JP2007313705A - Laminated film and laminated adhesive film - Google Patents
Laminated film and laminated adhesive film Download PDFInfo
- Publication number
- JP2007313705A JP2007313705A JP2006143895A JP2006143895A JP2007313705A JP 2007313705 A JP2007313705 A JP 2007313705A JP 2006143895 A JP2006143895 A JP 2006143895A JP 2006143895 A JP2006143895 A JP 2006143895A JP 2007313705 A JP2007313705 A JP 2007313705A
- Authority
- JP
- Japan
- Prior art keywords
- weight
- laminated film
- film
- synthetic resin
- laminated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 239000002313 adhesive film Substances 0.000 title claims description 3
- 239000011941 photocatalyst Substances 0.000 claims abstract description 42
- 230000001699 photocatalysis Effects 0.000 claims abstract description 39
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 claims abstract description 26
- 229920003002 synthetic resin Polymers 0.000 claims abstract description 25
- 239000000057 synthetic resin Substances 0.000 claims abstract description 25
- 229920006243 acrylic copolymer Polymers 0.000 claims abstract description 15
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 claims abstract description 14
- 239000004065 semiconductor Substances 0.000 claims abstract description 10
- 239000002245 particle Substances 0.000 claims abstract description 6
- 239000010410 layer Substances 0.000 claims description 46
- 239000010419 fine particle Substances 0.000 claims description 20
- 239000000805 composite resin Substances 0.000 claims description 14
- 229920000642 polymer Polymers 0.000 claims description 14
- 229920002554 vinyl polymer Polymers 0.000 claims description 14
- 125000003808 silyl group Chemical group [H][Si]([H])([H])[*] 0.000 claims description 13
- 229920001577 copolymer Polymers 0.000 claims description 7
- 239000000178 monomer Substances 0.000 claims description 7
- 229920001296 polysiloxane Polymers 0.000 claims description 7
- 229920005672 polyolefin resin Polymers 0.000 claims description 4
- 239000012790 adhesive layer Substances 0.000 claims description 2
- 230000000379 polymerizing effect Effects 0.000 claims description 2
- -1 superoxide anions Chemical class 0.000 description 30
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 20
- 229920005989 resin Polymers 0.000 description 19
- 239000011347 resin Substances 0.000 description 19
- 238000000576 coating method Methods 0.000 description 14
- 239000011248 coating agent Substances 0.000 description 13
- 239000000203 mixture Substances 0.000 description 11
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 10
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 10
- 238000000034 method Methods 0.000 description 10
- 150000001875 compounds Chemical class 0.000 description 9
- 239000004408 titanium dioxide Substances 0.000 description 9
- 230000015572 biosynthetic process Effects 0.000 description 8
- 239000000243 solution Substances 0.000 description 8
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 7
- 238000001035 drying Methods 0.000 description 7
- 229920001155 polypropylene Polymers 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 6
- 239000004743 Polypropylene Substances 0.000 description 6
- 238000002156 mixing Methods 0.000 description 6
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 6
- 239000007787 solid Substances 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 5
- 239000004611 light stabiliser Substances 0.000 description 5
- GRWFGVWFFZKLTI-IUCAKERBSA-N (-)-α-pinene Chemical compound CC1=CC[C@@H]2C(C)(C)[C@H]1C2 GRWFGVWFFZKLTI-IUCAKERBSA-N 0.000 description 4
- 239000005977 Ethylene Substances 0.000 description 4
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 4
- 125000000217 alkyl group Chemical group 0.000 description 4
- 150000001412 amines Chemical class 0.000 description 4
- 125000003118 aryl group Chemical group 0.000 description 4
- 239000006185 dispersion Substances 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 229920001684 low density polyethylene Polymers 0.000 description 4
- 239000004702 low-density polyethylene Substances 0.000 description 4
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 4
- 229910000077 silane Inorganic materials 0.000 description 4
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 4
- 239000004711 α-olefin Substances 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 125000003545 alkoxy group Chemical group 0.000 description 3
- 229910052586 apatite Inorganic materials 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- VSIIXMUUUJUKCM-UHFFFAOYSA-D pentacalcium;fluoride;triphosphate Chemical compound [F-].[Ca+2].[Ca+2].[Ca+2].[Ca+2].[Ca+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O VSIIXMUUUJUKCM-UHFFFAOYSA-D 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 2
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 2
- ZGEGCLOFRBLKSE-UHFFFAOYSA-N 1-Heptene Chemical compound CCCCCC=C ZGEGCLOFRBLKSE-UHFFFAOYSA-N 0.000 description 2
- AFFLGGQVNFXPEV-UHFFFAOYSA-N 1-decene Chemical compound CCCCCCCCC=C AFFLGGQVNFXPEV-UHFFFAOYSA-N 0.000 description 2
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 description 2
- KWKAKUADMBZCLK-UHFFFAOYSA-N 1-octene Chemical compound CCCCCCC=C KWKAKUADMBZCLK-UHFFFAOYSA-N 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- RBTBFTRPCNLSDE-UHFFFAOYSA-N 3,7-bis(dimethylamino)phenothiazin-5-ium Chemical compound C1=CC(N(C)C)=CC2=[S+]C3=CC(N(C)C)=CC=C3N=C21 RBTBFTRPCNLSDE-UHFFFAOYSA-N 0.000 description 2
- WUPHOULIZUERAE-UHFFFAOYSA-N 3-(oxolan-2-yl)propanoic acid Chemical compound OC(=O)CCC1CCCO1 WUPHOULIZUERAE-UHFFFAOYSA-N 0.000 description 2
- KSCAZPYHLGGNPZ-UHFFFAOYSA-N 3-chloropropyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)CCCCl KSCAZPYHLGGNPZ-UHFFFAOYSA-N 0.000 description 2
- WSSSPWUEQFSQQG-UHFFFAOYSA-N 4-methyl-1-pentene Chemical compound CC(C)CC=C WSSSPWUEQFSQQG-UHFFFAOYSA-N 0.000 description 2
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- GYCMBHHDWRMZGG-UHFFFAOYSA-N Methylacrylonitrile Chemical compound CC(=C)C#N GYCMBHHDWRMZGG-UHFFFAOYSA-N 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 239000005083 Zinc sulfide Substances 0.000 description 2
- 239000006096 absorbing agent Substances 0.000 description 2
- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Chemical compound CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 description 2
- 125000004423 acyloxy group Chemical group 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 2
- MVNCAPSFBDBCGF-UHFFFAOYSA-N alpha-pinene Natural products CC1=CCC23C1CC2C3(C)C MVNCAPSFBDBCGF-UHFFFAOYSA-N 0.000 description 2
- 230000000844 anti-bacterial effect Effects 0.000 description 2
- 230000003373 anti-fouling effect Effects 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- ZPOLOEWJWXZUSP-AATRIKPKSA-N bis(prop-2-enyl) (e)-but-2-enedioate Chemical compound C=CCOC(=O)\C=C\C(=O)OCC=C ZPOLOEWJWXZUSP-AATRIKPKSA-N 0.000 description 2
- 229920001400 block copolymer Polymers 0.000 description 2
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 2
- 229910052980 cadmium sulfide Inorganic materials 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 150000001735 carboxylic acids Chemical class 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 238000004332 deodorization Methods 0.000 description 2
- JJQZDUKDJDQPMQ-UHFFFAOYSA-N dimethoxy(dimethyl)silane Chemical compound CO[Si](C)(C)OC JJQZDUKDJDQPMQ-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000005357 flat glass Substances 0.000 description 2
- 229920001903 high density polyethylene Polymers 0.000 description 2
- 239000004700 high-density polyethylene Substances 0.000 description 2
- 125000001841 imino group Chemical group [H]N=* 0.000 description 2
- ZXEKIIBDNHEJCQ-UHFFFAOYSA-N isobutanol Chemical compound CC(C)CO ZXEKIIBDNHEJCQ-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 229960000907 methylthioninium chloride Drugs 0.000 description 2
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- QGLKJKCYBOYXKC-UHFFFAOYSA-N nonaoxidotritungsten Chemical compound O=[W]1(=O)O[W](=O)(=O)O[W](=O)(=O)O1 QGLKJKCYBOYXKC-UHFFFAOYSA-N 0.000 description 2
- 229920001778 nylon Polymers 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- YWAKXRMUMFPDSH-UHFFFAOYSA-N pentene Chemical compound CCCC=C YWAKXRMUMFPDSH-UHFFFAOYSA-N 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 229920013716 polyethylene resin Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 125000002572 propoxy group Chemical group [*]OC([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 2
- GRWFGVWFFZKLTI-UHFFFAOYSA-N rac-alpha-Pinene Natural products CC1=CCC2C(C)(C)C1C2 GRWFGVWFFZKLTI-UHFFFAOYSA-N 0.000 description 2
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- 238000010992 reflux Methods 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
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- 239000002002 slurry Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
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- 238000012360 testing method Methods 0.000 description 2
- 125000000101 thioether group Chemical group 0.000 description 2
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- 239000006097 ultraviolet radiation absorber Substances 0.000 description 2
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- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 description 2
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- GIIUJJXXMYYQQD-UHFFFAOYSA-N (2,2,6,6-tetramethylpiperidin-1-yl) prop-2-enoate Chemical compound CC1(C)CCCC(C)(C)N1OC(=O)C=C GIIUJJXXMYYQQD-UHFFFAOYSA-N 0.000 description 1
- BSSNZUFKXJJCBG-UPHRSURJSA-N (z)-but-2-enediamide Chemical compound NC(=O)\C=C/C(N)=O BSSNZUFKXJJCBG-UPHRSURJSA-N 0.000 description 1
- 229940058015 1,3-butylene glycol Drugs 0.000 description 1
- KPAPHODVWOVUJL-UHFFFAOYSA-N 1-benzofuran;1h-indene Chemical compound C1=CC=C2CC=CC2=C1.C1=CC=C2OC=CC2=C1 KPAPHODVWOVUJL-UHFFFAOYSA-N 0.000 description 1
- BQTPKSBXMONSJI-UHFFFAOYSA-N 1-cyclohexylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1CCCCC1 BQTPKSBXMONSJI-UHFFFAOYSA-N 0.000 description 1
- HIDBROSJWZYGSZ-UHFFFAOYSA-N 1-phenylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC=C1 HIDBROSJWZYGSZ-UHFFFAOYSA-N 0.000 description 1
- RKMGAJGJIURJSJ-UHFFFAOYSA-N 2,2,6,6-Tetramethylpiperidine Substances CC1(C)CCCC(C)(C)N1 RKMGAJGJIURJSJ-UHFFFAOYSA-N 0.000 description 1
- BJELTSYBAHKXRW-UHFFFAOYSA-N 2,4,6-triallyloxy-1,3,5-triazine Chemical compound C=CCOC1=NC(OCC=C)=NC(OCC=C)=N1 BJELTSYBAHKXRW-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- VQMHSKWEJGIXGA-UHFFFAOYSA-N 2-(benzotriazol-2-yl)-6-dodecyl-4-methylphenol Chemical compound CCCCCCCCCCCCC1=CC(C)=CC(N2N=C3C=CC=CC3=N2)=C1O VQMHSKWEJGIXGA-UHFFFAOYSA-N 0.000 description 1
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- CEYHHQSTMVVZQP-UHFFFAOYSA-N 2-ethenoxyethanamine Chemical compound NCCOC=C CEYHHQSTMVVZQP-UHFFFAOYSA-N 0.000 description 1
- 125000000094 2-phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
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- ZCILGMFPJBRCNO-UHFFFAOYSA-N 4-phenyl-2H-benzotriazol-5-ol Chemical class OC1=CC=C2NN=NC2=C1C1=CC=CC=C1 ZCILGMFPJBRCNO-UHFFFAOYSA-N 0.000 description 1
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- 108700018427 F 327 Proteins 0.000 description 1
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- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 244000043261 Hevea brasiliensis Species 0.000 description 1
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- GHAZCVNUKKZTLG-UHFFFAOYSA-N N-ethyl-succinimide Natural products CCN1C(=O)CCC1=O GHAZCVNUKKZTLG-UHFFFAOYSA-N 0.000 description 1
- HDFGOPSGAURCEO-UHFFFAOYSA-N N-ethylmaleimide Chemical compound CCN1C(=O)C=CC1=O HDFGOPSGAURCEO-UHFFFAOYSA-N 0.000 description 1
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- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
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Landscapes
- Paints Or Removers (AREA)
- Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
- Laminated Bodies (AREA)
- Catalysts (AREA)
- Adhesive Tapes (AREA)
Abstract
Description
本発明は、光触媒活性を有する積層フィルムに関し、更に詳しくは、光触媒活性を有する層(光触媒層)表面の耐スクラッチ性等の耐傷付き性に優れる積層フィルムに関するものである。 The present invention relates to a laminated film having photocatalytic activity, and more particularly to a laminated film having excellent scratch resistance such as scratch resistance on the surface having a photocatalytic activity (photocatalytic layer).
光触媒活性を有する材料(以下、単に光触媒と称すことがある。)は、そのバンドギャップ以上のエネルギーの光を照射すると、励起されて伝導帯に電子が生じ、かつ価電子帯に正孔が生じる。そして、生成した電子は表面酸素を還元してスーパーオキサイドアニオン(・O2 -)を生成させると共に、正孔は表面水酸基を酸化して水酸ラジカル(・OH)を生成し、これらの反応性活性酸素種が強い酸化分解機能を発揮し、光触媒の表面に付着している有機物質を高効率で分解することが知られている。このような光触媒の機能を応用して、例えば脱臭、防汚、抗菌、殺菌、さらには廃水中や廃ガス中の環境汚染上の問題となっている各種物質の分解・除去等が検討されている。 A material having photocatalytic activity (hereinafter, sometimes simply referred to as a photocatalyst) is excited to generate electrons in the conduction band and holes in the valence band when irradiated with light having energy higher than the band gap. . The generated electrons reduce surface oxygen to generate superoxide anions (• O 2 − ), and holes oxidize surface hydroxyl groups to generate hydroxyl radicals (• OH). It is known that active oxygen species exert a strong oxidative decomposition function and decompose organic substances adhering to the surface of the photocatalyst with high efficiency. By applying such photocatalytic functions, for example, deodorization, antifouling, antibacterial, sterilization, and decomposition / removal of various substances that cause environmental pollution in wastewater and waste gas are being studied. Yes.
また、光触媒のもう1つの機能として、該光触媒が光励起されると、例えば国際特許公開96/29375号公報に開示されているように、光触媒表面は、水との接触角が10度以下となる超親水化を発現することも知られている。
このような光触媒技術は、年々注目を集めるようになっており、現在では、建物外壁、病院内壁、壁紙(特許文献1)、鏡、窓ガラス、衛生陶器、包丁、まな板、高速道路の防音壁やトンネル内照明、街路灯、道路標識、自動車のボディーコート、自動車サイドミラー、等の用途で各社により検討されており、一部実用化もされてきている。
Further, as another function of the photocatalyst, when the photocatalyst is photoexcited, for example, as disclosed in International Patent Publication No. 96/29375, the photocatalyst surface has a contact angle with water of 10 degrees or less. It is also known to express superhydrophilization.
Such photocatalytic technology has been attracting attention year by year, and nowadays, building outer walls, hospital inner walls, wallpaper (Patent Document 1), mirrors, window glass, sanitary ware, kitchen knives, cutting boards, and soundproof walls on highways. Have been studied by various companies in applications such as lighting in tunnels, street lights, road signs, automobile body coats, and automobile side mirrors, and some have been put into practical use.
光触媒活性を有する材料としては、半導体的特性を有する種々の化合物、例えば二酸化チタン、酸化鉄、酸化タングステン、酸化亜鉛等の金属酸化物、硫化カドミウムや硫化亜鉛等の金属硫化物等が知られているが、これらの中で、二酸化チタン、特にアナターゼ型二酸化チタンは実用的な光触媒として有用である。この二酸化チタンは、太陽光等の日常光に含まれる紫外線領域の特定波長の光を吸収することによって優れた光触媒活性を示す。
また、最近では、可視光でも光触媒活性を発現する材料も開発されている。
このように、光触媒活性を有する化合物を含有する層を最表層に形成させて、各種機能を発現させる検討が種々なされているが、これらの光触媒活性を有する化合物を含有する層は、耐スクラッチ性が悪いといった欠点があり、物理的な負荷のかからない用途では問題無いが、例えば、壁紙や窓ガラス用フィルムといった用途では、傷付きや光触媒性微粒子の脱離等が問題となっており、その改良が望まれている。
As materials having photocatalytic activity, various compounds having semiconductor characteristics, such as metal oxides such as titanium dioxide, iron oxide, tungsten oxide, and zinc oxide, metal sulfides such as cadmium sulfide and zinc sulfide, are known. Of these, titanium dioxide, particularly anatase titanium dioxide, is useful as a practical photocatalyst. This titanium dioxide exhibits excellent photocatalytic activity by absorbing light of a specific wavelength in the ultraviolet region contained in daily light such as sunlight.
Recently, materials that exhibit photocatalytic activity even under visible light have been developed.
As described above, various studies have been made to develop various functions by forming a layer containing a compound having photocatalytic activity on the outermost layer. However, the layer containing a compound having photocatalytic activity is resistant to scratches. However, there is no problem in applications where physical load is not applied. For example, in applications such as wallpaper and window glass films, there are problems such as scratches and the removal of photocatalytic fine particles. Is desired.
本発明は、光触媒活性を有し、かつ耐傷付き性に優れるフィルムの提供を目的とするものである。 The object of the present invention is to provide a film having photocatalytic activity and excellent scratch resistance.
すなわち、本発明の要旨とするところは、(1)合成樹脂製フィルムの片面側に、光触媒活性を有する酸化物半導体微粒子及び、メタクリル酸メチルに由来する構造単位とメタクリル酸ブチルに由来する構造単位を有するアクリル系共重合体を含有する光触媒層を有する積層フィルムであって、該光触媒層の表面の算術平均粗さRaが0.3μm以下で、かつ十点平均粗さRzが1.0μm以下である積層フィルム、(2)光触媒活性を有する酸化物半導体微粒子の平均粒子径が3〜300nmである(1)に記載の積層フィルム、(3)光触媒層が、光触媒活性を有する酸化物半導体微粒子20〜70重量%、アクリル系共重合体30〜80重量%を含有する(1)または(2)に記載の積層フィルム、(4)合成樹脂製フィルムと光触媒層との間に、有機−無機複合樹脂を主成分とする層を有する(1)〜(3)のいずれかに記載の積層フィルム、(5)有機−無機複合樹脂が、オルガノポリシロキサンとシリル基含有ビニル系重合体とを反応させて得られる重合体である(4)に記載の積層フィルム、(6)アクリル系共重合体が、メタクリル酸メチル5〜50重量%、メタクリル酸ブチル40〜90重量%、及びこれらと共重合可能な単量体0〜40重量%を重合して得られる共重合体である(1)〜(5)のいずれかに記載の積層フィルム、(7)合成樹脂製フィルムが、ポリオレフィン系樹脂製を50〜100重量%含有する(1)〜(6)のいずれかに記載の積層フィルム及び(8)(1)〜(7)のいずれかに記載の積層フィルムの合成樹脂製フィルム側表面に粘着剤層を形成してなる粘着フィルムに存する。 That is, the gist of the present invention is that (1) on one side of a synthetic resin film, oxide semiconductor fine particles having photocatalytic activity, a structural unit derived from methyl methacrylate, and a structural unit derived from butyl methacrylate A laminated film having a photocatalyst layer containing an acrylic copolymer having an arithmetic average roughness Ra of 0.3 μm or less and a ten-point average roughness Rz of 1.0 μm or less. (2) The laminated film according to (1), wherein the average particle diameter of the oxide semiconductor fine particles having photocatalytic activity is 3 to 300 nm, and (3) the oxide semiconductor fine particles having a photocatalytic layer having photocatalytic activity The laminated film according to (1) or (2) containing 20 to 70% by weight and 30 to 80% by weight of an acrylic copolymer, (4) a synthetic resin film and a photocatalyst layer A laminated film according to any one of (1) to (3), wherein the organic-inorganic composite resin is composed of an organopolysiloxane and a silyl group. The laminated film according to (4), which is a polymer obtained by reacting with a vinyl-containing polymer, and (6) an acrylic copolymer is 5 to 50% by weight of methyl methacrylate, 40 to 90 of butyl methacrylate. The laminated film according to any one of (1) to (5), which is a copolymer obtained by polymerizing 0% to 40% by weight of a monomer copolymerizable therewith, and (7) a synthetic resin The laminated film according to any one of (1) to (6) and the laminated film according to any one of (8) (1) to (7), wherein the film-made film contains 50 to 100% by weight of a polyolefin resin. Adhered to the surface of the synthetic resin film It consists in the adhesive film obtained by forming a layer.
本発明の積層フィルムは、光触媒活性を有し、かつ光触媒層の表面の耐傷付性に優れるため、壁紙を始めとし、表示用のフィルムや装飾フィルム等各種フィルム用途に極めて有用である。 Since the laminated film of the present invention has photocatalytic activity and is excellent in scratch resistance on the surface of the photocatalyst layer, it is very useful for various film applications such as wallpaper and display films and decorative films.
以下に本発明の詳細を説明する。
本発明の積層体は、合成樹脂製フィルムの片面に、光触媒活性を有する酸化物半導体微粒子、及び、メタクリル酸メチルに由来する構造単位とメタクリル酸ブチルに由来する構造単位を構造単位として有するアクリル系共重合体を含有する光触媒層を有している。
Details of the present invention will be described below.
The laminate of the present invention comprises an acrylic semiconductor fine particle having photocatalytic activity on one side of a synthetic resin film, and a structural unit derived from methyl methacrylate and a structural unit derived from butyl methacrylate as a structural unit. It has a photocatalyst layer containing a copolymer.
該合成樹脂製フィルムを構成する樹脂としては、例えばポリメチルメタクリレート等のアクリル系樹脂、ポリスチレンやABS樹脂等のスチレン系樹脂、ポリエチレン系樹脂やポリプロピレン系樹脂及びこれらの混合物等のポリオレフィン系樹脂、ポリエチレンテレフタレートやポリエチレンナフタレート等のポリエステル系樹脂、6−ナイロンや6,6−ナイロン等のポリアミド系樹脂、ポリ塩化ビニル系樹脂、ポリカーボネート系樹脂、ポリフェニレンサルファイド系樹脂、ポリフェニレンエーテル系樹脂、ポリイミド系樹脂、セルロースアセテート等のセルロース系樹脂、ポリフッ化ビニリデン、フッ化エチレン−プロピレン共重合体、フッ化エチレン−エチレン共重合体等のフッ素系樹脂等を挙げることができる。これらの樹脂は1種を単独で用いてもよいし、2種以上を組み合わせて用いてもよい。更にポリエチレン系樹脂としては、エチレンの単独重合体、エチレンを主成分とするエチレンと共重合可能な他の単量体との共重合体(低密度ポリエチレン(LDPE)、高圧法低密度ポリエチレン、線状低密度ポリエチレン(LLDPE)、高密度ポリエチレン(HDPE)、メタロセン系触媒を用いて重合して得られたエチレン−α−オレフィン共重合体(メタロセン系ポリエチレン)等)及びこれらの混合物等が例示できる。ポリプロピレン系樹脂としては、プロピレンの単独重合体(ホモポリプロピレン)、プロピレンの共重合体、リアクター型のポリプロピレン系熱可塑性エラストマー及びこれらの混合物等が例示できる。前記プロピレンの共重合体としてはプロピレンとエチレンまたは他のα−オレフィンとのランダム共重合体(ランダムポリプロピレン)、またはブロック共重合体(ブロックポリプロピレン)、ゴム成分を含むブロック共重合体あるいはグラフト共重合体等が挙げられる。前記プロピレンと共重合可能な他のα−オレフィンとしては、炭素原子数が4〜12のものが好ましく、例えば、1−ブテン、1−ペンテン、1−ヘキセン、1−ヘプテン、1−オクテン、4−メチル−1−ペンテン、1−デセン等が挙げられ、その1種または2種以上の混合物が用いられる。通常、α−オレフィンの混合割合はプロピレンに対して1〜10重量%程度である。 Examples of the resin constituting the synthetic resin film include acrylic resins such as polymethyl methacrylate, styrene resins such as polystyrene and ABS resins, polyolefin resins such as polyethylene resins and polypropylene resins, and mixtures thereof, polyethylene Polyester resins such as terephthalate and polyethylene naphthalate, polyamide resins such as 6-nylon and 6,6-nylon, polyvinyl chloride resins, polycarbonate resins, polyphenylene sulfide resins, polyphenylene ether resins, polyimide resins, Examples thereof include cellulose resins such as cellulose acetate, fluorine resins such as polyvinylidene fluoride, fluorinated ethylene-propylene copolymer, and fluorinated ethylene-ethylene copolymer. These resins may be used alone or in combination of two or more. Furthermore, polyethylene resins include homopolymers of ethylene, copolymers of ethylene as a main component and other monomers copolymerizable with ethylene (low density polyethylene (LDPE), high pressure method low density polyethylene, wire And low density polyethylene (LLDPE), high density polyethylene (HDPE), ethylene-α-olefin copolymer (metallocene polyethylene) obtained by polymerization using a metallocene catalyst, and mixtures thereof. . Examples of the polypropylene resin include a propylene homopolymer (homopolypropylene), a propylene copolymer, a reactor type polypropylene thermoplastic elastomer, and a mixture thereof. The propylene copolymer may be a random copolymer of propylene and ethylene or other α-olefin (random polypropylene), a block copolymer (block polypropylene), a block copolymer containing a rubber component, or a graft copolymer. Examples include coalescence. The other α-olefin copolymerizable with propylene is preferably one having 4 to 12 carbon atoms, such as 1-butene, 1-pentene, 1-hexene, 1-heptene, 1-octene, 4 -Methyl-1-pentene, 1-decene, etc. are mentioned, The 1 type (s) or 2 or more types of mixture is used. Usually, the mixing ratio of the α-olefin is about 1 to 10% by weight with respect to propylene.
該フィルム中の合成樹脂の量は50〜100重量%であるのが好ましい。 The amount of synthetic resin in the film is preferably 50 to 100% by weight.
また、該合成樹脂製フィルムには、フィルム劣化の防止目的で、紫外線吸収剤、ヒンダードアミン系光安定剤等の光安定剤を添加することが好ましく、更に、必要に応じ、酸化防止剤、充填剤、顔料、耐水化剤、分散剤、消泡剤等を配合することができる。
紫外線吸収剤としては、2−(2'−ヒドロキシ−3'ラウリル−5'−メチルフェニル)ベンゾトリアゾール、メチル−3−[3−t−ブチル−5−(2H−ベンゾトリアゾール−2−イル)−4−ヒドロキシフェニル]プロピオネート−ポリエチレングリコールの縮合物及びヒドロキシフェニルベンゾトリアゾール誘導体等が挙げられる。
ヒンダードアミン系光安定剤としては、ビス(2,2,6,6−テトラメチル−4−ピペリジル)セバケート、ビス(1,2,2,6,6−ペンタメチル−4−ピペリジル)セバケート、2−(3,5−ジ−t−ブチル−4−ヒドロキシベンジル)−2−n−ブチルマロン酸ビス(1,2,2,6,6−ペンタメチル−4−ピペリジル)、コハク酸ジメチル−1−(2−ヒドロキシエチル)−4−ヒドロキシ−2,2,6,6−テトラメチルピペリジン重縮合物及びリ[{6−(1,1,3,3−テトラメチルブチル)アミノ−1,3,5−トリアジン−2,4−ジイル}{(2,2,6,6−テトラメチル−4−ピペリジル)イミノ}ヘキサメチレン{(2,2,6,6−テトラメチル−4−ピペリジル)イミノ}]等が挙げられる。
In addition, for the purpose of preventing film deterioration, it is preferable to add a light stabilizer such as an ultraviolet absorber or a hindered amine light stabilizer to the synthetic resin film, and if necessary, an antioxidant or a filler. , Pigments, water resistance agents, dispersants, antifoaming agents, and the like can be blended.
As UV absorbers, 2- (2′-hydroxy-3′lauryl-5′-methylphenyl) benzotriazole, methyl-3- [3-tert-butyl-5- (2H-benzotriazol-2-yl) -4-hydroxyphenyl] propionate-polyethylene glycol condensates and hydroxyphenylbenzotriazole derivatives.
Examples of hindered amine light stabilizers include bis (2,2,6,6-tetramethyl-4-piperidyl) sebacate, bis (1,2,2,6,6-pentamethyl-4-piperidyl) sebacate, 2- ( 3,5-di-t-butyl-4-hydroxybenzyl) -2-n-butylmalonate bis (1,2,2,6,6-pentamethyl-4-piperidyl), dimethyl succinate-1- (2 -Hydroxyethyl) -4-hydroxy-2,2,6,6-tetramethylpiperidine polycondensate and li [{6- (1,1,3,3-tetramethylbutyl) amino-1,3,5- Triazine-2,4-diyl} {(2,2,6,6-tetramethyl-4-piperidyl) imino} hexamethylene {(2,2,6,6-tetramethyl-4-piperidyl) imino}] and the like Is mentioned.
紫外線吸収剤及びヒンダードアミン系光安定剤の配合量は各々単独または併用した場合でも、フィルムの樹脂成分100重量部に対し0.1〜10重量部の範囲とすることが好ましい。
合成樹脂製フィルムの製造方法としては、Tダイ押出し成形法、インフレーション成形法及びカレンダー成形法等の従来既知の方法より、樹脂の物性を考慮して適宜選定すればよく、特に限定されない。
合成樹脂製フィルムの厚さは、その用途により異なるが、通常20〜300μmであるのが好ましい。
The blending amounts of the ultraviolet absorber and the hindered amine light stabilizer are preferably in the range of 0.1 to 10 parts by weight with respect to 100 parts by weight of the resin component of the film, even when used alone or in combination.
The method for producing the synthetic resin film is not particularly limited as long as it is appropriately selected in consideration of the physical properties of the resin from conventionally known methods such as a T-die extrusion molding method, an inflation molding method and a calender molding method.
Although the thickness of the synthetic resin film varies depending on the application, it is usually preferably 20 to 300 μm.
更に合成樹脂製フィルムは、該フィルムに積層する他の層との密着性を向上させる為に、予め該フィルム表面に易接着処理を施してもよい。
易接着処理としては、公知のコロナ放電処理、プラズマ処理、オゾン処理または火炎処理等の方法が挙げられる。
Furthermore, the synthetic resin film may be subjected to easy adhesion treatment on the surface of the film in advance in order to improve adhesion with other layers laminated on the film.
Examples of the easy adhesion treatment include known methods such as corona discharge treatment, plasma treatment, ozone treatment, and flame treatment.
光触媒層中の光触媒活性を有する酸化物半導体微粒子(以下、「光触媒活性微粒子」と記す)としては、特に制限はなく、従来公知のもの、例えば二酸化チタン、チタン酸ストロンチウム(SrTiO3)、チタン酸バリウム(BaTi4O9)、チタン酸ナトリウム(Na2Ti6O13)、二酸化ジルコニウム、α−Fe2O3、酸化タングステン、K4Nb6O17、Rb4Nb6O17、K2Rb2Nb6O17、硫化カドミウム、硫化亜鉛等を挙げることができる。これらは1種を単独で用いてもよいし、2種以上を組み合わせて用いてもよいが、これらの中で、二酸化チタン、特にアナターゼ型二酸化チタンは実用的な光触媒活性材料として有用である。この二酸化チタンは、太陽光等の日常光に含まれる紫外線領域の特定波長の光を吸収することによって優れた光触媒活性を示す。光触媒活性微粒子の平均粒子径は、3〜300nmが好ましく、特に好ましくは5〜100nmである。平均粒子径が3nmより小さいと塗布液とした場合の保存安定性が悪くなり、また、300nmより大きいと耐傷付き性が低下する傾向となるので好ましくない。なお、平均粒子径は例えばレーザー回析法により求めることができる。 The oxide semiconductor fine particles having photocatalytic activity in the photocatalytic layer (hereinafter referred to as “photocatalytically active fine particles”) are not particularly limited, and are conventionally known, for example, titanium dioxide, strontium titanate (SrTiO 3 ), titanic acid. Barium (BaTi 4 O 9 ), sodium titanate (Na 2 Ti 6 O 13 ), zirconium dioxide, α-Fe 2 O 3 , tungsten oxide, K 4 Nb 6 O 17 , Rb 4 Nb 6 O 17 , K 2 Rb 2 Nb 6 O 17 , cadmium sulfide, zinc sulfide and the like can be mentioned. These may be used alone or in combination of two or more. Among these, titanium dioxide, particularly anatase titanium dioxide, is useful as a practical photocatalytically active material. This titanium dioxide exhibits excellent photocatalytic activity by absorbing light of a specific wavelength in the ultraviolet region contained in daily light such as sunlight. The average particle diameter of the photocatalytically active fine particles is preferably from 3 to 300 nm, particularly preferably from 5 to 100 nm. If the average particle size is smaller than 3 nm, the storage stability in the case of a coating solution is deteriorated, and if it is larger than 300 nm, the scratch resistance tends to decrease, which is not preferable. In addition, an average particle diameter can be calculated | required by the laser diffraction method, for example.
また、光触媒活性微粒子は、その性能を損なわない範囲で、表面をシリカやアパタイトで処理したものを用いることもできる。また、光触媒活性微粒子とシリカを併用してもよい。
更に、光触媒層には、光触媒活性を促進させる目的で、光触媒微粒子と共に、所望により従来公知の光触媒促進剤を含有させることができる。この光触媒促進剤としては、例えば白金、パラジウム、ロジウム、ルテニウム等の白金族金属が好ましく挙げられる。これらは単独で用いてもよいし、2種以上を組み合わせて用いてもよい。この光触媒促進剤の添加量は、光触媒活性の点から、通常、光触媒活性微粒子と光触媒促進剤との合計重量中、1〜20重量%の範囲であるのが好ましい。
Further, the photocatalytically active fine particles can be used in which the surface is treated with silica or apatite as long as the performance is not impaired. Further, photocatalytically active fine particles and silica may be used in combination.
Further, the photocatalyst layer may contain a conventionally known photocatalyst promoter together with the photocatalyst fine particles, if desired, for the purpose of promoting photocatalytic activity. Preferred examples of the photocatalyst promoter include platinum group metals such as platinum, palladium, rhodium, and ruthenium. These may be used alone or in combination of two or more. In general, the amount of the photocatalyst promoter added is preferably in the range of 1 to 20% by weight in the total weight of the photocatalytically active fine particles and the photocatalyst promoter from the viewpoint of photocatalytic activity.
光触媒層に使用されるアクリル系共重合体は、メタクリル酸メチル由来の構造単位とメタクリル酸ブチル由来の構造単位を構造単位として有する、特に主な構造単位として有するアクリル系共重合体がよく、中でも、メタクリル酸メチル5〜50重量%、メタクリル酸ブチル40〜90重量%、及びこれらと共重合可能な単量体0〜40重量%を反応させて得られるものが好ましい。メタクリル酸メチルが5重量%未満、あるいは、メタクリル酸ブチルが90重量%を超えると光触媒層の耐傷付き性が低下する傾向となる。また、メタクリル酸メチルが50重量%を超えたり、メタクリル酸ブチルが40重量%未満になると、光触媒層が脆くなる傾向となる。
メタクリル酸メチル、メタクリル酸ブチルと共重合可能な単量体としては、アクリル酸、メタクリル酸(←実施例に記載があったので追記しました)、アクリル酸アルキルエステル、メタクリル酸メチル及びメタクリル酸ブチル以外のメタクリル酸アルキルエステル、ブタジエン、イソプレン、スチレン、α−メチルスチレン、ビニルトルエン、アクリロニトリル、メタクリロニトリル、N−シクロヘキシルマレイミド、N−エチルマレイミド、N−t−ブチルマレイミド、N−フェニルマレイミド、N−オルソクロロフェニルマレイミド等の不飽和単量体や、エチレングリコールジ(メタ)アクリレート、1,3−ブチレングリコールジ(メタ)アクリレート、ポリエチレングリコールジ(メタ)アクリレート、ジビニルベンゼン、アリルメタクリレート、アリルアクリレート、アリルマレエート、アリルフマレート、ジアリルフマレート、トリアリルシアヌレート等の官能基含有単量体等が挙げられる。これらは単独または併用して用いることができる。
The acrylic copolymer used for the photocatalyst layer has a structural unit derived from methyl methacrylate and a structural unit derived from butyl methacrylate as the structural unit, and particularly an acrylic copolymer having a main structural unit, A compound obtained by reacting 5 to 50% by weight of methyl methacrylate, 40 to 90% by weight of butyl methacrylate, and 0 to 40% by weight of a monomer copolymerizable therewith is preferable. When the methyl methacrylate is less than 5% by weight or the butyl methacrylate exceeds 90% by weight, the scratch resistance of the photocatalyst layer tends to be lowered. Moreover, when methyl methacrylate exceeds 50% by weight or butyl methacrylate is less than 40% by weight, the photocatalyst layer tends to become brittle.
As monomers that can be copolymerized with methyl methacrylate and butyl methacrylate, acrylic acid, methacrylic acid (← added because it was described in the Examples), alkyl acrylate, methyl methacrylate, and butyl methacrylate Other than methacrylic acid alkyl ester, butadiene, isoprene, styrene, α-methylstyrene, vinyl toluene, acrylonitrile, methacrylonitrile, N-cyclohexylmaleimide, N-ethylmaleimide, Nt-butylmaleimide, N-phenylmaleimide, N -Unsaturated monomers such as orthochlorophenylmaleimide, ethylene glycol di (meth) acrylate, 1,3-butylene glycol di (meth) acrylate, polyethylene glycol di (meth) acrylate, divinylbenzene, allyl Methacrylate, allyl acrylate, diallyl maleate, diallyl fumarate, diallyl fumarate, functional group-containing monomer such as triallyl cyanurate. These can be used alone or in combination.
光触媒層の光触媒活性微粒子とアクリル系共重合体の含有量は、光触媒活性微粒子20〜70重量%、アクリル系共重合体樹脂30〜80重量%であるのが好ましく、光触媒活性微粒子の量が20重量%未満だと脱臭、抗菌、防汚といった光触媒機能が充分でない恐れがあり、また70重量%を超えると耐傷付き性が低下する傾向となる。
光触媒層の平均厚さは、0.1〜5μm、好ましくは0.2〜1μmである。0.1μmより薄いと十分な光触媒機能が得られにくくなり、また、5μmを超えても光触媒機能はほとんど向上しない。
合成樹脂製フィルムへの光触媒層の形成は、例えば、上記光触媒活性微粒子、アクリル系共重合体、及び必要に応じその他の各成分を混合した組成物をイソプロピルアルコール、メチルエチルケトン、水等公知の溶剤に分散し、更に必要に応じ上記溶媒を用いて適当な濃度に調製し、合成樹脂製フィルムに、バーコート、ナイフコート、ロールコート、ダイコートまたはグラビアロールコート等の公知の方法で塗工し、次いで熱風乾燥機等を用いて、通常50〜200℃で数秒間〜数分加熱して乾燥させることにより行えばよい。
また、光触媒活性微粒子は、粉末状態で混合することも可能であるが、スラリー状、あるいはゾル状に調製してから混合するのが好ましく、必要な性状や物性等が満たされていれば、市販の二酸化チタンスラリーやゾルを使用しても良い。
The content of the photocatalytically active fine particles and the acrylic copolymer in the photocatalyst layer is preferably 20 to 70% by weight of the photocatalytic active fine particles and 30 to 80% by weight of the acrylic copolymer resin, and the amount of the photocatalytic active fine particles is 20%. If it is less than% by weight, the photocatalytic functions such as deodorization, antibacterial action and antifouling may be insufficient, and if it exceeds 70% by weight, the scratch resistance tends to be lowered.
The average thickness of the photocatalyst layer is 0.1 to 5 μm, preferably 0.2 to 1 μm. If it is thinner than 0.1 μm, it is difficult to obtain a sufficient photocatalytic function, and the photocatalytic function is hardly improved even if it exceeds 5 μm.
Formation of the photocatalyst layer on the synthetic resin film can be achieved, for example, by mixing the composition obtained by mixing the photocatalytic active fine particles, the acrylic copolymer, and other components as necessary with a known solvent such as isopropyl alcohol, methyl ethyl ketone, and water. Disperse and adjust to a suitable concentration using the above-mentioned solvent as necessary, and apply to a synthetic resin film by a known method such as bar coating, knife coating, roll coating, die coating or gravure roll coating, What is necessary is just to carry out by heating for several seconds-several minutes normally at 50-200 degreeC using a hot air dryer etc., and drying.
The photocatalytically active fine particles can be mixed in a powder state, but it is preferable to mix them after preparing them in a slurry or sol form, and if the necessary properties and physical properties are satisfied, they are commercially available. Alternatively, a titanium dioxide slurry or sol may be used.
本発明の積層フィルムは、光触媒層表面のJIS B 601に規定された算術平均粗さRaが0.3μm以下、好ましくは0.2μm以下で、かつ十点平均粗さRzが1.0μm以下、好ましくは0.8μm以下である。Ra、Rzが上記範囲を超えると、光触媒層の耐傷付き性が著しく低下する傾向となる。また、特に制限はないが、通常、Raの下限は0.01μm程度、Rzの下限は0.05μm程度である。 The laminated film of the present invention has an arithmetic average roughness Ra specified in JIS B 601 of the surface of the photocatalyst layer of 0.3 μm or less, preferably 0.2 μm or less, and a ten-point average roughness Rz of 1.0 μm or less. Preferably it is 0.8 micrometer or less. When Ra and Rz exceed the above ranges, the scratch resistance of the photocatalyst layer tends to be remarkably lowered. Further, although there is no particular limitation, usually, the lower limit of Ra is about 0.01 μm, and the lower limit of Rz is about 0.05 μm.
更に、本発明の積層フィルムは、積層フィルムの耐久性を向上させたり、光触媒層の合成樹脂製フィルムとの密着性を向上させる目的で、光触媒層と合成樹脂製フィルムの間に、有機−無機複合樹脂(ポリマー)を主成分とする層を形成するのが好ましい。有機−無機複合樹脂は該層中50〜100重量%であるのが好ましい。
有機−無機複合樹脂としては、オルガノアルコキシシランの加水分解物またはその部分縮合物であるオルガノポリシロキサンと、水酸基または加水分解性基と結合したケイ素原子を有するシリル基を重合体中に少なくとも1個有するシリル基含有ビニル系重合体とを反応させて得られるハイブリッドポリマー等があげられる。
Furthermore, the laminated film of the present invention is an organic-inorganic layer between the photocatalyst layer and the synthetic resin film for the purpose of improving the durability of the laminated film or improving the adhesion of the photocatalyst layer to the synthetic resin film. It is preferable to form a layer mainly composed of a composite resin (polymer). The organic-inorganic composite resin is preferably 50 to 100% by weight in the layer.
As the organic-inorganic composite resin, at least one silyl group having a silicon atom bonded to a hydroxyl group or a hydrolyzable group and an organopolysiloxane that is a hydrolyzate of organoalkoxysilane or a partial condensate thereof is contained in the polymer. Examples thereof include a hybrid polymer obtained by reacting with a silyl group-containing vinyl polymer.
オルガノアルコキシシランの具体例としては、メチルトリメトキシシラン、メチルトリエトキシシラン、メチルトリアセトキシシラン、メチルトリイソプロポキシシラン、ジメチルジメトキシシラン、エチルトリメトキシシラン、エチルトリエトキシシラン、エチルトリイソプロポキシシラン、ノルマルプロピルトリメトキシシラン、イソプロピルトリメトキシシラン、ブチルトリメトキシシラン、ペンチルトリメトキシシラン、ヘキシルトリメトキシシラン、オクチルトリメトキシシラン、γ−クロロプロピルトリエトキシシラン、γ−クロロプロピルトリエトキシシラン、ビニルトリメトキシシラン、ビニルトリエトキシシラン、トリフルオロプロピルトリメトキシシラン、γ−グリシドキシプロピルトリメトキシシラン、γ−メタクリロキシプロピルトリメトキシシラン、γ−メタクリロキシプロピルトリエトキシシラン、γ−メルカプトプロピルトリメトキシシラン、γ−メルカプトプロピルトリエトキシシラン、フェニルトリメトキシシラン、フェニルトリエトキシシラン、3,4−エポキシシクロヘキシルエチルトリメトキシシラン等を挙げることができる。これら、オルガノアルコキシシランは、1種単独でも2種以上でも使用することができる。 Specific examples of the organoalkoxysilane include methyltrimethoxysilane, methyltriethoxysilane, methyltriacetoxysilane, methyltriisopropoxysilane, dimethyldimethoxysilane, ethyltrimethoxysilane, ethyltriethoxysilane, ethyltriisopropoxysilane, N-propyltrimethoxysilane, isopropyltrimethoxysilane, butyltrimethoxysilane, pentyltrimethoxysilane, hexyltrimethoxysilane, octyltrimethoxysilane, γ-chloropropyltriethoxysilane, γ-chloropropyltriethoxysilane, vinyltrimethoxy Silane, vinyltriethoxysilane, trifluoropropyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, γ-methacrylo Cypropyltrimethoxysilane, γ-methacryloxypropyltriethoxysilane, γ-mercaptopropyltrimethoxysilane, γ-mercaptopropyltriethoxysilane, phenyltrimethoxysilane, phenyltriethoxysilane, 3,4-epoxycyclohexylethyltrimethoxy A silane etc. can be mentioned. These organoalkoxysilanes can be used alone or in combination of two or more.
また、オルガノアルコキシシランの加水分解物および/またはその部分縮合物であるオルガノポリシロキサンの製造法は既に公知であり、多くの方法が提案されており、例えば、特公昭52−39691に開示される方法によって実施することができる。すなわち、その方法は前記オルガノアルコキシシランに所定量の水を加え、加熱することにより、加水分解、縮合を行わせる工程からなっている。
有機−無機複合樹脂に用いられるシリル基含有ビニル系重合体は、主鎖が炭素骨格のビニル系重合体からなり、末端あるいは、側鎖に水酸基もしくは加水分解性基と結合したケイ素原子を有するシリル基を重合体中に少なくとも1個有するものが好ましい。該シリル基の多くは、一般式(1):−Si(R1)3−nXnで示される。一般式(1)中、Xは水酸基、アルコキシ基、アシロキシ基、アミノ基、フェノキシ基、アルキルスルフィド基等の加水分解性基、nは1〜3の正の整数である。ここでXのうちアルコキシ基としてはメトキシ基、エトキシ基、プロポキシ基等が挙げられ、アシロキシ基としてはアセチル基、プロピオニル基等が挙げられ、アルキルスルフィド基としてはメチルスルフィド、エチルスルフィド基等を挙げることができるが、好ましいものとしては、水酸基、メトキシ基、エトキシ基、プロポキシ基等のアルコキシ基が挙げられる。
In addition, a method for producing an organoalkoxysilane hydrolyzate and / or an organopolysiloxane which is a partial condensate thereof has already been known, and many methods have been proposed, for example, disclosed in JP-B-52-39691. It can be implemented by a method. That is, the method comprises the steps of adding a predetermined amount of water to the organoalkoxysilane and heating it to cause hydrolysis and condensation.
The silyl group-containing vinyl polymer used in the organic-inorganic composite resin is a silyl group having a silicon atom bonded to a hydroxyl group or a hydrolyzable group at the terminal or side chain of a vinyl polymer having a carbon skeleton as the main chain. Those having at least one group in the polymer are preferred. Most of the silyl groups are represented by the general formula (1): —Si (R 1 ) 3-n Xn . In general formula (1), X is a hydrolyzable group such as a hydroxyl group, an alkoxy group, an acyloxy group, an amino group, a phenoxy group, or an alkyl sulfide group, and n is a positive integer of 1 to 3. In X, the alkoxy group includes a methoxy group, an ethoxy group, a propoxy group, and the like, the acyloxy group includes an acetyl group, a propionyl group, and the like, and the alkyl sulfide group includes a methyl sulfide, an ethyl sulfide group, and the like. Preferred examples include alkoxy groups such as a hydroxyl group, a methoxy group, an ethoxy group, and a propoxy group.
また、R1としては、水素原子;メチル基、エチル基、プロピル基、シクロヘキシル基、オクチル基、ノニル基、デシル基等の炭素数1〜10のアルキル基;フェニル基、トリル基、キシリル基等のアリール基;ベンジル基、フェネチル基、アラルキル基を挙げることができる。
かかるシリル基含有ビニル系重合体は、例えば、一般式(2):R2−Si(R3)3−nXn(式中、R3、Xおよびnは前記一般式(1)と同様であり、R2は例えばビニル、2−プロペニル、3−アクリロキシプロピル、3−メタクリロキシプロピル、4−ビニルフェニル、2−(4−ビニル)フェニルエチル等の重合性2重結合を有する有機基である)で示されるシラン化合物とビニル系化合物と必要に応じこれらと共重合可能な化合物とをラジカル発生化合物の存在下、一般的な方法により共重合することにより製造することができる。ここでビニル系化合物としては前記一般式(2)のシラン化合物との付加体が得られる限りとくに制限を受けるものではなく、例えば、(メタ)アクリル酸メチル、(メタ)アクリル酸エチル、(メタ)アクリル酸ブチル、(メタ)アクリル酸2−エチルヘキシル、(メタ)アクリル酸シクロヘキシル、(メタ)アクリル酸2−ヒドロキシエチル等の(メタ)アクリル酸アルキルエステル類、(メタ)アクリル酸、イタコン酸、フマル酸等の不飽和カルボン酸および無水マレイン酸等の酸無水物、グリシジル(メタ)アクリレ−ト等のエポキシ化合物、ジメチルアミノエチル(メタ)アクリレ−ト、アミノエチルビニルエ−テル等のアミノ化合物、(メタ)アクリルアミド、クロトンアミド、イタコン酸アミド、マレイン酸ジアミド等のアミド化合物、アクリロニトリル、メタクリロニトリル、スチレン、α−メチルスチレン、塩化ビニル、酢酸ビニル、プロピオン酸ビニル等が挙げられる。また、これらと共重合可能な化合物としては、1,1,1−トリメチルアミンメタクリルイミド、4−(メタ)アクリロイルオキシ−2,2,6,6−テトラメチルピペリジン等が挙げられる。
R 1 represents a hydrogen atom; an alkyl group having 1 to 10 carbon atoms such as a methyl group, an ethyl group, a propyl group, a cyclohexyl group, an octyl group, a nonyl group, or a decyl group; a phenyl group, a tolyl group, a xylyl group, or the like An aryl group of: benzyl group, phenethyl group and aralkyl group.
Such a silyl group-containing vinyl polymer is, for example, represented by the general formula (2): R 2 —Si (R 3 ) 3−n X n (wherein R 3 , X and n are the same as in the general formula (1)). R 2 is an organic group having a polymerizable double bond such as vinyl, 2-propenyl, 3-acryloxypropyl, 3-methacryloxypropyl, 4-vinylphenyl, 2- (4-vinyl) phenylethyl, etc. Can be produced by copolymerizing a silane compound, a vinyl compound, and a compound copolymerizable therewith by a general method in the presence of a radical generating compound. Here, the vinyl compound is not particularly limited as long as an adduct with the silane compound of the general formula (2) is obtained. For example, methyl (meth) acrylate, ethyl (meth) acrylate, (meth ) (Meth) acrylic acid alkyl esters such as butyl acrylate, (meth) acrylic acid 2-ethylhexyl, (meth) acrylic acid cyclohexyl, (meth) acrylic acid 2-hydroxyethyl, (meth) acrylic acid, itaconic acid, Unsaturated carboxylic acids such as fumaric acid and acid anhydrides such as maleic anhydride, epoxy compounds such as glycidyl (meth) acrylate, amino compounds such as dimethylaminoethyl (meth) acrylate and aminoethyl vinyl ether , (Meth) acrylamide, crotonamide, itaconic acid amide, maleic acid diamide, etc. Compound, acrylonitrile, methacrylonitrile, styrene, alpha-methyl styrene, vinyl chloride, vinyl acetate and vinyl propionate. Moreover, 1,1,1-trimethylamine methacrylimide, 4- (meth) acryloyloxy-2,2,6,6-tetramethylpiperidine etc. are mentioned as a compound copolymerizable with these.
このようにして製造されるシリル基含有ビニル系重合体中の前記一般式(2)で表わされるシラン化合物に由来する構造単位の割合はSi元素換算で、通常、0.01〜20重量%、好ましくは0.1〜10重量%であり、0.01重量%未満では密着性向上の効果は小さくなる傾向となり、また20重量%を超えると塗布液とした際の保存安定性が低下する場合があるので好ましくない。
ハイブリッドポリマーとしては、オルガノポリシロキサン30〜70重量%、シリル基含有ビニル系重合体70〜30重量%を反応させて得られるものが特に好ましく、オルガノポリシロキサンの量が30重量%未満、あるいは70重量%を超えると耐久性向上効果が小さくなる傾向となる。
有機−無機複合樹脂よりなる層の形成は、上記、光触媒層の形成と同様に、有機−無機複合樹脂を公知の有機溶剤に溶解、または分散させて、公知の塗工方法で塗布し、乾燥させればよい。
本発明の積層フィルムは、合成樹脂製フィルムの光触媒層を形成させる面と反対側の面に、必要に応じ粘着剤層を設けることができる。この粘着剤層を形成する粘着剤の種類は特に限定されるものではなく、例えば、天然ゴム系、合成ゴム系、アクリル系、ウレタン系、ビニルエーテル系、シリコーン系、アミド系及びスチレン系粘着剤、スチレン系エラストマー、オレフィン系エラストマー及びエチレン系不飽和カルボン酸やその無水物でグラフト変性された酸変性オレフィン樹脂等の各種粘着剤が好適に用いられ、また、その形態は、溶液型、エマルジョン型、ホットメルト型等いずれであってもよい。前記粘着剤層には、粘着特性の制御等を目的として必要に応じて、例えばα−ピネンやβ−ピネン重合体、ジテルペン重合体、α−ピネン・フェノール共重合体等のテルペン系樹脂、脂肪族系や芳香族系、脂肪族・芳香族共重合体系等の炭化水素系樹脂、その他ロジン系樹脂やクマロンインデン系樹脂、(アルキル)フェノール系樹脂やキシレン系樹脂等適当な粘着付与剤を配合できる。さらに、液状ポリマーやパラフィン系オイル等の軟化剤、充填剤、顔料、酸化防止剤、安定剤、紫外線吸収剤等、用途等に応じて必要な種々の添加剤が配合できる。
The proportion of the structural unit derived from the silane compound represented by the general formula (2) in the silyl group-containing vinyl polymer thus produced is usually 0.01 to 20% by weight in terms of Si element. Preferably, it is 0.1 to 10% by weight. If it is less than 0.01% by weight, the effect of improving the adhesion tends to be small. This is not preferable.
As the hybrid polymer, those obtained by reacting 30 to 70% by weight of organopolysiloxane and 70 to 30% by weight of a silyl group-containing vinyl polymer are particularly preferable, and the amount of organopolysiloxane is less than 30% by weight, or 70 If it exceeds wt%, the durability improving effect tends to be small.
In the same manner as the formation of the photocatalyst layer, the organic-inorganic composite resin is formed by dissolving or dispersing the organic-inorganic composite resin in a known organic solvent, applying it by a known coating method, and drying. You can do it.
In the laminated film of the present invention, an adhesive layer can be provided on the surface opposite to the surface on which the photocatalyst layer of the synthetic resin film is formed, if necessary. The type of pressure-sensitive adhesive that forms this pressure-sensitive adhesive layer is not particularly limited. For example, natural rubber-based, synthetic rubber-based, acrylic-based, urethane-based, vinyl ether-based, silicone-based, amide-based and styrene-based pressure-sensitive adhesives, Various adhesives such as styrene-based elastomers, olefin-based elastomers, and acid-modified olefin resins graft-modified with ethylenically unsaturated carboxylic acids and anhydrides thereof are preferably used. Any of hot melt type and the like may be used. For the purpose of controlling the adhesive properties, the pressure-sensitive adhesive layer may include, for example, terpene resins such as α-pinene, β-pinene polymer, diterpene polymer, α-pinene / phenol copolymer, fat Suitable tackifiers such as aromatic resins, aromatic resins, aliphatic / aromatic copolymer resins, rosin resins, coumarone indene resins, (alkyl) phenol resins, xylene resins, etc. Can be blended. Furthermore, various additives required according to the use, such as softeners such as liquid polymers and paraffinic oils, fillers, pigments, antioxidants, stabilizers, ultraviolet absorbers, and the like can be blended.
以下に本発明の実施形態について実施例を用いて詳述するが、本発明はその要旨を越えない限り以下の実施例に限定されるものではない。
(1)合成樹脂製フィルムの作成
(A)プロピレンランダム共重合体(グランドポリマー(株)製、グランドポリプロF327)100重量部、ヒンダードアミン系光安定剤(チバ・スペシャリティ・ケミカルズ(株)製、キマソーブ944)0.1重量部よりなる混合物を用いて、三菱重工(株)製押出成型機により、厚さ0.1mmのポリプロピレン系樹脂フィルムを作成した。
Embodiments of the present invention will be described in detail below with reference to examples, but the present invention is not limited to the following examples unless it exceeds the gist.
(1) Preparation of synthetic resin film (A) 100 parts by weight of propylene random copolymer (Grand Polymer Co., Ltd., Grand Polypro F327), hindered amine light stabilizer (Ciba Specialty Chemicals Co., Ltd., Kimasorb) 944) Using a mixture composed of 0.1 parts by weight, a polypropylene resin film having a thickness of 0.1 mm was prepared by an extruder manufactured by Mitsubishi Heavy Industries, Ltd.
(B)帝人デュポンフィルム株式会社製ポリエステルフィルム(テトロンHB、厚さ50μm)を合成樹脂製フィルムとして使用した。
(2)有機−無機複合樹脂層の形成
a)シリル基含有ビニル系重合体の合成
還流冷却器、攪拌機を備えた反応器に、メチルメタクリレート70重量部、n−ブチルアクリレート40重量部、γ−メタクリロキシプロピルトリメトキシシラン20重量部、アクリル酸5重量部、2−ヒドロキシエチルメタクリレート13重量部、1,1,1−トリメチルアミンメタクリルイミド1重量部、4−(メタ)アクリロイルオキシ−2,2,6,6−テトラメチルピペリジン1重量部、i−プロピルアルコール150重量部、メチルエチルケトン50重量部およびメタノール25重量部を加えて混合したのち、攪拌しながら80℃に加温し、この混合物にアゾビスイソバレロニトリル4重量部をキシレン10重量部に溶解した溶液を30分間かけて滴下したのち、80℃で5時間反応させて固形分濃度40重量%のシリル基含有ビニル系重合体溶液を得た。
b)有機−無機複合樹脂層用塗布液の調製
還流冷却器、撹拌機を備えた反応器に、メチルトリメトキシシラン70重量部、ジメチルジメトキシシラン30重量部、a)で得たシリル基含有ビニル系重合体100重量部、i−ブチルアルコール100重量部、エチレングリコールモノブチルエーテル75重量部、ジ−i−プロポキシエチルアセトアセテートアルミニウム10重量部を加えよく攪拌したのち、攪拌下水30重量部を滴下し、60℃で4時間反応させた。次いで、アセチルアセトン10重量部添加した後、室温まで冷却し固形分濃度30重量%の組成物を得た。得られた組成物100重量部に、i−ブチルアルコール100重量部、プロピレングリコールモノメチルエーテルアセテート100重量部を加えてよく混合したのち、ジオクチルスズジマレエートエステルのi−プロピルアルコール溶液(固形分15重量%)を10重量部添加し、よく攪拌し、有機−無機複合樹脂層用塗布液を得た。
c)有機−無機複合樹脂層の形成
b)で得られた塗布液を、(1)で得られた合成樹脂製フィルムの片面に、グラビアロールコーターで塗工後、80℃の熱風乾燥機内で1分間加熱乾燥させて塗膜層を形成した。なお、乾燥後の塗膜厚さは、1μmであった。
(3)光触媒層の形成
d)アクリル系共重合体の合成
水125重量部、過硫酸カリウム0.025重量部及びポリオキシエチレンアルキルフェニルエーテル誘導体1.0重量部を反応容器中に仕込み、窒素気流下に70℃に昇温した。これにメタクリル酸メチル27重量部、メタクリル酸ブチル70重量部、メタクリル酸4重量部を3時間で滴下し、乳化重合させ、滴下終了後更に3時間反応させ、樹脂固形分濃度45重量%の反応液(水性分散液)を得た。この反応液にアンモニア水を滴下し、PHを7.0に中和し、アクリル系共重合体を得た。
e)光触媒層の形成
d)で得られたアクリル系共重合体、光触媒及びイソプロピルアルコール等を用いて、表−1に記載の配合になるように混合した後、十分に撹拌し、光触媒含有塗布液を調整した。
得られた塗布液を、(1)で得られた合成樹脂フィルム上またはc)で得られた有機−無機複合樹脂層上にグラビアロールコーターで塗工後、80℃の熱風乾燥機内で1分間加熱乾燥させて光触媒層を形成し、積層フィルムを得た。なお、乾燥後の塗膜厚さは、0.5μmであった。
(4)積層フィルムの評価
f)積層フィルムの表面粗さの測定
(3)で得られた積層フィルムの光触媒層の表面粗さ(JIS B 0601に規定された算術平均粗さRa及び十点平均粗さRz)を、株式会社島津製作所製走査型プローブ顕微鏡(SPM−9500J3)を用いて求め、結果を表−2に記載した。
g)耐傷付き性
(3)で得られた積層フィルムの光触媒層の表面を、学振磨耗試験機を用い、以下の条件で摩擦して試験を実施し、試験後の状態を目視観察により以下の基準で評価し、結果を表−2に記載した。
(B) A polyester film (Tetron HB, thickness 50 μm) manufactured by Teijin DuPont Films Ltd. was used as a synthetic resin film.
(2) Formation of organic-inorganic composite resin layer a) Synthesis of silyl group-containing vinyl polymer In a reactor equipped with a reflux condenser and a stirrer, 70 parts by weight of methyl methacrylate, 40 parts by weight of n-butyl acrylate, γ- 20 parts by weight of methacryloxypropyltrimethoxysilane, 5 parts by weight of acrylic acid, 13 parts by weight of 2-hydroxyethyl methacrylate, 1 part by weight of 1,1,1-trimethylamine methacrylamide, 4- (meth) acryloyloxy-2,2, After adding 1 part by weight of 6,6-tetramethylpiperidine, 150 parts by weight of i-propyl alcohol, 50 parts by weight of methyl ethyl ketone and 25 parts by weight of methanol, the mixture was heated to 80 ° C. with stirring. A solution prepared by dissolving 4 parts by weight of isovaleronitrile in 10 parts by weight of xylene is dropped over 30 minutes. And then it was reacted for 5 hours at 80 ° C. to give a solid concentration of 40 wt% of the silyl group-containing vinyl-based polymer solution.
b) Preparation of coating solution for organic-inorganic composite resin layer In a reactor equipped with a reflux condenser and a stirrer, 70 parts by weight of methyltrimethoxysilane, 30 parts by weight of dimethyldimethoxysilane, and a silyl group-containing vinyl obtained in a) After adding 100 parts by weight of a polymer, 100 parts by weight of i-butyl alcohol, 75 parts by weight of ethylene glycol monobutyl ether and 10 parts by weight of di-i-propoxyethyl acetoacetate aluminum, 30 parts by weight of water was added dropwise with stirring. , Reacted at 60 ° C. for 4 hours. Subsequently, 10 parts by weight of acetylacetone was added, and then cooled to room temperature to obtain a composition having a solid content concentration of 30% by weight. After adding 100 parts by weight of i-butyl alcohol and 100 parts by weight of propylene glycol monomethyl ether acetate to 100 parts by weight of the resulting composition and mixing well, an i-propyl alcohol solution of dioctyltin dimaleate ester (solid content 15 10 wt parts) was added and stirred well to obtain a coating solution for organic-inorganic composite resin layer.
c) Formation of organic-inorganic composite resin layer The coating liquid obtained in b) was applied to one side of the synthetic resin film obtained in (1) with a gravure roll coater, and then in a hot air dryer at 80 ° C. A coating layer was formed by heating and drying for 1 minute. The coating thickness after drying was 1 μm.
(3) Formation of photocatalyst layer d) Synthesis of acrylic copolymer 125 parts by weight of water, 0.025 part by weight of potassium persulfate and 1.0 part by weight of polyoxyethylene alkylphenyl ether derivative were charged into a reaction vessel, and nitrogen was added. The temperature was raised to 70 ° C. under an air stream. To this, 27 parts by weight of methyl methacrylate, 70 parts by weight of butyl methacrylate and 4 parts by weight of methacrylic acid were added dropwise over 3 hours, followed by emulsion polymerization, and further reacted for 3 hours after the completion of the addition. A liquid (aqueous dispersion) was obtained. Aqueous ammonia was added dropwise to the reaction solution, and PH was neutralized to 7.0 to obtain an acrylic copolymer.
e) Formation of photocatalyst layer Using the acrylic copolymer obtained in d), photocatalyst, isopropyl alcohol, and the like, after mixing so as to have the composition shown in Table 1, the mixture is sufficiently stirred, and the photocatalyst-containing coating is applied. The liquid was adjusted.
The obtained coating solution is applied on the synthetic resin film obtained in (1) or on the organic-inorganic composite resin layer obtained in c) with a gravure roll coater, and then in a hot air dryer at 80 ° C. for 1 minute. A photocatalyst layer was formed by heating and drying to obtain a laminated film. The coating thickness after drying was 0.5 μm.
(4) Evaluation of laminated film f) Measurement of surface roughness of laminated film Surface roughness of photocatalyst layer of laminated film obtained in (3) (arithmetic average roughness Ra and ten-point average defined in JIS B 0601) Roughness Rz) was obtained using a scanning probe microscope (SPM-9500J3) manufactured by Shimadzu Corporation, and the results are shown in Table-2.
g) Scratch resistance The surface of the photocatalyst layer of the laminated film obtained in (3) was subjected to a test by rubbing under the following conditions using a Gakushin abrasion tester. The results are shown in Table 2.
<試験条件> 摩擦子 : カナキン3号で被覆
荷重 : 500g
摩擦回数 : 1000往復
<評価基準>
◎ : 全く傷付きが見られない
○ : 極微小な傷付きが見られる
△ : 傷付きが見られる
× : 著しい傷付きが見られる
h)光触媒作用の評価
(3)で得られた積層フィルム、及び比較例3として光触媒層を形成していないフィルムのそれぞれの表面に、0.1重量%のメチレンブルー水溶液を、乾燥後の塗工量が約5mg/m2になるようにバーコーターにより塗工し、熱風乾燥機にて乾燥した。得られたサンプルを1000LXの蛍光灯照射下に置き、経時による色の変化(光触媒活性作用による有機色素の分解、退色)を測定し、結果を表−2に記載した。
<Test conditions> Friction: Covered with Kanakin 3
Load: 500g
Number of friction: 1000 round trips
<Evaluation criteria>
◎: No scratches are seen
○: Very small scratches are seen
Δ: Scratched
×: Significant scratches are seen
h) Evaluation of photocatalytic action A 0.1% by weight aqueous solution of methylene blue was applied to each surface of the laminated film obtained in (3) and the film not formed with a photocatalytic layer as Comparative Example 3 after drying. The coating was applied with a bar coater so that the amount was about 5 mg / m 2, and dried with a hot air dryer. The obtained sample was placed under 1000 LX fluorescent lamp irradiation, and the color change with time (decomposition of organic dye due to photocatalytic activity and fading) was measured. The results are shown in Table-2.
なお、測色は、エックスライトMA68(エックスライト社製)にて行った。 Color measurement was performed with X-Rite MA68 (manufactured by X-Rite).
(*2)PHOTOHAPPCAP L−20:太平化学産業(株)製(光触媒アパタイト含有水分散液、固形分20重量%)
(*3)NW−1:(株)ナノウェイブ製(アパタイト被覆型二酸化チタン水分散液、固形分20重量%)
(* 2) PHOTOHAPPCAP L-20: manufactured by Taihei Chemical Industry Co., Ltd. (photocatalytic apatite-containing aqueous dispersion, solid content 20% by weight)
(* 3) NW-1: manufactured by Nanowave Co., Ltd. (apatite-coated titanium dioxide aqueous dispersion, solid content 20% by weight)
Claims (8)
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2009024285A1 (en) * | 2007-08-22 | 2009-02-26 | Renolit Ag | Film having a photocatalytic active surface |
JP2011000717A (en) * | 2009-06-16 | 2011-01-06 | Sumitomo Light Metal Ind Ltd | Aluminum material for interior and exterior and method of manufacturing the same |
CN113613785A (en) * | 2019-03-28 | 2021-11-05 | 三菱化学株式会社 | Molded catalyst, and method for producing unsaturated aldehyde and unsaturated carboxylic acid using same |
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2006
- 2006-05-24 JP JP2006143895A patent/JP2007313705A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009024285A1 (en) * | 2007-08-22 | 2009-02-26 | Renolit Ag | Film having a photocatalytic active surface |
US8652646B2 (en) | 2007-08-22 | 2014-02-18 | Renolit Ag | Film having a photocatalytic active surface |
JP2011000717A (en) * | 2009-06-16 | 2011-01-06 | Sumitomo Light Metal Ind Ltd | Aluminum material for interior and exterior and method of manufacturing the same |
CN113613785A (en) * | 2019-03-28 | 2021-11-05 | 三菱化学株式会社 | Molded catalyst, and method for producing unsaturated aldehyde and unsaturated carboxylic acid using same |
CN113613785B (en) * | 2019-03-28 | 2023-12-29 | 三菱化学株式会社 | Catalyst molded body and method for producing unsaturated aldehyde and unsaturated carboxylic acid using same |
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