JP2007165215A - Manufacturing method of electroluminescent device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of an electroluminescent device wherein bad influence caused by foreign substances adhering when forming an auxiliary electrode is prevented. <P>SOLUTION: This manufacturing method is equipped with a process to paste a photosensitive dry film on a substrate 20 through a thermally foaming resin so as to cover the auxiliary electrode 115 on the substrate 20 with it, a process to pattern the photosensitive film by exposing and developing it by making it correspond to the pattern of the auxiliary electrode 115, a process to pattern the thermally forming resin by using a pattern 61a made of the photosensitive dry film as a mask, a process to form a light emitting functional layer 110 in a pixel region X by depositing the formation material of the light emitting functional layer 110 on the substrate 20 by a vapor phase deposition method so as to cover the pattern 61a, and a process to expose the auxiliary electrode 115 by heating the pattern 60a of the thermally foaming resin to foam it and peeling off the pattern 61a comprising the pattern 60a and the photosensitive dry film. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a method for manufacturing an electroluminescent device.

  Conventionally, as an electroluminescence device, for example, an organic electroluminescence (hereinafter referred to as organic EL) device is known. In this organic EL device, a plurality of circuit elements, an anode, a light emitting functional layer including a hole injection layer and an organic EL layer (light emitting layer), a cathode, and the like are laminated on a substrate, and these are sealed with a sealing substrate or the like. It has a configuration. Moreover, as such an organic EL device, a bottom emission type in which light emitted from the light emitting functional layer is extracted from the substrate side on which the circuit element is formed, and a top emission type in which light is emitted from the sealing substrate side that seals the light emitting functional layer (For example, refer to Patent Document 1).

  By the way, in the organic EL device described above, the pixel regions are partitioned and electrically separated by partition walls (banks) formed of an insulating material. That is, generally in an organic EL device, pixel electrodes (first electrodes) as anodes are formed on the substrate side on which circuit elements and the like are formed, and these pixel electrodes are insulated from each other by the partition walls. A common electrode (second electrode) functioning as a cathode is formed on the pixel electrode via a light emitting functional layer, so that light emission driving can be performed independently for each pixel region.

In particular, in the top emission type, since the cathode (second electrode) needs to be a transparent electrode, a low-resistance metal such as Al cannot be used directly. Therefore, the partition is made of Al or the like for the purpose of reducing its resistance. An auxiliary electrode may be formed.
In the case of forming such an auxiliary electrode, usually, after forming a light emitting functional layer on the entire surface by an evaporation method or the like, Al or the like is selectively evaporated on the partition wall using a mask, and an auxiliary electrode having a desired pattern is formed. Forming.
JP 2005-285777 A

However, when the auxiliary electrode is formed by the vapor deposition method using the mask as described above, there are a lot of foreign matters (particles) in the vapor deposition apparatus. Therefore, when the mask is placed on and adhered to the substrate (substrate). In some cases, foreign matter may be caught between them. And if the foreign matter is bitten in this way, it will remain without being removed even in the subsequent process, resulting in the occurrence of a short circuit or a bright line when the panel is lit in the resulting organic EL device due to the foreign matter. May occur.
That is, after the formation of the light emitting functional layer, it is not possible to perform cleaning or the like in order to avoid an adverse effect on the light emitting functional layer, and therefore, even if foreign matter is bitten on the light emitting functional layer and remains as it is, This cannot be removed in a later process, and the above-described defects such as shorts and bright lines are caused.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a method for manufacturing an electroluminescent device, which prevents adverse effects caused by foreign matter adhering to the auxiliary electrode during formation.

In order to achieve the above object, a method of manufacturing an electroluminescent device according to the present invention includes a first electrode provided on a substrate, a light emitting functional layer provided on the first electrode, and a light emitting functional layer. A plurality of pixel regions partitioned by a partition provided on the substrate, each having a light emitting functional layer, and an auxiliary electrode joined to the second electrode on the partition An electroluminescence device manufacturing method comprising:
Forming a first electrode and a partition on the substrate;
Forming the auxiliary electrode on the partition;
Covering the auxiliary electrode and pasting a photosensitive dry film on the substrate via a thermally foamable resin;
Patterning by exposing and developing the photosensitive dry film corresponding to the pattern of the auxiliary electrode; and
Patterning the thermally foamable resin using a pattern made of the photosensitive dry film as a mask;
Covering the pattern made of the photosensitive dry film, forming a light emitting functional layer forming material on the substrate by a vapor deposition method, and forming a light emitting functional layer in the pixel region;
Heating the pattern made of the thermally foamable resin to foam it, thereby peeling the photosensitive dry film pattern containing the thermally foamable resin to expose the auxiliary electrode;
Forming the second electrode so as to cover the auxiliary electrode and the light emitting functional layer.

  According to this method for manufacturing an electroluminescent device, the photosensitive dry film and the heat-foamable resin are patterned corresponding to the pattern of the auxiliary electrode prior to the formation of the light emitting functional layer. After the film is formed by a vapor deposition method such as vapor deposition, the photosensitive dry film pattern containing the thermally foamable resin is peeled off to expose the auxiliary electrode. The adhered foreign matter (particles) is removed from the substrate as the photosensitive dry film pattern is peeled off. Therefore, it is possible to prevent defects such as shorts and bright lines due to adhesion / remaining foreign matter.

Moreover, in the manufacturing method of the said electroluminescent apparatus, it is preferable that the said heat foamable resin is integrally provided previously in the back surface of the said photosensitive dry film.
In this way, the process of pasting the photosensitive dry film on the substrate through the thermally foamable resin so as to cover the auxiliary electrode can be pasted with the photosensitive dry film integrated with the thermally foamable resin as it is. Therefore, the process becomes easy.

Further, in the method of manufacturing the electroluminescence device, in the step of attaching a photosensitive dry film on the substrate via a thermally foamable resin, the photosensitive circuit also covers the drive circuit portion formed on the substrate. Put a dry film,
In the step of patterning the photosensitive dry film, it is preferable that the pattern obtained is a pattern covering the drive circuit unit.
In this way, even if foreign matter adheres to the drive circuit portion during film formation of the light emitting functional layer forming material, the foreign matter can be easily removed from the substrate by peeling the photosensitive dry film pattern. Therefore, it is possible to prevent a short circuit caused by foreign matter in the drive circuit portion.

In the method for manufacturing the electroluminescence device, the light emitted from the light emitting functional layer is white light.
It is preferable to provide a step of attaching a sealing substrate having a colored portion on the second electrode via a sealing portion.
If it does in this way, a white display from a light emission functional layer will be colored by the color of a colored part by transmitting a colored part, and color display will be attained.

Hereinafter, the present invention will be described in detail.
In each of the drawings shown below, the scale of each layer or each member is appropriately changed so that each layer or each member has a size that can be recognized on the drawing.
First, prior to the description of the method for manufacturing the electroluminescent device of the present invention, the structure of the electroluminescent device according to the present invention will be described. Note that the electroluminescence device described here is a top emission type organic electroluminescence device (hereinafter referred to as an organic EL device).

FIG. 1 is a schematic diagram showing a wiring structure of an organic EL device according to the present invention. In FIG. 1, reference numeral 1 denotes an organic EL device.
This organic EL device 1 is of an active matrix type using thin film transistors (hereinafter referred to as TFTs) as switching elements, and intersects a plurality of scanning lines 101. And a plurality of power lines 103 extending in parallel to each signal line 102, and in the vicinity of the intersections of the scanning lines 101 and the signal lines 102. Pixel regions X are formed.
A data line driving circuit 100 including a shift register, a level shifter, a video line, and an analog switch is connected to the signal line 102. Further, a scanning line driving circuit 80 including a shift register and a level shifter is connected to the scanning line 101.

  Further, in each pixel region X, a switching TFT (switching element) 112 to which a scanning signal is supplied to the gate electrode via the scanning line 101 and a pixel supplied from the signal line 102 via the switching TFT 112 are provided. A holding capacitor 113 for holding a signal, a driving TFT (switching element) 123 to which a pixel signal held by the holding capacitor 113 is supplied to a gate electrode, and the power supply line 103 through the driving TFT 123 are electrically connected A pixel electrode (anode; first electrode) 23 into which a driving current flows from the power supply line 103 when connected, and a light emitting functional layer sandwiched between the pixel electrode 23 and the common electrode (cathode; second electrode) 50 110 is provided.

  Next, specific modes of the organic EL device 1 according to the present invention will be described with reference to FIGS. Here, FIG. 2 is a plan view schematically showing the configuration of the organic EL device 1, FIG. 3 is a cross-sectional view schematically showing the organic EL device 1, and FIG. 4 is a diagram showing the main part of FIG. It is sectional drawing for demonstrating the structure and effect | action of a pixel area | region in a display unit pixel.

As shown in FIG. 2, in the organic EL device 1 of the present embodiment, a substrate 20 </ b> A that emits light from the light emitting functional layer 110 is configured by forming various wirings, TFTs, pixel electrodes, and various circuits on the substrate 20. . The substrate 20A includes a substrate 20 having electrical insulation, a pixel region X in which pixel electrodes 23 connected to the switching TFT 112 are arranged in a matrix on the substrate 20 (see FIG. 1), and the pixel region X A power line 103 arranged around and connected to each pixel electrode, and at least a pixel portion 3 (inside the one-dot chain line in FIG. 2) having a substantially rectangular shape in a plan view located on the pixel region X. ing.
In the present embodiment, the pixel unit 3 includes an actual display area 4 (within the two-dot chain line in the figure) in the center and a dummy area 5 (one-dot chain line and two-dot chain line) arranged around the actual display area 4. Between the two areas).

In the actual display area 4, display areas RGB provided corresponding to the pixel areas X are regularly arranged in the left-right direction on the paper surface. In addition, each of the display areas RGB is arranged in the same color in the vertical direction of the paper, and constitutes a so-called stripe arrangement. The display area RGB is defined by a color filter (coloring portion) described later in this example. In other words, each pixel region X corresponding to each of the display regions RGB is provided with a light emitting functional layer 110, and this light emitting functional layer 110 emits white light by the operation of the TFTs 112 and 123. . The white light emitted from the light emitting functional layer 110 passes through the color filter and is colored by the color of the color filter, thereby forming a color display. In addition, the display area RGB constitutes a display unit pixel as one basic unit, and the display unit pixel performs full color display by mixing colors of RGB light emission.
Further, scanning line driving circuits 80 and 80 are arranged on both sides of the actual display area 4 in FIG.

  In addition, an inspection circuit 90 is disposed above the actual display area 4 in FIG. The inspection circuit 90 is a circuit for inspecting the operating state of the organic EL device 1, and includes, for example, inspection information output means (not shown) for outputting the inspection result to the outside, and is organic during manufacturing or shipping. It is configured so that the quality and defect inspection of the EL device can be performed.

  The driving voltages of the scanning line driving circuit 80 and the inspection circuit 90 are applied from a predetermined power supply unit through a driving voltage conducting unit (not shown) and a driving voltage conducting unit (not shown). The drive control signals and drive voltages to the scanning line drive circuit 80 and the inspection circuit 90 are supplied from a predetermined main driver that controls the operation of the organic EL device 1 and the drive control signal conduction unit (not shown) and drive voltage. It is transmitted and applied via a conduction part (not shown). The drive control signal in this case is a command signal from a main driver or the like related to control when the scanning line drive circuit 80 and the inspection circuit 90 output signals.

Next, a cross-sectional structure of the organic EL device 1 will be described with reference to FIG.
The organic EL device 1 is roughly composed of the base body 20A, the sealing substrate 30, and a sealing portion 31 that seals between the substrate 20A and the sealing substrate 30.
Here, the base body 20A includes an interlayer insulating film 21 provided on the substrate 20, a partition wall 22 provided on the interlayer insulating film 21, a light emitting functional layer 110 provided in the partition wall 22, and the like. Has been.

  The substrate 20 is a substrate made of a transparent material or a non-transparent material. As the transparent substrate, a glass substrate or a transparent resin substrate is employed, and as the non-transparent substrate, a metal substrate or a non-transparent resin substrate is employed. In this example, since the top emission structure is used as described above, either a transparent substrate or a non-transparent substrate can be adopted as the substrate 20.

The interlayer insulating film 21 is formed of a silicon oxide film (SiO ₂ ) or the like, and the scanning lines 101, signal lines 102, power supply lines 103, switching TFTs 112, and driving lines provided on the substrate 20 are provided. It is formed so as to cover the TFT 123 (described above in FIG. 1). The interlayer insulating film 21 is a layer film that also functions as a planarization film because the TFTs 112 and 123 and the various wirings 101, 102, and 103 are buried and planarized by the material itself. In this embodiment, a silicon oxide film is used as the interlayer insulating film 21, but the present invention is not limited to this, and an insulating material such as a silicon nitride film (SiN) or a silicon oxynitride film (SiON) is used. Also good.

  On the interlayer insulating film 21, pixel electrodes (first electrodes) 23 are formed corresponding to the driving TFTs 123, respectively. The pixel electrode 23 has a structure in which a reflective film 23a made of a light reflective metal such as Al and a transparent conductive film 23b made of indium tin oxide (ITO) or the like are laminated. However, the pixel electrode 23 may have a single-layer structure made of only a light reflective metal. The pixel electrode 23 is electrically connected to the driving TFT 123 via a plug (not shown) in a contact hole formed in the interlayer insulating film 21.

  Further, on the interlayer insulating film 21, the gap between the adjacent pixel electrodes 23, 23 is covered, and further, the pixel electrodes 23, 23 are insulated from each other in a state where the pixel electrodes 23, 23 are laid on the periphery of the pixel electrode 23, A partition wall 22 that partitions X is formed. The partition wall 22 is made of an organic insulating material such as acrylic resin or polyimide resin, and is made of a non-photosensitive resin or a photosensitive resin. The partition wall 22 is formed with an opening 22a that exposes the pixel electrode 23 and forms a pixel region X.

  On the pixel electrode 23 exposed in the opening 22a and the upper surface of the partition wall 22, a light emitting functional layer 110 is provided so as to cover them. Although not shown, the light emitting functional layer 110 is formed by laminating a hole transport layer, a hole injection layer, an organic EL layer, an electron injection layer, and an electron transport layer in this order from the pixel electrode 23 side. Each of these layers is formed by a vapor deposition method such as a vapor deposition method in this example. Note that the layer configuration of the light emitting functional layer 110 can be appropriately changed as necessary. For example, the organic EL layer may have a laminated structure including a plurality of layers.

  Here, the hole transport layer and the hole injection layer are formed of a material such as a triphenylamine derivative (TPD), a pyrazoline derivative, an arylamine derivative, a stilbene derivative, or a triphenyldiamine derivative. Specifically, JP-A-63-70257, JP-A-63-175860, JP-A-2-135359, JP-A-2-135361, JP-A-2-209998, JP-A-3-37992, and JP-A-3-152184. Examples of the forming material include those described in the publication, but a triphenyldiamine derivative is preferable, and 4,4′-bis (N (3-methylphenyl) -N-phenylamino) biphenyl is particularly preferable. The

The organic EL layer is formed of a low molecular weight organic light emitting dye or polymer light emitter, that is, a light emitting material such as various fluorescent materials or phosphorescent materials, or an organic electroluminescent material such as Alq ₃ (aluminum chelate complex). Among the conjugated polymers that serve as the light-emitting substance, those containing an arylene vinylene or polyfluorene structure are particularly preferable. In the low-molecular light emitters, for example, naphthalene derivatives, anthracene derivatives, perylene derivatives, polymethine-based, xanthene-based, coumarin-based, cyanine-based pigments, 8-hydroquinoline and its metal complexes, aromatic amines, tetraphenylcyclo Pentadiene derivatives and the like, or known ones described in JP-A-57-51781 and 59-194393 can be used.

  However, in this example, since the light emitting functional layer 110 including the organic EL layer emits white light as described above, the material is appropriately selected and used so that the emitted light becomes white. It is done. That is, since white light is light in which color wavelengths of a plurality of peak wavelengths are combined, the material is selected so that color wavelengths of the plurality of peak wavelengths are combined.

  The electron injection layer and the electron transport layer include, for example, oxadiazole derivatives, anthraquinodimethane and its derivatives, benzoquinone and its derivatives, naphthoquinone and its derivatives, anthraquinone and its derivatives, tetracyanoanthraquinodimethane and its derivatives, fluorenone It is formed of a material such as a derivative, diphenyldicyanoethylene and its derivative, diphenoquinone derivative, 8-hydroxyquinoline and a metal complex of its derivative. Specifically, as in the case of the previous hole transport layer and hole injection layer, JP-A-63-70257, JP-A-63-175860, JP-A-2-135359, JP-A-2-135361, Examples described in JP-A-2-209988, JP-A-3-37992, and JP-A-3-152184 are examples of forming materials, and in particular, 2- (4-biphenylyl) -5- (4-t-butylphenyl). ) -1,3,4-oxadiazole, benzoquinone, anthraquinone, and tris (8-quinolinol) aluminum are preferred.

  On the light emitting functional layer 110 having such a configuration, an auxiliary electrode 115 made of a metal such as Al is formed on the upper surface of the partition wall 22 in particular. A cathode (second electrode) 50 as a common electrode is formed on the light emitting functional layer 110 so as to cover the auxiliary electrode 115. The cathode 50 is made of a thin film such as MgAg formed by a vapor deposition method or the like, and is formed with sufficient transparency so that light emitted from the light emitting functional layer 110 can be transmitted satisfactorily.

  Further, a transparent passivation film 55 made of SiON or the like is formed on the cathode 50 so as to cover it. The passivation film 55 functions to prevent moisture and oxygen from entering the light emitting functional layer 110 from the outside and to transmit light emitted from the light emitting functional layer 110 to the sealing substrate 30 side. . Therefore, an opaque metal product cannot be used, and the transparent and dense oxynitride film is preferably used.

  Further, the sealing substrate 30 is stuck on the passivation film 55 through a transparent adhesive layer 57. The transparent adhesive layer 57 is formed of a thermosetting resin or an ultraviolet irradiation curable resin, and is made of, for example, an epoxy resin or an acrylic resin. The passivation film 55 and the transparent adhesive layer 57 form a sealing portion 31 that seals between the substrate 20 </ b> A and the sealing substrate 30.

The sealing substrate 30 is made of a material having optical transparency and electrical insulation, and is made of, for example, a glass substrate. The sealing substrate 30 has a black matrix 35 and color filters (colored portions) 37 (37R, 37G, 37B) formed on the inner surface thereof, that is, the surface on the transparent adhesive layer 57 side.
The black matrix 35 is formed and arranged between the pixel regions X in the actual display region 4, that is, directly above the partition wall 22, and is formed in a lattice shape with a light-shielding metal such as Cr or resin black. It is. With such a configuration, the regions surrounded by the black matrix 35 correspond to the pixel regions X, respectively. A color filter 37 is formed and arranged in a region surrounded by the black matrix 35.

  The color filter 37 is formed and arranged at a position corresponding to each of the pixel areas X, that is, almost immediately above the pixel area X, thereby defining the display area RGB as described above. That is, in this embodiment, since the light emitting functional layer 110 emits white light as described above, the emitted white light is colored by being transmitted through the color filter 37 (37R, 37G, 37B), and red (R). , Green (G), and blue (B) are emitted as light having a peak in the wavelength region. Therefore, as described above, the white light emitted from the light emitting functional layer 110 constitutes the display unit pixel with the display area RGB as one basic unit, and thus the RGB light emission is mixed. Thus, full color display is performed for each display unit pixel.

Next, based on the manufacturing method of the organic EL device 1 having such a configuration, one embodiment of the manufacturing method of the organic EL device of the present invention will be described.
First, the scanning line 101, the signal line 102, the power supply line 103, the switching TFT 112, and the driving TFT 123 (described above in FIG. 1) are formed on the substrate 20 in the same manner as in the prior art. In such a method of forming TFTs and various wirings, various layer films are formed by a CVD method, a sputtering method, or the like, and then patterning is performed using a known photolithography method, an etching method, or the like. An ion doping method or the like is employed to form the source region and the drain region in the semiconductor layer.

Next, an interlayer insulating film 21 is formed so as to cover them, and a contact hole is formed in the interlayer insulating film 21, and then a conductive material is embedded in the contact hole to form a plug (not shown). .
Next, a pixel electrode (first electrode) 23 composed of a reflective film 23 a and a transparent conductive film 23 b is formed on the interlayer insulating film 21, and the pixel electrode 23 and the driving TFT 123 are made conductive through the plug. For the formation of the pixel electrode 23, a film forming method using a vapor phase film forming method such as a sputtering method or a vapor deposition method, and a patterning method using a photolithography method, an etching method, or the like are employed.

Next, the partition wall 22 is formed on the side of the pixel electrode 23. As a method for forming the partition wall 22, a wet film forming method such as a spin coating method, a dip method, or a slit coating method is preferably employed. After film formation, the resin is cured by heat treatment or the like, and patterned by a known photolithography method and etching method to form the opening 22a. Alternatively, the partition wall 22 may be formed using a droplet discharge method.
Through these steps, pixel electrodes 23 and barrier ribs 22 are formed on the substrate 20 as shown in FIG. In FIG. 4A, illustration of the driving TFT 123 and the like is omitted (the same applies hereinafter).

  Next, in this embodiment, Al as an auxiliary electrode material is formed on the entire surface by sputtering or the like. Then, a resist mask is formed by a known resist method and photolithography method, and further, etching is performed using this resist mask, thereby forming the auxiliary electrode 115 on the partition wall 22 as shown in FIG. 4B. .

  Next, as shown in FIG. 4C, a photosensitive dry film 61 is pasted on the entire surface of the substrate 20 with a thermally foamable resin 60 so as to cover the auxiliary electrode 115. That is, the photosensitive dry film 61 is attached so as to cover the scanning line driving circuit (driving circuit unit) 80 and the inspection circuit 90 shown in FIG. The photosensitive dry film 61 has the same function as a resist material, and an exposed portion or a non-exposed portion is selectively developed and removed by an exposure process. As such a photosensitive dry film 61, “ORDYL E4025 (trade name)” (for 25 μm film thickness) and “ORDYL E4040 (trade name)” (for 40 μm film thickness) manufactured by Tokyo Ohka Kogyo Co., Ltd. are suitable. Used. The thermally foamable resin 60 contains a foaming agent that foams when heated. For example, “Riva Alpha” (trade name) manufactured by Nitto Denko Corporation is preferably used.

  Here, as the photosensitive dry film 61 and the thermally foamable resin 60, those obtained by integrally attaching the thermally foamable resin 60 to the back surface of the photosensitive dry film 61 in advance, that is, laminated are preferably used. It is done. By using the laminated material as described above, the step of attaching the photosensitive dry film 61 can be facilitated.

Next, the photosensitive dry film 61 is patterned to correspond to the pattern of the auxiliary electrode 115 and is exposed and developed. That is, in the actual display region 4 shown in FIG. 2, the photosensitive dry film 61 is patterned so as to have the same planar shape as the auxiliary electrode 115. Further, portions other than the actual display area 4 shown in FIG. 2 are left covered with the scanning line driving circuit 80 (driving circuit unit) without being removed by development. As for the exposure / development processing of the photosensitive dry film 61, for example, it is exposed at an intensity of 200 mJ / cm ² , and then immersed in a developer (for example, ADS-2000U [trade name]) for 90 seconds, and further washed with running water for 5 minutes. Do that.

Next, as shown in FIG. 5A, the thermally foamable resin 60 is patterned using the pattern 61a made of the photosensitive dry film 61 thus obtained as a mask, and the pattern having the same planar shape as the pattern 61a. 60a is formed. The patterning of the thermally foamable resin 60 can be performed by, for example, O ₂ plasma processing using an RIE processing apparatus. Specifically, the ashing process is performed at 200 W for 20 minutes at a processing atmosphere pressure of 0.2 Torr, an O ₂ flow rate of 30 sccm.

  Next, as shown in FIG. 5B, a material for forming the light emitting functional layer 110 is formed on the entire surface of the substrate 20 so as to cover the pattern 61a made of the photosensitive dry film 61 by vapor deposition (vapor deposition method). Film. That is, each forming material of a hole transport layer, a hole injection layer, an organic EL layer, an electron injection layer, and an electron transport layer is formed in this order by a vapor deposition method. As a result, the light emitting functional layer 110 is formed in the opening 22a of the partition wall 22 exposed without being covered with the pattern 61a. That is, the light emitting functional layer 110 is formed in each pixel region X of the actual display region 4 shown in FIG. By this film formation, a material for forming the light emitting functional layer 110 is also formed on the pattern 61 a made of the photosensitive dry film 61.

At this time, when the film is formed by the vapor deposition method as described above, a lot of foreign matters (particles) exist in the vapor deposition apparatus. Therefore, as shown in FIG. Foreign matter (particles) P may adhere. In addition, when transported prior to this, the foreign matter P may adhere.
Therefore, after this film forming step, the substrate 20 is heated to an appropriate temperature, thereby heating the pattern 60a made of the thermally foamable resin 60 and causing it to foam. Then, the adhesive strength of the thermally foamable resin 60 forming the pattern 60a is greatly reduced by foaming. As a result, the pattern 61a made of the photosensitive dry film 61 adhered on the auxiliary electrode 115 or the like through the pattern 60a can be easily peeled off from the auxiliary electrode 115 or the like.

  If the pattern 61a can be peeled by heating in this way, the pattern 61a is peeled off. As a result, as shown in FIG. 5C, the pattern 61a is removed from the auxiliary electrode 115 (on the substrate 20) together with the pattern 60a made of the thermally foamable resin 60, and the auxiliary electrode 115 is exposed. At this time, the foreign matter (particles) P adhering to the light emitting functional layer 110 or the like is also removed from the substrate 20 with the peeling of the pattern 61 a made of the photosensitive dry film 61. That is, not only the foreign matter P directly on the pattern 61a on the auxiliary electrode 115, but also the relatively large foreign matter P partially on the pattern 61a even on the light emitting functional layer 110, etc. Accompanying the peeling, it is removed from the substrate 20. Further, the foreign matter P placed thereon is also removed from the portions other than the actual display area 4 shown in FIG. 2 by peeling the pattern 61a.

Next, a film of MgAg as a cathode material is deposited by vapor deposition so as to cover the auxiliary electrode 115 and the light emitting functional layer 110, thereby forming a cathode (common electrode; second electrode) 50 that is electrically connected to the auxiliary electrode 115.
Next, a passivation film 55 is formed on the cathode 50 by a CVD method or the like (see FIG. 3). Thereafter, a separately prepared sealing substrate 30 in a state where the black matrix 35 and the color filter 37 are formed is stuck on the passivation film 55 of the substrate 20 through the transparent adhesive layer 57, and the organic EL shown in FIG. Device 1 is obtained.

  In such a manufacturing method of the organic EL device 1, after the pattern 60a of the thermally foamable resin 60 is foamed by heating, the pattern 61a of the photosensitive dry film 61 is peeled off together with the pattern 60a, and the auxiliary electrode 115 is peeled off. Therefore, the foreign matter (particles) P adhering at the time of forming the material for forming the light emitting functional layer 110 can be removed from the substrate 20 by peeling the pattern 61a.・ Defects such as shorts and bright spots / bright lines due to residuals can be prevented.

  Further, since the pattern 61a of the photosensitive dry film 61 is formed in a pattern covering the scanning line driving circuit (driving circuit unit) 80 and the like, the scanning line driving is performed at the time of forming the material for forming the light emitting functional layer 110. Even if the foreign matter P adheres to the circuit (driving circuit unit) 80 or the like, the foreign matter P can be easily removed from the substrate 20 by peeling the pattern 61a. Therefore, it is possible to prevent a short circuit or the like due to foreign matter in the scanning line driving circuit (driving circuit unit) 80 or the like.

  Note that the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the gist of the present invention. For example, in the above-described embodiment, the organic EL layer is particularly formed as the light emitting functional layer 110 so that the emitted light becomes white light. The organic EL layer (light emitting functional layer 110) is formed for each pixel region X. You may make it light-emit as light which has a peak in any wavelength range of red (R), green (G), and blue (B), ie, colored light. In this case, the color of the color filter 37 (37R, 37G, 37B) is the same color as the emitted light (colored light) in the light emitting functional layer 110 of the pixel region X at the corresponding position. With this configuration, the color of the emitted light (colored light) in the light emitting functional layer 110 and the color of the color filter 37 (37R, 37G, 37B) that transmits the same are the same color. The light transmitted through (37R, 37G, 37B) has a higher color purity, and the display performance is further improved.

Further, in the case where the light colored by the organic EL layer (light emitting functional layer 110) is configured to emit light as described above, the color filter 37 (37R, 37G, 37B) is not provided, and black is provided as necessary. A sealing substrate may be formed by providing only the matrix 35. Even in this case, the colored light is directly emitted from the sealing substrate, thereby enabling full color display.
Further, in the embodiment, the RGB color filter 37 is used for the color filter 37. However, the color filter 37 is a multicolor system, that is, a 4-color system in which W (white) is added to RGB, or 6 A color system or the like may be used.
Furthermore, in the above embodiment, the EL device of the present invention is applied to a top emission type organic EL device. However, the present invention can be applied to an inorganic EL device and also to a bottom emission type.

Next, an electronic apparatus according to the present invention will be described.
The organic EL device 1 obtained by the present invention can be used particularly as a display unit in an electronic device. Examples of such electronic devices include the following.
FIG. 6A is a perspective view showing an example of a mobile phone. In FIG. 6A, reference numeral 500 denotes a mobile phone body, and reference numeral 501 denotes a display unit including an organic EL device.
FIG. 6B is a perspective view illustrating an example of a portable information processing apparatus such as a word processor or a personal computer. 6B, reference numeral 600 denotes an information processing apparatus, reference numeral 601 denotes an input unit such as a keyboard, reference numeral 603 denotes an information processing body, and reference numeral 602 denotes a display unit including an organic EL device.
FIG. 6C is a perspective view showing an example of a wristwatch type electronic device. In FIG. 6C, reference numeral 700 denotes a watch body, and reference numeral 701 denotes a display unit including an organic EL device.
Since the electronic apparatus shown in FIGS. 6A to 6C includes the organic EL device 1 in which defects such as a short circuit, a bright spot, and a bright line are prevented, as shown in the previous embodiment. It becomes a good electronic device having high display characteristics.

  The electronic apparatus is not limited to the electronic apparatus, and the present invention can be applied to various electronic apparatuses. For example, a desktop computer, a liquid crystal projector, a multimedia personal computer (PC) and an engineering workstation (EWS), a pager, a word processor, a TV, a viewfinder type or a monitor direct view type video tape recorder, an electronic notebook, an electronic The present invention can be applied to electronic devices such as a desktop computer, a car navigation device, a POS terminal, and a device having a touch panel.

It is a schematic diagram which shows the wiring structure of the organic electroluminescent apparatus which concerns on this invention. 1 is a plan view schematically showing a configuration of an organic EL device according to the present invention. 1 is a cross-sectional view schematically showing an organic EL device according to the present invention. (A)-(c) is principal part sectional drawing for demonstrating the manufacturing method of this invention. (A)-(c) is principal part sectional drawing for demonstrating the manufacturing method of this invention. (A)-(c) is a figure which shows an electronic device provided with the organic EL apparatus which concerns on this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Organic EL apparatus (organic electroluminescent apparatus), 20 ... Board | substrate, 20A ... Base | substrate, 22 ... Partition, 23 ... Pixel electrode (anode; 1st electrode), 37, 37R, 37G, 37B ... Color filter (coloring part) , 30 ... sealing substrate, 50 ... common electrode (cathode; second electrode), 60 ... thermally foamable resin, 60a ... pattern, 61 ... photosensitive dry film, 61a ... pattern, 110 ... light emitting functional layer, 115 ... auxiliary Electrode, X ... pixel area

Claims (4)

A first electrode provided on the substrate, a light emitting functional layer provided on the first electrode, and a second electrode provided on the light emitting functional layer, and a partition provided on the substrate A method of manufacturing an electroluminescence device, which includes the light emitting functional layer in each of a plurality of partitioned pixel regions, and an auxiliary electrode that is joined to the second electrode on the partition wall,
Forming a first electrode and a partition on the substrate;
Forming the auxiliary electrode on the partition;
Covering the auxiliary electrode and pasting a photosensitive dry film on the substrate via a thermally foamable resin;
Patterning by exposing and developing the photosensitive dry film corresponding to the pattern of the auxiliary electrode; and
Patterning the thermally foamable resin using a pattern made of the photosensitive dry film as a mask;
Covering the pattern made of the photosensitive dry film, forming a light emitting functional layer forming material on the substrate by a vapor deposition method, and forming a light emitting functional layer in the pixel region;
Heating the pattern made of the thermally foamable resin to foam it, thereby peeling the photosensitive dry film pattern containing the thermally foamable resin to expose the auxiliary electrode;
Forming the second electrode so as to cover the auxiliary electrode and the light emitting functional layer, and a method for manufacturing an electroluminescent device.   The method for manufacturing an electroluminescent device according to claim 1, wherein the thermally foamable resin is integrally provided in advance on the back surface of the photosensitive dry film. In the step of pasting the photosensitive dry film on the substrate via the thermally foamable resin, the photosensitive dry film is pasted so as to cover the drive circuit portion formed on the substrate,
3. The method of manufacturing an electroluminescent device according to claim 1, wherein, in the step of patterning the photosensitive dry film, an obtained pattern is a pattern covering the drive circuit unit. The light emitted from the light emitting functional layer is white light,
The manufacturing of the electroluminescent device according to any one of claims 1 to 3, further comprising a step of attaching a sealing substrate having a colored portion on the second electrode via a sealing portion. Method.

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