JP2008053529A5 - - Google Patents
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- Publication number
- JP2008053529A5 JP2008053529A5 JP2006229141A JP2006229141A JP2008053529A5 JP 2008053529 A5 JP2008053529 A5 JP 2008053529A5 JP 2006229141 A JP2006229141 A JP 2006229141A JP 2006229141 A JP2006229141 A JP 2006229141A JP 2008053529 A5 JP2008053529 A5 JP 2008053529A5
- Authority
- JP
- Japan
- Prior art keywords
- encapsulant
- surfactant
- epoxy
- molecule
- semiconductor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000004593 Epoxy Substances 0.000 claims 1
- 150000008065 acid anhydrides Chemical class 0.000 claims 1
- 239000008393 encapsulating agent Substances 0.000 claims 1
- 230000003287 optical effect Effects 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- 229920002050 silicone resin Polymers 0.000 claims 1
- 239000004094 surface-active agent Substances 0.000 claims 1
Claims (1)
An encapsulant for an optical semiconductor element, which contains a silicone resin having one or more epoxy-containing groups in the molecule, an acid anhydride, and a surfactant.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006229141A JP2008053529A (en) | 2006-08-25 | 2006-08-25 | Sealant for optical semiconductor element, and optical semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006229141A JP2008053529A (en) | 2006-08-25 | 2006-08-25 | Sealant for optical semiconductor element, and optical semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2008053529A JP2008053529A (en) | 2008-03-06 |
| JP2008053529A5 true JP2008053529A5 (en) | 2009-08-20 |
Family
ID=39237277
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006229141A Withdrawn JP2008053529A (en) | 2006-08-25 | 2006-08-25 | Sealant for optical semiconductor element, and optical semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2008053529A (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4452755B2 (en) * | 2007-06-15 | 2010-04-21 | 積水化学工業株式会社 | Sealant for optical semiconductor element and optical semiconductor element |
| JP5472166B2 (en) * | 2011-03-15 | 2014-04-16 | Ｊｓｒ株式会社 | Curable composition, trench embedding method, cured film, and semiconductor light emitting device |
| JP5875269B2 (en) * | 2011-07-13 | 2016-03-02 | 株式会社ダイセル | Curable epoxy resin composition |
| JP6279830B2 (en) * | 2012-11-12 | 2018-02-14 | 日本化薬株式会社 | Curable resin composition and cured product thereof |
| JP6046497B2 (en) * | 2013-01-09 | 2016-12-14 | 株式会社ダイセル | Curable epoxy resin composition |
| JP2015088514A (en) | 2013-10-28 | 2015-05-07 | 日東電工株式会社 | Resin sheet for sealing electronic device, and method of manufacturing electronic device package |
| JP2018030999A (en) * | 2017-08-04 | 2018-03-01 | 日本化薬株式会社 | Curable resin composition and cured product of the same |
-
2006
- 2006-08-25 JP JP2006229141A patent/JP2008053529A/en not_active Withdrawn
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