JP2008015341A - Pattern correction method and device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a pattern correction method which can correct an electrode disconnection part or else with a fine line of about 10 μm and hardly causes contamination around a defective part. <P>SOLUTION: In the pattern correction method, a ring-like groove 3b is formed so as to surround an opening part on the substrate 1 side of a hole 3a opened in a film 3. Therefore, even when a correction paste 13 is sucked into a gap between the film 3 and the substrate 1 by a capillary phenomenon upon the filling of the correction paste 13 into the hole 3a, the correction paste 13 is not spread outside the groove 3b. Therefore, the contamination of the surrounding of the defective part 2a with the correction paste 13 can be prevented. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a pattern correction method and a pattern correction apparatus, and more particularly to a pattern correction method and a pattern correction apparatus for correcting a defective portion of a fine pattern formed on a substrate. More specifically, the present invention relates to a pattern correction method and a pattern correction device for correcting an open defect of an electrode that occurs in a manufacturing process of a flat panel display.

  In recent years, with the increase in size and definition of flat panel displays such as plasma displays, liquid crystal displays, and EL displays, the probability of defects in electrodes and liquid crystal color filters formed on glass substrates has increased. A method for correcting a defect has been proposed in order to improve the yield.

  For example, electrodes are formed on the surface of a glass substrate of a liquid crystal display. If this electrode is disconnected, apply the conductive correction paste (correction solution) attached to the tip of the application needle to the disconnection part, and apply the electrode several times while shifting the application position in the length direction of the electrode. It corrects (for example, refer patent document 1).

In addition, a film is provided so as to cover the defective part, the defective part and the film are removed almost simultaneously using laser light, and a correction ink (correction liquid) is applied to the removed part using the film as a mask. There is a method of peeling and removing (see, for example, Patent Documents 2 and 3).
JP-A-8-292442 Japanese Patent Laid-Open No. 11-125895 JP 2005-95971 A

  However, in the method of correcting the electrode, the conductive correction paste is attached to the tip of the application needle, and the correction paste is transferred to the disconnected portion. Therefore, the application diameter is determined by the flat surface size of the tip of the application needle, and is about 10 μm. It was difficult to realize the coating diameter, and it was also difficult to form a thin line using this.

  On the other hand, in the method using a film as a mask, it is possible to correct the electrode disconnection portion with a thin wire of about 10 μm, but at the time when the correction ink is applied to the hole, a capillary phenomenon occurs in the gap between the film and the substrate. It is also conceivable that the correction ink or its solvent is sucked in and contaminates the substrate.

  Therefore, a main object of the present invention is to provide a pattern correction method and a pattern correction apparatus that can correct an electrode disconnection portion or the like with a thin wire of about 10 μm and that has little contamination around a defect portion.

  The pattern correction method according to the present invention is a pattern correction method in which a defect portion of a fine pattern formed on a substrate is covered with a film, and a correction liquid is applied to the defect portion through a hole in the film. A groove for preventing the correction liquid from spreading between the film and the substrate by capillary action is formed so as to surround the hole.

  Another pattern correction method according to the present invention is a pattern correction method for correcting a defect portion of a fine pattern formed on a substrate. In the pattern correction method, a hole having a shape corresponding to the defect portion is formed in the film and a groove is formed so as to surround the hole. The film groove side of the film is directed to the substrate side, the hole is aligned with the defective portion, the film is placed on the substrate, the correction liquid is applied to the defective portion through the hole, and the correction liquid is capillary The groove is prevented from spreading between the film and the substrate due to the phenomenon.

Preferably, the groove is formed in a ring shape.
Preferably, after forming holes and grooves in the film by irradiating laser light from above the film, the front and back of the film are reversed so that the groove side surface of the film faces the substrate side.

Preferably, a partition wall exists between the groove and the hole.
Preferably, the hole and the defective portion are opposed to each other with a gap, the film is pressed against the substrate within a predetermined range including the hole, and the correction liquid is applied to the defective portion through the hole, and the film is restored by the restoring force of the film. Is peeled from the substrate.

  Preferably, a recess is formed on the surface of the film on the substrate side, a hole and a groove are formed in the recess, the hole and the defect are aligned, and the film and the substrate are brought into contact with each other. With a gap.

  Preferably, a spacer is disposed in the vicinity of the defect portion, the hole is aligned with the defect portion, and the film is disposed on the spacer so that the hole and the defect portion are opposed to each other with a gap.

  Preferably, a concave portion is formed on the surface of the film on the substrate side, holes and grooves are formed in the concave portion, a spacer is disposed in the vicinity of the defective portion, the hole is aligned with the defective portion, and the film is placed on the spacer. By arranging, the hole and the defective part are opposed to each other with a gap.

  Moreover, the pattern correction apparatus according to the present invention is a pattern correction apparatus that covers a defective portion of a fine pattern formed on a substrate with a film and applies correction liquid to the defective portion through a hole in the film. A groove for preventing the correction liquid from spreading between the film and the substrate due to capillary action is formed on the surface so as to surround the hole.

  In the pattern correction method and the pattern correction apparatus according to the present invention, grooves for preventing the correction liquid from spreading between the film and the substrate due to capillary action are formed so as to surround the hole on the substrate side surface of the film. Therefore, it is possible to correct an electrode disconnection portion or the like with a thin wire of about 10 μm, and to prevent the periphery of the defective portion from being contaminated by the correction liquid.

  In the pattern correction method according to the present invention, a groove having a constant width is formed over the entire circumference around the hole formed in the film, and the defect portion is formed through the hole in a state where the film surface having the groove is in contact with the substrate. Apply corrective paste. By forming a groove around the hole, an area where the film and the substrate do not contact around the hole is secured, so even if correction paste is sucked into the gap between the film and the substrate due to capillary action, Does not invade. Therefore, it is possible to prevent the periphery of the defective portion from being contaminated with the correction paste, and a fine pattern having substantially the same shape as the hole can be obtained.

  In the above example, the film is brought into contact with the substrate, but at the top of the hole in a state where the film is opposed to at least a minute range of the film including the hole and the minute range of the substrate including the defective portion. The correction paste may be applied by application means such as an application needle. In this case, when the microscopic range including the hole is pressed with the application needle having the correction paste attached to the tip, the film is deformed and the periphery of the hole comes into contact with the periphery of the defective portion. The contact time is while the application needle is pushing the hole opened in the film, and is controlled so that the application needle is retracted upward from the film before the correction paste flows into the gap between the film and the substrate by capillary action. When the application needle is separated from the film, the film is restored to the original state, and the hole is separated from the defective portion. Since the time for the periphery of the hole to contact the periphery of the defective portion is short, the substrate can be prevented from being contaminated with the correction paste. Therefore, a more stable effect can be obtained together with the effect of the groove. Hereinafter, this pattern correction method will be described in detail with reference to the drawings.

[Embodiment 1]
1A is a plan view showing a pattern correction method according to Embodiment 1 of the present invention, and FIG. 1B is a cross-sectional view taken along line IB-IB in FIG. 1A and 1B, in this pattern correction method, a film 3 having holes 3a is disposed on a substrate 1. As shown in FIG. 2, an electrode 2 having a fine pattern is formed on the surface of the substrate 1, and an open defect portion (disconnection portion) 2 a is generated in the electrode 2.

  Referring back to FIGS. 1A and 1B, in this pattern correction method, the film 3 having a hole 3a having a shape corresponding to the defect 2a is used as a mask. The film 3 is disposed so as to contact the upper surface of the substrate 1 in a state where the hole 3a is aligned with the defect portion 2a. The film 3 is, for example, a thin polyimide film, and the width of the film 3 only needs to be sufficient to be used as a mask. For example, a roll film slit to about 5 mm to 15 mm is used. The thickness Ft of the film 3 is preferably such that the underside can be seen through, for example, about 10 to 25 μm.

  The opening of the hole 3a has, for example, a rectangular shape with a short axis length Sw and a long axis length Sl, so that the correction paste can be applied to the normal electrode surfaces 2b located at both ends of the defect 2a. 3a is formed longer than the defective part 2a. This can be expected to be effective in reducing the resistance value of the correction portion and improving the adhesion of the correction portion.

  As shown in FIG. 3, a ring-shaped groove 3b is formed on the film surface 3P of the film 3 on the substrate 1 side so as to surround the through hole 3a. The groove 3b is formed at a position slightly away from the hole 3a, and a partition wall 3c is left between the groove 3b and the hole 3a. For example, the width W1 of the partition wall 3c is 1 to 5 μm, the width W2 of the groove 3b is 5 to 50 μm, and the depth D1 of the groove 3b is about 1 to 5 μm depending on the film thickness of the film 3. Since the partition 3c and the groove 3b are provided around the hole 3a, when the correction paste is filled in the hole 3a, the range in which the correction paste spreads is the range including the hole 3a and the partition 3c, that is, the width Sy = Sw + 2 × W1, long It is limited to the range of Sx = Sl + 2 × W1.

  The holes 3a and the grooves 3b are formed by irradiating the film 3 with laser light. As the laser, a pulse laser such as a YAG third harmonic laser, a YAG fourth harmonic laser, or an excimer laser is used. For example, as shown in FIG. 4A, the laser unit 4 is fixed to the upper part of the observation optical system 5, and the laser light emitted from the laser unit 4 passes through an objective lens 6 fixed to the lower end of the observation optical system 5. The film 3 is irradiated. The hole 3 a is shaped by, for example, a variable slit (not shown) built in the laser unit 4 and has a cross-sectional shape of the laser beam condensed by the objective lens 6. The shape and size of the hole 3a are determined by the variable slit.

  In addition, when the groove 3b is formed by laser processing around the hole 3a using a rectangular slit, if the hole 3a is a square, the four sides are processed in four times, so that the processing is repeated. And the overlapping portion is about twice as deep. Therefore, it is necessary to determine the depth D1 of the groove 3b in consideration of the film thickness of the film 3 so that the groove 3b does not penetrate the film 3. .

  The step of opening the hole 3a in the film 3 is performed at a position away from the position of the defective portion 2a, or is performed by the film 3 alone so that the laser beam does not hit the defective portion 2a. For example, the film 3 is folded up and down by left and right by fixed rollers 8 and 9 disposed on the left and right and a fixed roller 10 disposed between them at a position away from the processing table 7. It is made the state stretched in parallel. In the example of FIG. 4A, the film 3 between the fixed rollers 9 and 10 is irradiated with laser light from above to form the holes 3a and the grooves 3b. When processing the holes 3a and grooves 3b on the substrate 1 instead of the processing table 7, the shielding plate 11 is placed under the film 3 (in parallel with the upper and lower sides) so that dust generated by laser ablation does not fall on the substrate 1. Between the films 3 stretched between the two.

  The film 3 is supplied from a film supply reel (not shown) and is collected by a film take-up reel (not shown) via fixed rollers 10, 9 and 8. These are the main components of a film supply unit (not shown) and can be moved in the XYZ directions by an XYZ stage (not shown). Further, the film supply unit may have a rotating means.

  The processing table 7 is a processing region when the hole 3a is opened in the film 3, and is disposed at a position different from the substrate 1, but may be omitted. In FIG. 4A, the film 3 is folded back to the right and left, and when the hole 3a is opened in the upper film 3, the film 3 is present at a distance from the lower side. In the case where the film 3 in the above can be used as a substitute for the shielding plate 11, the shielding plate 11 can be omitted.

  At the time when the formation of the hole 3a and the groove 3b is completed, dust generated during laser ablation is scattered on the laser processed surface 3P of the film 3. In order to remove dust, a step of irradiating laser light with a weak power over a wide range around the hole 3a may be included. At this time, by switching to the YAG second harmonic laser and irradiating a wide range centering on the hole 3a with a weak laser power, it is possible to remove only dust and prevent new dust from being generated. can do. As the laser unit 4, a laser unit that can selectively emit one of two types of laser beams, that is, a laser beam for opening the hole 3 a and a laser beam for removing dust is preferably used.

  Thus, since the hole 3a is not processed by the laser beam in a state where the film 3 is attached or adhered to the defect portion 2a, the vicinity of the electrode 2 and the defect portion 2a is not damaged. Moreover, since the hole 3a is opened in a state where the film 3 is floated, it is possible to prevent dust from adhering to the back surface of the film 3.

  Next, as shown in FIG. 4B, the film 3 is wound up in the R direction (right rotation in the figure), and the film 3 is inverted so that the laser-processed film surface 3P faces downward. Next, the film 3 is moved relative to the substrate 1 based on the image processing result, and the holes 3a and the defective portion 2a are aligned so that the substrate 1 and the film 3 face each other. Next, as shown in FIGS. 1A and 1B, the film 3 is lowered and brought into contact with the substrate 1. This step may be performed manually. At this time, the film 3 may be contacted (attached) to the substrate 1 in a state where the tension of the film 3 is relaxed and the film 3 is suspended in a U shape.

  Next, the correction paste 13 is applied to the defective portion 2a by the applying means. As the application means, for example, an application needle 12 is used as shown in FIG. The tip of the application needle 12 is pointed, but the tip is processed flat. The diameter of the flat surface 12a at the tip of the application needle 12 is, for example, about 30 to 70 μm, and an optimum diameter is selected according to the size of the hole 3a. It is preferable to select and use the applicator needle 12 so that the openings of the holes 3a all fit in the flat surface 12a. If such an application needle 12 is used, the correction paste 13 can be filled in the entire hole 3a by a single application operation.

  In a state where the correction paste 13 is attached around the flat surface 12a of the application needle 12, when the application needle 12 is lowered from above in the approximate center of the hole 3a, the defect paste 2a is filled with the correction paste 13. The application needle 12 can move up and down on a guide (linear motion bearing) (not shown), and pushes the film 3 only by its own weight of the movable part including the application needle 12. Even if the application needle 12 is further lowered after contacting the film 3, the application needle 12 is retracted upward along the guide, so that the flat surface 12a of the application needle 12 is not overloaded. The driving means of the application needle 12 is controlled by time management by a control means (not shown).

  The time during which the application needle 12 is pressing the film 3 in the minute range including the hole 3a is extremely short, for example, 1 second or less. Even when the correction paste 13 flows into the gap between the film 3 and the substrate 1 (near the defective portion 2a) by capillary action, the substrate 1 and the film 3 are not in contact with each other in the groove 3b of the film 3, so that the groove 3b Thus, the flow of the correction paste 7 is stopped. Therefore, the range in which the correction paste 13 flows is limited to the range including the hole 3a and the partition 3c, that is, the range of the width Sy and the length Sx shown in FIGS. 1 (a) and 1 (b) and FIG.

  If the viscosity of the correction paste 13 is large, the possibility of being sucked into the gap between the substrate 1 and the film 3 by a capillary phenomenon is reduced, but conversely, the fluidity deteriorates and does not enter the entire hole 3a. It is also assumed that the correction paste 13 does not adhere to the surface. On the other hand, in the first embodiment, the correction paste 13 can be sucked into the partition wall 3c provided at the boundary between the hole 3a and the groove 3b by the capillary phenomenon, so that the viscosity of the correction paste 13 is small. I do not care.

  When correcting one defective portion 2a, it is preferable to complete the correction by one application. The reason is that as the number of times of application increases, the amount of the correction paste 13 adhering to the hole 3a increases, and accordingly, the amount of the correction paste 13 sucked into the gap between the film 3 and the substrate 1 may increase. It is possible. However, it is possible to increase the thickness of the correction layer by applying the same multiple times, and it is desirable to determine it according to the specification of the correction paste 13 to be used.

  Moreover, as the correction paste 13 for correcting the defective portion 2a of the electrode 2, a metal nano paste using a metal nanoparticle such as gold or silver, a metal complex solution, or a metal colloid is used.

  Next, as shown in FIG. 6, the application needle 12 is retracted upward, and the curing unit 14 performs the curing process of the correction paste 13. The curing unit 14 performs an ultraviolet curing process, a heat curing process, or a drying process according to the specification of the correction paste 13. Next, when the film 3 is removed from the substrate 1, the defect portion 2a is covered with a correction layer 13A (pattern) finer than the shape applied by the application needle 12 as shown in FIG. If necessary, the heat treatment of the correction layer 13A may be performed thereafter.

  In the first embodiment, since the groove 3b is provided so as to surround the hole 3a, the applied correction paste 13 is not sucked into the gap between the substrate 1 and the film 3 by capillary action, and is wider than the hole 3a. There is no need to worry about contaminating the substrate 1 over a period of time.

  In the first embodiment, the application needle 12 is used as the application means. However, as shown in FIG. 8A, the correction paste 13 may be filled into the hole 3a using the microdispenser 15, As shown in FIG. 8B, while the tip of the application nozzle 16 is moved from one end of the hole 3 a to the other end, the mist-like correction paste 13 is ejected from the tip of the application nozzle 16 to correct the correction paste 13. May be applied to the defective portion 2a. When the thickness of the correction paste 13 is insufficient, the application nozzle 16 may be reciprocated until a desired thickness is obtained. Although not shown, the correction paste 13 may be applied to the defective portion 2a by ejecting a droplet of the correction paste 13 from the nozzle into the hole 3a as in an inkjet.

[Embodiment 2]
FIG. 9 is a cross-sectional view showing a pattern correction method according to the second embodiment of the present invention, and is a view compared with FIG. Referring to FIG. 9, this pattern correction method is different from the pattern correction method of the first embodiment in that film 3 and substrate 1 are confronted with a certain gap G.

  For example, the film 3 and the substrate 1 are opposed to each other in a state where the film 3 is stretched with a constant tension between the two fixed rollers 8 and 9 shown in FIG. The gap G varies depending on the distance between fulcrums (for example, fixed rollers 8 and 9) that support the film 3 and the thickness of the film 3, but is set to about 10 to 1000 μm, for example. When the surface of the substrate 1 is uneven, the film 3 facing the substrate 1 may maintain a gap G so as not to contact the substrate 1, and a minute range including the hole 3 a does not contact the defective portion 2 a. Such a gap G may be maintained.

  As the application means of the correction paste 13, for example, the application needle 12 is used as in the first embodiment. If the application needle 12 is lowered from above in the center of the hole 3a with the correction paste 13 attached around the flat surface 12a of the application needle 12, as shown in FIG. 10, the film 3 is deformed and the hole 3a is deformed. The film 3 in a minute range around the surface adheres to a range including the defect portion 2a, and the correction paste 13 is filled in the defect portion 2a.

  The time during which the film 3 in the minute range including the hole 3a contacts the range including the defect 2a is while the coating needle 12 is pressing the film 3, and the correction paste 13 is in the film 3 and the substrate 1 (near the defect 2a). The coating needle 12 is retracted upward before flowing into the gap due to capillary action. If the application needle 12 is separated from the film 3, the film 3 returns to its original state due to the elasticity of the film 3, and the film 3 in a minute range including the hole 3a is separated from the defect portion 2a. Therefore, the time for the film 3 to contact the substrate 1 is very short.

  FIG. 11 is a cross-sectional view showing a state where the application needle 12 is retracted upward. In FIG. 11, the film 3 has returned to the state separated from the substrate 1, and the correction layer 13A having substantially the same shape as the shape of the hole 3a remains in the defect portion 2a. Further, the correction paste 13 applied in excess remains on the surface of the film 3. Thus, since the film 3 having the groove 3b around the hole 3a is used as a mask, the correction paste 13 is sucked into the gap between the film 3 and the substrate 1 due to a capillary phenomenon, and enters the outside of the groove 3b. In synergy with the effect of not performing, it is possible to stably obtain the correction layer 13A (pattern) finer than the application shape by the application needle 12.

  The applied correction paste 13 is subjected to ultraviolet curing, heat curing, or drying according to the specifications of the correction paste 13. The curing process may be performed in the state shown in FIG. 11, or the curing process may be performed after the film 3 is removed from above the defect portion 2a.

  If the defect portion 2a is corrected by such a method, the applied correction paste 13 is not sucked into the gap between the substrate 1 and the film 3 by capillary action, and the substrate 1 extends over a wider area than the hole 3a. No worries about polluting. Further, since the film 3 is completely separated from the defective portion 2a and the substrate 1 when the application is completed, when the film 3 is removed in the subsequent process, the film 3 contacts the correction layer 13A and is corrected. There is no worry of breaking the layer 13A.

  When the gap between the film 3 and the substrate 1 is as small as several tens of μm, the fixing roller 8 may come into contact with the substrate 1. Therefore, holding means for holding the fixing rollers 8 and 9 so as to be movable up and down is provided. It may be provided.

  When the fixed rollers 8 and 9 are provided so as to be movable up and down, as shown in FIG. 12, the fixed roller 8 has a two-stage shape in which a small-diameter portion 8a and a large-diameter portion 8b are arranged on the same axis. The film 3 is brought into contact with the portion 8a, and the large diameter portion 8b is brought into contact with the substrate 1. The fixed roller 9 is configured in the same manner as the fixed roller 8. In this case, the gap G is a dimension obtained by subtracting the film thickness of the film 3 from the radius difference between the large diameter portion 8b and the small diameter portion 8a. According to this method, the gap between the film 3 and the substrate 1 can be easily adjusted.

  In the second embodiment, the film 3 is arranged in a state of being floated from the substrate 1, and the minute holes including the holes 3 a formed in the film 3 are only pressed while the holes 3 a formed in the film 3 and the periphery thereof are pushed by the application needle 12. Since the range is in contact with the defective portion 2a and the substrate 1 in the vicinity thereof, the correction paste 13 can be prevented from entering the gap between the substrate 1 and the film 3, and the shape is almost the same as the shape of the hole 3a stably. The fine pattern can be obtained.

  Hereinafter, various modifications of the second embodiment will be described. In the modified example of FIG. 13, a recess 3e is formed on the surface of the film 3 that contacts the substrate 1, a hole 3a is formed in the approximate center of the recess 3e, and a groove 3b is formed in the recess 3e so as to surround the hole 3a. . The width W and the depth D of the recess 3e are set in a range in which the film 3 is deformed when applied, and a minute range of the film 3 including the hole 3a can adhere to the defect 2a. For example, in the case of the film 3 having a thickness of 12.5 μm, the width W is about 100 μm to 300 μm, and the depth D is about 1 μm to 5 μm. The recess 3e may be processed into the film 3 in advance, and laser or mechanical means (for example, transfer of a mold) is used as the processing means. In addition, the recessed part 3e may be formed continuously in the extending direction of a film, and may be formed intermittently.

  FIG. 14 shows a state in which the hole 3a and the groove 3b are formed in the film 3 shown in FIG. 13, and then the film 3 is arranged on the substrate 1 with the hole 3a aligned with the defective portion 2a. Thus, since the recessed part 3e was formed in the side which touches the board | substrate 1 of the film 3, the hole 3a and the defect part 2a can be made to oppose with a fixed clearance gap only by placing the film 3 on the board | substrate 1 directly. . In this case, the film 3 may be in a relaxed state without applying a certain tension. Since the application method of correction paste 13 is the same as the method shown in FIG. 10, the description thereof will not be repeated. This also applies to the following modified example.

  FIG. 15A is a plan view showing another modification of this embodiment, and FIG. 15B is a cross-sectional view taken along the line XVB-XVB in FIG. In this modification, a rectangular recess 3f is formed in the center of the surface of the film 3 that contacts the substrate 1, a hole 3a is formed in the approximate center of the recess 3f, and the groove 3b is formed so as to surround the hole 3a in the recess 3f. It is formed. The area and depth of the recess 3f are set in such a range that the film 3 is deformed when applied with the application needle 12, and the film 3 in a minute range including the hole 3a can adhere to the periphery of the defective portion 2a of the substrate 1. The The recess 3f is formed by the method shown in FIG. 4A, for example, by laser ablation. In addition, the recess 3f may be formed in the film 3 in advance by a mechanical method such as transfer of a mold.

  FIG. 16 is a cross-sectional view showing still another modification of this embodiment. In FIG. 16, a spacer 17 is interposed between the film 3 having the hole 3a and the substrate 1 so that the hole 3a and the defect 2a can be opposed to each other with a certain gap. As the spacer 17, the same film as the film 3 may be used.

  15A and 15B and the modification example of FIG. 16 are combined, the spacer 17 is disposed on the substrate 1, and the film 3 having the recess 3 f is disposed on the spacer 17. The hole 3a and the defect 2a may be opposed to each other with a certain gap.

  FIG. 17A is a plan view showing still another modified example of this embodiment, and FIG. 17B is a cross-sectional view taken along line XVIIB-XVIIB in FIG. In this modified example, the film 19 is formed by superimposing the film 3 on the film 18 having the holes 18a opened at regular intervals. The films 3 and 18 are, for example, polyimide films having a thickness of 12.5 μm. The film 19 is wound, for example, in a roll shape. The hole 18a is formed sufficiently larger than the defect 2a by a press, a laser, or the like. A hole 3a and a groove 3b are formed in the film 3 substantially in the center of the hole 18a, and the films 18 and 3 are disposed on the substrate 1 with the hole 3a aligned with the defect 2a. The film 18 serves as a spacer, and the hole 3a and the defect 2a are opposed to each other with a certain gap. In this modified example, since it is not necessary to form the recess 3f shown in FIGS. 15A and 15B, dust generated when the recess 3f is formed can be eliminated, and the processing time can be shortened. Can do.

  In the above-described first and second embodiments and modified examples, the case where the linear defect 2a is corrected has been described. However, it goes without saying that the hole 3a having a shape corresponding to the defective portion can be corrected by opening the film 3.

  4 (a) and 4 (b) show how to support the film 3, but as shown in FIG. 18, the film 3B is stretched substantially parallel to the substrate 1 and positioned upward, and folded downward. The film 3A to be stretched may be twisted so that it does not overlap vertically. In this case, the fixed rollers 8 and 9 are not parallel but have an angle. By doing so, a portion where the film 3B does not exist is formed above the film 3A, so that interference with the coating means can be avoided. After the hole 3a is processed at the position of the film 3B, the hole 3a is moved to the position of the film 3A by winding the film 3. However, since the hole 3a is twisted at the folded portion of the film 3, the hole 3a is rotated. The rotation of the hole 3a is corrected by correcting the processing direction of the hole 3a or by rotating the film supply unit.

  In addition, laser processing may be performed from the substrate 1 side without folding the film 3.

  Further, according to the above pattern correction method, a thin line pattern can be easily formed. For example, in a place where pattern formation of 10 μm or less is required, such as electrode correction of a TFT (thin film transistor) panel of a liquid crystal panel. Can be applied. In addition to the electrodes, the black matrix of the liquid crystal color filter has a line width of less than 20 μm with higher definition, and can be applied to this correction.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

It is a figure which shows the pattern correction method by Embodiment 1 of this invention. It is a figure which shows the board | substrate shown in FIG. It is a figure which shows the surface at the side of the board | substrate of the film shown in FIG. It is sectional drawing which shows the process of forming a hole and a groove | channel in the film shown in FIG. It is sectional drawing which shows the process of apply | coating correction paste to a defect part through the hole of the film shown in FIG. It is sectional drawing which shows the process of hardening the correction paste apply | coated to the defective part. It is a figure which shows the state which removed the film shown in FIG. 6 is a diagram illustrating a modification example of the first embodiment. FIG. It is a figure which shows the pattern correction method by Embodiment 2 of this invention. It is sectional drawing which shows the process of apply | coating correction paste to a defective part through the hole of the film shown in FIG. It is sectional drawing which shows the state which retracted the application needle | hook shown in FIG. It is sectional drawing which shows the method of making the film shown in FIG. 9 confront a board | substrate. It is a figure which shows the example of a change of Embodiment 2. FIG. It is sectional drawing which shows the state which has arrange | positioned the film shown in FIG. 13 on the board | substrate. It is a figure which shows the other example of a change of Embodiment 2. FIG. It is a figure which shows the other example of a change of Embodiment 2. FIG. It is a figure which shows the other example of a change of Embodiment 2. FIG. It is a figure which shows the example of a change of Embodiment 1,2.

Explanation of symbols

  1 substrate, 2 electrode, 2a open defect part, 3, 3A, 3B, 18 film, 3a, 18a hole, 3b groove, 3c partition, 3e, 3f recess, 3P film surface, 4 laser part, 5 observation optical system, 6 Objective lens, 7 processing table, 8-10 fixed roller, 8a small diameter part, 8b large diameter part, 11 shielding plate, 12 application needle, 12a flat surface, 13 correction paste, 13A correction layer, 14 curing unit, 15 micro dispenser, 16 coating nozzles, 17 spacers.

Claims (10)

In the pattern correction method of covering the defect portion of the fine pattern formed on the substrate with a film and applying a correction liquid to the defect portion through the hole of the film,
A groove for preventing the correction liquid from spreading between the film and the substrate by capillary action is formed on the substrate side surface of the film so as to surround the hole. How to fix. In a pattern correction method for correcting a defective portion of a fine pattern formed on a substrate,
A hole is formed in the film in a shape corresponding to the defect portion, and a groove is formed so as to surround the hole,
Directing the groove side surface of the film to the substrate side, aligning the holes in the defect and placing the film on the substrate;
Applying correction fluid to the defect through the hole,
The pattern correction method, wherein the groove prevents the correction liquid from spreading between the film and the substrate by capillary action.   The pattern correction method according to claim 2, wherein the groove is formed in a ring shape.   After irradiating a laser beam from above the film to form the hole and the groove in the film, the front and back of the film are reversed so that the groove side surface of the film faces the substrate side. The pattern correction method according to claim 2 or 3, wherein:   The pattern correction method according to claim 2, wherein a partition wall exists between the groove and the hole. The hole and the defective part are opposed to each other with a gap,
The film is pressed against the substrate in a predetermined range including the hole, and the correction liquid is applied to the defective portion through the hole.
The pattern correction method according to claim 2, wherein the film is peeled from the substrate by a restoring force of the film.   By forming a recess in the surface of the film on the substrate side, forming the hole and the groove in the recess, aligning the hole and the defect, and contacting the film and the substrate, The pattern correction method according to claim 6, wherein the hole and the defect portion are opposed to each other with a gap.   A spacer is disposed in the vicinity of the defect portion, the hole is aligned with the defect portion, and the film is disposed on the spacer, thereby allowing the hole and the defect portion to face each other with a gap. The pattern correction method according to claim 6, wherein the pattern correction method is a feature.   A recess is formed on the substrate side surface of the film, the hole and the groove are formed in the recess, a spacer is disposed in the vicinity of the defect portion, and the hole is aligned with the defect portion. The pattern correction method according to claim 6, wherein the hole and the defect portion are opposed to each other with a gap formed by disposing a film on the spacer. In the pattern correction apparatus for covering the defect portion of the fine pattern formed on the substrate with a film and applying the correction liquid to the defect portion through the hole of the film,
A groove for preventing the correction liquid from spreading between the film and the substrate by capillary action is formed on the substrate side surface of the film so as to surround the hole. Correction device.

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