JP2008054097A - On-vehicle imaging module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an on-vehicle imaging module capable of suppressing the largeness of body dimensions while having functions necessary as an on-vehicle imaging module. <P>SOLUTION: An imager 11, driving circuit 13, signal processing circuit 14, AD conversion circuit 15, communication circuit 16, power supply circuit 17 and external RAM are integrated on a substrate 10 with a microcomputer 12 integrated thereon. A plurality of imaging elements 11a for photoelectrically converting an optical image generated from an imaging target are arrayed on the imager 11. The microcomputer 12 appropriately processes a signal outputted from the imager 11. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an in-vehicle imaging module that is useful when employed in an imaging device that constitutes, for example, a vehicle driving support system.

2. Description of the Related Art In recent years, driving support systems that provide driving assistance for a driver have been proposed in order to reduce the load on the driver for driving the vehicle. As such a driving support device, for example,
・ A system that detects the taillight of the preceding vehicle and the headlamp of the oncoming vehicle while driving at night, and supports switching between the high beam and low beam of the headlamp of the own vehicle. A system that helps the driver secure a wider field of view by clearly displaying vehicles and obstacles that exist outside of the vehicle ・ When parking the vehicle, it helps to ensure safety by displaying the rear view Driving support system that supports the driver in various ways, such as a system that assists the driver's steering operation during driving at a constant speed, such as a highway, to help ensure driving along the lane of the vehicle Has been proposed.

  In such a driving support system, it is required to accurately acquire image information suitable for each driving support mode. For example, in order to support the securing of a wider field of view at night because it is necessary for the driver to accurately capture vehicles and obstacles that are in front of the vehicle that cannot be captured by the driver and to make the driver recognize them. It is desirable to provide the driver with a clear image acquired through the in-vehicle imaging device. In addition, it is desirable to obtain clear image information through an in-vehicle imaging device in order to accurately recognize the white line on the front road, which is the target track of the vehicle, and to assist in ensuring traveling along the lane on an expressway. It is. Therefore, in order to realize various driving assistances as described above, the imaging devices that constitute the driving assistance system, in particular, imagers, have imaging methods such as the frame rate and exposure time as well as the number of pixels and dynamic range. It will vary widely depending on the target. Such imagers are difficult to share because of their low versatility. As a result, the number of imagers is increased, and as a result, it is difficult to secure these mounting locations.

Therefore, conventionally, as seen in, for example, Patent Document 1, a driving unit that drives an imager, a processing unit that processes image data acquired by the imager, and an analysis unit that analyzes processing data processed by the processing unit A technique for integrating peripheral circuits such as those on the same substrate has been proposed.
JP 2001-160613 A

  Thus, if only the peripheral circuit of the imager is integrated on the same substrate, it is possible to reduce the number of parts as an imaging module. Accordingly, the physique of the imaging module can be reduced, and it is easy to secure a mounting place in the vehicle. However, in order to employ the imaging module in the imaging device constituting the driving support system, in addition to the peripheral circuits such as the drive unit, the processing unit, and the analysis unit described above, the analysis result obtained by the peripheral circuit is used for in-vehicle LAN communication. A communication circuit that outputs data in a compliant format and a power supply circuit that is compatible with the vehicle are also required. Therefore, the number of parts is further increased, and even if the peripheral circuits of the imager are integrated on the same substrate and the size of the body is reduced, there is still room for improvement.

  The present invention has been made in view of the above circumstances, and an object thereof is to provide a vehicle-mounted imaging module that can further suppress the increase in size while having a necessary function as a vehicle-mounted imaging module. There is.

  In order to solve the above-described problem, in the invention according to claim 1, a plurality of image sensors for photoelectric conversion of an optical image emitted from an imaging target, which is an in-vehicle imaging module installed in a vehicle interior of a vehicle. The gist of the image pickup module is a vehicle-mounted image pickup module provided on a substrate on which a microcomputer that appropriately processes a signal output from the imager is arranged.

According to the first aspect of the present invention, an increase in the size of the physique can be further suppressed while having a necessary function as an in-vehicle imaging module.
As described in claim 2, in the in-vehicle imaging module according to claim 1, when the imager is configured to be integrated on the substrate, it is excellent in miniaturization.

  As described in claim 3, in the in-vehicle imaging module according to claim 1, the imager has excellent versatility when it has a stack structure integrated on a mounting table mounted on the substrate. Yes.

  Specifically, as described in claim 4, in the in-vehicle imaging module according to claim 3, the imager includes a wiring patterned on the surface of the mounting table and a through hole formed in the mounting table. And a wiring pattern patterned on the surface of the substrate. Alternatively, as described in claim 5, in the in-vehicle imaging module according to claim 3, the imager includes: a wiring patterned on the surface of the mounting table; a through hole formed in the mounting table; and a metal bump. And a wiring pattern patterned on the surface of the substrate and flip-chip connected. Alternatively, as described in claim 6, in the in-vehicle imaging module according to claim 3, the imager includes wiring and wire bonding patterned on the surface of the substrate via wiring patterned on the surface of the mounting table. It is set as the structure formed.

  As described in claim 7, in the in-vehicle imaging module according to any one of claims 1 to 6, a dedicated drive circuit for driving the imager in response to a command from the microcomputer is provided on the substrate. With this configuration, it is possible to further suppress an increase in the size of the physique while having a necessary function as an in-vehicle imaging module.

As described in claim 8, when the drive circuit is integrated on the substrate in the in-vehicle image pickup module according to claim 7, it is excellent in miniaturization.
As described in claim 9, in the in-vehicle imaging module according to any one of claims 1 to 8, a dedicated signal processing circuit for appropriately processing a signal output from the imager is provided on the substrate. If it becomes the structure which becomes, it can suppress the enlargement of a physique more, having a required function as a vehicle-mounted imaging module.

According to a tenth aspect of the present invention, in the in-vehicle imaging module according to the ninth aspect, if the signal processing circuit is integrated on the substrate, it is excellent in miniaturization.
The vehicle-mounted imaging module according to any one of claims 1 to 10, wherein the board is provided with a dedicated analog-digital conversion circuit that converts an input analog signal into a digital signal and outputs the digital signal. If it is set as the structure comprised by, it can suppress the enlargement of a physique more, having a required function as a vehicle-mounted imaging module.

  As described in claim 12, when the analog-digital conversion circuit is integrated on the substrate in the vehicle-mounted imaging module according to claim 11, the size is excellent.

  As described in claim 13, when the on-board imaging module according to any one of claims 1 to 12 is configured to include a dedicated memory that temporarily stores image data in the board, While having a necessary function as an in-vehicle imaging module, the size of the physique can be further suppressed.

  According to a fourteenth aspect of the present invention, in the in-vehicle imaging module according to the thirteenth aspect, the dedicated memory is provided on a surface of the substrate opposite to the surface on which the imager is provided. Can be used effectively.

  As described in claim 15, the in-vehicle imaging module according to any one of claims 1 to 14 captures data processed by the microcomputer and signals the captured data in accordance with a predetermined communication protocol. When the circuit board is provided with a dedicated communication circuit that converts and outputs to the above-mentioned circuit board, it is possible to further suppress an increase in size while having a necessary function as an in-vehicle imaging module.

  If it is set as the structure by which the vehicle-mounted power supply circuit is provided in the said board | substrate in the vehicle-mounted imaging module of any one of Claims 1-15 as described in Claim 16, it is required as a vehicle-mounted imaging module. Although it has a function, the enlargement of a physique can be suppressed more.

  As described in claim 17, in the in-vehicle imaging module according to any one of claims 1 to 16, the microcomputer is sealed with a heat radiating gel having a higher heat transfer coefficient than the substrate. Then, a surface area can be enlarged and heat dissipation can be improved.

  As described in claim 18, in the in-vehicle imaging module according to any one of claims 1 to 17, the microcomputer has a heat dissipation chip having an area larger than that of the microcomputer on a surface opposite to the substrate. If it is provided, the heat dissipation can be improved. Here, as described in claim 19, in the in-vehicle imaging module according to claim 18, the heat dissipation chip may be formed with a dedicated memory that temporarily stores and holds image data.

(First embodiment)
Hereinafter, a first embodiment of the present invention will be described with reference to the drawings.
The present embodiment is applied to a vehicle light control device, and FIG.

  As shown in FIG. 1, an in-vehicle imaging module (camera sensor) 3 is installed on the back surface of the room mirror 2 in the vehicle interior of the vehicle 1. With this in-vehicle imaging module 3, it is possible to image the front in the traveling direction of the vehicle 1 during night driving. The in-vehicle imaging module 3 captures the traveling direction ahead of the vehicle, and the tail lamp of the preceding vehicle and the headlamp of the oncoming vehicle can be detected from the captured data.

  An electronic control unit (ECU) 5 for light control is connected to the in-vehicle imaging module 3. The headlamp 6 can be controlled by the electronic control unit 5. That is, the electronic control unit 5 controls the headlamp 6 to high beam / low beam based on the recognition result of the preceding vehicle in the in-vehicle imaging module 3.

  In the vehicle-mounted imaging module 3, light from the front of the vehicle is condensed on an imager 11 described later through a lens (not shown), and a light source in a vehicle existing in front of the vehicle, that is, a tail lamp of a preceding vehicle or a head lamp of an oncoming vehicle is detected. Be able to.

FIG. 2 is a perspective view of the in-vehicle imaging module 3 in the present embodiment. FIG. 3 shows a plan view of the in-vehicle imaging module 3. FIG. 4 is a longitudinal sectional view taken along line AA in FIG.
2 to 4, the in-vehicle imaging module includes a substrate 10, an imager 11, a microcomputer (CPU) 12, a drive circuit (imager drive circuit) 13, a signal processing circuit 14, an AD conversion circuit (analog / digital conversion circuit) 15, and the like. A communication circuit 16, a power supply circuit 17, and an external RAM (dedicated memory) 18 are provided. The substrate 10 is a substrate for an integrated circuit. As a material of the substrate 10, silicon, a compound semiconductor, ceramic, or the like can be used. As shown in FIGS. 4 and 3, an imager 11, a microcomputer (CPU) 12, a drive circuit (imager drive circuit) 13, a signal processing circuit 14, and an AD conversion circuit (analog / digital conversion circuit) are disposed on the upper surface of the substrate 10. 15, a communication circuit 16, and a power supply circuit 17 are formed. As shown in FIG. 4, an external RAM 18 is formed on the lower surface of the substrate 10.

  The imager 11, the microcomputer 12, the drive circuit 13, the signal processing circuit 14, the AD conversion circuit 15, the communication circuit 16, the power supply circuit 17, and the external RAM 18 are manufactured using a semiconductor process and integrated on the substrate 10. That is, the imager 11, the drive circuit 13, the signal processing circuit 14, the AD conversion circuit 15, the communication circuit 16, the power supply circuit 17 and the external RAM 18 are integrated on the substrate 10 on which the microcomputer 12 is integrated.

  As shown in FIG. 3, the imager 11 has a plurality of imaging elements (pixels) 11 a for photoelectrically converting an optical image emitted from an imaging target outside the vehicle cabin. The imager 11 can use silicon, a compound semiconductor, or the like.

  In FIG. 3, a microcomputer (CPU) 12 is for executing various processes including appropriate processes for signals output from the imager 11. The drive circuit (imager drive circuit) 13 is a dedicated circuit that drives the imager 11 in response to a command from the microcomputer 12. When a pulse of a specific pattern is given from the microcomputer 12 to the drive circuit 13, the drive circuit 13 operates according to the pattern, drives the imager 11, and performs imaging under a predetermined condition. The predetermined condition in this case refers to the camera frame rate, exposure time, and the like.

The signal processing circuit 14 is a dedicated circuit for appropriately processing the signal output from the imager 11, and specifically amplifies the analog signal output from the imager 11.
The AD conversion circuit (analog-digital conversion circuit) 15 is a dedicated circuit that converts an input analog signal into a digital signal and outputs the digital signal. Specifically, the analog conversion signal from the signal processing circuit 14 is converted into a digital signal. Output. The AD conversion circuit 15 has a function capable of selecting a resolution of about 8 to 16 bits. The resolution may be selected by an instruction from the microcomputer 12 or an electric trim may be used. . For example, when the microcomputer 12 has a serial communication function for rewriting the flash ROM, the drive pattern of the imager 11 and the resolution of the AD conversion circuit 15 can be changed by this function.

  A signal after digital conversion by the AD conversion circuit 15 is input to the microcomputer 12. Inside the microcomputer 12, a RAM 12a for temporarily storing image data is prepared. Image analysis is performed in the microcomputer 12 to detect the tail lamp of the preceding vehicle and the head lamp of the oncoming vehicle.

  In FIG. 4, a through hole 19a is formed in the substrate 10, and an electrode material 19b is filled in the through hole 19a. The microcomputer 12 and the external RAM 18 are electrically connected by the electrode material 19b.

  An external RAM (dedicated memory) 18 is a dedicated memory that temporarily stores and holds image data. That is, in this example, in order to cope with an increase in the amount of image data, the external RAM 18 is provided in an integrated state on the back surface of the substrate 10 in addition to the RAM 12a inside the microcomputer 12. In particular, when the image data has a large capacity, the external RAM 18 is arranged on the back surface of the substrate 10 which can take a large area in consideration of an increase in the area of the RAM for storing the data. In this example using the external RAM 18, a function capable of directly transferring digital image data to the external RAM 18 without a command from the microcomputer 12 is installed in the microcomputer 12 in order to reduce the load on the microcomputer 12.

  The communication circuit 16 is a dedicated circuit that captures data processed by the microcomputer 12 and converts the captured data into a signal in accordance with a predetermined communication protocol and outputs the signal. Specifically, for example, conversion into a format conforming to in-vehicle LAN communication is performed. An image analysis result in the microcomputer 12 is output to the communication circuit 16. The electronic control device 5 shown in FIG. 1 is connected to the communication circuit 16. The communication circuit 16 serves as an interface with each connected ECU (electronic control device 5 in FIG. 1).

  The analysis result in the microcomputer 12 is received by the electronic control unit 5 in FIG. 1 via the communication circuit 16, and the headlamp of the own vehicle is based on the recognition result (presence / absence of tail lamp and headlamp) of the preceding vehicle and the oncoming vehicle. 6 is switched to high beam / low beam. As a result, during driving at night, the high beam / low beam of the headlamp 6 of the host vehicle is automatically switched depending on whether there is a preceding vehicle or an oncoming vehicle (tail lamp or headlamp), and the load on the driver for driving the vehicle Can be reduced.

According to the above embodiment, the following effects can be obtained.
(1) Since the imager 11 is provided on the substrate 10 on which the microcomputer 12 is integrated as a configuration of the in-vehicle imaging module, it is possible to further suppress an increase in size while having a necessary function as the in-vehicle imaging module. it can. In particular, since the imager 11 is integrated on the substrate 10, it is excellent in miniaturization.

  (2) The drive circuit 13 is provided on the substrate 10, and the size of the physique can be further suppressed while having a necessary function as an in-vehicle imaging module. In particular, since the drive circuit 13 is integrated on the substrate 10, it is excellent in miniaturization.

  (3) Since the signal processing circuit 14 is provided on the substrate 10, it is possible to further suppress an increase in the size of the physique while having a necessary function as an in-vehicle imaging module. In particular, since the signal processing circuit 14 is integrated on the substrate 10, it is excellent in miniaturization.

  (4) Since the AD conversion circuit (analog / digital conversion circuit) 15 is provided on the substrate 10, the size of the physique can be further suppressed while having a necessary function as an in-vehicle imaging module. In particular, since the AD conversion circuit 15 is integrated on the substrate 10, it is excellent in miniaturization.

  (5) Since the substrate 10 is provided with the RAM (dedicated memory) 18 that temporarily stores and holds the image data, the size of the physique is further suppressed while having a necessary function as an in-vehicle imaging module. Can do. In particular, since the RAM (dedicated memory) 18 is provided on the surface of the substrate 10 opposite to the surface on which the imager 11 is provided, both surfaces of the substrate 10 can be used effectively.

(6) Since the communication circuit 16 is provided on the substrate 10, it is possible to further suppress an increase in size while having a necessary function as an in-vehicle imaging module.
(7) Since the in-vehicle power supply circuit 17 is provided on the substrate 10, it is possible to further suppress an increase in the size of the physique while having a necessary function as the in-vehicle imaging module.

Note that the imager 11 may be directly driven by the microcomputer 12 without integrating the drive circuit 13.
(Second Embodiment)
Next, the second embodiment will be described focusing on the differences from the first embodiment.

FIG. 5 shows a perspective view of the in-vehicle imaging module in the present embodiment. FIG. 6 shows a plan view of the in-vehicle imaging module. FIG. 7A shows a longitudinal sectional view taken along line AA in FIG.
In the first embodiment, the imager 11 is integrated on the same plane as the substrate 10. However, in the present embodiment, the imager 11 is stacked on the substrate 10 using a stack structure.

  Specifically, as shown in FIGS. 5, 6, and 7 (a), the imager 11 has a stack structure that is integrated on the mounting table 20 formed on the substrate 10. A wiring 24 is patterned on the surface of the mounting table 20. A through hole 21 is formed in the mounting table 20, and a conductor 22 is disposed therein to form a through hole. A wiring 23 is patterned on the surface of the substrate 10. The wiring 23 is electrically connected to each component 31, 32, 33, 34 formed on the substrate 10. The imager 11 is electrically connected to the wiring 23 via a wiring 24 and a through hole (a conductor 22 disposed in the through hole 21). In this way, the substrate 10 and the imager 11 are electrically connected.

  Thus, by adopting the stack structure, it is possible to cope with the change of only the imager 11 when it is necessary to change the pixel size, the number of pixels, etc. according to the application of the sensor (excellent versatility). ).

  Instead of FIG. 7 (a), it may be as shown in FIG. 7 (b). In FIG. 7B, the wiring 24 is patterned on the surface of the mounting table 20. A through hole 25 is formed in the mounting table 20, and a conductor 26 is filled therein to form a through hole. Metal bumps 27 are formed on the surface of the substrate 10. A wiring 23 is patterned on the surface of the substrate 10. The imager 11 is flip-chip connected to the wiring 23 through the wiring 24, the through hole (the through hole 25 is filled with the conductor 26), and the metal bump 27.

  Instead of FIG. 7 (a), it may be as shown in FIG. 7 (c). In FIG. 7C, the wiring 24 is patterned on the surface of the mounting table 20. A wiring 23 is patterned on the surface of the substrate 10. The imager 11 is electrically connected to the wiring 23 via the wiring 24 by the bonding wire 28.

According to the above embodiment, the following effects can be obtained.
(8) Since the imager 11 has a stack structure that is integrated on the mounting table 20 mounted on the substrate 10, it is excellent in versatility. Specifically, as shown in FIG. 7A, the imager 11 is connected to the wiring 24 patterned on the surface of the mounting table 20, and through holes (21, 22) formed in the mounting table 20. It is configured to be electrically connected to the wiring 23 patterned on the surface of the substrate 10. Alternatively, as shown in FIG. 7B, the imager 11 passes through the wiring 24 patterned on the surface of the mounting table 20, the through holes (25, 26) formed in the mounting table 20, and the metal bumps 27. The wiring 23 patterned on the surface of the substrate 10 is flip-chip connected. Alternatively, as illustrated in FIG. 7C, the imager 11 is configured to be wire-bonded to the wiring 23 patterned on the surface of the substrate 10 through the wiring 24 patterned on the surface of the mounting table 20.
(Third embodiment)
Next, the third embodiment will be described focusing on the differences from the second embodiment.

8A is a plan view of the in-vehicle imaging module in the present embodiment, and FIG. 8B is a longitudinal sectional view taken along line AA in FIG.
In the first embodiment, the drive circuit (imager drive circuit) 13 is integrated on the substrate 10. On the other hand, in the present embodiment, the drive circuit 13 is also laminated on the substrate 10 by using a stack structure like the imager 11.

  In FIG. 8, the drive circuit 13 is built in the chip 40 and is flip-chip connected to the wiring 23 patterned on the surface of the substrate 10 through metal bumps 45 formed on the back surface of the chip 40.

  When the imager 11 has a stack structure as described above, the drive circuit 13 also has a stack structure, so that it is possible to easily cope with a case where the drive pulse is changed depending on the number of pixels of the imager 11. In FIG. 8, the external RAM 41 also employs a structure similar to that of the drive circuit 13 (a structure in which the stack is stacked on the substrate 10) and is electrically connected. In FIG. 8, the drive circuit 13 is flip-chip mounted, but may be wire bonding.

In addition, you may change the said embodiment as follows.
The signal processing circuit 14 may be integrated in the imager 11 when the stack structure is adopted. That is, the signal processing circuit 14 may be integrated in the imager 11.

The AD conversion circuit 15 may also be integrated in the imager 11 when the stack structure is adopted. That is, the AD conversion circuit 15 may be integrated with the imager 11.
Here, by integration, the imager 11, the signal processing circuit 14, and the AD conversion circuit 15 can be arranged closest to each other. By arranging them close to each other, the wiring length of the analog signal transmission portion is shortened, and it is possible to make it less susceptible to noise.

Moreover, in order to improve the heat dissipation of the microcomputer 12, it is good also as a structure as shown to Fig.9 (a) and FIG.9 (b).
In FIG. 9A, the microcomputer 12 is sealed with a heat radiating gel 50 having a heat transfer coefficient higher than that of the substrate 10. Thus, by covering the microcomputer 12 with the gel 50, the surface area can be increased and the heat dissipation can be improved.

  In FIG. 9B, a heat radiation chip 60 is disposed immediately above the microcomputer 12. The heat dissipation chip 60 has a larger area than the microcomputer 12 in order to increase the surface area. That is, the heat dissipation chip 60 having a larger area than the microcomputer 12 is provided on the surface opposite to the substrate 10 with respect to the microcomputer 12. The heat dissipation chip 60 and the microcomputer 12 are connected using solder bumps 61. By using the solder bumps 61, heat can be efficiently radiated from the microcomputer 12 to the heat dissipation chip 60. Furthermore, the heat radiation chip 60 may include a circuit function, and specifically, a dedicated memory for temporarily storing and holding image data may be formed (built-in).

  In the above-described embodiment, the present invention is applied to a light control device that detects a lamp of a preceding vehicle / oncoming vehicle and switches between a high beam and a low beam. However, the present invention is not limited to this, and the present invention may be applied to an in-vehicle imaging module used in other driving support systems. For example, the present invention is applied to a back monitor camera (vehicle-mounted imaging module) for rearward confirmation when parking or the like. Or it applies to the camera (vehicle-mounted imaging module) for monitoring the blind spot around the own vehicle and confirming safety. Or it applies to the lane detection camera (vehicle-mounted imaging module) by the white line detection used for the system which assists ensuring the driving | running | working along the lane of the own vehicle. Or it applies to the camera (vehicle-mounted imaging module) used for the system which displays the vehicle and obstacle which exist outside the reachable range of the headlamp of the own vehicle more clearly during night driving. Furthermore, the present invention may be applied to, for example, an occupant authentication camera other than the driving support system. In other words, the present invention may be applied to a case where the occupant outside the vehicle is authenticated to release the door lock, or the occupant in the vehicle interior is authenticated to allow the engine to start.

1 is an overall schematic configuration diagram of a vehicle light control device according to an embodiment. The perspective view of the vehicle-mounted imaging module in 1st this embodiment. The top view of the vehicle-mounted imaging module in 1st this embodiment. FIG. 4 is a longitudinal sectional view taken along line AA in FIG. 3. The perspective view of the vehicle-mounted imaging module in 2nd Embodiment. The top view of the vehicle-mounted imaging module in 2nd this embodiment. (A) is the longitudinal cross-sectional view in the AA line of FIG. 6, (b), (c) is a longitudinal cross-sectional view of the vehicle-mounted imaging module replaced with (a). (A) is a top view of the vehicle-mounted imaging module in 3rd Embodiment, (b) is a longitudinal cross-sectional view in the AA line of (a). (A), (b) is a longitudinal cross-sectional view of another example vehicle-mounted imaging module.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Vehicle, 10 ... Board | substrate, 11 ... Imager, 11a ... Imaging device, 12 ... Microcomputer, 13 ... Drive circuit, 14 ... Signal processing circuit, 15 ... AD converter circuit, 16 ... Communication circuit, 17 ... Power supply circuit, 18 ... external RAM, 20 ... mounting table, 23 ... wiring, 24 ... wiring, 27 ... metal bump, 50 ... gel, 60 ... chip.

Claims (19)

An in-vehicle imaging module installed in a vehicle interior of a vehicle (1),
A microcomputer (12) in which an imager (11) in which a plurality of image pickup elements (11a) for photoelectrically converting an optical image emitted from an imaging target is arranged appropriately processes a signal output from the imager (11). An in-vehicle imaging module comprising an integrated substrate (10). The in-vehicle imaging module according to claim 1, wherein the imager (11) is integrated on the substrate (10). The in-vehicle imaging module according to claim 1, wherein the imager (11) has a stack structure integrated with a mounting table (20) mounted on the substrate (10). The imager (11) includes the wiring (24) patterned on the surface of the mounting table (20) and the substrate (10) through the through holes (21, 22) formed in the mounting table (20). The in-vehicle imaging module according to claim 3, wherein the on-vehicle imaging module is electrically connected to a wiring (23) patterned on the surface of the wiring. The imager (11) is connected to the wiring (24) patterned on the surface of the mounting table (20), through holes (25, 26) formed in the mounting table (20), and metal bumps (27). The vehicle-mounted imaging module according to claim 3, which is flip-chip connected to a patterned wiring (23) on the surface of the substrate (10). The imager (11) is wire-bonded to a wiring (23) patterned on the surface of the substrate (10) via a wiring (24) patterned on the surface of the mounting table (20). The vehicle-mounted imaging module described in 1. The dedicated drive circuit (13) for driving the imager (11) in response to a command from the microcomputer (12) is provided on the substrate (10). In-vehicle imaging module. The in-vehicle imaging module according to claim 7, wherein the drive circuit (13) is integrated on the substrate (10). The vehicle-mounted imaging module according to any one of claims 1 to 8, wherein a dedicated signal processing circuit (14) for appropriately processing a signal output from the imager (11) is provided on the substrate (10). . The in-vehicle imaging module according to claim 9, wherein the signal processing circuit (14) is integrated on the substrate (10). The vehicle-mounted imaging module according to any one of claims 1 to 10, wherein a dedicated analog-digital conversion circuit (15) for converting an input analog signal into a digital signal and outputting the digital signal is provided on the substrate (10). . The in-vehicle imaging module according to claim 11, wherein the analog-digital conversion circuit (15) is integrated on the substrate (10). The in-vehicle imaging module according to any one of claims 1 to 12, wherein a dedicated memory (18) for temporarily storing and holding image data is provided on the substrate (10). The in-vehicle imaging module according to claim 13, wherein the dedicated memory (18) is provided on a surface of the substrate (10) opposite to a surface on which the imager (11) is provided. The board (10) is provided with a dedicated communication circuit (16) for taking in the data processed by the microcomputer (12) and converting the fetched data into a signal in accordance with a predetermined communication protocol and outputting it. The vehicle-mounted imaging module according to any one of claims 1 to 14. The vehicle-mounted imaging module according to any one of claims 1 to 15, wherein a vehicle-mounted power supply circuit (17) is provided on the substrate (10). The vehicle-mounted imaging module according to any one of claims 1 to 16, wherein the microcomputer (12) is sealed with a heat-dissipating gel (50) having a higher heat transfer coefficient than the substrate (10). 18. The microcomputer (12) is provided with a heat dissipation chip (60) having a larger area than the microcomputer (12) on a surface opposite to the substrate (10). The vehicle-mounted imaging module described in 1. The in-vehicle imaging module according to claim 18, wherein the heat dissipation chip (60) is formed with a dedicated memory for temporarily storing and holding image data.

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