JP2008088912A - メカニカルポンプおよびその製造方法 - Google Patents
メカニカルポンプおよびその製造方法 Download PDFInfo
- Publication number
- JP2008088912A JP2008088912A JP2006271816A JP2006271816A JP2008088912A JP 2008088912 A JP2008088912 A JP 2008088912A JP 2006271816 A JP2006271816 A JP 2006271816A JP 2006271816 A JP2006271816 A JP 2006271816A JP 2008088912 A JP2008088912 A JP 2008088912A
- Authority
- JP
- Japan
- Prior art keywords
- mechanical pump
- gas
- processing chamber
- pump
- pump according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04C—ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
- F04C18/00—Rotary-piston pumps specially adapted for elastic fluids
- F04C18/08—Rotary-piston pumps specially adapted for elastic fluids of intermeshing-engagement type, i.e. with engagement of co-operating members similar to that of toothed gearing
- F04C18/12—Rotary-piston pumps specially adapted for elastic fluids of intermeshing-engagement type, i.e. with engagement of co-operating members similar to that of toothed gearing of other than internal-axis type
- F04C18/14—Rotary-piston pumps specially adapted for elastic fluids of intermeshing-engagement type, i.e. with engagement of co-operating members similar to that of toothed gearing of other than internal-axis type with toothed rotary pistons
- F04C18/16—Rotary-piston pumps specially adapted for elastic fluids of intermeshing-engagement type, i.e. with engagement of co-operating members similar to that of toothed gearing of other than internal-axis type with toothed rotary pistons with helical teeth, e.g. chevron-shaped, screw type
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4412—Details relating to the exhausts, e.g. pumps, filters, scrubbers, particle traps
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04C—ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
- F04C25/00—Adaptations of pumps for special use of pumps for elastic fluids
- F04C25/02—Adaptations of pumps for special use of pumps for elastic fluids for producing high vacuum
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04C—ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
- F04C29/00—Component parts, details or accessories of pumps or pumping installations, not provided for in groups F04C18/00 - F04C28/00
- F04C29/04—Heating; Cooling; Heat insulation
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04C—ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
- F04C2220/00—Application
- F04C2220/10—Vacuum
- F04C2220/12—Dry running
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04C—ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
- F04C2230/00—Manufacture
- F04C2230/90—Improving properties of machine parts
- F04C2230/91—Coating
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04C—ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
- F04C2280/00—Arrangements for preventing or removing deposits or corrosion
- F04C2280/02—Preventing solid deposits in pumps, e.g. in vacuum pumps with chemical vapour deposition [CVD] processes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F05—INDEXING SCHEMES RELATING TO ENGINES OR PUMPS IN VARIOUS SUBCLASSES OF CLASSES F01-F04
- F05C—INDEXING SCHEME RELATING TO MATERIALS, MATERIAL PROPERTIES OR MATERIAL CHARACTERISTICS FOR MACHINES, ENGINES OR PUMPS OTHER THAN NON-POSITIVE-DISPLACEMENT MACHINES OR ENGINES
- F05C2201/00—Metals
- F05C2201/04—Heavy metals
- F05C2201/043—Rare earth metals, e.g. Sc, Y
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T117/00—Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
- Y10T117/10—Apparatus
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Applications Or Details Of Rotary Compressors (AREA)
- Drying Of Semiconductors (AREA)
Abstract
【解決手段】 ケーシングa3内などの排出すべき気体に曝される接ガス部の表面上に、イットリア(Y2 O3)膜を有している。
【選択図】 図1
Description
a1、a2 スクリューロータ
a3 ケーシング
a4 シャフト
a6 タイミングギア
a7 吸入ポート
a8 吐出ポート
a10 不活性ガス注入口
M モータ
Claims (10)
- 排出すべき気体に曝される接ガス部の表面上に、イットリア膜を有することを特徴とするメカニカルポンプ。
- 前記イットリア膜の厚さが、0.1乃至10μmの範囲にあることを特徴とする請求項1に記載のメカニカルポンプ。
- 前記接ガス部を80乃至250℃の範囲内に維持する温度制御手段を有することを特徴とする請求項1または2に記載のメカニカルポンプ。
- 前記温度制御手段は、加熱手段を含むことを特徴とする請求項3に記載のメカニカルポンプ。
- 前記温度制御手段は、前記メカニカルポンプの動作によって発生する気体圧縮熱および動作部材の摩擦熱の少なくも一方を利用するものであることを特徴とする請求項3に記載のメカニカルポンプ。
- 請求項1乃至5のいずれか1つに記載の前記メカニカルポンプと、該メカニカルポンプによってガスが排出される処理室と、処理室とメカニカルポンプとの間の配管とを有し、前記処理室および前記配管の少なくとも一方の内表面上に、不動態膜を有することを特徴とする半導体製造装置。
- 請求項1乃至5のいずれか1つに記載の前記メカニカルポンプと、該メカニカルポンプによってガスが排出される処理室と、処理室とメカニカルポンプとの間の配管とを有し、前記処理室および前記配管の少なくとも一方の内表面上に、不動態膜を有することを特徴とする薄型ディスプレイ製造装置。
- 請求項1乃至5のいずれか1つに記載の前記メカニカルポンプと、該メカニカルポンプによってガスが排出される処理室と、処理室とメカニカルポンプとの間の配管とを有し、前記処理室および前記配管の少なくとも一方の内表面上に、不動態膜を有することを特徴とする太陽電池製造装置。
- 請求項1乃至5のいずれか1つに記載の前記メカニカルポンプの製造方法であって、前記イットリア膜をゾルゲル法によって形成することを特徴とするメカニカルポンプの製造方法。
- 250乃至1000℃の範囲の熱処理を伴うゾルゲル法によって前記イットリア膜を形成することを特徴とする請求項9に記載のメカニカルポンプの製造方法。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006271816A JP2008088912A (ja) | 2006-10-03 | 2006-10-03 | メカニカルポンプおよびその製造方法 |
US11/905,580 US20080078503A1 (en) | 2006-10-03 | 2007-10-02 | Mechanical pump operating well for a long term and method of manufacturing the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006271816A JP2008088912A (ja) | 2006-10-03 | 2006-10-03 | メカニカルポンプおよびその製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2008088912A true JP2008088912A (ja) | 2008-04-17 |
Family
ID=39259977
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006271816A Pending JP2008088912A (ja) | 2006-10-03 | 2006-10-03 | メカニカルポンプおよびその製造方法 |
Country Status (2)
Country | Link |
---|---|
US (1) | US20080078503A1 (ja) |
JP (1) | JP2008088912A (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011065218A1 (ja) * | 2009-11-26 | 2011-06-03 | 国立大学法人東北大学 | 表面保護膜、接ガス部材、ガス処理装置及びメカニカルポンプ |
JP2012021508A (ja) * | 2010-07-16 | 2012-02-02 | Tohoku Univ | 処理装置 |
JP2012117369A (ja) * | 2010-11-12 | 2012-06-21 | Tohoku Univ | 処理装置 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6616611B2 (ja) * | 2015-07-23 | 2019-12-04 | エドワーズ株式会社 | 排気システム |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01177486A (ja) * | 1987-12-28 | 1989-07-13 | Ebara Corp | 真空ポンプ |
JPH02294589A (ja) * | 1989-05-10 | 1990-12-05 | Unozawagumi Tekkosho:Kk | ガス希釈をともなう逆流冷却式多段ロータリー形真空ポンプ |
JPH104083A (ja) * | 1996-06-17 | 1998-01-06 | Kyocera Corp | 半導体製造用耐食性部材 |
JPH10184576A (ja) * | 1996-12-26 | 1998-07-14 | Matsushita Electric Ind Co Ltd | 真空排気システム |
JPH10209058A (ja) * | 1997-12-17 | 1998-08-07 | Furukawa Electric Co Ltd:The | 有機金属気相成長装置 |
JPH11270483A (ja) * | 1998-03-23 | 1999-10-05 | Taiko Kikai Industries Co Ltd | ドライ真空ポンプ |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4327155A (en) * | 1980-12-29 | 1982-04-27 | General Electric Company | Coated metal structures and method for making |
JP2515831B2 (ja) * | 1987-12-18 | 1996-07-10 | 株式会社日立製作所 | スクリユ―真空ポンプ |
JPH0765585B2 (ja) * | 1988-09-28 | 1995-07-19 | 株式会社日立製作所 | 半導体製造装置に用いるドライスクリュ真空ポンプ |
US5585136A (en) * | 1995-03-22 | 1996-12-17 | Queen's University At Kingston | Method for producing thick ceramic films by a sol gel coating process |
JP3818709B2 (ja) * | 1996-11-12 | 2006-09-06 | 大亜真空株式会社 | メカニカルポンプ |
DE19709206A1 (de) * | 1997-03-06 | 1998-09-10 | Leybold Vakuum Gmbh | Vakuumpumpe |
JP3452468B2 (ja) * | 1997-08-15 | 2003-09-29 | 株式会社荏原製作所 | ターボ分子ポンプ |
US6371744B1 (en) * | 1998-03-23 | 2002-04-16 | Taiko Kikai Industries Co., Ltd. | Dry screw vacuum pump having spheroidal graphite cast iron rotors |
DE19962445A1 (de) * | 1999-12-22 | 2001-06-28 | Leybold Vakuum Gmbh | Trockenverdichtende Vakuumpumpe mit Gasballasteinrichtung |
US6682627B2 (en) * | 2001-09-24 | 2004-01-27 | Applied Materials, Inc. | Process chamber having a corrosion-resistant wall and method |
US6942929B2 (en) * | 2002-01-08 | 2005-09-13 | Nianci Han | Process chamber having component with yttrium-aluminum coating |
US7371467B2 (en) * | 2002-01-08 | 2008-05-13 | Applied Materials, Inc. | Process chamber component having electroplated yttrium containing coating |
US6776873B1 (en) * | 2002-02-14 | 2004-08-17 | Jennifer Y Sun | Yttrium oxide based surface coating for semiconductor IC processing vacuum chambers |
US7479304B2 (en) * | 2002-02-14 | 2009-01-20 | Applied Materials, Inc. | Gas distribution plate fabricated from a solid yttrium oxide-comprising substrate |
US6789498B2 (en) * | 2002-02-27 | 2004-09-14 | Applied Materials, Inc. | Elements having erosion resistance |
JP4694771B2 (ja) * | 2003-03-12 | 2011-06-08 | 財団法人国際科学振興財団 | ポンプおよびポンプ部材の製造方法 |
WO2005026717A1 (ja) * | 2003-09-10 | 2005-03-24 | Astellas Pharma Inc. | 溶媒の蒸発パターン解析方法および溶媒真空蒸発装置 |
US7241397B2 (en) * | 2004-03-30 | 2007-07-10 | Tokyo Electron Limited | Honeycomb optical window deposition shield and method for a plasma processing system |
US20070079849A1 (en) * | 2005-10-12 | 2007-04-12 | Richard Hogle | Integrated chamber cleaning system |
US7718559B2 (en) * | 2007-04-20 | 2010-05-18 | Applied Materials, Inc. | Erosion resistance enhanced quartz used in plasma etch chamber |
US20100081009A1 (en) * | 2008-09-26 | 2010-04-01 | General Electric Company | Spray Application of Liquid Precursors for CMAS Resistant Coatings |
US8398814B2 (en) * | 2009-07-08 | 2013-03-19 | Applied Materials, Inc. | Tunable gas flow equalizer |
-
2006
- 2006-10-03 JP JP2006271816A patent/JP2008088912A/ja active Pending
-
2007
- 2007-10-02 US US11/905,580 patent/US20080078503A1/en not_active Abandoned
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01177486A (ja) * | 1987-12-28 | 1989-07-13 | Ebara Corp | 真空ポンプ |
JPH02294589A (ja) * | 1989-05-10 | 1990-12-05 | Unozawagumi Tekkosho:Kk | ガス希釈をともなう逆流冷却式多段ロータリー形真空ポンプ |
JPH104083A (ja) * | 1996-06-17 | 1998-01-06 | Kyocera Corp | 半導体製造用耐食性部材 |
JPH10184576A (ja) * | 1996-12-26 | 1998-07-14 | Matsushita Electric Ind Co Ltd | 真空排気システム |
JPH10209058A (ja) * | 1997-12-17 | 1998-08-07 | Furukawa Electric Co Ltd:The | 有機金属気相成長装置 |
JPH11270483A (ja) * | 1998-03-23 | 1999-10-05 | Taiko Kikai Industries Co Ltd | ドライ真空ポンプ |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011065218A1 (ja) * | 2009-11-26 | 2011-06-03 | 国立大学法人東北大学 | 表面保護膜、接ガス部材、ガス処理装置及びメカニカルポンプ |
JP2011111363A (ja) * | 2009-11-26 | 2011-06-09 | Tohoku Univ | 表面保護膜、接ガス部材、ガス処理装置及びメカニカルポンプ |
JP2012021508A (ja) * | 2010-07-16 | 2012-02-02 | Tohoku Univ | 処理装置 |
JP2012117369A (ja) * | 2010-11-12 | 2012-06-21 | Tohoku Univ | 処理装置 |
Also Published As
Publication number | Publication date |
---|---|
US20080078503A1 (en) | 2008-04-03 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5470149B2 (ja) | 基板処理装置、半導体装置の製造方法およびクリーニング方法 | |
JP2007284717A (ja) | 触媒体化学気相成長装置 | |
JP2008088912A (ja) | メカニカルポンプおよびその製造方法 | |
TW201102511A (en) | Dry vacuum pump | |
JPH09202973A (ja) | 成膜処理装置の排気システム構造 | |
US11592025B2 (en) | Dry pump and exhaust gas treatment method | |
JP2004263629A (ja) | スクリュー真空ポンプ | |
JP5692772B2 (ja) | 表面保護膜、接ガス部材、ガス処理装置及びメカニカルポンプ | |
KR20190030163A (ko) | 배기관의 클리닝 방법 | |
JP4578780B2 (ja) | 真空ポンプ | |
JP2006066884A (ja) | 成膜方法、成膜装置及び記憶媒体 | |
JP5304934B2 (ja) | 真空ポンプの運転方法及び半導体装置の製造方法 | |
US20070020115A1 (en) | Integrated pump apparatus for semiconductor processing | |
JP6353257B2 (ja) | 排気口部品、および真空ポンプ | |
CN106637131A (zh) | 使用硅原料的成膜装置 | |
JP3831108B2 (ja) | ドライ真空ポンプ | |
JP5605638B2 (ja) | 処理装置 | |
JP2012021508A (ja) | 処理装置 | |
TW200414288A (en) | Method for cleaning a process chamber | |
JP2007198239A (ja) | 真空ポンプ | |
JP2010192736A (ja) | 原子層成長装置および方法 | |
JP2005179743A (ja) | 触媒cvd装置及び触媒cvd法 | |
JP2002180256A (ja) | 表面処理装置 | |
JP4112591B2 (ja) | 半導体装置の製造方法および基板処理装置 | |
WO2024014405A1 (ja) | 真空排気システムおよびクリーニング方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20090909 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20110629 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20110630 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20110823 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20120229 |