JP2008060404A - Flexible wiring board and manufacturing method of the flexible wiring board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To easily and surely make a part of plating wiring be independent of the other plating wiring, while securing a region where electronic components can be mounted. <P>SOLUTION: On a flexible substrate 2, the plating wiring 3 is formed comprising of first plating wiring 3A formed by being patterned into a prescribed shape, and second plating wiring 3B laminated on the first plating wiring 3A, by making a current flow to the first plating wiring 3A. A part of the plating wiring 3 is covered with a cover layer 12, and the other part of the plating wiring is exposed without being covered with the cover layer 12. A part is bent, where the exposed plating wiring 3 is formed of the substrate 2, and by applying a load to the prescribed part of the plating wiring 3, the plating wiring 3 is cut, and a part of the plating wiring 3 is formed independent of the other plating wirings. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a flexible wiring board on which a plated wiring having an arbitrary pattern is formed and a method for manufacturing the flexible wiring board.

  Conventionally, for example, in order to electrically connect a driving IC chip, a printed circuit board, and the like to an electronic device such as a display panel, the flexible wiring board can be bent and used even in a narrow area. From the viewpoint of

  FIG. 4 is a schematic plan view showing a part of a conventional flexible wiring board. As shown in FIG. 4, the flexible wiring board 21 has a base 22 having flexibility. On one surface of the base 22, a plated wiring 23 is formed by patterning into an arbitrary shape. The plated wiring 23 positioned at the central portion of the base 22 is covered with a coating layer 25 and the base 22. The plated wirings 23 positioned at both end portions of the wire are exposed without being covered with the covering layer 25 to form terminal portions 26.

  In addition, for example, one end portion of each of the plated wirings 23 facing each other is a land portion 29 that conductively connects an electronic component 28 such as an IC chip, a resistor, or a capacitor. The opening 31 formed in the covering layer 25 is exposed. The electronic component 28 is mounted on the flexible wiring board 21 by conductively connecting the electronic component 28 and the land portion 29 of the plated wiring 23.

  In such a conventional method for producing the flexible wiring substrate 21, first, the first plating wiring 23 made of copper is first patterned and formed in a predetermined shape on one surface of the base 22. Then, a coating layer 25 is formed on the central portion of the base 22 so as to cover the plated wiring 23. Thereafter, a current is passed from the terminal portion 26 to the first plated wiring 23 to fix nickel to the first plated wiring 23, thereby exposing the terminal portion 26 and the land portion exposed from the coating layer 25 in the first plated wiring 23. A second plated wiring 23 made of nickel is laminated on 29 to form a plated wiring 23.

  Here, when forming the plating wiring 23, a current is passed from the terminal portion 26 to the first plating wiring 23, and nickel is applied to the terminal portion 26 and the land portion 29 exposed from the coating layer 25 in the first plating wiring 23. In order to stack the second plating wirings 23 made of the above, first, all the first plating wirings 23 are formed. Here, in order to stack the second plating wiring 23 on the land portion 29 as well, the first plating wiring 23 is formed so that the land portion 29 is connected to the terminal portion 26 through the routing wiring. And after laminating the 2nd plating wiring 23 on the terminal part 26 and land part 29 of the 1st plating wiring 23, the plating cut hole 30 is formed in a predetermined part, and the predetermined part in the plating wiring 23 is cut. Some plating wirings 23 are made independent of other plating wirings 23.

  By the way, the plating cut hole 30 for cutting a predetermined portion of the plating wiring 23 in the means for making a part of the plating wiring 23 independent from the other plating wirings 23 as described above has a diameter of about 1 mm. Was formed. For this reason, the plated wiring 23 and the land portion 29 cannot be formed at the position where the plated cut hole 30 is formed. As a result, there is a region on the flexible wiring board 21 where other electronic components 28 can be mounted. There is a problem that the number and size of the electronic components 28 that can be mounted are limited due to the narrowing.

  In addition, in order to make some of the plating wirings 23 independent, it is necessary to form the plating cut holes 30 so as to cut only predetermined portions in the plating wirings 23. As a result, there is a problem that the production efficiency of the flexible wiring board 21 is lowered.

  The present invention has been made in view of these points, and flexible wiring capable of easily and surely making some plated wiring independent of other plated wiring while securing an area where electronic components can be mounted. It is an object to provide a method for manufacturing a substrate and a flexible wiring substrate.

  In order to achieve the above object, a feature of the flexible wiring board according to the present invention is that a plated wiring is formed by patterning in a predetermined shape on a flexible substrate, and a part of the plated wiring is covered with a coating layer. And the other part of the plated wiring is exposed without being covered with the coating layer, and a predetermined part of the exposed plated wiring is cut out of the base body, and a part of the plated wiring is cut. Is formed independently of the other plated wirings.

  According to the flexible wiring board according to the present invention, a predetermined portion in the plating wiring is cut, and a part of the plating wiring is independent of other plating wirings. Some plating wirings can be made independent from other plating wirings only by the area where the plating wirings to be cut are arranged, without being necessary.

  In addition, the method for producing a flexible wiring board according to the present invention is characterized in that a plated wiring is patterned and formed into a predetermined shape on a flexible substrate, and a part of the plated wiring is covered with a coating layer, A portion of the base body where the plated wiring exposed without being covered with the coating layer is formed is bent, and a predetermined portion of the plated wiring is cut.

  According to the method for manufacturing a flexible wiring board according to the present invention, a part of the plating wiring is made independent from other plating wirings by bending the substrate and applying a load to a predetermined portion of the plating wiring to cut it. Therefore, a predetermined area is not required as in the case of the plating cut hole, and some plating wirings can be made independent from other plating wirings only by the area where the plating wirings to be cut are arranged. Further, by bending the base and applying a load to a predetermined portion of the plated wiring and cutting it, a portion of the plated wiring can be made independent of other plated wiring easily and reliably.

  In the method for producing a flexible wiring board according to the present invention, a current is passed through the first plated wiring formed by patterning the exposed plated wiring into a predetermined shape on the substrate, and the first plated wiring. In this case, the second plating wiring is formed by being laminated on the first plating wiring. As described above, when the second plating wiring is formed by passing the current through the first plating wiring and laminating the first plating wiring, all the first plating wirings are continuously formed, and the second plating wiring is formed. This is because part of the plated wiring is made independent of the other parts after the lamination.

  In the method for manufacturing a flexible wiring board according to the present invention, a width of a portion to be cut in the plated wiring is preferably formed narrower than a width of another portion in the plated wiring. Thereby, the predetermined part of the plating wiring can be cut with a smaller load, and the predetermined part of the plating wiring can be cut more easily and reliably.

  Furthermore, in the method for manufacturing a flexible wiring board according to the present invention, a portion to be cut in the plated wiring is located at an edge portion of the base body, and is near the plated wiring to be cut at the edge portion of the base body. Further, it is preferable that a cut line extending in a direction intersecting with the width direction of the plated wiring is formed, and the base of the portion where the plated wiring to be cut is formed is bent with the cut line as a side edge. As a result, it is possible to bend the base of the portion where the plated wiring is formed with the cut line formed in the vicinity of the plated wiring to be cut as a side edge, thus affecting other plated wiring. In addition, only a predetermined portion of the plated wiring can be easily and reliably cut.

  Furthermore, in the method for manufacturing a flexible wiring board according to the present invention, the plated wiring is connected to the plated wiring at a boundary portion between a portion exposed from the coating layer and a portion covered with the coating layer. It is good to cut | disconnect a contact part with the edge of the said coating layer as a fulcrum. As a result, a load can be applied to a predetermined portion of the plated wiring using the contact portion between the plated wiring and the edge of the coating layer as a fulcrum, so that a load can be easily and reliably applied to the predetermined portion of the plated wiring. In addition, a predetermined portion of the plated wiring can be cut with a smaller load.

  As described above, according to the flexible wiring board of the present invention, some plating wirings can be made independent of other plating wirings only by the area where the plating wirings to be cut are arranged. As a result, the area where plating wiring and land portions can be formed on the flexible wiring board is expanded, and as a result, the area where electronic components can be mounted can be expanded. As a result, more electronic components can be mounted. It becomes possible to do.

  In addition, according to the method for manufacturing a flexible wiring board according to the present invention, by bending a base and applying a load to a predetermined portion of the plated wiring and cutting it, a part of the plated wiring can be easily and reliably removed. Since it can be made independent from plating wiring, the efficiency of production of a flexible wiring board can be improved.

  Hereinafter, an embodiment of a flexible wiring board and a manufacturing method thereof according to the present invention will be described with reference to FIGS.

  FIG. 1 is a schematic plan view showing a main part of the flexible wiring board according to the present embodiment, and FIG. 2 is a schematic cross-sectional view taken along line AA of the flexible wiring board of FIG.

  As shown in FIG. 1, the flexible wiring board 1 has a long base 2 made of a flexible resin material such as polyimide, for example. A first plated wiring 3 </ b> A made of the above metal material is formed by patterning into an arbitrary shape, and is bonded onto the substrate 2 through an adhesive 5. A second plated wiring 3B made of a metal material such as nickel is laminated on a predetermined portion of the first plated wiring 3A, and the second plated wiring 3B allows a current to flow through the first plated wiring 3A. The first plating wiring 3A is formed by fixing a metal material such as nickel. In the present embodiment, the plating wiring 3 is constituted by the first plating wiring 3A and the second plating wiring 3B.

  The plated wiring 3 is formed so as to reach both end edges 2a of the base body 2, and the plated wiring 3 positioned at both end edges 2a of the base body 2 is connected to terminal portions 7 that are conductively connected to other electric devices (not shown). Has been. In addition, a predetermined portion of the plated wiring 3 located in the center portion in the length direction of the base 2, in this embodiment, the opposing end portions of the pair of plated wiring 3 is an electronic component such as an IC chip, a resistor, or a capacitor. A land portion 10 for conductively connecting the component 9 is used.

  The plated wiring 3 located in the central portion of the base 2 is covered with a covering layer 12 made of a flexible resin material such as polyimide, and the covering layer 12 is formed on the base 2 via an adhesive 13. It is glued to. An opening 15 for exposing the land portion 10 of the plated wiring 3 is formed in the coating layer 12. Thereby, the terminal part 7 and the land part 10 of the plating wiring 3 are exposed from the coating layer 12. And the terminal part 7 and the land part 10 which are exposed from the coating layer 12 among the plating wiring 3 are formed by laminating the second plating wiring 3B on the first plating wiring 3A. That is, in the present embodiment, the predetermined portions of the first plated wiring 3A where the second plated wiring 3B is laminated are the terminal portions 7 and the land portions 10 exposed from the coating layer 12 in the plated wiring 3.

  And such a flexible wiring board 1 mounts the electronic component 9 on the flexible wiring board 1, and electrically connects the electronic component 9 and the land part 10 using the conductive adhesive which is not illustrated, An electronic component 9 is mounted.

  Further, the plated wiring 3 positioned at both end portions of the substrate 2, that is, the terminal portion 7 of the plated wiring 3 is exposed without being covered with the coating layer 12.

  As shown in FIG. 3, the predetermined portion in the plated wiring 3 is cut by bending a predetermined portion where the terminal portion 7 of the plated wiring 3 in the base 2 is formed and applying a load, Thereby, some plating wirings 3 are formed independently of other plating wirings 3. In the present embodiment, by bending the portion where the edge 12a of the coating layer 12 is located in the edge 2a portion of the substrate 2, the contact portion between the plated wiring 3 and the edge 12a of the coating layer 12 is used as a fulcrum. In addition, a load is applied to the boundary portion between the coating portion and the exposed portion in the plated wiring 3 and the plating wiring 3 is cut.

  In addition, the width of the portion to be cut in the plated wiring 3 is narrower than the width of the other portions in the plated wiring 3, and in the present embodiment, the width is about 50 μm when the width dimension is the narrowest. It has come to be.

  A cutting line 17 extending in a direction intersecting the width direction of the plating wiring 3 is formed in the vicinity of the plated wiring 3 to be cut at the edge 2a portion of the base 2 and in this embodiment, the base 2 A cut line 17 is formed along the plated wiring 3 to be cut at the edge 2a. And the part in which the plating wiring 3 to be cut in the edge 2a part of the base 2 is formed is bent with the cut line 17 as a side edge.

  Further, the edge 2a portion of the substrate 2 and the edge 12a of the coating layer 12 are covered with an insulating layer 19 made of an ultraviolet curable resin or the like, and the edge portion of the substrate 2 where the cut plated wiring 3 is located is defined. By forming the insulating layer 19 on the base 2 while being bent, the insulating layer 19 is disposed in the cut portion of the plated wiring 3.

  Next, a method for producing the flexible wiring board 1 according to this embodiment will be described.

  In the flexible wiring board 1 according to the present embodiment, first, a first plated wiring 3A made of a copper material or the like is patterned on a base 2 in a predetermined shape. Subsequently, by passing an electric current through the first plating wiring 3A and fixing a metal material such as nickel to the first plating wiring 3A, the second plating wiring 3B is laminated on the first plating wiring 3A, and a predetermined shape is obtained. Then, the plated wiring 3 patterned is formed. Next, a coating layer 12 is formed in the central portion of the base 2 to cover a part of the plating wiring 3 and the terminal portions 7 of the plating wiring 3 located at both end edges 2 a of the base 2 are exposed from the coating layer 12. Let Further, an opening 15 in a predetermined portion of the coating layer 12 is formed by means such as etching, and the land portion 10 of the plated wiring 3 is exposed through the opening 15.

  Subsequently, by cutting a predetermined portion in the edge portion of the substrate 2, a cut line 17 is formed, and the edge 12 a of the coating layer 12 in the edge portion of the substrate 2 is positioned with the cut line 17 as a side edge. By bending the portion and applying a load to a predetermined portion of the plated wiring 3, the plated wiring 3 is covered with the covered portion and the exposed portion with the contact portion between the plated wiring 3 and the edge 12a of the coating layer 12 as a fulcrum. Cut at the boundary. Thereafter, an insulating layer 19 is formed so as to cover the terminal portion 7 of the plated wiring 3 and the edge 12a of the coating layer 12 in a state where the base 2 is bent. At this time, the insulating layer 19 is disposed in the cut portion of the plated wiring 3.

  The flexible wiring board 1 is preferably bent and used in a conductive connection state with an electric device. Thereby, when using this flexible wiring board 1, some plated wiring 3 can be reliably made independent from the other plated wiring 3, without connecting the cut part in the plated wiring 3. FIG.

  Next, the operation of this embodiment will be described.

  As described above, according to the present embodiment, a part of the plating wiring 3 is made independent from the other plating wirings 3 by bending the base body 2 and applying a load to a predetermined portion of the plating wiring 3 to cut it. Therefore, a predetermined area is not required unlike the plating cut hole, and some plating wirings 3 can be made independent of other plating wirings 3 depending on the area where the plating wirings 3 to be cut are arranged.

  Therefore, since some plating wirings 3 can be made independent of other plating wirings 3 only by the area where the plating wirings 3 to be cut are arranged, the plating wirings 3 and the land portions 10 are formed on the flexible wiring board 1. The area where the electronic component 9 can be formed is widened, and the area where the electronic component 9 can be mounted can be widened. As a result, a larger number of electronic components 9 can be mounted. Further, by bending the base body 2 and applying a load to the predetermined portion of the plating wiring 3 and cutting it, a part of the plating wiring 3 can be made independent of other plating wirings 3 easily and reliably. The production efficiency of the flexible wiring board 1 can be improved.

  Furthermore, since the width of the portion to be cut in the plated wiring 3 is formed narrower than the width of the other portions in the plated wiring 3, it is possible to cut a predetermined portion of the plated wiring 3 with a smaller load. Can be cut more easily and reliably. Furthermore, a cut line 17 is formed in the vicinity of the plated wiring 3 to be cut at the edge 12a of the base 2 and the base of the part where the plated wiring 3 to be cut is formed using the cut line 17 as a side edge. Since 2 can be bent, only a predetermined portion of the plated wiring 3 can be easily and reliably cut without affecting the other plated wiring 3. Further, the plating wiring 3 is supported at a boundary portion between the portion exposed from the coating layer 12 and the portion covered by the coating layer 12 with a contact portion between the plating wiring 3 and the edge 12a of the coating layer 12 as a fulcrum. Since a load can be applied to a predetermined portion of the plated wiring 3, a load can be applied to the predetermined portion of the plated wiring 3 more easily and reliably, and a predetermined portion of the plated wiring 3 can be applied with a smaller load. Can be cut off.

  Further, by disposing the insulating layer 19 at the cut portion of the plated wiring 3, a part of the plated wiring 3 can be reliably made independent of the other plated wiring 3.

  In addition, this invention is not limited to the said embodiment, A various change is possible as needed.

  For example, in the present embodiment, the portion to be cut in the plated wiring 3 is a portion exposed from the coating layer 12 and is a portion facing the edge 12a of the coating layer 12, but is not limited thereto. Instead, any portion that is exposed from the coating layer 12 and can be cut by applying a load to a predetermined portion of the plated wiring 3 by bending the base 2 is used.

The schematic plan view which shows the principal part of one Embodiment of the flexible wiring board which concerns on this invention Typical sectional drawing in AA of the flexible wiring board of FIG. Typical sectional drawing which shows the case where the flexible wiring board of FIG. 2 is bent Typical top view which shows the principal part of an example of the conventional flexible wiring board

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Flexible wiring board 2 Base | substrate 2a Edge 3 Plating wiring 3A 1st plating wiring 3B 2nd plating wiring 7 Terminal part 9 Electronic component 10 Land part 12 Covering layer 12a Edge 15 Opening part 17 Cut line

Claims (6)

A plated wiring is formed by patterning into a predetermined shape on a flexible substrate, and a part of the plated wiring is covered with a coating layer, and the other part of the plated wiring is covered with the coating layer. Unexposed,
A flexible printed circuit board, wherein a predetermined portion of the plated wiring exposed in the base is cut, and a part of the plated wiring is formed independently of the other plated wiring. A plated wiring is formed by patterning into a predetermined shape on a flexible substrate, and a part of the plated wiring is covered with a coating layer,
A method for producing a flexible wiring board, comprising: bending a portion of the substrate where the plated wiring exposed without being covered by the coating layer is formed, and cutting a predetermined portion of the plated wiring .   A first plated wiring formed by patterning the exposed plated wiring on the substrate in a predetermined shape; and a current is passed through the first plated wiring to form a laminate on the first plated wiring. The manufacturing method of the flexible wiring board of Claim 2 formed with 2nd plating wiring.   The method for producing a flexible wiring board according to claim 2, wherein a width of a portion to be cut in the plated wiring is formed narrower than a width of another portion in the plated wiring.   A notch extending in a direction intersecting the width direction of the plated wiring is located near the plated wiring to be cut at the edge portion of the base, the portion to be cut in the plated wiring being located at the edge portion of the base The flexible wiring board according to any one of claims 2 to 4, wherein a wire is formed, and the base of the portion where the plated wiring to be cut is formed is bent with the cut line as a side edge. Method. The plating wiring is cut at a boundary portion between a portion exposed from the coating layer and a portion covered by the coating layer, with a contact portion between the plating wiring and an edge of the coating layer as a fulcrum. Item 6. The method for manufacturing a flexible wiring board according to any one of Items 2 to 5.

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