JP2008150491A - Room temperature-curable polyorganosiloxane composition - Google Patents
Room temperature-curable polyorganosiloxane composition Download PDFInfo
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- JP2008150491A JP2008150491A JP2006339694A JP2006339694A JP2008150491A JP 2008150491 A JP2008150491 A JP 2008150491A JP 2006339694 A JP2006339694 A JP 2006339694A JP 2006339694 A JP2006339694 A JP 2006339694A JP 2008150491 A JP2008150491 A JP 2008150491A
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- 239000000203 mixture Substances 0.000 title claims abstract description 121
- 125000003545 alkoxy group Chemical group 0.000 claims abstract description 21
- 239000000945 filler Substances 0.000 claims abstract description 15
- 238000002156 mixing Methods 0.000 claims abstract description 13
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 12
- 239000003054 catalyst Substances 0.000 claims abstract description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 7
- 150000003961 organosilicon compounds Chemical class 0.000 claims abstract description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 47
- 239000000377 silicon dioxide Substances 0.000 claims description 18
- 230000007062 hydrolysis Effects 0.000 claims description 3
- 238000006460 hydrolysis reaction Methods 0.000 claims description 3
- 238000001179 sorption measurement Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 abstract description 6
- -1 2-phenylpropyl groups Chemical group 0.000 description 24
- 239000004205 dimethyl polysiloxane Substances 0.000 description 10
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 10
- 239000000758 substrate Substances 0.000 description 7
- 229910002014 Aerosil® 130 Inorganic materials 0.000 description 6
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 5
- 125000000962 organic group Chemical group 0.000 description 5
- 239000003566 sealing material Substances 0.000 description 5
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 4
- 239000007983 Tris buffer Substances 0.000 description 4
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 238000004132 cross linking Methods 0.000 description 4
- 239000012975 dibutyltin dilaurate Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 4
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 4
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 4
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 229920005601 base polymer Polymers 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 238000006482 condensation reaction Methods 0.000 description 3
- 239000003431 cross linking reagent Substances 0.000 description 3
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 125000003342 alkenyl group Chemical group 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 2
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 2
- 125000001183 hydrocarbyl group Chemical group 0.000 description 2
- 125000003253 isopropoxy group Chemical group [H]C([H])([H])C([H])(O*)C([H])([H])[H] 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 description 2
- 229920006380 polyphenylene oxide Polymers 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 238000003786 synthesis reaction Methods 0.000 description 2
- YOBOXHGSEJBUPB-MTOQALJVSA-N (z)-4-hydroxypent-3-en-2-one;zirconium Chemical compound [Zr].C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O YOBOXHGSEJBUPB-MTOQALJVSA-N 0.000 description 1
- POILWHVDKZOXJZ-ARJAWSKDSA-M (z)-4-oxopent-2-en-2-olate Chemical compound C\C([O-])=C\C(C)=O POILWHVDKZOXJZ-ARJAWSKDSA-M 0.000 description 1
- QMTFKWDCWOTPGJ-KVVVOXFISA-N (z)-octadec-9-enoic acid;tin Chemical compound [Sn].CCCCCCCC\C=C/CCCCCCCC(O)=O QMTFKWDCWOTPGJ-KVVVOXFISA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- 125000000094 2-phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229910002012 Aerosil® Inorganic materials 0.000 description 1
- RBLNICCKPGGVJW-UHFFFAOYSA-N C(C)O[Si](O[Sn])(OCC)OCC Chemical compound C(C)O[Si](O[Sn])(OCC)OCC RBLNICCKPGGVJW-UHFFFAOYSA-N 0.000 description 1
- KFDGIFZCOIOUIL-UHFFFAOYSA-N CCCCO[Zr](OCCCC)OCCCC Chemical compound CCCCO[Zr](OCCCC)OCCCC KFDGIFZCOIOUIL-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000005909 Kieselgur Substances 0.000 description 1
- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical group O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- ISKQADXMHQSTHK-UHFFFAOYSA-N [4-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=C(CN)C=C1 ISKQADXMHQSTHK-UHFFFAOYSA-N 0.000 description 1
- VXPYSZQGFPMWQU-UHFFFAOYSA-L [acetyloxy(diphenyl)stannyl] acetate Chemical compound CC([O-])=O.CC([O-])=O.C=1C=CC=CC=1[Sn+2]C1=CC=CC=C1 VXPYSZQGFPMWQU-UHFFFAOYSA-L 0.000 description 1
- NBJODVYWAQLZOC-UHFFFAOYSA-L [dibutyl(octanoyloxy)stannyl] octanoate Chemical compound CCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCC NBJODVYWAQLZOC-UHFFFAOYSA-L 0.000 description 1
- AWFFJJAOMMAGFE-BGSQTJHASA-L [dibutyl-[(z)-octadec-9-enoyl]oxystannyl] (z)-octadec-9-enoate Chemical compound CCCC[Sn+2]CCCC.CCCCCCCC\C=C/CCCCCCCC([O-])=O.CCCCCCCC\C=C/CCCCCCCC([O-])=O AWFFJJAOMMAGFE-BGSQTJHASA-L 0.000 description 1
- XQBCVRSTVUHIGH-UHFFFAOYSA-L [dodecanoyloxy(dioctyl)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCCCCCC)(CCCCCCCC)OC(=O)CCCCCCCCCCC XQBCVRSTVUHIGH-UHFFFAOYSA-L 0.000 description 1
- 125000005083 alkoxyalkoxy group Chemical group 0.000 description 1
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical class [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910000323 aluminium silicate Inorganic materials 0.000 description 1
- JPUHCPXFQIXLMW-UHFFFAOYSA-N aluminium triethoxide Chemical compound CCO[Al](OCC)OCC JPUHCPXFQIXLMW-UHFFFAOYSA-N 0.000 description 1
- IKHOZNOYZQPPCK-UHFFFAOYSA-K aluminum;4,4-diethyl-3-oxohexanoate Chemical compound [Al+3].CCC(CC)(CC)C(=O)CC([O-])=O.CCC(CC)(CC)C(=O)CC([O-])=O.CCC(CC)(CC)C(=O)CC([O-])=O IKHOZNOYZQPPCK-UHFFFAOYSA-K 0.000 description 1
- 125000003710 aryl alkyl group Chemical group 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- FPCJKVGGYOAWIZ-UHFFFAOYSA-N butan-1-ol;titanium Chemical compound [Ti].CCCCO.CCCCO.CCCCO.CCCCO FPCJKVGGYOAWIZ-UHFFFAOYSA-N 0.000 description 1
- HIPFLUHRNLYKES-UHFFFAOYSA-M butan-1-olate octadecanoate zirconium(4+) Chemical compound CCCCO[Zr+](OCCCC)OCCCC.CCCCCCCCCCCCCCCCCC([O-])=O HIPFLUHRNLYKES-UHFFFAOYSA-M 0.000 description 1
- BSDOQSMQCZQLDV-UHFFFAOYSA-N butan-1-olate;zirconium(4+) Chemical compound [Zr+4].CCCC[O-].CCCC[O-].CCCC[O-].CCCC[O-] BSDOQSMQCZQLDV-UHFFFAOYSA-N 0.000 description 1
- 125000004106 butoxy group Chemical group [*]OC([H])([H])C([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 125000004218 chloromethyl group Chemical group [H]C([H])(Cl)* 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 229910002026 crystalline silica Inorganic materials 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- JGFBRKRYDCGYKD-UHFFFAOYSA-N dibutyl(oxo)tin Chemical compound CCCC[Sn](=O)CCCC JGFBRKRYDCGYKD-UHFFFAOYSA-N 0.000 description 1
- AYOHIQLKSOJJQH-UHFFFAOYSA-N dibutyltin Chemical compound CCCC[Sn]CCCC AYOHIQLKSOJJQH-UHFFFAOYSA-N 0.000 description 1
- ZXDVQYBUEVYUCG-UHFFFAOYSA-N dibutyltin(2+);methanolate Chemical compound CCCC[Sn](OC)(OC)CCCC ZXDVQYBUEVYUCG-UHFFFAOYSA-N 0.000 description 1
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- XGZNHFPFJRZBBT-UHFFFAOYSA-N ethanol;titanium Chemical compound [Ti].CCO.CCO.CCO.CCO XGZNHFPFJRZBBT-UHFFFAOYSA-N 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- UKRVECBFDMVBPU-UHFFFAOYSA-N ethyl 3-oxoheptanoate Chemical compound CCCCC(=O)CC(=O)OCC UKRVECBFDMVBPU-UHFFFAOYSA-N 0.000 description 1
- XYIBRDXRRQCHLP-UHFFFAOYSA-N ethyl acetoacetate Chemical compound CCOC(=O)CC(C)=O XYIBRDXRRQCHLP-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 229910021485 fumed silica Inorganic materials 0.000 description 1
- 230000000855 fungicidal effect Effects 0.000 description 1
- 239000000417 fungicide Substances 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- 239000002075 main ingredient Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- XTTBHNHORSDPPN-UHFFFAOYSA-J naphthalene-1-carboxylate;tin(4+) Chemical compound [Sn+4].C1=CC=C2C(C(=O)[O-])=CC=CC2=C1.C1=CC=C2C(C(=O)[O-])=CC=CC2=C1.C1=CC=C2C(C(=O)[O-])=CC=CC2=C1.C1=CC=C2C(C(=O)[O-])=CC=CC2=C1 XTTBHNHORSDPPN-UHFFFAOYSA-J 0.000 description 1
- XZZXKVYTWCYOQX-UHFFFAOYSA-J octanoate;tin(4+) Chemical compound [Sn+4].CCCCCCCC([O-])=O.CCCCCCCC([O-])=O.CCCCCCCC([O-])=O.CCCCCCCC([O-])=O XZZXKVYTWCYOQX-UHFFFAOYSA-J 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 150000001367 organochlorosilanes Chemical class 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- HKJYVRJHDIPMQB-UHFFFAOYSA-N propan-1-olate;titanium(4+) Chemical compound CCCO[Ti](OCCC)(OCCC)OCCC HKJYVRJHDIPMQB-UHFFFAOYSA-N 0.000 description 1
- BCWYYHBWCZYDNB-UHFFFAOYSA-N propan-2-ol;zirconium Chemical compound [Zr].CC(C)O.CC(C)O.CC(C)O.CC(C)O BCWYYHBWCZYDNB-UHFFFAOYSA-N 0.000 description 1
- 125000002572 propoxy group Chemical group [*]OC([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 125000005372 silanol group Chemical group 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- ZQZCOBSUOFHDEE-UHFFFAOYSA-N tetrapropyl silicate Chemical compound CCCO[Si](OCCC)(OCCC)OCCC ZQZCOBSUOFHDEE-UHFFFAOYSA-N 0.000 description 1
- 150000003606 tin compounds Chemical class 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 1
- 125000000026 trimethylsilyl group Chemical group [H]C([H])([H])[Si]([*])(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 239000004034 viscosity adjusting agent Substances 0.000 description 1
- CHJMFFKHPHCQIJ-UHFFFAOYSA-L zinc;octanoate Chemical compound [Zn+2].CCCCCCCC([O-])=O.CCCCCCCC([O-])=O CHJMFFKHPHCQIJ-UHFFFAOYSA-L 0.000 description 1
- 150000003755 zirconium compounds Chemical class 0.000 description 1
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- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
本発明は、室温で硬化してゴム状弾性体を生じる室温硬化性ポリオルガノシロキサン組成物に係り、特に、2成分型の室温硬化性ポリオルガノシロキサン組成物に関する。 The present invention relates to a room temperature curable polyorganosiloxane composition that cures at room temperature to produce a rubbery elastic body, and more particularly to a two-component room temperature curable polyorganosiloxane composition.
室温で硬化してゴム状弾性体を生じる縮合反応型のポリオルガノシロキサン組成物は、電気・電子工業等における弾性接着剤、コーティング材、電気絶縁シール材等として、また、建築用シーリング材等として広く用いられている。 Condensation-type polyorganosiloxane compositions that cure at room temperature to produce rubbery elastic bodies are used as elastic adhesives, coating materials, electrical insulating sealing materials, etc. in the electrical and electronic industries, and as building sealing materials, etc. Widely used.
このような縮合反応型の室温硬化性ポリオルガノシロキサン組成物の中で、空気中の水分と接触することにより硬化反応が生起する1成分型(1包装型)のものは、使用直前にベースポリマーと架橋剤や触媒等とを秤量したり混合したりする煩雑さがなく、取り扱いが簡単である。しかしながら、硬化が表面から徐々に内部へと進行するものであるため、硬化速度が遅く、また深部硬化性も悪いという難点があった。 Among these condensation reaction type room temperature curable polyorganosiloxane compositions, a one-component type (one packaging type) in which a curing reaction occurs by contact with moisture in the air is a base polymer immediately before use. There is no need to weigh and mix the cross-linking agent and catalyst, and the handling is easy. However, since the curing proceeds gradually from the surface to the inside, there are the disadvantages that the curing rate is slow and the deep part curability is poor.
これに対して、2成分型の室温硬化性ポリオルガノシロキサン組成物は、硬化速度が速く、深部硬化性も1成分型に比べて良好である。この組成物は、一般に、主剤成分と架橋成分に分けて調製され、それぞれ別々の容器に保存され使用時に混合される、いわゆる多包装型室温硬化性組成物として使用される。主剤成分には、ベースポリマーの分子末端が水酸基および/またはアルコキシ基で閉塞されたポリジオルガノシロキサンとともに無機充填剤が配合され、架橋成分には、架橋剤および硬化触媒が配合される(例えば、特許文献1参照)。 On the other hand, the two-component room temperature curable polyorganosiloxane composition has a high curing rate and better deep part curability than the one-component type. This composition is generally used as a so-called multi-packaging room temperature curable composition which is prepared by dividing into a main ingredient component and a crosslinking component, and is stored in separate containers and mixed at the time of use. The base component is blended with an inorganic filler together with a polydiorganosiloxane whose molecular terminal of the base polymer is blocked with a hydroxyl group and / or an alkoxy group, and the crosslinking component is blended with a crosslinking agent and a curing catalyst (for example, patents). Reference 1).
しかしながら、従来の2成分型の室温硬化性ポリオルガノシロキサン組成物は、各種基材に対する接着性および表面硬化性が十分ではなく、また、深部硬化性についても、1成分型組成物に比べて優れているものの、満足できるレベルのものではなかった。
上述したように、従来の1成分型室温硬化性ポリオルガノシロキサン組成物は、硬化速度が遅く、かつ、深部硬化性が不良であり、また、2成分型室温硬化性ポリオルガノシロキサン組成物は、硬化速度は速いものの、各種基材に対する接着性、表面硬化性および深部硬化性が不十分であった。 As described above, the conventional one-component room-temperature curable polyorganosiloxane composition has a slow curing rate and poor deep-curability, and the two-component room-temperature curable polyorganosiloxane composition is Although the curing rate was fast, the adhesion to various substrates, surface curability and deep part curability were insufficient.
本発明はこのような従来技術の課題に対処してなされたもので、硬化速度が速く、かつ、各種基材に対する接着性、表面硬化性および深部硬化性が良好な室温硬化性ポリオルガノシロキサン組成物を提供することを目的とする。 The present invention has been made in response to such problems of the prior art, and is a room temperature curable polyorganosiloxane composition having a high curing rate and good adhesion to various substrates, surface curing properties and deep curing properties. The purpose is to provide goods.
本発明者は、前記した従来技術の課題を解決すべく鋭意研究を重ねた結果、分子末端に2個以上のアルコキシ基を有するポリオルガノシロキサンと、1分子中に2個以上のアルコキシ基を有する有機ケイ素化合物またはその部分加水分解縮合物と、硬化触媒とを含む組成物と、分子末端に水酸基を有するポリオルガノシロキサンと、吸着水を有する充填剤とを含む組成物とをそれぞれ調製しておき、これらを混合することにより、硬化速度が速く、かつ、各種基材に対する接着性、表面硬化性および深部硬化性が良好な室温硬化性ポリオルガノシロキサン組成物が得られることを見出し、本発明を完成するに至った。 As a result of intensive studies to solve the problems of the prior art described above, the present inventor has a polyorganosiloxane having two or more alkoxy groups at the molecular end and two or more alkoxy groups in one molecule. A composition containing an organosilicon compound or a partially hydrolyzed condensate thereof, a curing catalyst, a polyorganosiloxane having a hydroxyl group at the molecular end, and a filler having adsorbed water are prepared. , By mixing them, it was found that a room temperature curable polyorganosiloxane composition having a high curing rate and good adhesion to various substrates, surface curability and deep curability can be obtained. It came to be completed.
すなわち、本発明の室温硬化性ポリオルガノシロキサン組成物は、(a1)分子末端に2個以上のアルコキシ基を有するポリオルガノシロキサン、(a2)1分子中に2個以上のアルコキシ基を有する有機ケイ素化合物またはその部分加水分解縮合物、(a3)硬化触媒、(b1)分子末端に水酸基を有するポリオルガノシロキサン、および、(b2)吸着水を有する充填剤、を含む室温硬化性ポリオルガノシロキサン組成物であって、前記(a1)、(a2)および(a3)成分を含む組成物(A)と、前記(b1)および(b2)成分を含む組成物(B)とを混合してなることを特徴とする。 That is, the room temperature curable polyorganosiloxane composition of the present invention comprises (a1) a polyorganosiloxane having two or more alkoxy groups at the molecular ends, and (a2) an organosilicon having two or more alkoxy groups in one molecule. A room temperature-curable polyorganosiloxane composition comprising: a compound or a partially hydrolyzed condensate thereof; (a3) a curing catalyst; (b1) a polyorganosiloxane having a hydroxyl group at a molecular end; and (b2) a filler having adsorbed water. The composition (A) containing the components (a1), (a2) and (a3) and the composition (B) containing the components (b1) and (b2) are mixed. Features.
本発明の室温硬化性ポリオルガノシロキサン組成物は、硬化速度が速く、かつ、各種基材に対する接着性、表面硬化性および深部硬化性が良好であり、電気・電子工業等における弾性接着剤、コーティング材、電気絶縁シール材等の用途に、また、建築用シーリング材等の用途に有用である。 The room temperature curable polyorganosiloxane composition of the present invention has a fast curing rate and good adhesion to various substrates, surface curing properties and deep curing properties, and is an elastic adhesive and coating in the electrical and electronic industries. It is useful for applications such as materials and electrical insulation sealing materials, and for applications such as architectural sealing materials.
以下、本発明の実施形態について説明する。 Hereinafter, embodiments of the present invention will be described.
本発明の室温硬化性ポリオルガノシロキサン組成物は、組成物(A)と組成物(B)とを混合してなる2成分型の室温硬化性ポリオルガノシロキサン組成物である。組成物(A)は、(a1)分子末端に2個以上のアルコキシ基を有するポリオルガノシロキサンと、(a2)1分子中に2個以上のアルコキシ基を有する有機ケイ素化合物またはその部分加水分解縮合物と、(a3)硬化触媒とを、必須成分として含有している。また、組成物(B)は、(b1)分子末端に水酸基を有するポリオルガノシロキサンと、(b2)吸着水を有する充填剤とを、必須成分として含有している。 The room temperature curable polyorganosiloxane composition of the present invention is a two-component room temperature curable polyorganosiloxane composition obtained by mixing the composition (A) and the composition (B). The composition (A) comprises (a1) a polyorganosiloxane having two or more alkoxy groups at the molecular terminals, and (a2) an organosilicon compound having two or more alkoxy groups in one molecule or a partial hydrolysis condensation thereof. And (a3) a curing catalyst are contained as essential components. The composition (B) contains (b1) a polyorganosiloxane having a hydroxyl group at the molecular end and (b2) a filler having adsorbed water as essential components.
組成物(A)の組成成分である(a1)分子末端に2個以上のアルコキシ基を有するポリオルガノシロキサン、および、組成物(B)の組成成分である(b1)分子末端に水酸機を有するポリオルガノシロキサンは、いずれも、通常室温で硬化し得る縮合型シリコーンゴムのベースポリマーとして用いられるものである。 (A1) a polyorganosiloxane having two or more alkoxy groups at the molecular ends, which is a composition component of the composition (A), and (b1) a hydroxyl machine at the molecular ends, which is a composition component of the composition (B). Any of the polyorganosiloxanes used is usually used as a base polymer of a condensation type silicone rubber that can be cured at room temperature.
(a1)および(b1)の各成分のケイ素原子に直接結合する有機基としては、メチル基、エチル基、プロピル基、ブチル基、ヘキシル基のようなアルキル基;ビニル基、アリル基のようなアルケニル基;フェニル基のようなアリール基、2−フェニルエチル基、2−フェニルプロピル基のようなアラルキル基;およびクロロメチル基、β−シアノエチル基、3,3,3−トリフルオロプロピル基のような一価の置換炭化水素基などが例示される。なかでも、合成が容易なことから、メチル基、ビニル基またはフェニル基が好ましい。 Examples of the organic group directly bonded to the silicon atom of each component of (a1) and (b1) include an alkyl group such as a methyl group, an ethyl group, a propyl group, a butyl group, and a hexyl group; Alkenyl groups; aryl groups such as phenyl groups; aralkyl groups such as 2-phenylethyl groups and 2-phenylpropyl groups; and chloromethyl groups, β-cyanoethyl groups, and 3,3,3-trifluoropropyl groups And a monovalent substituted hydrocarbon group. Among these, a methyl group, a vinyl group, or a phenyl group is preferable because synthesis is easy.
これらの有機基の中でもメチル基は、原料中間体が最も容易に得られるうえに、シロキサンの重合度の割に最も低い粘度を与え、かつ、硬化前の組成物の押出作業性と硬化後のゴム状弾性体の物性のバランスを有利にする。したがって、全有機基の85%以上がメチル基であることが好ましく、実質的にすべての有機基がメチル基であることがさらに好ましい。 Among these organic groups, the methyl group is the easiest to obtain a raw material intermediate, gives the lowest viscosity for the degree of polymerization of the siloxane, and extrudes the composition before curing and after curing. The balance of physical properties of the rubber-like elastic body is advantageous. Therefore, it is preferable that 85% or more of all organic groups are methyl groups, and it is more preferable that substantially all organic groups are methyl groups.
ただし、硬化後のゴム状弾性体が耐寒性や耐熱性を必要とするときはフェニル基を、耐油性を特に必要とするときは3,3,3−トリフルオロプロピル基を、それぞれ有機基の一部として有することが望ましい。 However, when the cured rubber-like elastic body requires cold resistance or heat resistance, a phenyl group is used, and when oil resistance is particularly required, a 3,3,3-trifluoropropyl group is used. It is desirable to have it as a part.
(a1)成分における分子末端のアルコキシ基、および、(b1)成分における分子末端の水酸基は、次述する(a2)成分との反応により硬化に寄与するものである。(a1)成分のアルコキシ基としては、メトキシ基、エトキシ基、イソプロポキシ基などが例示されるが、反応性の点から、なかでもメトキシ基が好ましい。 The alkoxy group at the molecular terminal in the component (a1) and the hydroxyl group at the molecular terminal in the component (b1) contribute to curing by reaction with the component (a2) described below. Examples of the alkoxy group of the component (a1) include a methoxy group, an ethoxy group, and an isopropoxy group, and a methoxy group is particularly preferable from the viewpoint of reactivity.
(a1)および(b1)の各成分の23℃における粘度は、0.1〜1000Pa・sの範囲であることが好ましい。粘度が0.1Pa・s未満では硬化後のゴム状弾性体の機械的特性が十分でなく、1000Pa・sを超えると、後述する充填剤などを配合したときに均一な組成物が得にくく、成形性も不良となる。特に好ましい範囲は0.3〜100Pa・sである。 The viscosity of each component (a1) and (b1) at 23 ° C. is preferably in the range of 0.1 to 1000 Pa · s. When the viscosity is less than 0.1 Pa · s, the mechanical properties of the rubber-like elastic body after curing are not sufficient, and when it exceeds 1000 Pa · s, it is difficult to obtain a uniform composition when a filler or the like described later is blended, Formability is also poor. A particularly preferable range is 0.3 to 100 Pa · s.
(b1)成分は、(a1)成分100重量部に対して、5〜200重量部配合することが好ましい。(b1)成分の配合量が、5重量部未満または200重量部を超えると、十分な硬化速度が得られない。より好ましい範囲は10〜100重量部である。 Component (b1) is preferably blended in an amount of 5 to 200 parts by weight per 100 parts by weight of component (a1). When the amount of component (b1) is less than 5 parts by weight or more than 200 parts by weight, a sufficient curing rate cannot be obtained. A more preferred range is 10 to 100 parts by weight.
組成物(A)の組成成分である(a2)1分子中に2個以上のアルコキシ基を有する有機ケイ素化合物またはその部分加水分解縮合物は、前記した(a1)および(b1)成分の架橋剤として作用するものであり、空気中や後述する(b2)成分に含まれる水分によって加水分解し、(a1)成分のアルコキシ基および(b1)成分の水酸基(シラノール基)とそれぞれ容易に縮合反応して硬化物を生成する。 (A2) The organosilicon compound having two or more alkoxy groups in one molecule or the partial hydrolysis condensate thereof, which is a composition component of the composition (A), is a cross-linking agent of the components (a1) and (b1) described above. It hydrolyzes in the air or with water contained in the component (b2) described later, and easily undergoes a condensation reaction with the alkoxy group of the component (a1) and the hydroxyl group (silanol group) of the component (b1). To produce a cured product.
(a2)成分の有するアルコキシ基としては、メトキシ基、エトキシ基、プロポキシ基、イソプロポキシ基、ブトキシ基などのアルコキシ基;メトキシエトキシ基などのアルコキシアルコキシ基などが例示される。アルコキシ基以外のケイ素原子に結合する基としては、(a1)および(b1)の各成分におけるケイ素原子に直接結合する有機基と同様の、置換または非置換の一価の炭化水素基が挙げられるが、合成の容易さと架橋速度の点から、炭素数1〜8のアルキル基、炭素数2〜5のアルケニル基およびフェニル基が好ましい。 Examples of the alkoxy group possessed by the component (a2) include alkoxy groups such as a methoxy group, an ethoxy group, a propoxy group, an isopropoxy group, and a butoxy group; an alkoxyalkoxy group such as a methoxyethoxy group. Examples of the group bonded to the silicon atom other than the alkoxy group include a substituted or unsubstituted monovalent hydrocarbon group similar to the organic group directly bonded to the silicon atom in each component of (a1) and (b1). However, an alkyl group having 1 to 8 carbon atoms, an alkenyl group having 2 to 5 carbon atoms and a phenyl group are preferable from the viewpoint of ease of synthesis and crosslinking rate.
(a2)成分の具体例としては、テトラエトキシラン、メチルトリメトキシシラン、ビニルトリメトキシシラン、メチルトリエトキシシラン、ビニルトリエトキシシラン、エチルオルソシリケート、プロピルオルソシリケート、アミノプロピルトリエトキシシランなどのアルコキシシランおよびその部分加水分解縮合物などが挙げられる。 Specific examples of the component (a2) include alkoxy such as tetraethoxylane, methyltrimethoxysilane, vinyltrimethoxysilane, methyltriethoxysilane, vinyltriethoxysilane, ethylorthosilicate, propylorthosilicate, and aminopropyltriethoxysilane. Silane and its partially hydrolyzed condensate are mentioned.
(a2)成分の配合量は、(a1)成分100重量部に対して、好ましくは0.5〜15重量部であり、より好ましくは0.5〜10重量部である。(a2)成分の配合量が、0.5重量部未満では、架橋が十分に行われず、硬度の低い硬化物しか得られないおそれがあるうえ、組成物の保存安定性が低下する。逆に、15重量部を超えると、組成物の硬化性および硬化後の機械的特性のバランスが著しく低下するおそれがある。 The amount of component (a2) is preferably 0.5 to 15 parts by weight, more preferably 0.5 to 10 parts by weight, based on 100 parts by weight of component (a1). When the blending amount of the component (a2) is less than 0.5 parts by weight, crosslinking is not sufficiently performed, and only a cured product having low hardness may be obtained, and the storage stability of the composition is lowered. On the other hand, if it exceeds 15 parts by weight, the balance between the curability of the composition and the mechanical properties after curing may be significantly reduced.
組成物(A)の組成成分である(a3)硬化触媒は、(a1)成分のアルコキシ基と(a2)成分の加水分解性基、(b1)成分の水酸基と(a2)成分の加水分解性基とが、水分の存在下で反応し架橋構造を形成するための触媒成分である。 The (a3) curing catalyst which is a composition component of the composition (A) is composed of the alkoxy group of the component (a1) and the hydrolyzable group of the component (a2), the hydroxyl group of the component (b1) and the hydrolyzability of the component (a2). The group is a catalyst component for reacting in the presence of moisture to form a crosslinked structure.
(a3)成分の具体例としては、鉄オクトエート、マンガンオクトエート、亜鉛オクトエート、スズナフテート、スズカプリレート、スズオレートのようなカルボン酸金属塩;ジブチルスズジアセテート、ジブチルスズジオクトエート、ジブチルスズジラウレート、ジブチルスズジオレート、ジフェニルスズジアセテート、酸化ジブチルスズ、ジブチルスズジメトキサイド、ジブチルビス(トリエトキシシロキシ)スズ、ジオクチルスズジラウレートのような有機スズ化合物;テトラエトキシチタン、テトラプロポキシチタン、テトラブトキシチタン、1、3−プロポキシチタンビス(エチルアセチルアセテート)のようなアルコキシチタン類;アルミニウムトリスアセチルアセトナート、アルミニウムトリスエチルアセトアセテート、ジイソプロポキシアルミニウムエチルアセトアセテート、トリエトキシアルミニウムのような有機アルミニウム;ジルコニウムテトラアセチルアセトナート、テトライソプロポキシジルコニウムテトラブトキシジルコニウム、トリブトキシジルコニウムアセチルアセトネート、トリブトキシジルコニウムステアレートのような有機ジルコニウム化合物等が例示される。これらは1種を単独で使用してもよく、2種以上を混合して使用してもよい。微量の存在で大きな触媒能を持つだけでなく、不純物の少ない組成物が得られることから、なかでも、有機スズ化合物およびアルコキシチタン類が好ましい。 Specific examples of the component (a3) include carboxylic acid metal salts such as iron octoate, manganese octoate, zinc octoate, tin naphthate, tin caprylate, and tin oleate; dibutyltin diacetate, dibutyltin dioctoate, dibutyltin dilaurate, dibutyltin dioleate Organic tin compounds such as diphenyltin diacetate, dibutyltin oxide, dibutyltin dimethoxide, dibutylbis (triethoxysiloxy) tin, dioctyltin dilaurate; tetraethoxytitanium, tetrapropoxytitanium, tetrabutoxytitanium, 1,3-propoxytitaniumbis ( Alkoxytitanium such as ethyl acetylacetate; aluminum trisacetylacetonate, aluminum trisethylacetoacetate, dii Organic aluminum compounds such as propoxy aluminum ethyl acetoacetate and triethoxy aluminum; organic zirconium compounds such as zirconium tetraacetylacetonate, tetraisopropoxyzirconium tetrabutoxyzirconium, tributoxyzirconium acetylacetonate, tributoxyzirconium stearate, etc. Is done. These may be used individually by 1 type, and may mix and use 2 or more types. Of these, organotin compounds and alkoxytitanium compounds are preferred because a composition having a small amount of impurities is obtained in addition to having a large catalytic ability in the presence of a small amount.
(a3)成分の配合量は、(a1)成分100重量部に対して、好ましくは0.01〜10重量部であり、より好ましくは0.1〜5重量部である。(a3)成分の配合量が、0.01重量部未満では、硬化触媒として十分に作用せず、硬化に長い時間がかかるばかりでなく、接着性も低下する。 逆に、10重量部を超えると、その配合量に見合う効果がなく無意味であるばかりか非経済的である。また、保存安定性も低下する。 The amount of component (a3) is preferably 0.01 to 10 parts by weight and more preferably 0.1 to 5 parts by weight with respect to 100 parts by weight of component (a1). When the blending amount of the component (a3) is less than 0.01 parts by weight, it does not sufficiently act as a curing catalyst, not only takes a long time for curing, but also decreases the adhesiveness. On the other hand, if it exceeds 10 parts by weight, it is not meaningless as it has no effect commensurate with the blending amount, and is uneconomical. In addition, the storage stability is lowered.
本発明において、前記(b1)成分とともに組成物(B)に配合される(b2)吸着水を有する充填剤は、主として、本発明の室温硬化性ポリオルガノシロキサン組成物に優れた深部硬化性を付与するために配合される成分である。 In the present invention, the filler having adsorbed water (b2) blended in the composition (B) together with the component (b1) mainly has excellent deep curability to the room temperature curable polyorganosiloxane composition of the present invention. It is a component blended for imparting.
(b2)成分としては、湿式シリカ、炭酸カルシウム、珪藻土、水酸化アルミニウム等が例示される。これらは1種を単独で使用してもよく、2種以上を混合して使用してもよい。特に、湿式シリカの使用が好ましい。 Examples of the component (b2) include wet silica, calcium carbonate, diatomaceous earth, and aluminum hydroxide. These may be used individually by 1 type, and may mix and use 2 or more types. In particular, the use of wet silica is preferred.
この(b2)成分の水分吸着量は、0.5重量%以上であることが好ましく、1.0重量%以上であることがより好ましい。特に好ましくは2.0重量%以上である。水分吸着量が0.5重量%未満では、深部硬化性が十分に改善されないおそれがある。 The moisture adsorption amount of the component (b2) is preferably 0.5% by weight or more, and more preferably 1.0% by weight or more. Particularly preferred is 2.0% by weight or more. If the moisture adsorption amount is less than 0.5% by weight, the deep-part curability may not be sufficiently improved.
また、(b2)成分の配合量は、(a1)成分100重量部に対して、好ましくは0.01〜100重量部であり、より好ましくは0.1〜10重量部である。(b2)成分の配合量が、0.01重量部未満では、添加による効果が十分に得られず、逆に、100重量部を超えると、作業性の低下や硬化後の機械特性が低下する。 Moreover, the compounding quantity of (b2) component becomes like this. Preferably it is 0.01-100 weight part with respect to 100 weight part of (a1) component, More preferably, it is 0.1-10 weight part. If the blending amount of component (b2) is less than 0.01 parts by weight, the effect due to addition cannot be sufficiently obtained. Conversely, if it exceeds 100 parts by weight, workability and mechanical properties after curing are lowered. .
本発明の室温硬化性ポリオルガノシロキサン組成物には、硬化後のゴム状弾性体に機械的強度や硬さを付与する目的で、上記の(b2)成分以外の充填剤を配合することができる。このような充填剤としては、乾式シリカ、焼成シリカ、煙霧質シリカ、溶融シリカ、結晶シリカなどの、湿式シリカ以外のシリカ粉末、酸化チタン、カーボンブラック、アルミノケイ酸、マグネシア、アルミナなどが挙げられる。また、(b2)成分として例示した湿式シリカや炭酸カルシウム等であっても、表面をオルガノクロロシラン類、ポリオルガノシロキサン類、ヘキサメチルジシラザン等で疎水化したものであれば使用可能である。これらは1種を単独で使用してもよく、2種以上を混合して使用してもよい。 In the room temperature curable polyorganosiloxane composition of the present invention, a filler other than the component (b2) can be blended for the purpose of imparting mechanical strength and hardness to the rubber-like elastic body after curing. . Examples of such fillers include silica powders other than wet silica, such as dry silica, calcined silica, fumed silica, fused silica, and crystalline silica, titanium oxide, carbon black, aluminosilicate, magnesia, and alumina. Moreover, even if it is the wet silica, calcium carbonate, etc. which were illustrated as (b2) component, if the surface was hydrophobized with organochlorosilanes, polyorganosiloxanes, hexamethyldisilazane, etc., it can be used. These may be used individually by 1 type, and may mix and use 2 or more types.
この(b2)成分以外の充填剤の配合量は、(a1)成分100重量部に対して、1〜500重量部の範囲が好ましく、1〜100重量部の範囲がより好ましい。(b2)成分以外の充填剤の配合量が1重量部未満では、添加による効果が十分に得られず、逆に、500重量部を超えると、混合が困難となり、均一な組成物が得にくくなる。 The amount of the filler other than the component (b2) is preferably in the range of 1 to 500 parts by weight and more preferably in the range of 1 to 100 parts by weight with respect to 100 parts by weight of the component (a1). When the blending amount of the filler other than the component (b2) is less than 1 part by weight, the effect of the addition cannot be sufficiently obtained. Conversely, when it exceeds 500 parts by weight, mixing becomes difficult and it is difficult to obtain a uniform composition. Become.
(b2)成分以外の充填剤は、組成物(A)および組成物(B)のいずれか一方に含有させてもよく、あるいは、適宜二分して、組成物(A)および組成物(B)にそれぞれ含有させてもよい。作業性や混合性の観点からは、組成物(A)および組成物(B)にそれぞれ含有させることが好ましい。 The filler other than the component (b2) may be contained in one of the composition (A) and the composition (B), or may be appropriately divided into two components, the composition (A) and the composition (B). You may make it contain in each. From the viewpoint of workability and mixing properties, it is preferable to contain the composition (A) and the composition (B), respectively.
本発明の室温硬化性ポリオルガノシロキサン組成物には、さらに必要に応じて、本発明の効果を阻害しない範囲で、この種の組成物に通常配合されている、接着向上剤、顔料、チクソトロピー性付与剤、押出作業性を改良するための粘度調整剤、紫外線吸収剤、防かび剤、耐熱性向上剤、難燃剤等の各種添加剤を配合することができる。これらの添加剤についても、組成物(A)および組成物(B)のいずれか一方または両方に添加することができる。 In the room temperature curable polyorganosiloxane composition of the present invention, if necessary, an adhesion improver, a pigment, and thixotropy that are usually blended in this type of composition within a range not impairing the effects of the present invention. Various additives such as an imparting agent, a viscosity modifier for improving extrusion workability, an ultraviolet absorber, a fungicide, a heat resistance improver, a flame retardant, and the like can be blended. These additives can also be added to one or both of the composition (A) and the composition (B).
本発明の室温硬化性ポリオルガノシロキサン組成物は、上記(a1)〜(a3)成分および必要に応じて配合される各種成分を含む組成物(A)と、上記(b1)、(b2)成分および必要に応じて配合される各種成分を含む組成物(B)がそれぞれ調製され、湿気を遮断した状態で別々に保存される。そして使用時に、組成物(A)と組成物(B)が適当な比率で混合され、かつ、空気中の水分に曝されることにより、縮合反応が生起して硬化しゴム状弾性を有する硬化物が得られる。なお、組成物(A)と組成物(B)の混合重量比は、混合のしやすさの観点から、1:20〜20:1の範囲が好ましく、1:10〜10:1の範囲がより好ましい。特に好ましくは1:3〜3:1の範囲である。 The room temperature curable polyorganosiloxane composition of the present invention comprises the above components (a1) to (a3) and a composition (A) containing various components blended as necessary, and the above components (b1) and (b2). And the composition (B) containing the various components mix | blended as needed is each prepared, and it preserve | saved separately in the state which interrupted moisture. In use, the composition (A) and the composition (B) are mixed at an appropriate ratio, and are exposed to moisture in the air, so that a condensation reaction occurs and cures and has rubber-like elasticity. Things are obtained. The mixing weight ratio of the composition (A) and the composition (B) is preferably in the range of 1:20 to 20: 1, and in the range of 1:10 to 10: 1, from the viewpoint of ease of mixing. More preferred. Particularly preferred is a range of 1: 3 to 3: 1.
本発明により得られる室温硬化性ポリオルガノシロキサン組成物は、硬化速度が速いうえ、各種基材に対する接着性に優れており、また、表面硬化性および深部硬化性も良好である。したがって、本発明の組成物は、電気・電子機器用の弾性接着剤、コーティング材、ポッティング材等として有用であり、また、現場形成ガスケット、建築用シーリング材等としても有用である。 The room temperature curable polyorganosiloxane composition obtained by the present invention has a high curing rate, excellent adhesion to various substrates, and good surface curability and deep part curability. Therefore, the composition of the present invention is useful as an elastic adhesive for electric / electronic devices, a coating material, a potting material, and the like, and is also useful as a field forming gasket, a building sealing material, and the like.
以下、本発明を実施例によりさらに具体的に説明するが、これらの実施例は本発明の範囲を何ら限定するものではない。なお、実施例中、「部」とあるのはいずれも「重量部」を表し、粘度等の物性値は全て23℃、相対湿度50%での値を示す。 EXAMPLES Hereinafter, the present invention will be described more specifically with reference to examples. However, these examples do not limit the scope of the present invention. In the examples, “part” means “part by weight”, and all physical properties such as viscosity are values at 23 ° C. and relative humidity 50%.
実施例1
両末端メチルジメトキシシリル基封鎖ポリジメチルシロキサン(粘度:10Pa・s)100部と、比表面積130m2の乾式シリカ(日本アエロジル社製 商品名 アエロジル130)10部とを、万能混練機により均一に混練りした後、メチルトリメトキシシラン2部、トリス(3−トロメトキシシリルプロピル)イソシアヌレート1部およびジブチル錫ジラウレート0.6部を添加し均一に混合して組成物(A−1)を得た。
Example 1
100 parts of polydimethylsiloxane blocked with methyldimethoxysilyl groups at both ends (viscosity: 10 Pa · s) and 10 parts of dry silica with a specific surface area of 130 m 2 (trade name Aerosil 130 manufactured by Nippon Aerosil Co., Ltd.) are uniformly mixed by a universal kneader. After kneading, 2 parts of methyltrimethoxysilane, 1 part of tris (3-tromethoxysilylpropyl) isocyanurate and 0.6 part of dibutyltin dilaurate were added and mixed uniformly to obtain composition (A-1). .
また、両末端水酸基封鎖ポリジメチルシロキサン(粘度:10Pa・s)100部と、湿式シリカ(東ソーシリカ社製 商品名 ニプシルLP)5部とを、万能混練機により均一に混練りして組成物(B−1)を得た。 Further, 100 parts of both ends hydroxyl-blocked polydimethylsiloxane (viscosity: 10 Pa · s) and 5 parts of wet silica (trade name Nipsil LP, manufactured by Tosoh Silica Co., Ltd.) are uniformly kneaded with a universal kneader to obtain a composition ( B-1) was obtained.
上記組成物(A−1)100部に上記組成物(B−1)50部を添加し均一に混合して室温硬化性ポリオルガノシロキサン組成物を調製した。 50 parts of the composition (B-1) was added to 100 parts of the composition (A-1) and mixed uniformly to prepare a room temperature curable polyorganosiloxane composition.
実施例2
両末端メチルジメトキシシリル基封鎖ポリジメチルシロキサン(粘度:10Pa・s)100部と、両末端トリメチルシリル基封鎖ポリジメチルシロキサン(粘度:0.1Pa・s)10部と、比表面積130m2の乾式シリカ(アエロジル130)10部とを、万能混練機により均一に混練りした後、メチルトリメトキシシラン2部、トリス(3−トロメトキシシリルプロピル)イソシアヌレート1部、アミノプロピルトリエトキシシラン1部およびジブチル錫ジラウレート0.6部を添加し均一に混合して組成物(A−2)を得た。
Example 2
100 parts of polydimethylsiloxane blocked with methyldimethoxysilyl groups at both ends (viscosity: 10 Pa · s), 10 parts of polydimethylsiloxane blocked with both ends trimethylsilyl groups (viscosity: 0.1 Pa · s), and dry silica having a specific surface area of 130 m 2 ( 10 parts of Aerosil 130) were uniformly kneaded with a universal kneader, then 2 parts of methyltrimethoxysilane, 1 part of tris (3-tromethoxysilylpropyl) isocyanurate, 1 part of aminopropyltriethoxysilane and dibutyltin 0.6 part of dilaurate was added and mixed uniformly to obtain a composition (A-2).
また、両末端水酸基封鎖ポリジメチルシロキサン(粘度:10Pa・s)100部と、湿式シリカ(ニプシルLP)3部と、比表面積130m2の乾式シリカ(アエロジル130)5部を、万能混練機により均一に混練りして組成物(B−2)を得た。 Further, 100 parts of both ends hydroxyl-blocked polydimethylsiloxane (viscosity: 10 Pa · s), 3 parts of wet silica (Nipsil LP), and 5 parts of dry silica (Aerosil 130) with a specific surface area of 130 m 2 were uniformly mixed using a universal kneader. To obtain a composition (B-2).
上記組成物(A−2)100部に上記組成物(B−2)50部を添加し均一に混合して室温硬化性ポリオルガノシロキサン組成物を調製した。 50 parts of the composition (B-2) was added to 100 parts of the composition (A-2) and mixed uniformly to prepare a room temperature curable polyorganosiloxane composition.
実施例3
両末端メチルジメトキシシリル基封鎖ポリジメチルシロキサン(粘度:20Pa・s)100部に、メチルトリメトキシシラン2部、トリス(3−トロメトキシシリルプロピル)イソシアヌレート1部およびジブチル錫ジラウレート0.6部を添加し均一に混合して組成物(A−3)を得た。
Example 3
100 parts of polydimethylsiloxane blocked with methyldimethoxysilyl groups at both ends (viscosity: 20 Pa · s), 2 parts of methyltrimethoxysilane, 1 part of tris (3-tromethoxysilylpropyl) isocyanurate and 0.6 part of dibutyltin dilaurate It added and mixed uniformly and the composition (A-3) was obtained.
また、両末端水酸基封鎖ポリジメチルシロキサン(粘度:10Pa・s)100部と、湿式シリカ(ニプシルLP)5部と、比表面積130m2の乾式シリカ(アエロジル130)10部を、万能混練機により均一に混練りして組成物(B−3)を得た。 Moreover, 100 parts of both ends hydroxyl-blocked polydimethylsiloxane (viscosity: 10 Pa · s), 5 parts of wet silica (Nipsil LP), and 10 parts of dry silica (Aerosil 130) with a specific surface area of 130 m 2 were uniformly mixed using a universal kneader. To obtain a composition (B-3).
上記組成物(A−3)100部に上記組成物(B−3)50部を添加し均一に混合して室温硬化性ポリオルガノシロキサン組成物を調製した。 50 parts of the composition (B-3) was added to 100 parts of the composition (A-3) and mixed uniformly to prepare a room temperature curable polyorganosiloxane composition.
実施例4
実施例3で得た組成物(A−3)100部に実施例1で得た組成物(B−1)50部を添加し均一に混合して室温硬化性ポリオルガノシロキサン組成物を調製した。
Example 4
50 parts of the composition (B-1) obtained in Example 1 was added to 100 parts of the composition (A-3) obtained in Example 3 and mixed uniformly to prepare a room temperature-curable polyorganosiloxane composition. .
比較例1
両末端メチルジメトキシシリル基封鎖ポリジメチルシロキサン(粘度:10Pa・s)100部に、湿式シリカ(ニプシルLP)2部を添加し均一に混合して組成物(B−4)を得た。
Comparative Example 1
2 parts of wet silica (Nippyl LP) was added to 100 parts of both ends methyldimethoxysilyl group-blocked polydimethylsiloxane (viscosity: 10 Pa · s) and mixed uniformly to obtain a composition (B-4).
実施例1で得た組成物(A−1)100部に上記組成物(B−4)50部を添加し均一に混合して室温硬化性ポリオルガノシロキサン組成物を調製した。 50 parts of the composition (B-4) was added to 100 parts of the composition (A-1) obtained in Example 1 and mixed uniformly to prepare a room temperature curable polyorganosiloxane composition.
比較例2
両末端水酸基封鎖ポリジメチルシロキサン(粘度:10Pa・s)100部と、比表面積130m2の乾式シリカ(アエロジル130)5部を、万能混練機により均一に混練りして組成物(B−5)を得た。
Comparative Example 2
100 parts of polydimethylsiloxane blocked with hydroxyl groups at both ends (viscosity: 10 Pa · s) and 5 parts of dry silica (Aerosil 130) having a specific surface area of 130 m 2 are uniformly kneaded by a universal kneader to obtain a composition (B-5) Got.
実施例1で得た組成物(A−1)100部に上記組成物(B−5)50部を添加し均一に混合して室温硬化性ポリオルガノシロキサン組成物を調製した。 50 parts of the composition (B-5) was added to 100 parts of the composition (A-1) obtained in Example 1 and mixed uniformly to prepare a room temperature curable polyorganosiloxane composition.
比較例3
両末端水酸基封鎖ポリジメチルシロキサン(粘度:10Pa・s)100部と、湿式シリカ(ニプシルLP)4部と、比表面積130m2の乾式シリカ(アエロジル130)5部を、万能混練機により均一に混練りして組成物(C−1)を得た。
Comparative Example 3
100 parts of polydimethylsiloxane blocked with hydroxyl groups at both ends (viscosity: 10 Pa · s), 4 parts of wet silica (Nipsil LP), and 5 parts of dry silica (Aerosil 130) with a specific surface area of 130 m 2 are mixed uniformly with a universal kneader. It knead | mixed and the composition (C-1) was obtained.
また、テトラエトキシシラン100部、アミノプロピルトリエトキシシラン70部、トリス(3−トロメトキシシリルプロピル)イソシアヌレート30部およびジブチル錫ジラウレート10部を添加し均一に混合して組成物(D−1)を得た。 Further, 100 parts of tetraethoxysilane, 70 parts of aminopropyltriethoxysilane, 30 parts of tris (3-tromethoxysilylpropyl) isocyanurate and 10 parts of dibutyltin dilaurate were added and mixed uniformly to obtain a composition (D-1) Got.
上記組成物(C−1)100部に上記組成物(D−1)5部を添加し均一に混合して室温硬化性ポリオルガノシロキサン組成物を調製した。 To 100 parts of the composition (C-1), 5 parts of the composition (D-1) was added and mixed uniformly to prepare a room temperature curable polyorganosiloxane composition.
上記各実施例および各比較例で得られたポリオルガノシロキサン組成物について、下記に示す方法で各種特性を評価した。
[タックフリータイム]
JIS K 6249に基づいて測定した。
[硬化性]
室温硬化性ポリオルガノシロキサン組成物を、内径20mm、深さ25mmの円筒状のポリエチレン製カップに充填し、10分後および1時間後の内部の硬化状態を観察した。
[接着性]
各種基材(アルミニウム、アクリル樹脂、エポキシガラス、PBT(ポリブチレンテレフタレート)、PPS(ポリフェニレンサルファィド)、PPO(ポリフェニレンオキサイド))に、室温硬化性ポリオルガノシロキサン組成物を、長さ50mm、幅10mmで、厚さ1mmになるように塗布し、23℃、50%RHの雰囲気中に24時間放置し硬化させて試験体を作製し、これらの試験体について、凝集破壊率を測定した。
About the polyorganosiloxane composition obtained by each said Example and each comparative example, various characteristics were evaluated by the method shown below.
[Tack Free Time]
Measured based on JIS K 6249.
[Curing property]
The room temperature-curable polyorganosiloxane composition was filled into a cylindrical polyethylene cup having an inner diameter of 20 mm and a depth of 25 mm, and the internal cured state after 10 minutes and 1 hour was observed.
[Adhesiveness]
Various base materials (aluminum, acrylic resin, epoxy glass, PBT (polybutylene terephthalate), PPS (polyphenylene sulfide), PPO (polyphenylene oxide)), room temperature curable polyorganosiloxane composition, 50 mm in length and width The coating was applied to a thickness of 10 mm at a thickness of 10 mm, and allowed to stand for 24 hours in an atmosphere of 23 ° C. and 50% RH to be cured to prepare specimens. The cohesive failure rate of these specimens was measured.
これらの結果を表1に示す。
表1から明らかなように、実施例で調製された室温硬化性ポリオルガノシロキサン組成物は、硬化性に優れるうえ、各種基材に対する接着性も良好であった。 As is apparent from Table 1, the room temperature curable polyorganosiloxane compositions prepared in the examples were excellent in curability and adhesiveness to various substrates.
Claims (6)
前記(a1)、(a2)および(a3)成分を含む組成物(A)と、前記(b1)および(b2)成分を含む組成物(B)とを混合してなることを特徴とする室温硬化性ポリオルガノシロキサン組成物。 (A1) a polyorganosiloxane having two or more alkoxy groups at the molecular terminals, (a2) an organosilicon compound having two or more alkoxy groups in one molecule or a partial hydrolysis condensate thereof, (a3) a curing catalyst, A room temperature-curable polyorganosiloxane composition comprising (b1) a polyorganosiloxane having a hydroxyl group at a molecular end, and (b2) a filler having adsorbed water,
A room temperature characterized by mixing the composition (A) containing the components (a1), (a2) and (a3) and the composition (B) containing the components (b1) and (b2). Curable polyorganosiloxane composition.
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