JP2008077072A - Imaging-element unit and imaging apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain an imaging-element unit of compact and power saving type, and that is capable of compensating camera shake, and to obtain an imaging apparatus that is compact, has low power consumption and is capable of compensating camera shake. <P>SOLUTION: The imaging-element unit comprises an imaging-element board, a relay board, and a package with at least the imaging-element board and the relay board contained therein, wherein a slider mechanism is disposed in between the imaging-element board, and the relay board for displacing the imaging-element board. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an image pickup apparatus, and more particularly to an image pickup element unit capable of correcting camera shake during shooting.

  2. Description of the Related Art Conventionally, an active camera shake correction technique that obtains a clear image by correcting optical axis shift due to camera shake has been put into practical use. Three types of camera shake correction techniques are known: a type that moves a part of the imaging optical system, a type that moves the entire imaging optical system, and a type that moves the imaging element.

As a type of moving the above-described image pickup device, there is known a device in which a substrate provided with an image pickup device is provided in a housing via a ball and the image is corrected by moving the substrate in the housing (patent) Reference 1).
JP 2006-133740 A

  However, the camera shake correction apparatus described in Patent Document 1 uses a flexible printed circuit board for transmitting and receiving signals between the image sensor and an external control board. For this reason, when the image pickup element is displaced in the image pickup plane during camera shake correction, the flexible printed circuit board must also be moved.

  For this reason, a very large driving force is required to displace the image sensor in the plane against the repulsive force generated by the bending of the flexible printed circuit board, which is an obstacle to miniaturization and power saving.

  In view of the above problems, an object of the present invention is to obtain a small and low-power image sensor unit capable of correcting camera shake, and to obtain a small and low power consumption image capturing apparatus capable of correcting camera shake.

  The above object is achieved by the invention described below.

  1. An image sensor substrate on which an image sensor for photoelectrically converting incident light is formed or disposed, and a signal between the image sensor substrate and an external control board, and a signal between the image sensor substrate and the external control board And a relay mechanism for displacing the image pickup device substrate between the image pickup device substrate and the relay substrate, and a relay substrate that includes at least the image pickup device substrate and the relay substrate. An image sensor unit characterized by comprising:

  2. 2. The image sensor unit according to 1, wherein driving power for the image sensor is supplied through a contact portion of the slider mechanism.

  3. 3. The image sensor unit according to 1 or 2, wherein a signal is exchanged between the image sensor substrate and the relay substrate in a non-contact manner.

  4). 4. The imaging element unit according to any one of 1 to 3, wherein at least one of a driving coil and a position detection sensor is disposed on the imaging element substrate.

  5. 4. The imaging element unit according to any one of 1 to 3, wherein a driving coil is disposed on the slider mechanism.

  6). 6. The image pickup device unit according to 4 or 5, wherein a magnet facing the driving coil is disposed outside the package.

  7. 6. The image pickup device unit according to 4 or 5, wherein a magnet facing the driving coil is disposed inside the package.

  8. An imaging device comprising: the imaging device unit according to any one of 8.1 to 7; and an imaging optical system that guides subject light to the imaging device unit, and performing camera shake correction by displacing the imaging device substrate. apparatus.

  According to the present invention, it is possible to obtain a small-size and power-saving image sensor unit capable of correcting camera shake. By including this image sensor unit, an image pickup apparatus having a small and low power consumption camera shake correction function can be obtained. Can be obtained.

  Hereinafter, the present invention will be described in detail with reference to embodiments, but the present invention is not limited thereto.

  FIG. 1 is an external view showing a camera which is an example of an imaging apparatus equipped with an imaging element unit according to the present embodiment. 1A is a perspective view of the front side of the camera, and FIG. 1B is a perspective view of the back side of the camera.

  In FIG. 1A, reference numeral 80 denotes a lens barrel. 82 is a finder window, 83 is a release button, 84 is a flash light emitting unit, 86 is a microphone, 87 is a strap attaching unit, and 88 is a USB terminal. Reference numeral 89 denotes a slide cover, and the lens barrel 80 is retracted when not photographing.

  In FIG. 1B, 91 is a viewfinder eyepiece, 92 is a red and green display lamp, and displays AF and AE information to the photographer by light emission or blinking when the release button 83 is pressed. It is. A zoom button 93 is a button for zooming up and zooming down. Reference numeral 94 denotes a speaker, which reproduces sound recorded by the microphone 86, emits a release sound, and the like. Reference numeral 95 denotes a menu / set button, reference numeral 96 denotes a selection button, which is a four-way switch, and reference numeral 100 denotes an image or other character information on the monitor LCD. The menu / set button 95 has a function of displaying various menus on the monitor LCD 100, selecting with the selection button 96, and confirming with the menu / set button 95. Reference numeral 97 denotes a playback button, which is a button for playing back a captured image. A display button 98 is a button for selecting display or deletion of an image or other character information displayed on the monitor LCD 100. Reference numeral 99 denotes an erase button, which is a button for erasing the recorded image. 101 is a tripod hole, and 102 is a battery / card cover. The battery / card cover 102 is loaded with a battery for supplying power to the camera and a card-type removable memory for recording captured images.

  FIG. 2 is a schematic longitudinal sectional view at the time of photographing of the lens barrel 80 of the image pickup apparatus in which the image pickup device unit 5 according to the present embodiment is mounted. This figure shows the wide state.

  In FIG. 2, 1 is a first lens group, 2 is a second lens group, 3 is a third lens group, and an imaging optical system is formed by these three lens groups. When performing zooming, the first lens group 1 and the second lens group 2 are moved in the optical axis direction, and when performing focusing, the third lens group 3 is moved in the optical axis direction. Reference numeral 4 denotes an optical filter in which an infrared light cut filter and an OLPF (optical low pass filter) are stacked. An image sensor unit 5 includes an image sensor that photoelectrically converts imaged subject light, and is, for example, a CCD (Charge Coupled Device) image sensor or a CMOS (Complementary Metal-Oxide Semiconductor) image sensor.

  The first lens group 1 is held by a first lens barrel 6, the second lens group 2 is held by a second lens barrel 7, and the third lens group 3 is held by a third lens barrel 8.

  Reference numeral 11 denotes a fixed barrel, which is integrally fixed to a camera body (not shown) and has a cam groove 11a on the inner periphery. A base plate 12 is fixed to the rear portion of the fixed drum 11. Then, the OLPF 4 and the image sensor unit 5 are mounted on the base plate 12 in order. The image sensor unit 5 is electrically connected to the printed circuit board 13.

  A cam cylinder 14 has a cam pin 14a that engages with the cam groove 11a of the fixed cylinder 11 formed on the outer periphery, and a partial gear 14b formed on a part of the rear part. A cam groove 14c is formed on the inner periphery.

  Reference numeral 15 denotes a front cylinder, which holds the first lens barrel 6. Three metal cam pins 16 are erected on the outer periphery of the front cylinder 15 and are engaged with the cam grooves 14 c of the cam cylinder 14.

  Although not shown, a cam pin is also erected on the second lens barrel 7 and is engaged with a cam groove different from the cam groove 14 c of the cam cylinder 14.

  The cam cylinder 14 is assembled so that the rectilinear movement member 17 and the rectilinear guide plate 18 are rotatable and can move as the cam cylinder 14 moves in the optical axis direction. The rectilinear guide plate 18 is engaged with a rectilinear guide portion 11m formed in the fixed cylinder 11 as shown in the figure, and a drive gear 21 meshed with the partial gear 14b is pivotally supported. The drive gear 21 meshes with the long gear 22. The long gear 22 is driven by a motor and a reduction gear train (not shown).

  As shown in the figure, the rectilinear guide plate 18 contacts and slides on the annular surface of the cam cylinder 14 on the image sensor unit 5 side, and the rectilinearly moving member 17 contacts and slides on the inner surface of the cam cylinder 14. It is supposed to be. Further, the rectilinear movement member 17 is formed with a rectilinear guide portion 17t that engages with the front cylinder 15 and the second lens group frame 7 and guides the front cylinder 15 and the second lens group frame 7 in a straight line. Reference numeral 33 denotes an aperture shutter unit, which is fixed to the second lens barrel 7. Alternatively, the front tube 15 may be guided in a straight line by the straight guide portion 17t, and the second lens group frame 7 may be guided in a straight line by engaging the front tube 15 that moves straight and the second lens group frame 7.

  Reference numeral 41 denotes a focus motor, to which a feed screw 42 is connected. A rotation-controlled nut 43 is screwed onto the feed screw 42, and the arm portion of the third lens group frame 8 is pressed against the nut 43 by a spring 44. As a result, when the feed screw 42 is rotated by the focus motor 41, the nut 43 moves in the direction of the optical axis O. Accordingly, the third lens group frame 8 is moved in the direction of the optical axis O, and during focusing and collapsing. A move is made.

  With the configuration as described above, when the motor (not shown) is driven to rotate in a predetermined direction from the wide state to the tele state shown in FIG. 2, the cam cylinder 14 is rotated by the long gear 22 and the drive gear 21. Thus, the front lens 15 to which the cam pin 16 engaged with the cam groove 14c formed on the inner periphery of the cam cylinder 14 is fixed and the second lens group engaged with the cam groove (not shown) formed on the cam cylinder 14 are secured. The frame 7 is guided straight by the straight guide 17t, moves in the direction of the optical axis O, and zooming is performed.

  On the other hand, from the wide state shown in FIG. 2 to the retracted state, the focus motor 41 is first driven to move the third lens group frame 8 to the image sensor unit 5 side, and then a motor (not shown) is rotated in the reverse direction. The cam cylinder 14 is reversely rotated by the long gear 22 and the drive gear 21. As a result, the cam cylinder 14 is guided to the cam groove 11 a formed in the fixed cylinder 11 and moves to the image pickup device unit 5 side, and the cam pin 16 engaged with the cam groove 14 c formed on the inner periphery of the cam cylinder 14 is fixed. The second lens group frame 7 engaged with a cam groove (not shown) formed in the front cylinder 15 and the cam cylinder 14 is linearly guided by the linear guide portion 17t and moved toward the image sensor unit 5, The retracted state becomes. At this time, the rectilinear movement member 17 and the rectilinear guide plate 18 move linearly with the cam cylinder 14.

  The above is the schematic configuration and operation outline of the lens barrel 80. Hereinafter, the image sensor unit 5 according to the present embodiment will be described in detail.

  FIG. 3 is a cross-sectional view of the image sensor unit 5 according to the present embodiment. FIG. 2 schematically shows the internal configuration of the image sensor unit 5.

  In the figure, reference numeral 51 denotes a package. 52 is a relay board, and the relay board 52 is connected to the flexible printed circuit board 13 (see FIG. 2) used for connection with an external control board. 53 is a cover glass.

  Reference numeral 55 denotes an image sensor substrate. An image sensor 54 in which a light receiving element array is two-dimensionally arranged is formed on the image sensor substrate 55. That is, in this example, the image sensor 54 and the image sensor substrate 55 are formed of the same silicon chip. The image pickup device substrate 55 and the relay substrate 52 are electrically connected by a plurality of wire bondings 59.

  Although not shown, the image sensor substrate 55 is provided with a biasing member such as a spring that biases the image sensor substrate 55 toward the relay substrate 52. As a result, the image pickup device substrate 55 to the relay substrate 52 are pressed and are not separated in any posture.

  A slider mechanism 60 is disposed between the image pickup device substrate 55 and the relay substrate 52, and in-plane displacement in a direction perpendicular to the optical axis O (X and Y directions in the drawing) is enabled with respect to the relay substrate 52. Yes. In the slider mechanism 60, a first slider 57 is disposed on a fixed portion 56 fixed to the relay substrate 52 via a ball, and a second slider 58 is disposed on the first slider 57 via a ball, and the second slider 58. The image pickup device substrate 55 is fixed to. That is, the movement of the first slider 57 and the second slider 58 enables the image pickup device substrate 55 to be displaced in two orthogonal directions (X and Y directions in the drawing) within a plane orthogonal to the optical axis O. Furthermore, magnets 65 and 66 are arranged on the back surface of the cover glass 53.

  FIG. 4 is a plan view of the relay board 52. In FIG. 4, two lands 56 a and 56 b are formed on the surface of the relay substrate 52. In the land 56a, two V-shaped grooves VG1 and VG2 having a V-shaped bottom are formed, and in the land 56b, one groove FG1 having a flat bottom is formed.

  A V-shaped groove VG1 and a groove (hereinafter referred to as a groove) FG1 having a flat bottom are shown as schematic views in FIGS. 5 (a) and 5 (b), respectively. Since VG1 and VG2 are formed in the same shape, only VG1 is shown as an example.

  Reference numerals 111, 112, and 113 denote balls disposed in the V-shaped grooves VG1, VG2, and the groove FG1, each of which has a conductive surface, for example, a conductive metal material or a surface thereof. A conductive coat is applied. Conductive patterns are formed in the V-shaped grooves VG1, VG2, and the groove FG1, and the VG1, VG2, and FG1 and the balls 111, 112, and 113 are in physical and electrical contact with each other and become conductive. . VG1, VG2, and FG1 on which the conductive pattern is formed are illustrated by hatched portions in FIGS. 5 (a) and 5 (b).

  Further, on the relay substrate 52, a camera shake correction control IC 120 and a controller IC 126 for the image sensor are arranged. On both sides of the relay substrate 52, a plurality of solder lands 56C and 56d are indicated by hatching in FIG. 4 and are connected to an external circuit (not shown).

  A plurality of lead frames 56e1 and 56e2 project from the relay substrate 52. The power supply Vp is supplied from the predetermined lead frame 56e1 to the relay substrate 52, and the control signal is supplied from the lead frame 56e2. Further, each of the power supply Vp, the digital circuit power supply Vd, and the ground line G to the relay board is connected to the balls 111, 112, 113 from the corresponding lead frame 56e1 via the conductive pattern. The controller IC 126 of the image sensor is connected to a plurality of lead frames 56e2.

  FIGS. 6A, 6 </ b> B, 7 </ b> A, and 7 </ b> B are diagrams showing details of the slider mechanism 60.

  FIG. 6A and FIG. 6B illustrate two surfaces of the first slider 57. FIG. 6A illustrates the surface of the first slider facing the relay substrate 52, and FIG. 6B illustrates the surface of the first slider facing the second slider 58. ing.

  As shown in FIG. 6A, two V-shaped grooves VG3 and VG4 and a groove FG2 are formed on the surface of the first slider 57 facing the relay substrate 52, and the balls 111, 112, and 113 are respectively It is arranged in the groove.

  The first slider 57 is disposed in parallel with the relay substrate 52, and the V-shaped grooves VG3 and VG4 are disposed to face each other VG1 and VG2 on the relay substrate. Similarly, the groove FG2 of the first slider 57 is disposed so as to face the groove FG1 of the relay substrate 52. The V-shaped grooves VG3 and VG4 and the groove FG2 have the same structure as the V-shaped grooves VG1VG2 and the groove FG1 illustrated in FIGS. 5 (a) and 5 (b).

  A yaw direction driver circuit 125 is disposed at the center of the surface of the first slider 57 facing the relay substrate 52.

  With the above configuration, the power power source Vp, the digital circuit power source Vd, and the ground line G are connected to the first slider 57 via the relay substrate 52 and the balls 111, 112, and 113.

  On the surface of the first slider 57 facing the second slider 58, three grooves are formed as shown in FIG. 6B. The grooves VG5 and VG6 are formed in a V shape as shown in FIG. 5A, and the groove FG3 is a groove having a flat bottom as shown in FIG. 5B. Balls 114, 115, and 116 are disposed in V-shaped grooves VG5, VG6, and groove FG3, respectively.

  The Y coil 124 is formed on the surface of the first slider 57 that faces the second slider 58, and includes a magnet 66 disposed on the cover glass 53 in order to move the imaging device substrate 55 in the yaw direction. Producing electromagnetic force.

  The power supply Vp, the digital circuit power supply Vd, and the ground line G are connected to the surface of the first slider 57 facing the second slider 58 through the through hole shown in FIG.

  The power supply Vp is in contact with the ball 114, the digital circuit power supply Vd is in contact with the ball 115, and the ground line G is in contact with the ball 116. These contacts are made through a conductive pattern formed at a position in contact with the through hole.

  7A is a diagram showing a surface of the second slider 58 facing the first slider 57, and FIG. 7B is a diagram showing a surface of the second slider 58 to which the image sensor substrate 55 is attached. is there.

  FIG. 7A shows V-shaped grooves VG7 and VG8 and a groove FG4 having a flat bottom surface. These VG7, VG8, and FG4 are the same as those shown in FIGS. 5 (a) and 5 (b). In FIG. 7B, through holes 204, 205, and 206 are shown.

  FIG. 8A and FIG. 8B are diagrams showing two surfaces of the image sensor substrate 55.

  FIG. 8A shows the surface of the image sensor substrate 55 on which the second slider 58 is attached. On this surface, a P-coil 123 and an image sensor controller 127 are arranged. The P coil 123 generates an electromagnetic force with the magnet 66 disposed on the cover glass 53 in order to move the image sensor substrate 55 in the pitch direction.

  FIG. 8B shows a surface of the image pickup device substrate 55 opposite to the second slider 58, and is a pitch direction driver circuit 122 for driving the image pickup device 54 and the P coil 123, and a position detection sensor. A biaxial Hall element sensor 121 is provided. The biaxial Hall element sensor 121 is provided at a position facing the magnet 65 on the back surface of the cover glass.

  On both sides of the image pickup device substrate 55, a plurality of solder lands 55c for wire bonding shown by hatching are provided.

  9, 10, and 11 are cross-sectional views showing the HH cross section, the II cross section, and the JJ cross section of FIG. 3, respectively, and simply show the internal configuration of the slider mechanism 60.

  FIG. 12 is a diagram illustrating a schematic configuration of a power supply related to the camera shake correction control circuit.

  As shown in the figure, the power power Vp is supplied to the pitch direction driver circuit 122 and the yaw direction driver circuit 125, and the digital circuit power Vd is supplied to the camera shake correction control IC 120 and the biaxial Hall element sensor 121. ing.

  An outline of the camera shake correction operation of the image sensor unit 5 as described above will be described.

  The camera includes a sensor that detects a swing in the pitch direction (Y direction) (not shown) and a sensor that detects a swing in the yaw direction (X direction). Based on the sensor outputs in the two directions, the camera shake correction control IC 120 controls the pitch direction driver circuit 122 and the yaw direction driver circuit 125 to energize the P coil 123 and the Y coil 124 that are driving coils. As a result, the image sensor substrate 55 is displaced in the plane, and the in-plane displacement amount of the image sensor substrate 55 is detected by the output of the biaxial Hall element sensor 121 and fed back to the energization to the P coil 123 and the Y coil 124. . In this way, the shake correction operation is performed by feedback control of the displacement of the image pickup device substrate 55.

  As described in the above embodiment, the driving load is reduced by supplying driving power to the image sensor unit 5 via the contact portion (ball) of the slider mechanism 60, and displacement is performed with a small driving force. It is possible to reduce the size and power consumption.

  Next, an example in which signal exchange is performed in a non-contact manner will be described in more detail with reference to FIGS.

  FIG. 13 is a plan view of a relay substrate 52 used in an image sensor unit that performs transmission and reception of signals in a non-contact manner.

  FIG. 14 is a cross-sectional view of the image sensor unit that performs signal transmission and reception in a non-contact manner, cut along the H′-H ′ cross section shown in FIG. 13.

  In the following drawings, the same parts as those of the image sensor unit shown in FIGS. 3 and 4 will be described by assigning the same reference numerals in order to avoid redundant description.

  As shown in FIGS. 13 and 14, the imaging element substrate 55 is provided with a light emitting element 71 (for example, a light emitting diode), and a light receiving element 72 (for example, a photodiode) is provided in the vicinity of the position where the relay substrate 52 faces. ing. In another position, a light emitting element 73 is provided on the relay substrate 52, and a light receiving element 74 is provided in the vicinity of the position where the imaging element substrate 55 faces.

  A control signal from an external control board is transmitted as an optical signal to the image sensor board 55 by the light emitting element 73 and the light receiving element 74, and an image signal obtained by the image sensor 54 is relayed as an optical signal by the light emitting element 71 and the light receiving element 72. It is transmitted to the substrate and sent out of the image sensor unit. In other words, the transmission / reception of signals between the image pickup device substrate 55 and the relay substrate 52 is performed by non-contact optical communication.

  Note that transmission / reception of signals between the imaging element substrate 55 and the relay substrate 52 is not limited to the above-described light, and radio waves may be used. Although not shown in the same manner as FIG. 3, an urging member such as a spring for urging the image sensor substrate 55 toward the relay substrate 52 is disposed on the image sensor substrate 55. As a result, the image pickup device substrate 55 to the relay substrate 52 are pressed and are not separated in any posture.

  In this way, by supplying the drive power of the image sensor unit via the ball that is the contact portion of the slider mechanism, and performing the transfer of signals between the image sensor substrate and the relay substrate in a non-contact manner, Compared to connecting with a wire, the driving load can be reduced, the displacement can be made with a small driving force, and the image sensor unit can be reduced in size and save electric power and capable of correcting camera shake.

  FIG. 15 is a cross-sectional view showing another example of the image sensor unit according to the present embodiment.

  The image sensor unit shown in the figure has a magnet 66 facing the drive coil of the image sensor unit shown in FIG. 3 and a magnet 65 facing the biaxial Hall element sensor arranged on the outside of the package, that is, on the outer surface of the cover glass. It is a thing. Further, this configuration can also be applied to an image sensor unit that performs transmission and reception of signals shown in FIG. 14 in a non-contact manner. Further, either one of the magnets may be arranged outside the cover glass, that is, outside the package, and the other magnet may be arranged so as to be inside the cover glass, that is, inside the package.

  As described above, the image pickup device substrate, the relay substrate, and the package including at least the image pickup device substrate and the relay substrate are included, and the image pickup device substrate is displaced between the image pickup device substrate and the relay substrate. By adopting an image sensor unit with a slider mechanism, the part that is displaced for camera shake correction is only a lightweight image sensor substrate, which can be displaced with a small driving force, and is small and power-saving. An image sensor unit can be obtained. Furthermore, by providing this image sensor unit, it is possible to obtain an image pickup apparatus having a small and low power consumption camera shake correction function.

  In the above embodiment, the image pickup device 54 and the image pickup device substrate 55 are described as being formed of the same silicon chip. However, the present invention is not limited to this, and the image pickup device substrate 55 is a normal printed board. The driving coil 61 may be formed by forming the imaging element 54 and the biaxial Hall element sensor 62 on the printed board.

  In addition, one of the biaxial Hall element sensor 62 and the driving coil 61 may be disposed on the image sensor substrate 55, and the other may be disposed on the second slider 58 of the slider mechanism 60.

  Further, the example in which the optical filter 4 is disposed as a separate member in front of the cover glass 53 has been described. However, the cover glass 53 may also be used as an OLPF.

  Furthermore, although an explanation has been given using an ordinary camera as an example of an imaging apparatus, camera shake correction can be performed using an imaging element unit 5 of the present embodiment for an imaging apparatus such as a camera module built in a mobile phone, a PDA, or the like. Needless to say, the image pickup apparatus can be a simple image pickup apparatus.

It is an external view which shows the camera which is an example of the imaging device carrying the image pick-up element unit which concerns on this Embodiment. It is a schematic longitudinal cross-sectional view at the time of imaging | photography of the lens barrel of the imaging device carrying the image pick-up element unit which concerns on this Embodiment. It is sectional drawing of the image pick-up element unit which concerns on this Embodiment. It is a top view of the relay substrate concerning this embodiment. It is a conceptual diagram of the groove structure which concerns on this Embodiment. It is a top view of the 1st slider concerning this embodiment. It is a top view of the 2nd slider which concerns on this Embodiment. It is a top view of the image sensor substrate concerning this embodiment. It is HH sectional drawing of FIG. It is II sectional drawing of FIG. It is JJ sectional drawing of FIG. It is a figure which shows the schematic structure regarding the power supply regarding a camera-shake correction control circuit. It is a top view of the relay board | substrate 52 used for the image pick-up element unit which performs transmission / reception of a signal by non-contact. It is sectional drawing which cut | disconnected the image pick-up element unit which performs transmission / reception of a signal by non-contact in the H'-H 'cross section shown in FIG. It is sectional drawing which shows the other example of the image pick-up element unit which concerns on this Embodiment.

Explanation of symbols

5 Image Sensor Unit 13 Flexible Printed Circuit Board 51 Package 52 Relay Board 53 Cover Glass 54 Image Sensor 55 Image Sensor Board 56 Fixed Part 57 First Slider 58 Second Slider 60 Slider Mechanism 65, 66 Magnet 71, 73 Light Emitting Element 72, 74 Light Receiving Element 111, 112, 113, 114, 115, 116 Ball 121 Two-axis Hall element O Optical axis

Claims (8)

An image sensor substrate on which an image sensor for photoelectrically converting incident light is formed or disposed, and a signal between the image sensor substrate and an external control board, and a signal between the image sensor substrate and the external control board A relay board that exchanges, and a package that includes at least the imaging device board and the relay board,
An image sensor unit, wherein a slider mechanism for displacing the image sensor substrate is disposed between the image sensor substrate and the relay substrate. The image sensor unit according to claim 1, wherein driving power for the image sensor is supplied through a contact portion of the slider mechanism. The image sensor unit according to claim 1 or 2, wherein signals are exchanged between the image sensor substrate and the relay substrate in a non-contact manner. The image sensor unit according to claim 1, wherein at least one of a driving coil and a position detection sensor is disposed on the image sensor substrate. The imaging element unit according to claim 1, wherein a driving coil is disposed on the slider mechanism. The image sensor unit according to claim 4, wherein a magnet facing the driving coil is disposed outside the package. 6. The image sensor unit according to claim 4, wherein a magnet facing the driving coil is disposed inside the package. An image pickup device unit according to claim 1, and an image pickup optical system that guides subject light to the image pickup device unit, wherein the image pickup device substrate is displaced to perform camera shake correction. An imaging device.

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