JP2007141808A - Laser thermal transfer method and organic light emitting device manufacturing method using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a laser heat transfer method that has enabled to laminate effectively by magnetic force when a donor film and an acceptor substrate are laminated by the laser transfer method, and a manufacturing method of an organic light emitting element utilizing this. <P>SOLUTION: The transfer method comprises a step in which an acceptor substrate on at least one side of which a magnetic body is formed is located on a substrate stage in a process chamber, a step in which a donor film including an electromagnet is located on the acceptor substrate, a step in which the donor film and the acceptor substrate are laminated by a magnetic force acting between the electromagnet formed on the donor film and the magnetic body of the acceptor substrate, and a step in which at least one region of the transfer layer is transferred on the acceptor substrate by irradiating laser on the donor film. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a laser thermal transfer method and an organic light emitting device manufacturing method using the same, and more specifically, when an organic film layer is formed on an acceptor substrate using a laser thermal transfer method, a donor film is generated by magnetic force. The present invention relates to a laser thermal transfer method capable of laminating an acceptor substrate and an organic light emitting device manufacturing method using the same.

  Among the methods for forming organic film layers of organic light-emitting devices, the vapor deposition method is a method of forming an organic film layer by vacuum-depositing an organic light-emitting substance using a shadow mask. It is difficult to form and difficult to apply to large area display devices.

  In order to solve the problems of the vapor deposition method, an ink jet method for directly patterning an organic film layer has been proposed. The ink jet method is a method in which a light emitting material is dissolved or dispersed in a solvent and discharged from a head of an ink jet printing apparatus as a discharge liquid to form an organic film layer. The inkjet method is relatively simple in process, but has a problem in that it is difficult to apply to a large-area display device due to a decrease in yield and non-uniformity in film thickness.

  On the other hand, a method of forming an organic film layer using a laser thermal transfer method has been proposed. In the laser thermal transfer method, a donor film including a base substrate, a light-heat conversion layer, and a transfer layer is irradiated with a laser, and the laser that has passed through the base substrate is converted from the light-heat conversion layer to heat to perform light-heat conversion. In this method, the adjacent transfer layer is expanded by expanding the layer, and the transfer layer is bonded to the acceptor substrate for transfer.

  The laser thermal transfer method is a laser guided imaging process and has inherent advantages such as high resolution patterning, film thickness uniformity, multi-layer stacking capability, and scalability to large mother glass.

  When performing the conventional laser thermal transfer method, it is preferable that the interior of the chamber where the light emitting layer is transferred is in a vacuum state in order to be synchronized with other vapor deposition processes when forming the light emitting display element. However, when laser thermal transfer is performed in a vacuum state by a conventional method, there is a problem in that the transfer force of the transfer layer is deteriorated because the bonding force between the donor film and the acceptor substrate is weakened. Therefore, in the laser thermal transfer method, the method of laminating the donor film and the acceptor substrate has an important meaning, and various methods for solving this have been studied.

Hereinafter, a conventional laser thermal transfer method and laser thermal transfer apparatus will be described in detail with reference to the drawings.
FIG. 1 is a partial sectional view of a conventional laser thermal transfer apparatus.
Referring to FIG. 1, the laser thermal transfer apparatus 100 includes a substrate stage 120 positioned inside the chamber 110 and a laser irradiation apparatus 130 positioned above the chamber 110.

  The substrate stage 120 is for sequentially positioning the acceptor substrate 140 and the donor film 150 introduced in the chamber 110, and the substrate stage 120 is for aligning the acceptor substrate 140 and the donor film 150, respectively. A first mounting home 121 and a second mounting home 123 are formed.

  The first mounting home 121 is formed along the circumferential direction of the acceptor substrate 140, and the second mounting home 123 is formed along the circumferential direction of the donor film 150. Normally, since the acceptor substrate 140 has a smaller area than the donor film 150, the first mounting home 121 is formed smaller than the second mounting home 123.

  At this time, the interior of the chamber 110 in which laser thermal transfer is performed is not maintained in a vacuum in order to allow lamination between the acceptor substrate 140 and the donor film 150 without any foreign matter or space. The pipes 161 and 163 are connected to one lower section, and the acceptor substrate 140 and the donor film 150 are bonded together by sucking with the vacuum pump P.

  However, the method of bringing the acceptor substrate and the donor film into close contact with each other by a vacuum pump makes it impossible to maintain the vacuum state inside the chamber unlike other processes for manufacturing the organic light emitting device that maintain the vacuum state. There is a problem of adversely affecting the reliability and life of the product.

On the other hand, the following Patent Documents 1 to 3 and the like are described as techniques related to the conventional laser thermal conversion method and a method for manufacturing an organic light-emitting element using the same.
JP 2004-296224 A JP 2004-355949 A US Patent Application Publication No. 4,377,339

  Therefore, the present invention is an invention devised to solve the above-mentioned conventional problems, and the purpose thereof is that there is no foreign matter or space between the donor film and the acceptor substrate while laser thermal transfer is performed in a vacuum state. A laser thermal transfer method of laminating a donor film and an acceptor substrate by magnetic force and an organic light emitting device manufacturing method using the same.

  To achieve the above object, a laser thermal transfer method according to the present invention includes a step of positioning an acceptor substrate having a magnetic material formed on at least one surface on a substrate stage in a process chamber, and a donor including an electromagnet on the acceptor substrate. Positioning the film; laminating the donor film and the acceptor substrate by a magnetic force acting between an electromagnet formed on the donor film and a magnetic body of the acceptor substrate; and a laser on the donor film Irradiating to transfer at least one region of the transfer layer onto the acceptor substrate.

  Preferably, the donor film includes at least one of a base substrate, a light-heat conversion layer formed on the base substrate, a transfer layer formed on the light-heat conversion layer, and the light-heat conversion layer. It includes an electromagnet formed on any one surface.

  An intercalation layer is further provided between the light-heat conversion layer and the transfer layer, and the electromagnet is formed in at least one rod or cylinder inside the base substrate or the light-heat conversion layer. The electromagnet includes electrical wiring for applying a voltage.

The magnetic body is any one selected from the group consisting of Fe, Ni, Cr, Fe ₂ O ₃ , Fe ₃ O ₄ , CoFe ₂ O ₄ , magnetic nanoparticles, and a mixture thereof, Magnetic nanoparticles are formed using spin coating, electron beam evaporation (E-Beam evaporation), or ink jet methods.

  The process chamber includes a drive power supply outer region formed on the acceptor substrate and a magnetic force supporting metal line formed on at least one of the regions other than the pixel region of the image display unit. Is a vacuum chamber.

  In addition, in the method of manufacturing an organic light emitting device in which a light emitting layer is formed between the first electrode and the second electrode by the laser thermal transfer method according to the present invention, an acceptor substrate including a magnetic material in which a pixel region is formed on a substrate stage. An acceptor substrate transfer step of positioning the donor film, a donor film transfer step of transferring a donor film including an electromagnet on the acceptor substrate and including a light emitting layer, and the magnetic material formed on the acceptor substrate and the donor film A lamination step of bonding the acceptor substrate and the donor film by a magnetic force between the electromagnets and a transfer step of irradiating the donor film with a laser to transfer the light emitting layer to the pixel region of the acceptor substrate. Including.

  As described above, according to the present invention, when the donor film and the acceptor substrate are laminated by the laser thermal transfer method, foreign matter and space are not generated between the donor film and the acceptor substrate while the laser thermal transfer is performed in a vacuum state. At the same time, by laminating the donor film and the acceptor substrate by the magnetic force generated between the electromagnet formed on the donor film and the magnetic material formed on the acceptor substrate, the adhesion, the lifetime of the organic light emitting device, the yield and Reliability can be increased.

Hereinafter, a laser thermal transfer method according to the present invention and an organic light emitting device manufacturing method using the same will be described in detail with reference to the drawings illustrating embodiments of the present invention.
An embodiment of the laser thermal transfer method according to the present invention will be described with reference to FIGS. 2a to 2h. The laser thermal transfer apparatus that proceeds with the laser thermal transfer method according to the present invention includes process chambers 200a and 200b, a substrate stage 220, and a laser oscillator 210.

  As the chamber, a process chamber 200a used in an ordinary laser thermal transfer apparatus can be used, and a donor film 280 including an electromagnet (not shown) or an acceptor substrate 270 including a magnetic body 271 is provided outside the process chamber 200a. A transfer chamber 200b including a robot arm 260 and an end-effector 261 for transferring to the inside is provided. A gate valve 250 exists between the process chamber 200a and the transfer chamber 200b. The gate valve 250 serves to shut off the process chamber 200a and the transfer chamber 200b.

  Meanwhile, the substrate stage 220 may further include driving means (not shown) for moving. For example, when the laser is irradiated in the vertically long direction, a driving unit that moves the substrate stage 220 in the horizontally long direction can be further provided.

  In addition, the substrate stage 220 can include respective mounting means for receiving and mounting the acceptor substrate 270 and the donor film 280. The mounting means ensures that the acceptor substrate 270 transferred into the process chamber 200a by the transfer means such as the robot arm 260 and the end effector 261 in the transfer chamber 200b is accurately mounted at a predetermined position on the substrate stage 220. .

  In this embodiment, the mounting means may include a through hole (not shown), guide bars 231 and 241, moving plates 230 and 240, a support base (not shown), and mounting homes 221 and 222. At this time, the guide bars 231 and 241 move up or down along with the moving plates 230 and 240 and the support, but the guide bars 231 and 241 receive the acceptor substrate 270 while moving up through the through holes, In this structure, the acceptor substrate 270 is seated on the mounting homes 221 and 222 while descending. At this time, it is preferable that wall surfaces of the mounting homes 221 and 222 are formed obliquely in order to secure the acceptor substrate 270 and the donor film 280 at accurate positions.

  The through holes are holes formed in the substrate stage 220 so that the guide bars 231 and 241 that support the donor film 280 and the acceptor substrate 270 can move up and down. The support base serves to support the guide bars 231 and 241 and the moving plates 230 and 240 so as to be movable up and down, and is connected to a separate motor (not shown).

  The laser oscillator 210 may be installed outside or inside the process chamber 200a, and is preferably installed so that the laser can be illuminated from above.

In this embodiment, the laser thermal transfer method applied to manufacture an organic light emitting device includes an acceptor substrate 270 transfer step, a donor film 280 transfer step, a lamination step, and a transfer step.
The acceptor substrate 270 transfer step is a step of positioning the acceptor substrate 200a in the process chamber 200a of the laser thermal transfer apparatus. At this time, the acceptor substrate 270 including the magnetic body 271 is placed on the end effector 261 as transfer means of the transfer chamber 200a. Position (Figure 2a).

  Then, the end effector 261 is advanced into the process chamber 200a by the robot arm 260 and positioned on the substrate stage 220 (FIG. 2b).

  The acceptor substrate 270 transferred into the process chamber 200a is supported by the guide bar 231 raised through the through hole. Thereafter, the end effector 261 exits the process chamber 200a and moves to the transfer chamber 200b again (FIG. 2c).

  The guide bar 231 supporting the acceptor substrate 270 accurately positions the acceptor substrate 270 on the first mounting home 222 of the substrate stage 220 while lowering again (FIG. 2d).

  The donor film 280 transfer step, like the acceptor substrate 270 transfer step, is transferred into the process chamber 200a by transfer means such as an end effector 261 attached to a robot arm 260 located in the transfer chamber 200b (FIG. 2e). .

  At this time, the donor film 280 is preferably transferred by the film tray 290 at the time of transfer. The donor film 280 transferred into the process chamber 200a is supported by the guide bar 241 raised through the through hole. When the donor film 280 is supported by the guide bar 241, the end effector 261 moves out of the process chamber 200 a and moves to the transfer chamber 200 b again by the robot arm 260 (FIG. 2 f).

  The guide bar 241 supporting the donor film 280 is lowered again to accurately position the donor film 280 on the second mounting home 221 of the substrate stage 220 (FIG. 2g).

  In the lamination step, electric power is applied to the magnetic material 271 formed on the acceptor substrate 270 and the electric wiring formed on the electromagnet (not shown) formed on the donor film 280 to thereby apply the acceptor substrate 270 and the donor film. In this step, the acceptor substrate 270 and the donor film 280 are bonded together by a magnetic attractive force formed between them.

  The electromagnet is formed in at least one rod or cylinder inside the base substrate or the light-heat conversion layer. At this time, since the inside of the process chamber 200a is maintained in a vacuum state, the generation of foreign matters and spaces between the donor film 280 and the acceptor substrate 270 is minimized, and the transfer efficiency is increased.

  In the transfer step, the light emitting layer formed on the donor film 280 is irradiated on the donor film 280 laminated with the acceptor substrate 270 by the laser irradiation device 210 to the region and the opening of the pixel defining film of the acceptor substrate 270. This is the stage of transcription. When laser irradiation is performed, the light-to-heat conversion layer of the donor film 280 swells, so that the adjacent luminescent layer also swells in the direction of the acceptor substrate 270 so that the luminescent layer contacts the acceptor substrate 270. As a result, transcription is performed (FIG. 2h).

Hereinafter, a laser thermal transfer donor film including an electromagnet according to the present invention will be described.
The donor film is a film including a transfer layer transferred to an acceptor substrate, and includes a base substrate, a light-heat conversion layer, and a transfer layer that are sequentially stacked. At this time, a buffer layer (not shown) and an interlayer insertion layer may be further included between the light-heat conversion layer and the transfer layer to improve performance.

  The laser thermal transfer donor film according to the present invention includes an electromagnet. In this case, at least one electromagnet is formed between many layers constituting the donor film.

FIG. 3 is a cross-sectional view showing a first embodiment of a donor film for laser transfer according to the present invention.
Referring to FIG. 3, the donor film includes a base substrate 310, a light-heat conversion layer 320, an electromagnet 330, an interlayer insertion layer 340, and a transfer layer 350.

  The base substrate 310 is a substrate that serves as a support for the donor film, is made of a transparent polymer, and preferably has a thickness of 10 μm to 500 μm. At this time, polyester, polyacryl, polyepoxy, polyethylene, polystyrene, or the like can be used as the transparent polymer, but is not limited thereto.

  The light-heat conversion layer 320 is a layer made of a light-absorbing material that absorbs laser light and converts it into heat. The thickness of the light-heat conversion layer 320 varies depending on the light-absorbing material used and the forming method. In the case of being made of metal or metal oxide, etc., it is formed in a thickness of 100 to 5000 by vacuum deposition, electron beam deposition or sputtering, and in the case of being formed in an organic film, it is expressed by extruding, gravure, spin, It is preferable that the thickness is 0.1 μm to 2 μm by a knife coating method.

  When the thickness of the light-heat conversion layer 320 is formed to be thinner than the above range, the energy absorption rate is low, the amount of energy converted into light is reduced, and the expansion pressure is reduced. In the case of being formed thick, a bad edge open may occur due to a step generated between the donor film and the acceptor substrate.

  The light-absorbing substance made of metal or metal oxide has an optical density of 0.1 to 0.4, and aluminum, silver, chromium, tungsten, tin, nickel, titanium, cobalt, zinc, gold, Examples include copper, molybdenum, lead, and oxides thereof.

  In addition, as a photosynthesis material made of an organic film, there is a polymer to which carbon black, graphite, or infrared dye is added. At this time, the substances forming the polymer-bound resin include, for example, acrylic (meth) acrylate oligomers, ester (meth) acrylate oligomers, epoxy (meth) acrylate oligomers, urethane (meth) acrylate oligomers, etc. There are, but are not limited to, acrylate oligomers, or mixtures of said oligomeric (meth) acrylate monomers.

  The magnet 330 is a layer that is inserted to form a magnetic force with a magnetic body that is inserted into an acceptor substrate, which will be described later.

  Although not shown in the drawing, the buffer layer is a layer introduced between the magnet 330 and the transfer layer 350 in order to improve the transfer characteristics of the transfer layer and to improve the device life after transfer. Or a non-metallic inorganic compound or a high molecular or low molecular organic substance can be used.

  The intermediate insertion layer 340 is for protecting the light-heat conversion layer 320 and preferably has a high thermal resistance, and may be composed of an organic or inorganic film.

  The transfer layer 350 is a layer that is separated from the donor film and transferred to the acceptor substrate. When the transfer layer 350 is used for manufacturing an organic light emitting device, the transfer layer 350 is made of a polymer or a low molecular organic light emitting material to form the light emitting layer. Can do. Further, in order to form the electron transport layer ETL, the electron injection layer EIL, the hole transport layer HTL, and the hole injection layer HIL, they can be made of materials suitable for each. At this time, the material of each transfer layer is not limited, and any material that can be easily pursued by those skilled in the art is possible, and can be formed by methods such as extrusion, gravure, spin, knife coating, vacuum deposition, and CVD. .

  As described above, when the magnet 330 is inserted into the donor film, the donor film becomes magnetic and forms a mutual magnetic attraction with the acceptor substrate into which the magnetic material is inserted when positioned above the acceptor substrate. To do. Therefore, the donor film and the acceptor substrate are brought into close contact by magnetic force.

  FIG. 4 is a sectional view showing a second embodiment of the donor film for laser transfer according to the present invention. Referring to FIG. 4, unlike the case where the electromagnet 330 is formed between the light-heat conversion layer 320 and the interlayer insertion layer 340 in FIG. 3, between the base substrate 410 and the light-heat conversion layer 430. An electromagnet 420 is formed. Since the function of each layer is the same as in FIG. 3, detailed description thereof will be omitted.

FIG. 5 is a sectional view showing a first embodiment of an acceptor substrate according to the present invention.
The structure on the acceptor substrate will be described with reference to FIG. 5. A buffer layer 502 is formed on the substrate 500, and the magnetic body 501 is formed on the other surface of the substrate 500 opposite to the surface on which the buffer layer 502 is formed. A containing layer is formed.

The magnetic body 501 is any one selected from the group consisting of Fe, Ni, Cr, Fe ₂ O ₃ , Fe ₃ O ₄ , CoFe ₂ O ₄ , magnetic nanoparticles, and a mixture thereof. Among these, the magnetic nanoparticles are formed using spin coating, E-Beam deposition, or an inkjet method.

  A semiconductor layer including an LDD layer (not shown) is formed between the active channel layer 503a and the ohmic contact layer 503b on a region of the buffer layer 502. A gate insulating layer 504 and a gate electrode 505 are sequentially formed on the semiconductor layer. An interlayer insulating film 506 formed on the gate electrode 505 so that the ohmic contact layer 503b is exposed in the semiconductor layer, and a source and drain electrode so as to be in contact with the exposed ohmic contact layer 503b. 507a and 507b are formed on a region of the interlayer insulating film 506.

  Also, a planarization film 508 is formed on the interlayer insulating film 506, and a via hole (on the planarization film 508 is formed so that the drain electrode 507b is exposed by etching a region of the planarization film 508. The drain electrode 507b and the first electrode layer 509 are electrically connected through a not-shown). The first electrode layer 509 is formed in a region of the planarization film 508, and a pixel defining film in which an opening 511 for exposing the first electrode layer 509 at least partially is formed on the planarization film 508. 510 is formed.

6 and 7 are cross-sectional views showing other embodiments of the acceptor substrate according to the present invention, and a description of the same configuration as that in FIG. 5 is omitted.
FIG. 6 is a sectional view showing a second embodiment of the acceptor substrate according to the present invention. FIG. 6 illustrates one selected from the group consisting of Fe, Ni, Cr, Fe ₂ O ₃ , Fe ₃ O ₄ , CoFe ₂ O ₄ , magnetic nanoparticles, and a mixture thereof between the substrate 600 and the buffer layer 602. A single magnetic body 801 is formed.

  FIG. 7 is a sectional view showing a third embodiment of the acceptor substrate according to the present invention. Referring to FIG. 7, an image display unit 760 including at least one pixel region 770, a scan driving unit 740, a data driving unit 730, a driving power source 710, and a base power source 720 are formed on the acceptor substrate 700. .

A magnetic force supporting metal line 750 is formed on at least one of the outer area of the drive power source 710 formed on the acceptor substrate 700 and the area other than the pixel area 770 of the image display unit 760. The magnetic support metal line 750 is a magnetic body, and the magnetic body is selected from the group consisting of Fe, Ni, Cr, Fe ₂ O ₃ , Fe ₃ O ₄ , CoFe ₂ O ₄ , magnetic nanoparticles, and a mixture thereof. One of them.

  The scan driver 740 controls a selection signal for driving an organic light emitting element (not shown) in each pixel region 770, and supplies the controlled selection signal to the scanning line. The selection signal is transmitted to a switching element (not shown) in each pixel region 770 through the scanning line, so that the switching element is turned on or turned on.

  The data driver 730 controls the data voltage or current indicating the image signal of each pixel region 770 and serves to supply the controlled data voltage or current to each data line.

8a to 8e are cross-sectional views illustrating a method for manufacturing an organic light emitting device according to the present invention.
As shown in FIG. 8a, when a light emitting layer is formed by the laser thermal transfer method according to the present invention, first, an acceptor substrate including a magnetic body 801 is prepared.

  As described above, in the acceptor substrate, a thin film transistor is formed on the substrate 800, and a magnetic body 801 is formed on the other surface of the substrate 800 facing the thin film transistor. The magnetic body 801 may be formed of nanoparticles, and may be formed using spin coating, E-Beam deposition, or an inkjet method. A pixel defining layer 811 having an opening 810 exposing at least one region of the first electrode layer 809 and the first electrode layer 809 is formed on the thin film transistor.

  Thereafter, as shown in FIG. 8b, a donor film 820 is laminated on the acceptor substrate. The better the adhesion characteristics between the donor film 820 and the substrate, the better the transfer efficiency in the subsequent transfer process. Therefore, the adhesion characteristics are improved by the magnetic force acting between the electromagnet 822 of the donor film 820 and the magnetic body 801 of the acceptor substrate. .

  The donor film 820 according to the embodiment of the present invention includes a base substrate 821, an electromagnet 822, a light-heat conversion layer 823, an interlayer insertion layer 824, and a transfer layer 825. The donor film 820 may include an electromagnet. Of course, other structures may be applied.

  Thereafter, as shown in FIG. 8c, in a state where the acceptor substrate and the donor film 820 are laminated, only the region where the light emitting layer 825 is transferred from the donor film 820 is locally irradiated with the laser. When the laser is irradiated, the light-heat conversion layer 823 expands in the direction of the acceptor substrate, so that the transfer layer 825 is also expanded, and the transfer layer 825 in the region irradiated with the laser is separated from the donor film 820 while accepting the acceptor substrate. Is transcribed.

  Then, as shown in FIG. 8d, when the transfer layer 825b is transferred onto the acceptor substrate, the donor film 820 and the acceptor substrate are separated. On the separated acceptor substrate, a transfer layer 825b is formed in at least one region and opening of the pixel defining film 811. Only the transfer layer 825b in the region irradiated with the laser is transferred onto the donor film 820. The remaining portion 825a is left on the donor film 820 as it is.

  Finally, as shown in FIG. 8e, after the transfer layer 825b is transferred onto the acceptor substrate, a second electrode layer 832 is formed on the light emitting layer 825b, which is the transfer layer, and sealed to protect the organic light emitting device. A stop film 830 is formed. An absorbing member 831 is formed on the inner surface of the sealing film 830, and the absorbing member 831 serves to absorb moisture and the like that permeate the organic light emitting device. Accordingly, the light emitting layer 825b of the organic light emitting device can be prevented from being damaged or corroded by moisture or the like.

  In the above embodiment, it has been described that the magnetic material is formed in the lower portion of the acceptor substrate. However, it is needless to say that the magnetic material may be formed in the upper portion of the acceptor substrate.

  The present invention has been described in detail with reference to the accompanying drawings. However, the present invention is only illustrative, and various modifications and other equivalent implementations may be made by those having ordinary skill in the art. It can be understood that the form is possible.

It is a fragmentary sectional view of the laser thermal transfer apparatus by a prior art. It is sectional drawing according to the step of the process for demonstrating the laser thermal transfer method by one side of this invention. It is sectional drawing according to the step of the process for demonstrating the laser thermal transfer method by one side of this invention. It is sectional drawing according to the step of the process for demonstrating the laser thermal transfer method by one side of this invention. It is sectional drawing according to the step of the process for demonstrating the laser thermal transfer method by one side of this invention. It is sectional drawing according to the step of the process for demonstrating the laser thermal transfer method by one side of this invention. It is sectional drawing according to the step of the process for demonstrating the laser thermal transfer method by one side of this invention. It is sectional drawing according to the step of the process for demonstrating the laser thermal transfer method by one side of this invention. It is sectional drawing according to the step of the process for demonstrating the laser thermal transfer method by one side of this invention. It is sectional drawing which showed 1st Example of the donor film for laser transfer by this invention. It is sectional drawing which showed 2nd Example of the donor film for laser transfer by this invention. It is sectional drawing which showed 1st Example of the acceptor board | substrate by this invention. It is sectional drawing which showed 2nd Example of the acceptor board | substrate by this invention. It is sectional drawing which showed 3rd Example of the acceptor board | substrate by this invention. It is sectional drawing for demonstrating the manufacturing method of the organic light emitting element by the other side of this invention. It is sectional drawing for demonstrating the manufacturing method of the organic light emitting element by the other side of this invention. It is sectional drawing for demonstrating the manufacturing method of the organic light emitting element by the other side of this invention. It is sectional drawing for demonstrating the manufacturing method of the organic light emitting element by the other side of this invention. It is sectional drawing for demonstrating the manufacturing method of the organic light emitting element by the other side of this invention.

Explanation of symbols

200a: process chamber 200b: transfer chamber 222: first mounting home 221: second mounting home 270: acceptor substrate 271: magnetic body 280, 820: donor film 330, 420: electromagnet

Claims (10)

Positioning an acceptor substrate having a magnetic material formed on at least one surface on a substrate stage in a process chamber;
Positioning a donor film comprising an electromagnet on the acceptor substrate;
Laminating the donor film and the acceptor substrate by a magnetic force acting between an electromagnet formed on the donor film and a magnetic body of the acceptor substrate;
Irradiating the donor film with a laser to transfer at least one region of the transfer layer onto the acceptor substrate;
A laser thermal transfer method comprising: The donor film is
A base substrate;
A light-to-heat conversion layer formed on the base substrate;
A transfer layer formed on the light-heat conversion layer;
2. The laser thermal transfer method according to claim 1, further comprising an electromagnet formed on at least one surface of the light-heat conversion layer.   3. The laser thermal transfer method according to claim 2, further comprising an interlayer insertion layer between the light-heat conversion layer and the transfer layer.   2. The laser thermal transfer method according to claim 1, wherein the electromagnet is formed in at least one rod or cylinder in a base substrate or a light-heat conversion layer. The electromagnet
The laser thermal transfer method according to claim 1, further comprising an electrical wiring for applying a voltage. The magnetic body is
_{2. The} composition according to claim 1, which is any one selected from the group consisting of Fe, Ni, Cr, Fe ₂ O ₃ , Fe ₃ O ₄ , CoFe ₂ O ₄ , magnetic nanoparticles, and a mixture thereof. Laser thermal transfer method. The magnetic nanoparticles are:
7. The laser thermal transfer method according to claim 6, wherein the laser thermal transfer method is formed by using spin coating, electron beam evaporation, or an ink jet method. A drive power supply outer region formed on the acceptor substrate;
2. The laser thermal transfer method according to claim 1, further comprising a magnetic support metal line formed on at least one of the areas other than the pixel area of the image display unit. The process chamber includes
The laser thermal transfer method according to claim 1, wherein the laser thermal transfer method is a vacuum chamber. In a method for manufacturing an organic light emitting device in which a light emitting layer is formed between a first electrode and a second electrode by a laser thermal transfer method,
An acceptor substrate transfer step in which a pixel region is formed on a substrate stage and an acceptor substrate including a magnetic material is positioned;
A donor film transfer step for transferring a donor film including an electromagnet on the acceptor substrate and having a light emitting layer;
A lamination step of joining the acceptor substrate and the donor film by a magnetic force between the magnetic material formed on the acceptor substrate and the electromagnet included in the donor film;
A transfer step of irradiating the donor film with a laser to transfer the light emitting layer to the pixel region of the acceptor substrate;
A method for producing an organic light-emitting device using a laser thermal transfer method.