JP2008177433A - Flexible printed wiring board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent air bubble from remaining in reinforcement patterns of a waste part provided around a product portion, when a reinforcement member is bonded to one side of a both-sided flexible printed wiring board with press equipment. <P>SOLUTION: The flexible printed wiring board is equipped with: a product portion 51 in which wiring patterns are formed with a metal foil; and a waste part 52 provided around the product portion 51, and reinforcement patterns 10 of the metal foil are formed, wherein while a reinforcement member 53 is in contact with one side of the flexible printed wiring board, a release-type member 59 is superimposed on the other side and is piled and then crimped with the press equipment to bond the reinforcement member 53. The reinforcement patterns 10 of the waste part 52 provide in some places metal foil removal parts 11 in front and rear sides of the flexible printed wiring board in the confronted state, and a metal foil removal part 11A on one side bonding the reinforcement member 53 is formed to be wider than a metal foil removal part 11B on the other side. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a flexible printed wiring board, and in particular, a flexible print in which a reinforcing pattern is formed on a discarded portion provided around a product portion in order to prevent warpage, and a reinforcing member is adhered by a press device. The present invention relates to a wiring board.

  Conventionally, this type of flexible printed wiring board is composed of a product part in which a wiring pattern is formed of a metal foil and a discard part provided around the product part. In order to prevent warping or the like in the discard part, It is common practice to form a foil reinforcement pattern.

  For example, Patent Document 1 discloses an example in which a grid-like, circular, or rectangular reinforcing pattern is formed in the discarding portion. These reinforcing patterns are made of a metal foil made of the same material as the wiring pattern of the product portion, and are formed by an etching method simultaneously with the wiring pattern.

  In addition, when double-sided flexible printed wiring boards are formed with reinforcing patterns with completely different shapes on the front and back sides, the remaining rate of metal foil on the front and back sides changes, causing the wiring board to be warped and corrugated, and to reinforce reinforcing boards and reinforcing films Since it is difficult to attach the members, the reinforcing patterns on the front and back sides are often the same shape.

  For example, in Patent Document 2, by forming at least a part of the same wiring pattern as the wiring pattern formed in the product part as a dummy pattern (reinforcing pattern) in the discarded part, the metal foil remaining rate of the entire workpiece is averaged. Therefore, it is trying to prevent deformation such as warping and twisting of the wiring board.

Furthermore, in Patent Document 3, after applying a thermosetting undercoat agent to both surfaces of a patterned multilayer printed wiring board, curing it by heating to make it non-flowable, impregnating both surfaces with an epoxy resin, A configuration for laminating and pressing prepregs is disclosed.
Japanese Utility Model Publication No. 60-169857 JP 2001-326429 A Japanese Patent Laid-Open No. 7-336048

  Conventionally, when affixing the above-mentioned reinforcing member in order to ensure the mechanical strength of the component mounting location, a plurality of product parts are individually taken in the workpiece. In many cases, the reinforcing member is pasted to the product part, and in this case, the reinforcing member is stuck not only to the product part but also to the discarded part.

  However, when the reinforcing member is attached, the lattice-like reinforcing pattern tends to leave bubbles at the location where the metal foil is removed. If air bubbles remain, the air bubbles expand during component reflow, and the reinforcing member is peeled off. There is no problem if the peeling stays only at the disposal part, but if it reaches the product part, it becomes a malfunction in the equipment. In particular, in recent years, component mounting using lead-free solder has been performed and the reflow temperature has been increased, so that peeling of the reinforcing member has become a problem.

  In Patent Document 1 and Patent Document 2, there is no description about generation of bubbles and prevention thereof. As a factor that the bubbles remain, there is a step at the location where the metal foil is removed from the lattice pattern.

  For example, as shown in FIG. 6, three product parts 51 are arranged on the work 50 of the double-sided flexible printed wiring board, and the discard part 52 provided around each product part 51 has a grid-like shape with metal foil. The reinforcing pattern 53 is formed at the same place on the front and back sides. Then, the reinforcing member 54 is stuck across the three product parts 51 including the discard part 52.

  FIG. 7 is an enlarged view of a portion A in FIG. 6, FIG. 7 (a) is a plan view, and FIG. 7 (b) is a sectional view taken along line XX in FIG. As described above, since the grid-like reinforcing pattern 53 is formed at the same place on the front and back sides, the metal foil removal places 55 face each other at the same position and the same area on both the front and back sides. The difference in thickness between a certain portion and the portion without the metal foil where the insulating base 56 is exposed changes abruptly at the boundary portion B of the reinforcing pattern 53.

  FIG. 8 shows a process of sticking the reinforcing member 54 to the work 50 of the double-sided flexible printed wiring board, and is an enlarged cross-sectional view of the metal foil removal portion 55 in the discarding part 52. FIG. 8A shows an insulating cover film 57 bonded to both the front and back surfaces of the work 50. From this state, as shown in FIG. The reinforcing member 54 is disposed via the agent 58, and a release member 59 having cushioning properties is disposed on the back side (lower side in the figure). Furthermore, as shown in FIG.8 (c), it press-bonds from the up-and-down both sides with a press apparatus, and the reinforcement member 54 is affixed.

  At this time, since the thickness rapidly changes at the boundary portion B of the reinforcing pattern 53, the rigidity also changes rapidly, and the release member 59 cannot follow the shape of the step, and only this portion is pushed up from the lower side in the figure. The pressure cannot be secured. Therefore, as shown by C1 in the same figure, a gap is generated between the reinforcing member 54 and the cover film 57, and when this gap cannot be filled with the adhesive 58, bubbles remain.

  In order to prevent air bubbles from remaining, there is a method in which the reinforcing member 54 is press-bonded in a vacuum atmosphere. However, a time for evacuation is required, and the processing time becomes long, resulting in a problem that productivity is lowered.

  On the other hand, if an adhesive having good fluidity is used to sufficiently fill the gap, there is a problem that the adhesive flows out of the reinforcing member because the adhesive is soft. Further, if the thickness of the adhesive is increased to fill the gap, the thickness of the flexible printed wiring board itself is increased, which causes restrictions on mounting on the device.

  Patent Document 3 discloses a method of filling a gap between reinforcing patterns with a thermosetting undercoat agent. This method can also fill the gap, but this also increases the thickness of the flexible printed wiring board itself. In addition, there is a problem in that the number of steps for filling the undercoat agent is increased and the cost is increased, and the flexibility of the flexible printed wiring board is deteriorated.

  Therefore, the present invention prevents bubbles from remaining in the reinforcing pattern of the discarded portion provided around the product portion when the reinforcing member is attached to one side of the double-sided flexible printed wiring board with a press device. For the purpose.

  The present invention has been proposed in order to achieve the above object, and the invention according to claim 1 is a product part in which a wiring pattern is formed of a metal foil and a metal foil provided around the product part. A flexible printed wiring board having a discarded portion on which a reinforcing pattern is formed, wherein the reinforcing member is brought into contact with one surface of the flexible printed wiring board and the release member is brought into contact with the other surface to overlap each other. In the flexible printed wiring board in which the reinforcing member is adhered by pressure bonding with a press device, the reinforcing pattern of the discarding portion is provided with metal foil removal portions facing each other on both the front and back sides of the flexible printed wiring board, And the flexible pudding characterized by forming the metal foil removal part of one side which sticks the said reinforcement member wider than the metal foil removal part of the other surface To provide a wiring board.

  According to this structure, the metal foil removal part of the reinforcement pattern formed in the discard part has different areas on the front and back of the flexible printed wiring board, and the metal foil removal part on one side where the reinforcing member is attached Is formed wider than the metal foil removal location on the other surface, the boundary portion between the metal foil removal location on one surface and the boundary portion between the metal foil removal locations on the other surface are misaligned. Accordingly, the thickness of the portion of the reinforcing pattern with and without the metal foil changes stepwise. For this reason, since the change of the thickness of a metal foil removal location is slow when sticking a reinforcement member, a mold release member becomes easy to follow and it is hard to remain a bubble.

  The invention according to claim 2 is characterized in that the reinforcing pattern has an opening edge portion of the metal foil removing portion on the other surface inside the opening edge portion of the metal foil removing portion on one surface to which the reinforcing member is attached. The flexible printed wiring board according to claim 1, wherein a thickness change is formed stepwise by arranging and shifting a boundary portion of the metal foil on the other side inward.

  According to this structure, the opening edge part of the metal foil removal part of the other surface is arranged inside the opening edge part of the metal foil removal part of the one surface to which the reinforcing member is adhered, and the other metal foil Since the thickness is changed stepwise by shifting the boundary portion inward, the release member rises stepwise while following the change in the thickness of the boundary portion when the reinforcing member is stuck by the press device, The metal foil removal location on the other surface and the release member are in close contact. Therefore, the gap between the metal foil removal part on one side and the reinforcing member is filled with the adhesive, and bubbles do not remain.

  In the present invention, since the change in thickness between the portion with the metal foil and the portion without the metal foil of the reinforcing pattern in the discarding portion is slow, the reinforcing member is stuck with a press device even if a lattice-like reinforcing pattern is used. In this case, the followability of the release member at the location where the metal foil is removed on the other surface is improved, and as a result, there is no gap between the location where the metal foil is removed on the one surface and the reinforcing member, thereby preventing air bubbles from remaining. it can.

  Hereinafter, the flexible printed wiring board according to the present invention will be described with reference to preferred embodiments. In order to achieve the purpose of preventing bubbles from remaining in the reinforcing pattern of the discarded part provided around the product part when the reinforcing member is attached to one side of the double-sided flexible printed wiring board with a press device. Furthermore, the present invention is a flexible printed wiring board having a product part in which a wiring pattern is formed of a metal foil, and a discarded part provided around the product part and having a reinforcing pattern of the metal foil formed thereon, A flexible printed wiring board in which a reinforcing member is brought into contact with one surface of the flexible printed wiring board, a release member is brought into contact with the other surface and stacked, and the reinforcing member is bonded by pressing with a press device In the reinforcing pattern of the discarded portion, the metal foil removal places are provided in places facing both the front and back surfaces of the flexible printed wiring board, and the reinforcing member is provided. The metal foil removed portion of one surface of wear was achieved by the wider than the metal foil removed portion of the other surface.

  The overall configuration of the flexible printed wiring board according to the present invention is substantially the same as the configuration shown in FIG. 6, and a plurality of product parts 51 are arranged on the work 50, and the discarding part provided around each product part 51. In 52, a grid-like reinforcing pattern is formed on the front and back of the metal foil at the same location. Then, the reinforcing member 54 is pasted across the plurality of product parts 51 including the discarding part 52.

  FIG. 1 shows metal foil removal locations 11 of a reinforcing pattern 10 provided on both front and back surfaces of a double-sided flexible printed wiring board, FIG. 1 (a) is a plan view, and FIG. 1 (b) is a YY cross-sectional view of FIG. It is. The metal foil removal portion 11 of the reinforcing pattern 10 is formed opposite to the same position on both the front and back surfaces of the double-sided flexible printed wiring board. If the front side (upper side in FIG. 4B) is the front surface side of the flexible printed wiring board in FIG. 5A, a reinforcing member 54 is disposed on the front surface side and the mold is released on the back surface side as will be described later. The member 59 is disposed, and the reinforcing member 54 is adhered while being crimped by a press device.

  Here, the size of the metal foil removal portion 11A formed on the surface side of the insulating base 12 is different from the size of the metal foil removal portion 11B formed on the back surface side of the insulating base 12, and the metal on the surface side is different. The foil removal part 11A is opened larger than the metal foil removal part 11B on the back side. That is, as shown in the drawing, the opening edge of the front surface side metal foil removal portion 11A is slightly shifted from the boundary portion of the front surface side metal foil removal portion 11A and the rear surface side metal foil removal portion 11B. The opening edge part of the metal foil removal part 11B of the back surface side is arrange | positioned inside the part, and it forms so that the thickness of each boundary part may change in steps.

  The difference α between the boundary part of the metal foil removal part 11A on the front surface side and the boundary part of the metal foil removal part 11B on the back surface side is set to 0.3 mm or more. It becomes difficult to follow and bubbles tend to remain. Preferably, α = about 0.5 mm, and if it is longer than that, there will be no effect on the remaining of the bubbles, but if there is a large difference in the remaining ratio of the metal foil on the front and back of the flexible printed wiring board, warping and twisting Therefore, care must be taken when the boundary portion difference α is extremely large.

  FIG. 2 shows a process of sticking the reinforcing member 54 to the double-sided flexible printed wiring board, and is an enlarged cross-sectional view of the portion 11 where the metal foil is removed. FIG. 2 (a) shows the insulating cover films 13 bonded to both the front and back surfaces of the workpiece 50. As described above, the metal foil removal site 11 is the boundary between the metal foil removal site 11A on the front side and the metal foil removal site 11A. Since there is a shift in the boundary portion of the metal foil removal location 11B on the back side, the thickness is formed so as to change stepwise.

  From this state, as shown in FIG. 2 (b), the reinforcing member 54 is disposed on the front surface side (upper side in the figure) via the adhesive 58, and cushioning is provided on the back side (lower side in the figure). A release member 59 is disposed. Furthermore, as shown in FIG.2 (c), it press-bonds from the up-and-down both sides with a press apparatus, and the reinforcement member 54 is affixed.

  At this time, since there is a deviation between the boundary portion of the metal foil removal portion 11A on the front surface side of the reinforcing pattern 10 and the boundary portion of the metal foil removal portion 11B on the back surface side, the thickness changes stepwise and the rigidity also changes stepwise. Then, the release member 59 follows the change in thickness. Therefore, as shown by C2 in the figure, the gap between the reinforcing member 54 and the cover film 57 is reduced, and this gap is easily filled with the adhesive 58, and the remaining of the bubbles is eliminated.

  Thus, peeling of the reinforcing member due to bubbles can be prevented during component reflow, and the productivity of the flexible printed wiring board is improved.

  In FIG. 1, assuming the lattice-like reinforcing pattern 10, the metal foil removal portion 11 is formed as a rhombus, but is not particularly limited to this shape. Moreover, the shape of the metal foil removal part 11A on the front surface side and the shape of the metal foil removal part 11B on the back surface side may be slightly different if there is no significant difference in the remaining ratio of the metal foil between the front and back of the flexible printed wiring board.

  For example, in FIG. 3, the shape of the metal foil removal part 11A on the front surface side is an octagon, and the shape of the metal foil removal part 11B on the back surface side is a circle. Also in this case, the metal foil removal spot 11A on the front surface side where the reinforcing member 54 is adhered is opened larger than the metal foil removal spot 11B on the back surface side.

  Here, when there is a large difference in the remaining ratio of the metal foil on the front and back of the flexible printed wiring board, warping occurs, as shown in FIG. 4, the back surface side where the metal foil removal portion 11B having a small opening area exists. A metal foil removal portion 11C for adjusting the residual ratio of the metal foil may be formed in the reinforcing pattern.

  In this way, changing the size of the metal foil removal portion on the front and back of the flexible printed wiring board may be performed on the entire surface of the discard portion 52 of the workpiece 50 shown in FIG. It suffices to carry out only the discarding part 52 of the part to be stuck. For example, as shown in FIG. 5, when the end portion of the reinforcing member 54 is applied to the metal foil removing portion 11, only the region where the reinforcing member 54 is pasted is removed from the metal foil removing portion 11 </ b> A on the front surface side and the metal foil on the back surface side. In the region where the size of the portion 11B is changed and the reinforcing member 54 is not attached, the size of the metal foil removal portion may be the same on the front and back sides.

  In this embodiment, the reinforcing member 54 is disposed on the front surface of the flexible printed wiring board, and the release member 59 is disposed on the back surface and laminated by the press device. However, the metal having a large opening area of the reinforcing pattern 10 If the reinforcing member 54 is disposed on the surface side where the foil removing portion 11A exists, the reinforcing member 54 and the release member 59 may be disposed upside down and stacked by a press device.

  It should be noted that the present invention can be variously modified without departing from the spirit of the present invention, and the present invention naturally extends to the modified ones.

The enlarged view of the metal foil removal part of the flexible printed wiring board which concerns on this invention. Explanatory drawing which showed the process of sticking a reinforcement member to the flexible printed wiring board shown in FIG. Explanatory drawing which shows the modification of a metal foil removal location. Explanatory drawing which shows the metal foil removal location for metal foil residual rate adjustment. Explanatory drawing which shows the modification of a metal foil removal location. Explanatory drawing which sticks a reinforcement pattern to the product part provided in the workpiece | work of the flexible printed wiring board, and the discard part. The enlarged view of A part of FIG. Explanatory drawing which showed the process of sticking the conventional reinforcement member.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Reinforcement pattern 11 Metal foil removal part 11A (front side) Metal foil removal part 11B (Back side) Metal foil removal part 11C (For adjustment) Metal foil removal part 12 Insulation base 13 Cover film 50 Work 51 Product part 52 Throwing part 54 Reinforcing member 58 Adhesive 59 Release member

Claims (2)

A flexible printed wiring board having a product portion in which a wiring pattern is formed of a metal foil and a discarded portion provided around the product portion and having a reinforcing pattern of the metal foil formed thereon, the flexible printed wiring board In the flexible printed wiring board in which the reinforcing member is brought into contact with one surface of the sheet, the release member is brought into contact with the other surface and overlapped, and the reinforcing member is bonded by pressing with a press device.
The reinforcing pattern of the discarded portion is provided with metal foil removal places on both sides of the flexible printed wiring board in some places, and the metal foil removal place on one side to which the reinforcing member is attached is provided on the other side. A flexible printed wiring board characterized in that it is formed wider than the metal foil removed portion.   In the reinforcing pattern, the opening edge of the metal foil removing portion on the other surface is disposed inside the opening edge of the metal foil removing portion on one surface to which the reinforcing member is attached, The flexible printed wiring board according to claim 1, wherein a change in thickness is formed stepwise by shifting a boundary portion of the metal foil inward.

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