JP2007150015A - Pattern forming method and liquid drop discharge device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a pattern forming method by a liquid drop discharge method which is hardly affected by the viscosity of a liquid drop to be discharged. <P>SOLUTION: The method includes a first process for discharging the liquid drop A, which is composed of a functional liquid B containing a material C to form a pattern in a base, toward the first region of the base to form the pattern; a second process for forming the pattern on the base by changing the state of the liquid drop A discharged on the base; and a third process for radiating a laser beam to a second region which is the region where the liquid drop A discharged on the base is naturally spread, and a third region which is the region after excluding the first region from the peripheral region of the second region. The spread of the liquid drop A is stopped by an interaction with the laser beam, so that the pattern is more precisely formed compared with a method for forming the pattern by removing a solvent D (a dispersion medium) after the liquid drop A is naturally spread. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a pattern forming method using a droplet discharge device and a droplet discharge device.

  In recent years, as means for forming a pattern such as a conductive wiring on a substrate such as glass, a droplet composed of a solute that is a pattern forming material and a solvent is discharged onto a discharge target surface of the substrate, and the droplet is covered. A pattern forming method using a droplet discharge device has been proposed in which the droplet is dried after spreading on the discharge surface, and the solvent is vaporized and removed to form the solute pattern (patent). Reference 1).

Japanese Patent Laid-Open No. 11-274671

  However, since the droplet discharge method described in Patent Document 1 forms a pattern by removing the solvent after the discharged droplets naturally spread on the discharge target surface, the dimensions of the obtained pattern The shape and shape depend on the shape and wettability distribution of the surface to be ejected, the viscosity and the minimum ejection amount of the droplets, and there is a problem that it is difficult to form an accurate pattern.

  In order to solve the above-mentioned problems, a pattern forming method according to the present invention includes a method of forming droplets made of a functional liquid having a material for forming a pattern on a substrate in a first region where the pattern on the substrate is to be formed. A second step of changing the state of the droplet landed on the substrate to form a pattern on the substrate, and the droplet landed on the substrate being wetted And a third step of irradiating the third region excluding the first region from the expanding second region or the peripheral region including the second region.

  According to the pattern forming method of the present invention, in the third step, the irradiation of the laser beam capable of suppressing the spread of the droplet due to the interaction between the droplet and the laser beam is performed in the third step. Since the liquid droplets in the region are not spread, the spread of the landed droplets is stopped on the line where the first region and the third region are in contact with each other, or the first region and the third region are stopped. It can be retracted to the line where the area touches. In other words, the landed droplets can be allowed to spread into the first region, and can be prevented from spreading outside the first region. As a result, it is possible to form a pattern with higher accuracy than in the conventional method of forming the pattern by removing the solvent after the ejected droplets spread on the ejection target surface.

  Here, the interaction between the droplet and the laser beam is, for example, convection and mass transfer due to temperature difference caused by partial light irradiation, force to push back the droplet generated by partial vaporization (evaporation / boiling), light pressure, etc. For example, it is possible to use a change in the momentum of the droplet due to.

  The functional liquid is a liquid containing a solute and a solvent containing a material for forming a pattern, or a dispersoid containing a material for forming a pattern and a dispersion medium. Examples of functional liquids include conductive materials, bank materials, insulating materials, resistive materials, dielectric materials, liquid silicon materials, etching materials, marking materials, adhesive materials, spacer materials, color filter materials, optical lens materials, and various organic ELs. Examples thereof include materials and titania-dispersed materials.

  In addition, the state change of the droplet is due to concentration (density) change due to vaporization of the solvent (dispersion medium), phase change, two-liquid mixing, progress of chemical reaction with the substance on the substrate surface, or progress of photopolymerization reaction. Changes in viscosity, liquid phase-solid phase change, sol-gel reaction, and the like.

  Preferably, the first step is performed during the execution of the third step.

  According to this pattern forming method, the third region is irradiated with laser light before the droplets land on the substrate and begin to spread. Therefore, the interaction with the laser beam starts at the moment when the droplet enters the third region, and it is further suppressed that the pattern is formed in the third region, and the pattern with higher accuracy is obtained. Formation is possible.

  Preferably, in the third step, the laser beam is irradiated so that the third region faces across the position where the droplets land on the substrate.

  According to this pattern forming method, the spread of the droplets landed on the substrate can be suppressed by being sandwiched from both sides. Therefore, it is possible to form a pattern with higher accuracy on the substrate as compared with the formation method that suppresses the spread only from one side.

  Preferably, in the third step, the irradiation intensity of the laser light is changed in accordance with a change in the state of the droplet.

  According to such a pattern forming method, an optimum irradiation intensity can be given according to the concentration of the solvent (dispersion medium) contained in the droplet, and mass transfer can be performed efficiently. Even when the droplets that have landed on the substrate are fixed on the way back to the line where the first region and the third region are in contact with each other, for example, a laser pulse having an ablation threshold value or more is applied. In addition, the substance can be removed, and a more accurate pattern can be formed on the substrate.

  Preferably, in the first step, the droplets are discontinuously ejected on the substrate at intervals, and in the third step, the droplets land on the third region. Move continuously according to the position.

  According to such a pattern forming method, by continuously moving the third region, it is possible to discharge the droplets while continuously suppressing the spread of the droplets that have landed on the substrate. it can. Therefore, it is possible to form a pattern that extends linearly while keeping the size of the area of the third region constant.

  Preferably, in the third step, the region surrounding the periphery of the discharged droplet is irradiated with the laser beam.

  According to this pattern forming method, since the third region is set so as to surround the periphery of the droplet that has landed on the substrate, the spread of the droplet after landing can be suppressed over the entire periphery. Therefore, a square pattern or the like can be formed on the substrate with higher accuracy.

  In addition, in order to solve the above-described problem, the pattern forming method according to the present invention forms a pattern on a substrate on which a droplet is to be ejected using a functional liquid having a material for forming the pattern. A first step of discharging into the first region to be performed, a second step of irradiating the laser beam to a region that does not overlap with the first region, and the liquid that has landed in the first region From a third step of changing the state of the droplet to form a pattern on the substrate, a second region in which the droplet landed on the substrate spreads out, or a peripheral region including the second region And a fourth step of changing the shape of the region irradiated with the laser light so that the third region, which is the region excluding the first region, is irradiated with the laser light.

  According to this pattern forming method, a region irradiated with the laser light that has not overlapped with the first region (hereinafter referred to as an “irradiation region”) is the third after the droplet has landed. By changing the area so as to include the area of the liquid droplets, it interacts with only the portion of the liquid droplets that have landed on the substrate, gradually reduces the volume of the liquid droplets, and pushes back toward the position where the liquid droplets have landed. be able to. Therefore, it is possible to suppress the material for forming the pattern from remaining in the irradiation region, and it is possible to form a pattern with high accuracy.

  Preferably, the first step is performed during the execution of the second step.

  According to the pattern forming method, the irradiation region is formed before the droplet starts to land on the substrate and spread. Therefore, the interaction between the droplet and the laser beam starts at the moment when the droplet reaches the irradiation region, that is, the moment when the droplet contacts the irradiation region. Reaching this level is further suppressed, and a pattern with higher accuracy can be formed.

  Preferably, in the second step, the laser beam is irradiated so that a region irradiated with the laser beam does not overlap the second region.

  According to this pattern forming method, the region outside the region where the droplets naturally spread after landing on the substrate is irradiated with laser light. Therefore, even if a slight deviation occurs in the landing point, the liquid droplets land in the irradiation region, and the state of the liquid droplets changes instantaneously due to the interaction with the laser beam, so that the first region The possibility of leaving the material for forming the pattern outside decreases, and the influence of the position accuracy of the landing point on the accuracy of the pattern to be formed can be suppressed.

  Preferably, in order to change the state of the droplet, the droplet is irradiated with the laser light.

  According to this pattern forming method, the laser beam used to stop the spread of the droplets can be used as the solvent removing means and the fixed pattern modifying means, so that the cost is not increased. Productivity can be improved.

  In order to solve the above problems, a droplet discharge device according to the present invention forms a pattern of a substrate on which a droplet from a functional liquid having a material for forming a pattern is to be discharged. A droplet discharge unit capable of discharging into a region to be discharged; a holding unit configured to hold an object from which the droplet is to be discharged; and a laser beam irradiation unit capable of irradiating a laser beam on an arbitrary region of the substrate.

  According to such a droplet discharge device, the phenomenon that the droplet that has landed on the substrate held by the holding means spreads on the surface of the substrate is suppressed by interacting with the droplet by laser light irradiation. Can do. Therefore, the controllability of the pattern is improved and a pattern can be formed with high accuracy compared to a droplet discharge device that does not have a means for suppressing the spread of the landed droplets.

  Preferably, the laser light irradiation means includes at least a light source that generates laser light and a diffractive optical element that diffracts the laser light.

  According to such a droplet discharge device, the size and shape of the region irradiated with the laser beam can be easily changed by transmitting the laser beam to the diffractive optical element in the previous period. Accuracy can be implemented while suppressing an increase in device cost.

(First embodiment)
Embodiments of a pattern forming method using a droplet discharge method and a droplet discharge apparatus according to the present invention will be described below with reference to the drawings. First, the droplet discharge device according to the present embodiment will be described with reference to FIG.

  FIG. 1 shows an electromechanical conversion type droplet discharge means 10 that utilizes the property that a piezoelectric element (piezoelectric element) is deformed by application of an electrical signal, and a semiconductor that emits laser light having a wavelength of 810 nm, according to the present embodiment. Laser beam irradiation means 20 combining a diffractive optical element and a substrate (hereinafter simply referred to as “substrate”) 40 on which a pattern is to be formed are held in a laser array and moved in the XY direction, that is, in the plane direction. 2 is a schematic cross-sectional view of a droplet discharge device including a possible substrate holding means 30. FIG.

  The droplet discharge means is provided with a nozzle plate 102 on the lower side, and forms a droplet A from a functional liquid B described later on the lower surface thereof, and a circular hole nozzle that discharges the droplet A onto a facing substrate 40 described later. 106 is formed. A cavity 108 as a pressure chamber is formed on the upper surface of the nozzle plate 102. The cavities 108 are electrically connected to a storage tank (not shown) via the corresponding communication holes 110 and supply paths 112, and supply the functional liquid B stored in the tank to the nozzle 106. The functional liquid B in each embodiment and modification is a liquid obtained by dissolving (dispersing) the pattern forming material C in the solvent (dispersion medium) D.

  A diaphragm 104 is provided above the cavity 108. The diaphragm is a polyphenylene sulfide film having a thickness of about 2 μm, and is attached so as to be able to vibrate in the vertical direction, and the volume in the cavity 108 is enlarged and reduced by the vibration. A piezo element 114 is disposed above the diaphragm. The piezo element 114 contracts or expands in response to a drive signal supplied from a control device (not shown), and vibrates the diaphragm 104 in the vertical direction. When the piezo element 114 vibrates, the volume in the cavity 108 expands or contracts, and the functional liquid B corresponding to the reduced volume is ejected as a droplet A from the nozzle 106.

  The laser beam irradiation means 20 is formed by a semiconductor laser array 124, a collimator 126, a diffractive optical element 128, a reflecting mirror 130, and an objective lens 132 provided in a housing 122. The collimator 126 guides the laser beam having a wavelength of 810 nm emitted from the semiconductor laser array 124 to the diffractive optical element 128 as a parallel beam. The diffractive optical element 128 processes the cross-sectional shape of the light beam (the shape irradiated on the surface perpendicular to the light beam) into an arbitrary shape in the light beam direction. The reflecting mirror 130 can adjust the angle with respect to the light beam, and guides the processed light beam to the vicinity of the target position 44 to be landed on the substrate surface. Then, the objective lens 132 condenses the laser light reflected by the reflecting mirror 130 in a region near the target position 44 where it should land.

  The substrate holding means 30 holds the substrate 40 such as glass, and can move the substrate in the plane direction within a predetermined range. A pattern formation region (see FIG. 2) described later is provided almost directly below the nozzle 106. Can be positioned.

  With the configuration described above, the droplet discharge device according to the present embodiment causes the droplet A discharged at any position on the surface of the substrate 40 to land, and at the same time, in a region of any shape around the target position 44 to be landed. Laser light can be irradiated. Then, the spread of the droplet A landed on the region irradiated with the laser beam can be suppressed, and a pattern made of the pattern forming material C can be formed on the surface of the substrate 40 with high accuracy.

  In the pattern formation step, the target position 44 to land and the position where the droplet A actually landed (hereinafter referred to as “landing point”) do not completely coincide with each other, and the target position 44 to land. Centering on the surface of the droplet, and landing within a predetermined range determined by the accuracy of the droplet discharge means. The landed droplet A spreads around the landing point, but there is no mechanism for detecting the landing point, and since the laser beam is irradiated before the droplet reaches, the droplet A should land The laser beam is irradiated assuming that the target position 44 is landed. In FIG. 1, the nozzle 106 that discharges the droplet A is illustrated as one, but in the practice of the present invention, the number of nozzles is not limited to one, and a plurality of nozzles may be used. is there. Further, the wavelength of the laser beam is not limited to 810 nm.

  FIG. 2 shows a pattern forming method by the droplet discharge method of this embodiment, and is a process sectional view when a wiring pattern is formed on the substrate 40 as seen from a direction perpendicular to the wiring. First, as shown in FIG. 2A, irradiation of laser light is started on a region 204 adjacent to a region where a pattern is to be formed (hereinafter referred to as “pattern formation region”) 202. Next, as shown in FIG. 2B, the droplet A of the functional liquid B is ejected from the nozzle 106 aiming at the target position 44 to be landed, which is located on the center line of the pattern formation region 202. The droplet A that has landed in the vicinity of the target position 44 to land begins to spread as shown in FIG. The spread described above reaches the irradiation region 204 as shown in FIG. Then, the laser beam irradiated in the irradiation region 204 interacts with the droplet A, and a part of the solvent (dispersion medium) D in the droplet A starts to vaporize. The flow of the substance is generated in the direction of the arrow due to the gas flow generated by the vaporization and the action of the surface tension accompanying the generation of the temperature gradient. Shrink. Then, as shown in FIG. 2E, the irradiation of the laser beam is stopped when the spread of the droplet A falls within the pattern formation region 202. The droplet A is in a state in which a part of the solvent (dispersion medium) D is vaporized to reduce the entire volume, and the ratio of the pattern forming material C in the droplet A is increased. Finally, as shown in FIG. 2 (f), the solvent (dispersion medium) D is completely removed from the droplet A to form a wiring pattern made of the pattern forming material C on the substrate 40.

  Laser light irradiation can also be used as means for completely removing the solvent (dispersion medium) D from the droplet A.

  FIG. 3 shows the shape of the irradiation region 204 according to the first embodiment and the arrangement of the target position 44 where the droplet A is to be ejected. As described above, this is an example of forming a wiring pattern, and there are irradiation regions 204 on both sides of a pattern forming region 202 extending linearly. A plurality of target positions 44 to be landed are set at substantially equal intervals on the center line 304 of the pattern formation region 202, and the droplets A are sequentially discharged toward the target position 44 to be landed. Then, the droplet A that has landed in the vicinity of the target position 44 to be landed does not protrude to the irradiation region 204 by the above-described mechanism, and remains in the pattern formation region 202 to form a wiring pattern. The direction in which the spread of the droplet A after landing is suppressed is only in the direction perpendicular to the center line 304, and can spread in the direction of the center line 304 in the same manner as in the normal droplet discharge method. Therefore, an accurate wiring pattern can be formed without affecting the wiring film thickness (wiring height).

(Second Embodiment)
FIG. 4 shows the shape of the irradiation region 204 and the ejection position of the droplet A according to the second embodiment of the present invention. The droplet discharge device and the pattern forming method used in this embodiment are the same as those shown in FIGS. 1 and 2 of the first embodiment, and only the shape of the irradiation region 204 is different. The same applies to a third embodiment and a fourth embodiment described later.

  There is an irradiation area 204 on one side of the target positions 44 to be landed in a line. The target positions 44 to be landed are not only in a single line along the irradiation area 204 but also in a plurality of areas on the opposite side of the irradiation area 204 across the single line. The spread of the droplets A that have landed in one row is suppressed in the irradiation region 204, and the droplets A that have landed on other target positions 44 to be landed are spread naturally. Only on one side can the spread of the landed droplet A be suppressed, and the boundary of the end is effective for forming a strict pattern.

(Third embodiment)
FIG. 5 shows the shape of the irradiation region 204 and the discharge position of the droplet A according to the third embodiment of the present invention. The irradiation area 204 is not rectangular but has a frame shape surrounding a plurality of target positions 44 to be landed. Since the spread of the landed droplets is suppressed over the entire circumference, an independent stepping stone-like pattern can be formed. 5 shows an example in which one droplet A is landed in the rectangular frame-shaped irradiation region 204, the shape of the irradiation region 204 is not limited to the quadrangular shape. An arbitrary shape, for example, a circular shape or a pattern having a refracting portion can be formed by selection. It is also possible to set one target position 44 to be landed in one frame-shaped irradiation region 204 without providing a plurality of target positions 44 to land.

(Fourth embodiment)
FIG. 6 shows the shape of the irradiation region 204 according to the fourth embodiment of the present invention and the target position 44 where the droplet A should land. The irradiation region 204 has a double shape that surrounds a plurality of target positions 44 to be landed arranged at substantially equal intervals in the annular pattern formation region 202 from both the inside and the outside. Since the spread droplet A is suppressed from being irradiated with laser light from both the inner side and the outer side, a frame-like pattern having an arbitrary width and shape is formed. Note that, similarly to the third embodiment described above, the shape of the irradiation region 204 is not limited to a square as shown in the figure, and may be other shapes such as a circle.

(Fifth embodiment)
7A to 7D show a pattern forming method according to the fifth embodiment as an example in which a wiring pattern is formed on a substrate. FIG. 3 is a process cross-sectional view seen from a direction perpendicular to the wiring as in FIG. 2. Since the steps shown in FIGS. 2A to 2C are the same as those in the first embodiment until the droplet A ejected on the substrate irradiated with the laser beam starts spreading, the illustration is shown. It is omitted. Accordingly, FIG. 7A shows a state corresponding to FIG. 2D, that is, the target to be landed in the pattern formation region 202 by irradiating the first irradiation region 702 on both sides of the pattern formation region 202 with laser light. In the vicinity of the position 44, the droplet A of the functional liquid B composed of the solvent (dispersion medium) D and the pattern forming material C was landed, and the droplet A started to spread on the substrate approached the first irradiation region 702. State. The solvent (dispersion medium) D in the droplet A starts to vaporize due to the interaction with the laser beam, and the material flow in the direction of the arrow due to the gas flow generated by the vaporization and the surface tension accompanying the generation of the temperature gradient. This is a state in which the spread starts to shrink toward the target position 44 where it should land. This state is maintained for a while until the spread stops even without the irradiation of the laser beam. Here, unlike the irradiation region 204 of the first to fourth embodiments, the first irradiation region 702 is a region that is not adjacent to the pattern formation region 202 and has a slight gap.

  Next, as shown in FIG. 7B, the irradiation region 702 of the first laser beam is moved in a direction approaching the target position 44 to be landed, and the laser is applied to the second irradiation region 704 adjacent to the pattern formation region 202. Let it be irradiated with light. When the droplet A spreading on the substrate partially overlaps with the laser light irradiation region, the evaporation of the solvent (dispersion medium) D resumes and the volume of the droplet A begins to decrease again. The gas flow generated by the vaporization of the solvent (dispersion medium) D and the surface tension accompanying the generation of the temperature gradient cause a material flow in the direction of the arrow, and the shrinkage is again contracted toward the target position 44 where the spread should land. Begin to. Next, as shown in FIG. 7C, when the volume of the droplet A is sufficiently reduced, the laser beam irradiation is stopped. Since the solvent (dispersion medium) D is greatly reduced, the droplet A does not exceed the pattern formation region 202 even if the laser light irradiation region is stopped. Finally, as shown in FIG. 7D, the solvent (dispersion medium) D is completely removed from the droplets A, and a wiring pattern made of the pattern forming material C is formed on the substrate 40.

  According to this embodiment, after the solvent (dispersion medium) D in the droplet A that has landed on the substrate 40 is vaporized to some extent to reduce the volume of the droplet A, the target to be landed on the region irradiated with the laser light By moving toward the position 44, the droplet A that has stopped spreading can be pushed back toward the target position 44 where it should land. Therefore, a pattern with higher accuracy can be formed as compared with a pattern forming method in which a region irradiated with laser light is fixed.

  The main droplets ejected to form the wiring pattern include a dispersion liquid in which conductive fine particles are dispersed in a dispersion medium and a dispersion liquid in which organic silver compounds or silver oxide nanoparticles are dispersed in a solvent. Can be mentioned. As the conductive fine particles, for example, metal fine particles containing any one of gold, silver, copper, palladium and nickel, oxides thereof, and fine particles of conductive polymer are preferable. These conductive fine particles are preferably used with a surface coated with an organic substance or the like in order to improve dispersibility. As the coating agent, for example, organic solvents such as xylene and toluene, citric acid, and the like are preferable.

  The conductive fine particles preferably have a particle size of 1 nm to 100 nm. If it is larger than 100 nm, the nozzle may be clogged. On the other hand, if it is smaller than 1 nm, the volume ratio of the coating agent to the conductive fine particles becomes large, and the ratio of the organic matter in the obtained film becomes excessive.

  The dispersion medium is not particularly limited as long as it can disperse the conductive fine particles and does not cause aggregation. For example, in addition to water, alcohols such as methanol, ethanol, propanol and butanol, n-heptane, n-octane, decane, dodecane, tetradecane, toluene, xylene, cymene, durene, indene, dipentene, tetrahydronaphthalene, deca Hydrocarbon compounds such as hyderonaphthalene and cyclohexylbenzene, ether compounds such as ethylene glycol dimethyl ether, ethylene glycol diethyl ether, and ethylene glycol methyl ethyl ether, as well as propylene carbonate, γ-butyrolactone, and N-methyl-2-pyrrolidone , Polar compounds of dimethylformamide, dimethyl sulfoxide, and cyclohexanone tow can be used. Among these, water, alcohols, hydrocarbon compounds, and ether compounds are preferable, and more preferable solvents are the dispersibility of the fine particles and the stability of the dispersion medium, and the ease of application to the droplet discharge method. There are water and hydrocarbon compounds.

  The surface tension of the dispersion medium of the conductive fine particles is preferably in the range of 0.02 N / m or more and 0.07 N / m or less. When ejecting droplets by the droplet ejection method, if the surface tension is less than 0.02 N / m, the wettability of the ink composition with respect to the nozzle surface increases, and thus flight bending easily occurs, and the surface tension is 0. If it exceeds 0.07 N / m, the shape of the meniscus at the tip of the nozzle is not stable, and it becomes difficult to control the discharge amount and the discharge timing. In order to adjust the surface tension, it is preferable to add a small amount of a surface tension adjusting agent such as a fluorine-based material, a silicone-based material, or a nonionic-based material to the dispersion medium as long as the contact angle with the substrate is not greatly reduced. The nonionic surface tension modifier improves the wettability of the droplets to the substrate and improves the leveling property of the film. The surface tension modifier may contain an organic compound such as alcohol, ether, ester, or ketone, if necessary.

  The viscosity of the droplet is preferably 1 mPa · s or more and 50 mPa · s or less. When a droplet is ejected, if the viscosity is less than 1 mPa · s, the peripheral portion of the nozzle is likely to be contaminated by the outflow of the droplet, and if the viscosity is greater than 50 mPa · s, the frequency of clogging in the nozzle hole is high. It becomes high and it becomes difficult to smoothly discharge droplets.

  As a method for forming the wiring pattern, the dispersion liquid is exemplified as described above as a specific example. However, the present embodiment is not limited to the dispersion liquid but is applied to a solution in which metal ions, metal complexes, conductive polymers, and the like are dissolved. can do.

  In the above-described embodiment, the electromechanical conversion method is described as the means for discharging the droplet A onto the substrate 40. However, the discharge means applicable to the present invention is not limited thereto, and the charging control method, the pressurization method, and the like. A vibration method, an electrothermal conversion method, an electrostatic suction method, or the like is also applicable.

In the charge control method, a charge is applied to a material with a charging electrode, and the flight direction of the material is controlled with a deflection electrode and discharged from a nozzle. In the pressurization vibration method, an ultra-high pressure of about 30 kg / cm ² is applied to the material to discharge the material to the nozzle tip side. In the electrothermal conversion method, bubbles are generated by rapidly heating the material with a heater provided in the space in which the material is stored, and the material in the space is discharged by the pressure of the bubble. In the electrostatic attraction method, a minute pressure is applied to the space in which the material is stored to form a meniscus of the material on the nozzle, and the material is pulled out after an electrostatic attractive force is applied in this state.

(Modification 1)
In each of the above-described embodiments, a droplet in which a pattern forming material is dispersed is ejected on a substantially flat substrate, and a region where a pattern is to be formed is not physically determined. However, the pattern forming method according to the present invention is not limited thereto, and can also be applied to a case where a pattern is formed by a droplet discharge method in a region surrounded by a partition wall.

8A to 8E show schematic process cross-sectional views of the pattern forming method according to this modification. First, as shown in FIG. 8A, a partition wall material layer 802 is formed on the substrate 40. Next, as shown in FIG. 8B, a part of the partition material layer 802 is selectively removed to form a partition 804 that surrounds the pattern formation region 202. Next, as shown in FIG. 8C, the upper surface of the partition 804 is irradiated with laser light. Next, as shown in FIG. 8D, the pattern forming material C and the solvent are placed at the target position 44 to be landed in the pattern forming region 202 surrounded by the partition wall 804 whose upper surface is continuously irradiated with the laser beam. A droplet A of a functional liquid composed of (dispersion medium) D is discharged. Since the upper surface of the partition wall 804 is irradiated with laser light, even when the droplet A reaches the upper surface of the partition wall 804, a force to return into the pattern formation region 202 is exerted by interaction with the laser light. Accordingly, the landed droplet A remains in the pattern formation region 202 and does not protrude outside the partition wall 804 or on the top surface of the partition wall 804. After the droplet A has landed on the pattern formation region 202 and a little time has passed, the irradiation of the laser beam is stopped. Then, as shown in FIG. 8E, the solvent (dispersion medium) D in the droplet A is removed, and a functional layer made of the pattern forming material C is formed in the pattern forming region 202.
According to this modification, the functional liquid can be prevented from leaking to the outside of the partition wall 804 without performing water repellency processing on the upper surface of the partition wall 804, and the functional layer is formed in the region surrounded by the partition wall 804. Productivity can be improved.

(Modification 2)
In each of the embodiments described above, droplets having a pattern forming material as a solute are ejected, and the pattern is formed with high accuracy by suppressing the spread by laser light irradiation. However, the pattern forming method according to the present invention is not limited thereto, and a mask is formed by discharging droplets of a mask forming material and a solvent onto a substrate on which a pattern forming material layer is formed on the entire surface. The present invention can also be applied to the case where a pattern is formed by removing a region of the forming material layer that is not covered with a mask by etching.

  9A to 9E show schematic process cross-sectional views of the pattern forming method according to this modification. First, as shown in FIG. 9A, a pattern forming material layer 902 is formed on the entire surface of the substrate 40. Next, as shown in FIG. 9B, the periphery of the pattern formation region 202 in the pattern formation material layer 902 is irradiated with laser light. Next, as shown in FIG. 9C, a droplet A composed of a mask material E and a solvent (dispersion medium) D should be landed in the pattern formation region 202 while maintaining the laser light irradiation. Discharge to the target position 44. Since the ejected droplet A does not protrude to the laser light irradiation region 204 by the mechanism shown in FIG. 2 of the above-described embodiment, only the pattern formation region 202 is made of the mask material E as shown in FIG. A mask pattern 904 can be formed. At this point, the laser beam irradiation is stopped. Finally, as shown in FIG. 9E, the portion of the pattern forming material layer 902 that is not covered with the mask pattern 904 is removed by etching, and then the mask pattern 904 is also removed to form a pattern 906 on the substrate 40. Can be formed.

  According to this modification, the present invention is not directly applied to the formation of a target pattern, but is difficult to be ejected as droplets by being applied to the formation of a pattern serving as a mask during etching. The present invention can also be applied to the formation of patterns made of various materials, and a highly accurate pattern can be formed at a lower cost than photolithography.

(Modification 3)
In the above-described embodiment, the droplet discharge apparatus having one nozzle for discharging droplets is illustrated in FIG. 1 as a schematic diagram, but the number of nozzles is not limited to one. A droplet discharge apparatus having a droplet discharge means provided with a plurality of nozzles is also applicable to the present invention. Since a plurality of droplets can be discharged at the same time, it is suitable for forming an elongated pattern such as a wiring or a pattern having a large area.

(Modification 4)
In the above-described embodiment, the droplet discharge device having one laser beam irradiation unit is shown as a schematic diagram, but a droplet discharge device having a plurality of laser beam irradiation units is also applicable to the present invention. If there are two laser light irradiation means, it is possible to irradiate laser light from both sides of the target position 44 to be landed, so that a complicated irradiation region can be easily set. In addition, laser light for vaporizing the solvent (dispersion medium) D can be irradiated separately from the laser light for suppressing the spread of the droplets, so that it is not necessary to separately perform a drying step, and productivity can be improved.

(Modification 5)
In the above-described embodiment, the diffractive optical element provided in the laser light irradiation means in FIG. 1 is illustrated as a schematic diagram of a single droplet discharge device, but a plurality of diffractive optical elements are provided on the surface. It is also possible to use a disk on a disk. Since the diffractive optical element of each pattern can be easily switched, the production efficiency is improved.

(Modification 6)
In the embodiment and the modification described above, the region 202 where the pattern is to be formed is in contact with the irradiation region 204 or the second irradiation region 704. The outer periphery of the formed pattern is determined by laser light irradiation at a stage before the solvent (dispersion medium) D is completely removed. However, the pattern forming method according to the present invention does not exclude the irradiation with laser light even after the solvent (dispersion medium) D is completely removed. After the solvent (dispersion medium) D is completely removed and the pattern made of the pattern forming material C is formed, the pattern forming material C may be partially removed by irradiating the edge portion of the pattern with laser light. It is contained in the pattern formation method of this invention. Since the edge portion of the pattern formed by suppressing the spread of the discharged droplet A can be further shaped after drying, a pattern with higher accuracy can be formed.

1 is a schematic cross-sectional view of a droplet discharge device according to a first embodiment. FIG. 3 is a schematic process cross-sectional view of the pattern forming method according to the first embodiment. The figure which shows the irradiation position 204 and the target position 44 which should land in 1st Embodiment. The figure which shows the irradiation position 204 and the target position 44 which should land in 2nd Embodiment. The figure which shows the irradiation position 204 and the target position 44 which should land in 3rd Embodiment. The figure which shows the irradiation position 204 and the target position 44 which should land in 4th Embodiment. Process sectional drawing of the pattern formation method of 5th Embodiment. FIG. 10 is a schematic process cross-sectional view of a pattern forming method according to Modification 1; FIG. 10 is a schematic process cross-sectional view of a pattern forming method according to Modification 2.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Droplet discharge means, 20 ... Laser beam irradiation means, 30 ... Substrate holding means, 40 ... Substrate, 44 ... Target position to land, 102 ... Nozzle plate, 104 ... Vibrating plate, 106 ... Nozzle, 108 ... Pressure chamber Cavity, 110 ... Communication hole, 112 ... Supply path, 114 ... Piezo element, 122 ... Case, 124 ... Semiconductor laser array, 126 ... Collimator, 128 ... Diffraction optical element, 130 ... Reflective mirror, 132 ... Objective lens, 202 ... Pattern formation region, 204 ... Irradiation region, 304 ... Center line, 702 ... First irradiation region, 704 ... Second irradiation region, 802 ... Partition wall material layer, 804 ... Partition wall, 902 ... Pattern formation material layer, 904 ... mask pattern, 906 ... pattern, A ... droplet, B ... functional liquid, C ... pattern forming material, D ... solvent (dispersion medium), E ... mask material.

Claims (12)

A first step of discharging droplets made of a functional liquid having a material for forming a pattern on a substrate into a first region on which the pattern is to be formed;
A second step of changing the state of the droplets landed on the substrate to form a pattern on the substrate;
A third step of irradiating the third region excluding the first region from the second region where the droplets that have landed on the substrate spread wet or the peripheral region including the second region. And a pattern forming method comprising:   The pattern forming method according to claim 1, wherein the first step is performed during the execution of the third step.   The said 3rd process irradiates the said laser beam so that the said 3rd area | region may face across the position where the said droplet lands on the said base | substrate, The 1st or 2 characterized by the above-mentioned. Pattern forming method.   The pattern forming method according to claim 1, wherein the third step changes the irradiation intensity of the laser light in accordance with a change in the state of the droplet. . In the first step, the droplets are ejected discontinuously at intervals on the substrate.
5. The method according to claim 1, wherein in the third step, the third region is continuously moved in accordance with a position at which the liquid droplets land. 6. Pattern forming method.   The pattern forming method according to claim 1, wherein the third step irradiates a region surrounding the periphery of the discharged droplet with the laser beam. . A first step of discharging a droplet made of a functional liquid having a material for forming a pattern into a first region on which a pattern is to be formed on a substrate on which the droplet is to be discharged;
A second step of irradiating a laser beam to a region that does not overlap with the first region;
Changing the state of the droplet landed in the first region to form a pattern on the substrate;
The laser beam is applied to the third region, which is a second region where the droplet landed on the substrate spreads out or the peripheral region including the second region is excluded from the first region. And a fourth step of changing the shape of the region irradiated with the laser light.   The pattern forming method according to claim 7, wherein the first step is performed during the execution of the second step.   The pattern forming method according to claim 7, wherein the second step irradiates the laser beam so that a region irradiated with the laser beam does not overlap the second region. .   The pattern forming method according to claim 1, wherein the state of the droplet is changed by irradiating the droplet with the laser beam. Droplet discharge means capable of discharging droplets made of a functional liquid having a material for forming a pattern into a region where a pattern of a substrate on which the droplets are to be discharged is to be formed;
Holding means for holding an object to which the droplets are to be discharged;
And a laser beam irradiation unit capable of irradiating a laser beam to an arbitrary region of the substrate. The liquid droplet ejection apparatus according to claim 11, wherein the laser light irradiation unit includes at least a light source that generates laser light and a diffractive optical element that diffracts the laser light.

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