JP2008091843A - Crimped-state inspection apparatus of substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a crimped-state inspection apparatus for accurately inspecting the crimped state of the terminal electrode of a flexible substrate that is crimped to the terminal electrode of a control board through an anisotropic conductive film. <P>SOLUTION: In a crimped-state inspection apparatus for inspecting the crimped state of the terminal electrode of a flexible substrate that is crimped to the terminal electrode of a control board through an anisotropic conductive film, there provided are coaxial downwardly lighting 13 for radiating parallel light 16 from the upper part of the flexible substrate 2; an imaging means for imaging the deformed state of the terminal electrode 17 caused by pressing conductive particles 19 in the anisotropic conductive film to the terminal electrode 17 that is formed on the back face of the flexible substrate 2 at the time of crimping from the surface through the flexible substrate 2; and an image processing section for image-processing the image data of the terminal electrode 17 of the imaged flexible substrate 2. The quality judgement of the crimped state is performed by comparing the deformed-state data of the terminal electrode 17 of the flexible substrate 2 in a judgement frame 32 provided in the processed image data with the preset quality judgement data. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

The present invention relates to an apparatus for inspecting the crimping state of a terminal electrode of a flexible substrate (TAB component, TCP, FPC, SOF, etc.) that is crimped to a terminal electrode of a control substrate via an anisotropic conductive film.
More specifically, when the terminal electrode of the control board and the terminal electrode of the flexible board are pressure-bonded via the anisotropic conductive film, the indentation state due to the conductive particles in the anisotropic conductive film generated on the terminal electrode of the flexible board and The present invention relates to an apparatus for inspecting a misalignment state between terminal electrodes.

  Conventionally, in the manufacturing process of a liquid crystal panel, after attaching an anisotropic conductive film to a terminal electrode of a liquid crystal glass substrate, the terminal electrode of the flexible substrate and the terminal electrode of the liquid crystal glass substrate are pressure-bonded, and then the flexible substrate The other terminal electrode is pressure-bonded to the control substrate via an anisotropic conductive film to produce a liquid crystal panel. Thereafter, a continuity test or the like is performed, and the subsequent process is performed.

  By the way, in this continuity test, the quality of the electrical connection state is judged, but depending on the pressure and heat variations during crimping, even if the electrical connection is good immediately after crimping, the connection state over time May become defective. For this reason, after the main crimping, it is necessary to inspect various crimping conditions such as whether the pressure and heating at the time of crimping are appropriate and the position of the terminal electrode of the control board and the flexible board at the time of crimping. is there.

  Therefore, conventionally, the inspection of the crimped state of the flexible substrate crimped to the control substrate side is performed by irradiating light from the light source 36 obliquely above the surface of the flexible substrate 2 as shown in FIG. 2. A method of judging the quality by visually checking the unevenness on the surface is performed. In order to automate this, a method of inspecting the irregularities on the surface of the flexible substrate using a line sensor which is performed in the foreign matter inspection on the polarizing plate surface is also conceivable.

In addition, as an inspection of the crimped state of the flexible substrate crimped to the liquid crystal glass substrate side, the terminal electrode of the liquid crystal glass substrate generated by pressing the conductive particles of the anisotropic conductive film against the terminal electrode of the liquid crystal glass substrate by the crimping The indentation is imaged by a CCD camera through a differential interference microscope from below through a glass substrate, and the quality is determined from the number of indentations existing in a specified range (for example, Patent Document 1).
JP 2005-227217 A

  However, the visual inspection as described above is difficult to handle with the recent increase in size of the liquid crystal panel, and the inspection area is increased, and further, it is difficult to accurately judge due to the bending of the substrate. It is coming.

  In addition, the method of viewing the surface of the flexible substrate with the naked eye does not look directly at the terminal electrode portion, and therefore has a problem that only indirect determination can be made, and there are variations in determination due to not being automated.

  Furthermore, since the method using the line sensor does not directly look at the terminal electrode portion in the same manner as described above, the problem that only indirect determination can be made and the positional deviation between the terminal electrodes of the flexible substrate and the control substrate are inspected. There was a problem that could not be done. Furthermore, since the flexible substrate has flexibility, there are many variations in the deformation of the surface, it is difficult to determine the determination conditions, and the quality determination is not stable.

  In the method of Patent Document 1, an impression generated on the terminal electrode of the liquid crystal glass substrate by the conductive particles of the anisotropic conductive film is transmitted through the liquid crystal glass substrate and imaged with a CCD camera through a differential interference microscope, and the number of the impressions is measured. The quality is judged from the above.

  However, the terminal electrode of the control board crimped to the control board side cannot be inspected through the control board because the control board is not formed transparent like the liquid crystal glass substrate, and the method of Patent Document 1 is applied. There was a problem that could not be done.

  Here, when the method of the above-mentioned Patent Document 1 is applied so as to inspect by allowing the flexible substrate to pass through from the flexible substrate side, the flexible substrate is different from the liquid crystal glass substrate in the amount of deformation at the time of crimping due to its flexibility. Because of the large size, the differential interference microscope has a problem in that the unevenness other than the indentation of the terminal electrode due to the conductive particles is excessively emphasized and cannot be inspected. Furthermore, the differential interference microscope is expensive, and a specific part is emphasized for viewing, so that the field of view is narrow at a high magnification (usually 5 times or more) and is not suitable for viewing a wide range. For this reason, when there are many terminal electrodes to be inspected, there is a problem that the inspection range is narrow and the number of inspections increases, which requires time.

  In addition, the alignment between the terminal electrodes of the control board and the flexible board during normal crimping will be described with reference to FIG. 6. The control board 3 in a state where the plurality of flexible boards 2 are already crimped to the liquid crystal glass substrate side. Since it is supplied to the upper side, it is not performed for each flexible substrate, and two positions of an alignment mark 24 provided at both ends of the control substrate 3 and alignment marks (not shown) located at both ends of the liquid crystal glass substrate are provided. The plurality of flexible boards 2 and the control board 3 are pressure-bonded together at a predetermined position.

  Visually or optically inspected whether the alignment marks 26a and 26b provided at both ends of each flexible substrate 2 after the crimping and the alignment marks 27a and 27b on the control substrate 3 provided at the opposite positions are not shifted. Has been done.

  However, the above method is an inspection of only the alignment mark portion, and is not performed for each of the plurality of terminal electrodes. Even if there is no problem in alignment of the alignment mark portion due to the recent finer pitch of the terminal electrodes. In some cases, poor connection may occur due to errors in the alignment marks themselves, accumulated errors for each pitch, deformation of some terminal electrodes, and the like. Furthermore, since the above inspections are performed independently, there is a problem that takes time.

  As described above, there is a problem in any of the above methods, there is no method for properly inspecting the crimped state of the flexible substrate that is crimped to the control substrate side, and there is a problem that it is not possible to cope with deterioration over time. . Further, there is a problem that the indentation and the positional deviation cannot be inspected at the same time. Furthermore, even if a failure occurs, the stored information is not fed back to the crimping device, so that it is necessary to manually adjust the crimping device when the failure occurs, and there is a problem that it takes time for the adjustment.

  Accordingly, the present invention provides a crimping state inspection device capable of accurately inspecting the crimping state of a flexible substrate that is crimped to a control substrate, and that can also perform misalignment inspection in the same process, and crimping state inspection results. It is an object of the present invention to provide a crimping state inspection apparatus capable of automatically improving the crimping accuracy.

  According to a first aspect of the present invention, there is provided a crimping state inspection apparatus for inspecting a crimping state of a terminal electrode of a flexible board that is crimped to a terminal electrode of a control board via an anisotropic conductive film. Coaxial epi-illumination for irradiating, and the deformation state of the terminal electrode of the flexible substrate caused by pressing conductive particles in the anisotropic conductive film against the terminal electrode formed on the back surface of the flexible substrate during crimping, An image pickup means for picking up an image from the surface via the image sensor and an image processing unit for image processing the image data of the terminal electrode of the imaged flexible substrate are provided, and the determination set in the image data image-processed by the image processing unit By comparing the deformation state data of the terminal electrode of the flexible substrate in the frame with the predetermined pass / fail judgment data, It is obtained by employing the structure which is adapted to the determination. As the imaging means, for example, an optical sensor capable of receiving irradiated light, such as a CCD camera or a CMOS sensor, can be used.

  According to a second aspect of the present invention, there is provided a crimping state inspection apparatus for inspecting a crimping state of a terminal electrode of a flexible board that is crimped to a terminal electrode of a control board via an anisotropic conductive film. Coaxial epi-illumination for irradiating, and the deformation state of the terminal electrode of the flexible substrate caused by pressing conductive particles in the anisotropic conductive film against the terminal electrode formed on the back surface of the flexible substrate during crimping, An image pickup means for picking up an image from the surface via an image processing section and an image processing section for image processing image data of the picked-up terminal electrode of the flexible board, and a terminal of the flexible board at the time of image pickup of the terminal electrode of the flexible board by the image pickup means Both ends of which the edge part of the electrode and the edge part of the terminal electrode of the control board are imaged and image processed by the image processing part The positional deviation amount between the terminal electrodes is calculated by calculating the positional deviation amount between the two terminal electrodes from the image data of the edge portion of the electrode and comparing the positional deviation amount with a preset reference positional deviation amount. A configuration in which the determination is made is adopted.

  According to a third aspect of the present invention, in the first and second aspects of the invention, a deformation state generated in the terminal electrode of the flexible substrate and an edge portion of the terminal electrode of the flexible substrate at the time of imaging the terminal electrode of the flexible substrate by the imaging unit And the edge part of the terminal electrode of the control board are imaged to judge the quality of the crimped state and to determine the quality of the positional deviation between the terminal electrode of the flexible board and the terminal electrode of the control board in the same process. Adopted.

  According to a fourth aspect of the present invention, in the first to third aspects of the present invention, a crimping device for crimping the terminal electrode of the control board and the terminal electrode of the flexible board via an anisotropic conductive film is provided, and the crimping apparatus and the crimping machine are provided. A storage unit is connected to the state inspection device and stores the image data captured by the crimp state inspection device and the analyzed pass / fail judgment data. The image processing data stored in the storage unit and the analyzed pass / fail are stored. A configuration is adopted in which information on the crimping state is fed back to the crimping condition of the crimping device by feeding back determination data to the crimping device.

  According to the invention of claim 1, it becomes possible to directly inspect the terminal electrode of the flexible substrate that is crimped to the control substrate, and whether the pressure and heating at the time of crimping are appropriate can be determined for each terminal electrode, Generation of quality defects due to deterioration over time can be prevented. In addition, the field of view can be widened, the speed can be increased, and the cost can be reduced because it is not necessary to use an expensive differential interference microscope. Furthermore, foreign matter mixed during crimping can be determined by inspecting the shape and size of the indentation.

  According to the invention of claim 2, since the inspection can be automated and the state of positional deviation can be confirmed for each terminal electrode, the inspection accuracy can be remarkably improved and the inspection time can be shortened.

  According to the invention of claim 3, since the positional deviation between the terminal electrodes can be automatically inspected in the same step as the step of inspecting the indentation of the flexible substrate, the time can be shortened. The inspection can be performed, and the inspection accuracy can be improved as compared with the inspection in the alignment section which has been conventionally performed.

  According to the invention of claim 4, since the image data of the crimping state inspection and the analyzed pass / fail judgment data are fed back to the crimping device and can be reflected in the crimping conditions, the crimping can be performed with high accuracy during the crimping, The setting conditions can be automatically input to the crimping apparatus, and the crimping accuracy can be improved.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

  Referring to FIGS. 1 and 2, a CCD camera 5 is provided on the machine base 4 as an imaging means for inspection, and the CCD camera 5 is provided horizontally on a column that is erected vertically to the machine base 4. By fitting the rail 10 and the slider 8 so as to be slidable, the rail 10 can be moved in the horizontal direction by an appropriate driving source (not shown).

  The elevating part of the CCD camera 5 is fitted to a rail 9 extending in the front-rear direction through a fixed frame 6, and can be moved in the front-rear direction by an appropriate drive source (not shown). The nut member 12 is connected through the nut member 12, and the nut member 12 is engaged with the ball screw 11 so that the motor 7 can be moved up and down.

  On the machine base 4, the liquid crystal panel 1 to which the control board 3 is connected by a crimping device is supplied to a predetermined position. It is designed to be fixed by a simple fixing mechanism.

  Next, the inspection apparatus of the present invention will be described with reference to FIGS. 3 (a) and 3 (b). A coaxial epi-illumination 13 is connected to the CCD camera 5. Light emitted from a light source (not shown) connected to the fiber illumination 14 is reflected by a half mirror 15, and the parallel light 16 is inspected through a lens (not shown). The terminal electrode 17 portion of the flexible board is irradiated through the flexible board 2.

  The parallel light 16 irradiated to the terminal electrode 17 portion through the flexible substrate 2 is reflected on the surface layer portion of the terminal electrode 17, and the reflected parallel light 16 passes through the half mirror 15 and is imaged by the CCD camera 5. It has become.

  The inspection apparatus according to the present invention is configured as described above. Next, an inspection method using the inspection apparatus according to the present invention will be described.

  First, the liquid crystal panel 1 and the flexible substrate 2 are pressure-bonded via the anisotropic conductive film 21 by a pressure bonding device, and then the anisotropic conductive film is formed on the terminal electrode 18 of the control substrate 3 as shown in FIG. 21 is pasted, and the terminal electrode 17 of the flexible substrate 2 connected to the liquid crystal panel 1 is opposed thereto, and crimping is performed as shown by an arrow in FIG.

  As shown in FIGS. 4B and 5, the control substrate 3 and the flexible substrate 2 that have been crimped have unevenness on the surface of the flexible substrate 2 other than the terminal electrodes 17 and 17 due to the flexibility of the flexible substrate 2. It will be.

  Further, on the upper surface of the terminal electrode 17, an indentation 22 generated when the conductive particles 20 of the anisotropic conductive film 21 are crushed by pressure bonding is generated at a position facing the deformed conductive particles 19.

  The liquid crystal panel 1 that has been crimped in this way is positioned and supplied to the inspection section on the machine base 4 of the inspection apparatus of the present invention by an appropriate conveying means (not shown), and the liquid crystal panel 1 is supplied by an appropriate fixing mechanism (not shown). And the control board 3 is fixed.

  When the liquid crystal panel 1 is fixed, the inspection means 34 is driven to the inspection position on the terminal electrode 17 of the flexible substrate 2 to be inspected, and the inspection means 34 moved to the inspection position is incident from the fiber illumination 14. Light is irradiated on the terminal electrode portion 17 on the control board 3 side of the flexible board 2 as parallel light 16 by the coaxial incident illumination 13.

  The irradiated parallel light 16 passes through the flexible substrate 2 and reaches above the terminal electrode 17, and the light reflected on the surface of the terminal electrode 17 passes through the half mirror 15 and passes through the half mirror 15 to the CCD camera 5. The state of the bulge is imaged.

  As the parallel light 16 used at this time, visible light can be used when the flexible substrate 2 itself has good transparency, and when the flexible substrate 2 with poor transparency is used, a light source with good transparency (for example, Red light, infrared light) can be used. In addition, it can select suitably according to coloring of the flexible substrate 2, without being limited to these.

  Further, the irradiation intensity of the coaxial epi-illumination 16 is adjusted in accordance with the transparency, or a portion to be supplementarily imaged in addition to the parallel light 16 by the coaxial epi-illumination 16 is illuminated by an auxiliary light source (not shown). May be.

  In addition, it is preferable to use a lens having a high condensing rate so that the lens used for the coaxial epi-illumination 13 can transmit a large amount of light transmitted through the flexible substrate 2 and reflected from the terminal electrode 17 by the CCD camera 5. . Moreover, a low magnification lens (for example, about 2 times) can be preferably used from the viewpoint of widening the inspection range and improving the inspection efficiency.

  FIGS. 6A and 6B are enlarged plan views of the vicinity of the inspection portion where the control substrate 3 to be inspected and the flexible substrate 2 are pressure-bonded.

  The control board 3 is provided with a fixing hole 25 for fixing the control board 3 when the liquid crystal panel 1 is assembled into the vessel, and a terminal electrode 18 for connecting the flexible board 2. In addition, alignment marks 24 for aligning with the liquid crystal panel 1 at the time of pressure bonding are provided at both end portions of the control substrate 3. Usually, an alignment mark (not shown) on the liquid crystal panel 1 side and the alignment mark 24 are appropriately attached. The plurality of flexible boards 2 and the control board 3 are collectively pressure-bonded by aligning at a predetermined position with an optical means.

  An image frame 33 is set in the portion to be imaged, and the captured image is subjected to image processing by a known image processing method (for example, binarization and differentiation processing) and displayed on a display means (not shown).

  FIG. 7A is an example in which the crimped state is good, and a determination frame 32 is set in each terminal electrode 17 portion, and the pass / fail determination is performed by deformation state data (existing state) of the terminal electrode 17 of the flexible substrate 2 in the determination frame 32. The pass / fail judgment is made in comparison with the pass / fail judgment data set in advance such as the number and shape of the indentations 22 and the shading.

  Note that, by determining from the shape and density of the indentation 22 as described above, even if the indentation 22 is not due to the conductive particles 20 but is due to foreign matter, the normal shape and density of the indentation 22 can be set in advance. In comparison with the normal state, it can also be used for foreign matter determination.

  FIG. 7B is an example in which the crimped state is poor. In this case, the number of the indentations 22 is smaller than that of the good product, and the flexible substrate in the determination frame 32 indicates that the pressure and heating during the crimping are weak. It can be detected as deformation state data of the two terminal electrodes 17. The deformation state data is compared with the quality determination data set in advance, and those determined as defective are subjected to a correction process and corrected.

  Further, when determining the quality by the indentation 22, the edge portion 28 of the terminal electrode 17 of the flexible substrate 2 and the edge portion 29 of the terminal electrode 18 of the control substrate 3 are shown in the same image as shown in FIG. By measuring the distances d1, d2 and d3, d4 of the edge portions 28, 29, the amount of positional deviation between the terminal electrodes can be calculated for each terminal electrode.

  This misregistration amount is compared with a reference misregistration amount set as a permissible misregistration amount in advance to determine whether the misregistration state is good or not.

  In the present embodiment, the general example in which the terminal electrode 18 on the control board 3 side is larger than the terminal electrode 17 on the flexible board 2 has been described. Further, not only the distance between the edge portions 28 and 29 but also an angle or the like may be measured.

  In this embodiment, the indentation inspection screen and the edge portions 28 and 29 are projected at the same time. However, depending on the relationship with the focal point, the focus may be adjusted separately. You can do both.

  Here, if the terminal electrodes 17 and 18 have a positional deviation exceeding the allowable range, they are subjected to a defective product correction process and corrected.

  Next, another embodiment of the present invention will be described based on the flowchart of FIG.

  A crimping device is provided in the vicinity of the crimping state inspection device, and communication is possible through the control unit of both devices. The crimping device is provided with positioning means and crimping means, and the crimping conditions are controlled through the control unit. It has become.

  In the crimping apparatus, first, the flexible substrate 2 and the control substrate 3 on the liquid crystal panel 1 are positioned and crimped by a crimping means.

  The flexible substrate 2 and the control substrate 3 that have been crimped are imaged by an appropriate imaging means (CCD camera 5), and image processing is performed by a known image processing method such as binarization or edge processing in an image processing unit, and pass / fail judgment is made. The pass / fail judgment is performed in the same manner as described above.

  After the pass / fail judgment is made, pass / fail judgment data (for example, the number of impressions, the shape of the impression, the density of the impression, the amount of displacement) and image data (raw image before image processing, image after image processing) are stored in the storage unit. Analysis of various data (for example, analysis from standard deviation of a plurality of data) is performed.

  The analyzed pass / fail judgment data is fed back to the control unit of the crimping device through the control unit of the crimping state inspection device, and if the crimping device determines, for example, that the pressure is weak based on the pass / fail judgment data, control such as increasing the pressure setting. Is supposed to do.

  Similarly, if the positional deviation is deviated in a certain direction, the positioning setting condition is fed back to the control unit of the crimping apparatus so as to correct the angle and movement amount during positioning.

  A product that has been inspected in a crimped state may be transported to the next process if the inspection is a non-defective product, and transported to a correction process if the product is defective.

  In this embodiment, the information analyzed from the pass / fail judgment data and the image data in the crimping state inspection device is fed back to the crimping device. However, by storing the data in the crimping state inspection device, It is also possible to reflect it in the inspection, and in this way, it is possible to accurately perform the quality determination criteria for the inspection.

  Overall plan view showing an embodiment of the device of the present invention   AA direction arrow sectional view of the device of the present invention   (A), (b) Explanatory drawing of the crimping | compression-bonding state test | inspection of this invention apparatus   (A) An enlarged explanatory view showing a state before pressure bonding, (b) An enlarged explanatory view showing a state after pressure bonding.   Expansion explanatory drawing showing the crimping state inspection of the present invention   (A), (b) Enlarged plan view of the crimping part   (A) Inspection screen display representing an example of a non-defective product in the crimping state inspection of the present invention, (b) Inspection screen display representing an example of a defective product in the crimping state inspection of the present invention   Expansion explanatory drawing showing the press-fit state (position shift) inspection of the present invention   Operation flow diagram showing one embodiment of the present invention   Explanatory drawing showing the conventional inspection method

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Liquid crystal panel 2 Flexible board 3 Control board 4 Machine stand 5 CCD camera 6 Fixed frame 7 Motor 8 Slider 9 Rail 10 Rail 11 Ball screw 12 Nut member 13 Coaxial incident illumination 14 Fiber illumination 15 Half mirror 16 Parallel light 17 Terminal electrode 18 Terminal electrode 19 Deformed conductive particles 20 Conductive particles 21 Anisotropic conductive film (ACF)
22 Indentation 23 Imaging frame 24 Alignment mark 25 Fixing hole 26a Alignment mark 26b Alignment mark 27a Alignment mark 27b Alignment mark 28 Terminal electrode edge 29 Terminal electrode edge 30 Light source 31 CCD camera 32 Judgment frame 33 Image frame 34 Inspection means 35 Eye 36 Light source

Claims (4)

In the crimping state inspection device for inspecting the crimping state of the terminal electrode of the flexible board that is crimped to the terminal electrode of the control board via the anisotropic conductive film, coaxial incident illumination that irradiates parallel light from above the flexible board, The deformation state of the terminal electrode of the flexible substrate, which is generated when the conductive particles in the anisotropic conductive film are pressed against the terminal electrode formed on the back surface of the flexible substrate at the time of crimping, is imaged from the surface through the flexible substrate. An imaging unit, and an image processing unit that performs image processing on the image data of the terminal electrodes of the captured flexible substrate;
The deformation state data of the terminal electrode of the flexible substrate within the determination frame set in the image data image-processed by the image processing unit is compared with the quality determination data set in advance so as to determine pass / fail of the crimped state. A crimping state inspection device for a flexible substrate and a control substrate. In the crimping state inspection device for inspecting the crimping state of the terminal electrode of the flexible board that is crimped to the terminal electrode of the control board via the anisotropic conductive film, coaxial incident illumination that irradiates parallel light from above the flexible board, The deformation state of the terminal electrode of the flexible substrate, which is generated when the conductive particles in the anisotropic conductive film are pressed against the terminal electrode formed on the back surface of the flexible substrate at the time of crimping, is imaged from the surface through the flexible substrate. An imaging unit, and an image processing unit that performs image processing on the image data of the terminal electrodes of the captured flexible substrate;
When imaging the terminal electrode of the flexible substrate by the imaging means, the edge portion of the terminal electrode of the flexible substrate and the edge portion of the terminal electrode of the control substrate are imaged, and the edge portions of both terminal electrodes subjected to image processing by the image processing unit The positional deviation amount between the terminal electrodes is calculated from the image data, and the positional deviation state between the terminal electrodes is determined to be acceptable by comparing the positional deviation amount with a preset reference positional deviation amount. A crimping state inspection apparatus for a flexible substrate and a control substrate. When imaging the terminal electrode of the flexible board by the imaging means, the deformation state generated in the terminal electrode of the flexible board, and the edge part of the terminal electrode of the flexible board and the edge part of the terminal electrode of the control board are imaged,
3. The flexible board and the control according to claim 1, wherein the pass / fail judgment of the crimped state is performed and the positional deviation between the terminal electrode of the flexible board and the terminal electrode of the control board is judged by the same process. Board crimping state inspection device. A crimping device for crimping the terminal electrode of the control board and the terminal electrode of the flexible board through an anisotropic conductive film is provided, and the crimping device and the crimping state inspection device are connected and imaged by the crimping state inspection device. A storage unit for storing the processed image data and the analyzed pass / fail judgment data,
The image processing data stored in the storage unit and the analyzed pass / fail judgment data are fed back to the crimping device, whereby the information on the crimping state is fed back to the crimping condition of the crimping device. Item 4. The apparatus for inspecting the pressed state of the flexible substrate and the control substrate according to items 1 to 3.

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