JP2007251238A - Piezoelectric device and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a piezoelectric device which can adjust frequencies after being sealed with a lid to accurately match frequencies, and is free from deterioration of vibration characteristic, even if it is subjected to a heating process afterwards, and to provide a manufacturing method of the piezoelectric device. <P>SOLUTION: The piezoelectric device has a configuration in which a piezoelectric vibration piece 32 is housed in a package 36 and the package is hermetically sealed. A laser beam LB1 is applied from the outside to partially evaporate a metal film of the piezoelectric vibration piece and frequency adjustment is executed. In the package, a getter member 71 is provided on a portion which is not on an optical path of the laser beam LB1 to be applied from the outside for frequency adjustment, and to which a laser beam LB2 can be applied from the outside of the package. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an improvement in a piezoelectric device in which a piezoelectric vibrating piece is housed in a package and a method for manufacturing the same.

  Packages such as small information devices such as HDDs (hard disk drives), mobile computers, IC cards, mobile communication devices such as mobile phones, car phones, and paging systems, and measuring devices such as gyro sensors Piezoelectric devices such as piezoelectric vibrators and piezoelectric oscillators that house a piezoelectric vibrating piece inside are widely used.

That is, a configuration in which a piezoelectric vibrating piece is accommodated in a case, that is, a package and the case is sealed with a glass cap or the like is widely known (see FIG. 3 of Patent Document 1).
In such a piezoelectric device, a metal weight is formed on one surface of the piezoelectric vibrating piece, that is, one surface of the tuning fork type piezoelectric vibrating piece. Then, the piezoelectric vibrating piece is bonded to the package and hermetically sealed with a glass cap so that the inside of the package is evacuated, and then the laser light is irradiated through the glass cap from the outside, and the tuning fork type vibrating piece There is known a method of performing frequency adjustment by a mass reduction method by applying a part to the weight and evaporating a part thereof.
Japanese Patent No. 2756559

However, when the frequency is adjusted by such a technique, metal (usually “Au”) droplets evaporated by the laser light enclose moisture and adhere to the package. That is, in a state where water is confined in the interior, metal splashes are attached to the inner surface of the package.
When such a piezoelectric device is purchased by a user and mounted on a substrate, a process involving temperature heating such as a reflow process is performed, so that moisture confined in the metal droplets adhering to the inner surface of the package is absorbed. When the airtightly sealed vacuum state is deteriorated by becoming steam and coming out inside the package, there is a problem that the frequency is shifted and the vibration characteristics are deteriorated.

  The present invention provides a piezoelectric device capable of precisely adjusting the frequency after sealing with a lid and adjusting the frequency so that vibration characteristics are not deteriorated even through a subsequent heating process, and manufacturing of the piezoelectric device It aims to provide a method.

  According to the first aspect of the present invention, the piezoelectric vibrating piece is housed in a package and the package is hermetically sealed. The piezoelectric vibrating piece is irradiated with laser light from the outside. A piezoelectric device configured to adjust the frequency by partially evaporating a metal film, wherein the piezoelectric device is in the package and is not located on the optical path of the laser light irradiated from the outside for frequency adjustment. And a piezoelectric device in which a getter material is provided at a location where laser light can be irradiated from the outside of the package.

According to the configuration of the first aspect of the present invention, the getter material is provided in a location in the package that is not on the optical path of the laser light for frequency adjustment, so that the laser light at the time of frequency adjustment after the package is sealed Therefore, the frequency can be adjusted appropriately without obstructing the irradiation.
In this frequency adjustment, the scattered metal droplets contain moisture and adhere to the inner surface of the package.
Here, the laser light is used again to irradiate the getter material with the laser light. Thereby, activation of a getter material is performed.
In this case, since the getter material is provided in the package and at a location not on the optical path of the laser light for frequency adjustment, the laser light applied to the getter material is used for frequency adjustment of the piezoelectric vibrating piece. The metal film is not irradiated and no new metal splashes are generated.
In the reflow process, gettering is performed by the already activated getter material even if the encapsulated water is evaporated from the metal droplets adhering to the inner surface of the package during the frequency adjustment. The water vapor is adsorbed on the getter material. Further, if necessary, gettering can be performed by irradiating the getter material with laser light from the outside even after mounting on a substrate or the like.
Thus, it is possible to provide a piezoelectric device in which the frequency can be precisely adjusted by adjusting the frequency after sealing with the lid, and the vibration characteristics are not deteriorated even through the subsequent heating process.

According to a second invention, in the configuration of the first invention, the piezoelectric vibrating piece includes a base portion formed of a piezoelectric material and at least a pair of vibrating arms extending from the base portion. The metal film formed on the tip side of the vibrating arm of the vibrating piece is configured to be frequency-adjusted by a mass reduction method by irradiating the laser beam through a lid formed of a material that transmits light. It is characterized by that.
According to the configuration of the second aspect of the invention, the frequency can be adjusted by transmitting the lid body and irradiating laser light from the outside to evaporate the metal film formed on the tip side of the vibrating arm of the piezoelectric vibrating piece. Since it is only necessary to place the getter material on any of the inner surfaces of the package other than the tip side of the vibrating arm, it is easy to select a location that satisfies the condition of the first invention.

According to a third invention, in the configuration of the second invention, the base portion of the piezoelectric vibrating piece is joined to the inner bottom surface of the package and is supported in a cantilevered manner, and the bottom surface is the inner surface of the package. A recess is formed at a position corresponding to the tip of the vibrating arm of the piezoelectric vibrating piece, and a getter material is disposed in the recess.
According to the configuration of the third invention, when the getter material is disposed in the recess, the getter material is efficiently avoided by avoiding the optical path of the laser beam at the time of frequency adjustment and following the electrode formation at the time of forming the electrode of the package. Arrangement of the material can be realized.

According to a fourth invention, in the configuration of the second invention, a sealing hole is formed in the bottom of the package, and a getter material is disposed in the sealing hole.
According to the configuration of the fourth invention, when the bulk metal filler is inserted or arranged in the sealing hole and melted by irradiating the laser beam to the filler, the getter material is simultaneously heated to perform gettering. It can be carried out.

  Further, in the fifth invention, the above object is a method of manufacturing a piezoelectric device in which a piezoelectric vibrating piece is bonded in a package and sealed with a lid that transmits light, the package, A pre-process for individually forming the piezoelectric vibrating piece and the lid, a mounting step for bonding the piezoelectric vibrating piece inside the package, a sealing step for hermetically sealing the package with the lid, After sealing with the lid, using a through hole, which is a sealing hole provided at the bottom of the package, degass the sealing hole under heating, and melts and fills the sealing hole with a metal material. And a hole sealing step of irradiating a laser beam from the outside of the package to evaporate a metal film formed on the distal end side of the vibrating arm of the piezoelectric vibrating piece, and In the hole sealing step, the sealing hole A piezoelectric material that inserts or arranges a metal filler together with a getter material, melts the metal filler, and simultaneously performs gettering, and performs the frequency adjusting step immediately after the gettering or simultaneously with the hole sealing step. This is achieved by a device manufacturing method.

According to the configuration of the fifth invention, since the hole sealing and the gettering can be performed at the same time, the moisture in the package can be adsorbed, and the metal scattered in the frequency adjustment process performed at the same time or immediately after that can be absorbed. It is possible to prevent such moisture from adhering to the package. For this reason, even if it heats after that in a reflow process etc., it can prevent generating gas from the metal which scattered and adhered to the inner surface of a package, and can prevent the deterioration of the vibration characteristic caused by gas.
In addition, since the gettering process can be realized without increasing the number of conventional processes, it is possible to adjust the frequency precisely after sealing with the lid body, and also through the subsequent heating process. It is possible to provide a method for manufacturing a piezoelectric device in which the vibration characteristics are not deteriorated.

According to a sixth invention, in the structure of the fifth invention, a commercially available getter material is used as the getter material.
According to the configuration of the sixth aspect of the invention, since the getter material is inserted or disposed in the sealing hole, it is possible to use an inexpensive commercially available getter material, thereby reducing the manufacturing cost of the piezoelectric device.

1 and 2 show an embodiment of a piezoelectric device of the present invention. FIG. 1 is a schematic plan view thereof, and FIG. 2 is a schematic cross-sectional view taken along the line BB of FIG.
In the figure, the piezoelectric device 30 shows an example in which a crystal resonator is configured, and the piezoelectric device 30 houses a piezoelectric vibrating piece 32 in a package 36 as a housing container. The package 36 is formed, for example, by sequentially laminating a plurality of substrates 61, 64, 68 formed by molding an aluminum oxide ceramic green sheet as an insulating material, and then sintering. Each of the second and third substrates 64 and 68 is formed with a predetermined hole on the inner side thereof so that a predetermined inner space S2 is formed on the inner side when stacked. The internal space S2 is a housing space for housing the piezoelectric vibrating piece 32.

A piezoelectric vibrating piece 32 is mounted inside the package 36 and hermetically sealed with a lid 39. Here, the lid 39 is formed by selecting a material such as ceramic, metal, or glass.
In order to enable frequency adjustment after the lid is sealed, the lid 39 is preferably formed of a material that transmits light, such as glass. For example, a plate body such as borosilicate glass can be used.
Further, when the lid 39 is, for example, metal, there is an advantage that the strength is generally higher than that of other materials. An approximate thermal expansion coefficient with the package 36 is suitable, and for example, Kovar can be used. In this case, it is necessary to form a light transmitting region in any part of the package other than the lid.

  In the inner space S2 of the package 36, in the vicinity of the left end portion, the laminated substrate that is exposed to the inner space S2 and constitutes the inner bottom portion has, for example, electrode portions 31, 31 formed by nickel plating and gold plating on tungsten metallization. Is provided. The electrode portions 31 are connected to the outside to supply a driving voltage. Conductive adhesives 43, 43 are applied on the electrode portions 31, 31, and the base 51 of the piezoelectric vibrating piece 32 is placed on the conductive adhesives 43, 43. 43 are hardened. In addition, as the conductive adhesives 43 and 43, a synthetic resin agent as an adhesive component exhibiting a bonding force and containing conductive particles such as fine silver particles can be used. A system-based or polyimide-based conductive adhesive or the like can be used.

The piezoelectric vibrating piece 32 is formed by etching, for example, quartz as a piezoelectric material by a manufacturing process described later. In the case of the present embodiment, the piezoelectric vibrating piece 32 is formed in a small size to obtain necessary performance. Therefore, in particular, the structure shown in the schematic perspective view of FIG. 3 and the C-C line cut end view of FIG. 3 shown in FIG.
That is, the piezoelectric vibrating piece 32 includes a base 51 fixed to the package 36 side, and a pair of vibrating arms 34 extending in parallel to be divided into two forks diagonally leftward in FIG. A so-called tuning fork type piezoelectric vibrating piece having a shape 35 like the tuning fork is used.

As can be understood with reference to FIGS. 3 and 4, long bottomed long grooves 56 and 57 extending in the length direction are formed in the respective vibrating arms 34 and 35 of the piezoelectric vibrating piece 32. The long grooves 56 and 57 are formed on both front and back surfaces of the vibrating arms 34 and 35 as shown in FIG. 4 which is a cross-sectional end view taken along the line CC of FIG.
Further, in FIG. 3, lead electrodes 52 and 53 are formed near both ends in the width direction of the end portion (lower end portion in FIG. 3) of the base portion 51 of the piezoelectric vibrating piece 32. The lead electrodes 52 and 53 are similarly formed on the back surface (not shown) of the base 51 of the piezoelectric vibrating piece 32.

  These lead electrodes 52 and 53 are portions connected to the package-side electrode portions 31 and 31 shown in FIG. 1 by the conductive adhesives 43 and 43 as described above. As shown in FIGS. 3 and 4, the lead electrodes 52 and 53 are integrally connected to excitation electrodes 54 and 55 provided in the grooves 56 and 57 of the vibrating arms 34 and 35, respectively. Yes. Further, as shown in FIG. 4, the excitation electrodes 54 and 55 are also formed on both side surfaces of the vibrating arms 34 and 35. For example, with respect to the vibrating arms 34, the excitation electrodes 54 in the long groove 56. And the excitation electrode 55 of the side part is made to have a different polarity. Further, with respect to the vibrating arm 35, the excitation electrode 55 in the long groove 57 and the excitation electrode 54 on the side surface thereof have different polarities.

  Further, metal films 38 and 38 for frequency adjustment are formed on the distal end sides of the vibrating arms 34 and 35, that is, in the respective distal ends in this embodiment. The metal films 38 and 38 are changed in the frequency adjustment (fine adjustment), which will be described later, by irradiating laser light so that the mass is slightly reduced and the frequency is increased. The frequency adjusting metal films 38 and 38 can be formed simultaneously with the same structure as the driving electrodes when the driving electrodes such as the excitation electrodes 54 and 55 are formed.

  As shown in FIGS. 1 and 2, the package 36 includes a rectangular recess 42 on the inner bottom surface thereof. The recess 42 can be formed by removing a part of the second substrate 64. The recess 42 is provided at a position corresponding to the tip of each vibrating arm 34, 35 of the piezoelectric vibrating piece 32, and each vibrating arm of the piezoelectric vibrating piece 32 when an external impact is applied to the piezoelectric device 30. When the tips of 35 and 36 are swung downward, it is possible to avoid collision with the inner bottom portion of the package 36 and to prevent damage.

Further, as shown in FIG. 2, a through hole 37 for hole sealing is provided at the bottom of the package 36.
Since the gettering is performed in the hole sealing process described later, preferably, the through hole 37 is near the center of the package 36, and in particular, the vibration arms 34 and 35 of the piezoelectric vibrating piece 32 bonded to the package. It is preferable to set it at a position (see FIG. 1) that does not overlap with the metal film 38 for frequency adjustment at the tip portion in plan view.

The through hole 37 is a hole that communicates the outside with the inside of the package 36, and the first hole 37 a and the second hole 37 b that is reduced in diameter are provided so as to overlap each other. 62. The through hole for hole sealing does not necessarily have such a double hole structure, and may be a tapered through hole that gradually increases in diameter toward the outside, for example, but has a stepped portion 62. Thus, there is an advantage as described later.
The through-hole 62 of the sealing hole 61 is hermetically sealed by filling a metal sealing material 39 such as Au—Ge, for example.

(Piezoelectric device manufacturing method)
Next, an embodiment of a method for manufacturing the piezoelectric device 30 will be described.
FIG. 5 is a simple flowchart for explaining an embodiment of the method for manufacturing the piezoelectric device 30 of the present embodiment.
(pre-process)
The piezoelectric vibrating piece 32, the package 36, and the lid 39 of the piezoelectric device 30 are separately manufactured as a pre-process (ST11).
For example, the lid 39 is prepared as a lid having a size suitable for sealing a package 36 by cutting a glass plate having a predetermined size.
As described above, the package 36 is formed by laminating a plurality of substrates formed by molding an aluminum oxide ceramic green sheet and then sintering. At the time of molding, each of the plurality of substrates forms a predetermined hole on the inner side thereof, so that a predetermined inner space S2 is formed on the inner side when stacked.

When the tuning fork type piezoelectric vibrating piece 32 is formed using a quartz wafer or the like, the piezoelectric vibrating piece 32 is an electric axis, an Y axis is a mechanical axis, and a Z axis is an optical axis. Thus, the quartz wafer is cut from a piezoelectric material, for example, a single crystal of quartz.
In addition, when cutting out from a single crystal of quartz, in the orthogonal coordinate system composed of the X-axis, Y-axis, and Z-axis described above, a crystal Z plate that is cut out by rotating clockwise within a range of several degrees around the Z-axis is predetermined. It is obtained by cutting and polishing to a thickness of.
Then, a necessary anticorrosion film (not shown) is provided on the quartz wafer to form a mask, and the portions of the long grooves 56 and 57 of the vibrating arm are formed by half etching using a hydrofluoric acid solution or the like.
Next, an excitation electrode as a drive electrode is formed.
That is, a metal film to be an electrode is formed on both the front and back surfaces of a quartz wafer. This metal film is formed, for example, by a technique such as vapor deposition or sputtering with chromium as a base.
Thereafter, each electrode as described in FIG. 3 is formed by a photolithography technique. At this time, the metal films 38 and 38 for adjusting the frequency are also formed at the same time.

  Next, a piezoelectric pattern as a tuning fork type piezoelectric vibrating piece is formed by forming a mask pattern (not shown) so as to conform to the outer shape including each vibrating arm and base, for example, by a corrosion-resistant film and performing wet etching using a hydrofluoric acid solution or the like. 32 external shapes are formed (see FIG. 3). Subsequently, an excitation electrode is formed on each side surface of the vibrating arms 34 and 35 of the piezoelectric vibrating piece 32 of FIG. 3 by a photolithography technique, whereby the piezoelectric vibrating piece 32 is completed.

(Mounting process)
After the above pre-process is executed, the completed piezoelectric vibrating piece 32 is joined (ST12).
Specifically, as shown in FIGS. 1 and 2, conductive adhesives 43, 43 are applied on the electrode portions 31, 31, respectively, and the piezoelectric vibrating piece is applied on the applied conductive adhesives 43, 43. 32 bases 51 are placed and a hard load is applied.
In this state, the piezoelectric vibrating piece 32 is joined in a cantilever manner by overheating in a belt furnace or the like to cure the conductive adhesive.

Next, a predetermined brazing material 36a made of a low melting point metal or the like is placed on the upper end of the package 36, and a glass lid 39 is placed and heated in a vacuum atmosphere. Thereby, the package 36 is hermetically sealed by the lid 39 (ST13).
Then, it moves to a hole sealing process.
FIG. 5 shows an example of the hole sealing step. In the heated state, for example, the package 36 is inverted and the getter material 71 that adsorbs moisture is disposed on the stepped portion 62. As the getter material 71, a so-called active metal that is activated when heat is applied is used, and a metal that adsorbs H ₂ O on the surface is particularly preferable. More preferably, it is a metal plate which is a commercially available bulk getter material, and titanium (Ti), zirconium (Zr), or alloys of these metals are suitable. In particular, when titanium is used alone, the melting point may be too high. On the other hand, the alloy has not only good moisture adsorptivity, but also has a suitable melting point and is easy to handle.

Then, a metal ball 39 a for filling metal is disposed on the getter material 71. Since the metal ball 39a has a spherical shape, it can be easily rolled and put into the hole 37a, thereby facilitating the work.
As the metal sphere 39a, for example, gold-germanium (Au—Ge), gold tin (Au—Sn), and the like are excellent. That is, since it is an alloy that does not contain lead, no harmful lead is produced even if it is discarded, and it does not melt even in the reflow process.
During this time, gas in the package 36 from the gap between the through-hole 37 and the getter material 71 placed thereon, that is, gas generated from the conductive adhesive 43 by heating at the time of sealing the lid, Water vapor or the like emitted from the ceramic of the package 36 is discharged to the outside.

In this state, as shown in FIG. 5, the metal ball 39a is irradiated with a laser beam LB2 for hole sealing. Thereby, the metal sphere 39a is instantaneously melted and filled in the through hole 37, and the through hole 37 is hermetically sealed, and at the same time, the getter material 71 is heated to activate the getter material 71. Yes (ST14).
(Frequency adjustment process)
Immediately after the hole sealing or simultaneously with the hole sealing step, as shown in FIG. 2, the laser light LB1 for frequency adjustment is irradiated into the package 36 from the outside and applied to the metal film 38 of the piezoelectric vibrating piece 32. Thereby, a part of the metal film 38 is evaporated, and the frequency adjustment (fine adjustment) by the mass reduction method can be performed (ST15).
Subsequently, necessary inspection is performed (ST16), and the piezoelectric device 30 is completed (ST17).

Thus, according to the present embodiment, by performing degassing from the inside of the package 36 after the lid 39 is sealed, the degree of vacuum in the package 36 is improved and excellent vibration characteristics can be exhibited.
Further, the frequency can be precisely adjusted by adjusting the frequency after sealing with the lid 39 and sealing the hole. In addition, hole sealing and gettering can be performed simultaneously, and moisture in the package 36 can be adsorbed. Therefore, it is possible to prevent the metal scattered in the frequency adjustment process performed at the same time or immediately after this from being included in the package 36 including these moisture.
And even if it heats by a reflow process etc. after that, it can prevent that gas produces | generates from the metal which scattered and adhered to the inner surface of the package 36, and can prevent the deterioration of the vibration characteristic caused by gas.
Further, the gettering process can be realized without increasing the number of conventional processes.

  FIG. 5 shows a modification. That is, “the package 36 is a portion that is not on the optical path of the laser beam LB1 irradiated from the outside for frequency adjustment, and the laser beam LB2 (for gettering) from the outside of the package 36 is The other example regarding "the part which can be irradiated" is shown.

As shown in the drawing, the getter material 72 is formed in the recess 42 of the package 36 described in FIG.
Is located at the bottom. The arrangement of the getter material 72 is performed in a package forming process, which is a previous process. As the getter material 72, titanium (Ti), zirconium (Zr), or alloys of these metals are suitable.
Thus, according to this modification, in the frequency adjusting step of step 15 described in FIG. 5, the metal film 38 of the vibrating arm 34 of the piezoelectric vibrating piece is irradiated with the laser beam LB1 for frequency adjustment as shown in the figure. If the optical path of the laser beam is directly shaken and the getter material 72 is irradiated as the gettering laser beam LB2, the frequency adjustment step and the gettering step can be performed very easily using the same heating source. There is an advantage.

The present invention is not limited to the above-described embodiment. Each configuration of each embodiment can be appropriately combined or omitted, and can be combined with other configurations not shown.
In addition, the present invention is not limited to the names of crystal resonators, crystal oscillators, crystal filters, SAW devices, gyros, angle sensors, etc. It can be applied to a piezoelectric device using this.
Moreover, in the above-described embodiment, a box-shaped package using ceramics is used. However, the present invention is not limited to such a form, and the package having a different shape, that is, a package that accommodates a piezoelectric vibrating piece in a container is also used. The present invention can be applied.

1 is a schematic plan view of a piezoelectric device according to an embodiment of the present invention. The schematic sectional drawing in the BB line of the piezoelectric device of FIG. FIG. 2 is a schematic perspective view of a piezoelectric vibrating piece used in the piezoelectric device of FIG. 1. FIG. 4 is an end view taken along the line C-C of the piezoelectric vibrating piece of FIG. 3. The flowchart which shows embodiment of the manufacturing method of the piezoelectric device of FIG. Explanatory drawing which shows the hole sealing in the manufacturing method of FIG. The figure of the principal part which shows the modification of the piezoelectric device of FIG.

Explanation of symbols

  30 ... Piezoelectric device, 36 ... Package, 32 ... Piezoelectric vibrating piece, 34, 35 ... Vibrating arm, 51 ... Base, 54, 55 ... Excitation electrode, 56, 57 ... .Long groove, 71, 72 ... getter material

Claims (6)

The package has a structure in which the piezoelectric vibrating piece is accommodated in the package and the package is hermetically sealed, and the frequency adjustment is performed by irradiating a laser beam from the outside to partially evaporate the metal film of the piezoelectric vibrating piece. A piezoelectric device having a configuration,
A getter material is provided in a location in the package that is not on the optical path of the laser light emitted from the outside for frequency adjustment and can be irradiated with laser light from the outside of the package. A piezoelectric device characterized by the above.   The piezoelectric vibrating piece is a tuning fork-type piezoelectric vibrating piece provided with a base formed of a piezoelectric material and at least a pair of vibrating arms extending from the base, and a metal film formed on the tip side of the vibrating arm of the piezoelectric vibrating piece 2. The piezoelectric device according to claim 1, wherein the frequency is adjusted by a mass reduction method by irradiating the laser beam through a lid formed of a light transmitting material.   The base of the piezoelectric vibrating piece is joined to the inner bottom surface of the package and is supported in a cantilever manner, and is the bottom surface inside the package, corresponding to the tip of the vibrating arm of the piezoelectric vibrating piece The piezoelectric device according to claim 2, wherein a recess is formed at a position where the getter material is disposed, and a getter material is disposed in the recess.   The piezoelectric device according to claim 2, wherein a sealing hole is formed in the bottom of the package, and a getter material is disposed in the sealing hole. A piezoelectric device manufacturing method in which a piezoelectric vibrating piece is bonded in a package and sealed with a lid that transmits light,
A pre-process for individually forming the package, the piezoelectric vibrating piece, and the lid;
A mounting step of bonding the piezoelectric vibrating piece inside the package;
A sealing step of hermetically sealing the package with the lid;
After sealing with the lid, using a through hole, which is a sealing hole provided at the bottom of the package, degass the sealing hole under heating, and melts and fills the sealing hole with a metal material. A hole sealing step,
A frequency adjustment step of irradiating a laser beam from the outside of the package to evaporate a metal film formed on the tip side of the vibrating arm of the piezoelectric vibrating piece,
And in the hole sealing step, by inserting or arranging a metal filler together with a getter material in the sealing hole and melting the metal filler, gettering is performed at the same time,
The method of manufacturing a piezoelectric device, wherein the frequency adjusting step is performed immediately after the gettering or simultaneously with the hole sealing step.   The method for manufacturing a piezoelectric device according to claim 5, wherein a commercially available getter material is used as the getter material.

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