epoxy main agent at room temperature, besides bisphenol F type epoxy, bisphenol A type epoxy, naphthalene type epoxy, brominated epoxy, phenolvolak type epoxy, cresol novolak type epoxy, biphenyl type epoxy, cyclopentagen type Epoxy and the like and mixtures thereof can be used. The curing agent is not limited to the microcapsule type curing agent having imidazole as a core, but can be appropriately selected as long as it is a microcapsule type curing agent using a core material in accordance with the gist of the present invention. As the filler, in addition to the alumina powder, powders such as silica, boron nitride, aluminum nitride, and silicon nitride can be applied, and the average size (particle size) of the powder is not limited to 0.7 μm, but is 0.5 to 20 μm. It suffices to select appropriately within the range.

Regarding the embodiment including the above examples, the following additional notes are further disclosed.
(Appendix 1)
Epoxy resin,
A microencapsulated resin curing agent;
An inorganic filler having an acute angle shape;
An underfill composition for flip-chip type semiconductor devices, comprising:
(Appendix 2)
The underfill composition for a flip-chip type semiconductor device according to appendix 1, wherein the microencapsulated resin curing agent has a curing action at room temperature.
(Appendix 3)
The underfill composition for flip chip type semiconductor devices according to appendix 1 or 2, further comprising a spherical inorganic material filler.
(Appendix 4)
The undermix for flip-chip type semiconductor devices according to appendix 3, wherein the weight-mixing ratio of the inorganic filler having an acute-angle shape in the filler configured together with the spherical inorganic filler is 30% or more. Fill composition.
(Appendix 5)
The underfill composition for a flip chip type semiconductor device according to any one of appendices 1 to 4, wherein the inorganic material filler is alumina powder or silica powder.
(Appendix 6)
The underfill composition for flip chip type semiconductor devices according to any one of appendices 1 to 5, further comprising a coupling material.
(Appendix 7)
A flip-chip type semiconductor device, wherein a semiconductor element and a substrate are bonded using the underfill composition for a flip-chip type semiconductor device according to any one of appendices 1 to 6.
(Appendix 8)
Covering the region including the electrodes of the substrate having a plurality of electrodes on the main surface with the underfill composition according to any one of appendices 1 to 6,
Aligning a semiconductor element having a plurality of bumps so that the bumps and the electrodes face each other;
Bonding the bump and the electrode by mutually pressing and applying an ultrasonic wave at room temperature; and
A method of manufacturing a flip-chip type semiconductor device comprising:
(Appendix 9)
Furthermore, the manufacturing method of the flip-chip type semiconductor device of Claim 8 characterized by including a high temperature baking process.

The figure explaining the underfill composition of this invention The figure explaining the flip-flop perturbation of this invention (the 1) The figure explaining the flip-flop perturbation of this invention (the 2) The figure explaining the conventional flip-flop perturbation (the 1) The figure explaining the conventional flip-flop perturbation (the 2)

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Underfill composition 2 Epoxy main ingredient 3 Microcapsule type hardening agent 4 Coupling agent 5 Filler 51 Spherical filler 52 Crushed filler 6, 103 Circuit board 7, 101 Substrate 8, 102 Electrode 9, 106 Bump formation semiconductor chip 10, 104 Semiconductor Chip 11, 105 Bump 12 Base for semiconductor chip

Claims (5)

Epoxy resin,
A microencapsulated resin curing agent;
An inorganic filler having an acute angle shape;
An underfill composition for flip-chip type semiconductor devices, comprising:   The underfill composition for a flip chip type semiconductor device according to claim 1, wherein the microencapsulated resin curing agent has a curing action at room temperature.   The underfill composition for a flip chip type semiconductor device according to claim 1, further comprising a spherical inorganic material filler.   A flip-chip type semiconductor device, wherein a semiconductor element and a substrate are bonded using the underfill composition for a flip-chip type semiconductor device according to claim 1. A step of covering the region including the electrodes of the substrate having a plurality of electrodes on the main surface with the underfill composition according to any one of claims 1 to 3,
Aligning a semiconductor element having a plurality of bumps so that the bumps and the electrodes face each other;
Bonding the bump and the electrode by pressing and applying ultrasonic waves to each other at room temperature; and
A method of manufacturing a flip-chip type semiconductor device comprising:

Images