JP2007274043A - Piezoelectric oscillator - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a piezoelectric oscillator compatible with downsizing, for ensuring a sealing state, preventing an integrated circuit element from being wasted, and whose manufacturing is facilitated. <P>SOLUTION: The piezoelectric oscillator includes: a base 10 formed with a substrate 11 and a frame 12; a piezoelectric resonator element 20 mounted on the substrate 11; a cover 30 joined with a step difference part 13 formed to the frame 12 and air-tightly sealing a space part C1 wherein the piezoelectric resonator element 20 is mounted; an integrated circuit element 40 coming into contact with the surface of the cover 30, a wiring part S reaching a mount position of the piezoelectric resonator element 20 from a tip of the frame 12 and provided inside the base 10; and a circuit board 50 joined with the tip of the frame 12 and bumps 42 provided to the integrated circuit element 40 and making the wiring part S and the integrated circuit element 40 conductive with each other, and the cover 30 is configured to include a hook lock part 32 for fixing the integrated circuit element 40, and the circuit board 50 is configured to include throughholes corresponding to positions of the bumps 42, and to include a circuit pattern provided to the surface exposed to connect the bumps 42 and the wiring part S via the throughholes. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

The present invention relates to a piezoelectric oscillator used in an electronic device.

Conventionally, piezoelectric oscillators have been used in electronic devices such as portable communication devices. In such a conventional piezoelectric oscillator, a first cavity portion and a second cavity portion for mounting the integrated circuit element and the piezoelectric oscillator are formed on one main surface of the substrate. The second cavity is located, the integrated circuit element is mounted on the first cavity, the piezoelectric vibration element is mounted on the second cavity, and the first cavity and the second cavity are connected to each other. The structure is hermetically sealed with a lid (see, for example, Patent Document 1).
Further, in a piezoelectric oscillator including a piezoelectric vibration element and an integrated circuit element, a concave portion is formed on a substrate to form a space portion, the space portion is divided into two space portions by a lid, and a piezoelectric portion is formed in a lower space portion. There has also been proposed a piezoelectric oscillator having a configuration in which an oscillation circuit and an integrated circuit element are arranged in an upper space (see, for example, Patent Document 2).

In this piezoelectric oscillator, for example, an integrated circuit element is mounted on a lid body that divides one space portion into two space portions, via holes are formed in the lid body, wiring is provided, and conduction between the piezoelectric vibration element and the integrated circuit element is achieved. I am trying. Further, an integrated circuit element is mounted on a circuit board provided with a wiring pattern, and the second space is closed with this circuit board.
In addition, a piezoelectric oscillator is also proposed in which an integrated circuit element is mounted on a circuit board and a second space remaining on the circuit board is sealed, and the integrated circuit element is accommodated in the space. Yes.
Further, in the piezoelectric oscillator having such a structure, a write control terminal for writing various data to the integrated circuit element is formed on the outer surface of the first container body and / or the second container body (for example, , See Patent Document 3).
Japanese Patent Laid-Open No. 10-22772 (paragraphs 0029 to 0053, FIG. 1) JP 2001-177347 A (paragraphs 0010 to 0015, FIG. 2) JP-A-10-98151 (paragraphs 0021 to 0029, FIG. 5)

  However, along with the downsizing of electronic equipment, piezoelectric oscillators are also required to be downsized. In the piezoelectric oscillator disclosed in Patent Document 2, when a via hole is formed in a member to be sealed (conventionally a lid). There is a risk that the joint surface cannot be sufficiently removed and the airtight state cannot be maintained.

  In addition, in a piezoelectric oscillator in which an integrated circuit element is mounted on a circuit board and a space portion located above the space section on which the piezoelectric vibration element is mounted is closed with the circuit board, a production line for mounting the integrated circuit element on the circuit board And a manufacturing line for manufacturing a piezoelectric vibration element, a lid, and the like are necessary, and there is a risk that the manufacturing becomes complicated.

  Further, in the piezoelectric oscillator disclosed in Patent Document 1, the piezoelectric oscillator having a structure in which the integrated circuit element is mounted in the cavity provided and then mounted on the integrated circuit element is defective. In this case, the integrated circuit elements are discarded, and there is a problem that expensive and normal integrated circuit elements are wasted.

In addition, the conventional piezoelectric oscillator is provided with the write control terminals provided on the outer surface or the like, but a large space for arranging these write control terminals is required on the surface of the container body. For this reason, the area of the container body is increased in the surface direction or the thickness direction, and there is a disadvantage that the entire structure is not miniaturized.
Further, when such a piezoelectric oscillator is mounted on an external electric circuit such as a mother board, a part of the conductive bonding material used for bonding the two adheres to the write control terminal, and the piezoelectric oscillator external terminal As a result, there is a disadvantage that handling of the product becomes complicated, such as the freedom of the electrode shape on the mother board side corresponding to the external terminal.

  Accordingly, an object of the present invention is to provide a piezoelectric oscillator that solves the above-described problems, that is compatible with downsizing, that ensures a sealed state, prevents waste of integrated circuit elements, and that is easy to manufacture.

  In order to solve the above-described problems, the piezoelectric oscillator according to the present invention divides one space portion provided in a base body integrally formed of a substrate and a frame portion into two space portions by a lid, and thereby provides a space on the substrate side. A piezoelectric oscillator in which a piezoelectric vibration element is mounted on a portion and an integrated circuit element is positioned on a tip side of the frame portion, reaches from the tip of the frame portion to a mounting position of the piezoelectric vibration element, and is provided inside the base body A wiring board; a circuit board bonded to the tip of the frame part; the predetermined bump for electrical connection; and the predetermined bump for writing; and the integrated circuit element on a circuit forming surface Predetermined bumps for electrical connection and predetermined bumps for writing are provided, and the surface opposite to the circuit forming surface placed on the lid is in contact with the surface of the lid. A latch that fixes the position of the lid when the integrated circuit element is placed. The circuit board has a through hole corresponding to the position of the predetermined bump for writing, and a write terminal provided to be connected to the bump on the surface exposed through the through hole It is characterized by comprising.

  The piezoelectric oscillator according to the present invention is characterized in that an opening is formed in the center of the circuit board, and resin is filled into the frame from the opening.

According to the piezoelectric oscillator of the present invention, since no via hole is provided in the lid, it is possible to reliably seal the space in which the piezoelectric vibration element is mounted.
In addition, since the integrated circuit element can be fixed simply by being placed on the lid, the production line can be unified, so that the production is facilitated and the production cost can be reduced.

In addition, since it is possible to check the quality of the piezoelectric vibration element before mounting the integrated circuit element, it is possible to make a pass / fail judgment, so unlike the case of checking the characteristics of the piezoelectric vibration element after mounting the integrated circuit element, When the piezoelectric vibration element is not a good product, it is possible to prevent the integrated circuit element from being wasted.
Since the resin is injected into the frame portion, the lid body is also covered with the resin, and even if a gap is generated between the lid body and the frame portion, airtight leakage can be prevented with the injected resin.

  Further, by providing a circuit pattern corresponding to the terminal of the integrated circuit element on the surface of the circuit board, it is possible to prevent a short circuit when mounted on a motherboard or the like and to easily write to the integrated circuit element. .

Next, the best mode for carrying out the present invention (hereinafter referred to as “embodiment”) will be described in detail with reference to the drawings as appropriate.
In addition, in each embodiment, the same code | symbol is attached | subjected about the same component and the overlapping description is abbreviate | omitted.
In addition, the temperature compensation data for compensating the temperature characteristics of the temperature sensing element (thermistor) for detecting the ambient temperature state and the piezoelectric vibration element are stored on the lower surface of the substrate made of insulating ceramic or the like for the integrated circuit element in this embodiment. And an electronic circuit such as a temperature compensation circuit for correcting the vibration characteristics of the piezoelectric vibration element according to the temperature change based on the temperature compensation data, and an oscillation circuit connected to the temperature compensation circuit to generate a predetermined oscillation output. It will be described as being.

(First embodiment)
FIG. 1 is an exploded perspective view showing an example of the piezoelectric oscillator according to the first embodiment of the present invention. FIG. 2A is a view showing a state in which the lid is bonded to the base body, and FIG. 2B is a view showing a state before the circuit board is bonded to the base body. FIG. 3A is a perspective view showing an example of the piezoelectric oscillator according to the first embodiment of the present invention, and FIG. 3B is a cross-sectional view taken along line AA in FIG.

  As shown in FIG. 1, a piezoelectric oscillator 100 according to the first embodiment of the present invention includes a quartz crystal vibration element (hereinafter referred to as “piezoelectric vibration element”) 20 that is a piezoelectric vibration element, and a piezoelectric vibration element 20. Base body 10, lid 30 for hermetically sealing piezoelectric vibration element 20, integrated circuit element 40 placed and fixed on lid 30, circuit board 50 electrically connected to integrated circuit element 40, and base 10 And the wiring part S provided in the main part.

  A piezoelectric vibration element 20 shown in FIG. 1 is formed by attaching and forming a pair of vibration electrodes 22 on both main surfaces of a piezoelectric piece 21 obtained by cutting a crystal along a predetermined crystal axis, and a fluctuation voltage from the outside is a pair of vibrations. When applied to the piezoelectric piece 21 via the electrode 22, thickness shear vibration is caused at a predetermined frequency. The piezoelectric vibration element 20 is mounted in the space C1 on the base 11 side constituting the base 10 described later.

As shown in FIGS. 1 and 3B, the base body 10 is mainly composed of a rectangular plate-like substrate 11 and a frame portion 12 having an annular shape having a step 13 provided at an edge of the substrate 11. It is made of glass cloth base resin such as epoxy resin, polycarbonate, epoxy resin, polyimide resin, or ceramic material such as glass-ceramic, alumina ceramic, and the like. It is integrally formed so as to form a rectangular shape.
The base body 10 has a space C1 formed between the step portion 13 and the substrate 11 by the step portion 13 of the frame portion 12, and a space formed between the step portion 13 and the tip of the frame portion 12. Part C2 is formed.

  As shown in FIG. 1 and FIG. 3B, the substrate 11 is provided with a pair of mounting pads 14 for mounting the piezoelectric vibration element 20 in the space C1, and Au bumps, solder, anisotropic The piezoelectric vibration element 20 can be mounted by a conductive adhesive DS such as a conductive conductive adhesive. The piezoelectric adhesive element 20 is electrically and mechanically connected to the mounting pad 14 by the conductive adhesive DS.

External connection terminals (power supply voltage terminal, ground terminal, oscillation output terminal, oscillation control terminal) ST are formed at the back side of the substrate 11, that is, at the four corners of the surface opposite to the surface on which the frame portion 12 is provided. At least two write control terminals (not shown) are formed on the periphery between the four external connection electrode terminals.
The four external connection terminals function as terminals for connecting the piezoelectric oscillator 100 according to the embodiment of the present invention to an external wiring board (not shown) such as a mother board. The piezoelectric oscillator 100 is connected to the external wiring. When mounted on a substrate, it is electrically connected to the circuit wiring of the external wiring substrate through a conductive adhesive such as solder.

As shown in FIGS. 1 and 3B, the frame portion 12 has a rectangular shape in plan view, is formed in an annular shape, and is provided at an edge portion of the substrate 11. The frame portion 12 is formed with a step portion 13 in the vicinity of the intermediate height thereof, and is formed such that the space portion C2 on the distal end side of the frame portion 12 is larger than the space portion C1 on the substrate 11 side.
The stepped portion 13 is provided with a metallized layer 15 for joining with a lid 30 described later. The front end of the frame portion 12 is a surface to which a plate-like circuit board 50 described later is joined, and connection pads 16A to 16N are provided at positions corresponding to the end portions of the circuit pattern provided on the circuit board 50. ing.

  As shown in FIGS. 1 and 3B, the mounting pads 14, the external connection terminals ST, and the predetermined connection pads among the connection pads 16 </ b> A to 16 </ b> N are inside the substrate (substrate 11 and frame portion 12) 10. Corresponding ones are electrically connected to each other through a wiring portion S provided in a via hole (not shown) provided in. That is, the predetermined wiring portion S is provided inside the base body 10 and reaches from the tip of the frame portion 12 to the mounting position (mounting pad 14) of the piezoelectric vibration element 20 provided on the substrate 11.

  As the integrated circuit element 40, a conventional one is used. As shown in FIG. 1, the shape of the integrated circuit element 40 is a rectangular shape in plan view. One main surface of the integrated circuit element 40 is a circuit forming surface, and four terminals 41 in total in the longitudinal direction and three in the lateral direction are provided along the outer periphery of the surface. Further, the other main surface of the integrated circuit element 40 is brought into contact with the surface of the lid 30. Each terminal 41 is provided with a bump for electrical connection and a bump 42 for writing made of a conductive material conventionally used.

  As shown in FIG.1 and FIG.3 (b), the cover body 30 becomes a plate body used as planar view rectangular shape, and the sealing material 31 is provided in the edge of the one main surface, and the other side The main surface is provided with a latching portion 32 for fixing the placement position of the integrated circuit element 40 placed at the center thereof. Conventionally used brazing materials (gold tin, silver brazing) are used as the sealing material.

Moreover, the latching | locking part 32 is a dent of the magnitude | size which the integrated circuit element 40 fits. For example, when the lid 30 is made of metal, the latching portion 32 is formed such that the same area as the surface area of the integrated circuit element 40 is recessed by driving.
As a result, the integrated circuit element 40 is positioned in the space C2 formed between the step portion 13 and the tip of the frame portion 12.

  The lid 30 is placed on the metallized layer 15 provided on the stepped portion 13 of the frame 12 so as to be in contact with the metallized layer 15, and the lid 30 is metalized with the sealant 31. By joining the layer 15, the space C1 in which the piezoelectric vibration element 20 is mounted is hermetically sealed.

  As shown in FIGS. 1, 2 (b), and 3 (b), the circuit board 50 has a rectangular shape in plan view so as to correspond to the base 10, and has an opening 53 at the center, and the integrated circuit element 40. Of the eight bumps provided in the write terminals 51K and 51L on the surface facing the outside of the circuit board 50 through through holes formed at positions corresponding to the positions of the bumps 42 used for writing. Circuit patterns 51A to 51D and 51F to 51I that are provided without crossing the positions corresponding to the positions of the other bumps and the positions corresponding to the connection pads 16A to 16N provided at the tip of the frame portion 12 are provided. Is provided. Further, circuit patterns 51E and 51J are provided on the surface facing the provided through hole.

  For example, when the bump 42 located at the center of the three bumps provided on the short side of the integrated circuit element 40 is used for writing, the circuit board 50 is provided with a through hole at a position corresponding to the bump 42. It is done. Write terminals 51K and 51L are provided on the surface facing the outside of the circuit board 50 through the through hole (surface opposite to the surface facing the integrated circuit element 40). Further, the surface of the circuit board 50 facing the integrated circuit element 40 intersects from a position corresponding to the bump not used for writing to a position corresponding to the connection pads 16A to 16N provided at the tip of the frame portion 12. The circuit patterns 51 </ b> A to 51 </ b> D and 51 </ b> F to 51 </ b> I and the circuit patterns 51 </ b> E and 51 </ b> J are provided on the surface facing the provided through holes.

  The integrated circuit element 40 has bumps provided to increase the strength of mechanical connection, but the circuit board 50 is also provided with a circuit pattern for such bumps. This is because it corresponds to the position of the terminal for electrical connection that is changed depending on the circuit state of the integrated circuit element 40. Therefore, even if the position of the terminal for electrical connection is changed, it can respond.

  In addition, the circuit board is arranged so that the end portions on the outer edge side of the circuit patterns 51B, 51C, 51G, 51H correspond to the positions of the connection pads 16B, 16C, 16I, 16J provided at the tip of the frame portion 12 of the base body 10. It is provided on the outer edge side of the main body 51. Further, the end portions on the outer edge side of the circuit patterns 51E and 51J are provided on the outer edge side of the circuit board main body 51 so as to correspond to the positions of the connection pads 16F and 16M provided on the front end of the frame portion 12 of the base body 10. ing.

Further, the end portions on the outer edge side of the circuit patterns 51A, 51D, 51F, and 51I branch toward two sides that intersect at right angles at the corners of the circuit board body 51, and end portions on the outer edge side of the circuit pattern 51A, respectively. Are the circuit patterns 51AA, 51AB, the circuit pattern 51D is the outer edge of the circuit pattern 51DA, 51DB, the circuit pattern 51F is the outer edge of the circuit pattern 51FA, 51FB, and the circuit pattern 51I is the outer edge of the circuit pattern 51I. The patterns are 51IA and 51IB.
These circuit patterns 51AA, 51AB, 51DA, 51DB, 51FA, 51FB, 51IA, 51IB are connection pads 16A, 16N, 16D, 16E, 16G, 16H, 16K, 16L provided at the tip of the frame portion 12 of the base body 10. The circuit board body 51 is provided on the edge side of the surface facing the integrated circuit element 40 so as to correspond to the positions of

Since the number of connection points increases by forming in this way, the connection strength when the circuit board 50 is connected to the frame portion 12 can be increased.
In addition, since the write terminals 51K and 51L are provided on the exposed surface of the circuit board 50 through the through holes, writing to the integrated circuit element 40 is facilitated, and the side surface of the piezoelectric oscillator is conventionally provided. Since no writing terminal is provided, there is no fear of a short circuit, and the system surface shape of the piezoelectric oscillator 100 can be used effectively, so that the size can be reduced.

Next, the manufacturing process of the piezoelectric oscillator according to the first embodiment of the present invention will be described.
As shown in FIG. 1, a stepped portion 13 is formed at the edge of a substrate 11 having an external connection terminal ST and a mounting pad 14, and connection pads 16A to 16N are provided at the tip of the frame portion 12, and the connection pads 16A to 16A are provided. In the base body 10 in which the wiring portion connected to 16N is formed, the piezoelectric vibration element 20 is first mounted on the mounting pad. At this time, the lead electrode extending from the excitation electrode 21 of the piezoelectric vibration element 20 and the mounting pad 14 are connected by the conductive adhesive DS.

As shown in FIG. 2A, after the piezoelectric vibration element 20 is mounted, the lid 30 is placed on the stepped portion 13 of the frame 12 of the base body 10, and the space C1 in which the piezoelectric vibration element 20 is mounted is opened. Seal tightly.
In this state, the characteristics of the piezoelectric vibration element 20 are confirmed, and only those determined as “non-defective” are used.

  As shown in FIG. 2 (b), the integrated circuit element 40 is arranged in the latching portion 32 provided on the lid 30, and the surface opposite to the circuit forming surface is brought into contact with the surface of the lid 30. The mounting position of the integrated circuit element 40 is fixed by the latching portion 32.

  As shown in FIGS. 3A and 3B, after the position of the integrated circuit element 40 is fixed, the circuit board 50 is placed on the frame portion 12. At this time, one end 51AA, 51B, 51C, 51DA, 51DB, 51E, 51FA, 51FB, 51G, 51H, 51IA of the circuit pattern located at the edge of the surface facing the integrated circuit element 40 outside the circuit board 50 , 51IB, 51J, 51AB and the connection pads 16A to 16N of the corresponding frame 12 are connected via a conductive adhesive (not shown), and the other end is provided in the integrated circuit element 40. Connect with the bumps. The write bumps 42 of the integrated circuit element 40 are connected to the write terminals 51K and 51L of the circuit board 50. Each bump may be melted and bonded to each corresponding circuit pattern, or may be bonded with a conductive adhesive.

  In this state, predetermined information is written to the integrated circuit element 40 using the write terminals 51K and 51L connected to the integrated circuit element 40.

  Therefore, since the piezoelectric oscillator 100 is configured as described above, it is possible to integrate the piezoelectric oscillator 100 without complicating the manufacturing line, thereby facilitating the manufacturing and reducing the manufacturing cost. In addition, since no through hole is provided in the lid 30, the sealing of the space C <b> 1 in which the piezoelectric vibration element 20 is mounted can be ensured.

  In addition, since the characteristics of the piezoelectric vibration element 20 can be confirmed before the integrated circuit element 40 is mounted and the quality can be determined, the characteristics of the piezoelectric vibration element 20 after the integrated circuit element 40 is mounted are confirmed. Unlike the case, it is possible to prevent the integrated circuit element 40 from being wasted when the piezoelectric vibration element 20 is not a good product.

(Second embodiment)
FIG. 4 is a cross-sectional view showing an example of a piezoelectric oscillator according to the second embodiment of the present invention.
The piezoelectric oscillator 101 according to the second embodiment of the present invention is different from the first embodiment in that the resin J is filled in the space C2.

The resin J is made of an insulating material, and is filled into the space C2 from the opening 53 provided in the circuit board 50 as shown in FIG.
At this time, the resin J covers the entire surface of the lid body 30 on which the integrated circuit element 40 is placed, while the circuit forming surface of the integrated circuit element 40 (the surface opposite to the surface in contact with the lid body 30). ) Until it covers. The resin J may be filled until the opening 53 is reached.

  As a result, the lid body is also covered with the resin, and even if a gap is generated between the lid body and the frame portion, it is possible to prevent airtight leakage with the injected resin. Also, the circuit formation surface of the integrated circuit element 40 can be prevented. Can be protected.

(Third embodiment)
Fig.5 (a) is a figure which shows an example of the piezoelectric oscillator which concerns on 2nd embodiment of this invention, (b) is BB sectional drawing of (a).
In the piezoelectric oscillator 102 according to the third embodiment of the present invention, the protective film F may be attached to the surface of the circuit board 50 on which the write terminals 51K and 51L are formed. This protective film F is made of an insulating material and plays a role of preventing a short circuit between the write terminals 51K and 51L.
Thus, even if the piezoelectric oscillator 102 of the present invention is mounted on a mother board or the like, even if foreign matter is mixed in, it is possible to prevent the writing terminals 51K and 51L from being short-circuited.

The present invention is not limited to the above-described embodiment, and various changes and improvements can be made without departing from the gist of the present invention. For example, you may form a latching part so that it may protrude from a cover body. In other words, the position of the integrated circuit element 40 can be fixed even if the latching part is formed as a wall part formed into four protrusions and the four lower edges of the integrated circuit element 40 are pressed. At this time, the side surface of the latching portion on the side of the integrated circuit element 40 is tapered so that the opening widens as the distance from the surface of the lid 30 increases, and when the integrated circuit element 40 is placed, the integrated circuit element 40 is placed. Is placed on the surface of the lid 30 so as to slide on the tapered surface. Therefore, when the integrated circuit element 40 is placed on the surface of the lid 30, the position where the integrated circuit element 40 is placed can be fixed by the latching portion 32.
In addition, this hooking portion may be affixed on the lid 30 with an adhesive or the like.
The circuit pattern formed on the circuit board only needs to correspond to the arrangement position of the bumps provided on the integrated circuit element, and the shape of the circuit pattern is not limited to the shape of the first embodiment.
Further, a plate material having a shielding effect may be provided inside the protective film to prevent interference due to electromagnetic waves from the outside.

1 is an exploded perspective view showing an example of a piezoelectric oscillator according to a first embodiment of the present invention. (A) is a figure which shows the state which joined the cover body to the base | substrate, (b) is a figure which shows the state before joining a circuit board to a base | substrate. (A) is a perspective view which shows an example of the piezoelectric oscillator which concerns on 1st embodiment of this invention, (b) is AA sectional drawing of (a). It is sectional drawing which shows an example of the piezoelectric oscillator which concerns on 2nd embodiment of this invention. (A) is a figure which shows an example of the piezoelectric oscillator which concerns on 2nd embodiment of this invention, (b) is BB sectional drawing of (a).

Explanation of symbols

DESCRIPTION OF SYMBOLS 100,101 Piezoelectric oscillator 10 Base | substrate 11 Board | substrate 12 Frame part 13 Level difference part 20
Piezoelectric vibration element 30 Lid 32 Latching part 40 Integrated circuit element 42 Bump 50 Circuit board 51K, 51L Writing terminal 53 Opening part C1, C2 Space part S Wiring part J Resin F Protective film

Claims (2)

One space portion provided in a base body integrally formed with a substrate and a frame portion is divided into two space portions by a lid, and a piezoelectric vibration element is mounted in the space portion on the substrate side, and the tip of the frame portion A piezoelectric oscillator having an integrated circuit element on its side,
Reaching the mounting position of the piezoelectric vibration element from the tip of the frame part, and a wiring part provided inside the base body,
A circuit board bonded to the tip of the frame portion, the predetermined bump for electrical connection and the predetermined bump for writing, and
The integrated circuit element is provided with predetermined bumps for electrical connection and predetermined bumps for writing on a circuit formation surface, and the surface opposite to the circuit formation surface is placed on the lid. Abutted against the surface of the lid,
The lid includes a latching portion for fixing a position when the integrated circuit element is placed,
The circuit board has a through hole corresponding to the position of a predetermined bump for writing, and a writing terminal provided on the surface exposed through the through hole so as to be connected to the bump. A piezoelectric oscillator characterized by comprising.   2. The piezoelectric oscillator according to claim 1, wherein an opening is provided in the center of the circuit board, and resin is filled into the frame from the opening.

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