JP2008060522A - Electronic element, current control device, arithmetic device, and display device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic element that is capable of high-speed response, to provide a current control device that has the electronic element, and to provide an arithmetic device and a display device that have the electronic element or the current control device. <P>SOLUTION: The electronic element comprises: a first electrode layer that is formed on a portion of a substrate; an insulating layer that is formed at least on the first electrode layer; a conductive layer that is formed on the insulating layer formed on an area where the first electrode layer is formed; a second electrode layer that is formed on one side of an area, which does not have the first electrode layer, on the substrate; a third electrode layer that is formed on the other side of the area, which does not have the first electrode layer, on the substrate; and a semiconductor layer that is formed so as to cover the conductive layer. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an electronic element, a current control device, an arithmetic device, and a display device.

  Currently, typical display devices used for information display and the like are CRTs, liquid crystal display devices, and EL display devices. CRTs have been widely used as display devices from the viewpoint of relatively low device cost and high display quality, but it is difficult to reduce the size and power consumption of a cathode ray tube. Against this background, the demand for liquid crystal display devices, and more recently, EL display devices has been rapidly increasing. Further, IC tags that can read and write data without contact are expected to have a large market in the future for logistics and personal information management purposes, and a large number of arithmetic devices are incorporated therein.

  On the other hand, typical active elements used in display devices and arithmetic devices are transistors having a semiconductor material, a first electrode (gate electrode), a second electrode (source electrode), and a third electrode (drain electrode). is there. General structures of the transistor include a planar type (see FIG. 22A) and an inverted stagger type (see FIG. 22B).

  With regard to semiconductor materials, in recent years, organic semiconductor materials that can be applied with a coating process have been actively developed. An organic semiconductor device that can be manufactured by coating does not need to use a vacuum film formation process, so that the manufacturing cost can be greatly reduced.

In recent years, polythiophene materials have attracted attention as organic semiconductor materials that can be applied by a coating process and have high mobility (see Non-Patent Document 1), but the mobility is less than 0.1 cm ² / V · sec. Yes, it is almost an order of magnitude smaller than amorphous silicon. For this reason, in general, in the case of a transistor using an organic semiconductor material, the cutoff frequency, which is an index of high-speed response, is on the order of kHz, and driving a high-definition video display device that requires a cutoff frequency of several MHz or more Cannot be used for IC tags.

  As a means for improving the cutoff frequency, in addition to increasing the mobility of the organic semiconductor material, it is possible to shorten the channel length of the transistor. However, in order to pattern the source electrode and the drain electrode with a channel length of about 1 μm or less, generally, a complicated process and an expensive manufacturing apparatus are required, which increases the manufacturing cost.

  In order to solve such a problem, an SIT structure (see FIG. 23A) in which a source electrode, a gate electrode, and a drain electrode are sequentially stacked is known. In the case of the SIT structure, ON / OFF of the current between the source electrode and the drain electrode increases the depletion layer of the semiconductor layer by applying a gate voltage as shown in FIG. Control is performed by increasing the resistance between the drain electrodes.

  As can be seen from FIG. 23A, since the channel length of the SIT structure can be controlled by the film thickness of the semiconductor layer, the manufacturing process is very easy in shortening the channel, and the response speed is high. Expected as a transistor. However, the SIT structure has a problem that when the gap between the gate electrodes is increased, the depletion layer does not spread over the entire region in the channel width direction, and the current at OFF is increased. For this reason, it is necessary to perform patterning so that the distance between the gate electrodes is less than 1 μm, and the manufacturing process requires complicated steps.

  Furthermore, in order to improve the cutoff frequency, it is necessary to reduce the parasitic capacitance inside the element. For example, in the case of FIG. 22A, the parasitic capacitance is formed by sandwiching the gate insulating film between the gate electrode and the source electrode and between the gate electrode and the drain electrode. In the case where the parasitic capacitance is large, a portion unrelated to the circuit operation is charged by application of the gate voltage, so that high-speed response becomes difficult. In addition, when the gate voltage is high frequency, the impedance due to the capacitor becomes very small, so the gate current flows to the source electrode and drain electrode, and the power consumption of the element becomes very large. It becomes difficult to apply to a driving application.

  Therefore, in the case of the planar type, it is necessary to align the gate electrode, the source electrode, and the drain electrode so that they hardly overlap each other, but in particular, when the material of the substrate is a material that easily contracts like a resin film, This alignment becomes more difficult as the area increases.

  Similarly, in the case of the SIT structure, in the case of FIG. 23A, since the gate electrode, the source electrode, and the drain electrode sandwich the semiconductor layer to form a parasitic capacitance, high speed operation and low power consumption are achieved. Trouble occurs in. Further, it is very difficult to align the source electrode and the drain electrode so as not to overlap with the finely processed gate electrode.

  Therefore, in Patent Document 1, a first electrode formed on a substrate and having a convex portion, an insulating layer covering the first electrode, and a convex of the first electrode formed on the insulating layer. The second electrode located above the first electrode and at least one of the two sides of the first electrode convex portion are positioned with the insulating layer interposed therebetween, and from the height of the first electrode convex portion. A field effect transistor comprising: a lower third electrode; and a semiconductor layer in contact with the second electrode and the third electrode and separated from the first electrode by the insulating layer It is disclosed.

  In Patent Document 2, (A) a gate electrode formed on a substrate, having a top surface, a first side surface, and a second side surface, and having a substantially square cross-sectional shape, and (B) a top surface of the gate electrode. (1) an insulating film formed on the first side surface and the second side surface; (C) a first source / drain electrode formed on a portion of the insulating film located on the top surface of the gate electrode; D) a second source / drain electrode formed on the portion of the substrate facing the first side of the gate electrode, and (E) formed on the portion of the substrate facing the second side of the gate electrode. A third source / drain electrode, and (F) a semiconductor material layer formed from the second source / drain electrode through the first source / drain electrode to the third source / drain electrode. , The gate electrode, the first source / drain electrode, and the first side surface of the gate electrode A first channel effect region comprising a semiconductor material layer portion formed on a portion of the insulating film located on the gate electrode and a second source / drain electrode constitute a first field effect transistor, and a gate electrode A second channel forming region comprising: a first source / drain electrode; a semiconductor material layer portion formed on a portion of the insulating film located on the second side surface of the gate electrode; A field effect transistor is disclosed in which a second field effect transistor is constituted by a source / drain electrode.

However, these structures make it difficult to respond at high speed because a parasitic capacitance is formed between the gate electrode and the source or drain electrode.
JP 2005-19446 A JP 2004-349292 A Applied Physics Letter, vol. 69. p4108 (1996)

  The present invention provides an electronic device capable of high-speed response, a current control device including the electronic device, an arithmetic device including the electronic device or the current control device, and a display device in view of the above-described problems of the related art. For the purpose.

  According to a first aspect of the present invention, in the electronic device, the first electrode layer is formed on a part of the substrate, and the insulating layer is formed on at least the first electrode layer. A conductive layer is formed on an insulating layer formed in a region where one electrode layer is formed, and the first electrode layer in a region where the first electrode layer is not formed on the substrate A second electrode layer is formed on one side of the substrate, and the second electrode with respect to the first electrode layer in a region where the first electrode layer is not formed on the substrate A third electrode layer is formed on the side where the layer is not formed, and a semiconductor layer is formed so as to cover the conductive layer. Thereby, an electronic device capable of high-speed response can be provided.

  According to a second aspect of the present invention, in the electronic device, the first electrode layer is formed on a part of the substrate, the insulating layer is formed on at least the first electrode layer, and the insulating A semiconductor layer is formed so as to cover the first electrode layer on which the layer is formed, and a conductive layer is formed on the semiconductor layer formed in the region where the first electrode layer is formed. A second electrode layer is formed on one side of the region of the substrate where the first electrode layer is not formed with respect to the first electrode layer. A third electrode layer is formed on a side where the second electrode layer is not formed with respect to the first electrode layer in a region where one electrode layer is not formed. Thereby, an electronic device capable of high-speed response can be provided.

  According to a third aspect of the present invention, in the electronic device according to the first or second aspect, the second electrode layer, the third electrode layer, and the conductive layer are made of the same material. Thereby, an electronic element can be manufactured easily.

  Invention of Claim 4 is an electronic element as described in any one of Claims 1 thru | or 3. WHEREIN: The said semiconductor layer, an insulating layer, a 1st electrode layer, a 2nd electrode layer, a 3rd electrode layer At least one of the conductive layers is formed by coating. Thereby, manufacturing cost can be reduced.

  According to a fifth aspect of the present invention, in the electronic device according to any one of the first to fourth aspects, the insulating layer is formed using a dipping method. Thereby, an insulating layer with little film thickness unevenness can be formed.

  The invention according to claim 6 is the electronic device according to any one of claims 1 to 5, wherein the insulating layer is made of an insulating material whose critical surface tension changes when energy is applied thereto. At least one of the second electrode layer, the third electrode layer, and the conductive layer is formed by coating. Thereby, patterning can be performed on the insulating layer with high definition.

  According to a seventh aspect of the present invention, in the electronic device according to any one of the first to sixth aspects, at least one of the second electrode layer, the third electrode layer, and the conductive layer is at least two kinds. The composition ratio of the two or more kinds of materials varies with respect to the film thickness direction. Thereby, the work functions of the second electrode layer, the third electrode layer, and the conductive layer can be easily controlled.

  The invention according to claim 8 is the electronic device according to claim 7, wherein at least one of the second electrode layer, the third electrode layer, and the conductive layer is electrolytically plated. And Thereby, an electronic device in which a conductive material is selectively formed on at least one of the second electrode layer, the third electrode layer, and the conductive layer can be obtained.

  According to a ninth aspect of the present invention, in the current control device, the electronic element according to any one of the first to eighth aspects, the first voltage control device for applying a voltage to the first electrode layer, and the second A current control unit for controlling a current flowing between the second electrode layer and the third electrode layer using a second voltage control device for applying a voltage to the electrode layer and the third electrode layer It is characterized by. Thereby, it is possible to provide a current control device capable of high-speed response.

  According to a tenth aspect of the present invention, in the current control device according to the ninth aspect, the current control unit is formed on a substrate. Thereby, a current control device capable of high-speed response can be obtained.

  According to an eleventh aspect of the present invention, an arithmetic device includes the electronic device according to any one of the first to eighth aspects or the current control device according to the ninth or tenth aspect. Thereby, it is possible to provide an arithmetic device capable of high-speed response.

  According to a twelfth aspect of the present invention, there is provided a display device that performs display by a change in voltage between electrodes formed on one of two opposing surfaces of two substrates provided opposite to each other. The electronic device according to claim 1 or the current control device according to claim 9 or 10 is used for pixel switching. Thereby, a display device capable of high-speed response can be provided.

  According to a thirteenth aspect of the present invention, there is provided a display device that performs display by a current flowing between electrodes formed on one of the opposing surfaces of two substrates that are provided to face each other. The electronic device according to claim 1 or the current control device according to claim 9 or 10 is used for pixel switching or pixel driving. Thereby, a display device capable of high-speed response can be provided.

  ADVANTAGE OF THE INVENTION According to this invention, the electronic device which can respond at high speed, the current control apparatus which has this electronic element, the arithmetic unit which has this electronic element or current control device, and a display apparatus can be provided.

  Next, the best mode for carrying out the present invention will be described with reference to the drawings.

  As shown in FIG. 1, the electronic device of the present invention has a first electrode layer formed on a part of a substrate, and an insulating layer is formed on at least the first electrode layer. The conductive layer is formed on the insulating layer formed in the region where the electrode layer is formed, and one side of the first electrode layer in the region where the first electrode layer is not formed on the substrate The second electrode layer is formed on the side of the substrate, and the second electrode layer is formed on the side where the second electrode layer is not formed with respect to the first electrode layer in the region where the first electrode layer is not formed on the substrate. A third electrode layer is formed, and a semiconductor layer is formed so as to cover the conductive layer.

  In the electronic device of the present invention, as shown in FIG. 21, the first electrode layer is formed on a part of the substrate, and the insulating layer is formed on at least the first electrode layer. A semiconductor layer is formed so as to cover the first electrode layer on which the insulating layer is formed, and a conductive layer is formed on the semiconductor layer formed in the region where the first electrode layer is formed. And the second electrode layer is formed on one side of the first electrode layer in the region where the first electrode layer is not formed on the substrate. The third electrode layer is formed on the side where the second electrode layer is not formed with respect to the first electrode layer in the region where no is formed.

  In the present invention, the region where the first electrode layer is formed means a region including the first electrode layer and the vicinity thereof, as shown in FIGS. The region where the first electrode layer on the substrate is not formed is the region where the first electrode layer on the substrate is formed (the region including the first electrode layer on the substrate and the vicinity thereof). It means the area to exclude. At this time, the conductive layer is not in contact with the second electrode layer and the third electrode layer. Further, the distance (channel length) between the conductive layer, the second electrode layer, and the third electrode layer is defined by at least the thickness of the first electrode layer. For this reason, it is easy to shorten the channel.

  In addition, as shown in FIGS. 1 and 21, the current control device of the present invention includes an electronic device of the present invention, a first voltage control device that applies a voltage to the first electrode layer, a second electrode layer, A second voltage control device that applies a voltage to the third electrode layer is used to control a current flowing between the second electrode layer and the third electrode layer. At this time, the current control unit is preferably formed on the substrate.

With respect to the cut-off frequency _{f c,} Appl. Phys. Lett. , Vol. 76, no. In 14, 3 April (2000), 1941-1943, the formula (1)
f _c = μV _ds / 2πL ²
Have been reported to show good agreement with experimental values. Here, μ is the carrier mobility, V _ds is the source / drain voltage, and L is the channel length. Thus, it can be seen that when the parasitic capacitance is small enough to be ignored, high-speed response can be achieved by shortening the channel.

  Since the electronic element of the present invention is self-aligned so that the first electrode layer, the second electrode layer, and the third electrode layer do not easily overlap, the parasitic capacitance can be easily reduced.

  In the electronic device shown in FIG. 1, a parasitic capacitance is formed between the first electrode layer and the conductive layer, but the voltage is applied to the first electrode layer, the second electrode layer, and the third electrode layer. In order to charge the parasitic capacitance, the semiconductor layer is interposed between the electrode layers. Here, since the resistance of the semiconductor layer is very high at the time of ON as compared with the wiring resistance, even if there appears to be parasitic capacitance, by applying a voltage to the first electrode layer, There is almost no charge between one electrode layer and a conductive layer. For this reason, the parasitic capacitance can be substantially reduced and high-speed response can be achieved.

  Also, in the electronic element shown in FIG. 21, a parasitic capacitance is formed between the first electrode layer and the conductive layer. Since the insulating layer and the semiconductor layer are stacked between the first electrode layer and the conductive layer, the parasitic capacitance between these is It becomes smaller than the case of only the insulating layer. Furthermore, since the voltage is applied between the first electrode layer and the second electrode layer and the third electrode layer, in order to charge this parasitic capacitance, the channels 1 and 2 are connected. It will be through. Here, since the resistance of the semiconductor layer is very high at the time of ON as compared with the wiring resistance, even if there appears to be parasitic capacitance, by applying a voltage to the first electrode layer, There is almost no charge between one electrode layer and a conductive layer. For this reason, it is possible to reduce the parasitic capacitance necessary for high-speed response.

  In addition, even when the voltage applied to the first electrode layer is driven at a high frequency, it is possible to suppress power consumption because almost no current flows through the second electrode layer and the third electrode layer due to the resistance of the semiconductor layer. It becomes.

  As shown in FIGS. 1 and 21, in the current control device of the present invention, when the first voltage control device applies a voltage to the first electrode layer, the conductive layer is interposed between the second electrode layer and the conductive layer. When a voltage is applied between the second electrode layer and the third electrode layer by the second voltage control device in this state, a channel is formed between the second electrode layer and the third electrode layer. The electrode layer enters the conductive layer through the semiconductor layer, is injected from the conductive layer into the semiconductor layer, and further flows to the third electrode layer.

  In the present invention, the first electrode layer, the second electrode layer, the third electrode layer, and the conductive layer include chromium (Cr), tantalum (Ta), titanium (Ti), copper (Cu), aluminum (Al ), Molybdenum (Mo), tungsten (W), nickel (Ni), gold (Au), palladium (Pd), platinum (Pt), silver (Ag), tin (Sn), and other metals, ITO, IZO, etc. Alloys, polyacetylene conductive polymers, poly (p-phenylene) and derivatives thereof, polyphenylene conductive polymers such as polyphenylene vinylene and derivatives thereof, polypyrrole and derivatives thereof, polythiophene and derivatives thereof, and complex such as polyfuran and derivatives thereof Conductive materials such as ionic conductive polymers such as ring-based conductive polymers, polyaniline and derivatives thereof can be used. These metals, alloys, and conductive polymers can be used in combination.

  Further, the conductive polymer may be used by increasing the conductivity by doping with a dopant. As the dopant, it is preferable to use a compound having a low vapor pressure such as polysulfonic acid, polystyrene sulfonic acid, naphthalene sulfonic acid, and alkyl naphthalene sulfonic acid.

In the present invention, the volume resistivity of the first electrode layer, the second electrode layer, the third electrode layer and the conductive layer is usually 1 × 10 ⁻³ Ω · cm or less, and 1 × 10 ⁻⁶ Ω. -Cm or less is preferable.

  In the present invention, the semiconductor layer includes fluorene and its derivatives, fluorenone and its derivatives, poly (N-vinylcarbazole) derivatives, polyglutamic acid γ-carbazolylethyl derivatives, polyvinylphenanthrene derivatives, polysilane derivatives, oxazole derivatives, oxadi Azole derivatives, imidazole derivatives; arylamine derivatives such as monoarylamines and triarylamine derivatives; benzidine derivatives, diarylmethane derivatives, triarylmethane derivatives, styrylanthracene derivatives, pyrazoline derivatives, divinylbenzene derivatives, hydrazone derivatives, indene derivatives, indenones Derivatives, butadiene derivatives; pyrene derivatives such as pyrene-formaldehyde, polyvinylpyrene; α-phenylstilbene derivatives, bisstilbene derivatives Stilbene derivatives; enamine derivatives; thiophene derivatives such as polyalkylthiophenes; pentacene, tetracene, bisazo, trisazo dyes, polyazo dyes, triarylmethane dyes, thiazine dyes, oxazine dyes, xanthene dyes, cyanine Dyes, styryl dyes, pyrylium dyes, quinacridone dyes, indigo dyes, perylene dyes, polycyclic quinone dyes, bisbenzimidazole dyes, indanthrone dyes, squarylium dyes, anthraquinone dyes; copper Organic semiconductor materials such as phthalocyanine dyes such as phthalocyanine and titanyl phthalocyanine, inorganic semiconductor materials such as CdS, ZnO, PbTe, PbSnTe, InGaZnO, GaP, GaAlAs, and GaN, polycrystalline silicon, amorphous silicon It may be a silicon semiconductor material such emissions, and the like. Among these, amorphous silicon is preferable in order to reduce the cost other than materials that can be applied. Amorphous silicon is also preferable from the standpoint of TFT durability and operational stability.

In the present invention, as the insulating layer, inorganic insulating materials such as SiO ₂ , Ta ₂ O ₅ , Al ₂ O ₃ , polyimide, styrene resin, polyethylene resin, polypropylene, vinyl chloride resin, polyester alkyd resin, polyamide, polyurethane Polycarbonate, polyarylate, polysulfone, diallyl phthalate resin, polyvinyl butyral resin, polyether resin, polyester resin, acrylic resin, silicone resin, epoxy resin, phenol resin, urea resin, melamine resin; Fluorine series such as PFA, PTFE, PVDF Resins; Parylene resins; Photocurable resins such as epoxy acrylates and urethane-acrylates; Organic insulating materials such as polysaccharides such as pullulan and cellulose, and derivatives thereof.

In the present invention, the volume resistivity of the insulating layer is preferably 1 × 10 ¹³ Ω · cm or more, and more preferably 1 × 10 ¹⁴ Ω · cm or more.

  In the present invention, the insulating layer is formed by a thermal oxidation method, an anodic oxidation method; a vacuum film forming process such as vapor deposition, sputtering, or CVD; a printing method using a relief plate, a flexographic printing, a printing method using a stencil, a screen printing, a printing using a planographic plate. It can be formed by using a printing method such as a printing method, offset printing, intaglio printing method, gravure printing, spin coating method, dipping method, spray coating method or ink jet method. Among these, when the oxide of the material forming the first electrode layer is an insulating material, the anodic oxidation method is preferable because of the simplicity of the process apparatus.

  In the present invention, as the substrate, glass, a metal material whose surface is coated with the above insulating material, a film obtained by forming the above organic insulating material, or the like can be used.

  In the present invention, the positions of the second electrode layer, the third electrode layer, and the conductive layer can be uniquely determined with respect to the region where the first electrode layer is formed. Can be facilitated, and the manufacturing cost can be reduced. Note that the second electrode layer, the third electrode layer, and the conductive layer may be formed by separate processes or simultaneously. In addition, after the second electrode layer, the third electrode layer, and the conductive layer are formed, when a conductive material is attached to the channel portion, the channel portion may be immersed in a liquid that dissolves these materials.

  In the present invention, the first electrode layer and the insulating layer preferably have a region rising at an angle of 60 ° or more with respect to the surface of the substrate, and this angle is more preferably 80 ° or more, and 90 °. The above is particularly preferable. Thereby, it becomes easy to define the distance (channel length) between the second electrode layer and the third electrode layer and the conductive layer. FIG. 2A shows a state in which the first electrode layer and the insulating layer are raised at 90 ° with respect to the surface of the substrate. As shown in FIG. 2B, a part of the insulating layer is a substrate. It may be in a state where it stands up at 90 ° with respect to the surface. FIG. 2C shows a state in which the first electrode layer and the insulating layer stand up at an angle larger than 90 ° with respect to the surface of the substrate.

  Further, the first electrode layer may have an overhanging structure as shown in FIG. At this time, as shown in FIG. 20, the first electrode layer can be formed by sequentially laminating a conductive material B and a conductive material A on a substrate and then etching. Furthermore, the insulating layer can be formed on at least the first electrode layer by using a CVD method (see FIG. 20A), an anodic oxidation method, or a thermal oxidation method (see FIG. 20B). A specific example of the etching process will be described below. First, a resist film is formed on the conductive material A by patterning, immersed in a solution for dissolving the conductive material A, and the conductive material A is patterned. Next, the conductive material B is immersed in a solution for dissolving the conductive material B, and the conductive material B is patterned. At this time, an overhanging structure can be formed by overetching the conductive material B.

  In the electronic device of the present invention, the second electrode layer, the third electrode layer, and the conductive layer are preferably made of the same material. Thereby, since the second electrode layer, the third electrode layer, and the conductive layer can be formed at the same time, the electronic device can be easily manufactured.

  In the present invention, when the second electrode layer, the third electrode layer, and the conductive layer are formed, a vacuum film forming process such as vapor deposition, sputtering, and CVD, a printing method using relief printing, flexographic printing, and printing using stencil printing. Printing processes such as printing, screen printing, printing using a lithographic plate, offset printing, printing using an intaglio, and gravure printing can be used. Of these, plate printing methods such as flexographic printing, screen printing, offset printing, and gravure printing are preferred because they can easily increase the area and process tact.

  In the electronic device of the present invention, it is preferable that at least one of the semiconductor layer, the insulating layer, the first electrode layer, the second electrode layer, the third electrode layer, and the conductive layer is made of a coatable material. Thereby, it becomes possible to manufacture an electronic element using a printing process, and it becomes possible to reduce manufacturing cost compared with the case where vacuum film-forming processes, such as sputtering, are used. Printing processes include letterpress printing, flexographic printing, stencil printing, screen printing, planographic printing, offset printing, intaglio printing, gravure printing, spin coating, dipping, spray coating. Method, ink jet method and the like can be used. Of these, plate printing methods such as flexographic printing, screen printing, offset printing, and gravure printing are preferred because they can easily increase the area and process tact.

  In the present invention, as the coating solution for the first electrode layer, the second electrode layer, the third electrode layer, and the conductive layer, a metal nanoparticle dispersion liquid in which nanoparticles such as Ag and Au are dispersed in a solvent Polyacetylene-based conductive polymers, poly (p-phenylene) and derivatives thereof, polyphenylene-based conductive polymers such as polyphenylene vinylene and derivatives thereof, polypyrrole and derivatives thereof, polythiophene and derivatives thereof, and heterocycles such as polyfuran and derivatives thereof A solution or dispersion obtained by dissolving or dispersing one or more ionic conductive polymers such as a conductive polymer, polyaniline and derivatives thereof in a solvent can be used. Further, the conductive polymer may be used with a higher conductivity by doping with a dopant. As the dopant, it is preferable to use a compound having a low vapor pressure such as polysulfonic acid, polystyrene sulfonic acid, naphthalene sulfonic acid, and alkyl naphthalene sulfonic acid.

  In the present invention, the semiconductor layer coating solution includes fluorene and derivatives thereof, fluorenone and derivatives thereof, poly (N-vinylcarbazole) derivatives, polyglutamic acid γ-carbazolylethyl derivatives, polyvinylphenanthrene derivatives, polysilane derivatives, oxazoles. Derivatives, oxadiazole derivatives, imidazole derivatives; arylamine derivatives such as monoarylamines and triarylamine derivatives; benzidine derivatives, diarylmethane derivatives, triarylmethane derivatives, styrylanthracene derivatives, pyrazoline derivatives, divinylbenzene derivatives, hydrazone derivatives, Indene derivatives, indenone derivatives, butadiene derivatives; pyrene derivatives such as pyrene-formaldehyde, polyvinylpyrene; α-phenylstilbene derivatives, biss Stilbene derivatives such as tilbene derivatives; enamine derivatives; thiophene derivatives such as polyalkylthiophene, pentacene, tetracene, bisazo dyes, trisazo dyes, polyazo dyes, triarylmethane dyes, thiazine dyes, oxazine dyes, xanthene dyes Dye, cyanine dye, styryl dye, pyrylium dye, quinacridone dye, indigo dye, perylene dye, polycyclic quinone dye, bisbenzimidazole dye, indanthrone dye, squarylium dye, anthraquinone dye Dye; using a solution in which at least one organic semiconductor material such as phthalocyanine dye such as copper phthalocyanine or titanyl phthalocyanine is dissolved, or a dispersion in which an organic semiconductor material is dispersed in a solution in which a semiconductor material or an insulating material is dissolved It can be.

  In the present invention, as the coating liquid for the insulating layer, polyimide resin, styrene resin, polyethylene resin, polypropylene, vinyl chloride resin, polyester alkyd resin, polyamide, polyurethane, polycarbonate, polyarylate, polysulfone, diallyl phthalate resin, polyvinyl Butyral, polyether resin, polyester resin, acrylic resin, silicone resin, epoxy resin, phenol resin, urea resin, melamine resin; fluorine resin such as PFA, PTFE, PVDF; parylene resin; light such as epoxy acrylate, urethane-acrylate A curable resin: a solution in which an organic insulating material such as pullulan or cellulose and its derivatives are dissolved, or a dispersion in which an organic insulating material is dispersed in a solution in which an insulating material is dissolved can be used. .

In the present invention, a metal oxide gel film is formed by coating, and an insulating layer made of an inorganic insulating material can be formed by heat treatment. The metal oxide gel film has the general formula M (OR) _n or MR (OR ′) _n−1.
It can form by hydrolyzing the metal alkoxide represented by these. The metal alkoxide is not particularly limited as long as it has a hydrolyzable alkoxide. M is a divalent or higher metal, R and R ′ are each independently an alkyl group, a phenyl group or the like, and the metal alkoxides can be used alone or in combination of two or more. At this time, the metal M is preferably a metal belonging to Group IIIb or Group IV of the periodic table. Examples of the metal belonging to Group IIIb of the periodic table include Al, and examples of the metal belonging to Group IV of the periodic table include Ti, Zr, Si belonging to the IVb group, and the like.

  In the present invention, the critical surface tension of the insulating layer is preferably 40 mN / m or less. Thereby, the mobility of a semiconductor can be improved.

  Further, the critical surface tension of the second electrode layer, the third electrode layer, and the conductive layer is preferably small in difference from the critical surface tension of the insulating layer, and more preferably the same as the critical surface tension of the insulating layer. . When the difference in critical surface tension between the insulating layer, the second electrode layer, the third electrode layer, and the conductive layer is large, the semiconductor layer formed thereon may not be a homogeneous thin film.

  Moreover, it is preferable that the critical surface tension of a 2nd electrode layer, a 3rd electrode layer, and a conductive layer is 40 mN / m or less similarly to an insulating layer. For this purpose, surface treatment may be performed using, for example, a SAM-forming molecular species disclosed in JP-T-2005-534190 having a water-repellent functional group at least at its end.

  The SAM-forming molecular species disclosed in JP 2005-534190 A can also surface-treat the insulating layer. This makes it possible to control the mobility of the semiconductor and the threshold voltage during FET operation.

  In the present invention, the insulating layer is preferably formed using a dipping method. Thereby, it is possible to form an insulating layer with little film thickness unevenness by a very simple method.

  FIG. 3 shows an example of the dipping method used in the present invention. Here, a coating solution in which an insulating material is dissolved is applied to a substrate on which the first electrode layer is formed in an array using a dipping method. As shown in FIG. 3, when the dipping method is used, the coating liquid uniformly contacts the first electrode layer when the substrate is immersed in the coating liquid. At this time, by pulling up the substrate in the direction of FIG. 3B, the insulating layer can be more uniformly formed on the side wall of the first electrode layer corresponding to the channels 1 and 2 (see FIG. 1). It becomes.

  In the present invention, the insulating layer is made of an insulating material that is provided with two regions of a high surface energy region having a large critical surface tension and a low surface energy region having a small critical surface tension when energy is applied thereto. At least one of the electrode layer, the third electrode layer, and the conductive layer is preferably made of a coatable material. This makes it possible to perform patterning on the insulating layer with high definition. In order to ensure that the liquid containing the conductive material adheres according to the pattern shapes of the high surface energy region and the low surface energy region, the difference in surface energy between the two regions is preferably 10 mN / m or more.

In the present invention, the critical surface tension is defined as follows. FIG. 4 shows a state where the droplet is in an equilibrium state at the contact angle θ on the surface of the solid. At this time, Young's equation γ _S = γ _SL + γ _L cos θ
Is established. Here, γ _S is the surface tension of the solid, γ _SL is the interfacial tension between the solid and the liquid, and γ _L is the surface tension of the liquid. The surface tension is substantially synonymous with the surface energy and has exactly the same value. When cos θ = 1, θ = 0 ° and the liquid is completely wetted. The value of γ _L at this time is γ _S -γ _SL , which is called the critical surface tension γ _{C of the} solid. γ _C plots the relationship between the surface tension of the liquid and the contact angle (Zisman plot) using several types of liquids whose surface tension is known, and the surface tension at which θ = 0 ° (cos θ = 1) is obtained. It is obtained by seeking. On the surface of the gamma _C is large solids, is wettable liquid (lyophilic), on the surface of the gamma _C is small solid, liquid does not easily wetted (lyophobic).

  In FIG. 5, an example of the manufacturing method of the electronic device of this invention is shown. Here, after applying energy on the insulating layer that is in the low surface energy region to locally make the high surface energy region, the liquid containing the conductive material is made into the high surface energy region by using an inkjet method. Apply. At this time, since the side surface portion of the first electrode layer is difficult to apply energy, it becomes a low surface energy region and the conductive material hardly adheres. For this reason, the distance between the second electrode layer and the conductive layer and the third electrode and the conductive layer can be controlled by the film thickness of the first electrode layer.

  In the present invention, the critical surface tension in the low surface energy region is preferably 40 mN / m or less. As a result, the mobility of the semiconductor layer can be increased, and the lyophobic property of the low surface energy portion is sufficient, so that good patterning can be performed on the insulating layer.

  FIG. 6 shows the relationship between the mobility of the semiconductor layer and the critical surface tension of the insulating layer. This plot is represented by the structural formula (1)

で表される有機半導体材料及び絶縁材料Ａ〜Ｆを用いて、図２１（ａ）のトランジスタを作製し、半導体層の移動度と絶縁層の臨界表面張力を測定することにより得られたものである。これより、臨界表面張力が４０ｍＮ／ｍ以下になると、半導体層の移動度が増加することが判る。

The transistor shown in FIG. 21A is manufactured using the organic semiconductor material and the insulating materials A to F expressed by the following, and the mobility of the semiconductor layer and the critical surface tension of the insulating layer are measured. is there. This shows that the mobility of the semiconductor layer increases when the critical surface tension is 40 mN / m or less.

In the present invention, the insulating layer is composed of at least a first material and a second material, and has a critical surface tension that has a large change in critical surface tension due to energy application compared to the second material, It is preferable that the second material has a function other than changing the tension. As a result, the function of changing the critical surface tension can be surely expressed. That is, it is possible to increase the difference in critical surface tension between the high surface energy region and the low surface energy region formed by applying energy, and patterning can be performed on the insulating layer with high definition. Further, the insulating layer has a distribution of the composition ratio of the material in the film thickness direction, and the concentration of the first material on the surface is preferably higher than the concentration of the second material, and the concentration of the first material on the surface Is more preferably 100%. The second material preferably has a volume resistivity of 1 × 10 ¹³ Ω · cm or more.

  FIG. 7 shows a layer in which the material composition ratio changes in the film thickness direction. The structure of FIG. 7A can be manufactured by sequentially forming a layer made of the second material and a layer made of the first material on the substrate. As a manufacturing method, a vacuum process such as vacuum vapor deposition or a coating process using a solvent can be used. The structure shown in FIG. 7B can be manufactured by applying a solution obtained by mixing the first material and the second material to the substrate and drying it. This is because when the polarity of the first material is smaller than that of the second material, or when the molecular weight of the first material is smaller than that of the second material, the time until the solvent evaporates during drying. In addition, this is because the first material easily moves to the surface side. When the coating process is used, the layer made of the first material and the layer made of the second material are often not clearly separated at the interface, but in the present invention, the concentration of the first material on the surface Is higher than the concentration of the second material, it can be applied. 7C to 7E show a state in which the first material and the second material are mixed in a predetermined concentration distribution in the film thickness direction.

  The insulating layer composed of three or more types of materials may have a laminated structure of three or more layers, or three or more types of materials are mixed in a predetermined concentration distribution in the film thickness direction. Also good.

  In the present invention, the insulating layer preferably contains a polyimide material, and the first material is more preferably a polyimide material having a hydrophobic group in the side chain. Since the polyimide material is excellent in solvent resistance and heat resistance, when the semiconductor layer is formed on the first material, it is possible to suppress the occurrence of cracks due to swelling due to the solvent and temperature changes during firing. Therefore, a highly reliable electronic element can be manufactured.

  As the polyimide material having a hydrophobic group in the side chain, materials described in JP-A No. 2002-162630, JP-A No. 2003-96034, JP-A No. 2003-267982 and the like can be used. Further, for the tetracarboxylic dianhydride constituting the main chain skeleton of the hydrophobic group, various materials such as aliphatic, alicyclic, and aromatic can be used. Specific examples include pyromellitic dianhydride, cyclobutanetetracarboxylic dianhydride, butanetetracarboxylic dianhydride, and the like. In addition, materials described in JP-A-11-193345, JP-A-11-193346, JP-A-11-193347, and the like can also be used.

  In the present invention, the energy used for changing the critical surface tension is preferably ultraviolet rays. Thereby, it can operate in air | atmosphere, a high resolution is obtained, and the damage inside an insulating layer can be suppressed.

  In the present invention, at least one of the second electrode layer, the third electrode layer, and the conductive layer is composed of two or more materials, and the composition ratio of the two or more materials changes with respect to the film thickness direction. It is preferable. Thereby, the work functions of the second electrode layer, the third electrode layer, and the conductive layer can be easily controlled. When the second electrode layer, the third electrode layer, and the conductive layer are made of the first material and the second material, the layers shown in FIG. 7 can be obtained.

  Note that in the region where the semiconductor layer is in contact with the second electrode layer, the third electrode layer, and the conductive layer, the work functions of the semiconductor material and the conductive material must be matched. In particular, when an n-type semiconductor material and a p-type semiconductor material coexist on a single substrate, the following problems may occur. That is, when an n-type semiconductor material is used, if the work function of the conductive material is larger than the work function of the semiconductor material, the injection of carriers from the conductive material to the semiconductor material is hindered. When a material is used, carrier injection from the conductive material to the semiconductor material is prevented when the work function of the conductive material is smaller than that of the semiconductor material. Therefore, in order to prevent the carrier injection from being hindered, it is necessary to use two or more kinds of conductive materials. However, in order to prevent the carrier injection into the p-type semiconductor material, the p-type After forming the second electrode layer, the third electrode layer, and the conductive layer using a conductive material having a work function larger than that of the semiconductor material, a conductive material having a work function smaller than that of the n-type semiconductor material is obtained. It is preferable to stack in a region in contact with the n-type semiconductor material.

  In the present invention, when a semiconductor layer is formed using a p-type semiconductor material, the surface portions of the second electrode layer, the third electrode layer, and the conductive layer are electrically conductive such as Ag, Au, and Pt. It is preferable that it is made of a conductive material. In addition, when the semiconductor layer is formed using an n-type semiconductor material, the second electrode layer, the third electrode layer, and the surface portion of the conductive layer are made of a conductive material having a low work function such as Mg, Al, or Cr. It is preferable that it is formed.

  In the present invention, the surface of at least one of the second electrode layer, the third electrode layer, and the conductive layer is preferably electroplated. Electrolytic plating can form a conductive material selectively in the area where voltage is applied, so even if the substrate is stretched or deformed, it does not require an advanced alignment process and is very simple. It can be a simple process. For example, when the Cr thin film is laminated at a desired site after the Au thin film is formed, the method shown in FIG. 8 can be used. This method is a manufacturing method in which four electronic elements are arranged in an array on a substrate and each electronic element is wired. First, the second electrode layer, the third electrode layer, and the conductive layer are patterned by an inkjet method using an Au nanoparticle dispersion (see FIG. 8A). Next, a layer having a work function lower than that of Au Only the site where the metal needs to be formed is connected to the cathode, the substrate is immersed in the electrolytic plating solution of Cr, and a Cr thin film is deposited only on the desired site. (See FIG. 8B). Furthermore, the wiring electrode between electronic elements is patterned by the inkjet method using Ag nanoparticle dispersion liquid. (See FIG. 8 (c)).

  The arithmetic device of the present invention has the electronic element or the current control device of the present invention. Therefore, it is possible to manufacture an arithmetic device capable of high-speed response at low cost.

FIG. 9 shows a configuration example of the arithmetic device of the present invention. P-ch and N-ch indicate a transistor using a hole transport material and a transistor using an electron transport material, respectively. _Here, the case of applying the + 5V to _{V in,} N-ch, although the ON, P-ch is OFF _{becomes, V out} becomes 0V. When V _in is 0 V, N-ch is OFF and V _dd is +5 V. _Therefore , the potential difference between the gate electrode and the source electrode of P-ch is 5 V, and V _out is + 5V is output. Thus, the potential of the V _in and V _out is inverted, the circuit of FIG. 9, can be applied as an inverter circuit. Furthermore, a control device can be manufactured by combining this inverter circuit with an arithmetic circuit such as an AND circuit, a NAND circuit, or a NOR circuit.

  In the first embodiment of the display device of the present invention, display is performed by a change in voltage between electrodes formed on one of opposing surfaces of two substrates provided to face each other, and the electronic device of the present invention is displayed. Elements or current control devices are used for pixel switching. Therefore, a display device capable of high-speed response at low cost can be manufactured. Examples of such a display device include a liquid crystal display device, an electrophoretic display device, and a plasma display device.

  FIG. 10 shows a configuration example of a liquid crystal display device. A voltage is applied from the gradation signal line according to the gradation of each pixel. From the scanning line, an ON / OFF signal voltage is sequentially applied for each line, and after the scanning of one screen is completed, the scanning of the next screen is started. In the case of video support, this interval is preferably 50 Hz or more (1/50 second or less). The capacitor has a function of charging the voltage of the gradation signal and applying the voltage to the liquid crystal cell for the time from the transition from one screen to the next screen.

  According to a second embodiment of the display device of the present invention, display is performed by a current flowing between electrodes formed on one of opposing surfaces of two substrates provided to face each other, and the electronic device of the present invention Alternatively, a current control device is used for pixel switching or pixel driving. Therefore, a display device capable of high-speed response at low cost can be manufactured. Examples of such display elements include EL display devices, electrochromic display devices, and electrodeposition display devices.

  FIG. 11 shows a configuration example in which one pixel of the EL display device is taken out. When a voltage is applied from the scanning line to the pixel switching TFT, the capacitor is charged, a voltage is applied to the first electrode G of the pixel driving TFT, and a current is supplied from the current supply line to the EL element. Emits light. Since the capacitor is charged for the time required to move from one screen to the next screen, the pixel driving TFT is turned on and the EL element continues to emit light.

(Example 1)
An electronic device having a device configuration as shown in FIG. 1 was produced. Specifically, after a first electrode layer made of Al was patterned on a glass substrate with a width of 50 μm by wet etching, an insulating layer made of Parylene C was formed by CVD to a film thickness of 400 nm. Next, a second electrode layer made of Au, a third electrode layer made of Au, and a conductive layer made of Au were formed by vapor deposition. Furthermore, a semiconductor layer made of an organic semiconductor material (mobility 1.2 × 10 ⁻³ cm ² / V · sec) represented by the structural formula (1) was formed. The obtained electronic element had a channel length (total of channel 1 side and channel 2 side) of 1.9 μm.

By measuring the current I _ds flowing when each voltage is applied with the voltage V _g of the first voltage control device being +8 to −16 V and the voltage V _ds of the second voltage control device being −16 V, static characteristics are obtained. Evaluation was performed. FIG. 12 shows the evaluation results. From this, when V _g = V _ds = −16 V, I _ds is 3.77 × 10 ⁻⁶ A, and V _g is in the range of +8 to −16 V, and 4 digits are obtained as the ON / OFF ratio. I understand.

V _{g is set} to +6 to −10 V (sin wave), V _ds is set to −8 V, the frequency of the first voltage control device is set to 0.5 to 50 kHz, and the current I _ds that flows when each voltage is applied is measured. Thus, dynamic characteristics were evaluated. The gain obtained when the frequency was 0.5 kHz was 1, and the frequency when this was −3 db was defined as the cutoff frequency. FIG. 13 shows the evaluation results. From this, it can be seen that a cutoff frequency of 25 kHz or more is obtained. In this study, the cutoff frequency f _c which is calculated from each parameter, the above equations that the gate electrode (first electrode layer) on the assumption that there is no overlap between the other electrodes (1)
f _c = μV _ds / 2πL ²
Therefore, it is estimated to be about 40 kHz. Thus, in the actual device, the conductive layer and the first electrode layer, despite the overlap of 50 [mu] m, close to the cutoff frequency f _c of the case overlap the first electrode layer and the other electrode layer is not The value is obtained. The cut-off frequency f _c when there is an overlap is expressed by the following formula: f _c = μV _ds / 2πL (D + L) where D is the overlap width
It means that as D increases, the parasitic capacitance increases.
(Example 2)
The insulating layer of Example 1 was made of polyimide material X491 (manufactured by Chisso Corporation), and the second electrode layer, the third electrode layer and the conductive layer were formed by the process of FIG. An electronic device was produced.

The above process will be specifically described below. The insulating layer was irradiated with UV having an irradiation energy of 9 J / cm ^{2 at} a wavelength of 250 nm using an exposure mask having a shape corresponding to the second electrode layer, the third electrode layer, and the conductive layer. Next, after forming a second electrode layer made of Ag, a third electrode layer made of Ag, and a conductive layer made of Ag using an Ag nanoparticle dispersion (manufactured by Sumitomo Electric Industries, Ltd.), a commercially available It etched by being immersed in Ag etching liquid. The obtained electronic device had a channel length (total of the channel 1 side and the channel 2 side) of 2.7 μm.

In the same manner as in Example 1, the static characteristics were evaluated. FIG. 14 shows the evaluation results.
(Example 3)
An electronic device having a device configuration as shown in FIG. 1 was produced. Specifically, a first electrode layer made of Al was patterned on a glass substrate with a width of 9 μm by wet etching, and then an insulating layer made of parylene C was formed to a thickness of 370 nm by CVD. Next, a second electrode layer made of Au, a third electrode layer made of Au, and a conductive layer made of Au were formed by vapor deposition. Further, a semiconductor layer made of pentacene (mobility 4.5 × 10 ⁻² cm ² / V · second) was formed. The obtained electronic device had a channel length (total of channel 1 side and channel 2 side) of 2.95 μm.

By measuring the current I _ds flowing when each voltage is applied with the voltage V _g of the first voltage control device being +6 to −16 V and the voltage V _ds of the second voltage control device being −16 V, static characteristics are obtained. Evaluation was performed. FIG. 15 shows the evaluation results. From this, when V _g = V _ds = −16 V, I _ds becomes 5.68 × 10 ⁻⁵ A, and an ON / OFF ratio of 10 ³ orders is obtained when V _g is in the range of +6 to −16 V. I understand that.

By measuring the current I _ds that flows when each voltage is applied with V _g being −8 to −14 V (sin wave), V _ds being −15 V, and the frequency of the first voltage control device being 1 to 800 kHz. The dynamic characteristics were evaluated. The gain obtained when the frequency was 1 kHz was set to 1, and the frequency at which this was −3 db was set as the cutoff frequency. FIG. 16 shows the evaluation results. From this, it can be seen that a cutoff frequency of 700 kHz or more is obtained.
Example 4
The electronic device shown in FIG. 21 was produced. Specifically, a first electrode layer made of Al was patterned on a glass substrate with a width of 9 μm by wet etching, and then an insulating layer made of SiO ₂ was formed with a film thickness of 180 nm by CVD. Next, a semiconductor layer made of amorphous silicon was formed, and finally a second electrode layer, a third electrode layer, and a conductive layer made of Al were formed. This was designated as sample A.

Similarly, the electronic device shown in FIG. 1 was produced. Specifically, a first electrode layer made of Al was patterned on a glass substrate with a width of 9 μm by wet etching, and then an insulating layer made of SiO ₂ was formed with a film thickness of 180 nm by CVD. Next, a second electrode layer made of Al, a third electrode layer, and a conductive layer were formed, and finally a semiconductor layer made of amorphous silicon was formed. This was designated as Sample B.

For Sample A and Sample B, the capacity between the first electrode layer and the third electrode layer was measured, and the capacity ratio of Sample A to Sample B was calculated to be 0.92. From this, it was found that Sample A has a slightly smaller parasitic capacitance.
(Reference Example 1)
Except that the second electrode layer, the third electrode layer, and the conductive layer were formed by screen printing using a printing plate having substantially the same pattern as the exposure mask of Example 2, the same as in Example 2 An electronic device was produced. The pattern shape after the Ag film formation was compared with the pattern of the exposure mask, and the dot gain (see FIG. 17) was measured with an optical microscope, and it was confirmed that the maximum was 6 μm.
(Reference Example 2)
Same as Example 2 except that the second electrode layer, the third electrode layer and the conductive layer were formed using a screen printing plate having the same pattern as the exposure mask of Example 2 without performing UV irradiation. Thus, an electronic device was produced. The pattern shape after the Ag film formation was compared with the pattern of the screen printing plate, and the dot gain (see FIG. 18) was measured with an optical microscope, and it was confirmed that the maximum was 20 μm.

It is a schematic diagram which shows the structural example of the electronic element and current control apparatus of this invention. It is sectional drawing which shows the structural example of a 1st electrode layer and an insulating layer. It is a schematic diagram which shows an example of the dipping method used by this invention. It is a schematic diagram which shows the state in which a droplet is in the equilibrium state by the contact angle (theta) on the surface of solid. It is a schematic diagram which shows an example of the manufacturing method of the electronic device of this invention. It is a figure which shows the relationship between the mobility of a semiconductor layer, and the critical surface tension of an insulating layer. It is sectional drawing which shows the layer from which the composition ratio of material changes with respect to a film thickness direction. It is a schematic diagram which shows the electrolytic plating used by this invention. It is a schematic diagram which shows the structural example of the arithmetic unit of this invention. It is a schematic diagram which shows the structural example of a liquid crystal display device. It is a schematic diagram which shows the structural example which took out 1 pixel of EL display apparatus. It is a figure which shows the result of the static characteristic evaluation of Example 1. FIG. It is a figure which shows the result of the dynamic characteristic evaluation of Example 1. FIG. It is a figure which shows the result of the static characteristic evaluation of Example 2. FIG. It is a figure which shows the result of the static characteristic evaluation of Example 3. FIG. It is a figure which shows the result of the static characteristic evaluation of Example 3. FIG. It is a figure explaining the dot gain of the reference example 1. FIG. It is a figure explaining the dot gain of the reference example 2. FIG. It is sectional drawing which shows the structural example of a 1st electrode layer. It is a figure explaining the formation method of a 1st electrode layer and an insulating layer. It is a schematic diagram which shows the structural example of the electronic element and current control apparatus of this invention. It is a figure which shows the general structure of a transistor. It is a figure which shows the general structure of the active element of SIT structure.

Claims (13)

A first electrode layer is formed on a part of the substrate,
An insulating layer is formed on at least the first electrode layer;
A conductive layer is formed on the insulating layer formed in the region where the first electrode layer is formed,
A second electrode layer is formed on one side of the region on the substrate where the first electrode layer is not formed with respect to the first electrode layer;
A third electrode layer is formed on the side of the substrate where the first electrode layer is not formed on the side where the second electrode layer is not formed with respect to the first electrode layer. ,
An electronic element, wherein a semiconductor layer is formed so as to cover the conductive layer. A first electrode layer is formed on a part of the substrate,
An insulating layer is formed on at least the first electrode layer;
A semiconductor layer is formed so as to cover the first electrode layer on which the insulating layer is formed;
A conductive layer is formed on the semiconductor layer formed in the region where the first electrode layer is formed,
A second electrode layer is formed on one side of the region on the substrate where the first electrode layer is not formed with respect to the first electrode layer;
A third electrode layer is formed on a side where the second electrode layer is not formed with respect to the first electrode layer in a region where the first electrode layer is not formed on the substrate. An electronic device characterized by that.   The electronic device according to claim 1, wherein the second electrode layer, the third electrode layer, and the conductive layer are made of the same material.   The at least one of the semiconductor layer, the insulating layer, the first electrode layer, the second electrode layer, the third electrode layer, and the conductive layer is formed by coating. The electronic element as described in any one.   The electronic device according to claim 1, wherein the insulating layer is formed using a dipping method. The insulating layer is made of an insulating material whose critical surface tension changes when energy is applied,
6. The electronic device according to claim 1, wherein at least one of the second electrode layer, the third electrode layer, and the conductive layer is formed by coating. At least one of the second electrode layer, the third electrode layer, and the conductive layer is made of two or more materials,
7. The electronic device according to claim 1, wherein the composition ratio of the two or more materials changes in the film thickness direction.   The electronic device according to claim 7, wherein the surface of at least one of the second electrode layer, the third electrode layer, and the conductive layer is electrolytically plated. The electronic device according to any one of claims 1 to 8,
Using the first voltage control device for applying a voltage to the first electrode layer and the second voltage control device for applying a voltage to the second electrode layer and the third electrode layer, the second electrode layer and A current control device comprising a current control unit for controlling a current flowing between the third electrode layers.   The current control device according to claim 9, wherein the current control unit is formed on a substrate.   An arithmetic device comprising the electronic device according to claim 1 or the current control device according to claim 9 or 10. In a display device that performs display by a change in voltage between electrodes formed on one of opposing surfaces of two substrates provided opposite to each other,
A display device, wherein the electronic device according to any one of claims 1 to 8 or the current control device according to claim 9 or 10 is used for pixel switching. In a display device that performs display by a current flowing between electrodes formed on one of opposing surfaces of two substrates provided to face each other,
A display device, wherein the electronic device according to any one of claims 1 to 8 or the current control device according to claim 9 or 10 is used for pixel switching or pixel driving.

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