JP2008112030A - Optical circuit substrate with adhesive, component for mounting optical element and optical element mounted component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an optical element mounted component in which light propagation loss is reduced, an optical circuit substrate for mounting an optical element in which the optical element is accurately positioned and a component for mounting an optical element. <P>SOLUTION: The optical element mounted component is composed by including the optical elements 901', 901"; an optical circuit substrate 106 comprising an optical waveguide layer having a core part and a clad part; and a wiring component 601' furnished with a mounting part for mounting the optical elements. The optical element mounted component is further provided with a receptor structure having a conductive body part with which the conductive member of the optical elements and the conductive member of the optical element mounting part of the wiring component are electrically conducted. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an optical circuit board with an adhesive, an optical element mounting component, and an optical element mounting component.

  In recent years, electronic devices have been increasingly demanded for miniaturization and high performance. In particular, in order to cope with high-speed signals, studies are being made to increase the speed of signal transmission paths in electronic devices by connecting electronic components with optical signals. For connection by optical signal, an optical / electrical hybrid substrate having optical wiring and electrical wiring is used, and the optical wiring has an optical waveguide composed of a core portion and a cladding portion, and the core portion of the optical waveguide. The optical signal is transmitted by transmitting the light.

In an electronic device equipped with such a mixed optical / electrical board, an electronic component is mounted on the board, and an input / output signal of the electronic component is converted into an optical signal using an optical element and propagated to an optical waveguide. First, it is advantageous to use a structure in which an optical signal is converted back to an electrical signal using the other optical element and connected to the other electronic component. Conventionally, such a substrate has been integrated with a rigid substrate such as an optical waveguide formed in the rigid substrate. For example, an optical element and an electronic component are mounted on the substrate, The signal is transmitted from the mounting surface through the substrate through the electric wiring formed on the opposite side, and the optical signal is propagated from the optical waveguide formed in the substrate, and the insulating layer is passed through the optical waveguide. However, in such a structure, there is a limit to downsizing such that it cannot be further thinned, and Since there is a distance between the light emitting / receiving portion of the optical element and the core portion of the optical waveguide, it may affect the efficiency of light input from the light emitting portion to the core portion, and may cause problems in characteristics such as loss of light propagation. . Further, as one method for solving such a problem, there is a demand for alignment accuracy between the light emitting / receiving portion of the optical element and the core portion of the optical waveguide.
JP 2002-182049 A

  The present invention provides an optical element mounting component capable of reducing the loss of light propagation, an optical circuit board with an adhesive having good alignment accuracy in mounting the optical element, and an optical element mounting component.

The present invention provides an optical circuit board with an adhesive according to the following items (1) to (18), an optical element mounting component according to items (19) to (20), and items (21) to (21). This is achieved by the optical element mounting component of item (29).
(1) An optical waveguide layer having a core portion and a clad portion, which is laminated on one surface side of a wiring component on which an optical element having an electrode is mounted, and a wiring component provided with a pad on the mounting portion; An optical circuit board including a conductor portion that electrically connects the electrode of the optical element and the pad of the mounting portion;
Between the wiring component and the optical circuit board, an adhesive layer that electrically connects the conductor part of the optical circuit board and the pad part of the mounting part,
An optical circuit board with an adhesive.
(2) The optical circuit board with an adhesive according to (1), wherein the optical circuit board includes a receptor structure for electrically connecting the electrode of the optical element and the pad of the wiring component. .
(3) The adhesive layer includes a resin, a curing agent having flux activity, and solder powder, and the solder powder and the curing agent having flux activity are present in the resin. The optical circuit board with an adhesive according to item (1) or (2).
(4) The adhesive layer includes a resin, a curing agent having flux activity, and solder powder, and the solder powder and the curing agent having flux activity are present in the resin. The optical circuit board with an adhesive according to item (3), wherein the optical circuit board has an adhesive.
(5) The optical circuit board with an adhesive according to (3) or (4), wherein the resin includes an epoxy resin and acrylic rubber in the adhesive layer.
(6) In the said adhesive bond layer, the hardening agent which has the said flux activity is a compound containing a carboxyl group, The light with an adhesive of any one of the (3) term | claim thru | or (5) term | claim. Circuit board.
(7) In the adhesive layer, the curing agent having the flux activity is any one of items (3) to (6), which is a compound containing a carboxyl group and a group that reacts with an epoxy group. 2. An optical circuit board with an adhesive according to item 1.
(8) The optical circuit board with an adhesive according to (6) or (7), wherein the curing agent having the flux activity in the adhesive layer is an alkyl carboxylic acid or an aromatic carboxylic acid.
(9) In the adhesive layer, the solder powder is an alloy containing two or more selected from Sn, Ag, Bi, In, Zn, and Cu, and any one of (3) to (8) An optical circuit board with an adhesive according to claim 1.
(10) In the adhesive layer, the solder powder has an adhesive according to any one of items (3) to (9), which has a melting point of 100 ° C. or higher and 250 ° C. or lower. Optical circuit board.
(11) In the adhesive layer, the resin includes an epoxy resin that is solid at room temperature and an epoxy resin that is liquid at room temperature, and any one of items (3) to (10) An optical circuit board with adhesive as described.
(12) Any one of Items (2) to (11), wherein the conductor portion that electrically connects the electrode of the optical element and the pad of the mounting portion is provided in the receptor structure. An optical circuit board with an adhesive according to Item.
(13) The optical circuit board with an adhesive according to item (12), wherein the conductor portion in the receptor structure includes a conductor post provided on a wiring component side bottom in the receptor structure.
(14) The optical circuit board with an adhesive according to item (13), wherein the conductor post of the conductor part in the receptor structure protrudes from the optical element mounting surface of the optical circuit board.
(15) The optical circuit board with an adhesive according to any one of (1) to (14), wherein the optical circuit board has a conductor circuit on the optical waveguide layer.
(16) The optical circuit board according to (12) to (15), wherein the optical circuit board has a conductor circuit connected to a conductor post of a conductor portion in a receptor structure on a joint surface with the wiring component. An optical circuit board with an adhesive according to any one of the preceding claims.
(17) The optical circuit board includes a conductive circuit on the side surface on which the optical element is mounted, and the conductive member of the wiring component so as to pass through the optical circuit board and to make electrical connection with the wiring component on the conductive circuit. The optical circuit board with an adhesive according to any one of items (1) to (16), which has a conductor portion for metal bonding.
(18) The optical circuit board includes an optical path conversion unit that bends the optical path of the core unit toward the light receiving and emitting unit of the optical element in the core unit. The optical circuit board with an adhesive according to any one of (17).
(19) a wiring component having a pad portion for mounting an optical element;
The optical circuit board with an adhesive according to any one of (1) to (18),
Comprising
An optical element mounting component in which the optical circuit board and the wiring component are bonded together by an adhesive layer that electrically connects the electrode of the optical element and the pad portion of the wiring component.
(20) The optical element mounting component according to (19), wherein the optical element mounting component has a structure in which the two wiring components are joined in a bridge shape by the optical circuit board.
(21) an optical element having an electrode;
The component for mounting an optical element according to item (19) or (20),
Comprising
The optical element is mounted on the pad of the wiring component having a pad portion for mounting the optical element via the optical circuit board in the optical element mounting component,
The optical circuit board and the wiring component are optical device mounting components joined by an adhesive layer that electrically connects the electrodes of the optical device and the pads of the wiring component.
(22) The optical element according to item (21), wherein the electrode of the optical element and the pad of the wiring component are electrically connected via a receptor structure formed on the optical circuit board. Mounting parts.
(23) In the receptor structure of the optical circuit board of the component for mounting an optical element, the electrode of the optical element and the pad of the wiring component are metal-bonded by a conductor portion in the receptor structure. The optical element mounting component according to item (21) or (22).
(24) In the item (23), the conductor portion in the receptor structure is formed by metal bonding of a conductor post protruding from the optical element mounting surface of the optical circuit board and an electrode of the optical element. The optical element mounting component described.
(25) Any one of the items (21) to (24), wherein the conductor portion in the receptor structure is composed of a protrusion provided on the electrode of the optical element and a conductor post. The optical element mounting component according to Item.
(26) The conductor circuit formed on the optical element mounting side surface of the optical circuit board and the optical circuit board are formed so as to be electrically connected to the conductive member of the wiring component through the optical circuit board. The optical element mounting component according to any one of items (21) to (25), wherein the conductor portion and the conductive member of the wiring component are metal-bonded.
(27) The optical element mounting component has any one of the items (21) to (26), wherein the two wiring components are joined in a bridge shape by the optical circuit board. The optical element mounting component according to Item 1.
(28) The optical element mounting component aligns the optical element mounting portion pad of the wiring component and the receptor structure portion of the optical circuit board, and mounts the optical element on the optical circuit board, and the receptor structure. Any one of (21) to (27), which is obtained by metal bonding the electrode of the optical element and the pad of the wiring component through a conductor portion in the portion. The optical element mounting component according to Item.
(29) The optical element mounting component according to any one of items (21) to (28), wherein the wiring component in the optical element mounting component is an electronic device wiring component.

According to the present invention, it is possible to obtain an optical element mounting component with high mounting accuracy and capable of reducing light propagation loss. Since the optical element mounting component of the present invention has a short distance between the light receiving and emitting part of the optical element and the core part of the optical waveguide, it can transmit light efficiently and can be thinned.
According to the present invention, it is possible to obtain an optical element mounting component and an optical circuit board for an optical element mounting component, which have good alignment accuracy in mounting an optical element and can be easily mounted. The component for mounting an optical element of the present invention is not limited as long as the optical circuit board and the wiring component are separately prepared and have a portion on which the optical element can be mounted. Therefore, the size can be reduced and the degree of freedom of design is increased.

The present invention provides a mounting portion for mounting an optical element having an electrode, and an optical waveguide layer having a core portion and a cladding portion, which are laminated on one surface side of a wiring component provided with a pad on the mounting portion. , An optical circuit board configured to include a conductor portion that electrically connects the electrode of the optical element and the pad of the mounting portion, and the optical circuit board between the wiring component and the optical circuit board. An adhesive-attached optical circuit board having an adhesive layer that electrically connects a conductor part and a pad part of the mounting part. According to this, the optical circuit board and the wiring component are used. In mounting the optical element, the alignment accuracy between the electrode of the optical element and the pad of the wiring component is good.
Further, the present invention is configured to include the wiring component and the optical circuit board with an adhesive, and the optical circuit board and the wiring component include an electrode of the optical element and a pad portion of the wiring component. An optical element mounting component joined by an electrically connecting adhesive layer. According to this, in mounting of an optical element using the optical element mounting component, the electrode of the optical element and the wiring component The alignment accuracy with the pad is good, and the degree of freedom of combination of the wiring component and the optical circuit board is high, and the size can be reduced.
According to another aspect of the present invention, there is provided an optical element having an electrode and the optical element mounting component, and the optical element is mounted on the optical element mounting component via the optical circuit board. The optical element is mounted on the pad of a wiring component having a pad portion, and the optical circuit board and the wiring component are bonded to electrically connect the electrode of the optical element and the pad of the wiring component. An optical element mounting component joined by an agent layer. According to this, the mounting accuracy of the optical element is high, the loss of light propagation can be reduced, and the thickness can be reduced.

Hereinafter, the optical circuit board with an adhesive, the component for mounting an optical element, and the component for mounting an optical element of the present invention will be described in detail.
The receptor structure in the present invention is a through hole for mounting an optical element provided in an optical circuit board, and the through hole has a structure for electrically connecting the optical element and an electric circuit of a wiring component by an electric conductor. Is. Further, the through hole can be used as an alignment portion between the light receiving and emitting portion of the optical element and the core portion of the optical waveguide. By providing this, the mounting accuracy is improved, and the light propagation loss is further reduced. Can be reduced.
Examples of the optical element in the present invention include a light receiving element and a light emitting element.

The optical circuit board in the present invention is composed of an optical waveguide layer having a core part and a cladding part, and preferably, when the optical element is mounted on the optical element mounting part of the wiring component, the optical element This is provided with a receptor structure for electrical connection between the electrode of the conductive member and the pad of the conductive member of the wiring component. The optical circuit board may have a conductor post or the like for passing through the electric circuit or the electric circuit and the optical circuit board in the clad portion so as to conduct electrical conduction on both surfaces.
The optical circuit board with an adhesive of the present invention is an optical circuit board having an adhesive layer for electrically connecting the conductive members on the joint surface with the wiring component. Embodiments of the present invention will be described below with reference to the drawings.

(Optical waveguide)
First, an optical waveguide layer 101 as shown in FIG.
As shown in FIG. 1A, the core layer 102 has a core portion having a refractive index higher than that of the cladding portion. The optical waveguide layer 101 includes a core layer 102 that forms a core portion, and a clad portion that is formed by clad layers 103 a and 103 b provided on both surfaces of the core layer 102. As a result, light can be transmitted through the core. In the optical waveguide layer, a plurality of the core portions may be provided.

  Such an optical waveguide layer 101 is formed by, for example, applying a varnish containing a material constituting a cladding layer on a substrate to form a cladding layer, and then forming a core layer on the cladding layer. A varnish containing is applied to form a core layer, and then a varnish containing a material constituting the cladding layer is applied onto the core layer to form another cladding layer. At this time, by using a metal plate such as copper and copper alloy as the base material, an optical waveguide layer with a metal plate is prepared, and the metal plate is etched to form a conductor circuit, thereby forming a conductor circuit on the clad layer. A conductor layer can be formed on the substrate. At this time, the thickness of the formed three layers is usually preferably about 70 to 150 μm, for example. Further, by irradiating the intermediate formed by the core layer 102 and the clad layers 103a and 103b provided on both surfaces of the core layer 102 with active energy rays through a photomask, the core portion is formed. can get. According to this method, a portion other than the core portion of the core layer 102 described later and all of the cladding layers 103a and 103b constitute the cladding portion.

(Core layer)
Examples of the material constituting the core layer 102 include resin materials such as cyclic olefin resins such as acrylic resins, epoxy resins, polyimide resins, benzocyclobutene resins, and norbornene resins. Among these, norbornene resins (particularly, addition polymers of norbornene resins) are preferable. Thereby, it is excellent in transparency, a softness | flexibility, insulation, and heat resistance. Furthermore, the hygroscopicity can be lowered as compared with the case where other resins are used.

Moreover, as a constituent material of the core layer 102, a material whose refractive index changes by irradiation with active energy rays or further heating is preferable. Preferred examples of such a material include a resin composition containing a cyclic olefin resin such as a benzocyclobutene resin and a norbornene resin as a main material, and a norbornene resin (particularly a norbornene resin). Those containing (addition polymer) (as the main material) are particularly preferred.
Examples of the active energy rays used for the exposure include active energy rays such as visible light, ultraviolet light, infrared light, and laser light, electron beams, and X-rays. The electron beam can be irradiated with an irradiation amount of about 50 to 2000 KGy, for example.

(Clad layer)
The material constituting the clad layers 103 a and 103 b is not particularly limited as long as the refractive index is lower than that of the material constituting the core layer 102. Specific examples include resin materials such as cyclic olefin resins such as acrylic resins, epoxy resins, polyimide resins, and norbornene resins. Among these, norbornene resins (in particular, addition polymers of norbornene resins) are preferable. Thereby, it is excellent in transparency, insulation, flexibility, and heat resistance. Furthermore, the hygroscopicity can be lowered as compared with the case where other resins are used.

  For example, in the case of an addition polymer of norbornene resin, the refractive index can be adjusted depending on the type of the side chain. Specifically, the refractive index can be adjusted as appropriate by providing an alkyl group, an aralkyl group, a halogenated alkyl group, a silyloxy group, or the like in the side chain of a norbornene resin (especially an addition polymer is preferred). Thereby, a difference in refractive index from the material constituting the core portion can be generated.

  In particular, the material constituting the core layer 102 is preferably an addition polymer of norbornene resin, and the material constituting the clad layers 103a and 103b is preferably an addition polymer of norbornene resin. Thereby, especially heat resistance and toughness can be improved.

Specifically, the norbornene-based resin (addition polymer thereof) constituting the clad layers 103a and 103b preferably has a linear aliphatic group in the side chain. Thereby, a softness | flexibility and folding resistance can be improved. Examples of the linear aliphatic group include propyl group, butyl group, pentyl group, hexyl group, heptyl group, octyl group, nonyl group, and decyl group.
The clad layers 103a and 103b may be made of the same constituent material or different constituent materials.

  In addition to the method described above, the optical waveguide layer 101 can be obtained by a known method such as a method in which a core portion is provided in a previously formed recess and the periphery thereof is covered with a clad material (cladding portion).

(Optical path conversion unit)
When the optical waveguide layer 101 mounts an optical element on an optical circuit board (optical element mounting component), the optical path of the core portion of the optical waveguide layer is changed according to the optical element mounting position. It is possible to provide an optical path changing portion that is bent toward the head.
A method for forming an example of the optical path conversion unit will be described.
As shown in FIG. 1B, the optical path conversion unit 105 has an inclined surface formed by providing a space having a triangular cross section from one surface side of the optical waveguide layer 101 as described above.
The inclined surface is inclined (approximately 45 degrees with respect to the light transmission direction of the core portion) with respect to the light transmission direction of the core portion provided in the core layer 102. Thereby, for example, as indicated by an arrow A in FIG. 2, light transmitted through the core portion provided in the core layer 102 is totally reflected, and the light transmission direction can be changed to a substantially right angle.

  Briefly describing the method of forming such an optical path changing portion, a laser is irradiated to a portion where the reflection portion of the optical waveguide layer 101 composed of a core portion and a clad portion bonded to the outer periphery of the core portion is formed. Then, by changing the irradiation region of the laser relative to the optical waveguide layer 101, the irradiation time of the laser to the portion of the optical waveguide layer where the optical path changing portion is formed is partially changed, so that the optical waveguide layer of the laser is changed. The optical path conversion part can be formed by removing the constituent material of the optical waveguide layer while adjusting the degree of reach in the depth direction. Thus, since the reflection part can be formed by laser irradiation, it is easy to form the optical path conversion part in an arbitrary pattern at an arbitrary position. Therefore, the pattern of the optical wiring can be easily formed.

Examples of the laser include an excimer laser such as ArF and KrF, a YAG laser, and a CO ₂ laser.

  Although the irradiation energy of a laser is not specifically limited, 1-10 mJ is preferable and 5-7 mJ is especially preferable. Within the above range, the constituent material of the optical waveguide layer 101 can be removed in a short time. Although the frequency at the time of laser irradiation is not specifically limited, 50-300 Hz is preferable and 200-250 Hz is especially preferable. When the frequency is within the above range, the smoothness of the inclined surface is particularly excellent.

  The size of the optical waveguide layer 101 that is irradiated with laser depends on the size of the optical path changing portion to be formed, but is not particularly limited, but is preferably 80 to 200 μm × 80 to 200 μm, and particularly 100 to 150 μm × 100. It is preferable that it is -150 micrometers. Thereby, a fine optical path conversion part can be formed.

(Receptor structure)
Next, a method for manufacturing the receptor structure will be described.
As a manufacturing method of the receptor structure portion, for example, an optical element mounting is performed by placing a mask having an opening at a predetermined position for forming the receptor structure on the optical waveguide layer 101 obtained above and irradiating a laser. It can be obtained by providing a through hole 104 for a receptor structure that penetrates the surface and the wiring component bonding surface (optical circuit base substrate (G1) 106).
The receptor structure part is formed on the optical element mounting part in accordance with at least the position of the conductive member (electrode, metal protrusion) of the optical element. As will be described later, the conductor structure of the through hole 104 for receptor structure is processed in accordance with a desired receptor structure.
As the size of the through hole 104 for receptor structure, an optical element can be mounted, and a conductive member for electrically connecting the optical element and a wiring component can be disposed or a conductor portion can be provided. The diameter may be about 100 to 125 μm, but is not limited thereto. The shape of the through hole is not particularly limited, such as a columnar shape or a prismatic shape.
Examples of the laser include a carbon dioxide laser, an excimer laser, and an ultraviolet laser. Further, as a method of forming the through hole, a method by laser irradiation has been described, but any method may be used as long as it is a method suitable for this manufacturing method, and a method such as plasma dry etching or chemical etching can also be exemplified. .

  In the present invention, when the receptor structure is not provided on the optical circuit board, for example, a through hole into which a conductive member such as a plug for electrically connecting the optical element and the wiring component is inserted may be provided. .

  When providing a conductor circuit on the cladding layer of the optical circuit board, for example, in the optical waveguide layer 101 obtained above, a metal plate such as copper and copper alloy is bonded to the surface of the cladding layer on which the conductor circuit is provided, A conductor circuit can be formed by etching. In addition, by using the optical waveguide layer with a metal plate, the metal plate may be etched to form a conductor circuit.

(adhesive)
The adhesive layer used in the present invention makes it possible to electrically connect conductive members, and specific examples include those containing a resin and conductive particles. The conductive particles are not particularly limited as long as they have conductivity, and various metals such as nickel, iron, copper, aluminum, tin, lead, chromium, cobalt, silver and gold, these metal alloys and Examples thereof include metal oxides and metal powders such as solder, conductive carbon powders such as carbon and graphite, and particles such as glass, ceramics and plastics coated with the metal. More preferably, the adhesive layer contains a resin, solder powder, and a curing agent having flux activity. Among these, the solder powder and the curing agent having flux activity are preferably present in the resin, but the adhesive layer used in the present invention is formed from an adhesive tape formed as an adhesive dry film. It is preferred that Further, by using a solder powder and a hardener having flux activity as the adhesive layer, the solder powder particles are concentrated and moved to the conductive member portion by a self-alignment effect in the bonding process, and are stable. A metal bond can be formed to allow electrical bonding.
Hereinafter, each component of the adhesive layer will be specifically described.

  The resin is not particularly limited, and a thermoplastic resin, a thermosetting resin, or a mixed system of a thermoplastic resin and a thermosetting resin can be used. Of these, a mixed system of a thermoplastic resin and a thermosetting resin is preferable from the viewpoints of film formability and the melt viscosity of the resin. More specifically, the resin may include an epoxy resin and acrylic rubber.

  The thermoplastic resin is not particularly limited. For example, phenoxy resin, polyester resin, polyurethane resin, polyimide resin, siloxane-modified polyimide resin, polybutadiene, polypropylene, styrene-butadiene-styrene copolymer, styrene- Ethylene-butylene-styrene copolymer, polyacetal resin, polyvinyl butyral resin, polyvinyl acetal resin, butyl rubber, chloroprene rubber, polyamide resin, acrylonitrile-butadiene copolymer, acrylonitrile-butadiene-acrylic acid copolymer, acrylonitrile-butadiene-styrene Copolymers, polyvinyl acetate, nylon, acrylic rubber, and the like can be used. These can be used individually or in mixture of 2 or more types.

  The thermoplastic resin may be one having a functional group such as a nitrile group, an epoxy group, a hydroxyl group and a carboxyl group for the purpose of improving adhesiveness and compatibility with other resins. As the resin, for example, acrylic rubber can be used.

  Although it does not restrict | limit especially as said thermosetting resin, For example, an epoxy resin, oxetane resin, a phenol resin, (meth) acrylate resin, unsaturated polyester resin, diallyl phthalate resin, maleimide resin etc. are used. Among these, an epoxy resin excellent in curability and storage stability, heat resistance of the cured product, moisture resistance, and chemical resistance is preferably used.

  As the epoxy resin, any one of an epoxy resin solid at room temperature and an epoxy resin liquid at room temperature may be used. The resin may include an epoxy resin that is solid at room temperature and an epoxy resin that is liquid at room temperature. Thereby, the freedom degree of design of the melting behavior of resin can further be raised.

  The epoxy resin solid at room temperature is not particularly limited. For example, bisphenol A type epoxy resin, bisphenol S type epoxy resin, phenol novolac type epoxy resin, cresol novolac type epoxy resin, glycidylamine type epoxy resin, Examples thereof include glycidyl ester type epoxy resins, trifunctional epoxy resins, and tetrafunctional epoxy resins. More specifically, a solid trifunctional epoxy resin and a cresol novolac type epoxy resin may be included.

  Moreover, as a liquid epoxy resin at room temperature, a bisphenol A type epoxy resin or a bisphenol F type epoxy resin can be used, for example. Moreover, you may use combining these.

  Moreover, the film-forming stability at the time of producing a film-form adhesive layer can be improved by setting resin as the structure containing an acrylic rubber. In addition, since the elastic modulus of the adhesive layer can be reduced and the residual stress between the adherend and the adhesive layer can be reduced, adhesion to the adherend can be improved.

  As the compounding ratio of the resin in the adhesive layer used in the present invention, when the acrylic rubber is included as the resin, for example, the acrylic rubber is 10% by weight or more and 50% by weight with respect to the total of the components of the adhesive layer excluding the solder powder. % Or less is preferable. By setting the blending ratio of the acrylic rubber to 10% by weight or more, a decrease in film formability is suppressed, and further, an increase in elastic modulus after curing of the adhesive layer is suppressed, so that adhesion to an object to be bonded is suppressed. Can be further improved. Further, by setting the blending ratio of the acrylic rubber to 50% by weight or less, an increase in the melt viscosity of the resin is suppressed, and the solder powder can be more reliably moved to the surface of the conductive member.

  Moreover, it is preferable that the compounding ratio of an epoxy resin shall be 20 weight% or more and 80 weight% or less with respect to the sum total of the structural component of the adhesive bond layer except electroconductive particle (solder powder etc.). By setting the blending ratio of the epoxy resin to 20% by weight or more, it is possible to further sufficiently secure the elastic modulus after bonding and improve the connection reliability. Moreover, since the melt viscosity can be further increased by setting the blending ratio of the epoxy resin to 80% by weight or less, the conductive particles (such as solder powder) protrude from the adherend and the connection reliability is lowered. Can be suppressed.

  Further, from the viewpoint of surely moving the solder powder in the resin in the conductive particles, the curing temperature of the resin is preferably higher than the melting temperature of the solder powder described later. More specifically, the curing temperature of the resin is preferably higher by 10 ° C. or higher than the melting point of the solder, and more preferably higher by 20 ° C. or higher. In addition, the resin may have a low melt viscosity at the bonding temperature.

  Here, the curing temperature of the resin is the exothermic peak temperature when the adhesive layer is measured at a heating rate of 10 ° C./min using, for example, DSC (Differential Scanning Calorimeter).

  In the adhesive layer used in the present invention, for example, lead-free solder can be used as the solder constituting the solder powder. Although it does not specifically limit as lead-free solder, It is preferable that it is an alloy containing at least 2 or more types chosen from Sn, Ag, Bi, In, Zn, and Cu. Among these, in consideration of the melting temperature and mechanical properties, an alloy containing Sn, such as an Sn—Bi alloy, an Sn—Ag—Cu alloy, and an Sn—In alloy, is preferable. In the present invention, it is desirable to select a solder that can be melted at a lower temperature and capable of metal bonding in consideration of the heat resistance of the optical circuit board and the optical element, depending on the manufacturing process.

  In general, the melting temperature of the solder powder is preferably 100 ° C. or higher, and more preferably 130 ° C. or higher, from the viewpoint of sufficiently ensuring the fluidity of the resin when bonding the adhesive layer. In addition, the melting temperature of the solder powder is preferably, for example, 250 ° C. or less, and preferably 230 ° C. or less from the viewpoint of suppressing deterioration of components provided on the optical element, the optical circuit board, and the wiring component at the time of bonding. It is more preferable. Although these melting temperatures depend on the type of solder, they are selected depending on the heat resistance of the optical circuit board and the optical element depending on the manufacturing process.

  Here, the melting temperature of the solder is, for example, the endothermic peak temperature when a single solder powder is measured at a temperature rising rate of 10 ° C./min using DSC.

  In addition, from the viewpoint of more reliably moving the solder powder to the surface of the conductive member, the melting temperature of the solder powder is set to a temperature lower than the curing temperature of the resin.

  The particle size of the solder powder can be set according to the surface area of the conductive member and the interval between the conductive members. The average particle size of the solder powder is preferably 5 μm or more, and more preferably 10 μm or more, from the viewpoint of reliably gathering the solder powder on the surface of the conductive member. In addition, from the viewpoint of selectively forming a solder region on the surface of the conductive member and ensuring insulation of the adhesive layer in a region other than the region to be conducted such as the conductive member, the average particle size of the solder powder is set. For example, it is preferably 100 μm or less, and more preferably 50 μm or less. Here, the average particle diameter of the solder powder is measured by, for example, a laser diffraction scattering method.

  Moreover, in the adhesive layer used in the present invention, the blending ratio of the conductive particles (such as solder powder) improves the connection reliability with respect to a total of 100 parts by weight of components other than the conductive particles (such as solder powder). From the viewpoint, 20 parts by weight or more is preferable, and 40 parts by weight or more is more preferable. Further, from the viewpoint of improving the film formability of the adhesive layer, the amount is preferably 250 parts by weight or less, more preferably 230 parts by weight or less, with respect to 100 parts by weight of the total components other than the solder powder in the adhesive layer. preferable.

  As the curing agent having flux activity used in the adhesive layer in the present invention, a functional group that exhibits an action of reducing the oxide film on the surface of the solder powder to such an extent that it can be electrically bonded to the conductive member and that binds to the resin. It is a compound that has.

  The curing agent having flux activity can be appropriately selected and used according to the kind of solder powder from the viewpoint of removing the oxide film on the surface of the solder powder during bonding.

As a hardening | curing agent which has flux activity, the compound containing a carboxyl group can be mentioned, for example. Examples of the compound containing a carboxyl group include carboxylic acids such as linear or branched alkyl carboxylic acids and aromatic carboxylic acids.
Moreover, when resin contains an epoxy resin, the hardening | curing agent which has flux activity may have a carboxyl group and the group which reacts with an epoxy group. Examples of the group that reacts with the epoxy group include a carboxyl group, a hydroxyl group, and an amino group.

Specific examples of the alkylcarboxylic acid include compounds represented by the following formula (1).
_{HOOC- (CH 2) n -COOH (} 1)
In the above formula (1), n is an integer of 0 or more and 20 or less.
Moreover, n in said Formula (1) has preferable 4 or more and 10 or less from the balance of the flux activity, the outgas at the time of adhesion | attachment, the elasticity modulus after hardening of an adhesive bond layer, and a glass transition temperature. By setting n to 4 or more, it is possible to suppress an increase in the elastic modulus after curing of the adhesive layer due to the too short distance between crosslinks of the epoxy resin, and to improve the adhesion to the adherend. In addition, by setting n to 10 or less, it is possible to suppress a decrease in elastic modulus due to an excessively long distance between crosslinks of the epoxy resin, and to further improve connection reliability.

Examples of the compound represented by the above formula (1) include n = 4 adipic acid (HOOC— (CH ₂ ) ₄ —COOH), n = 8 sebacic acid (HOOC— (CH ₂ ) ₈ —COOH) and n = 10 HOOC— (CH ₂ ) ₁₀ —COOH and the like.

Specific examples of the aromatic carboxylic acid include compounds containing, in one molecule, at least two phenolic hydroxyl groups and at least one carboxyl group directly bonded to the aromatic group. Examples of such compounds include 2,3-dihydroxybenzoic acid, 2,4-dihydroxybenzoic acid, gentisic acid (2,5-dihydroxybenzoic acid), 2,6-dihydroxybenzoic acid, and 3,4-dihydroxybenzoic acid. Benzoic acid derivatives such as acid and gallic acid (3,4,5-trihydroxybenzoic acid);
Naphthoic acid derivatives such as 1,4-dihydroxy-2-naphthoic acid, 3,5-dihydroxy-2-naphthoic acid, 3,7-dihydroxy-2-naphthoic acid;
Phenolphthaline; and diphenolic acid.

  More specifically, examples of the curing agent having flux activity include the above-mentioned sebacic acid and gentisic acid, and one or any of these may be included.

  In the adhesive layer constituting the present invention, the curing agent having flux activity may be present outside the solder powder. For example, the solder powder and the curing agent having flux activity are dispersed in the resin, respectively. It may be attached to the surface of the solder powder dispersed in the resin. Since the curing agent having the flux activity is present outside the solder powder, the curing agent having the flux activity efficiently moves to the interface between the solder and the conductive material in the adherend during bonding, The conductive member and the solder can be brought into direct contact. Thereby, connection reliability can be improved. Moreover, since the hardening | curing agent which has flux activity exists in resin, it can add to resin efficiently and can raise the elasticity modulus or Tg of resin.

  In addition, in the adhesive layer constituting the present invention, the blending ratio of the curing agent having the flux activity is such that the flux activity is relative to the total of the constituent components of the adhesive layer excluding the solder powder from the viewpoint of improving the flux activity. For example, the blending ratio of the curing agent is preferably 0.1% by weight or more, and more preferably 1% by weight or more. Moreover, from the viewpoint of lowering the melt viscosity of the resin at the time of adhesion, the blending ratio of the curing agent having flux activity is, for example, 30% by weight or less with respect to the total of the constituent components of the adhesive layer excluding the solder powder. It is preferably 10% by weight or less.

  More specifically, when the adhesive layer constituting the present invention contains an epoxy resin, the blending ratio of the curing agent having flux activity with respect to the epoxy resin in the adhesive layer is, for example, 50% by weight or less. It is preferable to make it 30% by weight or less. By so doing, excessive curing agent is eliminated and curability is improved.

  In addition, the adhesive bond layer which comprises this invention may further contain the hardening | curing agent different from the hardening | curing agent which has flux activity in resin, and may contain resin which functions as a hardening | curing agent.

  The curing agent different from the curing agent having the flux activity is not particularly limited, and examples thereof include phenols, amines and thiols, but reactivity with epoxy resin and physical properties after curing. When phenol is considered, phenols are preferably used.

  Although it does not specifically limit as said phenols, When considering the physical property after hardening of an adhesive bond layer, bifunctional or more phenols are preferable. Examples include bisphenol A, tetramethyl bisphenol A, diallyl bisphenol A, biphenol, bisphenol F, diallyl bisphenol F, trisphenol, tetrakisphenol, phenol novolacs, and cresol novolacs. When considering the properties and physical properties after curing, phenol novolacs and cresol novolacs can be preferably used.

  In addition, as a blending amount of a curing agent different from the curing agent having flux activity, when the total of the constituent components of the adhesive layer excluding the solder powder is 100% by weight, the viewpoint of reliably curing the resin, For example, it is preferably 5% by weight or more, and more preferably 10% by weight or more. Moreover, from the viewpoint of improving the fluidity of the resin during bonding, when the total of the constituent components of the adhesive layer excluding the solder powder is 100% by weight, the blending amount of the curing agent is, for example, 40% by weight or less. It is preferable to make it 30% by weight or less.

  The adhesive layer constituting the present invention may further include a curing catalyst. By setting it as the structure containing a curing catalyst, resin can be hardened more reliably at the time of preparation of an adhesive bond layer.

  Although the said curing catalyst can be suitably selected according to the kind of resin, For example, imidazole compound whose melting | fusing point is 150 degreeC or more can be used. If the melting point of the imidazole compound is too low, before the solder powder moves to the electrode surface, the resin of the adhesive layer is hardened and metal bonding becomes unstable, or the storage stability of the adhesive layer may be reduced. is there. Therefore, the melting point of imidazole is preferably 150 ° C. or higher. Examples of the imidazole compound having a melting point of 150 ° C. or higher include 2-phenylhydroxyimidazole and 2-phenyl-4-methylhydroxyimidazole. In addition, there is no restriction | limiting in particular in the upper limit of melting | fusing point of an imidazole compound, For example, according to the adhesion temperature of an adhesive bond layer, it can set suitably.

  Further, the blending ratio of the curing catalyst is, for example, 0.01 wt% or more and 5 wt% or less when the total of the constituent components of the adhesive layer excluding the conductive particles (solder powder and the like) is 100 wt%. It is preferable to do. By setting the blending ratio of the curing catalyst to 0.01% by weight or more, the function of the epoxy resin as a curing catalyst can be more effectively exhibited and the curability of the adhesive layer can be improved. Moreover, the preservability of an adhesive bond layer can further be improved by the compounding ratio of a curing catalyst being 5 weight% or less.

  The adhesive layer constituting the present invention may further contain a silane coupling agent. By setting it as the structure containing a silane coupling agent, the adhesiveness to the to-be-adhered thing of an adhesive bond layer can further be improved. Examples of the silane coupling agent include an epoxy silane coupling agent and an aromatic-containing aminosilane coupling agent. One or both of these epoxysilane coupling agent and aromatic-containing aminosilane coupling may be included. For example, it can be set as the structure containing both of these. The compounding ratio of the silane coupling agent is preferably about 0.01 to 5% by weight, for example, when the total of the constituent components of the adhesive layer excluding the solder powder is 100% by weight.

  Furthermore, the adhesive layer constituting the present invention may contain components other than those described above. For example, various additives may be appropriately added in order to improve various properties such as resin compatibility, stability, and workability.

Next, a method for producing an adhesive layer in the present invention will be described. In the adhesive layer, first, conductive particles and other additives as necessary are mixed, and the conductive particles are mixed and dispersed in the resin to produce an adhesive. Also, when using solder powder as the conductive particles, resin, resin, solder powder, a curing agent having flux activity, and other additives as necessary are mixed, and the resin has solder powder and flux activity. A curing agent is mixed and dispersed to produce an adhesive. Next, the adhesive obtained as described above can be directly applied to a portion where the adhesive layer is formed using the coating liquid to form the adhesive layer.
Moreover, it can be set as an adhesive dry film by apply | coating the said coating liquid on peeling base materials, such as a polyester sheet, and drying at predetermined temperature. The dry film thus obtained can be used as an adhesive tape, which can be used after adjusting to a desired size.
Further, in the production of the dry film, on the release substrate, the coating liquid is applied only to a portion where the adhesive layer is formed by coating using a printing method or a dispenser, and dried at a predetermined temperature. You may produce the adhesive dry film in which the pattern of the adhesive bond layer was previously formed only in the adhesion location.

  In the adhesive layer and the film-like adhesive layer obtained as described above, a hardener having solder powder and flux activity is present in the resin. When this is placed between the objects to be bonded and heated, the solder powder in the resin moves in a self-aligned manner to the surface of the conductive member in the objects to be bonded, and a metal bond is formed.

(Optical circuit board)
Next, in the optical circuit board, a conductor circuit is provided on the optical element mounting surface, and the conductor circuit and the wiring component are electrically connected with each other. A conductor part for metal bonding to the conductive member of the wiring component may be formed, a method of forming a conductor circuit on the optical circuit board, and electrical conduction between both sides of the optical circuit board through the optical circuit board A method for forming a conductor portion for measuring the above will be described.

First, in the optical circuit base substrate (G1) 106 obtained above, a metal plate 301 is bonded to the optical element mounting surface (FIG. 3A), and then the optical waveguide layer 101 is penetrated on the metal plate 301. Then, a via is formed at a position where a conductor portion is formed in order to metal-connect a conductor circuit formed from the metal plate 301 and a conductive member of the wiring component (not shown).
As a method for forming the via, any method may be used as long as it is suitable for this manufacturing method, and examples thereof include laser, plasma dry etching, and chemical etching. Examples of the laser include a carbon dioxide gas laser, an excimer laser, and an ultraviolet laser.

Next, using the metal plate 301 as a lead for electroplating (a conductive member for power feeding), a conductor portion (conductor post 302) is formed in the via by electroplating (FIG. 3B), and then the metal plate 301 is etched to form a conductor circuit 303 (optical circuit base substrate (G2) 305) (FIG. 3C).
At this time, it is preferable to form a gold film 304 by electroplating or the like at the joint portion between the conductor portion (conductor post 302) of the optical circuit board and the conductive member of the wiring component opposite thereto (FIG. 3C). ), A gold film may be formed after nickel or the like is formed by electrolytic plating as a metal diffusion prevention layer. Similarly, a solder film (solder layer) may be formed on the tip surface of the conductor portion by electrolytic plating.
Examples of the method for forming the conductor portion (conductor post 302) include a method of forming by electroless plating and a method of printing a conductive paste containing copper and solder. The conductor portion (conductor post 302) is made of a metal or an alloy thereof, and examples of the metal include copper, solder, nickel, gold, tin, silver, and palladium, among which copper having low resistance is preferable. The conductor post (conductor post 302) varies depending on the method of metal bonding, but in order to improve the bondability, the solder post can be formed of one layer of solder or two layers of copper and solder. When the solder layer is formed on the conductor post, the solder film need not be formed.

Next, a method of providing a conductor portion for electrically connecting the electrode of the optical element and the pad portion of the wiring component in the optical circuit board used in the present invention will be described.
The conductor portion is provided in the receptor structure by filling a part or all of a conductor such as a conductor post from the bottom of the wiring component side in the receptor structure.

First, the surface of the optical circuit base substrate (G1) 106 obtained above that is in contact with the wiring component is bonded to the metal plate 401 (FIG. 4A).
The material of the metal plate 401 is preferably removable finally by etching, and examples thereof include copper and copper alloys.
At this time, an optical waveguide layer with a metal plate may be used when forming the optical waveguide layer as the optical circuit board.
As thickness of a metal plate, about 3-120 micrometers is preferable normally, and about 5-70 micrometers is more preferable.

  Next, a conductor post (conductor portion) 402 is formed from the bottom surface of the conductor portion on the wiring component side by electrolytic plating using the metal plate 401 as a lead for electroplating (a power supply conductive member) in the through hole 104 for the receptor structure. (FIG. 4B). At this time, when the optical element is mounted, in order to facilitate the bonding when the conductive post 402 and the conductive member such as the projecting portion provided on the electrode of the optical element or the electrode are metal-bonded. In order to form a sufficient thickness for bonding from the bottom, a part is filled and formed.

Next, the metal plate 401 is removed by etching. Further, preferably, a joint portion between the pad portion of the wiring component on the conductor post 402 provided in the receptor structure through hole 104 of the optical circuit base substrate 106 and a joint portion between the conductive member of the optical element on the conductor post 402. Then, gold films 403a and 403b are formed by electroplating or the like (optical circuit board (G3) 405) (FIG. 4C). Alternatively, the gold films 403a and 403b may be formed after nickel or the like is formed by electrolytic plating as a metal diffusion prevention layer.
Here, the entire surface of the metal plate 401 is removed. However, in the etching of the metal plate 401, partial etching is performed so as to cover at least the position where the electrical connection with the pad portion of the wiring component is made (the bottom surface on the wiring component side of the conductor portion). Conductor circuit may be formed. Thereby, the conductor circuit electrically connected with the conductor post of the conductor part in the said receptor structure can be formed in the joint surface with the said wiring component.

Examples of the method for forming the conductor post 402 include a method of forming by electroless plating, a method of printing a conductive paste containing copper, solder, and the like, in addition to a method of forming by electroplating. Forming a copper post by electrolytic plating is very preferable because the shape of the tip of the copper post can be freely controlled.
The material of the conductor post 402 is made of metal or an alloy thereof, and examples of the metal include copper, solder, nickel, gold, tin, silver, and palladium. Among them, copper having low resistance is preferable. Although the conductor post 402 differs depending on the method of metal bonding, in order to improve bondability, the solder post 402 can be formed of one layer of solder or two layers of copper and solder. When a solder layer is formed on the conductor post 402, the solder film need not be formed.
The conductor post 402 may be any material having etching resistance when the metal plate 401 is removed by etching. Usually, the metal plate 401 is used as an etching resist between the conductor post 402 and the metal plate 401. It is preferable to provide a metal layer having etching resistance with a different material. If the metal diffusion preventing layer can be used as an etching resist, it can be replaced with this.

Next, using the optical circuit board (G3) 405 obtained above, an adhesive layer 406 is formed at a predetermined position on the joint surface of the optical circuit board 405 with the wiring component (FIG. 4D). )).
As a method for forming the adhesive layer, for example, in the optical path circuit board (G3) 405 obtained above, the adhesive is directly applied to a predetermined position on the joint surface with the wiring component, and a coating film is formed. And dried to form an adhesive layer. Further, in the optical circuit board (G3) 405 obtained above, the adhesive dry film can be attached to a predetermined position on the joint surface with the wiring component to form an adhesive layer. The adhesive dry film can be adjusted in advance to a desired size, and the adhesive dry film on which the pattern is formed is adjusted in advance to a desired size, so that it is temporarily pressure-bonded at a predetermined position. Therefore, the operation can be easily performed. As a temporary pressure bonding condition of such an adhesive dry film, it is sufficient that the solder powder in the adhesive is not melted and the resin is cured and bonded at a temperature at which the resin is not hardened. Examples of the method include pressure bonding at a temperature of about 0.1 MPa to 2 MPa and a pressure of about 1 second to 10 seconds.

  In this way, the optical waveguide layer 101 having the core portion and the clad portion includes a receptor structure for conducting electrical connection between the electrode of the optical element and the pad portion of the wiring component, and the receptor structure includes: In an optical circuit board provided with a conductor part for electrically joining (metal joining) the electrode of the optical element and the pad part of the wiring component, as the conductor part, the wiring part side in the receptor structure It is possible to obtain an optical circuit board with adhesive (G3) 407 in which a conductor post 402 provided at the bottom is formed and an adhesive layer electrically connecting the conductive members is provided on the joint surface with the wiring component. it can.

  An optical circuit board (optical circuit board G3) in which a conductor portion for metal-bonding the conductive member of the optical element and the conductive member of the wiring component is provided in the receptor structure is an optical element mounting surface. A conductor part for passing through the optical circuit board and conducting electrical connection between the conductor circuit and the wiring part, and a conductor part for metal bonding to the conductive member of the wiring part on the conductor circuit. May be formed. In this case, in the step of providing the conductor portion in the receptor structure, the optical circuit base substrate (G2) 305 obtained above is used in place of the optical circuit base substrate (G1) 106, and the following is performed in the same manner. It can be formed by filling a part or all of a conductor such as a conductor post from the bottom of the wiring component side (optical circuit board (G3 ′) 1101 (FIG. 3E)). Further, by providing an adhesive layer in the same manner as described above, an optical circuit board (G3 ′) 1102 with an adhesive can be obtained (FIG. 3E).

The optical circuit board (G3) 405 has a structure similar to that of the optical circuit board (G4) 503 described later, and further protrudes from the optical element mounting surface of the optical circuit board 405 into the receptor structure as a conductor portion. Can be provided. More specifically, as an additional conductor portion on the conductor post 402 in the receptor structure formed on the optical circuit board 405, the stud bump 408 protrudes from the optical element mounting surface of the optical circuit board 405 into the receptor structure. (Optical circuit board (G3 ″) 409). At this time, the gold film 403a may or may not be present.
By providing an adhesive layer on the optical circuit board (G3 ″) 409 provided with the stud bump 408 in the same manner as described above, an optical circuit board (G3 ″) 410 with an adhesive can be obtained (FIG. 4). (E)).

  As a method for forming the stud bump, a wire bonder or the like is used to form a nail head by connecting a gold wire to an electrode pad by a thermocompression bonding method (ball bonding method), and then at the base of the nail head. There is a method in which protruding electrodes formed by cutting a wire are stacked in layers.

  Further, in the present invention, the projection of the optical element is not provided on the electrode of the optical element, and the electrode of the optical element and the receptor structure part in the optical circuit circuit board can be directly joined. In such a case, in the step of forming the conductor post 402 of the optical circuit board G3 from the wiring component side bottom surface of the conductor part, the surface of the optical circuit board 106 that contacts the wiring component and the metal plate 401 are bonded together. Thereafter (FIG. 5A), the conductor structure 501 is filled and formed in the receptor structure through-hole 104 so as to protrude the optical element mounting surface of the optical circuit board (FIG. 5B).

Next, the metal plate 401 is removed by etching. Further, preferably, a joint portion between the pad portion of the wiring component on the conductor post (conductor portion) 501 provided in the receptor structure through-hole 104 of the optical circuit board 106 and the electrode of the optical element on the conductor post 501 are formed. Gold films 502a and 502b are formed on the joint by electroplating or the like (optical circuit board (G4) 503) (FIG. 5C). Alternatively, the gold films 502a and 502b may be formed after nickel or the like is formed by electrolytic plating as a metal diffusion prevention layer.
Here, the entire surface of the metal plate 401 is removed, but a conductive circuit may be formed by performing partial etching in the same manner as the optical circuit board (G3). Thereby, the conductor circuit electrically connected with the conductor post of the conductor part in the said receptor structure can be formed in the joint surface with the said wiring component.
The conductor post 501 is the same as the optical circuit board (G3) in terms of formation method, material, and structure.

Next, using the optical circuit board (G4) 503 obtained above, an adhesive layer 504 is formed in the same manner as described above at a predetermined position on the joint surface of the optical circuit board 503 with the wiring component. (FIG. 5D). Examples of the method for forming the adhesive layer include a method of directly applying an adhesive and a method of temporarily pressing an adhesive dry film in the same manner as the optical circuit board G3 with an adhesive.
In this way, the optical waveguide layer 101 having the core portion and the clad portion includes a receptor structure for conducting electrical connection between the electrode of the optical element and the pad portion of the wiring component, and the receptor structure includes: In the optical circuit board provided with the conductor part for electrically joining (metal joining) the electrode of the optical element and the pad part of the wiring component, as the conductor part, as the conductor part in the receptor structure A conductor post 501 protruding from the optical element mounting surface of the optical circuit board is formed, and an adhesive-attached optical circuit board having an adhesive layer electrically connecting the conductive members to the joint surface with the wiring component ( G4) 505 can be obtained.

  An optical circuit board (optical circuit board G4) in which a conductor part for metal bonding the electrode of the optical element and the pad part of the wiring component is provided in the receptor structure is the same as the optical circuit board G3. In addition, a conductive circuit of the wiring component and a metal are provided on the conductive circuit so as to have a conductive circuit on the optical element mounting surface, penetrate the optical circuit board, and establish electrical conduction between the conductive circuit and the wiring component. A conductor portion for joining may be formed. In this case, in the step of providing the conductor portion in the receptor structure, the optical circuit base substrate (G2) 305 obtained above is used in place of the optical circuit base substrate (G1) 106, and the following is performed in the same manner. It can be formed by filling a conductor such as a conductor post from the bottom of the wiring component side so as to protrude the optical element mounting surface of the optical circuit board (optical circuit board (G4 ′) 1201 (FIG. 3 (f Further, in the same manner as described above, by providing the adhesive layer, the optical circuit board with adhesive (G4 ′) can obtain 1202 (FIG. 3F).

Next, wiring components will be described.
As the wiring component used in the present invention, when mounting the optical element, a mounting portion for providing electrical conduction between the electrode of the optical device and the pad portion of the wiring component is provided, and the insulating layer and the circuit layer are provided. There may be a multilayer circuit board in which a plurality of the circuit boards are stacked, and a rigid circuit board, a flexible circuit board, or the like can be used. The wiring component only needs to be provided with at least the optical element mounting portion, but an electronic component may be mounted. The wiring component may be a component such as a substrate of a semiconductor element or a connector. Furthermore, wiring components for electronic devices such as computers, liquid crystal displays, mobile phones, game machines, and car navigation systems can be used as the wiring components.

FIG. 6 is a cross-sectional view showing an example of a wiring component used in the present invention.
As shown in FIG. 6A, in the wiring component 601, an opening 603 opened by a drilling machine is formed in a core substrate 602 having an insulating layer. Conductor circuits 604 are formed on both surfaces of the core substrate 602.
At this time, the conductor circuit 604 is provided with a pad portion serving as a mounting portion for electrical connection between the electrode of the optical device and the conductive member of the wiring component when mounting the optical device. When the optical elements are mounted on both surfaces of the wiring component via the optical circuit board, the pad portions may be provided on the conductor circuits on both surfaces of the wiring component.
The inside of the opening 603 is plated, and the conductor circuits 604 on both surfaces of the core substrate 602 are conducted.
As said insulating layer, what is comprised from the resin composition using insulating resins, such as cyanate resin, cyclic olefin resin, a phenol resin, and an epoxy resin, can be mentioned, for example. In particular, when mounting an optical element, in order to reduce the dimensional change, a cyanate resin and / or a prepolymer thereof having characteristics such as high heat resistance and low linear expansion coefficient, and a resin composition containing an epoxy resin are used. It is preferable to use it.

A method for manufacturing such a wiring board will be described with reference to FIG. 6. For example, an opening 603 is provided in a core substrate (for example, FR-4 double-sided copper foil) 602 by opening a hole with a drilling machine. Thereafter, the opening 603 is plated by electroless plating so that both surfaces of the core substrate 602 are electrically connected. Then, the copper foil is etched to form a conductor circuit 604 including a pad portion for conducting electrical connection between the electrode of the optical element and the conductive member of the wiring component (FIG. 6A).
It is preferable to form a gold film 605 on the surface of the pad by electroplating or the like (FIG. 6B), and after forming nickel or the like as a metal diffusion prevention layer by electrolytic plating, the gold film is formed. You may do it.

  The conductor circuit 604 may be made of any material as long as it is suitable for this manufacturing method. However, it is preferable that the conductor circuit 604 can be removed by a method such as etching or peeling in the formation of the conductor circuit. Are preferably resistant to the chemicals used in this. Examples of the material of the conductor circuit 604 include copper, copper alloy, 42 alloy, and nickel. In particular, the copper foil, the copper plate, and the copper alloy plate are most preferable for use as the conductor circuit 604 because not only electrolytic plated products and rolled products can be selected, but also various thicknesses can be easily obtained.

  Further, although the adhesive layer is provided in the optical circuit board, the adhesive layer may be provided on the wiring component. In that case, in the wiring component obtained above, on the bonding surface (one side or both sides) of the core substrate 602 with the optical circuit board (there is no adhesive layer at this time) so as to cover the conductor circuit 604, In the same manner as described above, the adhesive layer 606 is formed to obtain the wiring component (601 ″) having the adhesive layer (FIG. 6C).

  Next, the optical element mounting component will be described using specific embodiments.

  As an optical element used in the present invention, in order to improve the connection between the electrode of the optical element and the conductor part that electrically connects the pad part of the wiring component, a metal protrusion is formed on the electrode of the optical element. It is preferable to use one provided with (bump) (conductive member). Examples of the material of the metal protrusion include gold, copper, and solder, and are selected according to the metal bonding method. When performing metal bonding by ultrasonic bonding, gold and copper are preferable.

A detailed example of the optical element 701 will be described with reference to FIG. 12. For example, in an optical element having a single light receiving point or light emitting point, it is provided on the signal line connecting electrode on the light receiving / emitting point 62 side. 12 having a metal protrusion (conductive member) 702a, a metal protrusion (conductive member) 702b provided on the ground connection electrode, and a positioning and fixing metal protrusion (conductive member) 702c (FIG. 12). (A) The figure shown from three directions.). By providing one positioning fixing protrusion, positioning and fixing of the optical element can be ensured, and a plurality of positioning fixing protrusions can be provided. The optical element may have a plurality of light receiving points or light emitting points. For example, the optical element may have four optical elements having a single light receiving point or light emitting point arranged in parallel (FIG. 12). (B)). The optical element having a plurality of light receiving points or light emitting points is used in an optical circuit board having a plurality of core parts, and the number of light receiving points or light emitting points is also determined according to the number of core parts.
The size of the metal protrusions may be such that the metal protrusions can be accommodated in the receptor structure through-holes and can be sufficiently metal-bonded to the conductive member of the electric circuit. When there are a plurality of metal protrusions, the pitch between the metal protrusions corresponds to the pitch between the conductive members of the optical element, and is generally 125 μm or 250 μm, but it may be about several tens of μm. good.

Next, an example of the manufacturing method of a 1st aspect is demonstrated.
<First Mode (FIG. 9)>
As shown in FIG. 9C, the first mode is composed of a wiring component provided with an optical element mounting portion for mounting an optical element, an optical waveguide layer having a core portion and a cladding portion, An optical element mounting component comprising: an optical circuit board having a receptor structure for conducting electrical conduction between the conductive member of the optical element and the conductive member of the wiring component. The optical element is mounted on the part via the optical circuit board, and the conductive member of the optical element and the conductive member of the wiring component are used as the conductor part in the receptor structure. A metal post including a conductor post formed in the receptor structure is bonded. In the third aspect, the conductor post 402 is partially formed from the bottom surface on the conductor part wiring component side, and as the conductor part in the receptor structure, a partially formed conductor post 402, It is formed by a metal protrusion 902 provided on the electrode of the optical element. Thereby, since the height of a conductor part can fully be ensured, metal bondability improves more.

  As the optical element used in the first aspect, it is preferable to use metal protrusions (bumps) 902 formed on the electrodes of the optical element. However, sufficient metal bonding is ensured as the conductor part in the receptor structure. What is necessary is just to have the height which can be performed (FIG. 9 (a)).

Next, an example of the manufacturing method of a 1st aspect is demonstrated.
First, an optical circuit board (G3) 407 with an adhesive layer obtained above and a wiring component 601 ′ having a gold film 605 formed on a pad (conductive member) for mounting an optical element are prepared. G3) The metal joint (gold film 403b) with the wiring component on the conductor post (conductive member) 402 in the receptor structure formed on 405 and the gold film 605 on the pad are aligned and overlapped, An optical element mounting component (G3) 903 is obtained (FIG. 9B).
At this time, the optical circuit board (G3) 407 with the adhesive layer and the wiring component 601 ′ are bonded (main press-bonding) with the adhesive layer to manufacture the optical element mounting component (G3) 903. Can do.

  In the alignment, passive alignment in which the optical element is mounted along the through hole for the receptor structure is possible. Thereby, both mounting accuracy and mounting speed can be improved.

As the bonding method, the bonding can be performed by heating at a predetermined temperature. The bonding temperature can be set according to the solder powder material and the resin material in the adhesive layer.
In the case where the adhesive layer containing the solder powder is used, the bonding temperature is preferably higher than the melting temperature of the solder powder and a temperature at which the resin is melted. In this viewpoint, the bonding temperature is preferably higher than 100 ° C., more preferably 120 ° C. or higher. Moreover, it is preferable that the melt viscosity of the resin is low at the bonding temperature. From this viewpoint, the bonding temperature is preferably 250 ° C. or lower, and more preferably 200 ° C. or lower. In addition, from the viewpoint of expanding the region where the resin has a low melt viscosity, it is preferable to lower the bonding temperature, but it is desirable to set in consideration of the heat resistance of the optical circuit board and the optical element.

  In bonding, from the viewpoint of causing solder powder to flow onto the surface of the metal projection and moving it more efficiently, it is preferable to pressurize with a predetermined pressure during bonding. The pressurizing pressure is preferably 0 MPa or more, more preferably 1 MPa or more, from the viewpoint of more reliably forming the solder region. In addition, even if the pressure applied intentionally to the adhesive layer is 0 MPa, a predetermined pressure may be applied to the adhesive layer by the weight of the member disposed on the adhesive layer. Further, from the viewpoint of further improving the connection reliability, the pressure is preferably 20 MPa or less, and more preferably 10 MPa or less.

  The resin in the adhesive layer is melted by the heating. Further, the solder powder in the adhesive layer is melted. The melted solder powder moves from a resin (not shown) in a self-aligned manner onto the metal protrusion 702 of the optical element 701 and the optical element mounting part pad part of the wiring component 601 ′. Since the solder powder self-aligns with the opposing region of the conductive member, a solder region is formed in a region between the metal projection 702 of the optical element 701 and the optical element mounting portion pad portion of the wiring component 601 '.

  In addition, a hardener (not shown) having a flux activity present in the resin efficiently moves to the interface between the solder powder and the conductive member, and removes an oxide film on the surface of the solder powder. Each conductive member is directly metal-bonded and electrically connected. Thereafter, by cooling the optical element mounting component (G3) 904 on which the optical element is mounted, the resin in the adhesive layer is cured, and the state where the conductive members are joined by the solder region is maintained.

  Here, when an adhesive dry film is used as the adhesive layer, heat treatment may be performed at a predetermined single temperature at the time of bonding, and the optical circuit board and the wiring component can be easily bonded. However, the heat treatment at the time of bonding is not limited to treatment at a single temperature, for example, step cure after heating at 150 ° C. for 100 seconds and then heating at 180 ° C. for 100 seconds, or after thermocompression bonding at 160 ° C. for 10 seconds, You may perform the postcure which oven-cure at 180 degreeC for 10 minutes. Further, since the conductive member and the solder in the adhesive layer are connected by metal bonding of solder particles constituting the solder powder, the connection resistance is low and the connection reliability is high.

  Further, in the manufacture of the optical element mounting component (G3) 903, the optical circuit board (G3) 407 with an adhesive layer and the wiring component 601 ′ were subjected to main pressure bonding with the adhesive layer. Then, by the same method as the temporary pressure bonding method of the adhesive layer, the optical circuit board with adhesive layer (G3) 407 and the wiring component 601 ′ are bonded (temporary pressure bonding) with the adhesive layer in advance, An optical element mounting component (G1) 903 can be manufactured, and the main pressure bonding can be performed when mounting the optical element.

Next, the metal protrusion 902 of the optical element 901 having the metal protrusion is positioned on the conductor post 402 (gold film 403a) in the receptor structure formed on the optical circuit board 405 in the optical element mounting component (G3) 903. In addition, ultrasonic bonding is performed while applying a weight so that the metal protrusion 902 is pressed against the gold film 403a in the receptor structure, and the metal protrusion 902 and the conductor of the optical element 901 are placed in a predetermined position. The post 402 (gold film 403a) is metal-bonded to obtain an optical element mounting component (G3) 904 on which an optical element is mounted (FIG. 9C).
As a specific example of the ultrasonic bonding method, for example, after the metal projection 902 is placed in a predetermined position of the receptor structure through-hole 104, an ultrasonic bonding apparatus is generally used at a frequency of 15 kHz. In addition, with a rated power of 3000 W, a weight of about 1 kN can be applied, and the metal protrusion 902 can be vibrated for 0.5 seconds while being pressed against at least the gold film 403a.

  At this time, when solder or the like is used for the metal protrusion 902 of the optical element 901, first, the optical circuit board with adhesive layer (G3) 407 and the wiring component 601 ′ are the same as the temporary press-bonding method in the first aspect. By the method, the optical element mounting component (G3) 903 can be manufactured by performing temporary pressure bonding with the adhesive layer. Next, the optical element 901 is mounted in the receptor structure through-hole 104 of the optical element mounting component (G3) 903, and the optical circuit board (G3) 405 and the wiring are connected by the same operation as the bonding method in the first aspect. While bonding the component 601 ′, the metal bonding portion (gold film 403b) with the wiring component on the conductor post (conductive member) 402 and the optical element mounting portion pad of the wiring component 601 ′ are bonded with metal, The metal protrusion 902 of the optical element 901 and the gold film 403a on the conductor post (conductive member) 402 are metal-bonded to obtain an optical element mounting component (G3) 904 on which the optical element is mounted.

  In the above description, the method using the optical circuit board with the adhesive layer has been described. However, the wiring component 601 ′, the adhesive dry film (adhesive layer), the optical circuit board (G3) 405, and the optical element 901 are The metal protrusions 902 and the conductor posts 402 (gold film 403a) of the optical element 901 are metal-bonded in the same manner as described above, and the optical circuit board (G3) 405 and the wiring component are joined. 601 ′ is bonded, and a metal joint (gold film 403b) with a wiring component on the conductor post (conductive member) 402 and an optical element mounting portion pad of the wiring component 601 ′ are metal-bonded to form an optical element. The optical device mounting component (G3) 904 on which is mounted can be obtained. Moreover, you may use wiring components with an adhesive layer.

The adhesive layer (adhesive dry film) used in the present invention is excellent in adhesiveness with an adherend and has an excellent electrical connection reliability between conductive members. In addition, the adhesive layer (adhesive dry film) used in the present invention can be reliably bonded even when the bonding area of the conductive member in the adherend is small, and the solder powder is self-adhering to the opposing region of the conductive member. Since alignment is performed and the connection is made through the solder region, a slight deviation in alignment between the conductive members can be allowed.
The adhesive layer has a resin and a solder region that penetrates the resin in a state after bonding. A curing agent having flux activity may or may not remain in the resin.

Next, a 2nd aspect is demonstrated.
In the first aspect, the optical circuit board has a conductor circuit on the optical element mounting surface, penetrates the optical circuit board, and can conduct electrical continuity between the conductor circuit and the wiring component. Using the optical circuit base substrate (G2) in which a conductor part for metal bonding to the conductive member of the wiring component is formed on the conductor circuit, and the electrode of the optical element and the pad of the wiring component And a metal protrusion (conductive member) provided on the electrode of the optical element is directly metal-bonded as a conductor in the receptor structure and formed on the optical element mounting surface. The conductor part (conductive member) for penetrating the optical circuit board on the conductor circuit and metal-bonding to the conductive member of the wiring component and the corresponding conductive member of the wiring component are metal-bonded. It is done.
As the optical element used in this case, the same optical element as that used in the first embodiment having a metal protrusion (bump) (conductive member) that becomes a conductor in the receptor structure can be used.

Next, an example of the manufacturing method of the second aspect will be described.
First, an optical circuit board (G3 ′) 1102 with an adhesive layer obtained above and a wiring component 601 ′ in which a gold film 605 is formed on an optical element mounting portion pad portion (conductive member) are prepared, and an optical circuit base is prepared. The receptor structure through-hole 104 formed in the substrate (G2) 305 is aligned with the gold film 605 on the pad, and the conductive member of the wiring component is metal-bonded through the optical circuit board. A conductor post 302 as a conductor portion for this purpose and a conductive member (not shown) of a wiring component corresponding thereto are aligned and overlapped to obtain an optical element mounting component (G3 ′) 1103 (FIG. 7). (B)). At this time, the optical circuit board (G3 ′) 1102 with the adhesive layer and the wiring component 601 ′ are temporarily bonded by the adhesive layer in the same manner as described above.

Next, the metal protrusion 902 of the optical element 901 having the metal protrusion and the receptor structure through-hole 104 formed in the optical circuit base substrate (G2) 305 in the optical element mounting component (G3 ′) 1102 The optical circuit base substrate (G2) 305 and the wiring component 601 ′ are bonded to each other and placed in a predetermined position, and the metal protrusion 902 of the optical element 901 and the optical element mounting of the wiring component 601 ′ are attached. A metal post to connect the conductive post 302 and the conductive member of the wiring component corresponding to the conductive component of the wiring component. Then, an optical element mounting component (G3 ′) 1104 on which the optical element is mounted is obtained (FIG. 7C).
The bonding method at this time is the same as in the first embodiment.

<Third Aspect (FIG. 10)>
As shown in FIG. 10 (c), the third mode is composed of a wiring component provided with an optical element mounting portion for mounting an optical element, and an optical waveguide layer having a core portion and a cladding portion, An optical element mounting component comprising an optical circuit board having a receptor structure for conducting electrical conduction between the electrode (conductive member) of the optical element and the conductive member of the wiring component. An optical element is mounted on the optical element mounting portion via the optical circuit board, and an electrode (conductive member) of the optical element and a conductive member of the wiring component are disposed in the receptor structure. The conductor portion is metal-bonded by a conductor post that protrudes from the optical element mounting surface of the optical circuit board and is formed in the receptor structure. In the third aspect, the conductor post 501 is formed all over the receptor structure from the bottom surface on the conductor part wiring component side, and further the metal bondability can be improved, and the optical element Those having no metal protrusions on the electrode (conductive member) can be used.

  As the optical element 1001 used in the third aspect, it is not necessary to form a metal protrusion on the electrode (conductive member) as in the above-described aspect, as long as it has a conductive member for electrical connection. good.

Next, an example of the manufacturing method of a 3rd aspect is demonstrated.
First, an optical circuit board (G4) 505 with an adhesive layer obtained above and a wiring component 601 ′ in which a gold film 605 is formed on a pad portion (conductive member) for mounting an optical element are prepared. (G4) The metal joint (gold film 502b) with the wiring component on the conductor post (conductive member) 501 in the receptor structure formed in 503 is aligned with the gold film 605 on the pad, and superimposed. Thus, an optical element mounting component (G4) 1002 is obtained (FIG. 10B).
At this time, the optical circuit board (G4) 505 with the adhesive layer and the wiring component 601 ′ are bonded (main press-bonding) with the adhesive layer by the same method as the bonding method in the first aspect. A component mounting component (G4) 1002 can be manufactured.

Next, the electrode of the optical element 1001 is aligned with the gold film 502a on the protruding conductor post 501 in the receptor structure formed on the optical circuit board 503 in the optical element mounting component (G4) 1002, and the optical element Ultrasonic bonding is performed while applying a weight so that the electrode 1001 is pressed against the gold film 502a of the protruding conductor post 501 in the receptor structure, and the electrode of the optical element 1001 and the conductor post 501 (gold film 502a) are connected. An optical element mounting component (G4) 1003 on which an optical element is mounted is obtained by metal bonding (FIG. 10C).
The ultrasonic bonding method at this time is the same as in the first aspect. Further, the gold film 502a of the protruding conductor post 501 in the receptor structure may be formed on the electrode of the optical element 1001.

  In the above, when solder or the like is used for the protruding conductor post 501 in the receptor structure formed on the optical circuit board 503 in the optical element mounting component (G4) 1002, the gold film 502a is not provided. The optical circuit board (G4) 505 with the agent layer and the wiring component 601 ′ are subjected to temporary pressure bonding with the adhesive layer by the same method as the temporary pressure bonding method in the adhesive layer, so that an optical element mounting component (G4 ) 903 can be manufactured. Next, the electrode of the optical element 1001 is positioned and mounted on the protruding conductor post 501 in the receptor structure, and the optical circuit board (G4) 503 and the wiring component 601 are operated by the same operation as the bonding method in the first aspect. And bonding the metal joint (gold film 502b) with the wiring component on the conductor post (conductive member) 501 and the optical element mounting portion pad portion of the wiring component 601 ′, The electrode of the optical element 1001 and the conductor post 501 are metal-bonded to obtain an optical element mounting component (G4) 1003 on which the optical element is mounted.

  In the above description, the method using the optical circuit board with the adhesive layer has been described. However, the wiring component 601 ′, the adhesive dry film (adhesive layer), the optical circuit board (G4) 503, and the optical element 1001 are The electrodes of the optical element 1001 and the conductor post 501 (gold film 502a) are metal-bonded in the same manner as described above, and the optical circuit board (G4) 503, the wiring component 601 ′, and the like. Are bonded together, and a metal joint (gold film 502b) with a wiring component on the conductor post (conductive member) 501 is metal-bonded with an optical element mounting portion pad of the wiring component 601 ′ to mount an optical element. An optical element mounting component (G4) 1003 can be obtained. Moreover, you may use wiring components with an adhesive layer.

Next, a 4th aspect is demonstrated.
Apart from the third aspect, an aspect in which an optical element having no metal protrusion on the electrode (conductive member) can be used will be described.
In this case, as a first example, in the manufacturing process of the optical element mounting component (G3) 903, instead of the optical circuit board with adhesive layer (G3) 407, the optical circuit board with adhesive (G3) obtained above is used. '') 410 is used to bond (main press-bond) the optical circuit board with adhesive (G3 '') 410 and the wiring component 601 ′ with the adhesive layer in the same manner as the bonding method in the first aspect. Thus, an optical element mounting component (G3 ″) 1004 can be manufactured (FIG. 13A).
As a second example, on the conductor post 402 in the receptor structure formed on the optical circuit board 405 using the optical element mounting component (G3) 903 obtained above, the optical circuit board is further provided as a conductor part. A stud bump 408 is formed in the receptor structure so as to protrude from the optical element mounting surface 405, and an optical element mounting component (G3 ″) 1004 can be manufactured (FIG. 13A).

  Next, the electrode of the optical element 1001 similar to the third aspect is aligned with the protruding stud bump 408 in the receptor structure formed on the optical circuit board 409 in the optical element mounting component (G3 ″) 1004. Ultrasonic bonding is performed in the same manner as described above while applying a weight so that the electrode of the optical element 1001 is pressed against the stud bump 408, and the electrode of the optical element 1001 and the stud bump 408 are metal-bonded. The mounted optical element mounting component (G3 ″) 1005 is obtained (FIG. 13C).

Next, the fifth aspect will be described.
In the third aspect, similarly to the first aspect, the optical circuit board has a conductor circuit on the optical element mounting surface, penetrates the optical circuit board, and electrical conduction between the conductor circuit and the wiring component is achieved. Can be measured.
As the optical element used in this case, the same optical element as that used in the third embodiment, which does not have a metal protrusion (bump) (conductive member) on the electrode of the optical element, can be used.

Next, an example of the manufacturing method of the fifth aspect will be described.
First, an optical circuit board (G4 ′) 1202 with an adhesive layer obtained above and a wiring component 601 ′ in which a gold film 605 is formed on an optical element mounting portion pad portion (conductive member) are prepared, and an optical circuit base is prepared. The metal joint (gold film 502b ′) with the wiring component on the conductor post (conductive member) 501 ′ in the receptor structure formed on the substrate (G2) 305 is aligned with the gold film 605 on the pad. Then, the optical element mounting component (G4 ′) 1203 is obtained by superimposing (FIG. 8B). At this time, the optical circuit board (G4 ′) 1202 with an adhesive layer and the wiring component 601 ′ are bonded (main press-bonding) with the adhesive layer in the same manner as described above.

Next, the electrode of the optical element 1001 and the gold film 502a ′ on the protruding conductor post 501 ′ in the receptor structure formed on the optical circuit base substrate (G2) 305 in the optical element mounting component (G4 ′) 1203 are applied. Alignment is performed and ultrasonic bonding is performed while applying a weight so that the electrode of the optical element 1001 is pressed against the gold film 502a ′ of the protruding conductor post 501 ′ in the receptor structure. The post 501 ′ (gold film 502a ′) is metal-bonded to obtain an optical element mounting component (G4 ′) 1204 (FIG. 8C) on which the optical element is mounted.
The bonding method and ultrasonic bonding method at this time are the same as in the first embodiment. Further, the gold film 502a ′ of the protruding conductor post 501 ′ in the receptor structure may be formed on the electrode of the optical element 1001.

Furthermore, in the above aspect, the structure for mounting the optical element on the optical element mounting component composed of the optical circuit board and the wiring component and the manufacturing method thereof have been described. The receptor structure is also formed at the other end with respect to the part, for example, the end where the receptor structure is formed, to form a wiring component and an optical element mounting component, and the optical circuit board is bridged Thus, an optical element can be mounted. In this case, the receptor structures and the wiring components formed at both ends of the optical circuit board may be different structures.
The optical element mounting component thus obtained will be described with reference to FIG. 11. For example, in the case of the optical element mounting component (G3), in the receptor structure formed at one end of the optical circuit board (G1) 106, wiring is performed. An optical element 901 ′ having a light emitting point is mounted on the optical element mounting portion of the component 601 ′, and the light of the wiring component 601 ′ is formed in the receptor structure formed on the other end with the optical circuit board (G1) 106 as a bridge. A device in which an optical element 901 ″ having a light receiving point is mounted on the element mounting portion is exemplified. In other embodiments, similarly, a bridged structure can be mentioned. In the wiring component 601 ′, an electronic component may be mounted.

  Furthermore, in the above aspect, the optical element can be mounted on both surfaces of the wiring component via the optical circuit board.

EXAMPLES Hereinafter, although an Example demonstrates this invention further in detail, this invention is not limited to this at all.
(Preparation of adhesive tape)
40 μm thick adhesive tapes (adhesive tapes 1 to 14) containing a resin, solder powder, and a curing agent having flux activity were produced. Further, an adhesive tape (adhesive tape 15) containing a resin and solder powder and not containing a curing agent having flux activity was produced.

  Table 1 shows the composition of each component in parts by weight. For each Example and Comparative Example, each component is an aromatic hydrocarbon solvent such as toluene and xylene, an ester organic solvent such as ethyl acetate and butyl acetate, and a ketone system such as acetone and methyl ethyl ketone, with the composition shown in Table 1. After dissolving in an organic solvent, the obtained varnish was applied to a polyester sheet and dried at a temperature at which the organic solvent volatilized to obtain an adhesive tape having good film formability.

(Optical circuit board)
(Optical waveguide)
Preparation of Varnish for Optical Waveguide (Catalyst Precursor C1: Synthesis of Pd (OAc) ₂ (P (Cy) ₃ ) ₂ )
In a 2-neck round bottom flask equipped with a funnel, a reddish brown suspension consisting of Pd (OAc) ₂ (5.00 g, 22.3 mmol) and CH ₂ Cl ₂ (30 mL) was stirred at −78 ° C. Cy represents a cyclohexyl group, and Ac represents an acetyl group.
A funnel was charged with a solution of P (Cy) ₃ (13.12 mL (44.6 mmol)) in CH ₂ Cl ₂ (30 mL) and added dropwise to the stirred suspension over 15 minutes. As a result, the color gradually changed from reddish brown to yellow.
After stirring at −78 ° C. for 1 hour, the suspension was warmed to room temperature, stirred for an additional 2 hours, and diluted with hexane (20 mL).
The yellow solid was then filtered in air, washed with pentane (5 × 10 mL) and dried in vacuo to give a primary collection.
The secondary collection was separated by cooling the above filtrate to 0 ° C., washed and dried as above. The yield was 15.42 g (88%). The NMR data was as follows. ¹ H-NMR (δ, CD ₂ Cl ₂ ): 1.18-1.32 (brm, 18H, Cy), 1.69 (brm, 18H, Cy), 1.80 (brm, 18H, Cy), 1.84 (s, 6H , CH3), 2.00 (br d, 12H, Cy), 31P-NMR (δ, CD 2 Cl 2): 21.2 (s). Hereinafter, the obtained primary collection and secondary collection were used as catalyst precursor C1.

(Synthesis of core layer (core part) polymer (P1: hexylnorbornene (HxNB) / diphenylmethylnorbornenemethoxysilane (diPhNB) copolymer))
HxNB (8.94 g, 0.05 mol), diPhNB (16.1 g, 0.05 mol), 1-hexene (4.2 g, 0.05 mol) and toluene (142.0 g) were mixed in a 250 mL sealam bottle. And heated to 120 ° C. in an oil bath to form a solution. To this solution, [Pd (PCy ₃ ) ₂ (O ₂ CCH ₃ ) (NCCH ₃ )] tetrakis (pentafluorophenyl) borate (hereinafter abbreviated as “Pd1446”) (5.8 × 10 ⁻³ g, 4.0). × 10 ⁻⁶ mol) and N, N-dimethylanilinium tetrakis (pentafluorophenyl) borate (hereinafter abbreviated as “DANFABA”) (3.2 × 10 ⁻³ g, 4.0 × 10 ⁻⁶ mol) ) Were added in the form of concentrated dichloromethane solutions, respectively.
After the addition, the resulting solution was maintained at 120 ° C. for 6 hours. When methanol was added dropwise to the vigorously stirred mixture, the copolymer precipitated. The precipitated copolymer was collected by filtration and vacuum dried in an oven at 80 ° C. The weight after drying was 12.0 g (yield: 48%). When the molecular weight of the obtained copolymer was measured by GPC method (gel permeation chromatography method) using THF as a solvent (polystyrene conversion), it was Mw = 16,196 and Mn = 8,448. When the composition of the copolymer was measured by ¹ H-NMR, it was ¹ H-NMR: 54/46 = HxNB / diPhNB copolymer. Hereinafter, the HxNB / diPhNB copolymer was designated as polymer P1.
The refractive index of the polymer P1 (copolymer) (the refractive index was measured by the prism coupling method, hereinafter the same) was 633 nm, 1.5569 in the TE mode, and 1.5555 in the TM mode. .

(Preparation of core varnish (V1))
Hexylnorbornene (42.03 g, 0.24 mol) and dimethylbis (norbornenemethoxy) silane (7.97 g, 0.026 mol) were weighed and placed in a glass bottle.
Ciba IRGANOX 1076 (0.5 g) and Ciba IRGAFOS 168 (0.125 g) were added to the monomer solution as an antioxidant to obtain a monomer antioxidant solution.
To a solution (30.0 g) of the above polymer P1 dissolved in mesitylene so as to be 10 wt%, a monomer antioxidant solution (3.0 g) and the catalyst precursor C1 (4.94 × 10 ⁻⁴ g, 6.29 × 10 ⁻⁷ mol in 0.1 mL of methylene chloride), RHODORSIL PHOTOINITIATOR 2074 (2.55 × 10 ⁻³ g, 2.51 × 10 ⁻⁶ mol, methylene as a photoacid generator (co-catalyst) In 0.1 mL of chloride) was added to prepare varnish V1.
This varnish V1 was used after being filtered with a 0.2 μm pore filter. Hereinafter, Ciba IRGANOX 1076 was referred to as “IRGANOX 1076”, Ciba IRGAFOS 168 as “IRGAFOS 168”, and RHODORSIL PHOTOINITIATOR 2074 as “RHODORSIL 2074”.

(Synthesis of clad layer (cladding part) polymer (P2: decylnorbornene (DeNB) / methylglycidyl ether norbornene (AGENB) copolymer))
DeNB (16.4 g, 0.07 mol), AGENB (5.41 g, 0.03 mol) and toluene (58.0 g) were added to the sealum bottle in the dry box. This solution was stirred in an oil bath at 80 ° C.
To this solution was added a toluene solution (5 g) of (η6-toluene) Ni (C ₆ F ₅ ) 2 (0.69 g, 0.0014 mol).
After the addition, the resulting mixture was maintained at room temperature for 4 hours. Toluene solution (87.0 g) was added to the reaction solution. When methanol was added dropwise to the vigorously stirred reaction mixture, the copolymer precipitated.
The precipitated copolymer was collected by filtration and vacuum dried in an oven at 60 ° C. The weight after drying was 17.00 g (yield: 87%). When the molecular weight of the obtained copolymer was measured by GPC method using THF as a solvent (in terms of polystyrene), it was Mw = 75,000 and Mn = 30,000.
When the composition of the copolymer was measured by ¹ H-NMR, it was ¹ H-NMR: 77/23 = DeNB / AGENB copolymer. Hereinafter, DeNB / AGENB copolymer was designated as polymer P2.
The refractive index of the polymer P2 (copolymer) was 1.5153 in the TE mode and 1.5151 in the TM mode at a wavelength of 633 nm.

(Preparation of clad layer (cladding part) varnish (V2))
IRGANOX 1076 (0.05 g) and IRGAFOS 168 (1.25 × 10 ⁻² g) as antioxidants in a solution (16.7 g) of the above polymer P2 dissolved in toluene so as to be 30 wt%, and As a photoacid generator, RHODORSIL 2074 (0.1 g in 0.5 mL of methylene chloride) was added to prepare varnish V2.
This varnish V2 was used after being filtered with a 0.2 μm pore filter.

2. Formation of optical waveguide On the base material, the clad layer varnish V2 obtained above is applied to form a clad layer 103a having a thickness of 50 μm, and then the core layer varnish V1 obtained above is applied on the clad layer. Then, the core layer 102 having a thickness of 50 μm was formed, and then the cladding layer varnish V2 was applied on the core layer to form another cladding layer 103b having a thickness of 50 μm. Here, it heat-drys for 30 minutes at 45 degreeC.
Further, UV light (wavelength: 365 nm, 900 mJ to 3000 mJ, irradiation amount = 3 J /) is passed through an intermediate formed by the core layer 102 and the clad layers 103 a and 103 b provided on both surfaces of the core layer 102. cm ² ) to form a core part. Next, in the oven, the optical waveguide is heated at 85 ° C. for 30 minutes, and further heated at 150 ° C. for 60 minutes, so that the portion other than the core portion of the core layer 102 and the cladding layers 103a and 103b all constitute the cladding portion. Layer 101 was obtained. The optical waveguide obtained above was 50 μm high × 50 μm wide, and four core portions were formed. The size of the optical circuit board was 30 mm (vertical) × 100 mm (horizontal), the refractive index of the core portion was 1.58, and the refractive index of the cladding portion was 1.52.

(Optical path conversion unit)
The optical waveguide layer 101 obtained above was fixed to a sample holder of an excimer laser (wavelength: 193 nm, device name: ProMaster (OPTEC)) with a vacuum chuck. The laser intensity is set to 7 mJ, the laser oscillation frequency is 250 Hz, the opening of the stainless steel mask that cuts the laser beam is 1 mm × 1 mm, the moving speed of the processing table is set to 45 μm / s, and the moving distance to the processing table is set to 150 μm. The laser is irradiated to the portions (the optical element mounting portion and the four core portions at both ends of the optical waveguide layer) forming the reflection portion of the optical waveguide layer 101 composed of the clad portion joined to the outer periphery of the core portion. By changing the irradiation region of the laser with respect to the optical waveguide layer 101 relatively, the irradiation time of the laser to the portion of the optical waveguide layer forming the optical path changing portion is partially changed, and the optical waveguide layer of the laser is changed. While adjusting the degree of reach in the depth direction, the constituent material of the optical waveguide layer was removed to form an optical path conversion section. As a result of observing the processed cross section (reflecting portion) with a microscope, the region where the resin of the upper clad layer and the core layer was removed was an isosceles triangle, and the apex angle was approximately 90 °.

(Receptor structure)
The optical waveguide layer 101 obtained above has a predetermined structure for forming a receptor structure in accordance with the electrodes (conductive member bumps) (diameter: 100 μm) of the optical element at the optical element mounting portion (four locations on both ends of the optical waveguide layer). By mounting a mask having an opening at a position and irradiating a laser in the same manner as described above, a through hole 104 for a receptor structure penetrating the optical element mounting surface and the wiring component bonding surface is provided, and an optical circuit base A substrate was obtained.
Next, a copper foil (thickness: 18 μm) is bonded to the wiring component lamination side surface of the optical circuit base substrate obtained above, and the copper foil 401 is used as a lead for electroplating (a conductive member for power feeding) in the through hole 104 for the receptor structure. Then, a nickel metal diffusion prevention layer was formed by electrolytic plating, and then copper conductor posts 402 were filled from the bottom face on the wiring component side to form a thickness of 30 μm by electrolytic plating.
Next, the copper foil 401 was removed by etching. Next, gold films 403a and 403b were formed on the upper surface of the copper conductor post obtained above and on the exposed surface of the nickel metal diffusion preventing layer to obtain an optical circuit board G3.

(Wiring parts)
The FR-4 core substrate 602 having a double-sided copper foil is drilled with a drill machine to provide an opening 603, and then the opening 603 is plated by electroless plating so that both sides of the core substrate 602 are electrically connected. I planned. Next, the copper foil was etched to form a conductor circuit 604 including a pad serving as a mounting portion for conducting electrical conduction between the conductive member of the optical element and the conductive member of the wiring component (FIG. 6A). ). On the surface of the pad, a nickel film was formed by electrolytic plating as a metal diffusion prevention layer, and a gold film 605 was formed by electroplating to obtain a wiring component.

(Example 1)
The size of the adhesive tape 1 obtained above is adjusted to 20 mm × 20 mm according to the joint, and then the above-mentioned adhesive is bonded to the joint surface (two places on both ends) of the optical circuit board obtained above. The tape 1 was bonded at a temperature of 100 ° C. by applying a pressure of 1 MPa for 10 seconds to produce an optical circuit board with an adhesive layer.
Next, VCSEL (surface emitting laser) and PD (photodiode) were prepared as optical elements. The optical element used here has metal protrusions (bumps) 61 that serve as conductors in the receptor structure of the optical circuit board on the electrodes. The metal protrusions used were three solder bumps having a diameter of 80 μmΦ formed on the electrodes.

Next, using the optical circuit board with adhesive layer (G3) obtained above and the wiring component obtained above, the adhesive layer surface of the optical circuit board with adhesive layer and the optical element of the wiring component The optical device mounting is performed by aligning and superposing the optical device mounting portion pad of the wiring component and the through hole of the receptor structure portion of the optical circuit board with the adhesive layer with the mounting portion pad surface facing each other. Parts (G3) were obtained.
Next, the metal protrusions of the optical element prepared above were aligned with the through holes for receptor structure formed in the optical circuit board (G3) in the optical element mounting component, and were placed in the through holes. Next, while heating at a temperature of 160 ° C., pressurizing at a pressure of 1 MPa for 500 seconds, and thermocompression bonding, the optical circuit board (G3) and the wiring component are bonded, and the metal protrusion of the optical element and the wiring The optical element mounting part (G3) on which the optical element was mounted was obtained by metal bonding while performing self-alignment with the optical element mounting part pad of the part.

(Examples 2 to 14 and Comparative Example 1)
In Example 1, it replaced with adhesive tape 1, and it carried out like Example 1 except having used adhesive tapes 2-14, respectively, and obtained optical element mounting parts of Examples 2-14.
Similarly, in Example 1, except that the adhesive tape 15 was used in place of the adhesive tape 1, the same procedure as in Example 1 was performed to obtain an optical element mounting component of Comparative Example 1.

  In the optical circuit board (G3) with an adhesive shown in FIG. 9C, the conductor circuit on the back surface of the core substrate connected via the adhesive layer and the metal protrusion attached to the optical element is sandwiched between the microprobes, and the four terminals The connection resistance was measured at 12 points by the method, and the average value was taken as the measured value.

  From the above results, it was confirmed that sufficient conduction was ensured through the adhesive layer.

It is a schematic diagram for demonstrating an example of an optical circuit base substrate (G1). It is a schematic diagram for demonstrating the optical path change part in an optical waveguide layer, and the transmission direction of light. It is a schematic diagram for demonstrating an example of an optical circuit base substrate (G2). It is a schematic diagram for demonstrating an example of a 1st optical circuit board (G3). It is a schematic diagram for demonstrating an example of a 2nd optical circuit board (G4). It is sectional drawing for demonstrating an example of wiring components. It is a schematic diagram for demonstrating the 2nd aspect (G3 ') of optical element mounting components. It is a schematic diagram for demonstrating the 5th aspect (G4 ') of optical element mounting components. It is a schematic diagram for demonstrating the 1st aspect (G3) of optical element mounting component. It is a schematic diagram for demonstrating the 3rd aspect (G4) of optical element mounting components. It is a schematic diagram which shows the example of an optical element mounting component. It is a figure for demonstrating the example of an optical element. It is a schematic diagram for demonstrating the 4th aspect (G3 '') of optical element mounting components.

Explanation of symbols

101 Optical waveguide layer 102 Core layers 103a, 103b Clad layer 104 Receptor structure through hole 105 Optical path conversion unit 106 Optical circuit base substrate (G1)
301 Metal plate 302 Conductor (conductor post)
303 Conductor Circuit 304 Gold Film 305 Optical Circuit Base Board (G2)
401 Metal plate 402, 402 'Conductor post (conductor part)
403a, 403b, 403a ′, 403b ′ Gold coating 405 Optical circuit board (G3)
406 Adhesive layer 407 Optical circuit board with adhesive (G3)
408 Stud bump 503 Optical circuit board (G4)
409 Optical circuit board (G3 ″)
410 Optical circuit board with adhesive (G3 ″)
501, 501 'Conductor post (conductor part)
502a, 502b, 502a ′, 502b ′ Gold coating 503 Optical circuit board (G4)
504 Adhesive layer 505 Optical circuit board with adhesive (G4)
601 Wiring component 601 ′ Wiring component 601 ″ having a gold film on the optical element mounting portion (pad) Wiring component 602 having an adhesive layer Core substrate 603 Opening 604 Conductor circuit 605 Gold film 606 Adhesive layer 701 Optical element 702 Metal Projection 702a Metal projection 702b on signal line connecting conductive member Metal projection 702c on ground connection conductive member Positioning and fixing metal projection 901 Optical element 901 ′ Optical element 901 ″ with light emitting point Light receiving point Optical element 902 Metal protrusion (bump)
903 Components for mounting optical elements (G3)
904 Optical device mounting parts (G3)
1001 Optical element 1002 Optical element mounting component (G4)
1003 Optical device mounting parts (G4)
1004 Components for mounting optical elements (G3 ″)
1005 Optical device mounting parts (G3 ″)
1101 Optical circuit board (G3 ′)
1102 Optical circuit board with adhesive (G3 ′)
1103 Components for mounting optical elements (G3 ′)
1104 Optical element mounting parts (G3 ′)
1201 Optical circuit board (G4 ')
1202 Optical circuit board with adhesive (G4 ')
1203 Components for mounting optical elements (G4 ′)
1204 Optical device mounting parts (G4 ′)

Claims (29)

An optical waveguide layer having a core part and a clad part laminated on one surface side of a mounting part for mounting an optical element having an electrode, and a wiring component provided with a pad on the mounting part, and the optical element An optical circuit board configured to include a conductor portion that electrically connects the electrode and the pad of the mounting portion;
Between the wiring component and the optical circuit board, an adhesive layer that electrically connects the conductor part of the optical circuit board and the pad part of the mounting part,
An optical circuit board with an adhesive. 2. The optical circuit board with an adhesive according to claim 1, wherein the optical circuit board has a receptor structure for electrically connecting the electrode of the optical element and the pad of the wiring component. The adhesive layer includes a resin, a curing agent having flux activity, and solder powder, and the solder powder and the curing agent having flux activity are present in the resin. Or an optical circuit board with an adhesive according to 2; The adhesive layer includes a resin, a curing agent having flux activity, and solder powder, and is composed of an adhesive dry film in which the solder powder and the curing agent having flux activity are present in the resin. The optical circuit board with an adhesive according to claim 3, wherein the optical circuit board has an adhesive. The optical circuit board with an adhesive according to claim 3 or 4, wherein in the adhesive layer, the resin includes an epoxy resin and an acrylic rubber. The optical circuit board with an adhesive according to any one of claims 3 to 5, wherein in the adhesive layer, the curing agent having flux activity is a compound containing a carboxyl group. The adhesive-attached light according to any one of claims 3 to 6, wherein in the adhesive layer, the curing agent having flux activity is a compound containing a carboxyl group and a group that reacts with an epoxy group. Circuit board. In the said adhesive bond layer, the hardening | curing agent which has the said flux activity is an optical circuit board with an adhesive of Claim 6 or 7 which is alkylcarboxylic acid or aromatic carboxylic acid. The adhesive layer according to any one of claims 3 to 8, wherein, in the adhesive layer, the solder powder is an alloy containing two or more selected from Sn, Ag, Bi, In, Zn, and Cu. Optical circuit board. 10. The optical circuit board with an adhesive according to claim 3, wherein the solder powder has a melting point of 100 ° C. or higher and 250 ° C. or lower in the adhesive layer. The optical circuit board with an adhesive according to any one of claims 3 to 10, wherein in the adhesive layer, the resin includes an epoxy resin that is solid at room temperature and an epoxy resin that is liquid at room temperature. The optical circuit with an adhesive according to any one of claims 2 to 11, wherein a conductor portion that electrically connects an electrode of the optical element and a pad of the mounting portion is provided in the receptor structure. substrate. The optical circuit board with an adhesive according to claim 12, wherein the conductor portion in the receptor structure includes a conductor post provided on a wiring component side bottom in the receptor structure. The optical circuit board with an adhesive according to claim 13, wherein a conductor post of a conductor portion in the receptor structure protrudes from the optical element mounting surface of the optical circuit board. The optical circuit board with an adhesive according to claim 1, wherein the optical circuit board has a conductor circuit on the optical waveguide layer. The adhesive according to any one of claims 12 to 15, wherein the optical circuit board has a conductor circuit connected to a conductor post of a conductor portion in a receptor structure on a joint surface with the wiring component. With optical circuit board. The optical circuit board is metal-bonded to a conductive member of the wiring component so as to penetrate the conductor circuit and the optical circuit board on the optical element mounting side surface and to make electrical connection with the wiring component on the conductive circuit. The optical circuit board with an adhesive according to any one of claims 1 to 16, wherein the optical circuit board has an electrical conductor portion. 18. The optical circuit board according to claim 1, wherein the optical circuit board includes an optical path conversion unit that bends an optical path of the core unit toward a light emitting / receiving unit of the optical element. An optical circuit board with an adhesive as described in 1. A wiring component having a pad portion for mounting an optical element;
An optical circuit board with an adhesive according to any one of claims 1 to 18,
Comprising
An optical element mounting component in which the optical circuit board and the wiring component are bonded together by an adhesive layer that electrically connects the electrode of the optical element and the pad portion of the wiring component. 20. The optical element mounting component according to claim 19, wherein the optical element mounting component has a structure in which the two wiring components are joined in a bridge shape by the optical circuit board. An optical element having an electrode;
The component for mounting an optical element according to claim 19 or 20,
Comprising
The optical element is mounted on the pad of the wiring component having a pad portion for mounting the optical element via the optical circuit board in the optical element mounting component,
The optical circuit board and the wiring component are optical device mounting components joined by an adhesive layer that electrically connects the electrodes of the optical device and the pads of the wiring component. The optical element mounting component according to claim 21, wherein the electrode of the optical element and the pad of the wiring component are electrically connected through a receptor structure formed on the optical circuit board. 23. In the receptor structure of the optical circuit board of the optical element mounting component, the electrode of the optical element and the pad of the wiring component are metal-bonded by a conductor portion in the receptor structure. Or the optical element mounting component of 22. 24. The optical element mounting according to claim 23, wherein the conductor portion in the receptor structure is formed by metal bonding of a conductor post protruding from the optical element mounting surface of the optical circuit board and an electrode of the optical element. parts. 25. The optical element mounting component according to any one of claims 21 to 24, wherein the conductor portion in the receptor structure includes a protrusion provided on an electrode of the optical element and a conductor post. A conductor part formed on the conductor circuit formed on the optical element mounting side surface of the optical circuit board and the conductive member of the wiring component penetrating the optical circuit board and conducting on the conductor circuit. The optical element mounting component according to any one of claims 21 to 25, wherein the conductive member of the wiring component is metal-bonded. 27. The optical element mounting component according to any one of claims 21 to 26, wherein the optical element mounting component has a structure in which the two wiring components are joined in a bridge shape by the optical circuit board. . The optical element mounting component aligns an optical element mounting portion pad of the wiring component and a receptor structure portion of the optical circuit board, and mounts the optical element on the optical circuit board, and a conductor in the receptor structure portion. The optical element mounting component according to any one of claims 21 to 27, wherein the optical element mounting component is obtained by metal bonding the electrode of the optical element and the pad of the wiring component through a section. The optical element mounting component according to any one of claims 21 to 28, wherein the wiring component in the optical element mounting component is an electronic device wiring component.