JP2008167123A - Method of manufacturing piezoelectric oscillator - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve the problem that the entire structure becomes tall in height and hence it is difficult to reduce the height of a piezoelectric oscillator since the piezoelectric oscillator is composed by connecting a vessel body into which a piezoelectric vibration element is stored onto the upper surface of a substrate where an integrated circuit element is mounted. <P>SOLUTION: A method of manufacturing a piezoelectric device includes: a process for preparing a metal plate arranged face to face in a form, where a terminal section is arranged in series; an integrated circuit element connection process for connecting the integrated circuit element electrically and mechanically for mounting in a form, where each integrated circuit element mount pad faces a connection pad corresponding to a decided function; a terminal section junction process for joining an electrode terminal for connecting a terminal section at a piezoelectric vibration section to the upper surface of the terminal section by a conductive junction material so that the integrated circuit element is inserted into the storage section of the metal plate; and a cut-off separation process for cutting off the connection portion between the sacrificial marginal section of a metal plate and the terminal section to separate each terminal section from the sacrificial marginal section and obtaining a plurality of piezoelectric oscillators simultaneously. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a piezoelectric oscillator which is one of electronic components used in an electronic device such as a portable communication device.

  A conventional piezoelectric oscillator will be described below with reference to FIG. In the drawings, description will be made on the assumption that the upper side of the described paper is “up” in the piezoelectric oscillator. Such a conventional piezoelectric oscillator includes a container body 100 in which the piezoelectric vibration element 101 is housed and the piezoelectric vibration element 101 is hermetically sealed by a lid, a concave space having an opening in the center region of the upper surface, and a lower surface. Is attached on the top surface of the side wall surrounding the recessed space of the base body 102 on which external connection electrode terminals are formed, and in a space region surrounded by the lower surface of the container body 100 and the recessed space of the base body 102. In order to control the oscillation output based on the excitation of the piezoelectric vibration element 101, a piezoelectric oscillator having a structure in which at least an oscillation integrated circuit element 103 electrically connected to the piezoelectric vibration element 101 is accommodated is known. (For example, see Patent Document 1 below.)

  The container body 100 and the base body 102 are usually made of a ceramic material such as alumina ceramics, and a predetermined wiring pattern is formed on the inside and the surface thereof. By adopting a conventionally known green sheet laminating method or the like, It has been produced. In addition, a base body connecting electrode terminal is provided on the lower surface of the container body 101 facing the base body 102, and a container body connection pad is provided on the opening side top surface of the side wall of the base body 102 at locations facing each other. The container body 100 was fixed to the upper surface of the base body 102 by conductively fixing the electrode terminal for base body connection and the container body connection pad through a conductive bonding material such as a conductive adhesive or solder.

The following prior art is disclosed about the piezoelectric oscillator of the above forms.
JP-A-10-98151 JP 2004-228894 A JP 2004-88533 A JP 2000-349555 A

  In addition, other than the prior art documents specified by the prior art document information described above, other than the prior art documents related to the present invention have not been found by the time of filing of the present application.

  As a manufacturing method of the above-described conventional piezoelectric oscillator, a piezoelectric oscillator is obtained by connecting a container body (piezoelectric vibrator unit) containing a piezoelectric vibration element to the upper surface of a substrate on which an integrated circuit element is mounted. Due to the configuration, the manufactured piezoelectric oscillator becomes tall. Accordingly, it is difficult to reduce the thickness (thinner) of the piezoelectric oscillator in the method of manufacturing the piezoelectric oscillator including the base body on which such an integrated circuit element is mounted and the container body on which the piezoelectric vibration element is mounted. It had the problem that.

  In addition, as a manufacturing method of the above-described conventional piezoelectric oscillator, the manufacturing method of a container body or a substrate is usually manufactured by a method of cutting and dividing a plurality of substrate sheets each of which are arranged in groups to obtain individual container bodies or substrates. The piezoelectric oscillator is assembled and manufactured by individually mounting the crystal resonator element and the integrated circuit element on the individual container bodies and bases obtained after the division. In that case, it is necessary to mount and hold the integrated circuit element and the piezoelectric vibration element after mounting and holding the individual container body and the base body on the carrier jig. The process is also complicated, and the manufacturing time is increased.

  Furthermore, as a manufacturing method of the above-described conventional piezoelectric oscillator, when electrically and mechanically connecting a container body (piezoelectric vibrator portion) on which a piezoelectric vibration element is mounted and a substrate on which an integrated circuit element is mounted, Since it is necessary to form individual conductors one by one on the substrate connection electrode terminal on the mounting side main surface of the container body, there is a problem that the production efficiency of the piezoelectric oscillator is reduced. .

  The present invention has been devised in view of the above problems, and an object of the present invention is to provide a method of manufacturing a piezoelectric oscillator that is easy to handle, has excellent productivity, and can cope with a low profile.

The method for manufacturing a piezoelectric device of the present invention is made to solve the above-described problem. A terminal portion having a rectangular parallelepiped shape having sides higher than the height dimension of an integrated circuit element is A plurality of terminals are arranged in series in a form in which one surface is connected to the cut-off portion, and the terminal portion arranged in series is spaced a predetermined distance from the surface connected to the turn-off portion of the terminal portion. A step of preparing a metal plate having a configuration in which a vacant accommodating portion is provided in a face-to-face configuration,
In the integrated circuit element mounting pad of the piezoelectric vibrator portion formed by airtightly mounting the piezoelectric vibration element inside the container body of the terminal portion connection electrode terminal and the integrated circuit element mounting pad formed on one main surface, An integrated circuit element connection step for mounting the integrated circuit elements by electrically and mechanically connecting the connection pads corresponding to the functions determined for each integrated circuit element mounting pad in a face-to-face configuration;
A terminal part joining step for joining the electrode part for connecting the terminal part of the piezoelectric vibration part and the upper surface of the terminal part with a conductive joining material so as to insert the integrated circuit element into the housing part of the metal plate;
By cutting the connecting portion between the metal plate surplus portion and the terminal portion, each terminal portion is separated from the metal plate, and a cutting and separating step for simultaneously obtaining a plurality of piezoelectric oscillators,
It is characterized by comprising.

  Further, a part of the terminal portion of the metal plate is used as a data write terminal, temperature compensation data is input to the integrated circuit element through the data write terminal, and the temperature compensation data is stored in a memory in the integrated circuit element. It is also a method for manufacturing a piezoelectric device according to the preceding paragraph, characterized in that the step is provided after the cutting and separating step.

  Further, the present invention is also a method for manufacturing a piezoelectric device according to paragraph (0010), which includes a step of covering the periphery of the integrated circuit element with an insulating resin after the terminal portion bonding step.

  Also, paragraph (0011) is characterized in that when a part of the terminal portion of the metal plate is used as a data write terminal, the height of the terminal portion used as the data write terminal is lower than the height of the other terminal portions. It is also a manufacturing method of the piezoelectric device.

  According to the piezoelectric oscillator manufacturing method of the present invention, the terminal portion connected to the piezoelectric vibration element is formed to be higher than the height dimension of the integrated circuit element mounted on the piezoelectric oscillator. By adopting a form in which the upper surface and the electrode terminal for connecting the terminal part are joined and connected by a conductive bonding material, a substrate for mounting an integrated circuit element is not used, and the height is reduced compared to a conventional piezoelectric oscillator (thin type). It is possible to make

  In addition, the conductive bonding material used for bonding the terminal portion connection electrode and the terminal portion in the present invention is a mask jig in which holes are formed at positions corresponding to the terminal portions formed on the metal plate on the upper surface of the metal plate. Can be collectively formed on a plurality of terminal portions by printing means, so that the individual conductors are formed one by one on the substrate connection electrode terminal on the mounting side main surface of the container body as in the prior art. Therefore, the productivity of the piezoelectric oscillator is improved.

  Also, the metal plate is a process of dividing the surplus part and the terminal part after mounting the integrated circuit element. During the manufacturing process of the piezoelectric oscillator, the metal plate itself is a piezoelectric vibration having the integrated circuit element mounted thereon. Since it is designed to function as a carrier for the child portion, the carrier for mounting an integrated circuit element as described in the conventional example is unnecessary, and individual substrates obtained by dividing the substrate are mounted on the carrier. No complicated work is required. This also improves the productivity of the piezoelectric oscillator.

  In addition, by filling the periphery of the integrated circuit element including a part of the surface of the terminal portion with an insulating resin, when the terminal portion is cut and separated from the discarded portion of the metal plate, the insulating resin is disconnected at the time of cutting. Therefore, it is possible to further reduce problems such as peeling between the terminal portion and the terminal portion connection electrode terminal due to stress at the time of cutting.

  In addition, when a part of the terminal portion of the metal plate is used as the data write terminal, the height of the terminal portion used as the data write terminal is made lower than the height of the other terminal portions. Even when mounted on an external electric circuit such as a mother board, the wiring pattern formed on the mother board surface and the data writing terminal are not unnecessarily brought into contact with each other, so that a stable oscillation frequency can be output.

  Therefore, the present invention has an effect of providing a method for manufacturing a piezoelectric oscillator that is easy to handle, has excellent productivity, and can cope with a low profile.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.
FIG. 1 is an exploded perspective view showing an example of an oscillator using a crystal as a piezoelectric material (hereinafter referred to as a crystal oscillator), which is a piezoelectric oscillator formed by a method for manufacturing a piezoelectric oscillator according to an embodiment of the manufacturing method of the present invention. FIG. FIG. 2 is a sectional view after the crystal oscillator shown in FIG. 1 is assembled. FIG. 3A is a perspective view of the piezoelectric vibrator portion constituting the piezoelectric oscillator formed by the piezoelectric oscillator manufacturing method of the present invention as seen from the integrated circuit element mounting side main surface (one main surface). FIG. 3B is a perspective view of the piezoelectric oscillator formed by the method for manufacturing a piezoelectric oscillator of the present invention as seen from the main surface on the mounting side. 4 and 5 are sectional views of a piezoelectric oscillator according to another embodiment of the piezoelectric oscillator formed by the method for manufacturing a piezoelectric oscillator of the present invention.
In FIG. 1 and FIG. 2, FIG. 3, FIG. 4, and FIG. Moreover, in each figure, the same code | symbol shows the same components, and in order to clarify description, a part of structure unnecessary for description is not shown in figure. Further, the illustrated dimensions are partially exaggerated.
In the crystal oscillator shown in each drawing, a crystal resonator element 20 is accommodated in a container body 10 whose main surface has a rectangular outer shape, and an integrated circuit element 50 is connected to one main surface of the container body 10. At the same time, the terminal portion 41 to be the external connection electrode terminal 41a and the data writing terminal 41b is connected.

The container body 10 is made of, for example, a ceramic material such as alumina ceramics or glass-ceramics, and the other main surface (upper main surface in FIG. 1) of the container body 10 has a recessed space that opens in a rectangular shape in the central region thereof. 14 is formed. Further, an annular sealing conductor pattern 11 is formed on the opening side top surface of the side wall surrounding the opening of the recessed space 14, and one main surface (the lower main surface in FIG. 1) of the container body 10 is formed. The integrated circuit element mounting pad 15 is provided while making electrical connection with an electronic circuit network mounted in the integrated circuit element 50.
Further, when the terminal part 41 is fixedly attached to the container body 10, the upper main surface of the terminal part 41 and the terminal part connection electrode terminals 12 formed on one main surface of the container body 10 are soldered. And mechanically and electrically bonded by a conductive bonding material 60 such as a conductive adhesive. Further, the container body 10 is for accommodating the crystal resonator element 20 in the recessed space 14 opened to the other main surface, and both the front and back main surfaces of the crystal resonator element 20 are disposed on the bottom surface in the recess space 14. A piezoelectric vibration element mounting pad 13 that is electrically connected to each of the excitation electrodes 21 formed on the surface is deposited.

  In addition, the sealing conductor pattern 11 formed on the top surface of the opening side of the recess space 14 on the side wall of the container body 10 is made of nickel (on the surface of a base layer made of tungsten (W), molybdenum (Mo), etc., for example. A Ni) layer and a gold (Au) layer are sequentially deposited in a form surrounding the opening of the recess space 14 in an annular shape, and are formed to a thickness of 10 μm to 25 μm. The peripheral edge is exposed on the inner wall surface of the recessed space 14, and the outer peripheral edge is exposed on the outer surface of the container body 10. The conductive pattern 11 for sealing improves the airtight reliability and productivity of the piezoelectric vibration element mounting space by improving the wettability of the sealing member 31 formed on the lid 30 for the lid 30 described later. Can do.

  The piezoelectric vibration element mounting pad 13 provided on the bottom surface in the concave space 14 of the side wall of the container body 10 is connected to the terminal portion connection electrode terminal 12 and the container body 10 provided on one main surface of the container body 10. They are electrically connected via wiring patterns on the surface of each layer to be configured and via conductors that penetrate each layer. Further, the piezoelectric vibration element mounting pad 13 is electrically and mechanically connected to an excitation electrode 21 of a crystal vibration element 20 described later via a conductive adhesive 70 on the upper surface side.

  On the other hand, the crystal resonator element 20 accommodated in the recessed space 14 of the container body 10 is mainly a crystal element plate having a substantially flat plate shape and a main surface shape of which is cut out from an artificial crystal lens at a predetermined cut angle and is subjected to outer shape processing. As a structure, a pair of excitation electrodes 21 are attached and formed on both the front and back main surfaces of the crystal element plate, and when an alternating voltage from the outside is applied to the crystal element plate via the excitation electrode 21. The excitation is generated in a predetermined vibration mode and frequency. Such a crystal resonator element 20 has a lead electrode drawn out from the excitation electrode 21 applied to both main surfaces thereof to one short side of the crystal base plate and a corresponding piezoelectric vibration in the bottom surface of the recessed space 14. The element mounting pad 13 is mounted on the bottom surface in the recessed space 14 of the container body 10 by electrically and mechanically connecting the element mounting pad 13 via the conductive contact adhesive 70.

  The conductive adhesive 70 is obtained by adding and mixing a predetermined amount of conductive particles made of Ag or the like into a resin material made of silicon resin or polyimide resin.

  Further, the lid 30 disposed on the container body 10 is manufactured by adopting a conventionally known metal processing method and shaping a metal such as 42 alloy into a predetermined shape. A nickel (Ni) layer is formed on the upper surface of the lid body 30, and further, gold tin (Au—Sn) which is a sealing member 31 at least at a location facing the sealing conductor pattern 11 on the upper surface of the nickel (Ni) layer. ) Layer is formed. The thickness of the gold tin (Au—Sn) layer is 10 μm to 40 μm. For example, the component ratio is 80% gold and 20% tin. Moreover, such a sealing member 31 can relieve unevenness on the surface of the sealing conductor pattern 11 and prevent a decrease in hermeticity. Such a lid body 30 is arranged on the sealing conductor pattern 11 formed on the top of the side wall portion surrounding the recessed space 14 in which the crystal resonator element 20 is mounted, so as to cover the opening of the recessed space 14. The sealing member 31 and the sealing conductor pattern 11 are melt-bonded to hermetically seal the inside of the recessed space 14 to constitute a piezoelectric vibrator portion.

The terminal portion 41 is made of a metal material such as copper or SUS, and a single plate using the metal material is formed by a conventionally known punching method, etching method, or the like. A plurality of terminal portions 41 having a rectangular parallelepiped shape having sides higher than the length dimension are arranged in series in a form in which one surface of the terminal portion 41 is connected to the surplus portion 42, and the terminals arranged in series The metal plate of the structure which arrange | positioned the part 41 in the form which provided the accommodating part which provided the predetermined space | interval in the surface on the opposite side to the surface connected with the discard part 42 of the said terminal part 41 in between Then, the terminal portion 41 is formed separately. Further, the upper surface of the terminal portion 41 and the terminal portion connecting electrode terminal 12 on one main surface side of the container body 10 are melt-bonded by a conductive bonding material 60 such as solder or a conductive adhesive.
Further, the main surface connected to the terminal portion connection electrode terminal 12 on the mounting surface side of the container body 10 of the terminal portion 41 and the main surface connected to an external electronic circuit such as a mother board are subjected to Ni plating or Au plating. As a result, the bondability of the conductive bonding material 60 can be improved.

Each terminal portion 41 is used as a data write terminal 41b in addition to the external connection electrode terminal 41a (power supply voltage terminal, ground terminal, oscillation output terminal, oscillation control terminal). When the piezoelectric oscillator is mounted on an external electric circuit such as a mother board, the external connection electrode terminal 41a is electrically connected to the circuit wiring of the external electric circuit by soldering or the like. Further, the data write terminal 41b applies the probe needle of the temperature compensation data writing device and writes temperature compensation data corresponding to the temperature characteristics of the crystal resonator element 20, whereby the temperature compensation data is stored in the memory of the integrated circuit element 50. Stored. In addition, the terminal part 41 used as each electrode terminal is provided with a difference in outer shape depending on the use of the electrode terminal.
For example, as shown in FIG. 4, when a part of the terminal portion of the metal plate 43 is formed as the data write terminal 41b, the height of the data write terminal 41b is higher than the height of the other external connection electrode terminals 41a. Since it has been lowered, the wiring pattern formed on the motherboard and the data write terminal 41b do not come into contact with each other even when mounted on an external electric circuit such as a motherboard, so that a stable oscillation frequency is output. Is possible.

  Here, if the ground terminal and the oscillation output terminal are arranged close to each other among the four external connection electrode terminals 41a, it is possible to effectively prevent noise from interfering with the oscillation signal output from the oscillation output terminal. can do. Therefore, it is preferable to arrange the ground terminal and the oscillation output terminal close to each other.

  The integrated circuit element 50 is, for example, a rectangular flip-chip integrated circuit element having a plurality of connection pads corresponding to the integrated circuit element mounting pads 15 on the mounting surface side of the container body 10 on one main surface. Etc., and an oscillation circuit or the like that is connected to the crystal resonator element 20 and generates a predetermined oscillation output is provided on the circuit forming surface, and the oscillation output generated by this oscillation circuit is output to the outside For example, it is used as a reference signal such as a clock signal.

  Further, the integrated circuit element 50 is connected to the integrated circuit element mounting pad 15 via the conductive bonding material 60 so that the integrated circuit element 50 is attached to the container body 10. As a result, the electronic circuit in the integrated circuit element 50 is electrically connected to the crystal resonator element 20 and the terminal portion 41 to be the external connection electrode terminal 41a.

Next, a manufacturing method of the above-described piezoelectric oscillator will be described with reference to FIGS.
Here, FIGS. 6A to 6D are explanatory views shown in a sectional view of the piezoelectric oscillator for explaining the manufacturing method of the present invention, and FIG. 7 is a metal plate used in the manufacturing method of the present invention. It is the external appearance perspective view which showed the container body. FIG. 8 is a plan view of the form shown in FIG. 6C for explaining the manufacturing method of the present invention as seen from above the container body.
First, as shown in FIGS. 6A, 7, and 8, a terminal portion 41 having a rectangular parallelepiped shape having a side that is higher than the height of the integrated circuit element 50 and has a height h is provided as the terminal portion. A plurality of one surface 41 is connected in series in a form connected to the surrender portion 42, and a surface opposite to the surface connected to the surrogate portion 42 of the terminal portion 41 arranged in series is predetermined. A metal plate 43 having a configuration in which the accommodating portions 44 with a space of [5] are provided facing each other in a form provided therebetween is prepared.
In addition, the cross-sectional location of the cross-sectional view of the metal plate 43 shown in FIG. 6A is a cross-sectional view when cut along the virtual cutting line AA ′ shown in FIG.
Such a metal plate 43 is formed of a metal material such as copper or SUS, and is formed by processing a single plate made of this metal material into a predetermined pattern using a conventionally known photoetching process. . Further, the main surface connected to the terminal portion connecting electrode terminal 12 on the mounting surface side of the container body 10 of the terminal portion 41 and the main surface connected to the mother board are subjected to Ni plating and Au plating, thereby providing a conductive bonding material. The bondability of 60 can be improved.
The height dimension of the metal plate 43 is formed to be higher than the height dimension of the integrated circuit element 50. By doing so, the integrated circuit element 50 does not come into contact with the motherboard or the like.
Moreover, in this embodiment, the metal plate 43 will cut | disconnect the terminal part 41 and the surplus part 42 in the process mentioned later.

  Next, as shown in FIG. 6B, the piezoelectric vibration element 20 is airtightly sealed in the container body 10 in which the terminal portion connection electrode terminal 14 and the integrated circuit element mounting pad 15 are formed on one main surface. The integrated circuit element 50 is electrically and in a form in which the integrated circuit element mounting pad 15 of the piezoelectric vibrator portion mounted is opposed to the connection pad corresponding to the function determined for each integrated circuit element mounting pad 15. Connect mechanically.

  As the integrated circuit element 50, a rectangular flip-chip type integrated circuit element having a plurality of connection pads on the bonding surface is used. The integrated circuit element 50 is placed such that a plurality of connection pads provided on the bonding surface thereof are in contact with each integrated circuit element mounting pad 15 of the container body 10 via a conductive bonding material. Thereafter, the conductive bonding material is melted by application of heat and then solidified by cooling, and the integrated circuit element 50 is contained in the container by bonding the connection pad and the integrated circuit element mounting pad 15 via the conductive bonding material. It is mounted on the body 10.

  Next, as shown in FIG. 6C and FIG. 8, the container body 10 in which the crystal resonator element 20 and the integrated circuit element 50 constituting the piezoelectric vibrator portion are accommodated and mounted is mounted on the metal plate 43. The integrated circuit element 50 is inserted into the storage portion 44 of the piezoelectric vibration portion, and the terminal portion connection electrode terminal 12 of the piezoelectric vibration portion and the upper surface of the terminal portion 41 are collectively formed on the upper surface of each terminal portion 41 by printing means It is mounted on the terminal portion 41 of the metal plate 43 by bonding with a conductive bonding material 60 such as solder or conductive adhesive.

  Thereafter, as shown in FIG. 6D and FIG. 8, each terminal portion 41 is discarded by cutting the connecting portion (two-dot chain line portion) between the disposal portion 42 and the terminal portion 41 of each metal plate 43. Separated from the part 42, a plurality of piezoelectric oscillators are obtained simultaneously. The metal plate 43 is cut by dicing using a dicer or the like, and through such a cutting process, the terminal portion 41 has a plurality of piezoelectric elements having various functions of the external connection electrode terminal 41a and the data writing terminal 41b. An oscillator is obtained at the same time.

  Finally, when the piezoelectric oscillator has a temperature compensation function, temperature compensation data is input to the integrated circuit element 50 via the data write terminal 41b of the terminal part 41 cut and separated by the surrendering part 42, and the integrated circuit The temperature compensation data is stored in the memory in the element 50. In such temperature compensation data writing operation, the temperature compensation data created in accordance with the temperature characteristics of the crystal resonator element 20 is applied to the integrated circuit by applying the probe needle of the temperature compensation data writing device to the data write terminal 41b. This is performed by inputting to a memory provided in the temperature compensation circuit of the element 50 and storing it. Here, the temperature compensation data written in the integrated circuit element 50 is for correcting the temperature characteristic variation for each crystal oscillation element 20, and the temperature of the crystal oscillation element 20 used in the temperature compensation type crystal oscillator. It is obtained by measuring the characteristics in advance.

In addition, this invention is not limited to the above-mentioned embodiment, A various change, improvement, etc. are possible in the range which does not deviate from the summary of this invention.
FIG. 5 discloses a piezoelectric oscillator in which the periphery of the integrated circuit element 50 is covered with an insulating resin 80.
The insulating resin 80 is often made of epoxy, polyimide, or the like, and is made of a thermoplastic resin that has the property of flowing when softened or melted by heating.
As described above, since the periphery of the integrated circuit element 50 is covered and protected by the insulating resin 80, it is possible to prevent the frequency from fluctuating due to the influence of foreign matter or the like.
Further, since the periphery of the integrated circuit element 50 is covered with the insulating resin 80 when the terminal portion 41 is cut and separated from the disposal portion 42 of the metal plate 43, the insulating resin 80 is cut when the terminal portion 41 is cut. Therefore, it is possible to further reduce problems such as peeling between the terminal portion 41 and the terminal portion connecting electrode terminal 12 due to stress at the time of cutting.
In the above-described embodiment, the quartz resonator element using quartz as a piezoelectric material constituting the piezoelectric resonator element has been described. However, as other piezoelectric materials, lithium niobate, lithium tantalate, or piezoelectric ceramics is used as the piezoelectric material. The piezoelectric vibration element used as the above may be used.

FIG. 1 is an exploded perspective view showing an embodiment of a crystal oscillator which is an example of a piezoelectric oscillator formed by a method for manufacturing a piezoelectric oscillator according to the present invention. (Note that the integrated circuit element is already connected to the lower surface of the piezoelectric vibrator portion.) FIG. 2 is a schematic cross-sectional view showing the piezoelectric oscillator shown in FIG. 1 assembled and then cut at the position of the virtual cutting line AA ′ shown in FIG. FIG. 3A is a perspective view of a container body constituting a crystal oscillator, which is an example of a piezoelectric oscillator formed by the method for manufacturing a piezoelectric oscillator of the present invention, as viewed from the main surface on the mounting side, and FIG. It is the perspective view which looked at the crystal oscillator which is an example of the piezoelectric oscillator formed with the manufacturing method of the piezoelectric oscillator of invention from the mounting side main surface. FIG. 4 is a schematic cross-sectional view showing another embodiment of a crystal oscillator which is an example of a piezoelectric oscillator formed by the method for manufacturing a piezoelectric oscillator of the present invention. FIG. 5 is a schematic cross-sectional view showing another embodiment of a crystal oscillator which is an example of a piezoelectric oscillator formed by the method for manufacturing a piezoelectric oscillator of the present invention. FIG. 6 is a process explanatory view showing forms (a) to (d) of the method for manufacturing a piezoelectric oscillator according to the present invention using sectional views of the piezoelectric oscillator. FIG. 7 is an explanatory view showing a metal plate and a container used in the method for manufacturing a piezoelectric oscillator according to the present invention using a perspective view. FIG. 8 is a process explanatory view showing the method for manufacturing a piezoelectric oscillator according to the present invention, using a plan view of the form in FIG. 6C as viewed from above the container body. FIG. 9 is an exploded perspective view showing a crystal oscillator as an example of a conventional piezoelectric oscillator.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Container body 11 ... Conductive pattern for sealing 12 ... Electrode terminal for terminal part connection 13 ... Piezoelectric vibration element mounting pad 14 ... Recessed space 15 ... Integrated circuit element mounting pad 16 ... Electrode terminal for monitoring 20 ... Piezoelectric vibration element 21 ... Electrode for excitation 30 ... Lid 31 ... Sealing member 41 ... Terminal part 41a ... Electrode terminal for external connection 41b ... Data writing terminal 42 ... Disposal part 43 ... Metal plate 44 ... Accommodating part 50 ... Integrated circuit element 60 ... Conductive bonding material 70 ... Conductive adhesive 80 ... Insulating resin

Claims (4)

A rectangular parallelepiped terminal portion having sides with dimensions higher than the height dimension of the integrated circuit element is arranged in series in a form in which one surface of the terminal portion is connected to the surplus portion, and arranged in series. A metal plate having a configuration in which the terminal portion is disposed face-to-face in a form in which a receiving portion having a predetermined interval is provided between a surface opposite to the surface connected to the disposal portion of the terminal portion. A preparation process;
The integrated circuit element mounting pad of the piezoelectric vibrator portion in which the piezoelectric vibration element is hermetically mounted inside the container body of the terminal portion connection electrode terminal and the integrated circuit element mounting pad formed on one main surface. An integrated circuit element connection step for mounting the integrated circuit elements by electrically and mechanically connecting the connection pads corresponding to the functions determined for each integrated circuit element mounting pad in a face-to-face configuration;
A terminal part joining step for joining the terminal part connection electrode terminal of the piezoelectric vibration part and the upper surface of the terminal part with a conductive joining material so as to insert the integrated circuit element into the housing part of the metal plate. When,
A cutting and separating step of cutting each of the terminal portions from the metal plate by simultaneously cutting a connecting portion between the discarded portion and the terminal portion of the metal plate, and simultaneously obtaining a plurality of piezoelectric oscillators;
A method for manufacturing a piezoelectric oscillator, comprising:   A part of the terminal portion of the metal plate is used as a data write terminal, temperature compensation data is input to the integrated circuit element via the data write terminal, and the temperature compensation data is stored in a memory in the integrated circuit element. The method for manufacturing a piezoelectric oscillator according to claim 1, further comprising a step of storing the step after the cutting and separating step.   2. The method of manufacturing a piezoelectric oscillator according to claim 1, further comprising a step of covering the periphery of the integrated circuit element with an insulating resin after the terminal portion bonding step.   The height of the terminal portion used as the data write terminal is lower than the height of the other terminal portions when a part of the terminal portion of the metal plate is used as a data write terminal. A method for manufacturing a piezoelectric oscillator.

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