JP2007115844A - Motor controller - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a motor controller in which the overall device can be made compact without raising a performance of a cooling fan, with a simple heat sink structure and at a low cost. <P>SOLUTION: The motor controller comprises a fin base 1a provided in a case 5, a heat sink 1 composed of a plurality of heat radiating linear fins 1b which are disposed in parallel with each other along the longitudinal direction of the fin base 1a, a power semiconductor module 2 which is directly or indirectly adhered and fixed to the back of the fin base 1a, an electrolytic capacitor 3 disposed at one end of the linear fin 1b, and a cooling fan 4 which is disposed at another end of the linear fin 1b for inducing cooling air with respect to the heat sink 1. The linear fins 1b are disposed beneath the power semiconductor module 2; and also, inclined fins 1c which are inclined to the linear fins 1b are provided on a right and left side of the linear fin 1b, so as to compensate for an insufficient part of the cooling air from a lower face of the linear fin 1b and to concentrate the cooling air. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a motor control device such as an inverter device or a servo amplifier that mainly operates with a high-voltage power supply, and more particularly to a cooling structure for increasing the heat dissipation effect of the motor control device.

Conventionally, motor control devices such as inverter devices and servo amplifiers that mainly operate with a high-voltage power supply have used power semiconductor modules including IGBT elements that generate high heat. Therefore, power semiconductor modules are closely fixed to a heat sink and cooled. The thing of the structure which raises an effect is proposed (for example, refer to patent documents 1).
FIG. 5 is an overall perspective view of a conventional motor control device, and FIG. 6 is a plan view of the motor control device of FIG. 5 as viewed from below, and each figure is a view seen through the inside.
5 and 6, 1 is a heat sink, 1 a is a fin substrate, 1 b is a straight fin, 2 is a power semiconductor module, 3 is an electrolytic capacitor, 4 is a cooling fan, 5 is a housing, 5 a is an air inlet, and 5 b is a ventilation. It is a hole. Inside the housing 5, a heat sink 1 is provided in which a plurality of straight fins 1 b are arranged in parallel on a flat fin substrate 1 a, and the power semiconductor module 2 is mounted on the back surface of the fin substrate 1 a of the heat sink 1. It is fixed directly or indirectly. Further, inside the housing 5, an electrolytic capacitor 3 is disposed at one end of the linear fin 1b, and a cooling fan 4 for inducing cooling air to the heat sink 1 is disposed at the other end of the linear fin 1b. . And the inlet 5a is provided in the lower part of the front side of the electrolytic capacitor in the housing 5, and the cooling air enters the heat sink 1 after passing through the gap of the electrolytic capacitor 3 through the inlet 5a. In addition, ventilation holes 5b are provided on both side surfaces of the housing 5 in order to increase the cooling air.
JP 2004-228515 A (page 5 of the specification, FIG. 2)

However, the conventional motor control device has the following problems.
When the cooling air is introduced from the electrolytic capacitor side of the housing, the cooling air is heated by the electrolytic capacitor in a stage before passing through the fin row, so that when the heated cooling air passes through the fin row of the heat sink, the fins are heated. Cooling efficiency is reduced. In order to improve the cooling efficiency of the heat sink, it is necessary to simply increase the size of the heat sink itself, change the thickness of the fins or the fin substrate, or increase the capacity of the cooling fan. For this reason, if the entire device becomes large and expensive, or if the number of electrolytic capacitors increases, it becomes impossible to secure a sufficient cooling air passage, and there is a limit to realizing a smaller motor control device. .
The present invention has been made in view of the above problems, and provides a motor control device that can be reduced in size with a simple heat sink structure and reduced in size without increasing the performance of a cooling fan. For the purpose.

In order to solve the above problems, the present invention is configured as follows.
The invention according to claim 1 is a housing, a fin substrate provided inside the housing, and a heat sink comprising a plurality of linear fins for heat dissipation arranged in parallel along the longitudinal direction of the fin substrate. A power semiconductor module fixed directly or indirectly to the back surface of the fin substrate; an electrolytic capacitor disposed at one end of the linear fin; and cooling air for the heat sink disposed at the other end of the linear fin. And a cooling fan for inducing a cooling fan, wherein the linear fins are arranged directly under the power semiconductor module, the shortage of cooling air from the lower surface of the fins is compensated, and the cooling air is In order to concentrate, inclined fins inclined with respect to the linear fins are provided on the left and right sides of the linear fins.
According to a second aspect of the present invention, in the motor control device according to the first aspect, the straight fin is provided with a space for securing a cooling air passage between the linear fin and the electrolytic capacitor.
According to a third aspect of the present invention, in the motor control device according to the first aspect of the present invention, air inlets for introducing air into the inclined fins are provided on the side surfaces of the inclined fins of the housing with respect to the left and right sides. It is said.
According to a fourth aspect of the present invention, in the motor control device according to the first aspect of the present invention, air is guided to the inclined fin between the inclined fin provided on the electrolytic capacitor side and the housing. An air guide plate for blocking heat radiation from the electrolytic capacitor is provided.
The invention according to claim 5 is characterized in that an air guide plate is arranged between the cooling fan and the heat sink so as to concentrate cooling air directly under the power semiconductor module.

The present invention has the following effects.
According to the first to third aspects of the present invention, it is possible to improve the heat dissipation capability of the fins of the heat sink and to reduce the size of the heat sink by effectively using the fins by providing inclined fins on the heat sink having a straight fin having a simple shape. As a result, the entire motor control device can be reduced in size.
In addition, by reducing the size of the heat sink, the material cost of the heat sink can be suppressed, and the cost of the heat sink can be reduced.
According to the invention described in claims 4 and 5, each of the power semiconductor module and the electrolytic capacitor can be efficiently cooled without increasing the capacity of the fan.
In addition, since the heat effects of the power semiconductor module and the electrolytic capacitor can be reduced, the overall motor control device can be greatly reduced in size.

  Hereinafter, embodiments of the present invention will be specifically described with reference to the drawings.

FIG. 1 is an overall perspective view of a motor control device showing an embodiment of the present invention, and FIG. 2 is a plan view of the motor control device of FIG. Note that the description of the same constituent elements of the present invention as those of the prior art will be omitted, and only different points will be described.
1 and 2, 1c is an inclined fin, and 5c is an inlet hole.
The present invention is different from the prior art as follows.
That is, the motor control device arranges the linear fins 1b directly below the power semiconductor module 2, compensates for the lack of cooling air from the lower surface of the linear fins 1b, and concentrates the cooling air. It is the point which provided the inclined fin 1c inclined with respect to this linear fin on the right and left of 1b.
The straight fin 1 c is provided with a space S for securing a cooling air passage between the linear fin 1 c and the electrolytic capacitor 3.
In addition, on the side surfaces of the inclined fins 1c on the left and right sides of the casing 5, air inlet holes 5c for introducing air into the inclined fins 1c are provided.

Next, the operation will be described.
When the power semiconductor module 2 generates heat in the operation state of the motor control device, the generated heat is transmitted to the straight fins 1b and the inclined fins 1c through the fin substrate 1a of the heat sink 1. At this time, the cooling fan 4 is driven, and the cooling fan 4 sucks cooling air into the inlet hole 5a provided in the lower part of the front side of the electrolytic capacitor in the casing 5, and the cooling air passing through the inlet hole 5a is electrolyzed. After passing through the gap of the capacitor 3, the heat sink 1 enters the straight fin 1 b located immediately below the power semiconductor module 3. On the other hand, the cooling air is sucked into the air inlet holes 5c on both side surfaces of the housing 5 provided to increase the cooling air, and the cooling air passing through the air inlet holes 5c passes through the inclined fins 1c, and the power semiconductor module 3 After merging with the cooling air that has reached the straight fins 1 a at the portion immediately below, it is discharged to the outside of the housing 5 by the cooling fan 4.

As described above, in the first embodiment, the linear fin 1b is disposed immediately below the power semiconductor module 2, and the inclined fins 1c inclined with respect to the linear fin are provided on the left and right sides of the linear fin 1b. 1b is disposed at a position where it is not directly affected by the cooling air heated by the heat generated by the electrolytic capacitor 3, and can be improved without lowering the cooling efficiency.
Moreover, since the space for ensuring a cooling air path was provided between the linear fin 1c and the electrolytic capacitor 3, it can improve without reducing cooling efficiency similarly by using together with an inclination fin.
In addition, since the air holes 5c for introducing air into the inclined fins 1c are provided on the left and right side surfaces of the inclined fins 1c of the housing 5, the amount of cooling air flowing in is larger than that of a heat sink configured only with conventional linear fins. Since the shortage can be compensated, the cooling efficiency of the power semiconductor module 2 can be improved by the cooling air from the side surface of the housing 5.
As a result, it is possible to reduce the cost and size of the apparatus.

FIG. 3 is an overall perspective view of a motor control device according to a second embodiment of the present invention, and FIG. 4 is a plan view of the motor control device of FIG. .
3 and 4, reference numerals 6 and 7 denote air guide plates.
The second embodiment is different from the first embodiment as follows.
That is, a wind guide plate 7 is provided between the inclined fin 1 c provided on the electrolytic capacitor 3 side and the housing 5 to guide air to the inclined fin and block heat radiation from the electrolytic capacitor 3. In addition, the air guide plate 6 is disposed between the cooling fan 4 and the heat sink 1 so that the cooling air is concentrated directly under the power semiconductor module 2.
Since the operation is basically the same as that of the first embodiment, the description thereof is omitted.

As described above, in the second embodiment, the air guide plate 7 efficiently guides the cooling air passing through the inlet hole 5 a to the electrolytic capacitor 3 portion to the heat sink 1 without waste. The air guide plate 6 is a fin of the heat sink 1. Since the cooling air passing from 1b and 1c to the cooling fan 4 is efficiently guided to the cooling fan 4 without waste, the cooling efficiency can be further increased compared to the first embodiment 1, and the motor control is achieved by downsizing the heat sink. The entire device can be downsized.
As a result, the cost of the entire apparatus can be reduced by increasing the cooling efficiency.

1 is an overall perspective view of a motor control device showing a first embodiment of the present invention. 1 is a plan view of the motor control device of FIG. Overall perspective view of a motor control device showing a second embodiment of the present invention The top view which looked at the motor control device of FIG. 3 from the lower surface Overall perspective view of a conventional motor control device The top view which looked at the motor control apparatus of FIG. 5 from the lower surface

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Heat sink 1a Fin board 1b Straight fin 1c Inclined fin 2 Power semiconductor module 3 Electrolytic capacitor 4 Cooling fan 5 Case 5a Inlet hole 5b Ventilation hole 5c Inlet hole 6, 7 Air guide plate S Space

Claims (5)

A housing,
A heat sink composed of a fin substrate provided inside the housing, and a plurality of heat dissipating linear fins arranged in parallel along the longitudinal direction of the fin substrate;
A power semiconductor module directly or indirectly fixed to the back surface of the fin substrate; and
An electrolytic capacitor disposed at one end of the straight fin;
A cooling fan for inducing cooling air to the heat sink disposed at the other end of the linear fin;
In a motor control device comprising:
The straight fins are disposed immediately below the power semiconductor module, and the shortage of cooling air from the lower surface of the fins is compensated and the cooling air is concentrated with respect to the straight fins on the left and right sides of the straight fins. A motor control device provided with an inclined fin.   The motor control device according to claim 1, wherein a space for securing a cooling air passage is provided between the linear fin and the electrolytic capacitor.   The motor control device according to claim 1, wherein an air inlet hole for introducing air into the inclined fin is provided on a side surface of the housing with respect to the left and right sides of the inclined fin.   A wind guide plate is provided between the inclined fin provided on the electrolytic capacitor side and the housing to guide air to the inclined fin and to block heat dissipation from the electrolytic capacitor. The motor control device according to claim 1.   The motor control device according to claim 1, wherein an air guide plate is disposed between the cooling fan and the heat sink so as to concentrate cooling air directly below the power semiconductor module.

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