JP2007324181A - Prober and probing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To achieve a prober and a probing method capable of detecting a change in the contact pressure of a probe easily at low cost and capable of maintaining the contact pressure within a prescribed range. <P>SOLUTION: The prober connects each terminal of a tester to the electrode of an electronic device for inspecting the electronic device on a wafer W with the tester. The prober comprises: a probe card 25 having a probe 26 in contact with an electrode; a stage 18; moving mechanisms 12-17 for moving the stage; a travel control section 27; and alignment mechanisms 19, 23 for detecting the relative positions of the electrode and the probe. The prober also comprises: motor current measurement sections 62, 65 for measuring the current value of the drive motor of at least one moving shaft; and current-load operation sections 63, 66 for computing a load applied to at least one moving shaft from a motor current value when control is made to maintain a travel position. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a prober and a probing method for connecting an electrode of an electronic device to a tester in order to perform electrical inspection of a plurality of electronic devices such as a semiconductor chip (die) formed on a substrate such as a semiconductor wafer and MEMS. . Hereinafter, a case where an electronic device (semiconductor chip) formed on a semiconductor wafer is inspected will be described as an example. However, the present invention is not limited to this, and the MEMS or glass substrate formed on the substrate is not limited thereto. The present invention can also be applied to a prober and a probing method for performing electrical inspection of an electronic device or the like on the formed liquid crystal panel.

  In the semiconductor manufacturing process, various processes are performed on a thin disk-shaped semiconductor wafer to form a plurality of chips (dies) each having an electronic device. Each chip is inspected for electrical characteristics, then separated by a dicer, and then fixed to a lead frame and assembled. The inspection of the electrical characteristics is performed using a prober and a tester. The prober fixes the wafer to the stage and brings the probe into contact with the electrode pad of each chip. The tester supplies power and various test signals from the terminals connected to the probe, and analyzes the signals output to the electrodes of the chip with the tester to check whether it operates normally.

  Electronic devices are used in a wide range of applications and are used in a wide temperature range. Therefore, when inspecting an electronic device, it is necessary to inspect at room temperature (room temperature), a high temperature such as 200 ° C., and a low temperature such as −55 ° C. It is required that the inspection can be performed. Therefore, a wafer temperature adjustment mechanism that changes the temperature of the surface of the stage, such as a heater mechanism, a chiller mechanism, or a heat pump mechanism, is provided below the wafer mounting surface of the stage that holds the wafer in the prober, and is held on the stage. The heated wafer is heated or cooled.

  FIG. 1 is a diagram showing a schematic configuration of a wafer test system including a prober having a wafer temperature adjusting mechanism. As shown, the prober 10 includes a base 11, a moving base 12, a Y-axis moving unit 13, an X-axis moving unit 14, a Z-axis moving unit 15, and a Z-axis moving table provided thereon. 16, θ rotation unit 17, stage 18, needle alignment camera 19 for detecting the position of the probe, support columns 20 and 21, head stage 22, and wafer alignment camera 23 provided on a support column (not shown). A card holder 24 provided on the head stage 22, a probe card 25 attached to the card holder 24, and a stage movement control unit 27. The probe card 25 is provided with a probe 26 such as a cantilever or a spring pin. The movement base 12, the Y-axis movement unit 13, the X-axis movement unit 14, the Z-axis movement unit 15, the Z-axis movement table 16, and the θ rotation unit 17 move the stage 18 around the three axes and around the Z axis. The moving / rotating mechanism is configured to rotate and is controlled by the stage movement control unit 27. Since the moving / rotating mechanism is widely known, the description thereof is omitted here. The probe card 25 has a probe 26 arranged according to the electrode arrangement of the device to be inspected, and is exchanged according to the device to be inspected.

  In the stage 18, a heater / cooling liquid path 28 is provided to make the stage 18 hot or cold. The temperature control unit 29 controls the electric power supplied to the heater of the heater / cooling liquid path 28 and the temperature of the cooling liquid circulated in the cooling liquid path. Thereby, the stage 18 can be set to a desired temperature between high temperature and low temperature, and the wafer W held on the stage 18 can be inspected at a desired temperature accordingly. The temperature control unit 29 performs control based on the temperature detected by a temperature sensor (not shown) provided near the surface of the stage 18.

  The tester 30 includes a tester body 31 and a contact ring 32 provided on the tester body 31. The probe card 25 is provided with a terminal connected to each probe, and the contact ring 32 has a spring probe arranged so as to contact the terminal. The tester body 31 is held with respect to the prober 10 by a support mechanism (not shown).

  When the inspection is performed, the Z-axis moving table 16 is moved so that the needle alignment camera 19 is positioned below the probe 26, and the tip position of the probe 26 is detected by the needle alignment camera 19. The detection of the tip position of the probe 26 must be performed whenever the probe card is replaced, and is appropriately performed every time a predetermined number of chips are measured even when the probe card is not replaced. Next, with the wafer W to be inspected held on the stage 18, the Z-axis moving table 16 is moved so that the wafer W is positioned under the wafer alignment camera 23, and the electrode pads of the semiconductor chips on the wafer W are moved. Detect position. It is not necessary to detect the positions of all the electrode pads of one chip, and the positions of several electrode pads may be detected. Further, it is not necessary to detect the electrode pads of all the chips on the wafer W, and the positions of the electrode pads of several chips are detected.

  FIG. 2 is a diagram for explaining the operation of bringing the electrode pad into contact with the probe 26. After detecting the position of the probe 26 and the position of the wafer W, the stage 18 is rotated by the θ rotation unit 17 so that the arrangement direction of the electrode pads of the chip matches the arrangement direction of the probe 26. Then, after moving so that the electrode pad of the chip to be inspected on the wafer W is positioned below the probe 26, the stage 18 is raised and the electrode pad is brought into contact with the probe 26.

  The probe 26 has a spring characteristic and contacts the electrode with a predetermined contact pressure by raising the contact point from the tip position of the probe. In consideration of the inclination of the wafer W and the arrangement surface of the tip of the probe 26 and the variation in the tip position of the probe 26, the electrode pad is positioned up to a position higher than the tip position of the probe 26 so that the electrode pad and the probe 26 are in reliable contact The surface of the pad, that is, the wafer W is raised. This is referred to as overdrive, and the amount of movement that further raises the surface of the wafer W from the detected tip position of the probe 26 is referred to as overdrive amount. Accordingly, if all the probes are in contact with the wafer electrode at a predetermined contact pressure, a contact pressure obtained by multiplying the contact pressure of one probe by the number of probes is applied to the entire stage 18. In recent years, in order to improve throughput, multi-probing processing for inspecting a plurality of dies simultaneously has been performed, and the number of probes may be several thousand. In such a case, the probe card 25 and A very large contact pressure is applied to the stage 18 as a whole.

  The variation of the probe tip position is set to be within a predetermined range, which is confirmed by the needle alignment camera 19, and the probe card is repaired when there is a probe whose tip position is outside the predetermined range. . As described above, since the tip position of the probe is within the predetermined range, when the electrode of the semiconductor chip is brought into contact with the probe as described above, the wafer is further lifted from the contact position by the amount of overdrive, thereby It has been considered that the contact pressure with the electrode falls within a predetermined range.

  However, with the miniaturization and high integration of semiconductor devices, the film thickness of the electrode portion tends to decrease, and the allowable range of contact pressure is also reduced. In particular, when performing inspections at high or low temperatures, the temperature of each part changes, causing an error in the moving amount of the moving mechanism, etc., and the probe 26 contacts the electrode with a contact pressure within a predetermined range only by overdriving. The problem of not being possible.

  In addition, there is also a problem that the stage is tilted but tilted to cause an error in the contact position due to the contact of the probe. This problem causes non-negligible errors as the number of probes increases.

  Therefore, Patent Document 1 describes that the load on the stage of the probe card is calculated from the amount of overdrive, and the moving position is corrected when the stage is tilted by the load. However, the load is calculated from the amount of overdrive, and considering various fluctuations, there is a problem that it is difficult to accurately calculate the load, that is, the contact pressure of the probe.

  Further, Patent Document 2 describes that at least one of the temperature of the probe card and the contact pressure of the probe card is detected and the position of the stage is corrected based on the detected value. The pressure is detected using a pressure sensor.

  Further, in Patent Document 3, a pressure sensor for measuring a load is provided on the stage, and the load generated by the contact between the probe and the wafer is measured to control the overdrive amount, in other words, the contact pressure with respect to the electrode of the entire probe. Is made constant.

  Further, Patent Document 4 provides a linear encoder that detects the position of the stage, and calculates the contact pressure by calculating the amount of sinking due to contact of the probe with the wafer from the difference between the overdrive amount and the actual displacement amount. It is described.

Japanese Patent Laid-Open No. 11-30651 JP-A-11-176893 JP2001-110857 JP 2001-228212 A

  Patent Document 2 detects the pressure generated in the probe card by the contact of the probe with the wafer by the pressure sensor provided in the probe card, and there is a problem that the cost increases because the pressure sensor is provided. In particular, since the pressure generated in the probe card varies depending on the position, pressure sensors are provided at a plurality of locations, which greatly increases the cost.

  Patent Document 3 also uses a pressure sensor, and there is a problem that the cost increases because the pressure sensor is provided. In particular, the stage needs to be rigid so that it does not tilt even if the probe comes into contact. However, in Patent Document 3, a pressure sensor is provided in a portion that supports the stage, and the pressure sensor measures the load while maintaining the rigidity of the stage. Is difficult, and there is a problem that the installation mechanism of the pressure sensor is complicated and expensive.

  Since Patent Document 4 calculates the contact pressure from the position of the stage detected by the linear encoder and does not detect a physical quantity directly related to the contact pressure, the contact pressure is increased when the measurement movement error increases. Causes a problem that cannot be detected accurately.

  Furthermore, although Patent Documents 2 and 3 are concerned only with the pressure in the direction perpendicular to the wafer mounting surface of the stage, that is, the Z-axis direction, depending on the probe shape and arrangement, only the Z-axis direction with respect to the stage is used. In addition, force may be applied in other axial directions and rotational directions, and the relative position of the probe and the electrode may change. In order to be able to measure in directions other than the Z-axis direction, it is necessary to provide more pressure sensors, resulting in further cost increase.

  The present invention solves such a problem, and makes it possible to easily detect a change in pressure that causes a change in the contact pressure and relative position of the probe to the wafer at low cost, and to reduce the contact pressure of the probe on the wafer. An object is to realize a prober and a probing method that can be maintained within a predetermined range.

  In order to achieve the above object, the prober and probing method of the present invention detects the current value of the drive motor in each of the Z, X, Y, and θ directions when the stage moving position is maintained by the stage moving mechanism. Thus, the load in each axial direction is detected.

  That is, the prober of the present invention is a prober for connecting each terminal of the tester to the electrode of the electronic device in order to inspect the electronic device on the substrate with a tester, and is in contact with the electrode of the electronic device. A probe card having a probe for connecting the electrode to a terminal of the tester, a stage for holding a substrate, a moving mechanism for moving the stage, a movement control unit for controlling the moving mechanism, and the probe of the probe card An alignment mechanism that detects the relative position between the electrode of the electronic device and the probe by performing an alignment operation of detecting the position of the electrode of the electronic device on the substrate held on the stage. The movement control unit inspects based on the relative position detected by the alignment mechanism In a prober that controls the movement mechanism so that the electrode of a child device contacts the probe, a motor current measurement unit that measures a current value of a drive motor of at least one movement axis of the movement mechanism, and the movement control unit includes: A current-load for calculating a load applied to the at least one moving axis of the moving mechanism from a current value measured by the motor current measuring unit when the moving position of the at least one moving axis is controlled to be maintained. And an arithmetic unit.

  Further, in the probing method of the present invention, in order to inspect an electronic device on a substrate with a tester, the substrate is provided on a probe card of a prober and probes connected to the terminals of the tester are held on the stage. A probing method for contacting an electrode of an upper electronic device, comprising: an alignment operation for detecting the position of the probe of the probe card and detecting the position of the electrode of the electronic device on the substrate held on the stage In the probing method, the relative position between the electrode of the electronic device and the probe is detected, and the electrode of the electronic device to be inspected is moved to contact the probe based on the detected relative position. The moving position of the drive motor of at least one moving shaft of the moving mechanism to be moved The current value of the drive motor when controlled to lifting was measured, from the measured current value, and calculates the load applied to said at least one moving axis of the moving mechanism.

  According to the present invention, the load on each moving shaft can be measured by a low-cost motor current measuring unit.

  The movement control unit controls the movement of the stage by the movement mechanism so that the load calculated by the current-load calculation unit is within a predetermined range.

  In the present invention, a motor capable of measuring a load with a current value is used as a drive motor. As such a motor, for example, a linear motor, a DC servo motor, an AC servo motor, or the like can be used.

  Since the contact pressure due to the contact between the probe and the substrate is mainly generated in the Z-axis direction perpendicular to the stage mounting surface, the load of the drive motor in the Z-axis direction of the stage moving mechanism is measured at least, but the other X-axis directions The drive motors in the Y axis direction and the θ rotation direction are also measured as necessary.

  Control to make the calculated load within a predetermined range is performed in a state where the electrode of the electronic device is in contact with the probe or in a state where the electrode is separated from the probe. These two methods can be performed for the Z-axis direction and other directions, but the electrode is in contact with the probe for the Z-axis direction, and the electrode is separated from the probe for directions other than the Z-axis. It is desirable to do.

  In the case of a prober provided with a stage temperature adjusting mechanism for increasing or decreasing the temperature of the stage, the movement error of the moving mechanism increases with an increase in the temperature change amount. Therefore, it is effective to apply the present invention.

  According to the present invention, a prober and a probing method capable of reliably contacting the probe and the electrode on the substrate can be realized at low cost.

  The prober according to the embodiment of the present invention is used in the wafer test system shown in FIG.

  FIG. 3 is a diagram illustrating a configuration of a portion related to the stage 18 of the prober of the embodiment and its moving mechanism. As shown in FIG. 3, a probe 26 is provided on a probe card 25 held by a card holder (not shown) so as to face a wafer W held on a stage 18. As shown in FIG. 1, the stage 18 is provided with a heater / cooling liquid passage 28, but the illustration is omitted. The stage 18 is supported by the θ rotation unit 17 and is rotatable around the Z axis. The θ rotation unit 17 and the needle alignment camera 19 are supported by the Z-axis moving table 16 and can be moved in the Z-axis direction (vertical direction) by the Z-axis moving unit 15.

  The Z-axis moving unit 15 is attached to a sliding member 41 supported so as to be slidable in the Z-axis direction with respect to the sliding base 42 provided on the X-axis moving table 47. A ball screw nut 44 is attached to the bottom plate 43 of the sliding member 41. The ball screw 45 is supported by a bearing (not shown) of the Z-axis moving table 16 and a bearing 46 of the X-axis moving table 47 and is rotated by a Z-axis motor 48 provided on the X-axis moving table 47. When the ball screw 45 rotates, the Z-axis moving table 16 moves in the Z-axis direction according to the rotation direction.

  In the X-axis moving unit 14, two side plates 50 and a sliding base 51 are provided on the Y moving table 58. The sliding member 52 provided below the X-axis moving table 47 is supported so as to be slidable in the X-axis direction with respect to the sliding base 51, and the X-axis moving table 47 is movable in the X-axis direction. . Ball screws 55 are supported on bearings 56 (only one shown) of the two side plates 50 and are rotated by an X-axis motor 57 provided on the side plates 50. A support plate 53 is provided below the X-axis moving table 47, and a nut portion 54 of a ball screw 55 is attached to the support plate 53. When the ball screw 55 rotates, the X-axis moving table 47 moves in the X-axis direction according to the rotation direction.

  Furthermore, a Z-axis motor drive unit 61 that drives the Z-axis motor 48 and an X-axis motor drive unit 64 that drives the X-axis motor 57 are provided.

  Here, only the Z-axis moving mechanism and the X-axis moving mechanism are shown, but the Y-axis moving unit 13 is also provided with a similar mechanism, and the θ rotating unit 17 is provided with a stage 18 around the Z-axis by a motor. A rotating mechanism is provided, and a drive unit for driving each drive motor is provided. The above configuration is the same as the conventional example.

  In this embodiment, the drive motors 48 and 57 are linear motors. In the linear motor, since the motor load corresponds to the current value, that is, the torque and the current value, the motor load can be measured by measuring the current value. As described above, a motor corresponding to a torque and a current value, for example, a DC servo motor or an AC servo motor can be used instead of the linear motor. Therefore, a stepping motor whose torque and current value do not correspond cannot be used.

  Each drive motor is provided with an encoder so that the amount of rotation can be controlled. Further, a linear scale is provided for each of the X axis, the Y axis, and the Z axis, and the position can be controlled by reading the value of the linear scale. Note that the rotation amount of the θ rotation axis can be controlled by providing a scale for detecting the rotation amount.

  In this embodiment, there is provided a calculation unit that measures the currents of the drive motors of the Z axis, the X axis, the Y axis, and the θ rotation axis, and calculates a load from the measured values. As shown in FIG. 3, a Z-axis current measurement unit 62 that measures the current of the drive signal of the Z-axis motor 48 in the Z-axis motor drive unit 61, a current-load calculation unit 63 that calculates a load from the measured current, An X-axis current measurement unit 65 that measures the current of the drive signal of the X-axis motor 57 in the X-axis motor drive unit 64 and a current-load calculation unit 66 that calculates a load from the measured current are provided. The Z-axis and X-axis load data calculated by the current-load calculation units 63 and 66 are sent to the stage movement control unit 27. Although only the portion for calculating the loads on the Z axis and the X axis is shown here, a current measuring unit and a current-load calculating unit are also provided for the Y axis and the θ rotation axis.

  FIG. 4 is a flowchart showing a control operation in the prober of the embodiment for bringing the electrode of the semiconductor chip to be inspected on the wafer into contact with the probe and maintaining the contact state during the inspection.

  In step 101, the stage is moved so that the electrodes are positioned under the probe by controlling the X-axis, Y-axis, and θ rotation movement mechanisms based on the results of the probe position detection process and the alignment process. The movement amount is controlled using an encoder and a linear scale.

  In step 102, the X-axis, Y-axis, and θ-rotation drive motors are switched to the holding mode. In the holding mode, an operation for maintaining the moved position is performed, and the linear scale or the like is monitored, and control is performed so that the moved position, that is, the scale value does not change.

  In step 103, the Z-axis drive motor is controlled to move the stage so that a predetermined overdrive amount is obtained.

  In step 104, the Z-axis drive motor is switched to the holding mode. As described above, the stage is moved in the Z-axis direction so as to have a predetermined overdrive amount, and the probe is bent in contact with the electrode, so that contact pressure is generated.

  In step 105, the current value of the Z-axis drive motor is measured.

  In step 106, the Z-axis load is calculated from the measured current value. The Z-axis load calculated here corresponds to the contact pressure with the electrode of the probe.

  In step 107, it is determined whether the calculated load is within a predetermined range set in advance.

  If it is out of range, the process proceeds to step 108. Thereafter, while the probe is in contact with the electrode, the control is switched to feedback control so that the calculated load falls within a predetermined range, not the control for maintaining the scale value in the Z-axis direction.

  In step 108, it is determined in which direction the load should be moved so that the load of the Z-axis drive motor is within a predetermined range. In other words, the stage is raised when the load is small, and the stage is lowered when the load is large.

  In step 109, the unit moves by the unit movement amount of the encoder or scale in the Z-axis direction, and the process returns to step 105.

  The above steps 105 to 109 are repeated so that the calculated Z-axis load falls within a predetermined range. If it is determined that the Z-axis load calculated in step 107 is within the predetermined range, the process proceeds to step 110.

  In step 110, the current values of the X-axis, Y-axis, and θ-rotation drive motors are measured.

  In step 111, the X-axis, Y-axis, and θ rotation loads are calculated from the measured current values.

  In step 112, it is determined whether the calculated load is within a predetermined range set in advance. If the X axis, Y axis, and θ rotation loads are all within the range, the process returns to step 105. And the test | inspection with respect to the semiconductor chip which contacted the probe is started. If one of the X-axis, Y-axis, and θ rotation loads is out of range, the process proceeds to step 113. After step 113, the load is performed only for the out-of-range axes, and when there are a plurality of such axes, the processes are performed in order.

  In step 113, it is determined in which direction the X axis, Y axis, and θ rotation load should be moved so as to be within a predetermined range.

  In step 114, the value of the scale for position control is changed (stored) by changing the unit amount in the above direction.

  In step 115, the scale value is changed so as to become the value of the scale.

  In step 116, the mode is switched to the holding mode, and the process returns to step 110.

  Then, Steps 110 to 116 are repeated so that the X-axis, Y-axis, and θ rotation loads are within a predetermined range. If it is determined in step 112 that the X-axis, Y-axis, and θ rotation loads are within the predetermined ranges, the process returns to step 105. Then, the inspection of the semiconductor chip with which the probe is brought into contact is started, and steps 105 to 116 are repeated during the inspection. Thereby, even if each part expands and contracts due to a temperature change or the like during the inspection, a desired state is maintained.

  When the inspection is completed and another semiconductor chip is inspected, the stage is lowered in the Z-axis direction to separate the probe from the electrode, and then the same operation is performed from Step 101.

  In the flowchart of FIG. 4, if at least one of the calculated X-axis, Y-axis, and θ rotation loads is outside the predetermined range in step 112, the X-axis, Y-axis is left as it is, that is, the probe is in contact with the electrode. Movement in the direction of the axis and θ rotation is performed. This movement is a minute movement amount that is a unit amount of the scale. In most cases, the X-axis, Y-axis, and θ rotation loads all fall within the specified range just by moving the minute amount, so the probe contacts the electrode. There is almost no problem even if it moves in the state. However, if the probe moves while being in contact with the electrode, the probe rubs against the electrode surface, which may generate dust. A modification of the control operation that prevents the occurrence of such a problem will be described with reference to the flowchart of FIG.

  The flowchart of FIG. 5 proceeds to step 121 when it is determined in step 112 that the X axis, Y axis, and θ rotation loads are outside the predetermined ranges.

  Steps 121 and 122 are the same as steps 113 and 114.

  In step 123, the probe is moved in the Z-axis direction, that is, the stage is lowered so that the electrode and the electrode are not in contact with each other.

  In step 124, movement is performed according to the stored scale values for the X axis, Y axis, and θ rotation axis, and the process returns to step 103. Then, the stage is raised so that the electrode again comes into contact with the probe, and the operation after step 103 is performed. Here, steps 121 to 124 are performed before the inspection is started, and after the inspection is started, when it is determined in step 107 that the load on the Z-axis is within the predetermined range, the process returns to step 105, and after step 110 It is desirable not to do this. As a result, the probe and the electrode are not in contact with each other during the inspection, and the inspection is not interrupted.

  As mentioned above, although the Example of this invention was described, it cannot be overemphasized that various modifications are possible. For example, when it is determined in step 107 that the load on the Z axis is within a predetermined range, the control returns to step 105 to perform feedback control only for the load in the Z axis direction, and the X axis, Y axis, and θ rotation axis. For the above, only position control using a scale based on alignment processing may be performed.

  The present invention is applicable to any prober as long as it is a prober.

It is a figure which shows the basic composition of the system which test | inspects the chip | tip on a wafer with a prober and a tester. It is a figure explaining the operation | movement which makes an electrode pad contact a probe. It is a figure which shows the structure of the part relevant to the stage of the prober of the Example of this invention, and its moving mechanism. 6 is a flowchart showing a control operation in which the probe of the embodiment brings the electrode of the semiconductor chip into contact with the probe and maintains the contact state during the inspection. It is a flowchart which shows the modification of the control action of FIG.

Explanation of symbols

13 Y-axis moving unit 14 X-axis moving unit 15 Z-axis moving unit 16 Z-axis moving table 17 θ rotating unit 18 Stage 19 Needle alignment camera 23 Wafer alignment camera 25 Probe card 26 Probe 27 Stage movement control unit 48 Z-axis motor 57 X-axis motor 61 Z-axis motor drive unit 62 Z-axis current measurement unit 63, 66 Current-load calculation unit 64 X-axis motor drive unit 65 X-axis current measurement unit W Wafer

Claims (10)

A prober for connecting each terminal of the tester to an electrode of the electronic device in order to inspect the electronic device on the substrate with a tester,
A probe card having a probe that contacts the electrode of the electronic device and connects the electrode to a terminal of the tester;
A stage for holding a substrate;
A moving mechanism for moving the stage;
A movement control unit for controlling the movement mechanism;
The position of the probe on the probe card is detected, and an alignment operation for detecting the position of the electrode of the electronic device on the substrate held on the stage is performed to detect the relative position of the electrode of the electronic device and the probe An alignment mechanism
The movement control unit is a prober that controls the movement mechanism to bring the electrode of the electronic device to be inspected into contact with the probe, based on the relative position detected by the alignment mechanism.
A motor current measuring unit for measuring a current value of a driving motor of at least one moving shaft of the moving mechanism;
The load applied to the at least one moving shaft of the moving mechanism is determined from the current value measured by the motor current measuring unit when the movement control unit controls the moving position of the at least one moving shaft to be maintained. A prober comprising: a current-load calculation unit for calculation.   The prober according to claim 1, wherein the movement control unit controls the movement of the stage by the movement mechanism so that the load calculated by the current-load calculation unit is within a predetermined range.   The prober according to claim 2, wherein the drive motor is any one of a linear motor, a DC servo motor, and an AC servo motor.   The prober according to claim 2, wherein the direction of the at least one movement axis includes a Z-axis direction perpendicular to the substrate holding surface of the stage.   The prober according to claim 4, wherein the direction of the at least one movement axis includes a direction other than the Z-axis direction.   6. The prober according to claim 4, wherein the drive motor is controlled by the movement control unit so that the calculated load falls within a predetermined range while the electrode of the electronic device is in contact with the probe.   The movement so that the calculated load in the Z-axis direction is within a predetermined range is performed in a state where the electrode of the electronic device is in contact with the probe, and the calculated load in a direction other than the Z-axis is predetermined. The prober according to claim 5, wherein the movement to be within the range is performed in a state where the electrode of the electronic device does not contact the probe.   The prober according to any one of claims 1 to 7, further comprising a stage temperature adjusting mechanism for setting the temperature of the stage to a predetermined temperature. In order to inspect an electronic device on a substrate with a tester, a probe provided on a probe card of a prober and connected to each terminal of the tester is brought into contact with an electrode of the electronic device on the substrate held on the stage. A probing method,
The position of the probe on the probe card is detected, and an alignment operation for detecting the position of the electrode of the electronic device on the substrate held on the stage is performed to detect the relative position of the electrode of the electronic device and the probe And
In the probing method of moving the electrode of the electronic device to be inspected so as to contact the probe based on the detected relative position,
Measuring the current value of the drive motor when the drive motor of at least one moving shaft of the moving mechanism for moving the stage is controlled to maintain the moving position;
A probing method comprising: calculating a load applied to the at least one moving shaft of the moving mechanism from a measured current value.   The probing method according to claim 9, wherein the movement of the stage by the moving mechanism is controlled so that the calculated load falls within a predetermined range.

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