JP2007318035A - Multiple-formed wiring substrate, package for holding electronic component, and electronic device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a multiple-formed wiring substrate where the careless fragile of a mother substrate can be prevented by a hole formed at an edge of a dividing groove, and can be favorably divided along an extension line of the dividing groove, when dividing the mother substrate to a tanzaku (an oblong card for writing a poem) like mother substrate. <P>SOLUTION: The multiple-formed wiring substrate includes a dividing groove 102 which is formed on at least one main surface of a plane-sheet-like mother substrate 101, so that the mother substrate is divided into a plurality of segments and the edge is positioned inside the circumference of the mother substrate; a first hole 103 which is formed between the edge of the dividing groove 102 and the circumference of the mother substrate 101 communicating with the dividing groove 102; and a second hole 104 which is formed between the first hole 103 and the circumference of the mother substrate 101 in an area on the extension line of the dividing groove 102. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention provides a multi-piece wiring board in which a plurality of wiring board regions, each of which is a wiring board for accommodating electronic components, are arranged vertically and horizontally in the central portion of the ceramic mother board, and is divided into wiring board regions. The present invention relates to an electronic component storage package separated into individual pieces and an electronic device on which the electronic component is mounted.

  2. Description of the Related Art Conventionally, wiring boards (electronic component storage packages) for mounting electronic components such as semiconductor elements and crystal resonators are made of tungsten on the surface of an insulating base made of an electrically insulating material such as an aluminum oxide sintered body. It is formed by disposing a wiring conductor made of metal powder metallization such as molybdenum.

  An electronic component is mounted on the upper surface of the wiring board, and after each electrode of the electronic component is electrically connected to the wiring conductor via an electrical connection means such as solder or a bonding wire, the electronic component Is covered with a lid made of metal or ceramics or potting resin and hermetically sealed to produce an electronic device.

  By the way, with the recent demand for downsizing of electronic devices, such wiring boards have become extremely small with a size of several mm square or less. In order to make such a small wiring board easy to handle and to improve the efficiency of manufacturing a wiring board and an electronic device using the wiring board, a large number of wiring boards that become wiring boards are used. It is manufactured in the form of a so-called multi-cavity wiring board in which the regions are arranged vertically and horizontally in the center of a large-area mother board.

  In such a multi-cavity wiring board, for example, a plurality of wiring board regions each having wiring conductors are vertically and horizontally arranged at the center of a substantially square flat-plate mother board, and at least one of the mother boards Divided grooves that divide each wiring board region are formed vertically and horizontally on this surface. Then, before or after the electronic components are mounted on each wiring board area, the mother board is bent along the dividing grooves and divided into wiring board areas, so that a large number of wiring boards and electronic devices can be obtained. Are manufactured simultaneously and intensively.

  Such a multi-piece wiring board is prepared by, for example, preparing a ceramic green sheet for a mother board, printing a metallized paste for a wiring conductor on the ceramic green sheet, and, if necessary, a plurality of ceramic green sheets. After the sheets are laminated, a cut for a dividing groove is made on at least one surface by a cutting blade such as a cutter blade or a mold, and the sheet is fired at a high temperature.

  However, when a force is applied from the outside to the mother board during transportation or mounting of electronic components, the force concentrates on the edge of the dividing groove and inadvertently breaks into the mother board starting from the corner. Had the problem that may occur.

  In view of this, as a countermeasure against such an unintentional crack of the mother substrate, a method has been proposed in which a hole deeper than the dividing groove is formed at a position overlapping the end of the dividing groove (see Patent Document 1). As a result, when an external force is applied to the mother board during transport or electronic component mounting, the force is well dispersed in the holes. It is possible to suppress the occurrence of cracks.

Moreover, such a multi-piece wiring board is performed by, for example, an automatic dividing apparatus as described in Patent Document 2. The automatic dividing device transfers the mother board mounted on the conveyor belt by an arbitrary distance according to the size of the wiring board area, and applies a predetermined pressure to a predetermined position of the mother board across the dividing groove. To divide the mother board into strip-shaped mother boards arranged in a line along the dividing groove, and further divide the strip-like mother board along the dividing grooves into each wiring board region. can do.
JP 2003-273274 A JP 2002-166398 A

  However, in such a conventional mother board, even if an attempt is made to divide the mother board by bending along the dividing grooves to obtain a strip-like mother board, each of which is a starting point at the time of division. The progress direction of cracks varies, and the progressed cracks deviate from the extension line of the dividing groove, and the shape of the divided strip-shaped mother substrate is, for example, a shape in which a part of the strip shape is missing, or a strip-shaped mother substrate. Or a part of the projecting shape.

  In the case of a shape having a protruding portion on the strip-shaped mother substrate, even if an attempt is made to supply the strip-shaped mother substrate to the automatic dividing device by transferring the groove in the automatic dividing device, the strip-shaped mother substrate does not enter the groove. There is a problem in that it does not exist or is caught on the inner wall of the groove and is supplied to the dividing device at an angle. If the strip-shaped mother board is supplied obliquely to the dividing device, it is impossible to apply a predetermined pressure to the strip-shaped mother board, and there is a problem that burrs and chips are likely to occur on each divided wiring board. It was.

  In addition, in order to make it easy to split the mother board along the extension line of the dividing groove, when a hole communicating with the dividing groove is formed near the outer periphery of the mother board, when carrying or mounting electronic components, A force is applied, a crack is generated between the hole and the outer periphery of the mother substrate, and the dividing groove and the outer periphery of the mother substrate communicate with each other, which may cause the mother substrate to be carelessly cracked.

  The present invention has been devised in view of the above-mentioned problems of the prior art, and its purpose is to prevent inadvertent cracking of the mother board by the holes formed at the ends of the dividing grooves and to make the mother board a strip. It is an object of the present invention to provide a multi-piece wiring substrate that can be favorably divided along an extended line of a dividing groove when dividing the substrate into a shaped mother substrate.

  The multi-cavity wiring board of the present invention is configured such that the mother board is divided into a plurality of sections on at least one main surface of the flat mother board, and the end portion is located inside the outer periphery of the mother board. Between the formed dividing groove, an end of the dividing groove, and the outer periphery of the mother substrate, the dividing groove is formed to communicate with the dividing groove, and is wider than the dividing groove and deeper than the dividing groove. A deep hole, and a second hole formed between the first hole and the outer periphery of the mother substrate and in a region on an extension line of the dividing groove. It is.

  Preferably, in the multi-cavity wiring board according to the present invention, the second hole has an opening diameter smaller than that of the first hole.

  Preferably, the multi-cavity wiring board of the present invention is characterized in that a plurality of the second holes are formed on an extension line of the dividing groove.

  Preferably, the multi-cavity wiring board according to the present invention communicates the adjacent second holes, and has a second divided groove shallower than the divided groove and shallower than the second hole. It is characterized by being formed.

  Preferably, in the multi-cavity wiring board according to the present invention, the first hole or the second hole has a shape having a corner portion at least outside of a portion overlapping with an extension line of the dividing groove. It is characterized by.

  Preferably, the multi-cavity wiring board of the present invention has a tapered shape in which the first hole or the second hole is gradually tapered toward the outer peripheral side at a portion where the first hole or the second hole overlaps the extension line of the dividing groove. It is characterized by being.

  Preferably, in the multi-cavity wiring board of the present invention, the first hole and the second hole communicate with each other, and the divided groove and the third divided groove shallower than the second hole are provided. It is characterized by being formed.

  Preferably, the multi-piece wiring board of the present invention is formed with a fourth dividing groove extending from the second hole located on the outermost periphery to the outer periphery of the mother board, and the fourth The dividing groove is shallower than the dividing groove and the second hole.

  The electronic component storage package of the present invention is characterized in that it is separated into pieces by dividing the multi-piece wiring board of the present invention along the dividing groove.

  An electronic device of the present invention includes the electronic component storage package of the present invention and an electronic component mounted on the electronic component storage package.

  The multi-cavity wiring board of the present invention is provided with a second hole on the extension line of the dividing groove between the first hole and the outer periphery of the mother board, thereby providing a space between the first hole and the outer periphery of the mother board. The mechanical strength in the region on the extension line of the split groove can be relatively lower than that in the surrounding region. For this reason, when the mother board is bent along the dividing groove to be divided into strip-shaped mother boards, it becomes easy to propagate cracks from the first hole to the outer periphery of the mother board along the extension line of the dividing groove. It is possible to suppress the occurrence of burrs and chips on the substrate.

  In addition, since the first hole and the second hole are separated from each other, an external force is applied to the mother board at the time of transportation or mounting of electronic components, so that the second hole and the outer periphery of the mother board are Even if a crack occurs between them, it is possible to prevent the dividing groove and the outer periphery of the mother substrate from communicating with each other, and the mother substrate is not prepared compared to the case where the first hole is formed near the outer periphery of the mother substrate. It is possible to reduce cracking.

  Preferably, since the opening diameter of the second hole is smaller than the opening diameter of the first hole, it is easy to maintain the mechanical strength between the outer periphery of the mother board and the second hole. Even when an external force is applied to the mother board during transportation or mounting of electronic components, cracks are unlikely to occur between the outer periphery of the mother board and the second hole, and the mother board is inadvertently cracked. , Can be suppressed more favorably.

  Preferably, since the plurality of second holes are formed on the extension line of the dividing groove, the first hole and the mother board are reduced by reducing the mechanical strength between the plurality of second holes. The mechanical strength in the region on the extension line of the dividing groove between the outer periphery and the outer periphery of the substrate becomes relatively lower than the surrounding region, and the mother substrate is bent along the dividing groove to be divided into strip-shaped mother substrates. In the outer periphery of the mother board, it becomes easier to propagate cracks from the second hole to the outer periphery of the mother board along the extension line of the dividing groove, and it is possible to better suppress the occurrence of burrs and chips on the wiring board. become able to.

  Preferably, the adjacent second holes communicate with each other, and the divided grooves and the second divided grooves shallower than the second holes are formed. Even if a force is applied, it is possible to prevent the mother substrate from being inadvertently cracked starting from the bottom of the second dividing groove. Furthermore, since the second split groove is formed between the adjacent second holes, the mechanical strength of the second split groove is relatively weaker than that of the surrounding area. Therefore, the mother substrate is bent along the split groove. When it is folded and divided into strip-shaped mother boards, cracks propagate along the second dividing grooves, making it easier to propagate cracks from the first hole to the outer periphery of the mother board, and there are burrs and chips on the wiring board. Generation | occurrence | production can be suppressed more favorably.

  Preferably, the first hole or the second hole has a corner portion on at least the outer peripheral side of the portion overlapping with the extension line of the dividing groove, so that the stress at the time of division is concentrated so that the first hole is concentrated. Since the corner from which the crack starts from the second hole or from the second hole toward the outer periphery of the mother substrate is located on the extension line of the division groove, the strip is well formed along the extension line of the division groove. It can divide | segment into a shape | mold mother board | substrate, and can make the dimension and shape of a strip-shaped mother board | substrate more favorable.

  Preferably, since the first hole or the second hole has a tapered shape that gradually becomes thinner toward the outer peripheral side in the portion overlapping the extension line of the dividing groove, the progress of the crack is controlled by the first hole. It becomes easy to guide from the taper portion of the second hole to the second hole or from the taper portion of the second hole to the outer periphery of the mother substrate. Accordingly, the progress of the crack in an unplanned direction such as from the second hole on the outer peripheral side to the inner hole or another second hole can be suppressed, thereby extending along the extension line of the dividing groove. Therefore, it can be divided into strip-shaped mother substrates, and the size and shape of the strip-shaped mother substrates can be made better.

  Preferably, the first hole and the second hole are communicated with each other, and the split groove and the third split groove shallower than the second hole are formed, so that the third split groove is split. Even when external force is applied to the mother board when transporting or mounting electronic components with relatively higher mechanical strength than the groove, the mother board is inadvertently cracked from the bottom of the third divided groove. Can be prevented from occurring. In addition, since the third split groove is formed between the first hole and the second hole, the mechanical strength is relatively weaker than the surrounding area. Along the third dividing groove, it is easy to propagate the crack from the first hole to the outer periphery of the mother board, and the wiring board is It is possible to better suppress the occurrence of cracks.

  Preferably, the fourth dividing groove extending from the second hole to the outer periphery of the mother substrate is shallower than the dividing groove and the second hole, so that the fourth dividing groove is formed so that it can be divided well when dividing. Even when an external force is applied to the mother board during transportation or mounting of electronic components with relatively higher mechanical strength than the divided grooves, the mother board is not prepared from the bottom of the fourth divided grooves. Suppresses the occurrence of cracks. In addition, since the fourth divided groove is formed between the second hole and the outer periphery of the mother board, the mechanical strength is relatively weaker than the surrounding area. When the substrate is bent and divided into strip-shaped mother boards, the cracks propagate along the fourth dividing grooves, and the cracks are easily propagated from the first hole to the outer periphery of the mother board. It is possible to better suppress the occurrence of chipping.

  Since the electronic component storage package of the present invention is separated into pieces by dividing the multi-cavity wiring board of the present invention along the dividing groove, it is a good electronic component with no occurrence of burrs or chips on the outer edge. It can be set as a storage package.

  Since the electronic device of the present invention includes the electronic component storage package of the present invention and the electronic component mounted on the electronic component storage package, the electronic device can be an electronic device in which the electronic component is well stored. it can.

  The present invention will be described in detail with reference to the accompanying drawings. FIG. 1 is a plan view showing an example of an embodiment of a multi-cavity wiring board according to the present invention. In FIG. 1, 101 is a mother board, 102 is a dividing groove, 103 is a first hole, and 104 is a second hole.

  The multi-cavity wiring board according to the present invention divides the mother board 101 into a plurality of sections on at least one main surface of the flat-shaped mother board 101, and the end is located inside the outer periphery of the mother board 101. Are formed in communication with the dividing groove 102 between the end of the dividing groove 102 and the outer periphery of the mother substrate 101, and are wider than the dividing groove 102 and wider than the dividing groove 102. A first hole 103 having a deep depth, and a second hole 104 formed between the first hole 103 and the outer periphery of the mother substrate 101 and in a region on an extension line of the dividing groove 102 are provided. .

  The base substrate 101 is an electrically insulating ceramic material such as an aluminum oxide sintered body, a mullite sintered body, an aluminum nitride sintered body, a silicon carbide sintered body, a silicon nitride sintered body, or a glass ceramic. It functions as a base material for manufacturing a large number of small wiring boards simultaneously. Then, electronic components (not shown) such as semiconductor elements, resistors, and capacitors are mounted on the upper surface of each small wiring board.

  If the mother substrate 101 is made of, for example, an aluminum oxide sintered body, an organic binder, solvent, plasticizer, and dispersing agent suitable for ceramic raw material powders such as aluminum oxide, silicon oxide, magnesium oxide, and calcium oxide. The ceramic slurry obtained by adding and mixing, etc. is formed into a sheet shape by using a conventionally known sheet forming method such as a doctor blade method, and then a ceramic green sheet is obtained. It is manufactured by laminating a plurality of sheets and baking them at a high temperature (about 1500 to 1800 ° C.).

  The mother board 101 has a plurality of divided grooves 102 formed in a lattice pattern on the upper surface of the mother board 101 so as to divide the mother board 101 into a plurality of areas. Wiring conductors are formed on the upper and lower surfaces of each area divided by the divided grooves 102. 105 is deposited.

  The wiring conductor 105 functions as a conductive path for electrically connecting an electronic component mounted on a small wiring board to an external electric circuit board, and is made of metal powder metallization such as tungsten, molybdenum, copper, silver, and the like. The metallized paste for the wiring conductor 105 is printed on the ceramic green sheet for the substrate 101 by printing means such as a screen printing method, and is fired together with the ceramic green sheet for the mother substrate 101 to adhere to the upper and lower surfaces of each region. It is formed. The metallized paste is prepared by adding an organic binder, an organic solvent, and a dispersant as required to the main component metal powder, and mixing and kneading them by a kneading means such as a ball mill, a three-roll mill, or a planetary mixer. Glass or ceramic powder may be added to match the sintering behavior of the ceramic green sheet or to increase the bonding strength with the mother substrate after firing.

  Further, the wiring conductors 105 formed on the upper surface and the lower surface are electrically connected by a through conductor penetrating the mother board 101. Such penetrating conductors are used for penetrating conductors by a punching method using a die or punching or a processing method such as laser processing on a ceramic green sheet for the mother substrate 101 prior to the printing and application of the metallized paste for forming the wiring conductor 105. The through hole for the through conductor is filled with the metallized paste for the through conductor by a printing means such as a screen printing method and fired together with the ceramic green sheet for the mother substrate 101. Formed in each region. The metallized paste for the through conductor is prepared in the same manner as the metallized paste for the wiring conductor 105, but is prepared to have a viscosity suitable for filling depending on the amount of the organic binder or organic solvent.

  Divided grooves 102 formed on the upper surface of the mother board 101 divide the mother board 101 into a plurality of regions having a size corresponding to the shape of a desired small wiring board, and bend the mother board 101 to obtain a plurality of pieces. When making a small circuit board, the bending is performed easily and accurately, and its end is located inside the outer periphery of the mother board 101. The width of the appearing opening is about 0.05 to 1 mm, and the depth is about 0.05 to 2 mm. Such dividing grooves 2 are formed on the upper surface of the mother board 101 by pressing a cutter blade or a die having a V-shaped cutting edge against a ceramic green sheet for the mother board 101 to make a cut. It is formed in a shape. When the mother substrate 101 is produced by laminating a plurality of ceramic green sheets, the cut is made after producing a laminated body in which a plurality of ceramic green sheets are laminated.

  The first hole 103 is formed between the end of the dividing groove 102 and the outer periphery of the mother substrate 101 so as to communicate with the dividing groove 102 and is wider than the dividing groove 102 and deeper than the dividing groove 102. It is formed as a deep thing. As a result, even when external stress is applied to the mother board 101 during transport or electronic component mounting, the stress can be well dispersed in the first holes 103, and the end portions of the divided grooves 102 can be dispersed. As a starting point, it acts as a means to suppress the occurrence of inadvertent cracking.

  Such a first hole 103 is formed by punching a through hole for the first hole 103 in some ceramic green sheets for the mother substrate 101 by a die or punching, or a processing method such as laser processing, By forming a cut for the dividing groove 102 in the ceramic green sheet for the mother substrate 101 so as to communicate with the first hole 103, it is formed between the end of the dividing groove 102 and the outer periphery of the mother substrate 101. The

  Note that the first hole 103 may penetrate the mother board 101 or may not penetrate the mother board 101. Further, the first hole 103 may be formed in a polygonal shape such as a circular shape, a quadrangular shape, or a triangular shape, and may have a shape other than the above.

  In the present invention, the second hole 104 is formed between the first hole 103 and the outer periphery of the mother substrate 101 and in a region on the extension line of the dividing groove 102. With this configuration, the mechanical strength in the region on the extension line of the dividing groove 102 between the first hole 103 and the outer periphery of the mother substrate 101 can be relatively lower than the surrounding region. For this reason, when the mother substrate 101 is bent along the dividing groove 102 to be divided into strip-shaped mother substrates, cracks propagate from the first hole 103 to the outer periphery of the mother substrate 101 along the extension line of the dividing groove 102. This makes it possible to suppress the occurrence of burrs and chips on the wiring board.

  In addition, since the first hole 103 and the second hole 104 are separated from each other, an external force is applied to the mother board 101 at the time of transportation or mounting of electronic components, so that the second hole 104 and the mother board are applied. Even when a crack occurs between the outer periphery of the first substrate 101 and the outer periphery of the mother substrate 101, the first groove 103 is formed near the outer periphery of the mother substrate 101. Compared to the above, it is possible to reduce the inadvertent cracking of the mother board 101.

  Like the first hole 103, the second hole 104 is formed by punching a through hole for the second hole 104 in some ceramic green sheets for the mother substrate 101 by a die, punching, or the like. By forming by a processing method such as processing, it is formed between the first hole 103 and the outer periphery of the mother substrate 101. In the case where the first hole 103 and the second hole 104 are formed by a punching method, the first hole 103 and the second hole 104 are arranged in order to reduce the positional deviation between the first hole 103 and the second hole 104. Preferably, the second hole 104 is formed by punching at the same time.

  Note that the second hole 104 may penetrate the mother board 101 or may not penetrate the mother board 101. The second hole 104 may be formed in a circular shape, a square shape, or a polygonal shape such as a triangle shape, and may have a shape other than those described above.

  For example, as such a multi-piece wiring board, a rectangular shape having a width of 80 mm × length of 80 mm (80 mmSQ) in a plan view and a thickness of 1.2 mm on one main surface of the mother board 101 is arranged at the center of the mother board 101. A division groove 102 of 0.4 mm (width of the opening) × 0.8 mm (depth) is formed to divide the 60 mmSQ region of the section into 100 pieces (10 rows × 10 columns) in a 6.0 mm SQ rectangular section In this case, 1.0 mm (width) × 1.0 mm (length) × 1.0 mm (depth) communicating with the dividing groove 102 between the end portion of the dividing groove 102 and the outer periphery of the mother substrate 101. Square-shaped first hole 103 (formed at a distance of 7.5 mm from the outer periphery of the mother substrate 101) and 1.0 mm (width) × 1.0 mm (length) × in the region on the extension line of the dividing groove 102 1.0 mm (depth) quadrangular second hole 104 (of the mother board 101) A distance of 3.5mm formation) and it is sufficient to form a circumference.

  As shown in FIG. 2, the second hole 104 preferably has a smaller opening diameter than the first hole 103. The opening diameter here indicates the opening width of the first hole 103 and the second hole 104 in the direction orthogonal to the extending direction of the dividing groove 102. With this configuration, the mechanical strength between the outer periphery of the mother board 101 and the second hole 104 can be easily maintained. Therefore, even when an external force is applied to the mother board 101 during transportation or mounting of electronic components. In addition, cracks are unlikely to occur between the outer periphery of the mother board 101 and the second holes 104, and the mother board 101 can be better prevented from being carelessly cracked.

  If the opening diameter of the second hole 104 is too small compared to the opening diameter of the first hole 103, cracks will start from a portion other than the portion overlapping the extension line of the dividing groove 102 in the first hole 103. When the crack occurs, the crack may not easily progress from the first hole 103 toward the second hole 104, so the opening diameter of the second hole 104 is 30 of the opening diameter of the first hole 103. % Or more is preferable.

  For example, as such a multi-piece wiring board, a 70 mmSQ region in the center of the mother board 101 is formed on one main surface of the mother board 101 having a rectangular shape of 90 mmSQ in a plan view and a thickness of 1.5 mm. In the case where 0.5 mm (opening portion width) × 1.0 mm (depth) dividing groove 102 is formed in a rectangular section divided into 100 pieces (10 rows × 10 columns), the end of the dividing groove 102 A circular first hole 103 having a diameter of 1.0 mm (inner diameter) × 1.2 mm (depth) communicating with the dividing groove 102 between the outer periphery of the mother substrate 101 and the outer periphery of the mother substrate 101 (7. And a circular second hole 104 of 0.6 mm (inner diameter) × 0.9 mm (depth) in the region on the extension line of the dividing groove 102 (formed from the outer periphery of the mother substrate 101 to 3.0 mm). ).

  Further, as shown in FIG. 3, it is preferable that a plurality of the second holes 104 are formed on the extension line of the dividing groove 102. With this configuration, by reducing the mechanical strength between the plurality of second holes 104, the mechanical strength in the region on the extension line of the dividing groove 102 between the first hole 103 and the outer periphery of the mother substrate 101. When the mother board 101 is bent along the dividing grooves 102 and divided into strip-shaped mother boards, the extension of the dividing grooves 102 is formed on the outer periphery of the mother board 101. Along the second hole 104, the crack can easily propagate from the second hole 104 to the outer periphery of the mother board 101, and the occurrence of burrs and chips on the wiring board can be suppressed.

  For example, as such a multi-piece wiring board, an area of 80 mmSQ in the center of the mother board 101 is set to 4.0 mmSQ on one main surface of the mother board 101 having a rectangular shape of 100 mmSQ and a thickness of 0.5 mm in plan view. When the dividing groove 102 of 0.15 mm (opening width) × 0.3 mm (depth) divided into 400 pieces (20 rows × 20 columns) is formed in a rectangular section, the end of the dividing groove 102 A circular first hole 103 (from the outer periphery of the mother substrate 101 to 8.0 mm) that penetrates the mother substrate 101 of 1.0 mm (inner diameter) communicating with the dividing groove 102 between the outer periphery of the mother substrate 101 and the outer periphery of the mother substrate 101 Formation) and a circular second hole 104 (formed from the outer periphery of the mother substrate 101 to 5.5 mm) in a region on the extension line of the dividing groove 102, 0.8 mm (inner diameter) × 0.2 mm (depth). In the region on the extension line of the dividing groove 102, 0.5 mm It is sufficient to form a second hole 104 inner diameter) × 0.2 mm circular in (depth) (formed 3.0mm from the outer periphery of the base substrate 101).

  In addition, as shown in FIGS. 4 and 5, the adjacent second holes 104 communicate with each other, and the divided grooves 102 and the second divided grooves 106 shallower than the second holes 104 are formed. preferable. With this configuration, the mechanical strength of the second dividing groove 106 is made relatively stronger than the mechanical strength of the dividing groove 102, and an external force is applied to the mother substrate 101 at the time of transportation or electronic component mounting. However, it is possible to prevent the mother substrate 101 from being carelessly cracked starting from the bottom of the second dividing groove 106. Furthermore, since the formation site of the second dividing groove 106 is relatively weaker than the mechanical strength of the surrounding area between the adjacent second holes 104, the mother substrate 101 extends along the dividing groove 102. When the substrate is bent into the strip-shaped mother board 101, the cracks propagate along the second dividing grooves 106, so that the cracks can easily propagate from the first hole 103 to the outer periphery of the mother board 101. It is possible to suppress the occurrence of burrs and chips on the substrate. Similar to the divided groove 102, such a second divided groove 106 is used for the second divided groove 106 by pressing a cutter blade or a die having a V-shaped cutting edge against a ceramic green sheet for the base substrate 101. The second holes 104 of the mother substrate 101 are formed to communicate with each other by making the cuts of. The second dividing groove 106 may be formed by simultaneously making a cut for the dividing groove 102 in the ceramic green sheet for the mother substrate 101, or by forming a notch for the second dividing groove 106 at the same time. It may be formed by making a notch for the second dividing groove 106 separately from the notch. In order to make the positional deviation between the dividing groove 102 and the second dividing groove 106 small, the notch for the dividing groove 102 and the notch for the second dividing groove 106 are simultaneously formed on the ceramic green sheet for the mother substrate 101. It is preferable to add. For example, by dividing the ceramic green sheet for the mother substrate 101 by using a cutter blade or a mold having different heights in the cut portion for the split groove 102 and the cut portion for the second split groove 106 A cut for the groove 102 and a cut for the second dividing groove 106 can be made simultaneously.

  The second dividing groove 106 may be formed so as to gradually become shallower from the second hole 104 on the inner peripheral side of the mother substrate 101 to the second hole 104 on the outer peripheral side. This makes it easier to maintain the mechanical strength at the outer periphery of the second division groove 106 portion of the mother board 101, so that the mother board 101 is inadvertently cracked when transported or mounted with electronic components. It becomes easy to suppress.

  For example, as such a multi-piece wiring board, an area of 80 mmSQ in the central portion of the mother board 101 is set to 4.0 mm on one main surface of the mother board 101 having a rectangular shape of 100 mmSQ and a thickness of 0.4 mm in plan view. Dividing grooves 102 of 0.1 mm (width of opening) × 0.25 mm (depth) divided into 200 (20 rows × 10 columns) in rectangular sections of (width) × 8.0 mm (length) When formed, a circular first hole 103 passing through the 0.8 mm (inner diameter) mother substrate 101 communicating with the dividing groove 102 between the end of the dividing groove 102 and the outer periphery of the mother substrate 101. (Formed to 8.0 mm from the outer periphery of the mother substrate 101) and a circular second hole 104 (mother substrate) of 0.5 mm (inner diameter) × 0.2 mm (depth) in a region on the extension line of the dividing groove 102 101) and an extension of the dividing groove 102 A circular second hole 104 (formed from the outer periphery of the mother substrate 101 to 3.0 mm) of 0.3 mm (inner diameter) × 0.2 mm (depth) is formed in the upper region, and 0.04 mm (opening) A second dividing groove 106 having a width of the portion × 0.1 mm (depth) may be formed so that the adjacent second holes 104 communicate with each other.

  Moreover, as shown in FIG. 6, it is preferable that the 1st hole 103 or the 2nd hole 104 has a corner | angular part at least on the outer peripheral side among the parts which overlap on the extension line of the division groove | channel 102. FIG. With this configuration, since the stress at the time of division is concentrated, the corner portion that becomes the starting point of the crack from the first hole 103 to the second hole 104 or from the second hole 104 to the outer periphery of the mother substrate 101 is divided into the divided grooves 102. Therefore, it can be divided into strip-shaped mother substrates well along the extension line of the dividing groove 102, and the dimensions and shape of the strip-shaped mother substrate can be made better. it can.

  In the above-described case, the first hole 103 or the second hole 104 may be provided with corner portions such as a polygonal shape such as a triangular shape, a quadrangular shape, and a rhombus shape.

  Moreover, as shown in FIG. 7, it is preferable that the 1st hole 103 or the 2nd hole 104 is a taper shape which becomes thin gradually toward the outer peripheral side among the parts which overlap with the extension line of the division | segmentation groove | channel 102. As shown in FIG. In addition, the taper shape here refers to a shape in which one side has a corner at the tip, and the other side is preferably an arc shape. With this configuration, it is easy to induce the progress of cracks from the tapered portion of the first hole 103 to the second hole 104 or from the tapered portion of the second hole 104 to the outer periphery of the mother substrate 101. Therefore, the progress of the crack in an unscheduled direction such as, for example, from the outer peripheral second hole 104 to the inner first hole 103 or the other second hole 104 can be suppressed, thereby dividing the crack. The strip-shaped mother substrate can be favorably divided along the extended line of the groove 102, and the size and shape of the strip-shaped mother substrate can be made better.

  Further, as shown in FIGS. 8 and 9, the first hole 103 and the second hole 104 communicate with each other, and the dividing groove 102 and the third dividing groove 107 shallower than the second hole 104 are formed. It is preferable. With this configuration, the mechanical strength of the third dividing groove 107 is made relatively stronger than the mechanical strength of the dividing groove 102, and an external force is applied to the mother board 101 at the time of transportation or mounting of electronic components. Even if it is done, it can suppress that a crack generate | occur | produces in the mother board | substrate 101 from the bottom part of the 3rd division groove 107 carelessly. In addition, the formation site of the third dividing groove 107 is relatively weaker in mechanical strength than the surrounding area between the first hole 103 and the second hole 104. When 101 is bent along the dividing groove 102 and divided into strip-shaped mother boards, the cracks propagate along the third dividing grooves 107 so that the cracks extend from the first holes 103 to the outer periphery of the mother board 101. It becomes easy to progress, and it becomes possible to suppress the generation of burrs and chips on the wiring board.

  The third dividing groove 107 is used for the third dividing groove 107 by pressing a cutter blade or a die having a V-shaped cutting edge against the ceramic green sheet for the base substrate 101 in the same manner as the dividing groove 102. Is formed between the first hole 103 and the second hole 104 of the mother substrate 101.

  The third dividing groove 107 may be formed by simultaneously making a cut for the dividing groove 102 in the ceramic green sheet for the mother substrate 101, or by forming a notch for the third dividing groove 107 at the same time. It may be formed by making a cut for the third dividing groove 107 separately from the cut for use. In order to make the positional deviation between the dividing groove 102 and the third dividing groove 107 small, the notch for the dividing groove 102 and the notch for the third dividing groove 107 are simultaneously formed on the ceramic green sheet for the mother substrate 101. It is preferable to add. For example, the ceramic green sheet for the mother substrate 101 is cut by using a cutter blade or a mold having different heights in the cut portion for the split groove 102 and the cut portion for the third split groove 107. A cut for the groove 102 and a cut for the third dividing groove 107 can be made simultaneously.

  Further, the third dividing groove 107 may be formed so as to become gradually shallower from the first hole 103 to the second hole 104. This makes it easier to maintain the mechanical strength at the outer periphery of the third division groove 107 portion of the mother board 101, so that the mother board 101 is inadvertently cracked when transporting or mounting electronic components on the mother board 101. It becomes easy to suppress.

  For example, as such a multi-piece wiring board, a 60 mmSQ region at the center of the mother board 101 is formed at 6.0 mmSQ on one main surface of the mother board 101 having a rectangular shape of 80 mmSQ and a thickness of 1.2 mm in plan view. In the case where 0.4 mm (opening portion width) × 0.8 mm (depth) dividing groove 102 is formed in a rectangular section divided into 100 pieces (10 rows × 10 columns), the end of the dividing groove 102 1.0 mm (one side length) × 1.0 mm (depth) equilateral triangular first hole 103 (of the mother substrate 101) communicating with the dividing groove 102 between the portion and the outer periphery of the mother substrate 101. Formed at a distance of 7.5 mm from the outer periphery) and a 1.0 mm (one side length) equilateral triangular second hole 104 (3.5 mm from the outer periphery of the mother substrate 101) in the region on the extended line of the dividing groove 102. ), And one of the corners is an extension line of the dividing groove 102 The third divided groove 107 having a width of 0.2 mm (opening width) × 0.4 mm (depth) is divided into the first hole 103 and the second hole 104. What is necessary is just to form so that it may communicate.

  Further, as shown in FIGS. 10 and 11, a fourth dividing groove 108 extending from the second hole 104 to the outer periphery of the mother board 101 is formed, and the fourth dividing groove 108 is divided into the dividing grooves. It is preferably shallower than 102 and the second hole 104. With this configuration, the mechanical strength is relatively stronger than the dividing groove 102 formed so that it can be divided satisfactorily when dividing, and external force is applied to the mother board 101 during transportation or mounting of electronic components. Even if it is applied, it is possible to prevent the mother substrate 101 from being inadvertently cracked from the bottom of the fourth dividing groove 108. Further, the fourth divided groove 108 can be formed at a portion where the mechanical strength is relatively weaker than the surrounding region between the second hole 104 and the outer periphery of the mother substrate 101. Is bent along the dividing groove 102 and divided into strip-shaped mother boards, the cracks are propagated along the fourth dividing grooves 108 and the cracks are propagated from the first hole 103 to the outer periphery of the mother board 101. This makes it possible to suppress the occurrence of burrs and chips on the wiring board.

  The fourth dividing groove 108 is used for the fourth dividing groove 108 by pressing a cutter blade or a die having a V-shaped cutting edge to the ceramic green sheet for the mother substrate 101 in the same manner as the dividing groove 102. Is formed from the second hole 104 of the mother board 101 to the outer periphery of the mother board 101.

  The fourth dividing groove 108 may be formed by simultaneously making a cut for the dividing groove 102 in the ceramic green sheet for the mother substrate 101, or by forming a notch for the fourth dividing groove 108 at the same time. It may be formed by making a cut for the fourth dividing groove 108 separately from the cut for use. In order to make the positional deviation between the dividing groove 102 and the fourth dividing groove 108 small, the notch for the dividing groove 102 and the notch for the fourth dividing groove 108 are simultaneously formed on the ceramic green sheet for the mother substrate 101. It is preferable to add. For example, by dividing the ceramic green sheet for the mother substrate 101 by using a cutter blade or a mold having different heights in the cut portion for the split groove 102 and the cut portion for the fourth split groove 108 A cut for the groove 102 and a cut for the fourth dividing groove 108 can be made simultaneously.

  The fourth dividing groove 108 may be formed so as to become gradually shallower from the second hole 104 to the outer periphery of the mother substrate 101. This makes it easy to maintain the mechanical strength at the outer periphery of the fourth division groove 108 portion of the mother board 101, so that the mother board 101 is inadvertently cracked when transporting or mounting electronic components on the mother board 101. It becomes easy to suppress.

  For example, as such a multi-piece wiring board, a 70 mmSQ area in the center of the mother board 101 is formed on one main surface of the mother board 101 having a rectangular shape of 90 mmSQ in a plan view and a thickness of 1.5 mm. When the dividing groove 102 of 0.4 mm (width of the opening portion) × 1.0 mm (depth) divided into 100 pieces (10 rows × 10 columns) is formed in the shape section, the end of the dividing groove 102 A circular first hole 103 (7.5 mm from the outer periphery of the mother substrate 101) communicating with the dividing groove 102 between the outer periphery of the mother substrate 101 and 1.0 mm (inner diameter) × 1.2 mm (depth). And a circular second hole 104 of 0.6 mm (inner diameter) × 1.0 mm (depth) in the region on the extension line of the dividing groove 102 (formed from the outer periphery of the mother substrate 101 to 3.0 mm). And 0.04 mm (opening width) × 0.1 mm ( A fourth division groove 108 having a depth) may be formed from the second hole 104 to the outer periphery of the mother substrate 101.

  In addition, on the surface of the wiring conductor 105 exposed on the surface of the multi-piece wiring board, corrosion prevention of the wiring conductor 105, connection between the electronic component and the wiring conductor 105, separated electronic component storage package and external circuit are provided. In order to strengthen the bonding with the substrate, it is preferable to perform plating such as Ni or Au.

  In addition, since the electronic component storage package of the present invention is divided into pieces by dividing the multi-cavity wiring board described above along the dividing groove 102, it is possible to obtain excellent electronic components that are free from burrs and chips on the outer edge. It can be set as a component storage package.

  Furthermore, since the electronic device of the present invention includes the above-described electronic component storage package and the electronic component mounted on the electronic component storage package, the electronic device can be an electronic device in which the electronic component is well stored. it can.

  The electronic components mounted on the electronic device of the present invention are semiconductor elements such as IC chips and LSI chips, piezoelectric elements such as crystal vibrators and piezoelectric vibrators, various sensors, and the like. You may mount in the package for electronic component accommodation divided | segmented along the groove | channel, and you may divide | segment after mounting a several electronic component in a multi-piece wiring board.

  When the electronic component is a flip-chip type semiconductor element, the electrode of the semiconductor element and the wiring conductor are connected via a solder bump, a gold bump, or a conductive resin (anisotropic conductive resin, etc.). 105, and when the electronic component is a wire bonding type semiconductor element, it is fixed with a bonding material such as glass, resin, brazing material, etc. This is performed by electrically connecting the electrode of the semiconductor element and the wiring conductor 105. When the electronic component is a piezoelectric element such as a crystal resonator, the piezoelectric element is fixed and the electrode of the piezoelectric element and the wiring conductor 105 are electrically connected by a conductive resin.

  And an electronic component is sealed as needed. Sealing is performed by covering the electronic component with a sealing resin such as epoxy resin, or a lid made of resin, metal, ceramics, etc. placed so as to cover the electronic component is bonded to glass, resin, brazing material, etc. What is necessary is just to carry out by attaching to an electronic component storage package with an agent.

  The present invention can be variously modified within a range not departing from the gist of the present invention. For example, in FIG. 1, the dividing groove 102 is formed on the upper surface of the mother substrate 101, but the dividing groove 102 may be formed on the lower surface of the mother substrate 101, or both the upper and lower surfaces of the mother substrate 101. You may form in. When the dividing grooves 102 are formed on both the upper surface and the lower surface of the mother substrate 101, the same first holes 103 are formed at both ends of the dividing grooves 102 formed on the upper surface and the lower surface in the same manner as described above. The second hole 104 may be formed.

It is a top view which shows the example of embodiment of the multi-piece wiring board of this invention. It is a top view which shows the example of embodiment of the multi-piece wiring board of this invention. It is a top view which shows the example of embodiment of the multi-piece wiring board of this invention. It is a top view which shows the example of embodiment of the multi-piece wiring board of this invention. 4A is a cross-sectional view taken along line A-A ′ of the multi-cavity wiring board in FIG. 4, and FIG. 4B is an enlarged cross-sectional view of a main part in a B portion of FIG. It is a top view which shows the example of embodiment of the multi-piece wiring board of this invention. It is a top view which shows the example of embodiment of the multi-piece wiring board of this invention. It is a top view which shows the example of embodiment of the multi-piece wiring board of this invention. (A) is sectional drawing in the C-C 'line of the multi-piece wiring board in FIG. 8, (b) is a principal part expanded sectional view in the D section of (a). It is a top view which shows the example of embodiment of the multi-piece wiring board of this invention. (A) is sectional drawing in the E-E 'line | wire of the multi-piece wiring board in FIG. 10, (b) is a principal part expanded sectional view in F section of (a).

Explanation of symbols

101 ... Mother board 102 ... Dividing groove 103 ... Hole 104 ... Second hole 105 ... Wiring conductor 106 ... Second dividing groove 107 ... Third dividing groove 108 ... Fourth dividing groove

Claims (10)

A dividing groove formed on at least one main surface of the flat-shaped mother board so that the mother board is divided into a plurality of sections and an end portion is located inside the outer periphery of the mother board, and the dividing groove A first hole having a width wider than the division groove and deeper than the division groove, and a first hole formed between the end of the division substrate and the outer periphery of the mother substrate. A multi-piece wiring board comprising: a second hole formed between a first hole and an outer periphery of the mother board and in a region on an extension line of the dividing groove. The multi-cavity wiring board according to claim 1, wherein the second hole has an opening diameter smaller than that of the first hole. 3. The multi-piece wiring board according to claim 1, wherein a plurality of the second holes are formed on an extension line of the division groove. 4. The multi-piece wiring board according to claim 3, wherein the adjacent second holes are communicated with each other, and the divided grooves and the second divided grooves shallower than the second holes are formed. . The said 1st hole or the said 2nd hole is a shape which has a corner | angular part at least on the outer peripheral side among the parts which overlap with the extension line of the said division groove | channel, The any one of Claim 1 thru | or 4 characterized by the above-mentioned. The multi-cavity wiring board described in 1. The said 1st hole or the said 2nd hole is a taper shape which becomes thin gradually toward an outer peripheral side among the parts which overlap with the extension line of the said division groove | channel, The any one of Claim 1 thru | or 4 characterized by the above-mentioned. Multi-cavity wiring board as described in Crab. The first and second holes communicate with each other, and the divided grooves and a third divided groove shallower than the second holes are formed. The multi-cavity wiring board according to 6. A fourth dividing groove extending from the second hole to the outer periphery of the mother substrate is formed, and the fourth dividing groove is shallower than the dividing groove and the second hole. The multi-piece wiring board according to any one of claims 1 to 7. 9. A package for storing electronic parts, wherein the multi-piece wiring board according to claim 1 is divided into pieces by dividing the wiring board along the dividing grooves. An electronic device comprising the electronic component storage package according to claim 9 and an electronic component mounted on the electronic component storage package.

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