JP2008004358A - Alignment method, alignment apparatus, and organic el element forming apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an alignment method extremely excellent in practicability which is capable of achieving improvement in accuracy of positioning by offsetting errors due to unique characteristics of the apparatus, and to provide an alignment apparatus as well as an organic EL element forming apparatus. <P>SOLUTION: This is the alignment method of a substrate 1 and a mask 3, in which differences of the coordinates corresponding to a first calculated movement amount in a positioning process and the coordinates after the first actual movement of the substrate 1 or the mask 3 actually moved by a movement means based on this first calculated movement amount are calculated, and by calculating a correction value to offset the differences between the coordinates corresponding to this calculated movement amount and the coordinates after the actual movement, the first calculated movement amount in the positioning process is corrected by using this correction value. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an alignment method, an alignment apparatus, and an organic EL element forming apparatus.

  For example, as disclosed in Patent Document 1, when forming an organic EL thin film in a predetermined pattern on a substrate, there is a technique for forming a film in a state in which a mask on which a predetermined pattern is formed is in close contact with the substrate. .

  At this time, before the substrate and the mask are brought into close contact with each other, the alignment mark on the substrate side and the alignment mark on the mask side are recognized by a CCD camera or the like to detect the relative distance (position shift amount). The substrate (or mask) is moved relatively in a plane parallel to the mask surface (or substrate surface) and the alignment marks are aligned to adjust the alignment between the substrate and the mask. (Or the mask) is moved in the vertical direction, and the mask is adhered to the substrate surface by a magnet mechanism or the like, so that the mask is brought into close contact with the substrate.

JP-A-11-158605

  By the way, at the time of the alignment adjustment, it is usually necessary to perform the detection of the relative distance and the alignment by moving the substrate or the mask in parallel several times.

  This is due to the characteristic of the device of the drive mechanism that drives the alignment table that moves the substrate or mask while holding it, and the amount of positional deviation detected and detected by a CCD camera, etc. This is considered to be because there is a difference in the actual amount of movement of the substrate or the like by the drive mechanism that is driven based on this.

  For example, in the alignment table A provided with the ball screw mechanisms for driving in the X1, X2, and Y-axis directions as shown in FIG. 1, the table B is arranged symmetrically with the ball screw mechanisms for driving the X1-axis and the X2-axis. The amount of movement of the table B (alignment mark) is different (non-linear) between the case where they are driven and moved simultaneously and the case where they are driven and moved individually. Further, since the ball screw mechanism for driving the Y-axis is often arranged offset from the rotation center O as shown in FIG. 1, when the table B is moved in the Y-axis direction, the rotation component C (twist) is generated. Movement occurs and loses symmetry. In addition, any distortion included in the device and backlash of the ball screw are considered to be the causes of the device-specific characteristics.

  Furthermore, after the alignment adjustment, when the substrate and the mask are brought into close contact with each other, a slight positional deviation occurs between the substrate and the mask. In some cases, the mask is displaced beyond the allowable range (both alignment mark positions). In this case, it is necessary to perform alignment adjustment again.

  The present invention has been made in view of the current situation as described above, and can offset errors caused by characteristics inherent in the apparatus to improve the alignment accuracy, and can reduce the number of times of driving the substrate or mask for alignment. The present invention provides an alignment method, an alignment apparatus, and an organic EL element forming apparatus that are excellent in practicality and that can shorten the adjustment time and can cancel the positional deviation at the time of close contact between the substrate and the mask.

  The gist of the present invention will be described with reference to the accompanying drawings.

  The substrate 1 and the mask 3 are relatively moved by the moving means so that both the substrate-side alignment mark 2 provided on the substrate 1 and the mask-side alignment mark 4 provided on the mask 3 can be recognized by the optical means, Using the image data recognized by the optical means, a movement amount necessary for alignment between the substrate side alignment mark 2 and the mask side alignment mark 4 is calculated, and the movement means is controlled based on the calculated movement amount. The alignment process for moving the substrate 1 or the mask 3 is performed once or a plurality of times to adjust the alignment between the substrate 1 and the mask 3, and the substrate 1 and the mask 3 are brought into close contact with each other. The alignment method includes a coordinate according to a first calculated movement amount in the alignment step, and a first calculated movement. The difference between the substrate 1 or the mask 3 actually moved by the moving means on the basis of the coordinates after the first actual movement is calculated, and the coordinates corresponding to the calculated movement amount and the coordinates after the actual movement are calculated. A correction value that cancels the difference between the first and second positions is calculated, and the first calculated movement amount in the alignment step is corrected using the correction value. Based on the correction calculated movement amount corrected by the correction value, the correction value is corrected. According to the alignment method, the substrate 1 or the mask 3 is moved by a moving means.

  2. The alignment method according to claim 1, wherein the correction value is calculated a plurality of times, and the calculated movement amount is corrected using an average value of the correction values calculated a plurality of times.

  3. The alignment method according to claim 2, wherein the calculated movement amount is corrected using an average value of the correction values of a plurality of latest times.

  In addition, a large number of the correction values are calculated and stored for each calculated movement amount, and one of the calculated and stored values for each calculated movement amount according to the first calculated movement amount in the alignment step. It corrects using a correction value, It concerns on the alignment method of any one of Claims 1-3 characterized by the above-mentioned.

  Further, when the correction value is calculated and the alignment adjustment is performed so that the substrate 1 and the mask 3 are brought into close contact with each other, the substrate-side alignment mark 2 and the mask before contact are obtained using image data recognized by the optical means. The positional deviation amount difference between the positional deviation amount with respect to the side alignment mark 4 and the positional deviation amount between the substrate side alignment mark 2 and the mask side alignment mark 4 after contact is calculated, and the positional deviation amount difference is offset. After calculating the mechanical offset amount and controlling the moving means using the mechanical offset amount to correct the relative position between the substrate 1 and the mask 3 before adhesion after the alignment adjustment, the substrate 1 5. The alignment method according to claim 1, wherein the mask and the mask are brought into close contact with each other.

  Further, the mechanical offset amount is calculated a plurality of times, and an average value of the mechanical offset amounts calculated a plurality of times is used to correct the relative position between the substrate 1 and the mask 3 before adhesion after the alignment adjustment. 6. The alignment method according to claim 5, wherein:

  A moving means for relatively moving the substrate 1 and the mask 3; and an optical means for imaging and recognizing the substrate-side alignment mark 2 provided on the substrate 1 and the mask-side alignment mark 4 provided on the mask 3; The moving amount calculating means for calculating the moving amount necessary for alignment between the substrate side alignment mark 2 and the mask side alignment mark 4 using the image data obtained by the optical means, and the moving amount calculating means The alignment according to claim 1, further comprising: a control unit that controls the moving unit based on the calculated calculated movement amount; and an adhesion unit that closely contacts the substrate 1 and the mask 3. The present invention relates to an alignment apparatus that performs alignment between the substrate 1 and the mask 3 using a method.

  The present invention also relates to an organic EL element forming apparatus comprising the alignment apparatus according to claim 7.

  Since the present invention is configured as described above, it is possible to improve the alignment accuracy by offsetting errors caused by the characteristics inherent in the apparatus, and reduce the number of times of driving the substrate or mask to shorten the alignment adjustment time. In addition, an alignment method, an alignment apparatus, and an organic EL element forming apparatus that are excellent in practicality and that can offset a positional shift at the time of close contact between the substrate and the mask.

  Embodiments of the present invention that are considered suitable (how to carry out the invention) will be briefly described with reference to the drawings, illustrating the operation of the present invention.

  The substrate 1 and the mask 3 are relatively moved so that both the substrate-side alignment mark 2 and the mask-side alignment mark 4 can be recognized by the optical means, and both alignments are performed using the image data recognized by the optical means. When the movement amount necessary for the alignment of the marks 2 and 4 is calculated and the substrate 1 or the mask 3 is moved by the moving means based on the calculated movement amount, the calculated movement amount and the substrate 1 or the mask 3 are actually A difference from the actual movement amount moved is calculated, and a first calculated movement amount calculated in the subsequent alignment process is corrected using a correction value that cancels the difference.

  That is, for example, when a moving means having a drive mechanism as shown in FIG. 1 is adopted, the moving amount necessary for alignment is determined from the relative distance (position shift amount) between the alignment marks 2 and 4 recognized by the optical means. Are calculated as X1 = 100, X2 = 100, and Y = 100, and the driving mechanism of the moving means is driven according to the calculated movement amount to the coordinates corresponding to the calculated movement amount. Assuming that the movement correction amount of X1 = + 10, X2 = −8, and Y = + 5, the first calculated movement calculated in the subsequent alignment process so as to cancel out these movement correction amounts. As a correction value, (calculated movement amount / (calculated movement amount−movement correction amount)), that is, X1 = 100 / (100−10), X2 = 100 / (100 + 8), Y = 100 / (100−5) ) To.

  By moving the substrate 1 or the mask 3 using the correction calculated movement amount corrected by the correction value, the characteristic characteristic of the apparatus can be canceled during the alignment process, and the smaller number of the substrate 1 or the mask 3 is obtained. Thus, the alignment marks 2 and 4 can be aligned with the number of movements, and the alignment time can be shortened accordingly.

  That is, for example, before performing this process, alignment adjustment is performed using a substrate transported preliminarily to calculate the correction value, and correction is performed using this correction value at the time of this process. Alignment adjustment is possible.

  Further, for example, by calculating the correction value a plurality of times and correcting the calculated movement amount using an average value of the correction values calculated a plurality of times, it is possible to perform more precise alignment. In particular, by correcting the calculated movement amount using an average value of the most recent correction values set in advance, it is possible to select a correction value in the state of the latest process, and it is possible to perform a correction that matches the current situation. Become.

  In addition, for example, a large number of the correction values are calculated and stored for each calculated movement amount, and any of the calculated and stored values for each calculated movement amount according to the first calculated movement amount in the alignment step. (For example, the case where the calculated movement amount is X1 = 100, X2 = 100, Y = 100 differs from the case where X1 = 110, X2 = 100, Y = 100). By performing correction using the correction value), more precise alignment is possible.

  Further, for example, when the correction value is calculated and the alignment adjustment is performed so that the substrate 1 and the mask 3 are brought into close contact with each other, the substrate side alignment mark 2 before contact is obtained using image data recognized by the optical means. And a positional deviation amount between the mask side alignment mark 4 and a positional deviation amount between the substrate side alignment mark 2 and the mask side alignment mark 4 after contact are calculated, and this positional deviation amount difference is calculated. After calculating the mechanical offset amount to be canceled and controlling the moving means using this mechanical offset amount, after correcting the relative position between the substrate 1 and the mask 3 before adhesion after the alignment adjustment, By causing the substrate 1 and the mask 3 to be in close contact with each other, it is possible to cancel the positional deviation that occurs when the substrate 1 and the mask 3 are in close contact with each other. Adjustment frequency can be lowered to perform the highly accurate alignment can be performed in a short time.

  Specific embodiments of the present invention will be described with reference to the drawings.

  In this embodiment, the substrate 1 and the mask 3 are relatively moved by the moving means so that both the substrate-side alignment mark 2 provided on the substrate 1 and the mask-side alignment mark 4 provided on the mask 3 can be recognized by the optical means. The movement amount necessary for alignment between the substrate side alignment mark 2 and the mask side alignment mark 4 is calculated using the image data recognized by the optical means, and based on the calculated movement amount, the movement amount is calculated. After adjusting the alignment between the substrate 1 and the mask 3 by performing a positioning step of controlling the moving means to move the substrate 1 or the mask 3 once or a plurality of times, An alignment method for bringing the mask 3 into close contact, the coordinates corresponding to the first calculated movement amount in the positioning step, and the first time Based on the calculated movement amount, the difference between the first actual movement of the substrate 1 or the mask 3 actually moved by the moving means is calculated, and the coordinates corresponding to the calculated movement amount and the actual A correction value that cancels the difference from the coordinate after movement is calculated, and the first calculated movement amount in the alignment step is corrected using this correction value, and the corrected calculated movement amount corrected by this correction value The alignment apparatus uses an alignment method for moving the substrate 1 or the mask 3 by the moving means based on the above.

  Specifically, in this embodiment, a moving means for relatively moving the substrate 1 and the mask 3 and a substrate-side alignment mark 2 provided on the substrate 1 and a mask-side alignment mark 4 provided on the mask 3 are provided. Optical means for imaging and recognizing, and movement amount calculating means for calculating a movement amount necessary for alignment between the substrate side alignment mark 2 and the mask side alignment mark 4 using image data obtained by the optical means And a control means for controlling the movement means based on the calculated movement amount calculated by the movement amount calculation means, and an adhesion means for bringing the substrate 1 and the mask 3 into close contact with each other.

  Further, the movement amount calculating means is a first calculation movement amount of the first time in the alignment step and a first time of the substrate 1 or the mask 3 actually moved based on the first calculation movement amount. A difference from the actual movement amount is calculated, and the first calculated movement amount in the alignment step is corrected using a correction value that cancels out the difference between the calculated movement amount and the actual movement amount. The control means is configured to control the moving means based on the correction calculated movement amount corrected by the correction value.

  Each part will be specifically described.

  As the substrate 1, a general glass substrate is used. As the mask 3, a general metal mask is used. In the present embodiment, a cross-shaped substrate-side alignment mark 2 is provided on the substrate 1, and an annular mask-side alignment mark 4 is provided on the mask 3, and the cross-shaped substrate-side alignment mark 3 is provided in the annular mask-side alignment mark 4. By just being accommodated, it sets so that the board | substrate 1 and the mask 3 may be in an appropriate superposition | polymerization state.

  As a moving means, a mask holder for holding the mask 3 is provided on the alignment table A as shown in FIG. 1, and the mask holder is used as a mask holder with respect to the substrate 1 held by an appropriate substrate holding mechanism such as an arm mechanism. The held mask 3 is moved by the table B of the alignment table A so that the mask 3 and the substrate 1 are aligned.

  The alignment table A is configured to move in the X1, X2, and Y axis directions by the ball screw mechanisms for driving the X1, X2, and Y axes, respectively. The ball screw mechanism is a ball screw that is screwed with a nut provided on the back surface of the table B. And a servo motor that rotationally drives the ball screw, and the servo motor is connected to a computer having control means.

  As the optical means, a CCD camera is adopted. The CCD camera is connected to a computer having the movement amount calculating means and the control means, and an image recognized by the CCD camera is processed as image data in the computer. That is, as in the prior art, it is possible to employ a configuration in which an image recognized by a CCD camera is processed using a computer and automatically aligned.

  Specifically, in order to detect the relative distance (position shift amount) from the position (coordinates) between the substrate side alignment mark 2 and the mask side alignment mark 4, both alignment marks 2 and 4 (the center positions thereof) are matched. The movement amount calculation means is configured to calculate the movement amount of the mask 3 necessary for the movement, each servo motor is driven using the calculated movement amount, and the mask 3 is moved in a plane parallel to the surface of the substrate 1. The control means is configured so as to make it possible.

  Further, the movement amount calculating means calculates a difference between the calculated movement amount and an actual movement amount when the mask 3 is actually moved using the calculated movement amount, and the calculated movement amount and the actual movement. A correction value that exactly cancels the difference from the amount is calculated, and the first calculated movement amount in the alignment step can be corrected by this correction value.

  That is, the calculated movement amount for the first time in the alignment process has a particularly large error (about a dozen μm). Therefore, the alignment process has to be repeated a plurality of times. The error in the first alignment can be kept within an allowable range of several μm, and it is not necessary to perform the alignment process a plurality of times as in the prior art, and the substrate 1 can be moved by a single movement of the mask. And the mask 3 can be aligned.

  For example, as shown in FIG. 2, the amount of movement required for alignment is calculated as X1 = 100, X2 = 100, and Y = 100 from the positional shift amount of both alignment marks 2 and 4 recognized by the optical means ( 2A), the movement correction amount from the coordinate point actually moved by the moving means controlled according to the calculated movement amount to the coordinate corresponding to the calculated movement amount is X1 = + 10, X2 = −8. , Y = + 5, X1 = 100 / (100-10), X2 = 100 / (100 + 8), Y = 100 / (100-5) as correction values so as to cancel out these movement correction amounts. The setting is made (FIG. 2B). Then, the drive mechanism of the moving means is driven in accordance with the corrected calculated movement amount obtained by multiplying the first calculated movement amount calculated in the subsequent alignment process by the correction value (FIG. 2 (c). )) By aligning the substrate 1 and the mask 3, it is possible to cancel the characteristic of the apparatus and finish the alignment of the substrate 1 and the mask 3 by one movement of the mask (FIG. 2 (d)).

  Further, an average value of correction values calculated a plurality of times may be used as the correction value. In addition to this, it is preferable to employ an average value of the correction values for a predetermined number of times until the previous time. In this way, since the correction value in the latest process state can be adopted, it is possible to make a correction that matches the current situation. Further, a large number of correction values are calculated and stored for each calculated movement amount, and one of the corrections calculated and stored for each calculated movement amount according to the first calculated movement amount in the alignment step. You may set so that it may correct using a value. That is, when the calculated movement amount is X1 = 100, X2 = 100, Y = 100, the correction value a, and when X1 = 110, X2 = 100, Y = 100, the correction value b, X1 = 100, When X2 = 110 and Y = 100, data is accumulated in the computer for each calculated movement amount, such as the correction value c, and a predetermined correction value is used for the predetermined calculated movement amount. good.

  Further, in the present embodiment, the positional deviation amount between the substrate-side alignment mark 2 and the mask-side alignment mark 4 before adhesion after calculating the correction value and performing alignment adjustment, and the substrate-side alignment mark 2 after adhesion. The movement amount calculating means is configured to calculate a positional deviation amount difference between the positional deviation amount between the mask side alignment mark 4 and the mask side alignment mark 4 and to calculate a mechanical offset amount that cancels the positional deviation amount. The control unit is configured to control the moving unit using an offset amount, and the relative position between the substrate 1 and the mask 3 before adhesion after the alignment adjustment using the mechanical offset amount is determined. It can be corrected.

  That is, as shown in FIG. 3, after alignment adjustment (FIG. 3A), when the mask 1 and the substrate 3 are brought into close contact, that is, the substrate 1 is placed on the mask 3 held by the mask holder. At this time, due to the inherent characteristics of the apparatus such as the substrate holding mechanism, the substrate cannot be placed vertically on the mask 3 and a slight displacement S1 occurs (FIG. 3B). If the relative distance of 2 and 4 is within the allowable range, the contact can be made as it is, but if the positional deviation S1 is out of the allowable range, the substrate 1 is separated from the mask 3 again and the position is adjusted. It is necessary to place it.

  In this respect, in this embodiment, the relative position between the substrate 1 and the mask 3 is corrected in advance by taking into consideration the characteristics inherent in the apparatus such as the substrate holding mechanism using the mechanical offset amount S2 that cancels the positional deviation S1. (FIG. 3 (c)), the position of the substrate 1 and the mask 3 can be aligned by the positional deviation that occurs when the substrate 1 and the mask 3 are in close contact (FIG. 3 (d)). It becomes unnecessary and the alignment accuracy is improved.

  Therefore, for example, when this embodiment is provided in an organic EL element forming apparatus, it becomes possible to form an organic EL film or a sealing film with a higher definition pattern, thereby improving the throughput of the alignment process and improving the organic EL element. It is possible to improve the tact time for manufacturing and improve productivity.

  In particular, for example, after assembling the present embodiment, before the alignment is performed in the actual film forming process, the substrate is transported preliminarily, and the above correction value is calculated when the alignment adjustment between the substrate and the mask is performed. In addition, by calculating the mechanical offset amount at the time of close contact, the alignment step is performed using the correction value calculated in advance when performing alignment in the actual film forming step. The first calculated movement amount is corrected, and the relative position between the substrate 1 and the mask 3 after alignment adjustment and before adhesion is corrected by using the mechanical offset amount. By closely contacting, the alignment time can be shortened without increasing the number of steps.

  In the present embodiment, for the sake of explanation, it is described separately in FIGS. 2 and 3, but actually, the mask 3 is moved relative to the spare substrate 1 as described above (FIG. 2 (a). )), A correction value is calculated during the alignment process (FIG. 2B), and after alignment adjustment (FIG. 3A), the preliminary substrate 1 and the mask 3 are brought into close contact with each other to calculate the mechanical offset amount. (FIG. 3B), the spare substrate 1 is unloaded, a substrate 1 different from the spare substrate 1 is loaded, and the first calculated movement amount is used by using the correction value in the actual film forming process. (FIG. 2 (c)), the substrate 1 and the mask 3 are aligned (FIG. 2 (d)), and the relative position between the substrate 1 and the mask 3 is set using the mechanical offset amount before the contact. Correction is performed (FIG. 3C), and the substrate 1 and the mask 3 are brought into close contact with each other (FIG. 3D). .

  Since the present embodiment is configured as described above, the substrate 1 and the mask 3 are relatively moved so that both the substrate-side alignment mark 2 and the mask-side alignment mark 4 can be recognized by the optical means. When the movement amount necessary for alignment of both alignment marks 2 and 4 is calculated using the image data recognized by the optical means, and when the substrate 1 or the mask 3 is moved by the movement means based on the calculated movement amount, The difference between the calculated movement amount and the actual movement amount that the substrate 1 or the mask 3 has actually moved is calculated, and the first time calculated in the subsequent alignment process using a correction value that cancels this difference. Since the calculated movement amount is corrected, the characteristic inherent to the apparatus can be canceled during the alignment process, and the position of both alignment marks 2 and 4 can be reduced with a smaller number of movements of the substrate 1 or mask 3. Combined it is possible to perform, it can be shortened correspondingly alignment time.

  Further, when the correction value is calculated and the alignment adjustment is performed so that the substrate 1 and the mask 3 are brought into close contact with each other, the substrate-side alignment mark 2 and the mask before contact are obtained using image data recognized by the optical means. The positional deviation amount difference between the positional deviation amount with respect to the side alignment mark 4 and the positional deviation amount between the substrate side alignment mark 2 and the mask side alignment mark 4 after contact is calculated, and the positional deviation amount difference is offset. After calculating the mechanical offset amount and controlling the moving means using the mechanical offset amount to correct the relative position between the substrate 1 and the mask 3 before adhesion after the alignment adjustment, the substrate 1 And the mask 3 are brought into close contact with each other, so that a positional shift that occurs when the substrate 1 and the mask 3 are brought into close contact can be offset, and alignment adjustment is performed again. It is possible to reduce the frequency, highly accurate alignment can be performed in a short time.

  Therefore, this embodiment can reduce the error due to the characteristics peculiar to the apparatus as much as possible to improve the alignment accuracy, reduce the number of times of driving the substrate or mask, and shorten the alignment adjustment time. The positional deviation when the substrate and the mask are in close contact with each other can be reduced, and it is extremely excellent in practicality.

  The present invention is not limited to this embodiment, and the specific configuration of each component can be designed as appropriate.

It is a schematic explanatory drawing of an alignment table. It is a schematic explanatory drawing of a present Example. It is a schematic explanatory drawing of a present Example.

Explanation of symbols

1 Substrate 2 Substrate side alignment mark 3 Mask 4 Mask side alignment mark

Claims (8)

  The substrate and the mask are relatively moved by the moving means so that both the substrate-side alignment mark provided on the substrate and the mask-side alignment mark provided on the mask can be recognized by the optical means, and the optical means recognizes them. The amount of movement required for alignment between the substrate side alignment mark and the mask side alignment mark is calculated using image data, and the substrate or the mask is moved by controlling the moving means based on the calculated amount of movement. An alignment method for aligning the substrate and the mask by performing the alignment step to be performed once or a plurality of times and then bringing the substrate and the mask into close contact with each other. Based on the coordinates according to the calculated movement amount of the first time and the calculated movement amount of the first time, the moving means actually The difference between the moved substrate and the mask after the first actual movement of the mask is calculated, and a correction value that cancels the difference between the coordinate according to the calculated movement amount and the coordinate after the actual movement. The first calculated movement amount in the alignment step is corrected using the correction value, and the substrate or the mask is moved by the moving means based on the corrected calculated movement amount corrected by the correction value. An alignment method characterized by moving.   The alignment method according to claim 1, wherein the correction value is calculated a plurality of times, and the calculated movement amount is corrected using an average value of the correction values calculated a plurality of times.   The alignment method according to claim 2, wherein the calculated movement amount is corrected using an average value of the most recent correction values.   A large number of the correction values are calculated and stored for each calculated movement amount, and one of the correction values calculated and stored for each calculated movement amount according to the first calculated movement amount in the alignment step. The alignment method according to any one of claims 1 to 3, wherein correction is performed by using the correction method.   When calculating the correction value and performing the alignment adjustment to bring the substrate and the mask into close contact, the image data recognized by the optical means is used to determine whether the substrate-side alignment mark and the mask-side alignment mark are in close contact with each other. A positional deviation amount difference between the positional deviation amount and the positional deviation amount between the substrate side alignment mark and the mask side alignment mark after adhesion is calculated, and a mechanical offset amount that cancels the positional deviation amount difference is calculated. After the alignment is adjusted by controlling the moving means using a mechanical offset amount, the relative position between the substrate and the mask before contact is corrected, and then the substrate and the mask are brought into contact with each other. The alignment method according to any one of claims 1 to 4.   The mechanical offset amount is calculated a plurality of times, and an average value of the mechanical offset amounts calculated a plurality of times is used to correct the relative position between the substrate and the mask before adhesion after the alignment adjustment. The alignment method according to claim 5.   A moving means for relatively moving the substrate and the mask, an optical means for imaging and recognizing the substrate-side alignment mark provided on the substrate and the mask-side alignment mark provided on the mask, and obtained by the optical means A movement amount calculation means for calculating a movement amount necessary for alignment between the substrate side alignment mark and the mask side alignment mark using image data, and the movement based on the calculated movement amount calculated by the movement amount calculation means. Control means for controlling the means and contact means for bringing the substrate and the mask into close contact with each other, and alignment of the substrate and the mask using the alignment method according to claim 1. An alignment apparatus characterized by performing: An organic EL element forming apparatus comprising the alignment apparatus according to claim 7.

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