JP2008177506A - Electronic component packaging method and electronic component packaging apparatus using same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component packaging method which is high in flexibility of component selection, and an electronic component packaging apparatus using the same. <P>SOLUTION: An electronic component packaging substrate 10 has recessed cavities P1i, differing in depth B1i according to heights C1i of electronic components X1i, formed on the side of a top surface 11a of a multilayer substrate 11 without exceeding the thickness D of the multilayer substrate 11 such that the thicknesses A1 up to upper-end portions of electronic components 12 to 20 mounted on the side of the top surface 11a is previously set based upon the reverse surface 11b of the multilayer substrate 11 and projection quantities of all the electronic components X1i (i=1, 2, ..., m (m: a positive integer)) on the side of the top surface 11a are held within the thickness A1, and the electronic components X1i are fitted therein. Similarly, recessed cavities P2i having depths B2i are formed on the side of the reverse surface 11b, and electronic components X2i are fitted therein. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an electronic component mounting method and an electronic component mounting substrate using the same, and more particularly to an electronic component mounting method for mounting an electronic component in a concave cavity formed on the substrate and an electronic component mounting substrate using the same. It is.

  As an electronic component mounting board, a concave cavity is formed in a multilayer substrate in which a plurality of insulating layers and conductor layers are alternately stacked, and electronic components are mounted in this cavity, enabling high-density mounting of electronic components. Is known (for example, Patent Documents 1 to 3).

In the electronic component mounting substrate described in Patent Document 1, concave cavities are formed on both front and back surfaces of a multilayer substrate, and the electronic components are accommodated therein. The electronic component mounting substrate described in Patent Document 2 mounts an electronic component in a concave cavity and mounts another electronic component on the surface of the substrate so as to straddle the cavity. Further, in the electronic component mounting substrate described in Patent Document 3, an IC chip is fixed to the bottom of the cavity formed in the multilayer substrate with an adhesive, and a resistor or a capacitor is formed on the step formed on the side of the cavity. Etc. are provided. One electrode of this chip component is soldered to the wiring pattern on the side of the cavity, and the other electrode is connected to the IC chip via a wire.
JP 2005-354093 A JP 2004-031413 A Japanese Utility Model Publication No. 6-77275

  Incidentally, electronic devices such as mobile phones and digital cameras are becoming smaller and more multifunctional, and further downsizing and thinning of electronic component mounting boards are required. However, in any of the electronic component mounting methods described in Patent Documents 1 to 3, there are few problems with ultra-small electronic components, but relatively large electronic components, particularly dimensions in the thickness direction of the substrate (high height). When an electronic component with a large dimension) is attached, the amount of protrusion of the component from the substrate surface increases and the dimension in the thickness direction of the electronic component mounting board increases, which affects the downsizing and thinning of electronic devices. There is a problem.

  The present invention has been made to solve the above-described problems, and a component having a relatively large height can be used without any problem, and an electronic component mounting method having a high degree of freedom in selecting a component and the same are used. An object is to provide an electronic component mounting board.

  In the electronic component mounting method of the present invention, the total dimension of the thickness dimension of the substrate and the height dimension of the electronic component attached to the substrate is set in advance so that the protruding amount of the electronic component from the substrate surface is constant. If the larger dimension than the predetermined dimension does not exceed the thickness dimension of the substrate, a concave cavity having a depth corresponding to the larger dimension is formed in the substrate, and an electronic component is attached to the cavity. It is characterized by that. Further, an electronic component different from the electronic component is attached to the side wall surface of the cavity. Further, the substrate is a multilayer substrate in which a plurality of insulating layers and conductor layers are alternately laminated.

  An electronic component mounting board according to the present invention is characterized in that the electronic component is mounted on the substrate at a high density by using the electronic component mounting method according to any one of the first to third aspects.

  According to the electronic component mounting method and the electronic component mounting board using the same according to the present invention, a concave cavity is formed in the substrate so that the protruding amount of the electronic component from the surface of the substrate is within a predetermined range, and the electronic component is formed on the substrate. Therefore, a part having a relatively large height can be used without any problem, and the degree of freedom in selecting a part can be increased. In addition, since another electronic component is attached to the side wall surface of the cavity, it can contribute to higher density of the electronic component mounting board, and related components can be placed close to each other, for example, by connecting a bypass capacitor at the shortest distance. Thus, the signal transmission / reception speed can be greatly increased, and the occurrence of noise due to the long connection distance can be suppressed. In addition, since the substrate is a multilayer substrate, electronic components can be mounted not only on the bottom surface of the cavity but also on the side wall surface without using jumper wires, etc., improving assembly efficiency and increasing the density of the electronic component mounting substrate. Can contribute.

  As shown in FIG. 1, an electronic component mounting substrate 10 according to a first embodiment of the present invention includes a multilayer substrate 11, relatively large electronic components 12 to 14 mounted on the surface 11a side, and a small size. It consists of electronic components 15 to 20 and relatively large electronic components 21 and 22 and small electronic components 23 to 27 mounted on the back surface 11b side. The electronic components 12 to 14, 21 and 22 are attached to concave cavities 31 to 35, which will be described in detail later. The electronic components 15 to 20 are on the front surface 11a, and the electronic components 23 to 27 are on the back surface 11b. It is attached.

  The multilayer substrate 11 includes a plurality of laminated insulating layers 37a to 37f made of, for example, prepreg, and conductor layers 38a to 38g made of metal foil such as a circuit pattern provided between and on the surface thereof. The prepreg is a sheet of glass fiber or the like impregnated with a resin. When heated, the resin melts, and when the resin of the prepreg is cured by stopping the heating, the insulating layers 37a to 37f, the conductor layer 38a-38g are joined together.

  The electronic component mounting substrate 10 sets in advance a thickness dimension A1 to the upper end of the electronic components 12 to 20 mounted on the front surface 11a side with respect to the back surface 11b of the multilayer substrate 11, and the surface 11a side is within this thickness dimension A1. Of the electronic component X1i (i = 1, 2,..., M (m is a positive integer)) so that the protruding amount is uniform, the thickness of the electronic component X1i is within a range not exceeding the thickness dimension D of the multilayer substrate 11. A concave cavity P1i having a different depth dimension B1i according to the height dimension C1i is formed on the surface 11a side of the multilayer substrate 11.

  The depth dimension B1i is a range that does not exceed the thickness dimension D. However, the depth dimension B1i is within a range in which there are no problems in terms of holding the electronic component X1i, connecting the electronic component X1i and the conductor layer, strength of the multilayer substrate 11, Up to 2/3 of the thickness dimension D is preferable. The electronic components 12 to 20 are specific examples of the electronic component X1i, and the cavities 31 to 33 are specific examples of the cavity P1i. Further, A1 ≧ D, and A1 = D is a case where the electronic components 15 to 20 are not attached to the surface 11a.

  Here, like the electronic component 13, the depth dimension B1i corresponding to the height C1i of the electronic component X1i is the thickness of the insulating layer (in the case of the electronic component 13, the thickness of the insulating layers 37a and 37b). Since the conductor layer (conductor layer 38c in the case of the electronic component 13) is exposed, the electrode of the electronic component X1i may be soldered to the exposed conductor layer. When the dimension B1i does not correspond to the thickness of the insulating layer (in the case of the electronic components 12 and 14), the conductor layer is not exposed as it is. In such a case, a conductor layer is provided at the bottom of the cavity P1i, and this is connected to a nearby conductor layer (conductor layer 38d in the case of the electronic component 12), and the electrode of the electronic component X1i is connected to the bottom conductor layer. Solder.

  In addition, a thickness dimension A2 is set in advance to the upper end portions (lowermost end portions in the drawing) of the electronic components 21 to 27 mounted on the back surface 11b side with respect to the front surface 11a of the multilayer substrate 11, and the back surface is within this thickness dimension A2. The electronic component X2i within a range not exceeding the thickness dimension D of the multilayer substrate 11 so that the protruding amounts of all the electronic components X2i on the 11b side (i = 1, 2,..., N (n is a positive integer)) are uniform. A concave cavity P2i having a different depth dimension B2i is formed on the back surface 11b side of the multilayer substrate 11 in accordance with the back height dimension C2i.

  The thickness dimension A2 may be the same as or different from the thickness dimension A1. Further, the depth dimension B2i is in a range not exceeding the thickness dimension D, but there is no problem in terms of holding the electronic component X2i, connecting the electronic component X2i and the conductor layer, strength of the multilayer substrate 11, For example, up to 2/3 of the thickness dimension D is preferable. The electronic components 21 to 27 are specific examples of the electronic component X2i, and the cavities 34 and 35 are specific examples of the cavity P2i. Further, A2 ≧ D, and A2 = D is a case where the electronic components 23 to 27 are not attached to the back surface 11b. Hereinafter, since the configuration on the front surface 11a side and the configuration on the back surface 11b side of the multilayer substrate 11 are the same, only the front surface 11a side will be described below.

  As shown in the flowchart of FIG. 2, first, it is checked whether or not the height dimension C1i of the electronic component X1i of the first (1 → i) (st1) satisfies the following formula (1) (st2). When the height dimension C1i satisfies Expression (1), the depth dimension B1i of the cavity P1i is obtained using Expression (2) (st3).

  A1 <C1i + D (1)

  B1i = C1i + D−A1 (2)

  Subsequently, when the depth dimension B1i of the obtained cavity P1i satisfies the following mathematical formula (3) (st4), the depth dimension B1i is effective, but the depth dimension B1i of the cavity P1i is mathematical formula ( If 3) is not satisfied (st4), the cavity P1i becomes a through hole, and mounting (holding and connection) of the electronic component X1i becomes difficult, and there is also a problem in the strength of the multilayer substrate 11. Electronic parts X1i are excluded as unusable (st5).

  B1i <D (3)

  If the height C1i of the electronic component X1i does not satisfy Expression (1), the depth B1i is set to “0” (st6). In this case, the electronic component X1i is attached to the conductor layer 38a on the surface 11a without forming the cavity P1i. Further, specific examples of the electronic component X1i in this case are the electronic components 15 to 20, for example, ferrite beads having a size of 2.0 mm × 1.25 mm × 0.5 mm. In the present embodiment, the protruding amount (A1-D) of the electronic component from the surface 11a is, for example, 1 mm or less.

  Then, 2 → i and i are incremented (st7), and the depth dimension B1i of the cavity P1i is sequentially determined for all the electronic components X1i until i = m (st8). A cavity P1i having a depth dimension B1i determined in this manner is formed in the multilayer substrate 11. The cavity P1i is formed by stacking the insulating layers 37a to 37f and the conductor layers 38a to 38g after forming openings corresponding to the insulating layers 37a to 37f and the conductor layers 38a to 38g.

  Similarly, the depth dimension B2i of the cavity P2i on the back surface 11b side is determined, and the cavity P2i is formed in the multilayer substrate 11. In this way, the maximum thickness dimension Q of the electronic component mounting board 10 on which the electronic components X1i and X2i are mounted on both surfaces is expressed by the following formula (4).

  Q = A1 + A2-D (4)

  As described above, in the present invention, even when tall electronic components 12 to 14 are attached to the multilayer substrate 11, they protrude upward only to the same extent as the small electronic components 15 to 20 mounted on the surface 11 a. The dimension in the thickness direction does not fluctuate greatly. Therefore, the electronic device to which the electronic component mounting substrate 10 is attached can also be kept small and thin. In addition, the large electronic components 12 to 14 can be prevented from interfering with the housing frame 39. Similarly, the large electronic components 21 and 22 on the back surface 11 b side can be prevented from interfering with the housing frame 40.

  Moreover, since the heights of the upper ends of the electronic components 12 to 14 are the same, the amount of descent when the electronic components 12 to 14 are inserted into the cavity can be made constant. Thereby, since the amount of descent of all the electronic components X1i by the robot hand can be kept within a certain range, the mounting accuracy and the mounting speed of the electronic components X1i on the multilayer substrate 11 can be improved.

  Next, the electronic component mounting substrate 42 of the second embodiment will be described with reference to FIG. In addition, the same code | symbol is attached | subjected to the same member as 1st Embodiment, and description is abbreviate | omitted. The electronic component mounting substrate 42 has a plurality of small electronic components on four side wall surfaces 44b to 44e in addition to attaching the large electronic component 45 to the bottom surface 44a of the concave cavity 44 formed in the multilayer substrate 11. 46, 47, 48, 49, ... are attached. The depth dimension of the cavity 44 is determined in the same manner as in the first embodiment.

  The electronic components 46, 47,... Are small polar components mainly having a function of assisting the operation of the large electronic component 45, for example, 0402 (0.4 mm × 0.2 mm × 0.12 mm) size. Chip components such as bypass capacitors and resistors. As described above, since the electronic components 46, 47,... Related to the operation of the electronic component 45 are arranged in the immediate vicinity of the electronic component 45, signals of the electronic component 45 and the electronic components 46, 47,. Transfer is performed at high speed, which can contribute to speeding up the operation of the entire circuit.

  The mounting angle of the electronic components 46, 47,... With respect to the layer direction of the multilayer substrate 11 is determined from the size of the side wall surfaces 44b to 44e, the component shape (electrode pitch), and the interlayer pitch of the insulating layers 37a to 37f. For example, both the electrodes of the electronic component 46 are soldered to the conductor layer 38 b, and the longitudinal direction thereof is attached parallel to the layer direction of the multilayer substrate 11 (attachment angle 0 °).

  The electronic components 47 and 48 are soldered to the conductor layers 38b and 38c across the insulating layer 37b, and the longitudinal direction thereof is attached perpendicularly to the layer direction of the multilayer substrate 11 (attachment angle 90 °). It has been. The electronic component 49 is soldered to the conductor layers 38b and 38c across the insulating layer 37b, and its longitudinal direction is attached obliquely to the layer direction of the multilayer substrate 11 (attachment angle 45 °). .

  In addition, when the electronic component is perpendicular to the layer direction of the multilayer substrate 11, there are cases where the plus electrode of the electronic component is on the upper side and the lower side. The angle is 90 °, and the case where the plus electrode is down is the mounting angle 270 °.

  As described above, since the electronic components 46, 47,... Can be attached to the side wall surfaces 44b to 44e of the cavity 44 at any angle, for example, a bypass capacitor or the like is connected to the large electronic component 45 at the shortest distance. Thus, the signal transmission / reception speed can be greatly increased, and the occurrence of noise due to the long connection distance can be suppressed.

  When the insulating layers 37a, 37b, and 37c constituting the side wall surfaces 44b to 44e of the cavity 44 are made adhesive by mixing a resin such as an adhesive gel polymer into the insulating layers 37a to 37f, soldering is performed. The electronic components 46, 47,... Can be easily temporarily fixed to the side wall surfaces 44b to 44e before being attached. Alternatively, a part of the insulating layer may protrude from the side wall surface of the cavity into the cavity, and the electronic component may be sandwiched from above and below, temporarily fixed, and then soldered.

  Next, an electronic component mounting board 50 according to a third embodiment will be described with reference to FIGS. In addition, the same code | symbol is attached | subjected to the same member as 1st, 2 embodiment, and description is abbreviate | omitted. The cavity 52 formed in the multilayer substrate 11 of the electronic component mounting substrate 50 has three step portions 56 and 57 so that the bottom 54 to which the large electronic component 53 is attached is deepest and narrow, and gradually becomes shallower and wider toward the periphery. , 58 are provided. The depth dimension of the cavity 52 is determined in the same manner as in the first embodiment.

  Small electronic components 61 to 75, which are chip components such as ceramic capacitors and resistors, are attached to the respective surfaces of the step portions 56 to 58, respectively. Thus, since the step portions 56 to 58 are provided, even when an electronic component close to the bottom portion 54 fails, the failed component can be replaced without removing the electronic component attached to the upper portion (surface close to the mouth). It has excellent maintainability.

  Next, an electronic component mounting board 80 of the fourth embodiment will be described with reference to FIG. In addition, the same code | symbol is attached | subjected to the same member as 1st-3rd embodiment, and description is abbreviate | omitted. The cavity 82 formed in the multilayer substrate 11 of the electronic component mounting substrate 80 is provided with stepped portions 84 to 86 as in the third embodiment, and small electronic components 88 to 94 are attached to the respective surfaces, and a bottom portion 96 is provided. A large electronic component 97 is attached to the main body. On the other hand, unlike the said 3rd Embodiment, the landing parts 98 and 99 are formed widely, and the large sized electronic components 101-103 are attached here.

  According to such a configuration, the maintainability of the electronic component mounting board can be improved as in the third embodiment, and the electronic component mounting board can be increased in density. In addition, the depth dimension from the surface 11a of the multilayer substrate 11 to the bottom part 94 and the landings 98 and 99 is the same as in the first embodiment, and the protruding amount from the surface 11a of the electronic components 96 and 101 to 103 is constant. It is decided to become.

  In the embodiment described above, the electrode of the electronic component is soldered to the conductor layer at the bottom of the cavity. However, the present invention is not limited to this, and soldering is performed on the conductor layer near the mouth of the cavity using, for example, a jumper wire. May be attached. In this case, the present invention can be applied to a single-layer substrate as long as the substrate has a thickness sufficient to form a concave cavity, not limited to a multilayer substrate.

  Moreover, in the said embodiment, although the number of layers of the insulating layer of the multilayer board | substrate was six layers, of course, this invention is not limited to such a number. In addition, the small electronic component attached to the side wall surface of the cavity may be attached across a plurality of layers, and the attachment angle is not limited to the above, and can be freely set.

It is sectional drawing which shows the structure of the electronic component mounting board | substrate of 1st Embodiment to which this invention is applied. It is a flowchart which shows the main sequences at the time of determining the depth of a cavity. It is a perspective view which shows the structure of 2nd Embodiment which mounts an electronic component on the side wall surface of a cavity. It is a top view which shows the structure of 3rd Embodiment which provided the level | step-difference part in the cavity. It is sectional drawing which shows the structure of 3rd Embodiment. It is sectional drawing which shows the structure of 4th Embodiment which mounted the electronic component also in the landing part of the level | step-difference part.

Explanation of symbols

10, 42, 50, 80 Electronic component mounting substrate 11 Multilayer substrate 12-27, 47-49, 53, 61-75, 88-94, 97, 101-103, X1i, X2i Electronic component 31-35, 44, 52 , 82, P1i, P2i Cavity 37a-37f Insulating layer 38a-38g Conductor layer 44b-44e Side wall surface 56-58, 84-86 Stepped part 98, 99 Landing part A1, A2, D Thickness dimension B1i, B2i Depth dimension C1i , C2i Height dimension Q Maximum thickness dimension

Claims (4)

  The total dimension of the thickness dimension of the board and the height dimension of the electronic component attached to the board is larger than and larger than a predetermined dimension set in advance so that the protruding amount of the electronic component from the board surface is constant. When the minute dimension does not exceed the thickness dimension of the substrate, a concave cavity having a depth corresponding to the large dimension is formed in the substrate, and the electronic component is attached to the cavity. .   The electronic component mounting method according to claim 1, wherein an electronic component different from the electronic component is attached to a side wall surface of the cavity.   3. The electronic component mounting method according to claim 1, wherein the substrate is a multilayer substrate in which a plurality of insulating layers and conductor layers are alternately laminated.   4. An electronic component mounting board, wherein the electronic component is mounted on the substrate at a high density using the electronic component mounting method according to claim 1.

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