JP2008093648A - Foreign matter elimination of submerged electronic equipment - Google Patents
Foreign matter elimination of submerged electronic equipment Download PDFInfo
- Publication number
- JP2008093648A JP2008093648A JP2006305961A JP2006305961A JP2008093648A JP 2008093648 A JP2008093648 A JP 2008093648A JP 2006305961 A JP2006305961 A JP 2006305961A JP 2006305961 A JP2006305961 A JP 2006305961A JP 2008093648 A JP2008093648 A JP 2008093648A
- Authority
- JP
- Japan
- Prior art keywords
- electronic equipment
- foreign matter
- order
- submerged
- airtight container
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Cleaning By Liquid Or Steam (AREA)
- Drying Of Solid Materials (AREA)
Abstract
Description
本発明は、水没した精密電子機器から水分、異物を取り出し電子回路の復旧を計る。 The present invention takes out moisture and foreign matter from submerged precision electronic equipment and restores the electronic circuit.
従来の事故による精密電子機器の水没事故において、水没した電子機器から内部に残されたデータを回収するために電子機器を修復する必要があり、そのために内部に残っている水分や異物を除去する必要があり、そのため分解して掃除と乾燥清浄をする必要があった、また分解には限度があり分解不可能な部位からの除去が困難であった。 In a submergence accident of precision electronic equipment due to a conventional accident, it is necessary to repair the electronic equipment in order to collect the data left inside from the submerged electronic equipment. Therefore, it was necessary to disassemble and clean and dry clean it, and there was a limit to disassembly and it was difficult to remove from the undissolvable part.
従来の水没した電子機器から内部のデータを安全に回収するには早く異物及び水分の除去をかけるほど機器と内部データの復旧率が向上する、内部に残存する液体、異物は導電性の物質が殆どであり電子回路への不安定要素で完全に除去しなければならない、しかし近年の精密電子機器は分解清掃がきわめて困難で作業も時間を要する、またその作業中に不純物を含んだ異物により電子回路素子に悪影響を及ぼすことを抑える。 To recover internal data safely from conventional submerged electronic equipment, the recovery rate of equipment and internal data improves as soon as foreign matter and moisture are removed. The remaining liquid and foreign matter are electrically conductive substances. However, most of the precision electronic devices in recent years are extremely difficult to disassemble and clean and require a long time to operate. Suppresses adverse effects on circuit elements.
本発明では上記目的を達成するために異物と水分除去を短時間にかつ電子回路への悪影響がでないようにするためのものである、
精密電子機器は内部にマイクロプロセッサを持ち、省電力化を計る為に微弱な電力で動作している、また電子コントロールチップの信号線の間隔は非常に狭くその間に水分、異物が入ると導電性を持つ場合が多いので誤動作を起こし破損してしまう。
このために内部の水分、異物を取り除く必要がある。水分を除くにあたり機器の密閉度が高いために機器の温度を上げて蒸発させる方法もあるが密閉度が高いために結露が生じ目的を短時間に達成できない、このために電子機器を機密性がある容器にいれて内部の気圧を下げて水分を除去する方法を取る、このときに近年多量に使用されている液晶表示装置はガラス板に挟まれた間に有機液晶があり、これを保護するためにシーリング材とスペーサで保護されている、よって単純に気圧をさげるだけではその素子を破壊してしまう。以上の弊害を除くために気密容器の圧力を気密容器内の気圧センサーで感知して気圧をさげるポンプの制御をおこなう。また気圧の制御のためにバルブを設けて外気の導入も計るその外気は空調機で水分を除去した乾燥空気をいれるようにする。In the present invention, in order to achieve the above object, foreign matter and water removal are performed in a short time so as not to adversely affect the electronic circuit.
The precision electronic equipment has a microprocessor inside and operates with weak power to save power. The signal lines of the electronic control chip are very narrow and conductive when moisture or foreign matter enters between them. In many cases, it will cause malfunction and damage.
For this purpose, it is necessary to remove moisture and foreign matter inside. There is also a method of evaporating by raising the temperature of the equipment to remove moisture, so the temperature of the equipment can be raised to evaporate, but because the degree of sealing is high, condensation occurs and the purpose cannot be achieved in a short time, which makes the electronic equipment confidential. A method of removing moisture by lowering the atmospheric pressure inside a container is adopted. At this time, liquid crystal display devices that have been used in large quantities in recent years have organic liquid crystals sandwiched between glass plates and protect them. Therefore, it is protected by a sealing material and a spacer. Therefore, simply reducing the air pressure will destroy the element. In order to eliminate the above adverse effects, the pressure of the hermetic container is sensed by a pressure sensor in the hermetic container and the pump is controlled to reduce the atmospheric pressure. In addition, a valve is provided to control the atmospheric pressure, and the introduction of outside air is also measured.
水没した電子機器は水分以外の異物も混入している場合が多い、また液体と混ざった異物は導電性を持つ場合が多く、これを取り除くために超音波素子による洗浄をおこなう、現在あるような単一の発振周期の振動子では精密電子機器の微細な部位に入り込んだ粒子を取り除くのが難しい、これを解消するために複数の周波数振動子を切り替えながら洗浄する、洗浄にあたりエネルギィー伝達媒体は電子回路の保護のために超純水を使用する、洗浄中に異物の導電性により電子回路に悪影響をださないように常に新しい超純水を電気抵抗センサーで検知して、制御しながら流し込み洗浄をはかる。 Submerged electronic devices often contain foreign substances other than moisture, and foreign substances mixed with liquid often have electrical conductivity, and are cleaned with ultrasonic elements to remove them. It is difficult to remove particles that have entered fine parts of precision electronic equipment with a vibrator with a single oscillation period. In order to solve this problem, washing is performed while switching between multiple frequency vibrators. Ultra-pure water is used to protect the circuit. During cleaning, new ultra-pure water is always detected by the electric resistance sensor so as not to adversely affect the electronic circuit due to the conductivity of foreign matter. Measure.
上述したように本発明の水没した電子機器内の異物水分除去で短時間に異物と水分を機器分解なしに電子回路への悪影響を除去して電子機器と内部にある電子データの回収をスムーズに行うことが可能になる。 As described above, the removal of foreign matter moisture in a submerged electronic device according to the present invention removes the adverse effects on the electronic circuit without disassembling the foreign matter and moisture in a short time, and smoothly collects the electronic data inside the electronic device and the electronic device. It becomes possible to do.
以下、本発明の実施の形態を図1に基ずいて説明する。Hereinafter, an embodiment of the present invention will be described with reference to FIG.
図においては、8は気密容器でこの中に水没した精密電子機器Aを配置する、水以外の異物が混入している場合は容器内に超純水タンク11から超純水を入れて複数の超音波振動子Bを切り替えながら超音波発信機16で洗浄する、洗浄課程で異物が超純水と混ざり導電性が出てくる、この状態を容器内の電気抵抗センサー14で検知してコントローラ15で流入させる量を電磁バルブ12と排出電磁バルブ13でコントロールして最適化を計る、次に超純水を排出して電子機器内に残る水分を除去する課程に入る、気密容器の気圧を下げるために排気ポンプ1を配置して内部気圧を検出させる気圧センサー4から気圧をコントロールする制御装置5により外気導入コントロール電磁バルブ3と排出コントロール電磁バルブ2を制御して気密容器内の最適気圧を保つ、外気は外気フィルター7から湿度、温度を制御された空調機6より流入させる。 In the figure, reference numeral 8 denotes an airtight container in which the precision electronic device A submerged is disposed. When foreign substances other than water are mixed, ultrapure water is put into the container from the
1 排気電動ポンプ
2 排気制御電磁バルブ
3 外気導入制御電磁バルブ
4 気密容器内圧力センサー
5 気密容器内部気圧コントローラ
6 空調機
7 外気導入フィルター
8 気密容器
11 超純水タンク
12 流入コントロール電磁バルブ
13 排出コントロール電磁バルブ
14 電気抵抗センサー
15 超音波発信機コントローラ
16 超純水流量コントローラ
A 処理対象精密電子機器
B 超音波振動子DESCRIPTION OF SYMBOLS 1 Exhaust
Claims (1)
洗浄が終了して残留洗浄液を取り除くために排気ポンプで負圧をかけて気化させるが負圧がかかりすぎることで電子部品の破損がでるのでセンサーで負圧を感知してコンピュータ制御によりコントロールすることで電子機器に破損が発生しないようにする。
排気ボンプが接続された電子機器を入れる容器には外部から湿度を落とした外気を流入させるために空調装置をおき適度な温度、湿度にした外気導入を排気制御と合わせて行う、また水没した電子機器を処理する容器内において気化をうながすために気圧を下げるので熱エネルギィーを遠赤外線領域の電磁波でも加熱する方法をとる。In order to remove foreign matter that entered the submerged electronic device, multiple ultrasonic transducers with different frequencies are placed and multi-scan is applied to clean the foreign matter inside the electronic device. The cleaning liquid uses ultra-pure water that is not conductive.However, foreign substances are mixed in the cleaning process, and conductivity is generated.However, in order to always ensure proper insulation while monitoring the electrical conductivity with the sensor, Control the flow state.
In order to remove the residual cleaning liquid after the cleaning is completed, a negative pressure is applied by the exhaust pump to vaporize, but the electronic components are damaged by applying a negative pressure too much, so the sensor detects the negative pressure and controls it by computer control. In order to prevent damage to electronic equipment.
An air conditioner is installed in the container for storing the electronic equipment to which the exhaust pump is connected to allow the outside air to flow in from the outside. In order to promote vaporization in a container for processing equipment, the pressure is lowered, so that heat energy is also heated by electromagnetic waves in the far infrared region.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006305961A JP2008093648A (en) | 2006-10-13 | 2006-10-13 | Foreign matter elimination of submerged electronic equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006305961A JP2008093648A (en) | 2006-10-13 | 2006-10-13 | Foreign matter elimination of submerged electronic equipment |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2008093648A true JP2008093648A (en) | 2008-04-24 |
Family
ID=39377061
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006305961A Pending JP2008093648A (en) | 2006-10-13 | 2006-10-13 | Foreign matter elimination of submerged electronic equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2008093648A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DK201670507A1 (en) * | 2016-07-06 | 2018-01-15 | Techsave As | Method for restoring damaged electronic devices by cleaning and apparatus |
CN109848132A (en) * | 2019-01-25 | 2019-06-07 | 泉州市友腾光电科技有限公司 | A kind of lenticule supersonic wave cleaning machine that stability is good |
JP2020180774A (en) * | 2012-02-01 | 2020-11-05 | リバイブ エレクトロニクス, エルエルシーRevive Electronics, Llc | Method and apparatus for drying electronic device |
CN113500043A (en) * | 2021-06-09 | 2021-10-15 | 深圳市壹帆自动化有限公司 | Ultrasonic cleaning machine |
US11713924B2 (en) | 2012-02-01 | 2023-08-01 | Revive Electronics, LLC | Methods and apparatuses for drying electronic devices |
-
2006
- 2006-10-13 JP JP2006305961A patent/JP2008093648A/en active Pending
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020180774A (en) * | 2012-02-01 | 2020-11-05 | リバイブ エレクトロニクス, エルエルシーRevive Electronics, Llc | Method and apparatus for drying electronic device |
JP7229549B2 (en) | 2012-02-01 | 2023-02-28 | リバイブ エレクトロニクス,エルエルシー | Method and apparatus for drying electronic devices |
US11713924B2 (en) | 2012-02-01 | 2023-08-01 | Revive Electronics, LLC | Methods and apparatuses for drying electronic devices |
DK201670507A1 (en) * | 2016-07-06 | 2018-01-15 | Techsave As | Method for restoring damaged electronic devices by cleaning and apparatus |
DK179189B1 (en) * | 2016-07-06 | 2018-01-22 | Techsave As | Method for restoring damaged electronic devices by cleaning and apparatus |
US20190314868A1 (en) * | 2016-07-06 | 2019-10-17 | Techsave A/S | Method for Restoring Damaged Electronic Devices by Cleaning and Apparatus Therefor |
CN109848132A (en) * | 2019-01-25 | 2019-06-07 | 泉州市友腾光电科技有限公司 | A kind of lenticule supersonic wave cleaning machine that stability is good |
CN113500043A (en) * | 2021-06-09 | 2021-10-15 | 深圳市壹帆自动化有限公司 | Ultrasonic cleaning machine |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2008093648A (en) | Foreign matter elimination of submerged electronic equipment | |
KR100930005B1 (en) | Substrate Processing Apparatus and Substrate Processing Method | |
CN108074844A (en) | Substrate board treatment, substrate processing method using same and storage medium | |
US5540245A (en) | Processing equipment of single substrate transfer type | |
TW202207298A (en) | Liquid processing device and liquid processing method | |
WO2009088644A1 (en) | Megasonic cleaning with controlled boundary layer thickness and associated systems and methods | |
JP5891085B2 (en) | Substrate processing apparatus and substrate processing method | |
CN201161960Y (en) | Continuous biological safety laboratory wastewater treatment system | |
CN106734012A (en) | Heating system and cleaning machine and TFT LCD production lines for base plate glass cleaning machine | |
JP2012081430A (en) | Ultrasonic cleaning apparatus | |
CN109589075A (en) | A kind of device for treating food wastes and its processing method of dish-washing machine | |
WO2020174874A1 (en) | Substrate processing device, semiconductor manufacturing device, and substrate processing method | |
CN102522358A (en) | Photoresist stripping technical cavity and photoresist stripping method for semiconductor silicon wafer | |
JP2011119514A (en) | Cleaning method of substrate, and cleaning device of substrate | |
CN108816166A (en) | A kind of chemical reaction reaction kettle of automatic Regulation | |
CN204424225U (en) | Integrated moisture removal and drying process equipment | |
CN209952473U (en) | Dust treatment equipment | |
WO2007063975A1 (en) | Apparatus and method for restoring electronic device | |
JP2010046570A (en) | Apparatus for manufacturing feed liquid for ultrasonic treatment apparatus, method for manufacturing feed liquid for ultrasonic treatment apparatus and ultrasonic treatment system | |
JP2010267856A (en) | Cleaning treatment apparatus and cleaning treatment method | |
JP2011183300A (en) | Ultrasonic cleaning apparatus | |
JP2013207022A (en) | Substrate processing apparatus and substrate processing method | |
US11993854B2 (en) | Chamber wall polymer protection system and method | |
JP2001050624A (en) | Cooling device | |
CN110243069A (en) | A kind of multiple function stable type water heater |