JP2008175595A - Board inspecting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a board inspection device capable of inspecting accurately a plurality of wiring patterns arranged and formed oppositely in a plurality of rows on a printed board. <P>SOLUTION: In this board inspection device, an inspection tool with a plurality of contactors to be conductively contacted is brought conductively into contact with each unit board, on a sheet board on which a plurality of unit boards are arrayed in a point-symmetrical shape, and then the sheet board is inspected. The device has a conveyance means for holding the sheet board, and conveying it to a prescribed inspection position; a supply means for supplying the power for inspection; a detection means for detecting an electric signal; a determination means for calculating an electric characteristic from the power and the electric signal, and determining the quality of each wiring pattern based on the electric characteristic; a selection means for conductively connecting the supply means and the detection means to the contactors of the inspection tool; and a moving means for holding and moving the inspection tool. The moving means can rotate and move integrally the inspection tool and the selection means. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

The present invention relates to a board inspection apparatus, and more particularly to a board inspection apparatus capable of accurately inspecting a plurality of wiring patterns formed by arranging a plurality of rows to face a printed board.
The present invention is not limited to a printed wiring board, but can be applied to inspection of electrical wiring on various substrates such as a flexible substrate, a multilayer wiring substrate, a package substrate for semiconductor packages, and a film carrier. These various wiring boards are collectively referred to as “substrates”.

Conventionally, a substrate having a plurality of wiring patterns has been inspected for good or defective wiring patterns by conducting a continuity test or an insulation test.
When continuity or insulation inspection is performed on a wiring pattern, a plurality of inspection points are set in advance on the wiring pattern, and needle-like contacts (probes) are brought into conductive contact with these inspection points. Then, the conduction state and the insulation state are inspected by applying a voltage or supplying a current to the wiring pattern via these contacts, or detecting an electrical signal from the wiring pattern.

  In the inspection as described above, since a plurality of contacts need to be brought into conductive contact with a plurality of inspection points, an inspection jig having a plurality of contacts is used, and this inspection jig is pressed against the substrate with high accuracy. It is important.

On the other hand, a variety of sheet-like printed circuit boards in which a plurality of unit substrates are formed on one sheet are also manufactured. In such a sheet-like printed board (sheet board), a plurality of unit boards formed are inspected using an inspection jig corresponding to the unit board.
In particular, the unit substrate formed on the sheet substrate is formed by arranging two unit substrates symmetrically in consideration of the problem of material yield. In the sheet substrate formed in this way, various inspection apparatuses are provided in order to efficiently inspect a plurality of unit substrates arranged symmetrically with respect to a point.

  For example, Patent Literature 1 discloses a technique for creating an inspection jig that is rotated and arranged in a predetermined rotation direction, and inspecting by rotating the inspection jig or the inspection substrate.

JP-A-8-21867

However, when inspecting such a sheet substrate, it is necessary to contact the inspection jig efficiently and accurately with respect to the substrate arranged symmetrically. For this reason, it was necessary to control the movement of the inspection jig with high accuracy.
In recent years, the miniaturization of the wiring pattern of the unit substrate has progressed, and it has become necessary to accurately grasp an electrical signal for conducting a continuity / insulation test without a slight error.
The present invention has been made in view of such a situation, and in a sheet substrate on which a plurality of unit substrates arranged symmetrically with respect to a point is formed, an inspection jig can be contacted efficiently and with high accuracy. Provided is a substrate inspection apparatus capable of accurately grasping a target signal.

The invention according to claim 1 is an inspection point set on a wiring pattern of a unit substrate in a sheet substrate arranged in pairs so that a plurality of unit substrates having a plurality of wiring patterns are point-symmetric. A substrate for inspecting the sheet substrate by detecting an electrical characteristic of a wiring pattern to be inspected on the unit substrate by bringing an inspection jig having a plurality of contacts in conductive contact with each unit substrate into conductive contact An inspection apparatus, which holds the sheet substrate and supplies a power for detecting an electrical signal for detecting an electrical characteristic from a wiring pattern to be inspected and a transport unit that transports the sheet substrate to a predetermined inspection position. Supplying means, detecting means for detecting the electrical signal, calculating electrical characteristics of the wiring pattern to be inspected from the power and the electrical signal, and based on the electrical characteristics, the wiring In order to select a determination unit for determining whether the turn is good and a wiring pattern to be inspected from a plurality of wiring patterns formed on the unit substrate, the supply unit and the detection unit are contacted with the inspection jig. Selection means for conducting connection with the inspection jig, and movement means for holding and moving the inspection jig in order to bring the inspection jig into conductive contact with the inspection point on the wiring pattern of the unit substrate, The substrate inspection apparatus is characterized in that the inspection jig and the selection means can be integrally rotated so that a set of unit substrates arranged symmetrically can be inspected.
According to a second aspect of the present invention, the substrate inspection apparatus is provided with a placement position for feeding the sheet substrate into the substrate inspection apparatus, and the conveying means is on a straight line connecting the inspection position and the placement position. The substrate inspection apparatus according to claim 1, wherein the substrate inspection apparatus moves.
According to a third aspect of the present invention, when the unit substrates of the sheet substrate are arranged in a matrix, the substrate inspection apparatus performs an inspection for each unit substrate arranged in a row perpendicular to the linear direction. A substrate inspection apparatus according to claim 2 is provided.
The invention according to claim 4 is characterized in that the moving means moves in a direction perpendicular to the surface of the sheet substrate and moves in a direction perpendicular to a straight line connecting the inspection position and the mounting position. A substrate inspection apparatus according to claim 2 is provided.
According to a fifth aspect of the present invention, the selection means has connection terminals that are electrically connected to the contacts of the inspection jig, and the connection terminals are electrically upstream and downstream of the supply means. 2. The substrate inspection apparatus according to claim 1, further comprising a switching unit so as to be electrically connected to either the upstream side or the downstream side of the detection means.
According to a sixth aspect of the present invention, the substrate inspection apparatus includes a mounting table on which the sheet substrate is vacuum-sucked and mounted at the mounting position, and the transport unit is mounted on the mounting table. The substrate inspection apparatus according to claim 1, further comprising a grip portion that grips an end portion of the sheet substrate and holds the end portion of the sheet substrate in a tensile state in an outer direction of the sheet substrate.

According to the first aspect of the present invention, in the sheet substrates arranged in pairs so that a plurality of unit substrates having a plurality of wiring patterns are point-symmetric, they are set on the wiring patterns of the unit substrates. Inspect the sheet substrate by detecting the electrical characteristics of the wiring pattern to be inspected on the unit substrate by bringing an inspection jig having a plurality of contacts in electrical contact with the inspection point into contact with each unit substrate. An inspection jig having a selection means for selecting a wiring pattern to be inspected from a plurality of wiring patterns formed on a unit substrate, and a contact that is in conductive contact with the unit substrate to be inspected Thus, the inspection jig and the selection means can be integrally rotated and moved so that the moving means can inspect a pair of unit substrates arranged symmetrically. For this reason, the selection means moves integrally with the inspection jig without the need for a cable for connecting the inspection jig and the selection means, and the noise caused by the cable and the stray capacitance due to the transmission path are canceled. Thus, an electrical signal can be transmitted and received, and a highly accurate substrate inspection apparatus can be provided. Moreover, since the board inspection apparatus is cable-less, it is possible to prevent the electrical signal from being attenuated when an AC signal is used.
Furthermore, since noise due to the cable can be prevented, high insulation is possible, and the determination threshold when performing an insulation inspection between wiring patterns can be increased.
According to the second aspect of the present invention, the substrate inspection apparatus is provided with a mounting position where the sheet substrate is put into the substrate inspection apparatus, and the conveying means moves on a straight line connecting the inspection position and the mounting position. The movement efficiency of the means can be improved.
In the invention according to claim 3, when the unit substrates of the sheet substrate are arranged in a matrix, the substrate inspection apparatus performs inspection for each unit substrate arranged in a row perpendicular to the linear direction. Since a plurality of unit substrates arranged symmetrically are inspected for each column in the perpendicular direction, the inspection can be performed efficiently.
In this case, unit substrates arranged in a predetermined direction arranged in a perpendicular row and unit substrates arranged in a position rotated 180 degrees with respect to the predetermined direction are arranged, and unit substrates arranged in the same direction were inspected. Thereafter, the unit substrates arranged in the rotation direction are inspected for each column.
According to the invention of claim 4, the moving means moves in a direction perpendicular to the surface of the sheet substrate and moves in a direction perpendicular to a straight line connecting the inspection position and the mounting position. The moving means moves in a direction orthogonal in a plan view. For this reason, the conveying means and the moving means move on one straight line, and when the inspection jig is brought into conductive contact with a desired unit substrate, it becomes easy to control the conveying means and the moving means.
According to the invention of claim 5, the selection means has connection terminals that are electrically connected to the contacts of the inspection jig, and the connection terminals are electrically upstream and downstream of the supply means. Since the switching unit is provided so as to be electrically connected to either the upstream side or the downstream side of the detection means, it is possible to control efficiently by connection to the respective upstream side or downstream side.
According to the invention described in claim 6, the substrate inspection apparatus has a mounting table for mounting the sheet substrate by vacuum suction at the mounting position, and the transport unit is a sheet mounted on the mounting table. Since the holding portion that holds the end portion of the substrate and holds it in a tensile state in the outer direction of the sheet substrate is provided, the sheet substrate can be reliably held and transported.

The best mode for carrying out the present invention will be described.
First, a substrate to be inspected that can be suitably inspected by the substrate inspection apparatus according to the present invention will be described.
FIG. 1 is a plan view showing an embodiment of a sheet substrate to be inspected for the inspection by the substrate inspection apparatus according to the present invention.
For example, a flexible printed circuit board corresponds to the sheet substrate 1 to be inspected by the substrate inspection apparatus of the present invention. A plurality of unit substrates 11 are formed on the sheet substrate 1.
In such a sheet substrate 1, in consideration of the yield, as many unit substrates 11 as possible can be formed from the sheet substrate 1, as shown in FIG. A substrate is placed. For example, in FIG. 1, the unit substrate A is formed and arranged, and the unit substrate B is arranged at a point-symmetrical position with respect to the center C.
Thus, the sheet substrate 1 is effectively used by arranging the two unit substrates symmetrically.
In the sheet substrate 1 shown in FIG. 1, twenty-four unit substrates 11 are formed, and twelve pairs that are point-symmetric are shown. The sets are four vertically and three horizontally. Is arranged. The number and arrangement of the unit substrates 11 of the sheet substrate 1 shown in FIG. 1 are not particularly limited.

An inspection jig used in the substrate inspection apparatus of the present invention will be described. Since the inspection jig itself is a conventionally known technique, detailed description thereof is omitted.
The inspection jig includes a plurality of contacts, a holding body that holds these contacts, and an electrode portion that is in conductive contact with the contacts.
The contact is a conductive and flexible member formed in a needle shape or a rod shape, one end of which is in electrical contact with an inspection point set on the wiring pattern of the unit substrate 11, and the other end is an electrode. Conductive contact with the part.
The holding body has a guide hole for guiding one end of the contact to a predetermined inspection point and a guide hole for guiding the other end of the contact to a predetermined electrode portion. Each guide hole which this holding body has is formed for every contact.
The electrode portion is in conductive contact with the other end of the contact and is conductively connected to selection means described later. This electrode part electrically connects the contactor and the selection means.

A substrate inspection apparatus 2 according to the present invention will be described. FIG. 2 is a schematic configuration diagram of the substrate inspection apparatus according to the present invention, and FIG. 3 is a side view showing the inside of the substrate inspection apparatus according to the present invention.
The substrate inspection apparatus 2 includes a transport unit 21, a supply unit 22, a detection unit 23, a determination unit 24, a control unit 25, a movement unit 26, a selection unit 27, a storage unit 28, and a display unit 29.
The circuit board CB shown in FIG. 2 has four wiring patterns P1 to P4. The number and shape of the wiring patterns of the circuit board CB are appropriately set according to the designed circuit board CB.
In the circuit board CB of FIG. 2, one-shaped wiring pattern P1, T-shaped wiring pattern P2, and ten-shaped wiring patterns P3 and P4 are shown.
FIG. 2 shows four contacts (contact probes) CP that are in electrical contact with the wiring patterns P1 to P4.
As will be described in detail later, a plurality of the contact CPs are provided in the inspection jig, and connect the substrate inspection apparatus 2 and the circuit board CB so as to be electrically conductive. Further, the arrangement position and the number of the contacts CP are appropriately set according to the wiring pattern formed on the circuit board CB.
In the embodiment shown in FIG. 2, the upstream and downstream current supply terminals and the upstream and downstream voltage detection terminals, which will be described later, can be connected to a predetermined inspection position provided on the wiring pattern with a single contact CP. However, each of the current supply terminal and the voltage detection terminal may be brought into contact with a predetermined inspection position by two separate contact probes CP.
In the substrate inspection apparatus 2, in the schematic diagram shown in FIG. 2, each component shown on the left side from the connection terminal T connected to the contact CP is the inside of the substrate inspection apparatus 2.

The supply means 22 supplies predetermined power for detecting an electrical signal between a wiring pattern to be inspected and another wiring pattern (hereinafter, between inspection targets).
For example, a current controller can be used as the supply unit 22, but the supply unit 22 is not particularly limited, and any unit that can supply predetermined power between inspection targets can be used. it can.
When a current controller is used, a current is supplied to a predetermined wiring pattern by the supply means 22 that is a current controller, and a predetermined voltage is applied between inspection targets.
The voltage to be applied by the supply means 2 is set to 200 to 250 V as described above.

The voltage detection means 221 detects the voltage between inspection objects. For example, a voltmeter can be used as the voltage inspection unit 221, but the voltage inspection unit 221 is not particularly limited as long as it can detect a voltage between inspection objects.
By using the voltage value detected by the voltage detection means 221 and the current value supplied by the supply means 22 or the current value detected by the detection means 23 described later, the resistance value between the inspection objects can be calculated. . Furthermore, by using this resistance value, it is possible to inspect electrical characteristics between inspection objects.
The operation of the supply means 22 can also be set to be controlled by the voltage value detected by the voltage detection means 221.

The detection means 23 detects the current between inspection objects. For example, an ammeter can be used as the detection means 23, but it is not particularly limited as long as it can detect a current value flowing between inspection objects.
Although the current value supplied by the supply means 22 can be determined, by using this detection means 23, the current value between inspection objects can be detected on the electrical downstream side.

The current supply terminal 8 is connected to each wiring pattern P via a contact CP in order to supply a current between inspection objects.
The current supply terminal 8 includes an upstream current supply terminal 81 that connects the upstream side (positive side) of the supply unit 22 and the wiring pattern, and a downstream side (negative side) of the supply unit 22 or the current detection unit 4 and the wiring pattern P. The downstream current supply terminal 82 is connected.
As shown in FIG. 2, the upstream current supply terminal 81 and the downstream current supply terminal 82 of the current supply terminal 8 are provided for each wiring pattern P.
Each of the upstream current supply terminal 81 and the downstream current supply terminal 82 has a switching unit (switch element) SW in the selection unit 27, and the ON / OFF operation of the switching unit SW of the selection unit 27 is performed. The connected / unconnected state is set.
The current supply terminal 8 is preferably provided with a resistance for protection against electrostatic discharge.

The voltage detection terminal 9 is connected to each wiring pattern P via a contact CP in order to detect a voltage between inspection objects.
This voltage detection terminal 9 connects the upstream side (positive electrode side) of the voltage detection means 221 and the wiring pattern P to the upstream voltage detection terminal 91, and the downstream side (negative electrode side) of the voltage detection means 221 and the wiring pattern P. A downstream voltage detection terminal 92 is provided.
As shown in FIG. 1, the upstream voltage detection terminal 91 and the downstream voltage detection terminal 92 of the voltage detection terminal 9 are provided for each wiring pattern P.
Each of the upstream voltage detection terminal 91 and the downstream voltage detection terminal 92 has a switching unit SW of the selection unit 27, similarly to the current supply terminal 8, and the switching unit SW of the selection unit 27 is turned on / off. By the OFF operation, the connected / unconnected state is set.

As shown in FIG. 2, the current supply terminal 8 and the voltage detection terminal 9 are arranged with four terminals with respect to one contact CP that is in conductive contact with the wiring pattern P. Four switching units SW that perform ON / OFF control are provided.
In FIG. 2, the switching unit that controls the operation of the upstream current supply terminal 81 is denoted by SW1, the switching unit that controls the operation of the upstream voltage detection terminal 91 is denoted by SW2, and the operation of the downstream current supply terminal 92 is illustrated. A switching unit that controls the switching is denoted by reference symbol SW3, and a switching unit that controls the operation of the downstream voltage detection terminal 82 is denoted by reference symbol SW4.

The selection means 27 selects the supply means 22 and the detection means 23 from the plurality of wiring patterns formed on the unit substrate so as to be a wiring pattern to be inspected, and a contact (connection terminal T) of the inspection jig. Make a conductive connection.
The selection means 27 is composed of a plurality of switching units SW that are conductively connected to the contact CPs described above. The selection means 27 is controlled to be turned ON / OFF by receiving an operation signal from the control means 25 described later.

The voltage value and the current value detected by the voltage detection unit 221 and the detection unit 23 are transmitted to the determination unit 24 with elapsed time information added (as time-series information). The determination means 24 calculates the electrical characteristics of the wiring pattern to be inspected from the power (voltage value) supplied by the supply means 22 and the electrical signal (current value) detected by the detection means 23, and this electrical characteristics. The quality of the wiring pattern is determined based on the above.
In the determination performed by the determination unit 24, a determination threshold is set in advance in a storage unit 28, which will be described later, and the quality in the continuity inspection of the wiring patterns and the quality in the insulation inspection between the wiring patterns are determined by comparison with the threshold.

The storage means 28 stores information related to the wiring pattern P of the circuit board CB, information related to inspection points of the wiring pattern P, and information of detected values to be detected.
Information necessary for the continuity / insulation test is stored in the storage means 28, and by using these pieces of information, the continuity / insulation test is performed and each detected value to be detected is stored.
Note that the order of the wiring patterns to be inspected is stored in the storage means 28, and the control means 25 described later controls the operation of the selection means 27 along this order.

The control means 25 selects the wiring pattern P to be inspected from the plurality of wiring patterns P on the circuit board CB, and specifies the wiring pattern P to be inspected. By specifying the wiring pattern P to be inspected by the control means 25, wiring patterns to be sequentially subjected to continuity / insulation inspection are selected.
The method for selecting a wiring pattern to be inspected by the control means 25 is exemplified by a method in which the order of wiring patterns to be inspected is set in the storage means 28 in advance, and the wiring pattern to be inspected is selected according to this order. Can do. This selection method can adopt the method as described above, but is not particularly limited as long as the wiring patterns to be inspected are selected in order.
The selection of a specific wiring pattern performed by the control unit 25 is performed by using the selection unit 27. For example, by performing ON / OFF control of each switching unit SW of the selection unit 27, a wiring pattern to be inspected can be selected.
In the substrate inspection apparatus 2 of the embodiment of FIG. 2, the switching unit SW is turned on so that the wiring pattern to be inspected is connected to the upstream current supply terminal 81 for connection to the supply means 22. Become. At the same time, the switching unit SW is turned on so that the upstream voltage detection means 91 and this wiring pattern are connected.

  For example, when the continuity test is performed, in the embodiment shown in FIG. 2, when the wiring pattern P1 is the inspection target, the control unit 25 detects the upstream current supply terminal 81 connected to the wiring pattern P1 and the upstream voltage detection. A terminal 91 is selected, and a downstream current supply terminal (not shown) connected to a contact (not shown) that contacts the other end of the wiring pattern P1 and a downstream voltage detection terminal (not shown) are selected. Then, a signal that prompts to turn on the two switching units SW of the switching units SW1 and SW2 of the terminals 81 and 91 and a terminal (not shown) (terminal connected to the contact at the other end) is transmitted. .

For example, when an insulation inspection is performed, in the embodiment shown in FIG. 2, when the wiring pattern P1 is an inspection target, the control unit 25 detects the upstream current supply terminal 81 connected to the wiring pattern P1 and the upstream voltage detection. The terminal 91 is selected, and a signal for urging to turn on the switching unit SW1 and the switching unit SW2 of these terminals 81 and 91 is transmitted. When the selection unit 27 receives this signal, the switching unit SW1 and the switching unit SW2 operate.
Further, in this case, a signal is transmitted that prompts the switching unit SW4 corresponding to a wiring pattern other than the wiring pattern to be inspected (remaining wiring patterns) to be turned on.
As described above, the control means 25 selects the wiring pattern P to be inspected from the plurality of wiring patterns P on the circuit board CB, and conducts the continuity inspection or the insulation inspection.

  The display means 29 displays the state of continuity / insulation inspection. This display means 29 displays the discovery of the spark.

Next, the mechanical structure of the substrate inspection apparatus 2 will be described with reference to FIG.
In the substrate inspection apparatus 2 shown in FIG. 3, a placement position A is provided on the left hand side, and an inspection position B is provided on the right hand side.
In the substrate inspection apparatus 2, the sheet substrate 1 is loaded into the substrate inspection apparatus 1 at the placement position A. In this placement position A, a door 31 that can be opened and closed is provided.
A placement table 32 on which the sheet substrate 1 is placed is disposed below the door 31 shown in FIG. The mounting table 32 has a plate-like portion 32a on which the sheet substrate 1 is placed, and the plate-like portion has a plurality of through holes (not shown) penetrating in the thickness direction. This through-hole is connected to a suction device such as a vacuum pump (not shown), and the sheet substrate 1 to be placed can be fixed to the plate-like portion 32a by vacuum suction from this through-hole.

  The plate-like portion 32a preferably has positioning means (not shown) for positioning when the sheet substrate 1 is placed. As this positioning means, for example, a fixing member such as a pin for positioning and fixing two adjacent sides of the sheet substrate 1 can be used. In this manner, the sheet substrate 1 can be positioned by positioning at least one corner of the sheet substrate 1.

The mounting table 32 has an elevating part 32b that can elevate and lower the plate-like part 32a. When the sheet substrate 1 is prepared for mounting in the substrate inspection apparatus 2 during use, the plate-like portion 32a of the mounting table 32 is located at the upper part and the sheet-like portion 32a is placed on the plate-like portion 32a. When the substrate 1 is placed and the transport unit 21 grips and transports the sheet substrate 1, the plate-like portion 32a can be moved downward.
Thus, by raising and lowering the plate-like portion 32a, the sheet substrate 1 can be easily placed, and it can be prevented that the conveying means 21 becomes an obstruction factor when conveying.

The transport unit 21 transports the sheet substrate 1 from the placement position A to the inspection position B and from the inspection position B to the placement position A.
The transport unit 21 includes a gripping portion (not shown) that grips an end portion of the sheet substrate 1 placed on the placement table 31 and holds the end portion of the sheet substrate 1 in a tensile state in the outer direction.
The gripping unit has four clamping mechanisms that clamp the four end portions of the sheet substrate 1 in the thickness direction of the sheet substrate 1 in order to securely grip the sheet substrate 1. In addition, when the gripping unit grips the sheet substrate 1, the clamping mechanism moves each clamping mechanism toward the outside of the sheet substrate 1 by a predetermined distance in order to hold the sheet substrate 1 in a tensile state.
The predetermined distance is not particularly limited as long as the sheet substrate 1 can be held in a tensile state and can be held as flat as possible.
The four clamping mechanisms of the transport means 21 move while holding the sheet substrate 1 in a tensioned state on a rail that linearly connects the placement position A and the inspection position B.
For this reason, the sheet substrate 1 is always kept in a tensile state during conveyance and inspection.

When the transport unit 21 transports the sheet substrate 1 as shown in FIG. 1, if the direction of the arrow shown in FIG. 1 is the same as the movement direction of the transport unit 21, each row (a, b, c , D line).
After inspecting the plurality of unit substrates 11 arranged in one row (for example, a row), the conveying means 21 conveys the sheet substrate 1 for one row and arranges it in the next row (for example, b row). The sheet substrate 1 is conveyed so that a plurality of unit substrates 11 to be inspected can be inspected.
In such a case, although details will be described later, as an inspection procedure for the unit substrates 11 arranged in the row a, three unit substrates A facing in the same direction are inspected and then arranged in a point-symmetric manner. One unit substrate B is inspected. Further, the unit substrate 11 can be inspected alternately with the unit substrate A and the unit substrate B.
This inspection procedure can use a method that can shorten the inspection time around the sheet substrate 1, and depends on the rotational speed and moving speed of the moving means 26.

The moving means 26 holds the inspection jig 5 and the selection means 27, and further moves the inspection jig 5 so that each contact of the inspection jig 5 can be brought into contact with each inspection point of the unit substrate 11. And the selection means 27 are rotated together. In the substrate inspection apparatus 2 shown in FIG. 3, two moving means 26 are arranged above and below the conveying means 21.
In this case, an inspection jig 5 for inspecting a wiring pattern arranged on the front surface of the unit substrate 11 of the sheet substrate 1 and an inspection jig 5 for inspecting a wiring pattern arranged on the back surface are shown. In addition, it is also possible to inspect a wiring pattern having end portions on the front surface and the back surface using these two inspection jigs 5.

The moving means 26 is provided so as to move in a direction perpendicular to the conveying means 21 in plan view. By providing the conveying means 21 and the moving means 26 so as to move in the orthogonal direction, the sheet substrate 1 can be freely moved in the orthogonal direction (xy direction).
Note that both the conveying means 21 and the moving means 26 can be provided so as to freely move in the xy directions, but the conveying means 21 and the moving means 26 are orthogonal to each other in order to reduce the size of the substrate inspection apparatus 2. It is preferable to provide a unidirectional movement mechanism.

The moving unit 26 includes a holding unit 261, a rotating unit 262, a moving mechanism 263, and a selecting unit 27. FIG. 4 is an enlarged view of the moving means shown in FIG.
The holding unit 261 is a holding mechanism that holds the inspection jig 5. The holding mechanism of the holding portion 261 is not particularly limited as long as it can hold the inspection jig 5 so as to be electrically connected to the selection means 27. As described above, the inspection jig 5 and the selection means 27 are integrated. It must be held securely so that it can be moved.

The rotating unit 262 enables the inspection jig 5 and the selection means 27 to rotate about the W axis shown in FIG. The rotating unit 262 can use a mechanism for rotationally driving such as a motor.
The rotating part 262 needs to be able to rotate 180 degrees in order to rotate the inspection jig 5 and the selection means 27 in order to inspect at least point symmetrical unit substrates A and B.

The moving mechanism 263 is a mechanism for moving in the orthogonal direction with respect to the conveying means 21 of the moving means 26 as described above. As described above, the moving mechanism 263 is provided so as to be able to move in a direction orthogonal to the moving direction of the conveying means 21.
The above is description of the structure of the board | substrate inspection apparatus 2 concerning this invention.

Next, the operation of the substrate inspection apparatus 2 according to the present invention will be described.
FIG. 5 is a schematic explanatory view for explaining the operation of the substrate inspection apparatus, (a) is a schematic plan view, and (b) is a schematic front view.
First, a sheet substrate 1 as shown in FIG. 1 is prepared, and an inspection jig 5 that can inspect the front and back surfaces of the unit substrate 11 of the sheet substrate 1 is prepared.
When the sheet substrate 1 and the inspection jig 5 are prepared, the inspection jig 5 is held by the holding unit 261 of the substrate inspection apparatus 2.

Next, the sheet substrate 1 is inspected.
The sheet substrate 1 is placed while the door 31 of the substrate inspection apparatus 2 is opened and the sheet substrate 1 is aligned on the plate-like portion 32a of the placement table 32 at the placement position A.
At this time, vacuum suction is performed on the plate-like portion 32 a of the mounting table 32 in order to fix the sheet substrate 1.
When the sheet substrate 1 is fixed, the four gripping portions 211 of the transport unit 21 sandwich the four corners of the sheet substrate 1 respectively. At this time, the gripper 211 appropriately moves toward the outer side of the sheet substrate 1.
When the gripping portions 211 sandwich the four corners of the sheet substrate 1, the mounting table 32 is lowered, and the transport unit 21 transports the sheet substrate 1 from the mounting position A to the inspection position B.

  When the sheet substrate 1 is conveyed to the inspection position B, the moving unit 26 comes close to the sheet substrate 1. At this time, since the moving means 26 is provided with the photographing device 6 (alignment camera) for detecting the position of the sheet substrate 1 and the unit substrate 11 on the sheet substrate 1, the photographing device 6 detects the position. And the position correction is performed. Note that the alternate long and short dash line extending from the imaging device 6 shown in FIG. 5A indicates the imaging axis of the imaging device 6.

When the position correction is performed, the moving unit 26 brings the inspection jig 5 into contact with a predetermined unit substrate 11 in order to perform the inspection. In this case, the upper inspection jig 5 and the lower inspection jig 5 are independently corrected in position by the respective moving means 26 and moved so that the contact is in conductive contact with a predetermined inspection point. To do.
When the sheet substrate 1 as shown in FIG. 1 is inspected, for example, in order to inspect the unit substrate A arranged on the left side of the row a, the inspection jig 5 is brought into contact with the inspection point of the unit substrate 11. The moving means 21 moves the inspection jig 5 so that the child is in conductive contact.

The inspection jig 5 is brought into conductive contact with the moving means 21, and a continuity / insulation inspection is executed. At this time, since the inspection jig 5 and the selection means 27 are conductively connected without a cable, electrical signals for inspection can be efficiently transmitted and received, and inspection accuracy can be improved.
When the inspection of the left unit substrate A in the a row is completed, the inspection jig 5 is separated from the unit substrate 11, and the unit substrate A (center unit substrate A) disposed in the middle of the a row is inspected. This unit substrate A is inspected in the same manner, and then the right unit substrate A is inspected.

When the inspection of the a-row unit substrates A is completed, the a-row unit substrates B arranged at point-symmetric positions of the unit substrate A are then inspected. At this time, the moving means 26 first rotates the inspection jig 5 and the selection means 27 by 180 degrees so that the unit substrate B can be inspected.
As described above, when the moving means 26 performs the rotational movement, the inspection jig 5 is easily brought into conductive contact with the unit substrate B.
When the inspection jig 5 is rotated, the unit substrates B are inspected one by one in the same manner as the unit substrate A inspection procedure. When all the a-row unit substrates B are inspected, the transport means 21 transports the sheet substrate 1 by one row, and then the b-row unit substrates 11 are inspected. In this case, the inspection is performed from the unit substrate B to the unit substrate A.
In this way, the process is repeated until the inspection of all the unit substrates 11 formed on the sheet substrate 1 is completed.
The above is description of operation | movement of the board | substrate inspection apparatus concerning this invention.

It is a top view which shows one Embodiment of the sheet | seat board | substrate used as the test object for the board | substrate inspection apparatus concerning this invention to test | inspect. It is a schematic block diagram of one Embodiment in the case of using the board | substrate inspection apparatus concerning this invention. It is a side view showing the inside of one embodiment board inspection device concerning the present invention. It is a schematic enlarged view of the moving means shown by FIG. It is a schematic explanatory drawing for demonstrating operation | movement of a board | substrate inspection apparatus, (a) is a schematic plan view, (b) is a schematic front view. In addition, the arrow in a figure shows the operation | movement direction of each mechanism, and a sheet | seat board | substrate and a mounting base are shown with a dotted line.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Sheet substrate 2 ... Board inspection apparatus 21 ... Conveying means 22 ... Supply means 23 ... Detection means 24 ... Determination means 25 ... Control means 26 ... Movement Means 27 ... Selection means SW ... Switching part CP ... Contact

Claims (6)

In a sheet substrate that is arranged in pairs so that a plurality of unit substrates having a plurality of wiring patterns are point-symmetric, contacts that are in conductive contact with inspection points set on the wiring patterns of the unit substrates A substrate inspection apparatus for inspecting the sheet substrate by detecting electrical characteristics of a wiring pattern to be inspected of the unit substrate by conducting contact with each unit substrate in a conductive contact with a plurality of inspection jigs,
A conveying means for holding the sheet substrate and conveying the sheet substrate to a predetermined inspection position;
Supply means for supplying power for detecting an electrical signal for detecting an electrical characteristic from the wiring pattern to be inspected;
Detection means for detecting the electrical signal;
A determination means for calculating the electrical characteristics of the wiring pattern to be inspected from the electric power and the electrical signal, and determining the quality of the wiring pattern based on the electrical characteristics;
In order to select a wiring pattern to be inspected from a plurality of wiring patterns formed on the unit substrate, a selecting means for electrically connecting the supply means and the detecting means to a contact of the inspection jig;
In order to bring the inspection jig into conductive contact with the inspection points on the wiring pattern of the unit substrate, the moving means for holding and moving the inspection jig,
The substrate inspection apparatus characterized in that the moving means can integrally rotate the inspection jig and the selection means so as to inspect a set of unit substrates arranged symmetrically with respect to a point. . The substrate inspection apparatus is provided with a placement position for loading the sheet substrate into the substrate inspection apparatus,
The substrate inspection apparatus according to claim 1, wherein the transport unit moves on a straight line connecting the inspection position and the mounting position. In the case where the unit substrates of the sheet substrate are arranged in a matrix,
The substrate inspection apparatus according to claim 2, wherein the substrate inspection apparatus performs inspection for each unit substrate arranged in a row perpendicular to the linear direction.   3. The substrate according to claim 2, wherein the moving means moves in a direction perpendicular to the surface of the sheet substrate and moves in a direction perpendicular to a straight line connecting the inspection position and the mounting position. Inspection device. The selection means has connection terminals that are connected to the contacts of the inspection jig, respectively.
The switching unit includes a switching unit so that the connection terminal is electrically connected to either the upstream side or the downstream side of the supply unit and either the upstream side or the downstream side of the detection unit. The board | substrate inspection apparatus of description. The substrate inspection apparatus includes:
In the mounting position, having a mounting table for mounting the sheet substrate by vacuum suction,
2. The substrate inspection according to claim 1, wherein the transport unit includes a gripping portion that grips an end portion of the sheet substrate placed on the mounting table and holds the sheet substrate in a tensile state in an outer direction of the sheet substrate. apparatus.

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