JP2008112862A - Double-side printed wiring circuit board, electronic device, and method of manufacturing the double-side printed wiring circuit board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent warpage of a double-side printed wiring circuit board when an electronic component is soldered thereto. <P>SOLUTION: Slit-shaped noncopper foil regions are formed along wiring directions in the vicinities of regions opposed to signal wiring lines 21a, 21b, 21c of a lower conductive layer. The slit-shaped noncopper foil regions are formed not to be overlapped with the signal wiring lines 21a, 21b (the signal wiring lines 21b, 21c). With such an arrangement, when a surface mounting component is soldered to the board, warpage or deformation of a double-side printed wiring circuit board 1 can be reliably suppressed. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a double-sided printed wiring board, an electronic device, and a method for manufacturing a double-sided printed wiring board, for example, a double-sided printed wiring board in which a conductive layer having a solid area is formed on both sides of an insulating substrate. The present invention relates to an electronic device including a wiring board and a method for manufacturing a double-sided printed wiring board.

2. Description of the Related Art Conventionally, electronic devices such as communication devices and computer devices are generally configured by mounting a printed wiring board, and components such as through-hole mounting parts and surface mounting parts (SMD: Surface Mount Device) are mounted on the printed wiring board. Is installed.
The through-hole mounting component is connected to a conductive layer inside the printed wiring board by inserting a soldering lead into a through hole provided in the printed wiring board and soldering in this state.

Further, the surface-mounted component is attached to the printed wiring board with the corresponding connection terminals physically and electrically connected to the solder pads formed on the front surface (and the back surface) of the printed wiring board.
Note that a conductive layer used as, for example, a power supply layer or a ground layer of a printed wiring board has a solid pattern in which a conductor region is formed on substantially one surface.

For example, when mounting a surface-mounted component on a printed wiring board, solder is supplied in advance to the joint location, heated to an appropriate temperature (eg, about 260 ° C.), and the solder is melted and connected by a reflow method. The surface mount component is connected to the printed wiring board.
With reference to FIG. 11 to FIG. 14, a case where the surface mounting component 102 is mounted on the double-sided printed wiring board 101 will be described.

  As shown in FIGS. 11 and 12, a double-sided printed circuit board 101 has an insulating substrate 103 and an upper conductive layer 104 and a lower conductive layer 105 which are formed on both surfaces of the insulating substrate 103 and both have a solid region. When the areas of the solid regions of the upper conductive layer 104 and the lower conductive layer 105 are substantially the same, if relatively long signal wirings 106 a, 106 b, 106 c are arranged at the center of the upper conductive layer 104, soldering is performed. When the upper conductive layer 104 and the lower conductive layer 105 are thermally expanded, a double-sided printed wiring board is formed by forming a streak-like groove from which the copper foil is removed on both sides of each signal wiring 106a (106b, 106c). As shown in FIG. 13, reference numeral 101 indicates that the signal wirings 106a, 106b, 106c are at the bottom (the opposite lower conductive layer 105 side is the top), that is, the lower conductive layer 05 are formed so that the outer peripheral side, and the signal lines 106a, 106b, along a direction substantially orthogonal to 106c, thereby curved.

When the double-sided printed wiring board 101 is warped, the flatness of the mounting surfaces (front and back) of the double-sided printed wiring board 101 on which the surface-mounted component 102 is mounted is lost as shown in FIG. The connection failure of the component 102 is caused.
For this reason, when a rectangular double-sided printed circuit board is used, the copper foil is removed in the conductor region on the side of the larger conductor area along the direction orthogonal to the longitudinal direction of the double-sided printed circuit board. A technique for forming a slit-like non-conductor region (copper foil removal region) is proposed (see, for example, Patent Document 1).
JP-A-5-299785

The problem to be solved is that it is difficult to reliably suppress the occurrence of deformation such as warpage in the printed wiring board.
That is, for example, a double-sided printed circuit board does not simply warp along its longitudinal direction, and the shape of the double-sided printed circuit board, the formation state of a wiring pattern including solid areas formed on the front surface side and the back surface side, etc. The method of deformation differs depending on the type.

  Further, for example, a relatively long linear signal wiring is formed on the conductive layer on one side of the double-sided printed circuit board, and a solid area is formed on both sides across the signal wiring, and the conductive layer on the other side is substantially the same. When one surface is a solid area, warping occurs in a direction substantially perpendicular to the wiring direction of the signal wiring, and even if the double-sided printed board is rectangular, the wiring direction is, for example, a diagonal direction. , Warping occurs along a direction substantially orthogonal to the diagonal direction.

In addition, when such signal wiring is formed at a plurality of locations on the double-sided printed circuit board and the wiring directions are various, the double-sided printed circuit board is not always warped along one direction. However, due to complex deformation, the above-mentioned conventional technology cannot cope.
In addition, the occurrence of warpage on the double-sided printed circuit board in this way leads to poor connection of electronic components, lowers reliability, and increases the substantial thickness of the double-sided printed circuit board. In the device, it will not fit in the housing, which will hinder thinning and miniaturization.

  The present invention has been made in view of the above-described circumstances, and can provide a double-sided printed wiring board, an electronic device, and a double-sided printed wiring board that can reliably suppress the occurrence of deformation such as warping during soldering by reflow or the like. It aims at providing the manufacturing method of.

  In order to solve the above-mentioned problems, an invention according to claim 1 is directed to an insulating substrate, a surface-side conductive layer formed on the surface side of the substrate, in which a solid layer is divided by a wiring pattern region, and the substrate. The present invention relates to a double-sided printed wiring board that is formed on the back side and includes a back side conductive layer in which the solid layer is not divided, and is a warp for preventing the insulating board from being warped by heating during reflow mounting of electronic components. A non-conductive pattern for prevention is provided on the back side of the wiring pattern region or the vicinity thereof.

  According to a second aspect of the present invention, there is provided an insulating substrate and a surface-side conductive material formed on the surface side of the substrate and divided into right and left by a wiring pattern region passing through a central region of the surface or a region in the vicinity thereof. Reflow of electronic components in relation to a double-sided printed wiring board formed of a layer and a back side conductive layer formed on the back side of the substrate and having a solid layer not divided in the central region of the back side or in the vicinity thereof A warp-preventing non-conductive pattern for preventing warpage of the insulating substrate due to heating during mounting is provided on the back side of the wiring pattern region or the vicinity thereof.

  According to a third aspect of the present invention, there is provided the double-sided printed wiring board according to the second aspect, wherein the left / right dividing ratio is set in a range of 3/1 to 1/3.

  According to a fourth aspect of the present invention, there is provided the double-sided printed wiring board according to the first, second, or second aspect, wherein the warp prevention non-conductive pattern is provided along the wiring in the wiring pattern region. It is a feature.

  A fifth aspect of the invention relates to the double-sided printed wiring board according to any one of the first to fourth aspects, wherein a plurality of wirings are formed in the wiring pattern region and the wirings adjacent to each other are formed. In addition, a shield wiring is formed, and the warp preventing non-conductive pattern is provided so as to overlap the shield wiring.

  A sixth aspect of the present invention relates to the double-sided printed wiring board according to any one of the first to fifth aspects, wherein a plurality of slits are provided on the back side of the insulating substrate as the non-conductive pattern for preventing warping. Are arranged along the wiring in the wiring pattern area, and the gap between the adjacent slit-like areas is between the conductive areas constituting the solid layers on both sides of the plurality of slit-like areas. It is characterized by being a current path connecting the two.

  According to a seventh aspect of the invention, an electronic apparatus includes the double-sided printed wiring board according to any one of the first to sixth aspects.

  The invention according to claim 8 is formed on an insulating substrate, a surface-side conductive layer formed on the surface side of the substrate and divided by a wiring pattern region, and a back surface side of the substrate. The present invention relates to a method for manufacturing a double-sided printed wiring board composed of a backside conductive layer in which a solid layer is not divided, and is used for preventing warpage of the insulating board to prevent warping of the insulating board due to heating during reflow mounting of electronic components. The conductive pattern is provided on the back surface side in the wiring pattern region or in the vicinity thereof.

  According to a ninth aspect of the invention, there is provided an insulating substrate and a surface-side conductive material formed on the surface side of the substrate and divided into right and left by a wiring pattern region passing through a central region of the surface or a region in the vicinity thereof. The present invention relates to a method of manufacturing a double-sided printed wiring board comprising a layer and a back side conductive layer formed on the back side of the substrate and having a solid layer not separated in a central region of the back side or a region in the vicinity thereof. A warp prevention non-conductive pattern for preventing warpage of the insulating substrate due to heating during reflow mounting of components is provided on the back surface side of the wiring pattern region or the vicinity thereof.

  According to the configuration of the present invention, the non-conductor pattern for warpage prevention for preventing the warpage of the insulating substrate due to heating at the time of reflow mounting of the electronic component is provided on the wiring pattern region or the back surface side in the vicinity thereof. When soldering, the occurrence of deformation such as warping can be reliably suppressed.

  When the soldering is performed by providing a non-conductor pattern for warpage prevention to prevent warpage of the insulating substrate due to heating during reflow mounting of electronic components on the back side of the wiring pattern region or its vicinity. The purpose of reliably suppressing the occurrence of deformation such as warping has been realized.

  1 is a plan view showing the configuration of a double-sided printed wiring board according to a first embodiment of the present invention, FIG. 2 is a bottom view showing the configuration of the double-sided printed wiring board, and FIG. 3 is the double-sided printed wiring board. FIG. 4 is a cross-sectional view showing the structure of the double-sided printed wiring board, FIG. 5 is a cross-sectional view taken along the line AA in FIG. 1, and FIG. FIG. 7 is an enlarged sectional view showing the portion C of FIG. 5 in an enlarged manner.

The double-sided printed wiring board 1 of this example is mounted on a communication device including a mobile phone or an electronic device such as a computer, and as shown in FIGS. 1 to 4, a double-sided printed wiring board 1 is a double-sided printed wiring board 1 in which an insulating layer 2 and a conductive layer 3 are laminated. A plurality of through-holes having a structure and penetrating the insulating layer 2 and the conductive layer 3 from the front surface to the back surface and connecting the connection terminals 5 of the surface mounting component 4 as an electronic component or an electrical component to the conductive layer 2 6, 6, ....
The surface mount component 4 is attached to the double-sided printed wiring board 1 with the connection terminals 5 connected to the corresponding conductive layers 2 through the through holes 6, 6.

  Note that metal plating is applied to the inner wall surfaces of the through holes 6, 6,. Further, the surface-mounted component 4 has both the corresponding connection terminals 5 physically and electrically connected to the solder pads 7 formed on the front surface (and the back surface) of the double-sided printed wiring board 1 via the solder 8, It is attached to the printed wiring board 1.

The through hole 6 is connected to an upper conductive layer 16 or a lower conductive layer 17 which will be described later, and is connected to a corresponding solder pad 7.
Each surface-mounted component 4 is arranged in a component arrangement area 9a (9b, 9c,...) Provided on the front and back surfaces of the double-sided printed wiring board 1.

  In FIGS. 1 to 3, the double-sided printed wiring board 1 has a surface mounting component 4, for example, a SIM (Subscriber Identity Module) card connector in the component placement region 9d on the back side, and lithium ion 2 in the component placement region 9e. A case will be described in which a secondary battery such as a secondary battery, a stacking connector in the front surface side component placement region 9a, and a capacitor or the like are placed in the front or back side component placement regions 9b, 9c, 9f. In this example, the thickness of the double-sided printed wiring board 1 is approximately 0.5 mm.

The insulating layer 2 includes, for example, an insulating substrate 11 made of a glass epoxy substrate, or surface protective films 12 and 13 that cover the surfaces of the upper conductive layer 16 and the lower conductive layer 17.
Here, openings 14 are formed in the surface protection films 12 and 13 where the connection terminals 5 of the surface mount component 4 are disposed, and the upper conductive layer 16 and the lower conductive layer 17 are exposed, and the upper conductive layer 16 and Metal plating (gold plating or the like) is applied to the exposed portion (connection portion) of the lower conductive layer 17.

The conductive layer 3 includes an upper conductive layer 16 formed on the front surface side of the insulating substrate 11 or a lower conductive layer 17 formed on the back surface side, and the connection terminals 5 of the surface mount component 4 are disposed. The connection portion is exposed, a metal plating layer 18 is formed, and the solder pad 7 is formed.
The upper conductive layer 16 excludes the wiring region in which the signal wirings 21a, 21b, and 21c are formed, the through holes 6, 6,..., And the non-copper foil region (clearance hole) around the through holes 6, 6,. Thus, it is a solid pattern in which a conductive region is formed on substantially one surface.

  In this example, three signal wirings 21a, 21b, and 21c are arranged obliquely in the center of the double-sided printed wiring board 1 (on the long-side edge 1a and the short-side edge 1b of the double-sided printed wiring board 1). (About 45 °). The end of the signal wiring 21a (21b, 21c) is connected to the solder pad 7, the through hole 6 or the like, and is stacked, for example, in the component placement region 9a on the front side via the signal wiring 21a, 21b, 21c. The connector is connected to the SIM card connector arranged in the component arrangement area 9d on the back side.

As shown in FIGS. 5 and 7, the signal wiring 21a (21b, 21c) has a relatively long straight line portion with a predetermined width da, and the adjacent signal wirings 21a, 21b (21b, 21c) are It is formed so as to maintain a predetermined interval pa.
The signal wiring 21a (21b, 21c) is separated from, for example, a solid pattern by striped grooves 21p, 21p (21q, 21q, 21r, 21r) formed by removing the copper foil on both sides of the copper foil region ( It is formed by being insulated.

  In this example, the predetermined interval pa is set to about 2 mm, and the predetermined width da is set to about 0.1 mm. In FIG. 1 and FIG. 3, the signal wirings 21a, 21b, and 21c are shown in a transparent state (that is, with solid lines).

  The lower conductive layer 17 includes rectangular slit-shaped non-copper foil regions 23a, 23b,... (24a, 24b,...) From which the copper foil has been removed, through holes 6, 6,. ,... Is a solid pattern in which conductive regions are formed on substantially one surface except for non-copper foil regions (clearance holes).

  The lower conductive layer 17 is formed between the straight portions of the signal wirings 21a and 21b, and is formed along the wiring direction directly under the shield region 22a for preventing crosstalk between the signal wirings 21a and 21b. A shield for preventing crosstalk between the signal wirings 21b and 21c, which is formed between the slit-shaped non-copper foil regions 24a, 24b,... Having substantially the same shape and size and the straight portions of the signal wirings 21b and 21c. The substantially same shape and dimension slit-shaped non-copper foil regions 23a, 23b,... Formed along the wiring direction are formed immediately below the region 22b.

  In this example, as shown in FIG. 6, the slit-like non-copper foil regions 23a, 23b,... (Slit-like non-copper foil regions 24a, 24b,...) Are formed at equal intervals on a straight line. The slit-shaped non-copper foil region 23a (23b, 23c, 23d) and the slit-shaped non-copper foil region 24a (24b, 24c) length (length of the non-copper foil region) db and the above-mentioned interval (length of the copper foil region) P) pb is set to a predetermined value. The length db and the interval pb are set to be (db: pb = 3: 1 to 2: 1), for example. The width df is set to be less than 2 mm.

  Here, the slit-shaped non-copper foil regions 23a, 24a (23b, 24b, 23c, 24c) adjacent to each other are along the horizontal direction (the direction along the edge 1b on the short side of the double-sided printed wiring board 1). It is arranged. That is, the slit-shaped non-copper foil regions 23a, 23b,... (Slit-shaped non-copper foil regions 24a, 24b,...) Are not zigzag along the wiring direction or the lateral direction. They are arranged and arranged.

In this example, the slit-shaped non-copper foil regions 23a, 23b,... Do not overlap the signal wirings 21a, 21b, and the slit-shaped non-copper foil regions 24a, 24b,. Each is formed.
That is, the copper foil region of the lower conductive layer 17 is arranged immediately below the signal wirings 21a, 21b, and 21c.

  For example, the copper foil region 25 constituting the lower conductive layer 17 disposed immediately below the signal wiring 21b has a width dc of (dc = da + d1 + d2) as shown in FIG. 7, and the width immediately below the signal wiring 21b. It is formed on both sides of the area da so as to ensure margins d1 and d2. In this example, the margins d1 and d2 are each set to approximately 0.1 mm.

  As described above, in the lower conductive layer 17, the copper foil region is formed so as to overlap each signal wiring 21 a (21 b, 21 c) with the insulating substrate 11 interposed therebetween. In 21c), the copper foil region is disposed opposite to the insulating substrate 11 so that a return current path is secured. Therefore, unnecessary electromagnetic radiation (EMI) is suppressed.

  Moreover, the copper foil area | region 26a (26b, 26c) (copper foil area | region 27a (27b)) of the space | interval pb between slit-shaped non-copper foil area | regions 23a, 23b, ... (slit-like non-copper foil area | region 24a, 24b, ...) , (Slit-like non-copper foil regions 24a, 24b,...) Function as part of a current path connecting between the solid pattern regions 31 and 32 on both sides of the slit-like non-copper foil regions 23a, 23b,.

That is, a current path passing through the copper foil area 26a, the copper foil area 25, and the copper foil area 27a, a current path passing through the copper foil area 26b, the copper foil area 25, and the copper foil area 27b, and a copper foil area 26c. And the solid pattern regions 31 and 32 are connected by the current path passing through the copper foil region 25, so that the potential between the solid pattern regions 31 and 32 is stably set to the same potential.
Thus, even if the slit-like non-copper foil regions 23a, 23b,... (Slit-like non-copper foil regions 24a, 24b,...) Are formed so as to divide the solid pattern regions 31, 32, Since the solid pattern regions 31 and 32 are connected by the short current path, instability of the potential can be avoided.

When mounting the surface mount component 4 on the double-sided printed wiring board 1, as shown in FIG. 4, a predetermined amount of solder 8 is supplied to the solder pads 7 in advance, and each connection terminal 5 corresponds to the surface mount component 4. Positioning so as to be disposed on the solder pad 7 and placing it on the double-sided printed wiring board 1, soldering is performed by a reflow method in which the temperature is raised to a predetermined temperature (for example, approximately 260 ° C.) to melt the solder 8.
Here, the copper foil which comprises the upper conductive layer 16 and the lower conductive layer 17 thermally expands by temperature rising.

For example, when the areas of the solid pattern regions of the upper conductive layer and the lower conductive layer are substantially the same, the upper conductive layer and the lower conductive layer expand when a relatively long signal wiring is disposed in the center of the upper conductive layer. When the striped grooves from which the copper foil is removed are formed on both sides of the signal wiring, the double-sided printed wiring board has the signal wiring at the bottom (the opposite lower conductive layer side is at the top) That is, the lower conductive layer tends to be bent along the direction substantially perpendicular to the signal wiring so as to be on the outer peripheral side. However, as in this example, the signal wiring 21a, 21b, 21c of the lower conductive layer 17 is used. Are formed at the position opposite to each other, thereby causing deformation such as warping in the double-sided printed wiring board 1 by forming the slit-shaped non-copper foil regions 23a, 23b,. That's true Expansion of the copper foil of the lower conductive layer 17 is allowed.
Accordingly, the occurrence of deformation such as warpage in the double-sided printed wiring board 1 is suppressed. Thereby, the flatness of the mounting surface (front surface and back surface) of the double-sided printed wiring board 1 on which the surface mounting component 4 is mounted is maintained, and connection failure of the surface mounting component 4 is avoided.

  Thus, according to the configuration of this example, slit-shaped non-copper foil regions 23a, 23b,... In the vicinity of the regions facing the signal wirings 21a, 21b, 21c of the lower conductive layer 17 along the wiring direction. Since the slit-shaped non-copper foil regions 24a, 24b,... Are formed, the copper of the lower conductive layer 17 does not cause deformation such as warpage in the double-sided printed wiring board 1 when the surface-mounted component 4 is soldered. The foil is allowed to expand. Therefore, the occurrence of deformation such as warpage of the double-sided printed wiring board 1 can be reliably suppressed.

Therefore, by suppressing deformation such as warpage of the double-sided printed circuit board 1, it is possible to prevent poor connection of electronic components such as the surface-mounted component 4 mounted on the double-sided printed circuit board 1, and improve reliability.
In addition, the double-sided printed circuit board 1 prevents a problem that the double-sided printed circuit board 1 cannot be stored in the casing of the electronic device due to warpage, and prevents the double-sided printed circuit board 1 from being increased in thickness. This can contribute to thinning and downsizing of electronic devices to be mounted.
For this reason, for example, it is suitable to be applied to a printed wiring board mounted on a small electronic device such as a mobile phone. Moreover, it is suitable for application when a relatively large electronic component is mounted on a double-sided printed circuit board.

Further, the slit-shaped non-copper foil regions 23a, 23b,... Do not overlap with the signal wirings 21a, 21b, and the slit-shaped non-copper foil regions 24a, 24b,. In other words, in the lower conductive layer 17, the copper foil region is formed so as to overlap each signal wiring 21a (21b, 21c) with the insulating substrate 11 interposed therebetween. 21a (21b, 21c) is opposed to the copper foil region through the insulating substrate 11, thereby ensuring a return current path.
Therefore, even if the slit-shaped non-copper foil regions 23a, 23b,... (Slit-shaped non-copper foil regions 24a, 24b,...) Are formed, unnecessary electromagnetic radiation is suppressed.

  Further, the copper foil regions 26a (26b, 26c) (copper foil regions 27a (27b)) between the slit-shaped non-copper foil regions 23a, 23b,... (Slit-shaped non-copper foil regions 24a, 24b,. The non-copper foil regions 23a, 23b,... (Slit-like non-copper foil regions 24a, 24b,...) Function as part of the current path connecting the solid pattern regions 31, 32 on both sides. , 32 are stably set to the same potential.

  Thus, even if the slit-like non-copper foil regions 23a, 23b,... (Slit-like non-copper foil regions 24a, 24b,...) Are formed so as to divide the solid pattern regions 31, 32, Since the solid pattern regions 31 and 32 are connected by the short current path, instability of the potential can be avoided.

FIG. 8 is a plan view showing the configuration of a double-sided printed wiring board according to the second embodiment of the present invention, and FIG. 9 is a cross-sectional view taken along the line DD of FIG.
The configuration of this example is greatly different from the configuration of the first embodiment described above in that slit-shaped non-copper foil regions are formed at two locations corresponding to the signal wiring formation region.
Since the configuration other than this is substantially the same as the configuration of the first embodiment described above, the same components as those of the first embodiment are the same as those used in FIGS. 1 to 3 in FIG. The description will be simplified by attaching the reference numeral.

  As shown in FIGS. 8 and 9, the double-sided printed wiring board 1A of this example has a double-sided structure in which an insulating layer 41 and a conductive layer 42 are laminated, and the insulating layer 41 and the conductive layer from the front surface to the back surface. .. Have a plurality of through holes 6, 6,... For connecting the connection terminals 5 of the surface mount component 4 as an electronic component or an electrical component to the conductive layer 42.

The insulating layer 41 includes an insulating substrate 43 or a surface protective film 44 that covers the surfaces of the upper conductive layer 45 and the lower conductive layer 46.
The conductive layer 42 includes an upper conductive layer 45 formed on the front surface side of the double-sided printed wiring board 1A or a lower conductive layer 46 formed on the back surface side.

The upper conductive layer 45 includes a wiring region 49 in which signal wirings 48a and 48b are formed, a wiring region 52 in which signal wirings 51a and 51b are formed, through holes 6, 6,. It is a solid pattern in which a conductive region is formed substantially on one surface except for a non-copper foil region (clearance hole) around.
In this example, signal wirings 48a and 48b are formed in the wiring region 49 along the oblique direction in the center of the double-sided printed wiring board 1A, and signal wirings 51a and 51b are formed in the wiring region 52. It is formed along a direction substantially orthogonal to the wiring direction of 48a and 48b.

  Further, the lower conductive layer 46 includes a copper foil removal region 55 formed with rectangular slit-shaped non-copper foil regions 54a, 54b,... From which copper foil has been removed, and slit-shaped non-copper foil regions 56a, 56b,. Except for the formed copper foil removal region 57, the through holes 6, 6,..., And the non-copper foil regions (clearance holes) around the through holes 6, 6,. Is a solid pattern formed.

  In the lower conductive layer 46, slit-shaped non-copper foil regions 54a, 54b,... Having substantially the same shape and dimensions formed along the wiring direction immediately below the shield wiring 59 formed between the signal wirings 48a, 48b. And substantially the same shape and size slit-shaped non-copper foil regions 56a, 56b,... Formed along the wiring direction immediately below the shield wiring 61 formed between the signal wirings 51a, 51b. .

  Also in this example, the slit-shaped non-copper foil regions 54a, 54b,... Do not overlap the signal wirings 48a, 48b, and the slit-shaped non-copper foil regions 56a, 56b,. Each is formed.

According to the configuration of this example, substantially the same effect as that of the first embodiment described above can be obtained.
In addition, even when the relatively long linear signal wiring is in a plurality of locations and the wiring directions are different, the occurrence of warpage is surely suppressed without causing complicated deformation, and the double-sided printed wiring board 1A The flatness of can be maintained.

  Moreover, since it is only necessary to form the slit-shaped non-copper foil region independently in each of the plurality of formation regions, both sides can be easily and without complicated calculation for setting the formation pattern of the slit-shaped non-copper foil region. Generation | occurrence | production of the curvature of 1 A of printed wiring boards can be suppressed.

The embodiment of the present invention has been described in detail with reference to the drawings. However, the specific configuration is not limited to this embodiment, and there are design changes and the like without departing from the gist of the present invention. Are also included in the present invention.
For example, in the above-described embodiment, the case where a copper foil is used as the metal foil constituting the conductor has been described. However, the present invention can be applied to a case where a silver foil or an aluminum foil is used. In addition, the solder pad may be formed by a surface layer not only by gold plating but also by silver plating or copper plating.

In addition to the glass epoxy substrate, a glass polyimide substrate, a paper phenol substrate, or the like may be used as the insulating substrate.
In addition to the method of forming a wiring by etching a metal foil adhered to an insulating layer, the method can be applied to the case of using a method of forming by plating.

In the first embodiment, the case where the connection portion where the connection terminals of the surface mounting parts of the upper conductive layer and the lower conductive layer are arranged is exposed and the metal plating layer is formed to form the solder pad is described. As shown in FIG. 10, in the double-sided printed wiring board 1B, the surface layers 72 and 73 on which the solder pads 71 and the like are formed may be separately provided on both sides, and the conductive layer 74 may have a four-layer structure.
In this case, the double-sided printed wiring board 1B is formed by laminating an insulating layer 75 and a conductive layer 74, and the conductive layer 74 includes an upper conductive layer 76, a lower conductive layer 77, or a surface layer 72. 73.

In the first embodiment, the slit-shaped non-copper foil regions 23a, 23b,... (Slit-shaped non-copper foil regions 24a, 24b,...) Are not zigzag along the wiring direction and the lateral direction. Although the case where they are arranged in alignment has been described, they may be arranged slightly in a zigzag manner along the wiring direction and the lateral direction, although they are not necessarily aligned.
In the first embodiment, it is not necessarily divided into slit-like non-copper foil regions, and may be formed in a long strip shape.

  In the second embodiment, the case where the slit forming portions are provided at two locations has been described. However, the slit forming locations may be provided at three or more locations depending on the length and direction of the signal wiring, the forming position, and the like. Further, the direction of the target signal wiring may be substantially the same direction, for example, may be directions along different diagonal lines.

  The electronic component or electrical component mounted on the double-sided printed wiring board can be applied not only when soldering a surface-mounted component but also when soldering a through-hole mounted component (inserted component with lead), for example.

It is a top view which shows the structure of the double-sided printed wiring board which is 1st Example of this invention. It is a bottom view which shows the structure of the double-sided printed wiring board. It is a top view which shows the structure of the double-sided printed wiring board. It is sectional drawing which shows the structure of the double-sided printed wiring board. It is sectional drawing along the AA line of FIG. It is an enlarged plan view which expands and shows the B section of FIG. It is an expanded sectional view which expands and shows the C section of FIG. It is a top view which shows the structure of the double-sided printed wiring board which is 2nd Example of this invention. It is sectional drawing along the DD line of FIG. It is sectional drawing which shows the structure of the double-sided printed wiring board which is a modification of the 1st Example of this invention. It is explanatory drawing for demonstrating a prior art. It is explanatory drawing for demonstrating a prior art. It is explanatory drawing for demonstrating a prior art. It is explanatory drawing for demonstrating a prior art.

Explanation of symbols

1,1A, 1B Double-sided printed wiring board (Double-sided printed wiring board)
2, 41, 75 Insulating layer 3, 42, 74 Conductive layer 4 Surface mount component (electronic component)
11, 43 Insulating substrate 16, 45, 76 Upper conductive layer (surface side conductive layer)
17, 46, 77 Lower conductive layer (back side conductive layer)
21a, 21b, 21c, 48a, 48b, 51a, 51b Signal wiring (wiring)
22a, 22b, 59, 61 Shield wiring 23a, 23b, ..., 24a, 24b, ... Slit-like non-copper foil region (non-conductor pattern for warpage prevention, slit-like region)

Claims (9)

An insulating substrate, a surface-side conductive layer formed on the surface side of the substrate and separated by a wiring pattern region, and a back-side conductive material formed on the back side of the substrate and not separated by a solid layer A double-sided printed wiring board composed of layers,
A double-sided print characterized in that a warp-preventing non-conductive pattern for preventing warpage of the insulating substrate due to heating during reflow mounting of electronic parts is provided on the back side of the wiring pattern region or its vicinity. Wiring board. An insulating substrate, a surface-side conductive layer formed on the surface side of the substrate and divided into right and left by a wiring pattern region passing through the central region or the vicinity region of the surface, and formed on the back side of the substrate Is a double-sided printed wiring board composed of a back side conductive layer in which the solid layer is not divided in the central region of the back surface or the vicinity thereof,
A double-sided print characterized in that a warp-preventing non-conductive pattern for preventing warpage of the insulating substrate due to heating during reflow mounting of electronic parts is provided on the back side of the wiring pattern region or its vicinity. Wiring board.   3. The double-sided printed wiring board according to claim 2, wherein the left / right dividing ratio is set in a range of 3/1 to 1/3.   4. The double-sided printed wiring board according to claim 1, wherein the warp preventing non-conductive pattern is provided along a wiring in the wiring pattern region.   A plurality of wirings are formed in the wiring pattern region, and a shield wiring is formed between the wirings adjacent to each other, and the non-conductive pattern for warpage prevention is provided so as to overlap the shield wiring. The double-sided printed wiring board according to claim 1, wherein the double-sided printed wiring board is provided.   On the back side of the insulating substrate, a plurality of slit-like regions are arranged along the wiring in the wiring pattern region as the warp-preventing non-conductive pattern, and the gap between the slit-like regions adjacent to each other is 6. The double-sided printed wiring board according to claim 1, wherein the double-sided printed wiring board is a current path that connects the conductive regions constituting the solid layers on both sides across the plurality of slit-like regions. .   An electronic apparatus comprising the double-sided printed wiring board according to claim 1. An insulating substrate, a surface-side conductive layer formed on the surface side of the substrate and separated by a wiring pattern region, and a back-side conductive material formed on the back side of the substrate and not separated by a solid layer A method of manufacturing a double-sided printed wiring board composed of layers,
A double-sided printed wiring board characterized by providing a warp-preventing non-conductive pattern for preventing warpage of the insulating substrate due to heating during reflow mounting of electronic components on the back side of the wiring pattern region or its vicinity. Production method. An insulating substrate, a surface-side conductive layer formed on the surface side of the substrate and divided into right and left by a wiring pattern region passing through the central region or the vicinity region of the surface, and formed on the back side of the substrate Is a method of manufacturing a double-sided printed wiring board composed of a back side conductive layer in which the solid layer is not divided in the central region of the back surface or the vicinity thereof,
A double-sided printed wiring board characterized by providing a warp-preventing non-conductive pattern for preventing warpage of the insulating substrate due to heating during reflow mounting of electronic components on the back side of the wiring pattern region or its vicinity. Production method.

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