JP2008016790A - Kintaro-type metal ceramics material - Google Patents

Abstract

Miniaturization of a substrate or a semiconductor chip is realized.
A honeycomb-shaped porous ceramic material is injected and impregnated with a metal, an alloy material, a semiconductor material, or an insulating material (resin) to form a multilayer ceramic composite material.
[Selection] Figure 1

Description

  The present invention relates to a metal ceramic material of a Kintaro method, which is provided with composite features of an insulator, a conductor, and a semiconductor.

  In conventional substrates and semiconductor chips, circuits are formed by printing by exposure or printing.

  With conventional substrates and semiconductor chips, circuits were formed by printing by exposure or printing, so there was only a two-dimensional idea and microfabrication was impossible.

  The means of the present invention is to manufacture and process several layers of ceramic composite laminates by injecting and impregnating a honeycomb-like porous ceramic material with metal, alloy material, semiconductor material, or insulating material (resin).

  Depending on the processing method, it becomes a source pattern if it is processed into a checkered pattern or a twill lattice, or processed into a conical shape. Since it is partitioned by a ceramic honeycomb wall, reproducible ceramic-metal-resin or the like can be produced like Kintaro, regardless of where it is cut.

  If a cylindrical material partially impregnated with metal as shown in FIG. 1 is processed into a conical shape, it becomes a conical column of ceramics and metal, and a metal and a ceramic layer on which current easily flows form a striped pattern to prevent wear and heat. It becomes a metallized ceramic material with good conductivity. This can be used for sensors, electronic circuit boards, soldering iron chips, and the like.

  It is possible to manufacture honeycomb-shaped ceramics with a space of several microns with the current mold, and use it for all electronic circuits and electrical circuits as a ceramic-metal-resin composite substrate with excellent thermal characteristics and electrical insulation. Can do.

  In addition, metal materials with various characteristics, semiconductor materials, insulating resins, etc. are impregnated and injected into the honeycomb structure in a matrix, and then molded to form a multilayer multiple composite circuit. It can be used as a material for compact substrates, connectors and LSI chips.

  With the Kintaro method, three-dimensional and four-dimensional circuits are possible.

  Manufacture of three-dimensional and four-dimensional structure materials that can be processed in metal, ceramics, semiconductors, and resin insulators of the Kintaro method, which has the characteristics of insulators, conductors, and semiconductors in combination. It is.

  FIG. 1 is a view for explaining an example of conical processing. In the figure, reference numeral 1 denotes a soldering iron chip formed in a conical shape. The soldering iron chip 1 is impregnated with a conductor 11 such as iron, nickel, or tungsten at the center of a ceramic base material 10, and copper, aluminum, gold, silver, or the like around a portion impregnated with the conductor 11. A cylindrical material 15 formed by impregnating the superconductor 12 is cut out in a conical shape from the outer periphery toward the center.

  FIG. 2 is a diagram for explaining an example of impregnation into a honeycomb structure ceramics. A ceramic base material 20 having a honeycomb structure is impregnated with a semiconductor 21, an insulator 22, and a metal 23 in a matrix shape, injected, and molded. It is configured.

It is a figure explaining the example of conical processing. It is a figure explaining the example of the impregnation to honeycomb structure ceramics.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Soldering iron chip 10 Ceramic base material 11 Conductor 12 Superconductor 15 Material 20 Ceramic base material 21 Semiconductor 22 Insulator 23 Metal

Claims (5)

    Manufacture and processing of multiple layers of ceramic composite laminates by injecting and impregnating honeycomb porous ceramic materials with metal, alloy material, semiconductive material, insulating material (resin).     Depending on the processing method, it becomes a source pattern if it is processed into a checkered pattern or a twill lattice, or processed into a conical shape. Since it is partitioned by a ceramic honeycomb wall, a reproducible composite material such as ceramic-metal-resin can be manufactured like Kintaro, regardless of where it is cut.     If a cylindrical material partially impregnated with metal as shown in Fig. 1 is processed into a conical shape, it becomes a conical column of ceramics and metal, and the metal and the ceramic layer on which current easily flows form a striped pattern to prevent wear and heat. It becomes a metallized ceramic material with good conductivity. This can be used for sensors, electronic circuit boards, soldering iron chips, and the like.     It is possible to produce honeycomb ceramics with a space of several microns with the current mold, and use it for all electronic circuits and electrical circuits as a ceramic-metal-resin composite substrate with excellent thermal characteristics and electrical insulation characteristics I can do it.     In addition, metal materials with various characteristics, semiconductive materials, insulating resins, etc. are impregnated into the honeycomb structure in a matrix and injected and then molded to form a multilayer multiple composite circuit. It can be used as a material for more compact substrates, connectors, LSI chips, and the like.

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