JP2007214164A - Electro-optical apparatus, method for manufacturing the same semiconductor device, and electronic apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electro-optical apparatus for improving the reliability of electrical connection between an electronic component and a substrate, for example, a substrate for an electro-optical apparatus, a semiconductor device, a method for manufacturing the electro-optical apparatus, and the electronic apparatus provided with the electro-optical apparatus. <P>SOLUTION: The electro-optical apparatus comprises a driver IC15 including a basic material 21, a projected member 23 having elasticity provided at the basic material 21, and a conductor member 24 provided at the projected member 23 to have an interval (d) at least to a part against the front surface 23a of the projected member 23; and a substrate 4 on which the driver IC 15 is mounted. Accordingly, when the driver IC 15 is pressed with a pressing head, etc. in order to mount the substrate 4, for example, to the driver IC 15, the projected member 23 is pushed out, for example, to a space G, etc. between the front surface 23a of the projected member 23 and the conductor member 24. Moreover, stress applied to the conductor member 24 may be suppressed to such an extent that a pushing degree of the projected member 23 is pushed into this space G. Accordingly, the generation of a crack and the breakdown of the conductor member 24 during the mounting can be prevented. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

The present invention relates to an electronic device such as a personal computer or a mobile phone, and an electro-optical device, a semiconductor device, and a method for manufacturing the electro-optical device used in these electronic devices.

Conventionally, for example, a liquid crystal device or the like is used as an electro-optical device as a display device of an electronic apparatus such as a personal computer or a mobile phone. The liquid crystal device or the like includes, for example, a liquid crystal panel, and a driver IC is mounted on the liquid crystal panel. A plurality of bumps are formed on the driver IC, and a narrow pitch of the bumps is required as the driver IC is downsized.

In order to meet this requirement, technologies such as semiconductor chips and electronic devices that can increase the aspect ratio and reduce the amount of material used are disclosed. (For example, refer to Patent Document 1).
JP 2001-110831 (paragraph [0031], FIG. 1).

However, in the above-described technique, the conductor is formed across the resin protrusions and the electrode pads constituting the bumps. However, when the driver IC is pressed during mounting, the resin protrusions are pushed. There is a problem in that an outward force acts on the conductor due to the crushed and elastically deformed protrusions, and the reliability of electrical connection is reduced due to cracks in the conductor.

The present invention has been made in view of the above-described problems. An electro-optical device, a semiconductor device, and the like that can improve the reliability of electrical connection between an electronic component and a substrate such as a substrate for an electro-optical device.
It is an object of the present invention to provide a method for manufacturing the electro-optical device and an electronic apparatus including the electro-optical device.

In order to achieve the above object, an electro-optical device according to a main aspect of the present invention includes at least a base member, a protruding member having elasticity provided on the base member, and a surface of the protruding member. An electronic component including a conductive member provided on the projecting member with a space in part, and an electro-optical device substrate on which the electronic component is mounted.

Here, the “electro-optical device substrate” includes, for example, an electro-optical device substrate and a circuit board electrically connected to the electro-optical device substrate. The “interval” is, for example, a gap between the protruding member and the conductive member. For example, a space (between the protruding member and the conductive member (
For example, a fluid substance may be interposed.

In the present invention, the conductive member provided on the protruding member with a gap in at least a part between the base member, the elastic protruding member provided on the base member, and the surface of the protruding member. And an electro-optical device substrate on which the electronic component is mounted. For example, when the electronic component is pressed to mount the electronic component on the electro-optical device substrate, the projecting member However, in the past, since there was no gap between the protruding member and the conductive member, a large stress was applied to the conductive member by the elastically deformed protruding member. An elastically deformed protruding member is pushed into, for example, a space (gap) between the surface of the electrode and the conductive member, and the stress applied to the conductive member by the protruding member is suppressed by the amount pushed into the space (gap). Can cause cracks in the conductive member during mounting. A and breakage can be prevented. Accordingly, it is possible to improve the reliability of electrical connection between the electronic component and, for example, the electro-optical device substrate.

According to one form of this invention, it has the said space | interval in the rising part which rises from the said base material of the said protruding member, and the said electrically-conductive member. Here, the rising portion is, for example, a portion on the side close to the base material of the protruding member and on the surface side of the protruding member. Thereby, since there is a gap between the rising part rising from the base material of the protruding member and the conductive member, for example, when the electronic component is pressed, the protruding member elastically deformed becomes the rising part of the protruding member and the conductive member. For example, the stress applied to the conductive member near the rising portion of the projecting member can be suppressed by being pushed into, for example, a space (gap) or the like. Traditionally,
A large load is applied to the boundary portion between the portion of the conductive member fixed to the base material and the portion overlapping the protruding member, so that the conductive member near the rising portion of the protruding member is most likely to break. It is possible to prevent breakage or the like at a portion that is easily broken.

According to one aspect of the present invention, it further includes an electrode pad provided on the base material and electrically connected to the conductive member, and the region having the gap is at least the electrode pad and the protruding member. It is provided between the top and the top. This further includes an electrode pad provided on the base material and electrically connected to the conductive member, and the region having a gap is provided between at least the electrode pad and the top of the protruding member. In the case where a region having a gap is provided between the electrode pad of the projecting member and the top of the conductive member, for example, at the time of mounting, the rising portion on the electrode pad side of the projecting member and the conductive member For example, space (gap) between
The projecting member can be pushed out into the space, and the conductive member between the top of the projecting member and the electrode pad is suppressed by suppressing the stress applied to the conducting member by the amount pushed into the space (gap) or the like. The generation and breakage of cracks can be prevented. Therefore, electrical continuity can be ensured between the electrode pad and a portion where, for example, a terminal provided on the electro-optical device substrate is connected to the conductive member.

Further, for example, the projecting member both between the electrode pad and the top of the projecting member and between the base portion located on the opposite side of the projecting member from the electrode pad side and the top of the projecting member. By providing the conductive member so as to have a gap on the surface, it is possible to reliably prevent the conductive member from being cracked or broken.

According to one aspect of the present invention, it is further characterized by further comprising a fluid member provided at the interval between the protruding member and the conductive member. As a result, since the fluid member provided in the gap between the projecting member and the conductive member is further provided, for example, during mounting, the projecting member is elastically deformed and pushed out as it is pushed out to the conductive member side. The projecting member can push the fluid member out from between the surface of the projecting member and the conductive member, for example, compared to the case where a member having no fluidity is provided in the space (gap), for example. In addition to suppressing the force with which the projecting member pushes out the conductive member, it is possible to suppress the occurrence of cracks and breakage of the conductor member, and for example, by mounting the conductive member on the fluid member, for example, mounting Before, for example, compared with the case where there is a space (gap) between the protruding member and the conductive member, the connectivity between the protruding member and the conductive member can be ensured, and the conductive member can be prevented from being peeled off.

According to an aspect of the present invention, the distance between the surface of the protruding member and the conductive member before the electronic component is mounted on the electro-optical device substrate is the same as that of the protruding member before the mounting. The volume of the space between the conductive members and the volume by which the protruding member elastically deformed by mounting is pushed into the space are set to be substantially the same. Thereby, the interval between the surface of the protruding member and the conductive member before mounting the electronic component on the electro-optical device substrate depends on the volume of the space between the protruding member and the conductive member before mounting and the mounting. Since the elastically deformed protruding member is set so that the volume pushed out into the space is substantially the same, for example, when the electronic component is mounted on the electro-optical device substrate, when the electronic component is pressed, The projecting member that is elastically deformed and pushed out into the space between the projecting member and the conductive member can be accommodated in this space, for example. It is possible to prevent the occurrence of cracks and breakage of the member.

A semiconductor device according to another aspect of the present invention has an interval between at least a part of a base material, a protruding member having elasticity provided on the base material, and a surface of the protruding member. And a conductive member provided on the protruding member.

Here, the “interval” is a distance between the protruding member and the conductive member, for example,
A space (gap) may be provided between the projecting member and the conductive member, or a fluid substance may be interposed, for example.

In the present invention, the conductive member provided on the protruding member with a gap in at least a part between the base member, the elastic protruding member provided on the base member, and the surface of the protruding member. When the semiconductor device is pressed to mount an electronic component such as a semiconductor device, for example, on a substrate for an electro-optical device, including the base material, the protruding member, and the conductive member, the protruding member is elastically deformed. However, in the past, since there was no gap between the protruding member and the conductive member, a large stress was applied to the conductive member due to the elastically deformed protruding member. An elastically deformed protruding member is pushed into, for example, a space (gap) between the conductive member and this space (gap).
As a result, the stress applied to the conductive member by the protruding member can be suppressed, and cracking or breakage of the conductive member during mounting can be prevented. Therefore, the reliability of electrical connection between an electronic component such as a semiconductor device and a substrate such as a substrate for an electro-optical device can be improved.

An electro-optical device manufacturing method according to another aspect of the present invention is a method for manufacturing an electro-optical device including a substrate and an electronic component mounted on the substrate, on a base material provided in the electronic component. The projecting member forming step of forming a projecting member having elasticity, the sacrificial layer forming step of forming a sacrificial layer on the projecting member, and the surface of the projecting member so as to have a gap A conductive member forming step of forming a conductive member through at least a portion of the protruding member via the sacrificial layer; a sacrificial layer removing step of removing the sacrificial layer; and an electronic component from which the sacrificial layer has been removed. A mounting step of mounting on the substrate.

  Here, the sacrificial layer is a layer such as a resist, for example.

In the present invention, a projecting member forming step of forming a projecting member having elasticity on a substrate provided in an electronic component, a sacrificial layer forming step of forming a sacrificial layer on the projecting member, and a projecting member A conductive member forming step of forming a conductive member via a sacrificial layer in at least a part between the projecting member and a sacrificial layer removing step of removing the sacrificial layer; A mounting step of mounting the electronic component from which the layer has been removed on the substrate, so that a space can be provided between the surface of the protruding member and the conductive member, for example, the base material, the protruding member, and the conductive member. When the electronic device such as a semiconductor device provided with a member is mounted on a substrate, when the semiconductor device is pressed, there is conventionally no gap between the protruding member and the conductive member. Whereas a large stress was acting on the conductive member The protruding member is elastically deformed, and the elastically deformed protruding member is pushed into a space (gap), for example, and the stress applied to the conductive member can be suppressed by the amount pushed into the space (gap). It is possible to prevent the occurrence or breakage of cracks. Therefore, the reliability of electrical connection between the electronic component and a substrate such as a substrate for an electro-optical device can be improved.

According to one aspect of the invention, the mounting step is characterized in that the electronic component is pressure-bonded to the substrate so as to eliminate the gap. As a result, the mounting process crimps the electronic component to the substrate so as to eliminate the interval. For example, the protruding member pushed out during the mounting process enters the space (gap) between the protruding member and the conductive member. In addition to suppressing the stress applied to the conductive member and preventing the occurrence of cracks in the conductive member, it is possible to cope with the manufacture of a wide variety of electro-optical devices.

According to one aspect of the present invention, the mounting step leaves at least a part of the interval.
The electronic component is pressure-bonded to the substrate. As a result, the mounting process crimps the electronic component to the substrate so as to leave at least a part of the interval. For example, even when the force for pressing the semiconductor device during mounting becomes larger than a preset force, for example, in advance The projecting member can be accommodated in a part of the space (gap) that is not filled with the extruded projecting member with the set force, preventing excessive stress on the conductive member, and more reliable In addition, it is possible to manufacture an electro-optical device that excels in the manufacturing process, and it is possible to cope with the manufacture of a wide variety of electro-optical devices.

According to one form of this invention, it has the said space | interval in the rising part which rises from the said base material of the said protruding member, and the said electrically-conductive member. Thereby, since there is a gap between the rising part rising from the base material of the protruding member and the conductive member, for example, when the electronic component is pressed, the protruding member elastically deformed becomes the rising part of the protruding member and the conductive member. For example, the stress applied to the conductive member near the rising portion of the projecting member can be suppressed by being pushed into, for example, a space (gap) or the like. Therefore, the conductive member near the rising portion of the projecting member is most likely to be broken because a load is applied to the boundary portion between the portion fixed to the base member and the portion overlapping the projecting member of the conductive member. It is possible to prevent breakage or the like at a portion that is easy to do.

According to one aspect of the present invention, it further includes an electrode pad provided on the base material and electrically connected to the conductive member, and the region having the gap is at least the electrode pad and the protruding member. It is provided between the top and the top. This further includes an electrode pad provided on the base material and electrically connected to the conductive member, and the region having a gap is provided between at least the electrode pad and the top of the protruding member. Excessive stress due to deformation of the projecting member to the conductive member between the electrode pad and the top of the projecting member can be prevented. Therefore, for example, electrical conduction between the electronic component and the electro-optical device substrate can be reliably achieved.

An electronic apparatus according to another aspect of the invention includes the above-described electro-optical device.

In the present invention, since an electro-optical device capable of improving the reliability of electrical connection between an electronic component and a substrate such as a substrate for an electro-optical device is provided, an electronic apparatus having excellent display performance can be obtained. Can do.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following description of the embodiments, a liquid crystal device, specifically a TFT (Thin Film), is given as an example of an electro-optical device.
(Transistor) A reflective transflective active matrix liquid crystal device, a method for manufacturing the liquid crystal device, a driver IC as a semiconductor device used in the liquid crystal device, and an electronic device using the liquid crystal device will be described, but the present invention is not limited thereto. . In the following drawings, the scale and number of each structure are different from each other in order to make each configuration easy to understand.

  (First embodiment)

1 is an external perspective view of the liquid crystal device according to the first embodiment of the present invention, FIG. 2 is a cross-sectional view taken along line AA of the liquid crystal device of FIG. 1, and FIG. 3 is an enlarged view of the driver side output terminal of the driver IC of FIG. 4 is a bottom view of the driver IC before mounting used in the liquid crystal device of FIG. 1, and FIG. 5 is a cross-sectional view of the driver IC of FIG.

  (Configuration of liquid crystal device)

The liquid crystal device 1 includes a liquid crystal panel 2 and a circuit board 3 connected to the liquid crystal panel 2. The liquid crystal device 1 is provided with other auxiliary mechanisms such as a frame (not shown) that supports the liquid crystal panel 2 as necessary.

The liquid crystal panel 2 includes a substrate 4, a substrate 5 provided to face the substrate 4, and the substrates 4, 5
And a liquid crystal (not shown) sealed by the sealing material 6 and the substrates 4 and 5 provided between them. For example, TN (Twisted Nematic) is used for the liquid crystal.

The substrate 4 and the substrate 5 are plate-shaped members made of a light-transmitting material such as glass or synthetic resin. On the liquid crystal side of the substrate 4, a gate electrode 7, a source electrode 8, a thin film transistor element T, a pixel electrode 9, an output wiring 11 electrically connected to the gate electrode 7, and an output wiring electrically connected to the source electrode 8. 12. Driver ICs 15 and 1 as electronic components (semiconductor devices)
6, input wirings 13 and 14 are formed which are electrically connected to driver side input terminals described later.

The gate electrode 7 is formed in the X direction, and the source electrode 8 is formed in the Y direction. As shown in FIG. 1, the source electrode 8 is formed by being routed to the right side of the liquid crystal device 1, for example. Note that the number of the gate electrodes 7 and the source electrodes 8 can be appropriately changed according to the resolution of the liquid crystal device 1 and the size of the display area.

The thin film transistor element T includes three terminals connected to the gate electrode 7, the source electrode 8, and the pixel electrode 9, respectively. The thin film transistor element T includes a pixel electrode 9 and a gate electrode 7.
Are connected to the source electrode 8. Thus, a current flows from the source electrode 8 to the pixel electrode 9 or vice versa when a voltage is applied to the gate electrode 7.

The output wiring 11 is a region where the substrate 4 protrudes from the outer peripheral edge of the substrate 5 (hereinafter referred to as “extended portion”).
4a) are arranged in parallel in the arrangement direction of gate electrodes 7 (Y direction). Output wiring 11
One end is electrically connected to the gate electrode 7 and the other end of the output wiring 11 is electrically connected to a driver side output terminal 17 of a driver IC 15 to be described later as shown in FIG.

The output wiring 12 is juxtaposed in the arrangement direction (Y direction) of the gate electrodes 7 at the projecting portion 4a. One end of each output wiring 12 is electrically connected to the source electrode 8, and the other end of each output wiring 12 is electrically connected to a driver side output terminal (not shown) of a driver IC 16 described later.

A plurality of input wirings 13 are arranged in parallel in the arrangement direction (Y direction) of the gate electrodes 7 at the projecting portion 4a. As shown in FIG. 2, one end of the input wiring 13 is electrically connected to a wiring 18 provided on the circuit board 3 via an ACF (not shown), and the other end of the input wiring 13 is connected to FIG. As shown, each of them is electrically connected to a driver side input terminal 19 of a driver IC 15 described later.

A plurality of input wirings 14 are arranged in parallel in the arrangement direction (Y direction) of the gate electrodes 7 at the projecting portion 4a. One end of the input wiring 14 is connected to a wiring (not shown) provided on the circuit board 3 via an ACF (not shown), and the other end of the input wiring 14 is a driver IC described later.
16 are electrically connected to driver side input terminals (not shown).

As shown in FIGS. 2 and 3, the driver IC 15 has, for example, an NCF (NCF
on conductive film) and the like.
As shown in FIG. 4, the driver IC 15 has, for example, a rectangular shape, and a plurality of bases 21 and a plurality of driver ICs 15 arranged on the mounting surface 21 a of the base 21 so as to correspond to the arrangement direction (Y direction) of the gate electrodes 7. Driver side output terminal 17 and driver side input terminal 19.

As shown in FIGS. 1 and 4, the base material 21 has, for example, a rectangular plate shape. For example, on the mounting surface 21 a side of the base material 21, as shown in FIG. 4, a plurality of electrode pads 22 are formed near the driver side input / output terminals 17, 19 so as to correspond to the driver side input / output terminals 17, 19. Has been. The shape of the electrode pad 22 is, for example, a rectangular plate shape as shown in FIG. 4, and as shown in FIG. 3, for example, a plurality of electrode pads 22 are provided so as to be embedded in the mounting surface 21 a of the base material 21.

As shown in FIG. 3, the driver-side output terminal 17 has a gap d at least at a part between the projecting member 23 having elasticity protruding from the mounting surface 21 a and the surface 23 a of the projecting member 23. The conductive member 24 is provided.

As shown in FIGS. 4 and 5, the protruding member 23 has, for example, a substantially bowl shape before mounting, and is provided over the longitudinal direction (Y direction) of the base material 21. As shown in FIG. 4, for example, two protruding members 23 are provided substantially parallel to each other in a direction (X direction) intersecting the longitudinal direction (Y direction) of the base material 21. The projecting member 23 has elasticity, and a resin such as an acrylic resin, an epoxy resin, or a urethane resin is used as a constituent material thereof.

As shown in FIG. 3, the protruding member 23 is, for example, a driver IC described later after mounting.
It is a shape that is elastically deformed (crushed) in 15 pressing directions (D direction in FIG. 3) and extruded in a lateral direction (for example, R direction in FIG. 3) orthogonal to the pressing direction.

As shown in FIG. 3, the conductive member 24 is provided on the projecting member 23 so as to have a gap d at least at a part between the surface 23 a of the projecting member 23, for example. The conductive member 24 is shown in FIG.
As shown in FIG. 2, for example, the electrode pad 22 is electrically connected. The conductive member 24 is plated with gold, for example.

The rising portion E rising from the mounting surface 21a of the base 21 on the surface 23a of the protruding member 23 on the electrode pad 22 side and the conductive member 24 are provided with a distance d. Here, the rising portion E is, for example, a portion of the protruding member 23 and a portion closer to the mounting surface 21a. The region having the distance d includes at least the electrode pad 22 and the top 23 of the protruding member 23.
b. Here, the top portion 23 b is, for example, the base material 21 of the protruding member 23.
The portion from the mounting surface 21a is the highest.

As a constituent material of the conductive member 24, for example, at least one of titanium and a titanium alloy is used. In addition, the constituent material of the electrically-conductive member 24 is not limited to these, For example, gold | metal | money, silver, copper, platinum, and these metals can be used.

Before the driver IC 15 is mounted, the conductive member 24 is separated from the surface 23a of the projecting member 23 by a substantially constant distance d over substantially the entire surface 23a of the projecting member 23, as shown in FIG. Is provided. In this embodiment, before the driver IC 15 is mounted,
Although an example in which a gap d (space G) is provided between the conductive member 24 and the substantially entire surface 23a of the protruding member 23 is shown, at least the rising portion E of the protruding member 23 and the conductive member 24 are shown. And a space d (space G) between them.

Before mounting the driver IC 15, as shown in FIG. 5, the surface 23 a of the protruding member 23.
The distance d between the conductive member 24 and the conductive member 24 is such that, for example, the volume of the space G between the protruding member 23 and the conductive member 24 shown in FIG. It is set to be slightly larger than the volume to be pushed out. After the mounting, as shown in FIG. 3, the rising portion E of the protruding member 23 of the driver side output terminal 17 of the driver IC 15;
A space G remains between the conductive member 24 and the conductive member 24.

In the present embodiment, as shown in FIG. 3, after the driver IC 15 is mounted, the driver I
The example in which the distance d (space G) remains between the surface 23a of the protruding member 23 of the driver side output terminal 17 of C15 and the conductive member 24 is shown. However, after mounting, the space d (space G before mounting) shown in FIG. 5 is not left between the surface 23a of the protruding member 23 of the driver side output terminal 17 of the driver IC 15 and the conductive member 24. May be set.

Since the driver side input terminal 19 is configured in the same manner as the driver side output terminal 17, for example, the description thereof is omitted.

As shown in FIG. 1, the circuit board 3 is electrically connected to the projecting portion 4a via an adhesive such as ACF. The circuit board 3 includes a flexible base material 28 as shown in FIG. 1, and the flexible base material 28 is connected to, for example, an ACF or the like not shown in the input wiring 13 as shown in FIG. Are connected to an external device (not shown) via the wiring 18.

  (Manufacturing method of liquid crystal device)

  Next, a method for manufacturing the liquid crystal device 1 will be described with reference to the drawings.

FIG. 6 is a flowchart showing a manufacturing process of the liquid crystal device 1 of the first embodiment, and FIG.
FIG. 8 is a cross-sectional view of a state (S1) in which a protruding member 23 is formed on one mounting surface 21a, and FIG.
FIG. 9 is a cross-sectional view of a state (S2) in which a resist layer is formed thereon, and FIG.
It is sectional drawing of S3). In the present embodiment, the manufacturing process (S5) of the liquid crystal panel 2 before the mounting of the driver IC 15 and the like and the manufacturing process (S7) of the circuit board 3 are the same as those in the publicly known technology, so that the description thereof is omitted. The manufacturing process (S1 to S4) will be mainly described.

First, as shown in FIG. 7, for example, a substantially bowl-shaped protruding member 23 is formed on the mounting surface 21a of the substrate 21 (S1). At this time, for example, the protruding members 23 are formed in, for example, two rows in the direction (X direction) intersecting the longitudinal direction (Y direction) in the longitudinal direction of the base material 21 (Y direction in FIG. 4). As a constituent material of the projecting member 23, for example, a resin such as an acrylic resin, an epoxy resin, or a urethane resin is used.

Next, for example, as shown in FIG. 8, a resist layer R as a sacrificial layer is formed so as to cover the protruding member 23 (S2). At this time, for example, the thickness of the resist layer R is appropriately changed according to the length of the interval d.

Next, a metal film made of, for example, titanium is formed so as to cover the base material 21 and the resist layer R, and the formed metal film is subjected to, for example, etching, so that the resist layer R is formed as shown in FIG.
The conductive member 24 and the like are formed so as to cover the projecting member 23 through (S3). At this time, the conductive member 24 is electrically connected to the electrode pad 22.

Subsequently, the resist layer R between the protruding member 23 and the conductive member 24 is removed by performing wet etching, for example, on the driver IC 15 manufactured in Step 3 (S4).
From the above, as shown in FIG. 5, for example, the entire surface 23a of the protruding member 23 and the conductive member 2 are formed.
4 is manufactured. The driver IC 15 having a distance d (space G) between

Subsequently, for example, an adhesive 20 such as NCF (Non Conductive Film) is interposed between the driver IC 15 and the liquid crystal panel before the driver IC 15 is mounted, for example, as shown in FIG. In the direction toward D (direction D in FIG. 3),
The driver IC 15 is pressed by a pressing head (not shown). As a result, for example, the driver I in a state where a part of the distance d remains between the rising portion E of the protruding member 23 and the conductive member 24.
C15 is mounted on the substrate 4 to manufacture the liquid crystal panel 2 (S6).

At this time, for example, the driver side output terminal 17 is connected to the base 21 of the driver IC 15 and the substrate 4.
The driver-side output terminal 17 is pushed in the direction (U direction in FIG. 3) from the substrate 4 side toward the driver-side output terminal 17, for example, a pressing direction of a pressing head (not shown) (D direction in FIG. 3). For example, the protruding member 23 is pushed out so as to be opened in a lateral direction (for example, the R direction in FIG. 3). However, the conductive member 24 is provided, for example, with a space d (space G) from at least a part of the surface 23a of the protruding member 23 before mounting. 23 is pushed out. For example, the stress applied to the conductive member 24 is suppressed by the protruding member 23 by the amount pushed out into the space G.

In addition, after mounting, the space d before mounting may be set or pressed so that the surface 23a of the protruding member 23 and the conductive member 24 are in close contact with each other and the space d does not remain.

Then, for example, the liquid crystal panel 2 on which the driver IC 15 is already mounted and the circuit board 3 manufactured in step 7 are electrically connected via an adhesive such as ACF (S8).
The liquid crystal device 1 is manufactured by providing a light guide plate, a reflection sheet, etc. (not shown) (S9).

  This is the end of the description of the method for manufacturing the liquid crystal device 1.

As described above, according to this embodiment, at least a part between the base member 21, the elastic protruding member 23 provided on the base member 21, and the surface 23 a of the protruding member 23 has the distance d. The driver IC 15 including the conductive member 24 provided on the protruding member 23 as described above, and the driver IC 1
5, the protruding member 23 is elastically deformed when the driver IC 15 is pressed by a not-shown pressing head or the like in order to mount the driver IC 15 on the substrate 4. Since there was no gap d between the protruding member 23 and the conductive member, a large stress was applied to the conductive member by the elastically deformed protruding member 24, whereas the surface 23a of the protruding member 23 and the conductive member were electrically conductive. The elastically deformed protruding member 23 is pushed into, for example, the space G between the member 24, and the stress applied to the conductive member 24 by the protruding member 23 can be suppressed by the amount pushed into the space G. It is possible to prevent the conductive member 24 from being cracked or broken during mounting. Therefore, the reliability of the electrical connection between the driver IC 15 side and the substrate 4 side can be improved.

Further, since the rising portion E rising from the base material 21 of the projecting member 23 and the conductive member 24 have a distance d, for example, when the driver IC 15 is pressed, the projecting member 23 that is elastically deformed is projected. The stress applied to the conductive member 24 near the rising portion E of the projecting member 23 is pushed by, for example, the space G between the rising portion E of the protruding member 23 and the conductive member 24 and pushed into the space G. Can be suppressed. Accordingly, the base member 20 of the conductive member 24 is used.
The conductive member 24 near the rising portion E of the projecting member 24 is most likely to be broken because a large load is applied to the boundary portion between the portion fixed to the projecting member 23 and the portion overlapping the projecting member 23. It is possible to prevent the conductive member 24 from being broken at an easy portion.

Further, the driver IC 15 further includes an electrode pad 22 provided on the base material 21 and electrically connected to the conductive member 24, and a region having a distance d is formed between the top 23 b of the protruding member 23 and the electrode pad 22. Specifically, the rising portion E of the protruding member 23 on the electrode pad 22 side,
Since it is provided between the conductive member 24 and the conductive member 24, for example, the protruding member 23 is disposed in a space G or the like between the rising portion E of the protruding member 23 on the electrode pad 22 side and the conductive member 24 at the time of mounting.
By suppressing the stress applied to the conductive member 24 by the amount pushed into the space G and the like, cracks and breakage of the conductive member 24 on the electrode pad 22 side of the protruding member 23 can be prevented. can do. Therefore, generation of a crack or breakage of the conductive member 24 between the electrode pad 22 and, for example, the output wiring 11 attached to the substrate 4 is prevented, and electrical connection between the electrode pad 22 and the output wiring 11 is prevented. Can be secured.

Further, for example, a part of the substrate 4 located on the opposite side of the protruding member 23 from the electrode pad 22 side,
The distance d between the top portion 23b and the surface 23a of the projecting member 23 at the rising portion E rising from the base material 21 located on the opposite side of the projecting member 23 from the electrode pad 22 side. Since the conductive member 24 is provided so as to have the protruding member 23, the protruding member 23 can be pushed out into the space G, for example, on both sides of the protruding member 23 at the time of mounting.
By accommodating the protruding member 23 in the space G in a larger amount, the stress applied to the conductive member 24 can be more reliably suppressed, and the occurrence or breakage of the crack in the conductive member 24 can be prevented more reliably.

In addition, since the constituent material of the projecting member 23 is, for example, a resin such as an acrylic resin, an epoxy resin, or a urethane resin, for example, excellent adhesion when the constituent material of the conductive member 23 is titanium, titanium alloy, or the like. Can be ensured, and at the time of mounting, the protruding member 23 can be elastically deformed, and the electrical connection between the conductive member 23 and, for example, the output wiring 11 on the substrate 4 side can be reliably ensured. .

Further, a distance d is formed between the step (S1) of forming the protruding member 23 on the base member 21, the step (S2) of forming the resist layer R on the protruding member 23, and the surface 23a of the protruding member 23. So that the conductive member 24 is formed via the resist layer R (S3) and the resist layer R is removed (S4). The driver IC 15 having, for example, a distance d (space G) at least at a part between the surface 23a of the 23 and the conductive member 24 can be manufactured.

Further, a step (S1 to S4) of providing the conductive member 24 on the projecting member 23 so as to have a distance d between the surface 23a of the projecting member 23 projecting from the base material 21, and a part of the distance d. A step (S6) of crimping the driver IC 15 so as to leave behind, for example, the driver IC 15
When the driver IC 15 is pressed by a pressing head or the like (not shown) to mount the circuit board 4 on the substrate 4, for example, in the space G between the surface 23a of the protruding member 23 and the conductive member 24 before mounting,
The projecting member 23 that has been elastically deformed is pushed out and pushed into the space G, so that the stress applied to the conducting member 24 can be suppressed by the projecting member 23, and the occurrence of cracks or breakage of the conducting member 24 during mounting can be prevented. Can be prevented.

Furthermore, for example, when the driver IC 15 is mounted on the substrate 4, even if the force for pressing the driver IC 15 becomes larger than a preset force, for example, the protruding member 23 pushed out with the preset force is used. By extruding the protruding member 23 into a part of the space G that is not filled with, it is possible to prevent the conductive member 24 from being excessively stressed and to manufacture the liquid crystal device 1 with higher reliability.

For example, in order to form the conductive member 24 on the protruding member 23 so as to have a distance d (space G before mounting) between the surface 23a of the protruding member 23, the size of the protruding member 23 is conventionally set. In this case, the size of the conductive member 24 is limited to a size that eliminates the interval d after the driver IC 15 is mounted. For example, in order to form the conductive member 24 on the projecting member 23 so as to have a distance d between the surface 23a of the projecting member 23, the size of the projecting member 23 may be reduced compared to the conventional case. Good.

Further, for example, the distance d between the surface 23a of the protruding member 23 and the conductive member 24 before the driver IC 15 is mounted on the substrate 4 is set to the space G between the protruding member 23 and the conductive member 24 before mounting. For example, when the driver IC 15 is mounted on the substrate 4, the driver IC 15 is pressed by setting the volume and the volume by which the protruding member 23 elastically deformed by mounting is pushed out into the space G. Sometimes, the protruding member 23 that is elastically deformed and pushed out, for example, is placed in the space G between the surface 23a of the protruding member 23 and the conductive member 24 so that the stress applied to the conductive member 24 is reduced. You may make it suppress reliably.

  (First modification)

Next, a liquid crystal device of a first modification according to the present invention will be described. In addition, after this modification, the same code | symbol is attached | subjected to the same component as the said embodiment, the description is abbreviate | omitted, and it demonstrates centering on a different location.

  FIG. 10 is a cross-sectional view of a driver IC used in the liquid crystal device of the first modification.

  (Configuration of liquid crystal device)

The liquid crystal device according to the present modification includes, for example, a liquid crystal panel manufactured by mounting a driver IC 15 ′ instead of the driver IC 15 of the first embodiment, and a circuit electrically connected to the liquid crystal panel via an ACF or the like. And a substrate 3. In this modification, only the driver IC 15 ′ and the like are different from those of the first embodiment. Therefore, the liquid crystal panel 2 and the circuit board 3 and the like before the driver IC 15 ′ and the like are mounted will be described. The driver IC 15 ′ will be mainly described below.

The driver IC 15 ′ includes a base material 21, a plurality of driver-side output terminals 17 ′ arranged on the mounting surface 21 a of the base material 21 so as to correspond to the arrangement direction (Y direction) of the gate electrodes 7, and the mounting surface 2.
1a includes a plurality of driver side input terminals 19 arranged so as to correspond to the arrangement direction (Y direction) of the gate electrodes 7.

For example, as shown in FIG. 10, the electrode pad 30 is formed on the mounting surface 21 a side of the base material 21 so that the driver side output terminal 17 ′ is sandwiched between the electrode pad 22 and the electrode pad 22. The electrode pad 30 is electrically connected to a conductive member 24 ′ described later.

The driver side output terminal 17 ′ has a protruding member 23 protruding from the mounting surface 21 a of the substrate 21,
For example, a conductive member 24 ′ provided on the protruding member 23 is provided so as to have a distance d at least at a part between the surface 23 a of the protruding member 23.

As shown in FIG. 10, the conductive member 24 ′ is provided on the projecting member 23 so as to have a distance d (space G ′) at least partly between the surface 23 a of the projecting member 23, for example. As shown in FIG. 10, the conductive member 24 ′ is electrically connected to the electrode pads 22 and 30, for example.

As shown in FIG. 10, for example, the base material positioned between, for example, the electrode pad 22 and the top 23 b of the protruding member 23 and on the opposite side (electrode pad 30 side) of the protruding member 23 to the electrode pad 22 side. The surface 23 of the projecting member 23 both between the portion 21 and the top 23 b of the projecting member 23.
A conductive member 24 ′ is provided so as to have a distance d between “a” and “a”. Specifically, the rising portion E on the electrode pad 22 side of the protruding member 23 and the conductive member 24 ′ have a distance d, and the rising portion E on the electrode pad 30 side of the protruding member 23 and the conductive member 24. 'Has a distance d. For example, the conductive member 24 ′ and the portion excluding the rising portion E of the protruding member 23 are provided in close contact with each other before mounting, for example. Thereby, the conductive member 2 before mounting
4 'peeling is prevented.

Before the driver IC 15 ′ is mounted, the distance d is, for example, as shown in FIG. 10, for example, the volume of the space G ′ between the protruding member 23 and the conductive member 24 ′ shown in FIG. The protruding member 23 elastically deformed by the mounting is set to be substantially the same as the volume pushed into the space G ′. After mounting, the space G ′ does not remain between the surface 23a of the protruding member 23 of the driver side output terminal 17 ′ of the driver IC 15 ′ and the conductive member 24 ′.

For example, at least one of titanium and a titanium alloy is used as a constituent material of the conductive member 24 '. Note that the constituent material of the conductive member 24 ′ is not limited to these, and for example, metals such as gold, silver, copper, and platinum can be used.

In the present modification, an example is shown in which the space G ′ does not remain between the surface 23a of the protruding member 23 of the driver side output terminal 17 ′ of the driver IC 15 ′ and the conductive member 24 ′ after mounting. . However, after mounting, the protruding member 23 of the driver side output terminal 17 ′ of the driver IC 15 ′.
The space d before mounting (the volume of the space G ′) may be set so that a part of the space G ′ remains between the surface 23 a of the metal and the conductive member 24 ′.

As described above, according to the present modification, the base member 21, the projecting member 23 having elasticity provided on the base member 21, the rising portion E rising from the base member 21 of the projecting member 23, and the conductive member 24 '.
Conductive member 24 provided on projecting member 23 so as to have a distance d at least at a part between
, And the substrate 4 on which the driver IC 15 ′ is mounted. For example, when mounting, the rising portions E of the protruding members 23 on the electrode pads 22, 30 side and the conductive member 24 are provided. For example, the protruding member 23 can be more reliably pushed into the space G ′ or the like, and the stress applied to the conductive member 24 ′ can be suppressed by the amount pushed into the space G ′ or the like. It is possible to efficiently and reliably prevent cracks and breakage of the conductive member 24 ′ on the electrode pads 22 and 30 side of the shaped member 23. Therefore, the electrical connection between the electrode pads 22 and 30 and, for example, the output wiring 11 attached to the substrate 4 can be reliably ensured.

  (Second modification)

  Next, a liquid crystal device of a second modification according to the present invention will be described.

  FIG. 11 is a cross-sectional view of a driver IC used in the liquid crystal device of the second modification.

In this modification, for example, a driver IC 43 having a driver-side output terminal 42 described later according to the present invention is used instead of the driver IC 15 having the driver-side output terminal 17 or the like.

The driver side output terminal 42 of the driver IC 43 has a protruding member 4 protruding from the mounting surface 21a.
0 and, for example, a conductive member 41 provided on the projecting member 40 so as to have a distance d at least at a part between the surface 40a of the projecting member 40.

As shown in FIG. 11, the protruding member 40 has, for example, a substantially trapezoidal cross section, and is provided in the Y direction with the arrangement direction of the gate electrodes 7 as the longitudinal direction. The protruding members 40 are arranged in two rows in the X direction so as to be separated from each other in the X direction intersecting the longitudinal direction. The protruding member 40 includes an exposed surface 44 that is exposed without being covered with the conductive member 41. The exposed surface 44 is a slope represented by, for example, a trapezoidal oblique side of the cross section of the protruding member 40. The inclined surface of the projecting member 40 is projected into the projecting member 4 after mounting.
Extruded to the outside of 0 (eg, lateral direction (X direction in FIG. 11)).

For example, the conductive member 41 has a distance d at least partially between the surface 40a of the protruding member 40.
Protruding member 40 is provided so as to have (space K). For example, a gap d is provided between the rising portion F rising from the mounting surface 21 a of the base member 21 of the protruding member 40 and the conductive member 41. Here, the rising portion F is, for example, a part of the protruding member 40, for example, a portion on the electrode pad 22 side and the side close to the mounting surface 21a.

As shown in FIG. 11, before the driver IC 43 is mounted, the distance d is, for example, that the volume of the space K between the protruding member 40 and the conductive member 41 shown in FIG. The deformed protruding member 40 is set to be substantially the same as the volume pushed into the space K. After mounting, for example, the space K does not remain between the surface 40 a of the protruding member 40 of the driver side output terminal 42 of the driver IC 43 and the conductive member 41.

The conductive member 41 is provided, for example, so as to be laminated on the top 40b of the protruding member 40.
Here, the top portion 40b refers to, for example, a portion having the highest height from the mounting surface 21a of the base member 21 of the protruding member 40.

For example, at least one of titanium and a titanium alloy is used as a constituent material of the conductive member 41. In addition, the constituent material of the electrically-conductive member 41 is not limited to these, For example, metals, such as gold | metal | money, silver, copper, and platinum, can be used.

As described above, according to the present modification, the conductive member 41 is provided on the protruding member 40 so as to have the distance d (space K) at least partially between the surface 40 a of the protruding member 40. For example, at the time of mounting, the rising portion F on the electrode pad 22 side of the protruding member 40 and the conductive member 41
For example, the protruding member 40 can be pushed into a space K between the electrode pad 22 and the electrode pad 22 of the protruding member 40 by suppressing the stress applied to the conductive member 41 by the amount pushed into the space K or the like.
It is possible to prevent the conductive member 41 from being cracked or broken on the side.

In this modification, the surface 40a of the rising portion F of the protruding member 40 and the conductive member 41 are used.
An example is shown in which they are spaced apart from each other without contact. However, the present invention is not limited to this, and for example, the protruding member 40 and the conductive member 41 may be provided apart from each other without completely contacting each other.

Moreover, in the said embodiment and modification, the example which has the space G in at least one part between the protruding member 23 and the electrically-conductive member 24 was shown, for example. However, it is not limited to this, For example, you may make it provide the fluid member which can be flowed according to pressing force at the time of mounting between a protruding member and a conductive member (interval). As the fluid member, for example, a resin having a fluidity larger than that of the protruding member 23 can be used. High fluidity means that, for example, when an external force is applied to the fluid member, the fluid member is more easily deformed than the protruding member 23. In this case, since the fluid member provided in the space | interval d of the protruding member 23 and the electrically-conductive member 24 is further provided, the protruding member 2 is mounted at the time of mounting, for example.
3 is elastically deformed and is pushed out toward the conductive member 24 side.
Can extrude the fluid member from between the surface 23a of the projecting member 23 and the conductive member 24, for example, and the projecting member, for example, compared to the case where a non-fluid member is provided at the interval d. 23 can suppress the force that pushes out the conductive member 24 to suppress the occurrence of cracks and breakage of the conductive wire member 24. For example, the conductive member 24 is formed so as to be laminated on the fluid member. Before, for example, compared with the case where there is a space between the protruding member 23 and the conductive member 24, it is possible to secure the connectivity between the protruding member 23 and the conductive member 24 and prevent the conductive member 24 from peeling off. it can.

  Second Embodiment Electronic Device

Next, an electronic apparatus according to the second embodiment of the present invention including the above-described liquid crystal device 1 will be described.

FIG. 12 is a schematic configuration diagram of the overall configuration of the display control system of the electronic device according to the second embodiment of the present invention.

The electronic device 300 includes, for example, a liquid crystal panel 2 and a display control circuit 390 as a display control system as shown in FIG. 12. The display control circuit 390 includes a display information output source 391, a display information processing circuit 392, a power supply circuit 393, and the like. A timing generator 394 and the like are included.

The liquid crystal panel 2 includes a driving circuit 36 including a driver IC 15 that drives the display area I.
1

The display information output source 391 includes a ROM (Read Only Memory) and a RAM (R
and a memory unit composed of a magnetic recording disk, an optical recording disk, and the like, and a tuning circuit that tunes and outputs a digital image signal. Further, the display information output source 391 is configured to supply display information to the display information processing circuit 392 in the form of a predetermined format image signal or the like based on various clock signals generated by the timing generator 394.

The display information processing circuit 392 includes various well-known circuits such as a serial-parallel conversion circuit, an amplification / inversion circuit, a rotation circuit, a gamma correction circuit, and a clamp circuit, and executes processing of input display information to display the image. Information is supplied to the drive circuit 361 together with the clock signal CLK. The power supply circuit 393 supplies a predetermined voltage to each component described above.

As described above, according to this embodiment, since the liquid crystal device 1 with improved reliability of electrical connection between the driver IC 15 side and the substrate 4 side is provided, an electronic apparatus having excellent display performance can be obtained.

Specific electronic devices include a touch panel equipped with a liquid crystal device in addition to a mobile phone, a personal computer, etc., a projector, a liquid crystal television, a viewfinder type, a monitor direct view type video tape recorder, a car navigation, a pager, an electronic notebook, Calculators, word processors, workstations, videophones, POS terminals, etc. Needless to say, for example, the above-described liquid crystal device 1 or the like can be applied as a display unit of these various electronic devices.

Note that the electronic device, the liquid crystal device, and the driver IC 15 of the present invention are not limited to the above-described examples, and it is needless to say that various modifications can be made without departing from the gist of the present invention. Moreover, you may combine said each embodiment and modification in the range which does not change the summary of this invention.

For example, in the above-described embodiment, the TFT type liquid crystal device 1 and the like have been described. However, the present invention is not limited to this. For example, a TFD (Thin Film Diode) type active matrix type or passive matrix type liquid crystal device may be used. In addition, plasma display devices, electrophoretic display devices, and devices using electron-emitting devices (Field Emis)
sion Display and Surface-Condection Electro
The present invention may be applied to various electro-optical devices such as n-Emitter Display.

In the above-described embodiment, the liquid crystal device 1 including the COG liquid crystal panel 2 is exemplified, but the present invention is not limited to this. For example, the present invention is applied to a COF (Chip on Film) liquid crystal device. May be.

1 is an external perspective view of a liquid crystal device according to a first embodiment of the present invention. It is AA sectional drawing of the liquid crystal device of FIG. FIG. 3 is an enlarged cross-sectional view of a driver side output terminal of the driver IC of FIG. 2. It is a bottom view of the driver IC before mounting used for the liquid crystal device of FIG. FIG. 5 is a cross-sectional view of the driver IC of FIG. 4 taken along the line BB. 4 is a flowchart illustrating a manufacturing process of the liquid crystal device according to the first embodiment. It is sectional drawing of the state (S1) in which the protruding member was formed in the mounting surface of a base material. It is sectional drawing of the state (S2) which formed the resist layer on the protruding member. It is sectional drawing of the state (S3) in which the electrically-conductive member was formed. It is sectional drawing of driver IC used for the liquid crystal device of a 1st modification. It is sectional drawing of driver IC used for the liquid crystal device of a 2nd modification. It is a schematic block diagram of the display control system of the electronic device of 2nd Embodiment which concerns on this invention.

Explanation of symbols

d interval, E, F rising part, G, K space, I display area, R resist layer, T thin film transistor element, 1 liquid crystal device, 2 liquid crystal panel, 3 circuit board, 4, 5 substrate, 4a overhanging part 6 sealing material, 7 Gate electrode, 8 Source electrode, 9 Pixel electrode, 11, 12 Output wiring, 13, 14 Input wiring, 15
16, 43 Driver IC, 17, 42 Driver side output terminal, 18 wiring, 1
9 Driver side input terminal, 20 Adhesive material, 21 Base material, 21a Mounting surface, 22,
30 electrode pad, 23 projecting member, 23a surface, 23b, 40b top, 2
4, 41 conductive member, 40a surface, 44 exposed surface, 300 electronic device, 361
Driving circuit

Claims (12)

A conductive member provided on the protruding member with an interval between at least a portion between the base member, an elastic protruding member provided on the base member, and a surface of the protruding member; An electronic component with
An electro-optical device comprising: an electro-optical device substrate on which the electronic component is mounted. The electro-optical device according to claim 1, wherein the gap is provided between a rising portion of the protruding member rising from the base material and the conductive member. An electrode pad provided on the base material and electrically connected to the conductive member;
The electro-optical device according to claim 1, wherein the region having the interval is provided at least between the electrode pad and a top portion of the protruding member. The electro-optical device according to claim 1, further comprising a fluid member provided at the interval between the protruding member and the conductive member. The space between the surface of the protruding member and the conductive member before mounting the electronic component on the electro-optical device substrate is the volume of the space between the protruding member and the conductive member before mounting. When,
4. The electricity according to claim 1, wherein the volume of the protruding member elastically deformed by mounting is set to be substantially the same as the volume pushed into the space. 5. Optical device. A substrate;
A projecting member having elasticity provided on the substrate;
And a conductive member provided on the projecting member with an interval between at least part of the surface of the projecting member. In a method for manufacturing an electro-optical device including a substrate and an electronic component mounted on the substrate,
A projecting member forming step of forming a projecting member having elasticity on a substrate provided in the electronic component;
A sacrificial layer forming step of forming a sacrificial layer on the protruding member;
A conductive member forming step of forming a conductive member via the sacrificial layer in at least a portion between the protruding member and the surface of the protruding member;
A sacrificial layer removing step of removing the sacrificial layer;
And a mounting step of mounting the electronic component from which the sacrificial layer has been removed on the substrate. 8. The method of manufacturing an electro-optical device according to claim 7, wherein in the mounting step, the electronic component is pressure-bonded to the substrate so as to eliminate the interval. 8. The method of manufacturing an electro-optical device according to claim 7, wherein in the mounting step, the electronic component is pressure-bonded to the substrate so as to leave at least a part of the interval. 8. The method of manufacturing an electro-optical device according to claim 7, wherein the gap is provided between a rising portion of the protruding member rising from the base material and the conductive member. An electrode pad provided on the base material and electrically connected to the conductive member;
11. The electro-optical device according to claim 7, wherein the region having the interval is provided at least between the electrode pad and a top portion of the protruding member. Device manufacturing method. An electronic apparatus comprising the electro-optical device according to any one of claims 1 to 5.

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