JP2007114588A - Substrate component and method for manufacturing same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate component having a plurality of substrates, the component having high accuracy in positioning the substrates with respect to one another. <P>SOLUTION: The substrate component has a plurality of substrates and is characterized in that: at least a first substrate and a second substrate of the plurality of substrates have through holes in the thickness direction; and the first substrate and the second substrates are laminated with the through holes opposing to each other; and a sphere is inserted at a position across the through hole of the first substrate and the through hole of the second substrate but not held by the first substrate or the second substrate. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a substrate component that is formed by bonding substrates together, and relates to a substrate component that forms, for example, optical components such as micromirrors and fiber collimator arrays, various microstructures, and the like.

  In order to realize desired characteristics and functions in the microstructure, the positional relationship between the components is important. For example, in an electrostatically driven micromirror having an electrostatic actuator, the positional relationship between the fixed electrode and the mirror strongly affects the driving force. Furthermore, the positional relationship between the fixed electrode and the mirror is important in order to avoid an electrical short circuit. As another example, in an optical component, the positional accuracy between the optical components strongly affects the characteristics of the light beam. For example, in a fiber collimator composed of an optical fiber and a lens, the positional accuracy between the optical fiber and the lens is important. These microstructures are often formed by bonding substrates, i.e., substrate components. For example, a fiber collimator array is configured by attaching a substrate on which a plurality of optical fibers are arranged and a substrate on which a plurality of lenses are arranged to face each other and each lens array. In that case, a high positioning accuracy is required at the time of bonding in the substrate parts constituting the microstructure.

  In response to the above requirement, for example, a method of positioning by positioning a spherical member on a pyramid type alignment reference formed on a stack member (Patent Document 1), or providing a hole for a guide in a substrate, A method (Patent Document 2) is disclosed in which positioning is performed by inserting a guide pin having an outer dimension substantially equal to the hole diameter.

JP-A-6-82661 JP 2004-252244 A

  However, when forming a pyramid-type (but including a flat-tip shape) alignment standard, it can be formed with high precision unless it depends on the etching characteristics of a specific single-crystal member, and practically, anisotropic etching of silicon. However, the material of the substrate is also limited. Further, the processing variation of the pyramid type alignment reference includes not only the variation of the formation position in the in-plane direction of the substrate but also the variation of the depth. As a result, a displacement in the in-plane direction and a displacement in the normal direction of the stacked (overlapping) members can occur. For example, if the pyramid alignment reference of one substrate is too deep, rattling occurs between the spherical member and the other substrate, and this rattling leads to in-plane misalignment. In addition, when a guide pin is inserted into the guide hole, insertion of the guide pin is hindered if a projection-like processing residue is generated in the guide hole. Such processing residue is likely to occur at the end of the hole. In addition, the perpendicularity of the guide hole with respect to the substrate plane is also important. If the perpendicularity of the guide hole is not ensured, the guide pins become non-parallel, making it difficult to overlap the members. In addition, when the substrate is thin, it becomes difficult to insert the guide pins while maintaining the vertical.

  In view of the above problems, an object of the present invention is to provide a substrate component having high positioning accuracy in bonding and a method for manufacturing the same.

  The present invention is a substrate component having a plurality of substrates, wherein at least a first substrate and a second substrate among the plurality of substrates are provided with through holes in a thickness direction, and the first substrate and the second substrate The two substrates are bonded to each other with the through holes facing each other, and the first substrate and the second substrate are disposed at positions straddling the through holes of the first substrate and the through holes of the second substrate. The board component is characterized in that a sphere is inserted in a state where it is not sandwiched between the boards. The position straddling the through hole of the first substrate and the through hole of the second substrate means that a part of the sphere exists in both the through hole of the first substrate and the through hole of the second substrate. (same as below). In addition, the state in which the first substrate and the second substrate are not sandwiched means that the movement of the sphere in the depth direction of the through hole is not restrained by the substrate. It means having a positional relationship that can move in the depth direction. The positional relationship only needs to be generated by the relationship between the substrate and the sphere, and an adhesive or the like may exist between the sphere and the substrate, and the adhesive may restrain the movement of the sphere. The first substrate and the second substrate may be directly bonded together, or may be bonded at a predetermined interval via a spacer. According to such a configuration, the sphere restrains the movement of the substrates to be bonded in the in-plane direction, and a stable fixing structure can be obtained by using the sphere, and it is difficult to be affected by the dimensional error of the through hole. A substrate component having accuracy can be realized.

  Further, the present invention is a substrate component having a plurality of substrates, wherein at least a first substrate and a second substrate among the plurality of substrates are provided with through holes in a thickness direction, and the first substrate And the second substrate are bonded together with the through holes facing each other, and the sphere is located at a position straddling the through hole of the first substrate and the through hole of the second substrate, and the second substrate. A substrate component, wherein a surface of the first substrate opposite to a surface to be bonded to the second substrate is inserted at a position in contact with a virtual surface extending on the through hole. Since the sphere is inserted at a position in contact with a virtual surface obtained by extending the surface of the first substrate opposite to the surface to be bonded to the second substrate onto the through hole, the dimension of the through hole is also in this configuration. In addition to being affected by errors, the spheres restrain the movement of the substrates to be bonded in the in-plane direction, and a stable fixing structure can be obtained by using the spheres, so that a substrate component having high positioning accuracy can be realized.

  In the substrate component, it is preferable that a diameter of the sphere is 1.53 times or more and 2.9 times or less of a thickness of the first substrate. According to this configuration, it is possible to realize a board component having particularly high positioning accuracy when the first board and the second board are bonded in contact with each other.

  Further, in the substrate component, the first substrate and the second substrate are bonded to each other with a predetermined interval, and the sphere is a surface of the first substrate to be bonded to the second substrate. The opposite surface is inserted into a position in contact with a virtual surface extending on the through hole, and the diameter of the sphere is 1.53 times or more of the sum of the thickness of the first substrate and the distance 2.9. It is good also as below. According to this configuration, when the first substrate and the second substrate are bonded to each other with a predetermined interval, it is possible to realize a substrate component having particularly high positioning accuracy.

  Further, in the board component, it is preferable that an optical element is provided on at least one of the first board and the second board. Since the substrate component has high positioning accuracy, an optical element substrate component with excellent positional accuracy is obtained by providing the substrate component with an optical element that is fine and requires high accuracy for positioning. be able to.

  In addition, the substrate component manufacturing method of the present invention is a method of manufacturing a substrate component having a plurality of substrates, wherein the first substrate having a through hole in the thickness direction and the through hole in the thickness direction are provided. And bonding the second substrate with the through holes facing each other, and before or after the step, the through holes of the first substrate and the through holes of the second substrate in the bonded substrate. A step of inserting a sphere without being sandwiched between the first substrate and the second substrate at a position to be straddled; the first substrate in which the sphere is inserted into the through hole; and the second substrate A step of fixing the substrate to the substrate. By this method, a substrate component having high positioning accuracy can be obtained. In the above method, the order of bonding the first substrate and the second substrate and inserting the sphere is not limited. That is, the second substrate may be bonded after the sphere is inserted into the through hole of the first substrate, or the sphere may be inserted after the first substrate and the second substrate are bonded.

  Furthermore, it is preferable to apply an adhesive to the through hole in the step of fixing the first substrate and the second substrate in which the sphere is inserted into the through hole. Since the adhesive is applied to a limited space called a through hole, the amount of the adhesive used can be suppressed, and the workability is excellent.

  In the method of manufacturing a board component, the sphere may be removed after the step of fixing the first board and the second board. After the first substrate and the second substrate are fixed at portions other than the through holes, the substrates are fixed to each other, so that the sphere does not have to exist. In this case, the sphere can be removed and reused, and the number of parts can be reduced.

  ADVANTAGE OF THE INVENTION According to this invention, the board | substrate component which has high positioning accuracy in bonding, and its manufacturing method can be provided.

  Embodiments of the present invention will be described below with reference to the drawings. In addition, this invention is not limited by these Examples.

  FIG. 1 corresponds to a cross-sectional view of a board component according to the present invention. The board component shown in FIG. 1 includes a first board 101 and a second board 102. The first substrate 101 is provided with a through hole 106 in the thickness direction, and the second substrate 102 is provided with a through hole 105 in the thickness direction. When used in combination with other positioning means, the number of through holes may be one, but two or more through holes 106 are formed in the first substrate 101, and the second substrate 102 is formed in the second substrate 102. It is preferable to form two or more through holes 105 to ensure the positioning function with the through holes. The through holes 105 and 106 of each substrate correspond to each other one to one. That is, the first substrate 101 and the second substrate 102 provided with the through holes are bonded to each other with the through holes facing each other. The sphere 103 is inserted at a position straddling the through-hole 106 of the first substrate 101 and the through-hole 105 of the second substrate 102 without being sandwiched between the first substrate and the second substrate. With this configuration, the first substrate 101 and the second substrate 102 are restrained from moving in the in-plane direction and positioned.

  The sphere 103 is inserted at a position straddling the through hole 106 of the first substrate 101 and the through hole 105 of the second substrate 102 without being sandwiched between the first substrate and the second substrate. 1) What is the surface of the first substrate to be bonded to the second substrate at a position straddling the through hole of the first substrate and the through hole of the second substrate? A configuration in which the sphere 103 is inserted and disposed at a position in contact with a virtual surface extending on the through hole on the opposite side, and 2) a spacer is inserted between the sphere 103 and the virtual surface, and the sphere 103 is inserted with the spacer. 3) A configuration in which the sphere 103 is bonded and fixed in the through hole at a predetermined distance from the virtual surface. Here, the position in contact with the virtual surface extended on the through hole means, in other words, the state where the opening surface of the through hole and the sphere are in contact with each other, and the bottom plate is installed under the first substrate. If so, the virtual plane coincides with the surface of the bottom plate, and the position of the sphere is a position in contact with the surface of the bottom plate. In FIG. 1, the upper surface 115 of the bottom plate 109 corresponds to the virtual surface. Assuming that the sphere 103 is sandwiched between the first substrate and the second substrate or the hole formed in them, not only the positioning accuracy in the in-plane direction but also the tilt of the substrate becomes a problem. The influence of the dimensional error of the substrate or the hole greatly affects the positioning accuracy of the substrate. On the other hand, the sphere 103 suppresses movement and displacement in the in-plane direction of the first substrate and the second substrate, but the sphere 103 is not sandwiched between the first substrate and the second substrate. Then, since it is hard to be influenced by the dimensional error of the through hole, high positioning accuracy can be realized.

  FIG. 1 shows a surface of the above-mentioned embodiment 1) in a position straddling the through hole of the first substrate and the through hole of the second substrate, and the surface of the first substrate to be bonded to the second substrate. The spherical body 103 is inserted and positioned at a position in contact with a virtual surface extending on the through hole on the opposite side of the through hole, and the spherical body 103 can be easily inserted and arranged, and has high positional accuracy. Is obtained.

  With the above configuration, the sphere 103 has a side wall of the through hole 106 of the first substrate, desirably an opening side end facing the second substrate 102, and a through hole 105 of the second substrate. The position shift amount is controlled within a range until it comes into contact with the side wall of the first substrate 101, preferably the opening side end portion on the side facing the first substrate 101, and a high position with little position shift in bonding. The board component 100 having accuracy can be realized.

  As the first substrate 101, for example, a silicon (Si) substrate, a metal substrate, or an insulator substrate (for example, a glass substrate or a ceramic substrate) can be applied. On the first substrate, as a reflective film, an electrode film, a protective film, etc., for example, gold (Au), aluminum (Al), chromium (Cr), nickel (Ni), copper (Cu), platinum (Pt) or Titanium (Ti) can be laminated on the entire surface or partially by singly or appropriately selected. Alternatively, unevenness can be formed on the first substrate. For the formation of the unevenness, dry etching, wet etching, or a chemical processing method combining them can be applied. Alternatively, a physical processing method such as sandblasting, FIB (Focused Ion Beam), or drilling can be used. The through hole 106 can also be formed by dry etching, wet etching, or a chemical processing method combining them, or a physical processing method such as sandblasting, FIB, or drilling. The through hole 106 is preferably a vertical hole, but the most important is the hole diameter on the side facing the second substrate 102, and this hole diameter is managed to be slightly larger than the diameter of the sphere 103. The reason for slightly exceeding is to insert the sphere into the through hole. The detailed size of the hole diameter is determined by the tolerance of the sphere 103 and the allowable deviation between the first substrate 101 and the second substrate 102. In order to reduce the amount of deviation between the first substrate 101 and the second substrate 102, the hole diameter should be as close as possible to the diameter of the sphere 103.

The second substrate 102 is, for example, a silicon (Si) substrate, an SOI substrate in which a silicon oxide (SiO ₂ ) layer is sandwiched between silicon (Si) layers, a metal substrate, or an insulator substrate (for example, a glass substrate or a ceramic substrate). Applicable. On the second substrate, as a reflective film, an electrode film, a protective film, etc., for example, gold (Au), aluminum (Al), chromium (Cr), nickel (Ni), copper (Cu), platinum (Pt) or Titanium (Ti) can be laminated on the entire surface or partially by singly or appropriately selected. Alternatively, unevenness can be formed on the second substrate. The unevenness can be formed by dry etching, wet etching, or a chemical processing method combining them, or a physical processing method such as sandblasting, FIB, or drilling. The through hole 105 is preferably a vertical hole, that is, the depth direction is perpendicular to the substrate surface. The most important point is the hole diameter at the end facing the first substrate 101, and this hole diameter is managed to be slightly larger than the diameter of the sphere 103. The reason for slightly exceeding is to insert the sphere into the through hole. The detailed size of the hole diameter is determined by the tolerance of the sphere 103 and the allowable deviation between the first substrate 101 and the second substrate 102. In order to reduce the amount of deviation between the first substrate 101 and the second substrate 102, the hole diameter should be as close as possible to the diameter of the sphere 103.

Moreover, the cross-sectional shape seen from the depth direction of the through-hole can be a circular shape or a polygonal shape such as a triangle or a quadrangle, but a circular shape is easy and preferable.
In addition, even if the 3rd board | substrate (bottom plate) is fixed to the opposite side to the said 2nd board | substrate of the 1st board | substrate as long as the 1st board | substrate has a through-hole, in the said structure, It does not change that the through hole is provided in the first substrate itself. Further, in addition to the sphere 103 inserted in a position straddling the through hole 106 of the first substrate 101 and the through hole 105 of the second substrate 102, another sphere or another shape member is attached to the sphere 103. You may contact and load in a through-hole for the purpose, such as a spacer.

  The sphere 103 can be made of glass, ceramic, plastic, metal, or the like. Further, the closer the shape is to a true sphere, the higher the position accuracy can be obtained. From the viewpoint of accuracy, price, etc., it is preferable to use a glass ball lens. When the sphere 103 is inserted into the through-holes of the first substrate 101 and the second substrate that are bonded together, a bottom plate 109 is further placed under the first substrate 101 and bonded. This is to keep the sphere 103 in the through hole. Since the bottom plate can be a plate material, it is easy to obtain a smooth surface, which is suitable for obtaining high positional accuracy when bonded to the first substrate 101. Although it is possible to provide a bottomed hole that is a non-through hole instead of the through hole provided in the first substrate, it is difficult to obtain a flat bottom surface, and depth accuracy is also required. It is preferable to use a substrate in which a through hole is formed. The bottom plate only needs to cover at least the through hole, and may cover the entire first substrate. As a method for fixing the first substrate 101 and the second substrate 102 which are bonded together, various means such as bonding using an adhesive, solder bonding, and fixing by a mechanical binding force can be used. Specifically, the first substrate 101 and the second substrate 102 are fixed by, for example, a method in which an adhesive is applied to a through-hole into which a sphere is inserted and bonded, or the positioning for the second substrate. A method of providing a through-hole separately from the through-hole and attaching an adhesive or the like to the part, a method of applying an adhesive at the edge of the substrate, a method of bonding by soldering, or applying an adhesive between the substrates And a combination of these methods. Among these, the method of applying an adhesive to the through-hole into which the sphere is inserted is preferable in that the amount of the adhesive used can be suppressed and the workability is excellent.

  The diameter of the sphere 103 is such that the sphere is inserted at a position in contact with a virtual surface extending from the surface of the first substrate opposite to the surface to be bonded to the second substrate on the through hole. In addition, the thickness exceeds the thickness of the first substrate, preferably about twice the thickness of the first substrate 101. In this case, the diameter of the through hole is also changed according to the diameter of the sphere. Here, when the diameter of the sphere 103 and the thickness of the first substrate 101 vary, the gap between the sphere 103 and the through hole 106 of the first substrate changes, and the first substrate 101 and the first substrate 101 in the substrate member 100 change. Although the positional deviation of the second substrate 102 varies, the influence of the variation can be suppressed by making the diameter of the sphere 103 about twice the thickness of the first substrate, so that the positioning accuracy of the substrate member 100 is improved. To do. More desirably, the thickness is 1.53 times or more and 2.9 times or less the thickness of the first substrate 101. FIG. 4 is a diagram showing an increase in displacement between the first substrate 101 and the second substrate with respect to the ratio (D / t) of the diameter (D) of the sphere 103 and the thickness (t) of the first substrate 101. It is. As shown in the figure, the diameter of the sphere 103 is 1.53 times or more and 2.9 times or less the thickness of the first substrate 101, so that the positional deviation between the first substrate 101 and the second substrate 102 is achieved. Can be suppressed within 5% of the sphere diameter ratio. Further, in order to suppress the increase in the positional deviation within 3% and obtain higher positional accuracy, the diameter of the sphere 103 is 1.6 times or more and 2.65 times the thickness of the first substrate 101. The following is preferable.

  Since a sphere having a radius corresponding to the substrate thickness is used for positioning, high positional accuracy can be realized by controlling the hole diameter of the opening rather than the uniformity of the hole diameter of the through hole in the depth direction. This is because the sphere is in contact with the vicinity of the opening. Therefore, if the hole diameter of the portion is controlled, the through-hole may have a slight taper, and the wall surface of the through-hole away from the vicinity of the opening does not contact the sphere, so that some dimensional error and machining residue are allowed. Also in this respect, the positional accuracy is higher than in the case of pin fixing, and it is easy to obtain the high accuracy. From the viewpoint of workability and accuracy variation, the hole diameter is more preferably constant in the depth direction. Moreover, since the means for forming the through hole is not limited, the substrate material to be used is not limited, and a processing means suitable for the substrate material to be used can be selected.

  As another embodiment of the present invention, a spacer can be inserted between the first substrate 101 and the second substrate 102. Hereinafter, the same reference numerals as those in the above embodiment are used except for the spacers. The configuration of the portion other than that related to the spacer is the same as that of the above embodiment. Even when the first substrate 101 and the second substrate 102 are bonded to each other with a predetermined interval through a spacer or the like, a sphere is formed at a position straddling the through hole of the first substrate and the through hole of the second substrate. By being inserted, the first substrate 101 and the second substrate 102 can be accurately positioned. In this case, the diameter of the sphere 103 is inserted at a position where the sphere is in contact with a virtual surface obtained by extending the surface of the first substrate opposite to the surface to be bonded to the second substrate onto the through hole. In this case, the thickness exceeds the thickness of the first substrate, preferably 1.53 times or more and 2.9 times or less the thickness of the first substrate 101, and at the same time the diameter of the sphere 103 Is greater than the sum of the thickness of the first substrate and the thickness of the spacer, preferably 1.53 times or more and 2.9 times or less. Thereby, even if it is a case where the 1st board | substrate 101 and the 2nd board | substrate 102 are bonded together via a spacer, the board | substrate component 100 which has a high positioning accuracy is realizable. For example, an increase in the positional deviation between the first substrate 101 and the second substrate 102 can be suppressed within a spherical diameter ratio of 5%. Further, in order to suppress the increase in the positional deviation within 3% and obtain higher positional accuracy, the diameter of the sphere 103 is 1.6 times or more and 2.65 times the thickness of the first substrate 101. At the same time, the diameter of the sphere 103 is preferably 1.6 times or more and 2.65 times or less of the sum of the thickness of the first substrate and the thickness of the spacer. The arrangement method of the spacer is not particularly limited, but a through hole is provided in the same manner as the first substrate, and the movement in the in-plane direction of the substrate is restricted by a sphere like the first substrate. You may arrange. Further, it may function as a spacer and may or may not be fixed to the first substrate or the like, but is preferably fixed to the first substrate or the like with an adhesive or the like. The configuration in which the first substrate and the second substrate are bonded to each other with a predetermined interval is suitable when a collimator in which a collimator lens is arranged at a predetermined interval on an optical fiber or a collimator array having a plurality of collimators is configured.

  A highly accurate optical component can be provided by providing an optical element on the substrate component having the above-described configuration. For example, a mirror, a half mirror, a collimator lens, an optical fiber, a light receiving element, a light emitting element, etc. are mounted as optical elements, and an optical switch, a collimator, an optical monitor, and an optical switch array having a plurality of them, a collimator array, an optical monitor array, etc. The optical component can be configured. More specifically, for example, a mirror is formed as an optical element on the second substrate, a drive electrode of the mirror element is provided on the first substrate, and a mirror-driven optical switch or an array type light in which a plurality of them are formed. A switch can be configured. In addition, a fiber collimator or a fiber collimator array in which a plurality of the fiber collimators are formed is formed by fixing an optical fiber on the first substrate, forming a collimator lens on the second substrate, and bonding them together. You can also. Alternatively, the optical power monitor can also be configured by combining a base part composed of a first substrate having a light receiving element and a second substrate having a half mirror and a separately formed fiber collimator.

  The substrate component manufacturing method of the present invention is a method of attaching a first substrate having a through hole in the thickness direction and a second substrate having a through hole in the thickness direction with the through holes facing each other. And the step of aligning the first substrate and the second substrate before or after the step, at positions where the bonded substrate straddles the through hole of the first substrate and the through hole of the second substrate. The method includes a step of inserting a sphere without being sandwiched between the substrates, and a step of fixing the first substrate having the sphere inserted into the through hole and the second substrate. More specifically, the procedure shown in FIG. 3 can be applied to the production of the substrate component 100 using the bottom plate 109.

  An example of a procedure for manufacturing the bonded substrate 100 will be described below with reference to FIG. First, the first substrate 101 is placed on the bottom plate 109 (procedure 1). The virtual surface 115 shown on the substrate 101 corresponds to the upper surface of the bottom plate 109 when the substrate 101 is placed on the bottom plate 109. The bottom plate 109 is preferably a rigid body with a smooth surface. The bottom plate 109 preferably has the same thermal expansion coefficient as that of the first substrate 101. As an example, the bottom plate 109 uses the same type of substrate as the first substrate 101. Next, the sphere 103 is inserted into the through hole 106 of the first substrate 101 (procedure 2). At this time, a part, preferably half, of the sphere 103 comes out on the first substrate 101. The board | substrate 102 is mounted on the board | substrate 101 according to the position where the through-hole 105 of the 2nd board | substrate 102 enters into the spherical body 103 (procedure 3). The second substrate 102 is bonded to the first substrate 101 with the adhesive 111 (procedure 4). FIG. 3 shows an example in which bonding is performed at the end of the substrate. Note that in the above method, the order of bonding the first substrate and the second substrate and inserting the sphere is not limited. That is, the second substrate may be bonded after the sphere is inserted into the through hole of the first substrate, or the sphere may be inserted after the first substrate and the second substrate are bonded. Further, in the substrate component manufacturing method, the bottom plate 109 and the sphere 103 may be fixed together with the first substrate and the second substrate, or only the first substrate and the second substrate are fixed, After the step of fixing the first substrate and the second substrate, the sphere and the bottom plate may be removed. After the first substrate and the second substrate are fixed at portions other than the through holes, the substrates are fixed to each other, so that the sphere does not have to exist. In this case, the sphere and the bottom plate can be removed and reused, which contributes to a reduction in the number of components and a reduction in the weight and size of the board components.

Example 1
FIG. 2 is a cross-sectional view of an electrostatically driven micromirror 200 using the board component according to the present invention. The electrostatically driven micromirror is a device that operates the micromirror 210 by electrostatic attraction generated when a potential difference is generated between the micromirror 210 and the electrode 204. The electrostatic drive type micromirror 200 shown in FIG. 2 has a fixed electrode substrate 201 as a first substrate and a mirror substrate 202 as a second substrate. A through hole 206 is formed in the fixed electrode substrate 201, and a through hole 205 is formed in the mirror substrate 202. The sphere 203 is inserted in a position straddling the through hole 206 of the fixed electrode substrate and the through hole 205 of the mirror substrate. Two through holes 206 are formed in the fixed electrode substrate 201, and two through holes 205 are formed in the mirror substrate 202. The through holes 205 and 206 of each substrate correspond to each other one to one.

The fixed electrode substrate 201 is formed by forming a metal film electrode 204 on a silicon (Si) substrate whose surface is covered with an oxide film (SiO ₂ ). As the metal film, a gold (Au) layer is laminated on a base of a chromium (Cr) layer. The through hole 206 is a vertical hole formed by dry etching. The diameter of the through hole 206 on the side facing the mirror substrate 202 is set to 1.01 ± 0.002 mm. The diameter of the sphere 203 is 1 ± 0.005 mm, and the thickness of the fixed electrode substrate 201 is 0.5 mm. The mirror substrate 202 is manufactured by combining dry etching and wet etching on a silicon (Si) substrate. A reflective film is formed on the reflective surface 207 of the mirror substrate 202, and a conductive film is formed on the electrode surface 208. As the reflective film and the conductive film, a metal multilayer film having gold (Au) as the outermost surface layer is applied. The through hole 205 formed in the mirror substrate 202 is a vertical hole formed by dry etching. The diameter of the through hole 205 on the side facing the fixed electrode substrate 201 is set to 1.01 ± 0.002 mm.

  The sphere 203 is made of glass having a diameter of 1 ± 0.005 mm. The sphere 203 is inserted at a position so as to straddle the through holes 205 and 206, and the mirror substrate 202 and the fixed electrode substrate 201 are bonded together and fixed with an adhesive 211. The adhesive is applied to the through holes 205 formed in the mirror substrate 202 and the adhesive application through holes formed in the mirror substrate 202, and is thermally cured. At the time of curing, a load is applied to the entire mirror substrate 202 so that there is no gap between the fixed electrode substrate 201 and the mirror substrate 202 and the two are brought into close contact with each other.

(Example 2)
FIG. 5 is a cross-sectional view of a fiber collimator array 300 which is another embodiment using the substrate component according to the present invention. The collimating lens array 300 shown in FIG. 5 has an optical fiber array substrate 301 as a first substrate and a lens array substrate 302 as a second substrate. A through hole 306 is formed in the optical fiber array substrate 301, and a through hole 305 is formed in the lens array substrate 302. The sphere 303 is inserted in a position straddling the through hole 306 of the optical fiber array substrate and the through hole 305 of the lens array substrate. Two through holes 306 are formed in the optical fiber array substrate 301, and two through holes 305 are formed in the lens array substrate 302. The through holes 305 and 306 of each substrate correspond to each other one to one.

  The optical fiber array substrate 301 is manufactured by forming a plurality of holes through which the optical fiber 313 passes through a silicon (Si) substrate and inserting the optical fibers into the holes. The through hole 306 is formed by a vertical hole formed by dry etching. The diameter of the through hole 306 on the side facing the lens array substrate 302 is set to 0.005 ± 0.001 mm. The diameter of the sphere 303 is 1 ± 0.003 mm, and the thickness of the optical fiber array substrate 301 is 0.45 mm. The lens array substrate 302 is produced by dry etching on a quartz substrate, and an antireflection film is formed on the front and back surfaces. The through holes 305 formed in the lens array substrate 302 are formed by sandblasting. The diameter of the through hole 305 on the side facing the optical fiber array substrate 301 is set to 0.005 ± 0.001 mm. A spacer 314 having a thickness of 0.1 mm is disposed between the optical fiber array substrate 301 and the lens array substrate 302. The spacer is disposed so as not to hinder the optical connection between the microlens 312 and the optical fiber 313. Since the thickness of the spacer is 0.1 mm, the opening of the through hole 305 of the lens array substrate on the side facing the optical fiber array substrate is effectively the thickness 0 of the optical fiber array substrate 301. It is equivalent to being arranged on the first substrate of 0.55 mm obtained by adding .45 mm and the spacer of 0.1 mm. The diameter of the sphere 303 corresponds to 1.8 times the effective thickness of the first substrate, and exhibits high positional accuracy.

  The sphere 303 is made of glass having a diameter of 1 ± 0.003 mm. The sphere 303 designates the positions of the through holes 306 of the optical fiber array substrate and the through holes 305 of the lens array substrate. The sphere 303 is inserted into a position so as to straddle the through holes 305 and 306, the optical fiber array substrate 302 and the lens array substrate 301 are bonded together, and fixed with an adhesive 311 to form a collimating lens array.

It is sectional drawing which shows the board | substrate component of this invention. It is a figure which shows the electrostatic micromirror formed using the board | substrate component of this invention. It is a flowchart which shows the manufacturing process of the board | substrate component of this invention. It is a figure which shows the diameter selection range of a sphere in this invention. It is sectional drawing which shows the fiber collimator array formed using the board | substrate component of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 100: Board | substrate component 101: 1st board | substrate 102: 2nd board | substrate 103: Sphere 105, 106: Through-hole 109: Bottom plate 111: Bonding agent 115: Virtual surface 200: Electrostatic drive micromirror 201: Fixed electrode board | substrate 102: Mirror substrate 203: Sphere 204: Electrode 205, 206: Through hole 207: Reflecting surface 208: Electrode surface 209: Bottom plate 210: Micromirror 300: Collimating lens array 301: Optical fiber array substrate 302: Lens array substrate 303: Sphere 305 306: Through hole 309: Bottom plate 311: Adhesive 312: Microlens 313: Optical fiber 314: Spacer

Claims (8)

  A substrate component having a plurality of substrates, wherein at least a first substrate and a second substrate of the plurality of substrates are provided with through holes in a thickness direction, and the first substrate and the second substrate are The first substrate and the second substrate are bonded to each other with the through holes facing each other, and in a position straddling the through hole of the first substrate and the through hole of the second substrate. A board component characterized in that a sphere is inserted in a state where it is not sandwiched between the two.   A substrate component having a plurality of substrates, wherein at least a first substrate and a second substrate of the plurality of substrates are provided with through holes in a thickness direction, and the first substrate and the second substrate are The through holes are bonded to each other, and a sphere is located at a position straddling the through hole of the first substrate and the through hole of the second substrate, and the first substrate of the first substrate. 2. A substrate component, wherein the substrate component is inserted at a position in contact with a virtual surface extending from the surface opposite to the surface to be bonded to the substrate of 2 above the through hole.   The board component according to claim 2, wherein a diameter of the sphere is 1.53 times or more and 2.9 times or less of a thickness of the first board.   The first substrate and the second substrate are bonded to each other with a predetermined interval, and the sphere has a through hole on a surface of the first substrate opposite to the surface to be bonded to the second substrate. It is inserted at a position in contact with the virtual surface extending upward, and the diameter of the sphere is 1.53 times or more and 2.9 times or less of the sum of the thickness of the first substrate and the interval. The board component according to claim 3.   The board component according to claim 1, wherein an optical element is provided on at least one of the first board and the second board.   A method of manufacturing a substrate component having a plurality of substrates, wherein a first substrate having a through hole in the thickness direction and a second substrate having a through hole in the thickness direction are formed by replacing the through holes with each other. The first substrate is placed at a position where the through-hole of the first substrate and the through-hole of the second substrate are straddled between the through-hole of the first substrate and the through-hole of the second substrate before or after the step. A substrate component comprising: a step of inserting a sphere in a state where it is not sandwiched between the second substrate; and a step of fixing the first substrate having the sphere inserted into the through hole and the second substrate. Production method.   The board component according to claim 6, wherein an adhesive is applied to the through hole in the step of fixing the first substrate and the second substrate in which the sphere is inserted into the through hole. Manufacturing method.   The method of manufacturing a board component according to claim 6, wherein the spherical body is removed after the step of fixing the first board and the second board.