JP2008011471A - Piezoelectric oscillator - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a small-sized piezoelectric oscillator which is easily handled and also improved in productivity. <P>SOLUTION: In the piezoelectric oscillator constituted of a piezoelectric vibrator 14 and a semiconductor circuit component 37 housing in a sealed container 1 a piezoelectric vibrating chip 8 formed with an exciting electrode 12 on a piezoelectric blank 11, an electrode surface of the semiconductor circuit component 37 is packaged in a lower portion of the piezoelectric vibrator 14, an input/output terminal 9 of the piezoelectric vibrator 14 and the semiconductor circuit component 37 are directly electrically connected, and an electrode terminal 38 is drawn around from the electrode surface of the semiconductor circuit component 37 through a lead frame 31 to a rear side of the semiconductor circuit component 37. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a piezoelectric oscillator used in an electronic device such as a portable communication device.

  Conventionally, piezoelectric oscillators have been used in electronic devices such as portable communication devices.

  As such a conventional piezoelectric oscillator, for example, as shown in FIG. 4, the first container 23 in which a piezoelectric vibrating piece is accommodated is contained in the cavity portion 25, although not shown in the drawing. A structure having a structure attached to a second container 21 in which an electronic component element such as a semiconductor circuit component 26 or a capacitor for controlling an oscillation output based on vibration of a piezoelectric vibrating piece is accommodated is known. The piezoelectric oscillator is mounted on the external wiring board by placing the electrode terminal on the external wiring board such as a mother board and soldering the electrode terminals provided on the lower surface of the second container 21 to the wiring of the external wiring board. The

  The first container 23 and the second container 21 are usually formed of a ceramic material, and a wiring conductor is formed inside or on the surface, and a conventionally known ceramic green sheet lamination method or the like is adopted. It is manufactured by.

The semiconductor circuit component 26 is provided with a temperature compensation circuit for correcting the oscillation frequency of the piezoelectric oscillator based on temperature compensation data created according to the temperature characteristics of the piezoelectric vibrating piece. After assembling the oscillator, in order to store the temperature compensation data in the memory of the semiconductor circuit component 26, the temperature compensation control terminal 27 for writing the temperature compensation data is provided on the lower surface and the outer surface of the second sealed container 21. Was provided. The temperature compensation data is stored in the memory of the semiconductor circuit component 26 by applying the probe needle of the temperature compensation data writing device to the temperature compensation control terminal 27 and inputting the temperature compensation data into the memory in the semiconductor circuit component 26. The
JP, 2004-228895, A In addition to the prior art documents specified by the prior art document information described above, the applicant did not find prior art documents related to the present invention by the time of filing of the present application. .

  However, when the piezoelectric oscillator is downsized, the semiconductor circuit component 26 accommodated in the second container 21 needs to be downsized, but there is a limit to downsizing of the semiconductor circuit component 26. Therefore, the conventional structure of the second container 21 makes it difficult to accommodate the semiconductor circuit component 26, which has been an obstacle to miniaturization of the piezoelectric oscillator.

  The present invention has been conceived in view of the above-described drawbacks. Accordingly, an object of the present invention is to provide a small piezoelectric oscillator that is easy to handle and excellent in productivity.

The piezoelectric oscillator according to the present invention is a piezoelectric oscillator including a piezoelectric vibrator in which a piezoelectric vibrating piece in which an excitation electrode is formed on a piezoelectric base plate is housed in a sealed container and a semiconductor circuit component, and the semiconductor below the piezoelectric vibrator. An electrode surface of the circuit component is mounted, and the input / output end of the piezoelectric vibrator and the semiconductor circuit component are directly electrically connected, and the electrode surface of the semiconductor circuit component is connected to the electrode surface via a lead frame. An electrode terminal is routed around the back surface of the semiconductor circuit component.

The piezoelectric oscillator according to the present invention has the above-described configuration, wherein the piezoelectric vibrator and the semiconductor circuit component are electrically connected by a conductive member.

  According to the piezoelectric oscillator of the present invention, in a piezoelectric oscillator composed of a piezoelectric vibrator in which a piezoelectric vibrating piece having an excitation electrode formed on a piezoelectric base plate is housed in a sealed container, and a semiconductor circuit component having an oscillation circuit, The electrode surface of the semiconductor circuit component is mounted on the lower part of the element, and the input / output ends of the piezoelectric vibrator and the semiconductor circuit component are directly connected to each other, and the electrode surface of the semiconductor circuit component is connected via a lead frame. Thus, since the electrode terminals are routed around the back surface of the semiconductor circuit component, it is possible to eliminate the need for a container for housing the semiconductor circuit component, which is necessary for a piezoelectric oscillator having a conventional structure.

  Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. In addition, the same code | symbol in each figure shall show the same object.

  FIG. 1 is a sectional view of a piezoelectric oscillator according to an embodiment of the present invention. The piezoelectric oscillator shown in FIG. 1 generally includes a hermetic container 1, a piezoelectric vibrating piece 8, and a semiconductor circuit component 37. In the piezoelectric oscillator illustrated in FIG. 1, input / output terminals 9 are provided at four corners of the bottom surface of the sealed container 1 in the sealed container 1 in which the piezoelectric vibrating piece 8 is accommodated in the cavity portion 10. The input / output end 9 has a structure in which a semiconductor circuit component 37 is mounted on the lower surface of the sealed container 1. Further, the input / output end 9 of the sealed container 1 and the semiconductor circuit component 37 are directly electrically connected, and the electrode surface of the semiconductor circuit component 37 is connected to the back surface of the semiconductor circuit component 37 via the lead frame 31. The electrode terminal 38 is routed around.

  FIG. 2 is a top view of the electrode surface of one semiconductor circuit component 37 cut from the lead frame 31 of FIG. FIG. 3 is a top view before the semiconductor circuit component 37 is mounted on the lead frame 31.

  In FIG. 1, a sealed container 1 includes, for example, a substrate 2 made of a ceramic material such as glass-ceramic and alumina ceramic, a side wall 3 made of a ceramic material similar to the substrate 2, and a lid 4 made of alloy, copal, phosphor bronze, or the like. The side wall 3 is attached to the upper surface of the substrate 2, and the lid 4 is placed and fixed on the upper surface of the substrate 2 to form the hermetic container 1, and the upper surface of the substrate 2 located inside the side wall 3 is electrically conductive. The piezoelectric vibrating piece 8 is mounted via the adhesive 13. The hermetic container 1 accommodates the piezoelectric vibrating reed 8 in its inside, specifically, in a cavity portion 10 surrounded by the upper surface of the substrate 2, the inner surface of the side wall 3, and the lower surface of the lid 4, and hermetically seals. Is for.

  On the other hand, the piezoelectric vibrating reed 8 accommodated in the cavity portion 10 of the sealed container 1 is formed by attaching and forming a pair of excitation electrodes 12 on both main surfaces of the piezoelectric vibrating reed 8 cut along a predetermined crystal axis. When a variable voltage from the outside is applied to the piezoelectric vibrating piece 8 via the pair of excitation electrodes 12, thickness shear vibration is caused at a predetermined frequency.

  On the other hand, as shown in FIGS. 1 and 2, input / output terminals 9 are formed at the four corners on the lower surface of the substrate 2 described above. At positions corresponding to the input / output terminals 9 at the four corners, connection terminals 33 of flip-chip type semiconductor circuit components 37 formed in a rectangular shape are formed, and the connection terminals 33 of the semiconductor circuit components 37 and the substrate 2 are formed. The input / output terminal 9 is connected via a conductive adhesive 36. Here, in the wiring on the electrode surface of the semiconductor circuit component 37, the electrodes corresponding to the electrode terminals 38 on the back surface of the semiconductor circuit component 37 are electrically connected via the lead frame 31 on the side surface of the semiconductor circuit component 37. Further, as shown in FIG. 2, a temperature compensation control terminal 34 is formed on the side surface of the semiconductor circuit component 37.

  Here, the semiconductor circuit component 37 has, on its electrode surface, a temperature sensing element that detects the ambient temperature state, and a temperature compensation control terminal 34 that compensates for the temperature characteristics of the piezoelectric vibrating piece 8. Are provided with a temperature compensation circuit that corrects the vibration characteristics of the piezoelectric vibrating piece 8 according to a temperature change based on the temperature compensation data written in, and an oscillation circuit that is connected to the temperature compensation circuit and generates a predetermined oscillation output. The oscillation output generated by the oscillation circuit is output to the outside and then used as a reference signal such as a clock signal. Here, the piezoelectric vibrating piece 8 and the semiconductor circuit component 37 are connected by a metallized wiring 15 provided in the inner layer of the substrate 2 shown in FIG.

  FIG. 3 is a top view before the lead frame 31 of the piezoelectric vibrator 14 according to the embodiment of the present invention is cut from the assembled state.

Next, a manufacturing method of the above-described piezoelectric oscillator will be described with reference to FIGS. 2 and 3 which are embodiments of the present invention. First, as shown in FIG. 3, a lead frame 31 in an assembled state arranged in a matrix of m columns × n rows (m and n are natural numbers of 2 or more) is prepared. Next, a semiconductor circuit component 37 in which solder bumps 32 are formed on the lead frame 31 as shown by dotted lines in FIG. 3 is mounted. Thereafter, the solder bump 32 of the semiconductor circuit component 37 and the lead frame 31 are electrically connected by passing through a reflow furnace or the like. Next, the lead frame 31 is cut as shown in FIG. Thereafter, the temperature compensation control terminal 34 and the electrode terminal 38 are bent so as to be in a predetermined position.
Accordingly, the temperature compensation control terminal 34 is disposed on the side surface of the semiconductor circuit component 37, and the electrode terminal 38 is disposed and formed on the back surface of the semiconductor circuit component 37. Finally, the connection terminal 33 of the semiconductor circuit component 37 wired on the lead frame 31 and the input / output end 9 of the piezoelectric vibrator 14 are electrically connected by the conductive member 36 to complete the piezoelectric oscillator of the present invention. .

  The semiconductor circuit component 37 has temperature compensation data for compensating the temperature characteristics of the temperature sensing element for detecting the ambient temperature state and the piezoelectric vibrating piece 8 on its electrode surface, and the piezoelectric vibrating piece 8 based on the temperature compensation data. The bit data is input from the temperature compensation control terminal 34 to the semiconductor circuit component 37 having a temperature compensation circuit that corrects the vibration characteristics of the piezoelectric oscillator according to the temperature change so that the specification of the piezoelectric oscillator becomes a desired numerical value. Write.

  Here, the characteristic part of the present invention is that, as shown in FIG. 1, the input / output end 9 of the piezoelectric vibrator 14 and the connection terminal 33 of the semiconductor circuit component 37 are electrically connected, and the electrode surface of the semiconductor circuit component 37 is electrically connected. The electrode terminal 38 is routed around the back surface of the semiconductor circuit component 37 via the lead frame 31. As a result, further miniaturization of the piezoelectric oscillator progresses, and even if the piezoelectric vibrator 14 and the semiconductor circuit component 37 have the same size, a small piezoelectric oscillator can be manufactured.

Further, as described above, since a series of assembly operations of the piezoelectric oscillator can be completed with the assembled state of the lead frames 31, the productivity of the piezoelectric oscillator can be improved.

In addition, this invention is not limited to the above-mentioned embodiment, A various change, improvement, etc. are possible in the range which does not deviate from the summary of this invention.

For example, in the above-described embodiment, the electrode terminal 38 on the back surface of the semiconductor circuit component 37 is directly connected to the external wiring board. Instead, the electrode terminal 38 is connected to the external wiring via a pedestal or the like. It does not matter as a structure connected to the substrate side. Needless to say, this case is also included in the technical scope of the present invention.

1 is a schematic cross-sectional view of a piezoelectric oscillator according to an embodiment of the present invention. It is a top view of one semiconductor circuit component cut | disconnected from the lead frame of this invention. FIG. 3 is a schematic top view showing an assembly state of lead frames used in the embodiment of the present invention. It is a schematic sectional drawing of the conventional piezoelectric oscillator.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Sealed container 2 ... Board | substrate 3 ... Side wall 4 ... Cover body 8 ... Piezoelectric vibrating piece 9 ... Input / output end 10 ... Cavity part 11 ... Piezoelectric base plate 12 ... Excitation electrode 13 ... Conductive adhesive 14 ... Piezoelectric vibrator
DESCRIPTION OF SYMBOLS 15 ... Metallized wiring 31 ... Lead frame 32 ... Solder bump 33 ... Connection terminal 34 ... Temperature compensation control terminal 36 ... Conductive member 37 ... Semiconductor circuit component 38 ... Electrode terminal

Claims (2)

In a piezoelectric oscillator composed of a piezoelectric vibrator and a semiconductor circuit component in which a piezoelectric vibrating piece in which an excitation electrode is formed on a piezoelectric element plate is housed in a sealed container,
The electrode surface of the semiconductor circuit component is mounted below the piezoelectric vibrator, and the input / output end of the piezoelectric vibrator and the semiconductor circuit component are directly connected to each other, and the electrode of the semiconductor circuit component An electrode terminal is routed from the surface to the back surface of the semiconductor circuit component through a lead frame. 2. The piezoelectric oscillator according to claim 1, wherein the piezoelectric vibrator and the semiconductor circuit component are electrically connected by a conductive member.

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