JP2007329891A - Image detection apparatus and related lens module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an image detection apparatus providing a conductive bump on a substrate so as to prevent itself from contamination, and to provide a lens module that uses it so as to solve the several problems of due to conventional technology. <P>SOLUTION: The image detection apparatus includes a substrate having an opening, a filter provided on a surface of the substrate for covering the opening, and a sensitive chip electrically connected to the substrate. The sensitive chip has a photosensitive area, corresponding to the opening. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an image sensing device, and more particularly to an image sensing device for forming conductive bumps on the surface of a substrate by FC mounting and a lens module using the image sensing device.

  Regarding the mounting technology of the image sensing device, there are two types such as CSP (chip scale package) mounting and COB (chip on board) mounting. The former is affected by the epoxy resin added during the process and has the disadvantage that the resolution and image quality are lowered. In contrast, the latter can provide high image quality, but requires wire bonding and can contaminate the sensing chip of the image sensing device made thereby. In addition, as long as there is a wire, the thickness and size of the image sensing device and the image module using the image sensing device cannot be effectively reduced.

  As an alternative, FC (flip chip) mounting has been introduced that simultaneously improves image quality and reduces module scale. However, since the conventional FC mounting produces conductive bumps on the sensing chip, contamination of the image sensing device is still unavoidable.

  In order to solve the above-described problems, an object of the present invention is to provide an image sensing device in which conductive bumps are formed on a substrate so as not to contaminate the image sensing device, and a lens module using the image sensing device.

  The present invention provides an image sensing device. The image sensing device includes a substrate having an opening, a filter provided on the upper surface of the substrate and covering the opening, and a sensing chip electrically connected to the substrate. The sensing chip has a photosensitive area corresponding to the opening.

  The present invention further provides a lens module. The lens module includes a lens, an image sensing device that senses a light beam focused on the lens, and a fixing module that is provided in the image sensing device and fixes the lens. The image sensing device includes a substrate having an opening, a filter provided on the upper surface of the substrate and covering the opening, a sensing chip electrically connected to the substrate, and an FPC coupled to the substrate. The sensing chip has a photosensitive area corresponding to the opening.

  The present invention maintains the photosensitive bandwidth and quality by creating conductive bumps on the substrate and sealing the openings with a filter to protect the photosensitive area of the sensing chip from contamination. Since the substrate and the chip are connected via contacts, the space required for wire bonding can be reduced, the module size can be reduced, the capacitor effect due to the wire can be reduced, and the image quality can be improved.

  In order to describe the characteristics of such a device in detail, a specific example will be given and described below with reference to the drawings.

  Please refer to FIG. FIG. 1 is an explanatory diagram showing the structure of an image sensing device 150 according to the present invention. The image sensing device 150 is manufactured by FC mounting. Referring to FIG. 1, the image sensing device 150 includes a substrate 152, a filter 154, and a sensing chip 156. Since the assembly of the image sensing device 150 is well known to those skilled in the art, a detailed description thereof is omitted here. Please refer to FIG. 2 and FIG. 2 is an external view of the substrate 152 of FIG. 1, and FIG. 3 is a plan view of the sensing chip 156 of FIG. According to FIG. 2, the substrate 152 is provided with an opening 153 and at least one conductive bump 155, the side surface of which provides a side connection and transmits a sensed image signal to the image sensing device 150. A via 159 for receiving an external control signal is provided. According to FIG. 3, the sensing chip 156 includes a photosensitive region 157. When the sensing chip 156 is aligned with the substrate 152, the photosensitive region 157 corresponds to the opening 153 of the substrate 152, and the light beam passes through the opening 153 and reaches the photosensitive region 157 of the sensing chip 156. The sensing chip 156 further includes at least one connection pad 158 that contacts and is electrically connected to the conductive bump 155. In the manufacturing process of the image sensing device 150, first, the substrate 152 is turned over so that the conductive bump 155 faces upward, and at the same time, the photosensitive region 157 of the sensing chip 156 faces downward and is aligned with the opening 153, and the connection pad 158 is connected to the conductive bump 155. The substrate 152 and the sensing chip 156 are coupled. Thereafter, the integrated substrate 152 and sensing chip 156 are turned over again, and a filter 154 that protects the photosensitive area 157 is stretched over the opening 153 to seal it. Keeping the photosensitive area 157 facing down during the manufacturing process can prevent particulate contamination.

  Please refer to FIG. FIG. 4 is an explanatory view showing the structure of the lens module 100 according to the first embodiment of the present invention. In the first embodiment, the lens module 100 includes a lens 110, a fixing module 120, and an image sensing device 125. The image sensing device 125 includes a flexible printed circuit board (FPC) 130, at least one passive element 140, a substrate 102, a filter 104, and a sensing chip 106. The structures of the substrate 102, the filter 104, and the sensing chip 106 are as described above, and a description thereof is omitted here. 4, at least one passive element 140 is provided on the substrate 102, an FPC 130 is provided below the sensing chip 106, and the plurality of vias 159 shown in FIG. At the same time as coupling the FPC 130, a conductive material 160 is injected that provides a side connection, transmits the sensed image signal to the image sensing device 150, and receives an external control signal. Note that in order to further strengthen the bond between the substrate 102 and the sensing chip 106 and between the substrate 102 and the FPC 130, an adhesive conductive material 160 (eg, anisotropic conductive film (ACF)) is used here. Is used. When the lens module 100 is assembled, the fixing module 120 is first provided on the image sensing device 112 (that is, on the substrate 102), and the lens 110 is further fixed by the fixing module 120.

  Please refer to FIG. FIG. 5 is an explanatory view showing the structure of a lens module 200 according to Embodiment 2 of the present invention. The lens module 200 of FIG. 5 is substantially similar to the lens module 100 of FIG. 4, but unlike the lens module 100, the image sensing device 225 of the lens module 200 includes a connector 270 provided under the FPC 130. The connector 270 transmits the sensed image signal to the image sensing device 225 and receives an external control signal.

  Please refer to FIG. FIG. 6 is an explanatory view showing the structure of a lens module 300 according to Embodiment 3 of the present invention. In the third embodiment, the lens module 300 includes a lens 110, a fixing module 120, and an image sensing device 325. The image sensing device 325 includes an FPC 130, at least one passive element 140, a pedestal 180, a substrate 302, a filter 304, and a sensing chip 306. The structures of the substrate 302, the filter 304, and the sensing chip 306 are as described above, and a description thereof is omitted here. According to FIG. 6, the pedestal 180 has a bottom 182 and a side wall 184. The side wall 184 is provided on the bottom portion 182, and the bottom portion 182 and the side wall 184 form a recess 186. The sensing chip 156 is provided in the recess 186, the substrate 302 is provided in the sidewall 184, and the plurality of vias 159 shown in FIG. A conductive material 160 that transmits an image signal sensed at 325 and receives an external control signal is injected. In order to further strengthen the coupling between the substrate 302 and the sensing chip 306, between the substrate 302 and the pedestal 180, and between the pedestal 180 and the FPC 130, an adhesive conductive material 160 is used in this embodiment. When assembling the lens module 300, the fixing module 120 is first provided on the image sensing device 325 (that is, on the substrate 302), and the lens 110 is further fixed by the fixing module 120.

  Please refer to FIG. FIG. 7 is an explanatory view showing the structure of a lens module 400 according to Embodiment 4 of the present invention. In the fourth embodiment, the lens module 400 includes a lens 110, a fixing module 120, and an image sensing device 425. The image sensing device 425 includes an FPC 130, at least one passive element 140, a substrate 402, a filter 404, and a sensing chip 406. The structures of the substrate 402, the filter 404, and the sensing chip 406 are as described above, and a description thereof is omitted here. According to FIG. 7, the FPC 130 is provided on the substrate 402, and at least one passive element 140 is provided on the FPC 130. The plurality of vias 159 shown in FIG. Simultaneously with the ring, conductive material 160 is injected that provides a side connection, transmits the sensed image signal to the image sensing device 425, and receives an external control signal. In order to further strengthen the bond between the substrate 402 and the sensing chip 406 and between the substrate 402 and the FPC 130, an adhesive conductive material 160 is used in this embodiment. When the lens module 400 is assembled, the fixing module 120 is first provided on the image sensing device 425, and the lens 110 is further fixed by the fixing module 120. It should be noted that one end of the fixing module 120 according to the fourth embodiment is fixed to the FPC 130 and the other end is fixed to the substrate 402. However, the present invention is not limited to this.

  Please refer to FIG. FIG. 8 is an explanatory view showing a manufacturing process of the substrate 152 of FIG. According to FIG. 8, first, a plurality of holes 820 are formed by a distance d (distance d is the width of the substrate 125) along the X-axis direction of the original substrate 810, and then a direction parallel to the Y-axis (the X coordinate is the same). A plurality of substrates 830 are formed by cutting the original substrate 810 along the holes 820. Further, an opening is formed in the substrate 830, at least one conductive bump is provided, and a structure as shown in FIG. 1 is manufactured. After cutting the original substrate 810, the plurality of holes 820 are formed with a plurality of vias 154 on the side surface of the substrate 152, and a conductive material is injected therein, so that the side connection is possible, and at the same time, the image sensed by the image sensing device. Signal transmission and external control signal reception are also possible.

  It should be noted that the installation of passive elements and connectors in the lens module is merely an example. Depending on the design requirements, it is possible to provide passive elements below the board or FPC instead of above, or connectors above or below the FPC.

  The above is a preferred embodiment of the present invention and does not limit the scope of the present invention. Therefore, any modifications or changes that can be made by those skilled in the art, which are made within the spirit of the present invention and have an equivalent effect on the present invention, shall belong to the scope of the claims of the present invention. To do.

  The present invention maintains the photosensitive bandwidth and quality by creating conductive bumps on the substrate and sealing the openings with a filter to protect the photosensitive area of the sensing chip from contamination.

It is explanatory drawing showing the structure of the image sensing apparatus by this invention. It is an external view of the board | substrate of FIG. It is a top view of the sensing chip of FIG. It is explanatory drawing showing the structure of the lens module by Example 1 of this invention. It is explanatory drawing showing the structure of the lens module by Example 2 of this invention. It is explanatory drawing showing the structure of the lens module by Example 3 of this invention. It is explanatory drawing showing the structure of the lens module by Example 4 of this invention. It is explanatory drawing showing the manufacturing process of the board | substrate of FIG.

Explanation of symbols

100, 200, 300, 400 Lens module 110 Lens 120 Fixed module 130 Flexible printed circuit board (FPC)
140 Passive element 150, 125, 225, 325, 425 Image sensing device 152, 102, 302, 402, 830 Substrate 153 Opening 154, 104, 304, 404 Filter 155 Conductive bump 156, 106, 306, 406 Sensing chip 157 Photosensitive region 158 Connection pad 159 Via 160 Conductive material 180 Base 182 Bottom 184 Side wall 186 Recess 270 Connector 810 Original substrate 820 Hole

Claims (22)

An image sensing device,
A substrate having an opening;
A filter provided on the upper surface of the substrate and covering the opening;
Including a sensing chip electrically connected to the substrate, of which the sensing chip is
An image sensing device having a photosensitive region corresponding to an opening.   The image sensing device according to claim 1, wherein at least one passive element is provided on a surface of the substrate.   3. The image sensing device according to claim 2, wherein a plurality of vias are provided on a side surface of the substrate. A method of manufacturing the substrate having the plurality of vias is as follows.
4. The image sensing device according to claim 3, further comprising the step of creating a plurality of holes in the original substrate by a predetermined distance and further cutting the substrate at the plurality of holes. The image sensing device further includes
A flexible printed circuit board provided below the sensing chip;
4. The image sensing device according to claim 3, further comprising a conductive material coupled to the substrate and the flexible printed circuit board.   6. The image sensing device according to claim 5, wherein the image sensing device further includes a connector provided on the flexible printed circuit board, and the connector and the sensing chip are provided on both sides of the flexible printed circuit board, respectively. The image sensing device further includes
3. The image sensing device according to claim 2, further comprising a pedestal having a bottom forming a recess and a side wall provided thereon, wherein the substrate is provided on the side wall, and the sensing chip is provided in the recess. The image sensing device further includes
A flexible printed circuit board provided below the sensing chip;
8. The image sensing device according to claim 7, further comprising a conductive material coupled to the substrate and the flexible printed circuit board. The image sensing device further includes
A flexible printed circuit board with one end coupled to the upper surface of the substrate;
2. The image sensing device according to claim 1, further comprising a conductive material coupled to the substrate and the flexible printed circuit board.   The image sensing device according to claim 9, wherein at least one passive element is provided on a surface of the flexible printed circuit board.   At least one conductive bump is provided on a lower surface of the substrate, the sensing chip has at least one connection pad, and the connection pad is in contact with and connected to the conductive bump. The image sensing device according to claim 1. A lens module,
A lens,
An image sensing device for sensing the light beam focused on the lens;
The image sensing device includes a fixing module for fixing the lens, and the image sensing device includes:
A substrate having an opening;
A filter provided on the upper surface of the substrate and covering the opening;
A sensing chip electrically connected to the substrate;
A flexible printed circuit board coupled to a substrate, the sensing chip comprising:
A lens module having a photosensitive region corresponding to an opening.   The lens module according to claim 12, wherein at least one passive element is provided on a surface of the substrate.   The lens module according to claim 13, wherein a plurality of vias are provided on a side surface of the substrate. A method of manufacturing the substrate having the plurality of vias is as follows.
15. The lens module according to claim 14, further comprising a step of creating a plurality of holes in the original substrate by a predetermined distance, and further cutting the substrate at the plurality of holes. The lens module further includes
14. The lens module according to claim 13, further comprising a conductive material coupled to the substrate and the flexible printed circuit board, wherein the flexible printed circuit board is provided below the pedestal.   The lens module according to claim 16, wherein the lens module further includes a connector provided on the flexible printed circuit board, and the connector and the sensing chip are provided on both sides of the flexible printed circuit board. The lens module further includes
14. The lens module according to claim 13, further comprising a pedestal having a bottom portion forming a recess and a side wall provided thereon, wherein the substrate is provided on the side wall, and the sensing chip is provided in the recess. The lens module further includes
19. The lens module according to claim 18, further comprising a conductive material coupled to the substrate and the flexible printed circuit board, wherein the flexible printed circuit board is provided below the pedestal. The lens module further includes
The lens module according to claim 12, further comprising a conductive material coupled to the substrate and the flexible printed circuit board, wherein one end of the flexible printed circuit board is coupled to the upper surface of the substrate.   The lens module according to claim 20, wherein at least one passive element is provided on a surface of the flexible printed circuit board.   At least one conductive bump is provided on a lower surface of the substrate, the sensing chip has at least one connection pad, and the connection pad is in contact with and connected to the conductive bump. The lens module according to claim 12.

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