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JP2007329394A - Light source module, method for manufacturing the same, and liquid crystal display device - Google Patents

Light source module, method for manufacturing the same, and liquid crystal display device Download PDF

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JP2007329394A
JP2007329394A JP2006161069A JP2006161069A JP2007329394A JP 2007329394 A JP2007329394 A JP 2007329394A JP 2006161069 A JP2006161069 A JP 2006161069A JP 2006161069 A JP2006161069 A JP 2006161069A JP 2007329394 A JP2007329394 A JP 2007329394A
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light
source module
light source
metal substrate
light emitting
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Naoki Yomoto
直樹 四本
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Hitachi Lighting Ltd
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Hitachi Lighting Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a light source module in which light extraction efficiency of LED light is improved, a method of manufacturing the light source module, and a liquid crystal display device. <P>SOLUTION: The light source module 7 comprises: a light emitting device 1 having a plurality of light emitting diodes 12 to 14 for each emitting red, blue and green; a metal substrate 2 on which the light emitting device 1 is mounted; a light scattering reflection member 3 that on the metal substrate 2 as a frame encircling the light emitting device 1; a seal member 4 for sealing between the light scattering reflection member 3 and metal substrate 2; and a transparent resin 5 that is filled into the frame of the light scattering reflection member 3. Furthermore, it can comprise an optical member 6 formed of a transparent material on the transparent resin 5. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、発光ダイオード（ＬＥＤ）を光源として用いた光源モジュール、光源モジュールの製造方法および液晶表示装置に関する。   The present invention relates to a light source module using a light emitting diode (LED) as a light source, a method for manufacturing the light source module, and a liquid crystal display device.

ＬＥＤは冷陰極管のように水銀を使用しておらず、しかも小型で低電力駆動が可能であり、近年ではその発光効率の向上が目覚しい。従来のＬＥＤモジュールの形状は砲弾型が主流であったが徐々に面実装タイプが増え、ＬＥＤモジュールが小型化することで、その利用が幅広く期待されている。また、近年では液晶テレビや携帯電話機の急速な普及やパーソナルコンピュータの小型化に伴い液晶表示装置の高性能化が推進され、バックライトの光源にＬＥＤを使用することでその要求を満たしている。特に色再現性については、ＬＥＤを用いることで蛍光ランプでは再現できなかった色が表示できるようになり、濃い赤色や濃い緑色の表示が可能となる。   The LED does not use mercury like a cold cathode tube, and is small and can be driven with low power. In recent years, the luminous efficiency has been remarkably improved. The conventional LED module has been mainly used in the shape of a shell, but the number of surface mounting types has gradually increased, and the LED module has been downsized, so that its use is widely expected. In recent years, with the rapid spread of liquid crystal televisions and mobile phones and the miniaturization of personal computers, the performance of liquid crystal display devices has been promoted, and the requirement is satisfied by using LEDs as the light source of the backlight. In particular, with regard to color reproducibility, it becomes possible to display colors that could not be reproduced with fluorescent lamps by using LEDs, and display of dark red or dark green is possible.

しかしながら、現在のところＬＥＤは、冷陰極蛍光管よりも低い発光効率しか得られていない。このため、ＬＥＤを高密度に実装し、ＬＥＤに大電流を投入して発光量を増やすとともに、光の利用効率を上げることによって冷陰極蛍光管と同等レベルの輝度を引き出している。このように、ＬＥＤに大電流を投入した場合、ＬＥＤは投入された電流に応じた発熱を生じる。この発熱による温度上昇は、ＬＥＤ自体および周辺部材の性能を劣化させ、光源モジュールの長期信頼性に影響を及ぼす。   However, at present, LEDs have only a lower luminous efficiency than cold cathode fluorescent tubes. For this reason, LEDs are mounted at a high density, a large current is supplied to the LEDs to increase the amount of light emission, and the use efficiency of light is increased to bring out the luminance equivalent to that of the cold cathode fluorescent tube. Thus, when a large current is input to the LED, the LED generates heat corresponding to the input current. The temperature rise due to the heat generation deteriorates the performance of the LED itself and peripheral members, and affects the long-term reliability of the light source module.

そこで、この種の光源モジュールではＬＥＤの放熱構造が必要となる。例えば特許文献１では、放熱構造として、ＬＥＤチップを金属基板上に搭載する構造が示されている。この放熱構造では、ＬＥＤの発熱を金属基板が吸収・放熱することによってＬＥＤの温度上昇が抑えられている。
特開２００２−２９９６９７号公報 Therefore, this type of light source module requires an LED heat dissipation structure. For example, Patent Document 1 discloses a structure in which an LED chip is mounted on a metal substrate as a heat dissipation structure. In this heat dissipation structure, the metal substrate absorbs and dissipates heat generated by the LED, thereby suppressing an increase in LED temperature.
JP 2002-299697 A

薄型の液晶表示装置に適合する赤青緑のＬＥＤ光源モジュールを形成するためには、上記特許文献１の構成のようにＬＥＤチップを金属基板に直接搭載する必要がある。しかしながら、前記構成では赤青緑のＬＥＤ光の混合については考慮されていない。光の混合距離は、ＬＥＤチップを覆う透明封止樹脂と導光板入射面の間に空隙を設けてもよいが、この場合、透明封止樹脂と空気、および空気と導光板の各界面における光透過率の変化によって反射が起き、ＬＥＤ光の取り出し効率が低下してしまうという問題がある。   In order to form a red, blue, and green LED light source module suitable for a thin liquid crystal display device, it is necessary to directly mount an LED chip on a metal substrate as in the configuration of Patent Document 1. However, the above configuration does not consider the mixing of red, blue, and green LED light. As for the mixing distance of light, a gap may be provided between the transparent sealing resin covering the LED chip and the light guide plate incident surface, but in this case, light at each interface between the transparent sealing resin and air and air and the light guide plate There is a problem that reflection occurs due to a change in transmittance, and LED light extraction efficiency decreases.

従って本発明の目的は、ＬＥＤ光の光取り出し効率を向上した光源モジュール、光源モジュールの製造方法および液晶表示装置を提供することにある。   Accordingly, an object of the present invention is to provide a light source module, a method for manufacturing the light source module, and a liquid crystal display device with improved light extraction efficiency of LED light.

上記目的は、異なる色を発する複数の発光ダイオードを有する発光素子と、前記発光素子を搭載した金属基板と、前記発光素子を取り囲む枠として前記金属基板上に配置された光散乱反射部材と、前記光散乱反射部材と前記金属基板との間をシールするシール部材と、前記光散乱反射部材の枠内に充填された透明樹脂とを備えた光源モジュールにより、達成される。   The object is to provide a light emitting element having a plurality of light emitting diodes emitting different colors, a metal substrate on which the light emitting element is mounted, a light scattering reflection member disposed on the metal substrate as a frame surrounding the light emitting element, This is achieved by a light source module including a seal member that seals between a light scattering reflection member and the metal substrate, and a transparent resin filled in a frame of the light scattering reflection member.

ここで、前記シール部材は好適には光散乱反射機能を有し、また弾性材料で構成することができる。また、前記透明樹脂は弾性材料で構成することができる。前記発光素子は、赤色、青色および緑色をそれぞれ発する複数の発光ダイオードを有することができる。さらに、前記透明樹脂上に透明材料で形成された光学部材を備えることができる。   Here, the seal member preferably has a light scattering reflection function and can be made of an elastic material. The transparent resin can be made of an elastic material. The light emitting element may include a plurality of light emitting diodes that emit red, blue, and green, respectively. Furthermore, the optical member formed with the transparent material on the said transparent resin can be provided.

本発明に係る光源モジュールの製造方法は、金属基板上に異なる色を発する複数の発光ダイオードを有する発光素子を搭載する工程と、前記発光素子を取り囲む枠として前記金属基板上に光散乱反射部材を配置する工程と、前記光散乱反射部材と前記金属基板との間をシール部材でシールする工程と、前記光散乱反射部材の枠内に透明樹脂を充填する工程とを備える。前記透明樹脂の硬化温度は、前記光散乱反射部材の軟化点温度よりも低くすることが好ましい。   The light source module manufacturing method according to the present invention includes a step of mounting a light emitting element having a plurality of light emitting diodes emitting different colors on a metal substrate, and a light scattering reflection member on the metal substrate as a frame surrounding the light emitting element. A step of arranging, a step of sealing between the light scattering reflection member and the metal substrate with a sealing member, and a step of filling a transparent resin in a frame of the light scattering reflection member. The curing temperature of the transparent resin is preferably lower than the softening point temperature of the light scattering reflection member.

本発明に係る液晶表示装置は、前記光源モジュールと、前記光源モジュールから入射した光を導く導光板と、前記導光板の一方の面に対向して設けられた光反射シートと、前記導光板の他方の面に対向して設けられた液晶パネルとを備えて構成される。   The liquid crystal display device according to the present invention includes: the light source module; a light guide plate that guides light incident from the light source module; a light reflection sheet provided to face one surface of the light guide plate; And a liquid crystal panel provided opposite to the other surface.

本発明によれば、ＬＥＤ光の光取り出し効率を向上した光源モジュール、光源モジュールの製造方法および液晶表示装置を得ることができる。   ADVANTAGE OF THE INVENTION According to this invention, the light source module which improved the light extraction efficiency of LED light, the manufacturing method of a light source module, and a liquid crystal display device can be obtained.

図１は、本発明に係る光源モジュールの一実施例を示す斜視図である。図２は、図１の光源モジュールを用いられる発光素子の構成例を示す図である。
図１に示すように、光源モジュール７は、異なる色を発する複数の発光ダイオードを有する発光素子１と、発光素子１を搭載した金属基板２と、発光素子１を取り囲む枠として金属基板上に配置される光散乱反射部材３と、光散乱反射部材３と金属基板２との間をシールするシール部材４と、光散乱反射部材３の枠内に充填された透明樹脂５とを備えて構成される。さらに、透明樹脂５上に透明材料で形成された光学部材６を備えることができる。以下、各部の詳細を説明する。 FIG. 1 is a perspective view showing an embodiment of a light source module according to the present invention. FIG. 2 is a diagram illustrating a configuration example of a light emitting element in which the light source module of FIG. 1 is used.
As shown in FIG. 1, the light source module 7 is arranged on a metal substrate as a light emitting element 1 having a plurality of light emitting diodes emitting different colors, a metal substrate 2 on which the light emitting element 1 is mounted, and a frame surrounding the light emitting element 1. Light scattering reflection member 3, sealing member 4 for sealing between light scattering reflection member 3 and metal substrate 2, and transparent resin 5 filled in the frame of light scattering reflection member 3. The Furthermore, the optical member 6 formed of a transparent material on the transparent resin 5 can be provided. Details of each part will be described below.

発光素子１は、図２に示すように、青色発光ダイオード１２と、緑色発光ダイオード１３と、赤色ダイオード１４と、これらの発光ダイオードを実装するサブマウント基板１５とを備える。金属基板２は、発光素子１の発熱を効率よく熱伝導するために、基板の母材にアルミニウムや銅のような金属材料を用いる。光散乱反射部材３は、発光素子１の発光を拡散させ、青色発光ダイオード１２と、緑色発光ダイオード１３と、赤色ダイオード１４の発光色を混色し、白色光を作り出すものである。そのため光散乱反射部材３は好適には少なくとも内面が光散乱反射機能を有し、例えば白色とされる。シール部材４は、金属基板２と光散乱反射部材３を接合するために用いられるものであり、光散乱反射部材３と同様にＬＥＤの各発光色の混色性を高めるため好適には光散乱反射機能を有し、例えば白色とされる。透明樹脂５は、発光素子１の発光を効率よく後述する導光板９へ伝えるために用いられる。これにより、ＬＥＤ光の高い光取り出し効率を得ることができる。光学部材６は、光散乱反射部材３での混色性をさらに強化し、または導光板９への光の伝達性能をさらに向上するために必要に応じて用いられる。   As shown in FIG. 2, the light emitting element 1 includes a blue light emitting diode 12, a green light emitting diode 13, a red diode 14, and a submount substrate 15 on which these light emitting diodes are mounted. The metal substrate 2 uses a metal material such as aluminum or copper as a base material of the substrate in order to efficiently conduct heat of the light emitting element 1. The light-scattering / reflecting member 3 diffuses the light emitted from the light-emitting element 1 and mixes the light-emitting colors of the blue light-emitting diode 12, the green light-emitting diode 13, and the red diode 14 to produce white light. Therefore, at least the inner surface of the light scattering reflection member 3 preferably has a light scattering reflection function, for example, white. The seal member 4 is used to join the metal substrate 2 and the light scattering / reflecting member 3. Like the light scattering / reflecting member 3, the sealing member 4 is preferably light scattering / reflecting in order to improve the color mixing property of each emission color of the LED. For example, white. The transparent resin 5 is used to efficiently transmit light emitted from the light emitting element 1 to a light guide plate 9 described later. Thereby, the high light extraction efficiency of LED light can be obtained. The optical member 6 is used as necessary to further enhance the color mixing property of the light scattering reflection member 3 or to further improve the light transmission performance to the light guide plate 9.

図１において、発光素子１より射出される青色発光ダイオード１２と、緑色発光ダイオード１３と、赤色ダイオード１４の発光は、透明樹脂５を介して後述する導光板９へ入射される。発光素子１の配光は集光していないため、発光素子１の横方向への発光は散乱反射部材３の内壁面にぶつかる。散乱反射部材３にぶつかった光は、散乱反射され、青色発光ダイオード１２と、緑色発光ダイオード１３と、赤色ダイオード１４の発光の混色性を高めることができる。一方、一部の発光はシール材４にぶつかるが、シール部材４も光散乱反射機能を付与し、例えば白色とすることにより、ここでも同様に散乱反射が生じ、前述の混色性をより一層高めることができる。   In FIG. 1, light emitted from the blue light emitting diode 12, the green light emitting diode 13, and the red diode 14 emitted from the light emitting element 1 is incident on a light guide plate 9 described later via the transparent resin 5. Since the light distribution of the light emitting element 1 is not condensed, the light emitted from the light emitting element 1 in the lateral direction hits the inner wall surface of the scattering reflection member 3. The light hitting the scattering reflection member 3 is scattered and reflected, and the color mixing property of the light emission of the blue light emitting diode 12, the green light emitting diode 13, and the red diode 14 can be improved. On the other hand, a part of the emitted light hits the sealing material 4, but the sealing member 4 also provides a light scattering reflection function, for example, white, thereby causing scattering reflection in the same manner, and further improving the above-described color mixing property. be able to.

また、透明樹脂５が大きなブロックで構成されることにより、透明樹脂５と金属基板２が大きな面で接合され、これによって大きな熱応力が発生し反りや接合界面の剥離を引き起こすおそれがあるが、これに対しては、例えばシール部材４、透明樹脂５またはその両者を弾性材料、例えばシリコーンあるいはシリコーン・ゲル等で構成する。これにより、ＬＥＤの発熱による光源モジュールの熱変形を吸収し、反りや界面剥離を抑制する構成を実現することができる。また、これにより、薄型・長尺の複数の発光ダイオードを搭載した光源モジュールを形成することが可能になり、さらに高寿命な液晶表示装置を提供することができる。   Further, since the transparent resin 5 is composed of a large block, the transparent resin 5 and the metal substrate 2 are bonded to each other on a large surface, which may cause a large thermal stress and cause warping or peeling of the bonding interface. For this, for example, the sealing member 4 and the transparent resin 5 or both are made of an elastic material such as silicone or silicone gel. Thereby, the structure which absorbs the heat deformation of the light source module by the heat_generation | fever of LED, and suppresses curvature and interface peeling can be implement | achieved. In addition, this makes it possible to form a light source module on which a plurality of thin and long light emitting diodes are mounted, and to provide a liquid crystal display device having a longer life.

図３（ａ）〜（ｄ）は、本発明に係る光源モジュールの製造方法の一例を示す図である。まず、図３（ａ）に示すように、金属基板２上に異なる色を発する複数の発光ダイオード１２〜１４を有する発光素子１を搭載し、発光素子１を取り囲む枠として金属基板２上に光散乱反射部材３を配置する。次に、図３（ｂ）に示すように、光散乱反射部材３と金属基板２との間をシール部材４でシールする。続いて、図３（ｃ）に示すように、光散乱反射部材３の枠内に透明樹脂５を充填する。この充填は、光散乱反射部材３の枠の上端まで一杯にしてもよいが、図示のように枠の上端より下の部分で止めてもよい。また、図３（ｄ）に示すように、必要に応じて、透明樹脂５上に透明材料で形成された光学部材６を設ける。以下、詳細に説明する。   3A to 3D are views showing an example of a method for manufacturing a light source module according to the present invention. First, as shown in FIG. 3A, a light emitting element 1 having a plurality of light emitting diodes 12 to 14 that emit different colors is mounted on a metal substrate 2, and light is applied to the metal substrate 2 as a frame surrounding the light emitting element 1. The scattering reflection member 3 is disposed. Next, as shown in FIG. 3B, the space between the light scattering reflection member 3 and the metal substrate 2 is sealed with a seal member 4. Subsequently, as shown in FIG. 3C, a transparent resin 5 is filled in the frame of the light scattering reflection member 3. This filling may be filled up to the upper end of the frame of the light-scattering / reflecting member 3, but may be stopped at a portion below the upper end of the frame as shown. Moreover, as shown in FIG.3 (d), the optical member 6 formed with the transparent material on the transparent resin 5 is provided as needed. Details will be described below.

青色発光ダイオードと、緑色発光ダイオードと、赤色ダイオードとをサブマウント基板に実装した複数の発光素子１は、金属基板２に銀ペーストまたは半田などで実装する。この発光素子１が実装された金属基板２上に白色のポリカーボネート、ＡＢＳ、セラミックなどを材料として構成された枠材としての光散乱反射部材３を載せる。金属基板２と光散乱反射部材３を接合するために、光散乱反射部材３の内壁面と金属基板２の接地面に全周にわたってシール部材４を塗布する。このときシール部材４は白色シリコーンなどを用いる。シール部材４を加熱硬化、ＵＶ硬化、自然硬化などで硬化させた後、金属基板２と光散乱反射部材３とシール材４によって構成された容器上の空間、すなわち光散乱反射部材３の枠内に、透明シリコーン、透明エポキシ樹脂などの透明樹脂５を充填する。この後、加熱等によって透明樹脂５を硬化させる。このとき透明樹脂５の硬化温度は、光散乱反射部材３とシール材４の軟化点温度よりも低いものを用いる。   A plurality of light emitting elements 1 in which a blue light emitting diode, a green light emitting diode, and a red diode are mounted on a submount substrate are mounted on a metal substrate 2 with silver paste or solder. On the metal substrate 2 on which the light emitting element 1 is mounted, a light scattering reflection member 3 as a frame material made of white polycarbonate, ABS, ceramic or the like is placed. In order to join the metal substrate 2 and the light scattering reflection member 3, the sealing member 4 is applied to the inner wall surface of the light scattering reflection member 3 and the grounding surface of the metal substrate 2 over the entire circumference. At this time, the sealing member 4 uses white silicone or the like. After the sealing member 4 is cured by heat curing, UV curing, natural curing or the like, the space on the container constituted by the metal substrate 2, the light scattering reflection member 3 and the sealing material 4, that is, within the frame of the light scattering reflection member 3. Further, a transparent resin 5 such as transparent silicone or transparent epoxy resin is filled. Thereafter, the transparent resin 5 is cured by heating or the like. At this time, the curing temperature of the transparent resin 5 is lower than the softening point temperature of the light scattering reflection member 3 and the sealing material 4.

ここで用いる透明樹脂５は硬化前の粘性が低く、密閉性の高い容器状のものへの充填が好適である。密閉性が悪いものへの充填では、透明樹脂が漏れだしてしまうことが想定されるからである。上記構成とすることにより、透明樹脂の充填作業が容易となる。   The transparent resin 5 used here has a low viscosity before curing and is preferably filled into a container having a high sealing property. This is because it is assumed that the transparent resin leaks out when filling the one with poor sealing performance. By setting it as the said structure, the filling operation | work of transparent resin becomes easy.

このように本発明は、発光素子１を搭載する母材として金属基板２を用い、その上に、発光素子１の出射面での輝度均一性を持たせるために、複数の発光ダイオード１２〜１４の発光を拡散させるための光学機能を有した光散乱反射部材３を配置する。金属基板２と光散乱反射部材３の接合にはシール部材４を用いてシールする。光散乱反射部材３は枠形状を有し、金属基板２と合わせて容器を成し、光散乱反射部材３の枠内、すなわち容器内に透明樹脂５を充填し、硬化させる。以上のようして光源モジュール７は構成されるが、上記のとおり好適には、透明樹脂５の上にさらに、透明ガラス、ポリカーボネート、環状ポリオレフィンなどを材料とした光学部材６を取り付ける。   As described above, the present invention uses the metal substrate 2 as a base material on which the light emitting element 1 is mounted, and a plurality of light emitting diodes 12 to 14 in order to provide luminance uniformity on the emission surface of the light emitting element 1 thereon. A light scattering reflection member 3 having an optical function for diffusing the emitted light is disposed. A seal member 4 is used for sealing the metal substrate 2 and the light scattering reflection member 3. The light scattering reflection member 3 has a frame shape, forms a container together with the metal substrate 2, fills the frame of the light scattering reflection member 3, that is, the container, with the transparent resin 5, and cures. Although the light source module 7 is configured as described above, as described above, the optical member 6 made of transparent glass, polycarbonate, cyclic polyolefin, or the like is preferably attached on the transparent resin 5.

図４は、本発明の光源モジュールを用いた液晶表示装置の一例を示す図である。本図は、液晶表示装置のバックライトシステム部の分解図を示すもので、光源モジュール７、液晶パネル８、導光板９、光学シート１０、および光反射シート１１を備える。本液晶表示装置は、光源モジュール７の発光素子で発光した光が、導光板９を通して伝わり、光反射シート１１によって液晶パネル８の方向に反射され、光学シート１０を介して液晶パネル８を照らすように構成される。上述のように、光源モジュール７の透明樹脂５により、発光素子１の発光が効率よく導光板９へ伝えられる。これによりＬＥＤ光の高い光取り出し効率を得ることができる。また、光学部材６を配置することにより、光散乱反射部材３での混色性をさらに強化し、または導光板９への光の伝達性能をさらに向上することができる。これにより、発光効率のよい液晶表示装置を得ることができる。   FIG. 4 is a diagram showing an example of a liquid crystal display device using the light source module of the present invention. This figure shows an exploded view of a backlight system part of a liquid crystal display device, and includes a light source module 7, a liquid crystal panel 8, a light guide plate 9, an optical sheet 10, and a light reflecting sheet 11. In the present liquid crystal display device, light emitted from the light emitting element of the light source module 7 is transmitted through the light guide plate 9, reflected by the light reflecting sheet 11 toward the liquid crystal panel 8, and illuminates the liquid crystal panel 8 through the optical sheet 10. Configured. As described above, the light emission of the light emitting element 1 is efficiently transmitted to the light guide plate 9 by the transparent resin 5 of the light source module 7. Thereby, the high light extraction efficiency of LED light can be obtained. Further, by arranging the optical member 6, the color mixing property of the light scattering reflection member 3 can be further enhanced, or the light transmission performance to the light guide plate 9 can be further improved. Thereby, a liquid crystal display device with good luminous efficiency can be obtained.

本発明は、発光ダイオードを光源として用いた光源モジュール、光源モジュールの製造方法および液晶表示装置に関するものであり、産業上の利用可能性がある。   The present invention relates to a light source module using a light emitting diode as a light source, a method for manufacturing the light source module, and a liquid crystal display device, and has industrial applicability.

本発明に係る光源モジュールの一実施例を示す斜視図である。It is a perspective view which shows one Example of the light source module which concerns on this invention. 図１の光源モジュールに用いられる発光素子の構成例を示す図である。It is a figure which shows the structural example of the light emitting element used for the light source module of FIG. （ａ）〜（ｄ）は本発明に係る光源モジュールの製造方法の一例を示す図である。(A)-(d) is a figure which shows an example of the manufacturing method of the light source module which concerns on this invention. 本発明の光源モジュールを用いた液晶表示装置の一例を示す図である。It is a figure which shows an example of the liquid crystal display device using the light source module of this invention.

符号の説明Explanation of symbols

１…発光素子、２…金属基板、３…光散乱反射部材、４…シール材、５…透明樹脂、６…光学部材、７…光源モジュール、８…液晶パネル、９…導光板、１０…光学シート、１１…光反射シート、１２…青色発光ダイオード、１３…緑色発光ダイオード、１４…赤色発光ダイオード、１５…サブマウント基板 DESCRIPTION OF SYMBOLS 1 ... Light emitting element, 2 ... Metal substrate, 3 ... Light scattering reflection member, 4 ... Sealing material, 5 ... Transparent resin, 6 ... Optical member, 7 ... Light source module, 8 ... Liquid crystal panel, 9 ... Light guide plate, 10 ... Optical Sheet, 11 ... Light reflecting sheet, 12 ... Blue light emitting diode, 13 ... Green light emitting diode, 14 ... Red light emitting diode, 15 ... Submount substrate

Claims (9)

異なる色を発する複数の発光ダイオードを有する発光素子と、前記発光素子を搭載した金属基板と、前記発光素子を取り囲む枠として前記金属基板上に配置された光散乱反射部材と、前記光散乱反射部材と前記金属基板との間をシールするシール部材と、前記光散乱反射部材の枠内に充填された透明樹脂とを備えたことを特徴とする光源モジュール。   A light emitting element having a plurality of light emitting diodes emitting different colors, a metal substrate on which the light emitting element is mounted, a light scattering reflecting member disposed on the metal substrate as a frame surrounding the light emitting element, and the light scattering reflecting member A light source module comprising: a seal member that seals between the metal substrate and a transparent resin filled in a frame of the light scattering reflection member. 前記シール部材が光散乱反射機能を有することを特徴とする請求項１に記載の光源モジュール。   The light source module according to claim 1, wherein the seal member has a light scattering reflection function. 前記シール部材が弾性材料からなることを特徴とする請求項１または２に記載の光源モジュール。   The light source module according to claim 1, wherein the seal member is made of an elastic material. 前記透明樹脂が弾性材料からなることを特徴とする請求項１〜３のいずれかに記載の光源モジュール。   The light source module according to claim 1, wherein the transparent resin is made of an elastic material. 前記発光素子が赤色、青色および緑色をそれぞれ発する複数の発光ダイオードを有することを特徴とする請求項１〜４のいずれかに記載の光源モジュール。   The light source module according to claim 1, wherein the light emitting element includes a plurality of light emitting diodes that emit red, blue, and green, respectively. 前記透明樹脂上に透明材料で形成された光学部材を備えたことを特徴とする請求項１〜５のいずれかに記載の光源モジュール。   The light source module according to claim 1, further comprising an optical member formed of a transparent material on the transparent resin. 金属基板上に異なる色を発する複数の発光ダイオードを有する発光素子を搭載する工程と、前記発光素子を取り囲む枠として前記金属基板上に光散乱反射部材を配置する工程と、前記光散乱反射部材と前記金属基板との間をシール部材でシールする工程と、前記光散乱反射部材の枠内に透明樹脂を充填する工程とを備えたことを特徴とする光源モジュールの製造方法。   Mounting a light-emitting element having a plurality of light-emitting diodes emitting different colors on a metal substrate, disposing a light-scattering / reflecting member on the metal substrate as a frame surrounding the light-emitting element, and the light-scattering / reflecting member; A method of manufacturing a light source module, comprising: a step of sealing between the metal substrate with a sealing member; and a step of filling a transparent resin in a frame of the light scattering reflection member. 前記透明樹脂の硬化温度が、前記光散乱反射部材の軟化点温度よりも低いことを特徴とする請求項７に記載の光源モジュールの製造方法。   The method for manufacturing a light source module according to claim 7, wherein a curing temperature of the transparent resin is lower than a softening point temperature of the light scattering reflection member. 請求項１〜６のいずれかに記載の光源モジュールと、前記光源モジュールから入射した光を導く導光板と、前記導光板の一方の面に対向して設けられた光反射シートと、前記導光板の他方の面に対向して設けられた液晶パネルとを備えたことを特徴とする液晶表示装置。   The light source module according to claim 1, a light guide plate that guides light incident from the light source module, a light reflection sheet provided to face one surface of the light guide plate, and the light guide plate And a liquid crystal panel provided opposite to the other surface of the liquid crystal display device.
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008084989A (en) * 2006-09-26 2008-04-10 Matsushita Electric Works Ltd Light-emitting apparatus and illumination appliance
WO2011096246A1 (en) * 2010-02-02 2011-08-11 シャープ株式会社 Lighting device, display device, and television reception device

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001345485A (en) * 2000-06-02 2001-12-14 Toyoda Gosei Co Ltd Light emitting device
JP2003190184A (en) * 2001-12-28 2003-07-08 Morita Mfg Co Ltd Medical photopolymerizer
JP2005136379A (en) * 2003-10-08 2005-05-26 Nichia Chem Ind Ltd Semiconductor device
JP2005268503A (en) * 2004-03-18 2005-09-29 Toshiba Corp Manufacturing method of optical semiconductor device and manufacturing method and apparatus of jig for molding package
JP2006501503A (en) * 2002-09-30 2006-01-12 シーメンス　アクチエンゲゼルシヤフト Apparatus for generating a focused light beam
JP2006501657A (en) * 2002-09-30 2006-01-12 オスラム　オプト　セミコンダクターズ　ゲゼルシャフト　ミット　ベシュレンクテル　ハフツング Light source module and method for manufacturing the light source module

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001345485A (en) * 2000-06-02 2001-12-14 Toyoda Gosei Co Ltd Light emitting device
JP2003190184A (en) * 2001-12-28 2003-07-08 Morita Mfg Co Ltd Medical photopolymerizer
JP2006501503A (en) * 2002-09-30 2006-01-12 シーメンス　アクチエンゲゼルシヤフト Apparatus for generating a focused light beam
JP2006501657A (en) * 2002-09-30 2006-01-12 オスラム　オプト　セミコンダクターズ　ゲゼルシャフト　ミット　ベシュレンクテル　ハフツング Light source module and method for manufacturing the light source module
JP2005136379A (en) * 2003-10-08 2005-05-26 Nichia Chem Ind Ltd Semiconductor device
JP2005268503A (en) * 2004-03-18 2005-09-29 Toshiba Corp Manufacturing method of optical semiconductor device and manufacturing method and apparatus of jig for molding package

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008084989A (en) * 2006-09-26 2008-04-10 Matsushita Electric Works Ltd Light-emitting apparatus and illumination appliance
WO2011096246A1 (en) * 2010-02-02 2011-08-11 シャープ株式会社 Lighting device, display device, and television reception device
CN102741608A (en) * 2010-02-02 2012-10-17 夏普株式会社 Lighting device, display device, and television reception device
JP5331214B2 (en) * 2010-02-02 2013-10-30 シャープ株式会社 Lighting device, display device, and television receiver
US8870401B2 (en) 2010-02-02 2014-10-28 Sharp Kabushiki Kaisha Lighting device, display device and television receiver

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