JP2007139712A - Probe holder and probe unit - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an economical probe holder and an economical probe unit of excellent durability, capable of securing a desired stroke when contacting with circuit structure that is an inspection object. <P>SOLUTION: This probe holder/probe unit is provided with a tip part for holding a plurality of probes for inputting and outputting respectively electric signals into/from the circuit structure by contacting with the circuit structure, a base end part for supporting the tip part, and a deflection part interposed between the tip part and the base end part to generate a deflection of the tip part with respect to the base end part. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a probe holder and a probe for holding a plurality of probes that respectively input and output electric signals in contact with the circuit structure when conducting a conduction state inspection or an operation characteristic inspection in a circuit structure such as a liquid crystal panel or an integrated circuit. It is about the unit.

  Conventionally, when conducting a conduction state inspection or an operation characteristic inspection of a circuit structure such as a liquid crystal panel (LCD) or an integrated circuit, an inspection using a probe is generally performed. Since the connection electrodes and terminals formed on the inspection object such as a liquid crystal panel have a structure in which a large number are arranged at a minute and narrow interval, a large number of connection electrodes or terminals formed on the inspection object The structure which electrically connects with a test object by using the probe unit by which the probe is arrange | positioned corresponding to is employ | adopted (for example, refer patent document 1). This technique is characterized in that a plurality of beam-shaped probes are collectively formed on the surface of a substrate using a lithography technique to cope with a reduction in the arrangement interval of electrodes and terminals for connecting circuit structures. .

JP 2002-151557 A

  However, the above-described prior art has a problem that the stroke caused by the contact is too small when inspecting an inspection object such as a liquid crystal panel that may cause a large warp on the substrate. In order to solve this problem and secure a stroke as large as required for inspection, it is necessary to apply a large load to the probe. However, if such a large load is applied, there is a problem in the durability of the probe itself. There was a risk of it occurring.

  In addition, increasing the accuracy of the contact position of a probe formed with high accuracy by photolithography requires manufacturing costs, and also costs when replacing the probe during maintenance, which is not always economical.

  The present invention has been made in view of the above, and provides an economical probe holder and probe unit that can ensure a desired stroke when contacting a circuit structure to be inspected, has excellent durability, and is economical. The purpose is to do.

  In order to solve the above-described problems and achieve the object, the invention according to claim 1 accommodates a plurality of probes that respectively input and output electrical signals to and from the circuit structure by contacting the circuit structure. A probe holder, a distal end holding the plurality of probes, a proximal end supporting the distal end, and a proximal end of the distal end interposed between the distal end and the proximal end And a bending generating means for generating bending with respect to the portion.

  According to a second aspect of the present invention, in the first aspect of the present invention, at least a part of the deflection generating means is integrally formed with the distal end portion and the base end portion, and is more plate-shaped than the distal end portion and the base end portion. It is characterized by a thin beam.

  According to a third aspect of the present invention, in the first or second aspect of the invention, the deflection generating means includes an elastic member that connects the distal end portion and the proximal end portion.

  According to a fourth aspect of the present invention, in the third aspect of the present invention, the elastic member is one or a plurality of leaf springs.

  According to a fifth aspect of the present invention, there is provided a probe unit comprising: a plurality of probes that respectively input and output electrical signals to and from the circuit structure by contacting the circuit structure; a tip portion that holds the plurality of probes; A probe holder having a base end portion that supports a distal end portion, and a bending generating means that is interposed between the distal end portion and the base end portion and generates a deflection of the distal end portion with respect to the base end portion. It is characterized by that.

  According to a sixth aspect of the present invention, in the fifth aspect of the present invention, at least a part of the deflection generating means is integrally formed with the distal end portion and the proximal end portion, and is more plate-shaped than the distal end portion and the proximal end portion. It is characterized by a thin beam.

  A seventh aspect of the invention is characterized in that, in the fifth aspect of the invention, the deflection generating means includes an elastic member that connects the distal end portion and the proximal end portion.

  The invention according to claim 8 is the invention according to claim 7, wherein the elastic member is one or a plurality of leaf springs.

  The invention according to claim 9 is the invention according to any one of claims 5 to 8, wherein the probe is arranged on the wiring formed on the surface of the sheet-like base material and one end of the wiring. And a contact portion that is in direct contact with the circuit structure.

  According to the present invention, a distal end portion that holds a plurality of probes that respectively input and output electrical signals to and from the circuit structure by contacting the circuit structure, a proximal end portion that supports the distal end portion, A deflection generating means that is interposed between the distal end portion and the proximal end portion and generates a deflection of the distal end portion with respect to the proximal end portion. It is possible to provide an economical probe holder and probe unit that can secure a stroke and is excellent in durability.

  The best mode for carrying out the present invention (hereinafter referred to as “embodiment”) will be described below with reference to the accompanying drawings. Note that the drawings are schematic, and it should be noted that the relationship between the thickness and width of each part, the ratio of the thickness of each part, and the like may differ from the actual ones. Of course, there may be included a portion having a different dimensional relationship or ratio.

(Embodiment 1)
FIG. 1 is a diagram showing a configuration of a probe unit according to Embodiment 1 of the present invention. 2 is an arrow view in the direction of arrow A in FIG. 1 showing the external configuration of the main part of the probe unit. Furthermore, FIG. 3 is a bottom view of the vicinity of the tip of the probe unit as viewed from the direction of arrow B in FIG. The probe unit 1 shown in FIG. 1 to FIG. 3 performs a conduction state inspection and an operation characteristic inspection before completion of an inspection object, and is in contact with the circuit structure of the inspection object and the circuit for inspection. Probe sheet 2 having a plurality of probes for inputting and outputting signals, probe holder 3 for holding probe sheet 2, fixing member 4 for fixing probe sheet 2 to probe holder 3, probe holder 3 and inspection object And an adjustment mechanism 5 that adjusts the contact position with.

  The probe sheet 2 is arranged in a predetermined pattern in the vicinity of the edge of the base material 21 in the short direction of the sheet-like base material 21 made of an insulating material such as polyimide, and inspects liquid crystal panels, integrated circuits, etc. A plurality of bumps 22 that are in direct contact with the object 200 and parallel to each other at a predetermined interval along the longitudinal direction of one surface (the lower surface side in FIG. 1) of the probe sheet 2 with each bump 22 serving as one starting point. And a plurality of wirings 23 formed on each other. The bumps 22 and the wirings 23 are formed using nickel or the like, and a set of both forms one probe element.

  The positions at which the bumps 22 are arranged are determined according to the arrangement pattern of the connection electrodes or terminals provided on the inspection object 200 to be contacted. FIG. 3 shows a case where the bumps 22 are straight. Although shown, it may be zigzag or staggered. Also, the number of bumps 22 and wirings 23 shown in FIG. 3 is merely an example, and hundreds of bumps 22 and wirings 23 are arranged for one probe unit 1 corresponding to the wiring pattern of the inspection object 200. There is also a case. Furthermore, the shape of the bump 22 may be other than the rectangular parallelepiped shape shown in FIG. 1 or the like, and may be, for example, a substantially cone shape or a substantially frustum shape.

The probe holder 3 includes a distal end portion 3a that holds the probe sheet 2, a proximal end portion 3b that is fixed to the adjustment mechanism 5 and supports the distal end portion 3a, and a distal end interposed between the distal end portion 3a and the proximal end portion 3b. The bending generation part 3c (bending generation | occurrence | production means) which generate | occur | produces the bending with respect to the base end part 3b of the part 3a is provided. This probe holder 3 is made of stainless steel, aluminum, phosphor bronze, iron-based alloy, nickel-based alloy, copper-based alloy, tungsten, silicon, carbon, or other metals, or alumina (Al ₂ O ₃ ), zirconia (ZrO ₂ ), silica. This is realized by using ceramics such as (SiO ₂ ), thermosetting resins such as epoxy, super engineering plastics such as polyimide, and the like.

  The bottom surface of the distal end portion 3a is a projection 31 for adhering and fixing the upper surface of the edge portion where the bumps 22 are disposed, which is the edge portion of the probe sheet 2, and the thickness direction of the distal end portion 3a (see FIG. 1 in the vertical direction). The probe sheet 2 bonded by the protrusion 31 is inserted into the opening 32. The probe sheet 2 is fixed by a fixing member 4 provided on the upper surface of the distal end portion 3a, and is prevented from being detached from the distal end portion 3a. Note that the protrusion 31 can also be realized by an elastic member such as silicon rubber.

  The bending generating part 3c is located in the middle between the distal end part 3a and the proximal end part 3b of the probe holder 3 and is integrally formed of the same material as the distal end part 3a and the proximal end part 3b. A thin-walled portion 34 having a beam shape is formed by drilling a groove portion 33 having a cross-sectional shape, and has a function as a leaf spring. As described above, in the first embodiment, since the thin portion 34 is formed by drilling the groove portion 33 having a bowl-shaped cross-sectional shape, the length in the horizontal direction in FIG. Compared to the case where the thin part is formed by simply cutting out the plate thickness direction with respect to the same base material, the length of the thin part 34 can be increased, and the use efficiency of the space is good. Therefore, the probe holder 3 is suitable for downsizing.

  The more specific shape (thickness, length, etc.) of the deflection generating part 3c having the above configuration is determined according to the stroke, contact load, etc. required for each probe element based on the Hooke's law. A desired spring characteristic can be imparted according to the shape. As a result, for example, a stroke of about 300 μm can be generated for a contact load of about the same as that of a pin-type probe, that is, about 5 g.

  The adjustment mechanism 5 includes a first block member 51 that is attached to and held on a predetermined frame substrate (not shown), and a second block member 52 that is fixed to the probe holder 3. The first block member It has a function of adjusting the vertical positional relationship between the first block member 51 and the second block member 52 and adjusting the height of the probe holder 3 (the vertical vertical position in FIG. 1). Among these, the second block member 52 is fixed to the upper surface of the probe holder 3 by using a screw or the like.

  When contacting each bump 22 and the inspection target 200 using the probe unit 1 having the above configuration, the adjustment mechanism 5 adjusts the position of the probe holder 3 and moves the inspection target 200 vertically upward in FIG. As a result, a connection electrode or terminal (not shown) on the inspection object 200 is physically brought into contact with the bump 22. In this case, it is preferable to control the moving speed of the inspection target 200 so that a contact load that does not generate excessive contact resistance is applied.

  When the inspection object 200 comes into contact with the bump 22, the distal end portion 3 a is bent by the load applied from the inspection object 200, and the vicinity of the boundary between the bending generation portion 3 c and the proximal end portion 3 b is set as the rotation center O. A stroke that draws a substantially arc-shaped locus occurs (in the direction of the double-sided arrow in FIG. 4). As a result, when the bump 22 contacts the surface of the inspection object 200, it moves minutely not only in the direction perpendicular to the surface of the inspection object 200 but also in the direction parallel to the surface. By this minute movement, the bump 22 scratches the surface of the inspection object 200, removes the oxide film formed on the surface and the dirt attached to the surface, and more stable between the bump 22 and the inspection object 200. Electrical contact can be obtained.

  After the bump 22 and the inspection target 200 are brought into contact with each other, the signal processing apparatus 100 outputs an electrical signal for inspection to the inspection target 200. Specifically, the electrical signal generated and output by the signal processing apparatus 100 is input to the inspection target 200 via the wiring 23 of the probe sheet 2, the bumps 22, and the electrodes or terminals on the inspection target 200. The electrical signal is processed by an electronic circuit (not shown) formed in the inspection target 200, and a response signal is output from the inspection target 200 to the signal processing device 100. The signal processing apparatus 100 uses the response signal received from the inspection target 200 via the bump 22 and the wiring 23 to perform a determination process on whether or not the inspection target 200 has desired characteristics.

  According to the first embodiment of the present invention described above, a distal end portion that holds a plurality of probes that respectively input and output electrical signals to and from the circuit structure by contacting the circuit structure; and the distal end portion A base end portion to be supported; and a bend generation means that is interposed between the tip end portion and the base end portion and generates a bend of the tip end portion with respect to the base end portion, and at least one of the bend generation means. The portion is formed integrally with the distal end portion and the base end portion, and has a beam shape whose thickness is thinner than that of the distal end portion and the base end portion, so that a desired stroke can be obtained when contacting the circuit structure to be inspected. It is possible to provide a probe holder and a probe unit that are excellent in durability and economical.

  In addition, according to the first embodiment, the probe holder that is integrally molded using the same material has a mechanism for generating deflection, so that it is compared with a probe holder having a complicated external spring mechanism as in the prior art. In this case, the structure is simple and compact, and the number of parts is small. As a result, the manufacturing cost can be kept low, and maintenance is easy, which is economical. Further, the size can be easily reduced.

  Furthermore, according to the first embodiment, when a load is applied to the bump that is the contact portion of the probe, the bump strokes in a circular arc due to the deflection of the deflection generating portion, so that the surface of the inspection target that the bump contacts By scratching, the oxide film formed on the surface and the dirt adhering to the surface can be removed, and stable electrical contact can be obtained.

  In addition, according to the first embodiment, since the groove portion of the deflection generating portion is formed so as to penetrate the probe holder main body along the arrangement direction of the probe elements, the inspection is performed at the time of contact with the inspection object. Even when the distal end portion is twisted with respect to the base end portion according to the warp of the object, the effect of correcting the twist can be obtained.

(Modification of Embodiment 1)
FIG. 5 is a diagram showing a configuration of a probe holder according to a modification of the first embodiment, and is a cross-sectional view corresponding to the same cut surface as the cross-sectional view of FIG. The probe holder 6 shown in the figure includes a distal end portion 6a (including a protruding portion 61 and an opening portion 62), a proximal end portion 6b, and a deflection generating portion 6c. The deflection generating portion 6c is made of the same material as the distal end portion 6a and the base end portion 6b, and has a beam-like thin portion 63 formed by cutting up and down in the thickness direction thereof. Like the thin part 34 in the part 3c, it has springiness. Therefore, the same effect as the probe holder 3 according to the first embodiment can be obtained. Of course, the shape including the length and thickness of the deflection generating portion 6c is also determined according to the stroke, contact load, etc. required for the probe unit having the probe holder 6 as a constituent element.

  In addition to the above, as the bending generation part, for example, a thin wall part in which the upper end surface is flush with the upper surfaces of the distal end part 6a and the base end part 6b by notching only the bottom surface side may be formed. By cutting out only the upper surface side, a thin wall portion whose lower end surface is flush with the bottom surfaces of the distal end portion 6a and the base end portion 6b may be formed.

  In addition, the thickness of the base end portion does not have to be the same as the thickness of the tip end portion. It is also possible to make it larger than the thickness.

(Embodiment 2)
FIG. 6 is a diagram showing a configuration of a probe unit according to Embodiment 2 of the present invention. Similar to the probe holder 3 in the first embodiment, the probe unit 10 shown in the figure performs a conduction state inspection and an operation characteristic inspection before completion of an inspection target, and a probe sheet 2 (base material 21, bump 22). , Including the wiring 23), the probe holder 7, the fixing member 4, and the adjusting mechanism 5 (including the first block member 51 and the second block member). Among these, since the other parts except the probe holder 7 are the same as the probe unit 1, the same reference numerals are assigned to the corresponding parts, and the description thereof is omitted.

  Hereinafter, the probe holder 7 will be described. The probe holder 7 includes a distal end portion 7a that holds the probe sheet 2, a proximal end portion 7b that is fixed to the adjustment mechanism 5 and supports the distal end portion 7a, and a distal end interposed between the distal end portion 7a and the proximal end portion 7b. The bending generation part 7c (bending generation | occurrence | production means) which generate | occur | produces the bending with respect to the base end part 7b of the part 7a is provided. The distal end portion 7a is an edge portion of the probe sheet 2 and a projection 71 that adheres and fixes the upper surface of the edge portion where the bumps 22 are disposed, and the thickness direction of the distal end portion 3a (see FIG. 6). And an opening 72 through which the probe sheet 2 is inserted. The probe sheet 2 is fixed by a fixing member 4 provided on the upper surface of the distal end portion 7a, and is prevented from coming off from the distal end portion 7a. Further, the base end portion 7b is fixed to the second block member 52 of the adjustment mechanism 5 with screws or the like.

  The distal end portion 7a and the proximal end portion 7b have the same plate thickness, and are realized by the same material (metal, ceramic, thermosetting resin, super engineering plastic, etc.) as the probe holder 3 according to the first embodiment. In addition, it is also possible to form the front-end | tip part 7a and the base end part 7b with a different material.

  On the other hand, the bending generation part 7c is composed of a member different from the distal end part 7a and the base end part 7b. Specifically, the deflection generating portion 7c has the same shape and is provided in parallel with two leaf springs 81, a fixing plate 82 that fixes each leaf spring 81 to the distal end portion 7a and the proximal end portion 7b, There are screws 83 for fastening the leaf spring 81 and the fixed plate 82 to the distal end portion 7a and the proximal end portion 7b, respectively. FIG. 7 is a diagram showing a part of the configuration of the bending generating part 7c, and is a partial arrow view in the direction of arrow C in FIG. In FIG. 7, the leaf spring 81 has a rectangular thin plate shape, and the opposite long side ends are fastened to the distal end portions 7 a and 7 b via the fixing plate 82 by screws 83, and the distal end portion 7 a and the proximal end portion 7 b Are connected in a direction (horizontal direction in FIG. 6) perpendicular to the respective plate thickness directions. 6 is also the same as FIG. 7 and connects the bottom surfaces of the distal end portion 7a and the base end portion 7b.

The leaf spring 81 is made of phosphor bronze, and its shape (thickness, surface area, etc.) is determined according to the stroke, contact load, etc. required for the probe unit 10 based on the Hooke's law. In addition to the phosphor bronze, the leaf spring 81 is made of metal such as nickel, nickel beryllium, stainless steel, ceramics such as alumina (Al ₂ O ₃ ), zirconia (ZrO ₂ ), and silica (SiO ₂ ), or epoxy. It is also possible to realize this by using a thermosetting resin.

  Also in the second embodiment, the more specific shape (thickness, surface area, etc. of the leaf spring) of the deflection generating portion 7c is based on the stroke or contact load required for each probe element based on the Hooke's law. The desired spring characteristic (for example, the same spring characteristic as that of the pin-type probe) can be imparted according to the shape of the probe. If the two leaf springs 81 are arranged in parallel as described above, the accuracy of the contact position of the bump 22 with the inspection object 200 is further improved, but generally the two leaf springs 81 are not necessarily parallel. Also good.

  When the bumps 22 and the inspection target 200 are brought into contact with each other using the probe unit 10 having the above configuration, the position of the probe holder 7 is adjusted by the adjustment mechanism 5 and the inspection target 200 is moved vertically upward in FIG. By doing so, the electrodes or terminals for connection on the inspection object 200 are brought into physical contact with the bumps 22. In this contact, it is more preferable to control the moving speed of the inspection object 200 so that a contact load that does not generate excessive contact resistance is applied.

  When the inspection object 200 comes into contact with the bump 22, the bending is generated in the bending generation portion 7 c due to the load applied from the inspection object 200. As a result, as shown in FIG. 8, the bump 22 has a stroke such that the distal end portion 7a moves up and down along the plate thickness direction with respect to the base end portion 7b (in the direction of the double-headed arrow in FIG. 8). The direction in which such a stroke occurs is substantially parallel to the direction in which the inspection target 200 approaches the bump 22. Therefore, the probe holder 7 according to the second embodiment is suitable when the inspection target 200 is high definition and high contact position accuracy is required at the time of inspection.

  In addition, the shape of the surface of the leaf | plate spring applied to the bending generation part 7c may be other than a rectangle. FIG. 9 is a diagram showing another example of the surface shape of a leaf spring applied as a deflection generating portion. The leaf spring 84 shown in the figure has a tapered notch formed in the vicinity of a substantially central portion of a rectangular short side. The leaf spring 84 having such a shape has the effect of making the stress applied to itself uniform and further increasing the stroke of the tip 7a of the probe holder 7.

  According to the second embodiment of the present invention described above, a distal end portion that holds a plurality of probes that respectively input and output electrical signals to and from the circuit structure by contacting the circuit structure, and the distal end portion A base end portion to be supported; and a bend generation means that is interposed between the tip end portion and the base end portion and generates a bend of the tip end portion with respect to the base end portion. By including an elastic member (leaf spring) that connects the distal end portion and the base end portion, a desired stroke can be secured when contacting the circuit structure to be inspected, and the durability is excellent and economical. Probe holders and probe units can be provided.

  Further, according to the second embodiment, as in the conventional external spring mechanism, a stroke in a direction substantially parallel to the plate thickness direction of the probe holder is mainly generated, which is suitable when high-precision inspection is required. is there. In particular, the second embodiment does not require a complicated spring mechanism, so the structure is simple and compact, and the size can be easily reduced. Therefore, according to the second embodiment, it is possible to realize a highly accurate inspection at a low cost.

(Modification of Embodiment 2)
FIG. 10 is a diagram showing a configuration of a probe holder according to a first modification of the second embodiment, and is a cross-sectional view corresponding to the same cut surface as that of FIG. The probe holder 9 shown in the figure includes a distal end portion 9a (including a protruding portion 91 and an opening 92), a proximal end portion 9b, and a deflection generating portion 9c. The bending generating part 9c is configured by using two leaf springs 81. One of them connects the substantially central portions in the thickness direction of the distal end portion 9a and the base end portion 9b, and the other one connects the bottom surfaces of the distal end portion 9a and the base end portion 9b. .

  When the tip of the probe element held by the probe holder 9 having the above configuration (for example, the bump 22 shown in FIG. 6) is physically in contact with the inspection object and a load is applied, as in the probe holder 7 described above, A stroke is generated in which the distal end portion 9a varies with respect to the proximal end portion 9b along the thickness direction. Therefore, the probe holder 9 exhibits the same effect as the probe holder 7.

  In the second embodiment, the case where the bending generating portion is configured by using two leaf springs 81 (or leaf springs 84) has been described so far, but the number of leaf springs to be used is limited to two. is not. FIG. 11 is a cross-sectional view showing a configuration in the case where three leaf springs having the same shape are used as a second modification of the second embodiment. The probe holder 11 shown in the figure is connected to a distal end portion 11a (including a protruding portion 111 and an opening 112) and a base end portion 11b to bend the distal end portion 11a relative to the base end portion 11b. Is constituted by three leaf springs 81. As is clear from this example, the number of leaf springs used as the deflection generating portion may be determined according to the stroke, contact load, etc. required for the probe unit.

  In addition, when applying a some leaf | plate spring as a bending generation | occurrence | production part, it is also possible to set it as the structure from which the leaf | plate thickness and shape of each leaf | plate spring mutually differ.

(Embodiment 3)
FIG. 12 is a cross-sectional view showing the configuration of the probe holder according to Embodiment 3 of the present invention. The probe holder 12 shown in the figure includes a distal end portion 12a (including a protruding portion 121 and an opening portion 122), a proximal end portion 12b, and a deflection generating portion 12c. The bending generating portion 12c includes a leaf spring 81 that connects bottom surfaces of the distal end portion 12a and the base end portion 12b, a fixing plate 82 that fixes the leaf spring 81, and a leaf spring 81 that is connected to the distal end portion 12a and the fixing plate 82. And a plurality of screws 83 fastened at predetermined positions of the base end portion 12b.

  When an inspection is performed using the probe holder 12 having the above configuration, a stroke that draws an arc shape is generated at the time of contact with the inspection object, as in the first embodiment. Therefore, by scratching the surface of the inspection object, The oxide film formed on the surface and the dirt attached on the surface can be removed. It goes without saying that the third embodiment of the present invention has the same effects as those of the first embodiment.

  As a modification of the third embodiment, the probe holder shown in FIG. 13 can be configured. A probe holder 12-2 shown in FIG. 13 has the same distal end portion 12a and proximal end portion 12b as the probe holder 12 described above. A bending generating portion 12-2c that is interposed between the distal end portion 12a and the proximal end portion 12b and generates the bending of the distal end portion 12a with respect to the proximal end portion 12b is configured by using a single leaf spring 81. However, it differs from the probe holder 12 in that the upper surfaces of the distal end portion 12a and the proximal end portion 12b are connected by the fixing plate 82 and the screw 83. Even when the inspection is performed using the probe holder 12-2 having the above-described configuration, it is a matter of course that a stroke that draws an arc shape occurs at the time of contact with the inspection object.

  In the third embodiment described above, the configuration of the probe unit excluding the probe holder is the same as in the first and second embodiments. The materials of the probe holder and the leaf spring are the same as those in the first and second embodiments. The same can be said for the fourth and fifth embodiments described later.

(Embodiment 4)
FIG. 14 is a cross-sectional view showing the configuration of the probe holder according to Embodiment 4 of the present invention. The probe holder 13 shown in the figure includes a distal end portion 13a (including a protruding portion 131 and an opening portion 132), a proximal end portion 13b, and a deflection generating portion 13b. The bend generation part 13b has an opening 133 formed by a wire cutting process or the like penetrating in a direction perpendicular to the plate thickness direction, and two thin wall parts 134 provided respectively at the upper and lower positions of the opening 133 in the plate thickness direction. And 135 fulfill the same function as the two leaf springs 81 constituting the deflection generating portion 6c of the probe holder 6 according to the second embodiment. In this sense, the thickness of the two thin portions 134 and 135 is substantially the same.

  According to the fourth embodiment of the present invention having the above configuration, since the two thin portions 134 and 135 have the same function as the two leaf springs 81 in the second embodiment, the probe holder 6 holds the probe holder 6. When the bump 22 of the probe sheet 2 to be in contact with the object to be inspected, a stroke that fluctuates in the thickness direction with respect to the base end portion 13b is generated at the distal end portion 13a. An effect can be obtained. In addition, since the probe holder according to the fourth embodiment can be formed by integrally molding using the same material, the number of parts can be reduced and the manufacturing is easy, so the cost can be further reduced. It becomes possible.

  In addition, the thickness of the thin part provided in the up-and-down position of the opening part formed in a bending generation | occurrence | production part may differ. In the above description, the case where one opening is formed in the deflection generating part has been described. However, two or more opening parts penetrating in parallel to each other in the direction perpendicular to the plate thickness may be formed.

(Embodiment 5)
FIG. 15 is a cross-sectional view showing the configuration of the probe holder according to Embodiment 5 of the present invention. The probe holder 14 shown in the figure includes a distal end portion 14a (including a protruding portion 141 and an opening 142), a proximal end portion 14b, and a deflection generating portion 14c. The deflection generating portion 14c is integrally formed of the same material as the distal end portion 14a and the base end portion 14b, and connects the thin wall portion 143 that integrally connects the bottom surfaces thereof and the upper surfaces of the distal end portion 14a and the base end portion 14b. And a plurality of screws 83 that fasten the plate spring 81 to predetermined positions of the distal end portion 14a and the base end portion 14b via the fixed plate 82.

  According to the fifth embodiment of the present invention having the above-described configuration, the leaf spring 81 and the thin portion 143 are bent to generate a stroke in the direction along the plate thickness direction, which is the same as in the second embodiment. An effect can be obtained.

(Other embodiments)
So far, the best mode for carrying out the present invention has been described in detail. However, the present invention should not be limited only by the above-described first to fifth embodiments, and further different by combining them as appropriate. Embodiments can be configured.

  In the above description, it is assumed that the probe unit is used for the inspection of the liquid crystal panel. However, the present invention is applied to a package substrate mounted with a semiconductor chip or a high-density probe unit used for wafer level inspection. It is possible to apply.

  Furthermore, although the case where a probe sheet is applied has been described in the above description, the present invention can also be applied to the case of using a pin-type probe or a blade-type probe using a coil spring.

  Thus, the present invention can include various embodiments and the like not described herein, and various design changes and the like can be made without departing from the technical idea specified by the claims. It is possible to apply.

It is a figure which shows the structure of a probe unit provided with the probe holder which concerns on Embodiment 1 of this invention. It is a figure which shows the external appearance structure of a probe unit principal part. It is a bottom view near the probe unit tip. It is a figure explaining the outline | summary of the stroke which generate | occur | produces when a load is added with respect to the probe holder which concerns on Embodiment 1 of this invention. It is a figure which shows the structure of the probe holder which concerns on the modification of Embodiment 1 of this invention. It is a figure which shows the structure of a probe unit provided with the probe holder which concerns on Embodiment 2 of this invention. It is a top view which shows the structure of the bending generation part of the probe holder which concerns on Embodiment 2 of this invention. It is a figure explaining the outline | summary of the stroke which generate | occur | produces when a load is added with respect to the probe holder which concerns on Embodiment 2 of this invention. It is a top view which shows another structural example of the bending generation part of the probe holder which concerns on Embodiment 2 of this invention. It is a figure which shows the structure of the probe holder which concerns on the 1st modification of this Embodiment 2. FIG. It is a figure which shows the structure of the probe holder which concerns on the 2nd modification of this Embodiment 2. FIG. It is a figure which shows the structure of the probe holder which concerns on Embodiment 3 of this invention. It is a figure which shows the structure of the probe holder which concerns on the modification of Embodiment 3 of this invention. It is a figure which shows the structure of the probe holder which concerns on Embodiment 4 of this invention. It is a figure which shows the structure of the probe holder which concerns on Embodiment 5 of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1, 10 Probe unit 2 Probe sheet 3, 6, 7, 9, 11, 12, 12-2, 13, 14 Probe holder 3a, 6a, 7a, 9a, 11a, 12a, 13a, 14a Tip part 3b, 6b, 7b, 9b, 11b, 12b, 13b, 14b Base end 3c, 6c, 7c, 9c, 11c, 12c, 12-2c, 13c, 14c Deflection generating part (deflection generating means)
4 Fixing member 5 Adjustment mechanism 21 Base material 22 Bump (contact part)
23 Wiring 31, 61, 71, 91, 111, 121, 131, 141 Protrusion 32, 62, 72, 92, 112, 122, 132, 133, 142 Opening 33 Groove 34, 63, 134, 135, 143 Thin Part 51 First block member 52 Second block member 81, 84 Leaf spring 82 Fixed plate 83 Screw 100 Signal processing circuit 200 Inspection target

Claims (9)

A probe holder that houses a plurality of probes that respectively input and output electrical signals to and from the circuit structure by contacting the circuit structure,
A tip portion for holding the plurality of probes;
A proximal end portion for supporting the distal end portion;
Bend generation means for generating a bend of the distal end portion with respect to the proximal end portion interposed between the distal end portion and the proximal end portion;
A probe holder comprising:   The at least part of the bending generating means is formed integrally with the distal end portion and the base end portion, and has a beam shape that is thinner than the distal end portion and the base end portion. Probe holder.   The probe holder according to claim 1, wherein the bending generating means includes an elastic member that connects the distal end portion and the proximal end portion.   The probe holder according to claim 3, wherein the elastic member is one or a plurality of leaf springs. A plurality of probes that respectively input and output electrical signals to and from the circuit structure by contacting the circuit structure;
A distal end portion that holds the plurality of probes, a proximal end portion that supports the distal end portion, and a bend that is interposed between the distal end portion and the proximal end portion to generate a deflection of the distal end portion with respect to the proximal end portion. A probe holder having generating means;
A probe unit comprising:   The at least part of the bending generating means is formed integrally with the distal end portion and the base end portion, and has a beam shape whose thickness is thinner than that of the distal end portion and the base end portion. Probe unit.   The probe unit according to claim 5, wherein the bending generating unit includes an elastic member that connects the distal end portion and the proximal end portion.   The probe unit according to claim 7, wherein the elastic member is one or a plurality of leaf springs. The probe is
Wiring formed on the surface of the sheet-like substrate;
A contact portion disposed at one end of the wiring and in direct contact with the circuit structure;
The probe unit according to claim 5, comprising:

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