JP2008038098A - Thermally disappearing resin particle - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a thermally disappearing resin particle capable of being decomposed at a low temperature in a short time in a low-oxygen concentration atmosphere, leaving very little residue of a resin component, and hardly causing transformation and breakage of an obtained sintered inorganic material when used as a pore-forming agent or the like; and to provide a method for producing the thermally disappearing resin particle, a method for producing a sintered inorganic material, and the sintered inorganic material. <P>SOLUTION: The thermally disappearing resin particle contains a polyoxyalkylene resin. The resin particles of ≥90 wt.% disappear within 2 hr by being heated to a prescribed temperature of 100-350°C in the atmosphere of ≤5% oxygen concentration, and the residue of the resin components becomes ≤0.01 wt.% within 1 hr when the resin particles after disappearance of ≥90 wt.% are further heated to a prescribed temperature of 200-400°C. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

The present invention is a sinterable inorganic material that can be decomposed at low temperature and in a short time under an atmosphere of low oxygen concentration, has very little resin component residue, and is obtained when used as a porous material or the like. The present invention relates to a heat extinguishing resin particle that does not cause deformation or cracking, a method for producing the heat extinguishing resin particle, a method for producing a sinterable inorganic material, and a sinterable inorganic material.

Organic polymers, especially thermoplastic resins represented by polyacrylates, polystyrenes, polyethylenes, etc., are decomposed by heating, and therefore have thermal decomposability and a relatively high softening point temperature. Has moldability. Therefore, organic polymers are widely used as ceramic molding binders, thermal recording resins, heat-disintegrating adhesives and the like by utilizing such thermal decomposability and moldability. In recent years, sinterable inorganic materials such as lightweight ceramics, glass filters, ceramic filters, and porous materials are manufactured by mixing organic polymers with micron-sized resin particles, mixing them with ceramics and metals, and firing and sintering them. It is used when doing.

When using organic polymer resin particles as a porous material for a sinterable inorganic material in this way, the resin component is removed by thermal decomposition or combustion by firing in a non-oxygen or oxygen atmosphere. There is a need.
Among these, in the case of removing the resin component in a nitrogen atmosphere or a non-oxygen atmosphere such as a vacuum state, a decomposition acceleration reaction caused by oxygen does not occur, and thus a great amount of heat energy is required for removing the resin component. It will be. As a result, in order to completely remove the resin component, it is necessary to perform the baking step at a high temperature of 500 ° C. or more, and it is necessary to perform it for a long time.

On the other hand, when the temperature of the firing process is lowered, there is a problem that a residue of a resin component such as carbon remains inside the material. If sintering is performed in a state in which such a resin component residue is included after firing, the resulting sinterable inorganic material may be deformed or cracked by the combustion heat generated when the resin component burns. When such a sinterable inorganic material is used as an electrode material, there arises a problem that quality deterioration such as leakage current occurs. Therefore, in the firing process, the resin component can be removed at a lower temperature, the residue of the resin component such as carbon is extremely small, and the resin is less likely to generate distortion due to combustion heat when used in the production of a sinterable inorganic material. Particles were desired.

To solve these problems, for example, Patent Document 1 discloses a thermal decomposition containing a styrene monomer and an α-methylstyrene monomer at a predetermined ratio as a resin material that is easily decomposed even at a low temperature and has good moldability. A basic styrenic copolymer is disclosed.

However, even such a thermally decomposable styrene copolymer cannot be said to have sufficient thermal decomposability at a low temperature, and a specific surface area is increased by using a large amount of resin material in the presence of non-oxygen or in a low oxygen state. If a large porous material is to be manufactured, the firing process must be performed at a high temperature of 500 ° C. or higher and for a long time, so that the entire manufacturing process takes a long time and the manufacturing efficiency is reduced. was there. Accordingly, there has been a strong demand for resin particles that can be thermally decomposed at a low temperature and in a short time in the baking step in the presence of non-oxygen or in a low oxygen state and that have very few resin component residues.
JP-A-6-41241

In view of the above-mentioned present situation, the present invention can be decomposed in a low oxygen concentration atmosphere at a low temperature and in a short time, has very little resin component residue, and is obtained when used as a porous material or the like. Provided are a heat extinguishing resin particle that does not cause deformation or cracking in a sinterable inorganic material, a method for producing the heat extinguishing resin particle, a method for producing a sinterable inorganic material, and a sinterable inorganic material. For the purpose.

The present invention relates to a heat-extinguishing resin particle containing a polyoxyalkylene resin, which is heated to a predetermined temperature of 100 to 350 ° C. in an atmosphere having an oxygen concentration of 5% or less, and is 90% by weight within 2 hours. After the above disappears and 90% by weight or more disappears, the heat extinguishing resin in which the residue of the resin component becomes 0.01% by weight or less within one hour by further heating to a predetermined temperature of 200 to 400 ° C. Particles.
Hereinafter, the present invention will be described in detail.

As a result of intensive studies, the present inventors have found that a certain amount or more disappears within 2 hours by heating to a predetermined temperature of 100 to 350 ° C. even in a non-oxygen or low oxygen concentration atmosphere. After the disappearance of the weight percent or more, by further heating to a predetermined temperature of 200 to 400 ° C., the heat extinguishing resin particles in which the residue of the resin component becomes a certain amount or less within 1 hour are produced together with the inorganic powder. When used as a porous material for a binder inorganic material, it is possible to improve the production efficiency by shortening the time required for the firing process and the like, and the residue of the resin component can be extremely reduced. The inventors have found that it is possible to suppress deformation and cracking of the inorganic material, and have completed the present invention.

When the heat extinguishing resin particles of the present invention are heated to a predetermined temperature of 100 to 350 ° C. in an atmosphere having an oxygen concentration of 5% or less, 90% by weight or more disappears within 2 hours.
The heat extinguishing resin particles of the present invention exhibit extremely excellent decomposability even in a low temperature region of 100 to 350 ° C. in a non-oxygen or low oxygen atmosphere, and 90% by weight or more disappears.
When the time required for disappearance of 90% by weight or more exceeds 2 hours, the production efficiency of the sinterable inorganic material decreases when used for the production of the sinterable inorganic material. If the portion that disappears within 2 hours is less than 90% by weight, the amount of heat generation is reduced and the effect of suppressing deformation becomes insufficient.

In the heat extinguishing resin particles of the present invention, after 90% by weight or more disappears as described above, the resin component residue is 0.01% within 1 hour by further heating to a predetermined temperature of 200 to 400 ° C. % By weight or less.
The heat extinguishing resin particles of the present invention exhibit extremely excellent degreasing properties in a temperature range of 200 to 400 ° C., and almost no resin component such as carbon remains.
When the time required for the resin component residue to be 0.01% by weight or less exceeds 1 hour, the production efficiency decreases. If it is lower than 200 ° C., the resin component cannot be sufficiently removed, and the resin component residue may not be 0.01% by weight or less. When the temperature at which the residue of the resin component becomes 0.01% by weight or less exceeds 400 ° C., when degreasing is performed at 400 ° C. or less in order to improve the production efficiency, the resin component such as carbon remains, The obtained sinterable inorganic material may have problems such as deformation and cracks.
In the present specification, the resin component residue is a component derived from the heat-extinguishing resin particles of the present invention, which is generated as a result of burning the heat-extinguishing resin particles of the present invention. Means.

The heat-extinguishing resin particles of the present invention contain a polyoxyalkylene resin.
The polyoxyalkylene resin is decomposed into low molecular weight hydrocarbons, ethers, etc. by heating to a predetermined temperature of 100 to 350 ° C. in a non-oxygen or low oxygen concentration atmosphere, and then subjected to combustion reaction, evaporation, etc. It disappears due to phase change and exhibits extremely excellent heat extinction properties.
This is because the polyoxyalkylene resin has many oxygen atoms in the molecule, and therefore the polyoxyalkylene resin itself works as an oxygen supply source even when heated in a non-oxygen or low oxygen concentration atmosphere. It is done.

Although it does not specifically limit as said polyoxyalkylene resin, It is preferable to contain polyoxypropylene, polyoxyethylene, or polyoxytetramethylene. When these polyoxyalkylene resins are not contained, predetermined heat extinction properties and particle strength may not be obtained. Of these, polyoxypropylene is more preferable. In order to obtain moderate heat extinction properties and particle strength, it is preferable that 5% by weight or more of the polyoxyalkylene resin contained in the heat extinction resin particles is polyoxypropylene. Moreover, polyoxyethylene shall contain ethylene glycol.

Examples of commercially available polyoxyalkylene resins include MS polymers S-203, S-303, and S-903 (manufactured by Kaneka Corporation); Silyl SAT-200, MA-403, and MA-447. (Above, manufactured by Kaneka Corporation); Epion EP103S, EP303S, EP505S (above, manufactured by Kaneka Corporation); Exester ESS-2410, ESS-2420, ESS-3630 (above, manufactured by Asahi Glass Co., Ltd.)

Although it does not specifically limit as molecular weight of the said polyoxyalkylene resin, The minimum with a preferable number average molecular weight is 300, and a preferable upper limit is 1 million. If it is less than 300, high heat extinction may not be realized, and if it exceeds 1,000,000, high particle strength may not be realized.

In the heat extinguishing resin particles of the present invention, the preferred lower limit of the content of the polyoxyalkylene resin is 5% by weight. If it is less than 5% by weight, the heat extinction property may not be sufficiently realized.

The polyoxyalkylene resin preferably further contains a crosslinking component.
By containing the crosslinking component, the compressive strength of the heat extinguishing resin particles of the present invention can be improved. Therefore, when the heat extinguishing resin particles of the present invention and inorganic powder are mixed and molded, handling properties can be improved without causing destruction of the resin particles at room temperature. Moreover, the resin particle can be made not to swell in the organic solvent by containing the crosslinking component.
The crosslinking component is not particularly limited, and examples thereof include an acrylic polyfunctional monomer such as trimethylolpropane tri (meth) acrylate, divinylbenzene, and a macromonomer having two or more functional groups described later. .

In the heat extinguishing resin particles of the present invention, the preferable lower limit of 10% compressive strength at 23 ° C. is 1 MPa, and the preferable upper limit is 1000 MPa. When the pressure is less than 1 MPa, resin particles are destroyed at room temperature, and thus handling properties may be deteriorated when molding with mixing with inorganic powder. If it exceeds 1000 MPa, the molding machine screw may be damaged when it is molded with inorganic powder. In this specification, the 10% compressive strength means a pressure required to compress the heat extinguishing hollow resin particles by 10% with respect to the particle diameter, such as a micro hardness tester (manufactured by Fischer). Can be measured.

It is preferable that the heat extinguishing resin particles of the present invention do not swell in an organic solvent.
When it is swollen in an organic solvent, the strength of the heat extinguishing resin particles of the present invention is reduced, so that when used as a porous material, a desired pore-forming effect may not be obtained.

The heat-extinguishing resin particles of the present invention preferably further contain an acrylic monomer polymer. The acrylic monomer polymer is easily depolymerized and excellent in thermal decomposability, and the coexistence with the polyoxyalkylene resin can further improve the decomposability.

The acrylic monomer polymer is not particularly limited. For example, ethyl acrylate, propyl acrylate, n-butyl acrylate, cyclohexyl acrylate, 2-ethylhexyl acrylate, ethyl methacrylate, butyl methacrylate, methyl methacrylate, butyl methacrylate, isobutyl methacrylate. And the like.
A polymer of an acrylic polyfunctional monomer such as trimethylolpropane tri (meth) acrylate is preferably used.

In the heat extinguishing resin particles of the present invention, a preferred upper limit of the content of the acrylic monomer polymer is 99% by weight. If it exceeds 99% by weight, the content of the polyoxyalkylene resin becomes too small, and the decomposition promoting effect may not be sufficiently obtained. A more preferred lower limit is 50% by weight, and a more preferred upper limit is 97% by weight.

The heat extinguishing resin particles of the present invention preferably further contain a decomposition accelerator.
In this specification, the decomposition accelerator means a substance that generates radicals at a predetermined temperature and accelerates a polymer decomposition reaction caused by radicals including depolymerization.
By containing the decomposition accelerator, the decomposition of the polyoxyalkylene resin is promoted, and the heat extinguishing resin particles can be extinguished in a short time at a lower temperature.

The decomposition accelerator is not particularly limited, and examples thereof include peroxides such as benzoyl peroxide and lauroyl peroxide, 2,2′-azobisisobutyronitrile, 2-carbamoylazoformamide, 1,1 ′. -Azo compounds such as azobiscyclohexane-1-carbonitrile.

The preferred lower limit of the average particle diameter of the heat extinguishing resin particles of the present invention is 0.05 μm, and the preferred upper limit is 500 μm. If it is outside the above range, it may be difficult to produce the heat extinguishing resin particles of the present invention with a good yield in a production method such as suspension polymerization. It is possible to efficiently produce extinct resin particles. A more preferable lower limit is 1 μm, and a more preferable upper limit is 200 μm.

The method for producing the heat extinguishing resin particles of the present invention is not particularly limited. For example, a polyoxyalkylene macromonomer, a mixed monomer of a polyoxyalkylene macromonomer and another polymerizable monomer, and a decomposition accelerator. Examples of the polymerization method include a polymerization method using a known polymerization method such as a suspension polymerization method, an emulsion polymerization method, a dispersion polymerization method, a soap-free polymerization method, a miniemulsion polymerization method, and the like.
Among them, a method having a step of polymerizing a polyoxyalkylene macromonomer or a mixed monomer of a polyoxyalkylene macromonomer and another polymerizable monomer is preferable. In the present specification, the macromonomer refers to a high molecular weight linear molecule having a polymerizable functional group such as a vinyl group at the molecular end, and the polyoxyalkylene macromonomer is a polymer having a linear portion having a poly moiety. A macromonomer composed of oxyalkylene.

The functional group contained in the polyoxyalkylene macromonomer is not particularly limited. For example, polymerizable unsaturated hydrocarbon such as (meth) acrylate, isocyanate group, epoxy group, hydrolyzable silyl group, hydroxyl group, carboxyl group Etc. Among them, a polyoxyalkylene macromonomer containing a polymerizable unsaturated hydrocarbon capable of radical polymerization is preferable because it can more easily produce a heat-extinguishing resin particle, and a polyoxyalkylene containing a (meth) acryloyl group having high polymerization reactivity. An alkylene macromonomer is more preferred.
Further, the number of functional groups contained in the polyoxyalkylene macromonomer is not particularly limited, but if a macromonomer having two or more functional groups is used, heat extinguishing resin particles having high compressive strength can be obtained by crosslinking. Can do.

Although it does not specifically limit as molecular weight of the polyoxyalkylene unit contained in the said polyoxyalkylene macromonomer, The minimum with a preferable number average molecular weight is 300, and a preferable upper limit is 1 million. If it is less than 300, sufficient heat extinction may not be obtained, and if it exceeds 1,000,000, sufficient particle strength may not be obtained.

Specific examples of the polyoxyalkylene macromonomer include polyoxyethylene di (meth) acrylate (manufactured by NOF Corporation; Blemmer PDE-400, PDE-600, ADE-400), polyoxypropylene di (meth). Acrylate (manufactured by NOF Corporation: Blemmer PDP-400, PDP-700, ADP-400), polyoxytetramethylene di (meth) acrylate (manufactured by NOF Corporation; Blemmer PDT-650, ADT-250), polyoxyethylene- Polyoxytetramethylene methacrylate (manufactured by NOF Corporation; Bremer 55PET-800) and the like can be mentioned.

Although it does not specifically limit as another polymerizable monomer when making it copolymerize with the said polyoxyalkylene macromonomer, Since it can manufacture simply, a radically polymerizable monomer is suitable. It does not specifically limit as said radically polymerizable monomer, For example, (meth) acrylate, (meth) acrylonitrile, (meth) acrylic acid, styrene and its derivative (s), vinyl acetate, etc. are mentioned.

Furthermore, as another polymerizable monomer used together with the polyoxyalkylene macromonomer, a polyfunctional monomer may be added for the purpose of improving the particle strength. The type of the polyfunctional monomer is not particularly limited, and examples thereof include acrylic polyfunctional monomers such as trimethylolpropane tri (meth) acrylate, divinylbenzene, and the like.

Although it does not specifically limit as another polymerizable monomer used with the said polyoxyalkylene macromonomer, Using a highly depolymerizable radically polymerizable monomer can manufacture a heat extinction resin particle easily. Preferred above. For example, (meth) acrylate, (meth) acrylonitrile, (meth) acrylic acid, styrene and its derivatives, vinyl acetate and the like can be mentioned.

When producing the heat extinguishing resin particles of the present invention, the particles containing a polyoxyalkylene resin and a decomposition accelerator may be coated with an organic resin and encapsulated. The encapsulation method is not particularly limited, and examples thereof include a coacervation method, a submerged drying method, an interfacial polymerization method, and an in-situ polymerization method.

The heat extinguishing resin particles of the present invention can be mixed with inorganic powders such as ceramics and metals and fired to produce sinterable inorganic materials such as lightweight ceramics, glass filters, ceramic filters, and porous materials. .
Although it does not specifically limit as a manufacturing method of such a sinterable inorganic material, For example, the process of mixing the heat extinction resin particle of this invention and inorganic powder, shape | molding, and manufacturing a molded object, and the said shaping | molding A method having a step of heating the body at a temperature of 200 to 400 ° C. or less for 10 minutes to 15 hours in an atmosphere having an oxygen concentration of 5% or less can be used. Such a method for producing a sinterable inorganic material is also one aspect of the present invention.
The sinterable inorganic material thus obtained is excellent in production efficiency because the heat extinguishing resin particles of the present invention have extremely excellent thermal decomposability at a low temperature in a short time, and does not cause deformation or cracking. Moreover, in the obtained sinterable inorganic material, the residue of the resin component can be 0.01% by weight or less.

The manufacturing method of the sinterable inorganic material of this invention has the process of mixing the heat extinction resin particle and inorganic powder of this invention, and shape | molding and manufacturing a molded object.
The inorganic powder is not particularly limited. For example, tantalum, nickel, palladium, platinum, gold, silver, copper, alumina, zirconia, aluminum silicate, titanium oxide, zinc oxide, barium titanate, magnesia, sialon, spinemul. Examples thereof include powder made of light, silicon carbide, silicon nitride, aluminum nitride, or alloys thereof. These inorganic powders may be used alone or in combination of two or more.

The method for mixing the heat extinguishing resin particles of the present invention and the inorganic powder is not particularly limited, and a conventionally known method can be used. For example, a method using various mixers such as a blender mill and a three-roller. Can be mentioned.
The method for molding the mixture of the heat extinguishing resin particles and the inorganic powder of the present invention is not particularly limited, and conventionally known methods can be used, and methods using various molding machines can be mentioned.

The manufacturing method of the sinterable inorganic material of this invention has the process of heating the said molded object for 10 minutes-15 hours at the temperature of 200-400 degrees C or less in the atmosphere of oxygen concentration 5% or less.
In the method for producing a sinterable inorganic material of the present invention, the lower limit of the heating temperature of the molded body is 200 ° C, and the upper limit is 400 ° C. If it is lower than 200 ° C., the resin component may not be sufficiently removed. When it exceeds 400 degreeC, the manufacturing efficiency of a sinterable inorganic material may deteriorate.
In the method for producing a sinterable inorganic material of the present invention, the lower limit of the heating time of the molded body is 10 minutes, and the upper limit is 15 hours. If it is less than 10 minutes, the resin component may not be sufficiently removed. If it exceeds 15 hours, the production efficiency of the sinterable inorganic material may deteriorate.

According to the method for producing a sinterable inorganic material of the present invention, a sinterable inorganic material having a resin component residue of 0.01% by weight or less can be produced.
The sinterable inorganic material thus obtained is also one aspect of the present invention.

According to the present invention, in an atmosphere of low oxygen concentration, it can be decomposed at a low temperature and in a short time, the resin component residue is extremely small, and the sinterability obtained when used as a porous material or the like To provide a heat extinguishing resin particle that does not cause deformation or cracking in an inorganic material, a method for producing the heat extinguishing resin particle, a method for producing a sinterable inorganic material, and a sinterable inorganic material Can do.

The present invention will be described in more detail with reference to the following examples, but the present invention is not limited to these examples.

(Example 1)
(Production of resin particles)
As a monomer component, 10 parts by weight of polyoxypropylene dimethacrylate (number of polyoxypropylene units = about 4), 90 parts by weight of isobutyl methacrylate, and 0.3 parts by weight of azobisisobutyronitrile (AIBN) as a polymerization initiator Were mixed and stirred to prepare a monomer solution.
The total amount of the monomer solution thus obtained is added to 300 parts by weight of an aqueous solution of 1% by weight of polyvinyl alcohol (PVA) and 0.02% by weight of sodium nitrite, and stirred using a stirring and dispersing device to obtain an emulsified suspension. It was.

Next, using a 20 liter polymerization vessel equipped with a stirrer, jacket, reflux condenser and thermometer, the inside of the polymerization vessel was depressurized, and after deoxidizing the vessel, the pressure was returned to atmospheric pressure with nitrogen gas. The inside of the polymerization vessel was set to a nitrogen atmosphere. The entire amount of the resulting emulsified suspension was charged all at once into the polymerization vessel, and the polymerization was started by raising the temperature of the polymerization vessel to 60 ° C. After polymerization for 8 hours, the polymerization vessel was cooled to room temperature to obtain a slurry. The obtained slurry was dehydrated with a dehydrator and vacuum dried to obtain resin particles.
In addition, it was 20 micrometers when the average particle diameter of the obtained resin particle was measured.

(Production of sinterable inorganic material)
After mixing a fine powder of tantalum and a solution obtained by dissolving a methacrylic resin with an organic solvent, the coated tantalum powder was obtained by heating to remove the organic solvent. 12 parts by weight of the obtained resin particles were mixed with 100 parts by weight of the obtained coated tantalum powder to obtain a mixture. Next, the obtained mixture was press-compressed into a square, and then heated in a vacuum to 400 ° C. at a heating rate of 10 ° C./min, and held for 1 hour to degrease the resin particles. Thereafter, sintering was performed at a heating rate of 40 ° C./h, a maximum temperature of 1400 ° C., and a holding time of 3 hours to obtain a sinterable inorganic material of 1.10 mm × 1.80 mm × 1.45 mm square.

(Example 2)
The same method as in Example 1 except that 50 parts by weight of polyoxyethylene dimethacrylate (number of polyoxyethylene units = about 2; manufactured by NOF Corporation, Blenmer PDE100) and 50 parts by weight of methyl methacrylate were used as the monomer components. Thus, resin particles and a sinterable inorganic material were obtained.
In addition, it was 40 micrometers when the average particle diameter of the obtained resin particle was measured.

(Comparative Example 1)
Resin particles and a sinterable inorganic material were obtained in the same manner as in Example 1 except that 80 parts by weight of methyl methacrylate and 20 parts by weight of trimethylolpropane trimethacrylate were used as monomer components.
In addition, it was 28 micrometers when the average particle diameter of the obtained resin particle was measured.

(Evaluation)
The following evaluation was performed on the heat extinguishing resin particles obtained in Examples 1 and 2 and Comparative Example 1.
The results are shown in Table 1.

(Evaluation of resin particles)
(1) Measurement of heat loss Measurement by using a differential scanning calorimeter (DSC-6200, manufactured by Seiko Instruments Inc.) while increasing the temperature at a rate of temperature increase of 5 ° C./min. The temperature, the weight loss rate at 350 ° C., and the amount of the resin component residue at 400 ° C. were measured.

(2) Measurement of compressive strength Using a micro hardness tester (manufactured by Fischer), 10% compressive strength at 23 ° C. was measured for arbitrarily selected five heat extinguishing resin particles.

(Evaluation of sinterable inorganic materials)
(1) Measurement of strain The obtained sinterable inorganic material was visually observed, and the occurrence of strain and cracks was evaluated according to the following criteria.
○: No distortion or crack was observed.
X: Distortion and a crack were recognized.

(2) Measurement of Resin Component Residue Using a differential scanning calorimeter (DSC-6200, manufactured by Seiko Instruments Inc.), the amount of the resin component residue in the sinterable inorganic material was measured.

According to the present invention, in an atmosphere of low oxygen concentration, it can be decomposed at a low temperature and in a short time, the resin component residue is extremely small, and the sinterability obtained when used as a porous material or the like To provide a heat extinguishing resin particle that does not cause deformation or cracking in an inorganic material, a method for producing the heat extinguishing resin particle, a method for producing a sinterable inorganic material, and a sinterable inorganic material Can do.

Claims (11)

Heat-extinguishing resin particles containing a polyoxyalkylene resin,
By heating to a predetermined temperature of 100 to 350 ° C. in an atmosphere with an oxygen concentration of 5% or less, 90% by weight or more disappears within 2 hours, and after 90% by weight or more disappears, further 200 to 400 ° C. Heat-extinguishing resin particles characterized in that the resin component residue is 0.01% by weight or less within 1 hour by heating to a predetermined temperature. The heat-extinguishing resin particle according to claim 1, wherein the polyoxyalkylene resin contains polyoxypropylene, polyoxyethylene, or polyoxytetramethylene. The heat-extinguishing resin particle according to claim 1 or 2, wherein the polyoxyalkylene resin contains 5% by weight or more of polyoxypropylene. The heat-extinguishing resin particles according to claim 1, 2, or 3, wherein the polyoxyalkylene resin has a number average molecular weight of 3 to 1,000,000. 5. The polyoxyalkylene resin further contains a crosslinking component, has a 10% compressive strength at 23 ° C. of 1 to 1000 MPa, and does not swell in an organic solvent. Heat extinguishing resin particles. Furthermore, the heat extinction resin particle of Claim 1, 2, 3, 4 or 5 characterized by containing an acrylic monomer polymer. Furthermore, the decomposition extinction agent is contained, The heat extinction resin particle of Claim 1, 2, 3, 4, 5 or 6 characterized by the above-mentioned. 8. The heat-extinguishing resin particles according to claim 1, wherein the average particle diameter is 0.05 to 500 [mu] m. A method for producing a heat-extinguishing resin particle comprising polymerizing a polyoxyalkylene macromonomer or a mixed monomer of a polyoxyalkylene macromonomer and another polymerizable monomer. A step of mixing the heat-extinguishing resin particles according to claim 1, 2, 3, 4, 5, 6, 7, or 8 and inorganic powder, and molding to produce a molded body, and
A method for producing a sinterable inorganic material, comprising a step of heating the compact at a temperature of 200 to 400 ° C. for 10 minutes to 15 hours in an atmosphere having an oxygen concentration of 5% or less. A sinterable inorganic material obtained by using the method for producing a sinterable inorganic material according to claim 10, wherein the resin component residue is 0.01% by weight or less.