JP2007034077A - Optical package, optical package with optical element, and optical waveguide module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an optical package capable of accurately aligning the optical axes for an optical element and an optical waveguide. <P>SOLUTION: The optical package 42 includes a substrate 11, an external connecting terminal 68, an aligning stud 71, and an aligning guide 23. On the rear face 13 of the substrate 11, there is installed a mounting region 54 on which an optical element 14 can be mounted. The external connecting terminal 68 is arranged on the rear face 13 side of the substrate 11 and is connectible to the connecting terminal 67 of an optical waveguide-attached substrate 61. The aligning guide 23 is disposed on the rear face 13 side of the substrate 11. The aligning stud 71 is formed on the substrate 11 in a manner projecting from the rear face 13 side thereof and is provided with a tip end face 72 connectible to the main face 62 of the optical waveguide-attached substrate 61. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an optical package, an optical package with an optical element, and an optical waveguide module, and more particularly to a substrate positioning structure provided in the optical package.

  In recent years, with the development of information communication technology represented by the Internet and the dramatic improvement in the processing speed of information processing apparatuses, there is an increasing need for transmitting and receiving large-capacity data such as images. An information transmission speed of 10 Gbps or higher is desirable to exchange such a large amount of data freely through an information communication facility, and great expectations are placed on optical communication technology as a technology that can realize such a high-speed communication environment. On the other hand, in recent years, signal transmission paths at relatively short distances such as connections between wiring boards in devices, connections between semiconductor chips in wiring boards, connections within semiconductor chips, and the like have recently been transmitted at high speed. It is desired. For this reason, it is thought that it is ideal to shift from the conventionally common metal cable or metal wiring to optical transmission using an optical waveguide or the like.

  In recent years, various optical waveguide modules that include an optical waveguide, an optical element, a substrate that supports the optical waveguide, and the like and perform optical communication between the optical waveguide and the optical element have been proposed (for example, Patent Documents 1 and 2). reference). In Patent Document 1, a submount substrate is attached via a support member on a substrate that supports an optical waveguide, and an optical element is mounted on the submount substrate. In Patent Document 2, an optical element (LSI chip) is attached via a metal post on a substrate that supports an optical waveguide. However, the conventional techniques described in Patent Documents 1 and 2 do not positively align each component. Therefore, in Patent Document 1, a positional displacement in the planar direction is likely to occur between the submount substrate and the support member, and in Patent Document 2, a positional displacement in the planar direction occurs between the LSI chip and the metal post. Cheap. As a result, the optical axis is likely to shift in the plane direction between the optical element and the optical waveguide, and light transmission loss is likely to occur.

Therefore, recently, a guide pin alignment type optical waveguide module that positively aligns each component has been proposed. An example of the improved form is shown in FIG. In this optical waveguide module 101, the optical waveguide 104 and the substrate 105 are fixed in a state of being aligned on the side of the optical waveguide-equipped substrate 102 using guide pins 103. More specifically, a fitting hole 107 having a circular cross section and a constant inner diameter is formed in the substrate 102 with an optical waveguide. A part of the guide pin 103 is fitted into the fitting hole 107 and fixed. On the other hand, the optical waveguide 104 is provided with an alignment hole 108 in advance, and the substrate 105 is provided with an alignment hole 109 in advance. Then, the optical waveguide 104 is aligned with the optical waveguide substrate 102 and the optical element 110 by inserting the protruding portion of the guide pin 103 into the alignment hole 108 and fitting it into the alignment hole 109. .
JP 2004-31456 A (FIG. 1 and the like) JP 2000-332301 A (FIG. 1 etc.)

  However, the guide pin alignment type optical waveguide module 101 has the following problems. That is, although there is a structure that prevents the positional deviation between the optical element 110 and the optical waveguide 104 in the planar direction, there is no structure that positively prevents the positional deviation in the height direction. As a result, the optical axis is likely to be shifted between the optical element 110 and the optical waveguide 104, and light transmission loss is likely to occur.

  The present invention has been made in view of the above problems, and an object thereof is to provide an optical package, an optical package with an optical element, and an optical waveguide module capable of accurately aligning the optical axis of the optical element and the optical waveguide. There is to do.

  Means for solving the above problems (means 1) include a substrate having a front surface and a back surface, and a mounting area in which an optical element can be mounted on the back surface side, and the back surface side of the substrate. A plurality of external connection terminals connectable to a plurality of connection terminals included in the substrate with an optical waveguide, and a main surface side of the substrate with the optical waveguide formed on the substrate so as to protrude from the back side of the substrate There is an optical package comprising an alignment stud having a front end surface capable of abutting on the substrate, and an alignment guide portion disposed on the back side of the substrate.

  Therefore, according to the structure of the means 1, the alignment guide portion allows the optical element that can be mounted on the substrate and the optical waveguide of the substrate with the optical waveguide to be easily aligned in the plane direction, and the aligned state. Can be retained. Moreover, since the alignment stud on the substrate side can contact the substrate with the optical waveguide, the optical element can be easily aligned with respect to the optical waveguide in the height direction and can be held in the aligned state. As a result, the optical axis alignment between the optical element and the optical waveguide can be performed accurately.

  Another means (means 2) for solving the above problem is an optical package including an optical package and an optical element, wherein the optical package is set on the front surface, the back surface, and the back surface side. A substrate having a mounting region on which an optical element is mounted; a plurality of external connection terminals disposed on the back side of the substrate and connectable to a plurality of connection terminals of the substrate with an optical waveguide; and the substrate An alignment stud formed on the substrate so as to protrude from the back surface and having a tip surface capable of contacting the main surface of the substrate with the optical waveguide; and an alignment guide disposed on the back surface of the substrate There is an optical package with an optical element.

  Still another means (means 3) for solving the above problems is an optical waveguide module in which an optical package and an optical package with an optical element including the optical element are mounted on the main surface of the substrate with an optical waveguide, The substrate with an optical waveguide includes a main body and a substrate body having an alignment hole opened on the main surface, a plurality of connection terminals disposed on the main surface, and an optical waveguide disposed on the main surface side. The optical package is provided on the front surface, the back surface, the back surface side and has a mounting area on which the optical element is mounted, and the optical package is disposed on the back surface side of the substrate, and the plurality of connection terminals A plurality of external connection terminals connected to each other, an alignment stud formed integrally with the substrate so as to protrude from the back surface side of the substrate, and having a tip surface that contacts the main surface side, and the back surface of the substrate Side or A positioning guide member that protrudes and fits into the positioning hole, and by fitting the positioning guide member into the positioning hole and contacting the positioning stud with the main surface, There is an optical waveguide module in which the optical element and the optical waveguide are aligned.

  As the substrate constituting the optical package, for example, a resin substrate, a ceramic substrate, a glass substrate, or a metal substrate can be used. In particular, a ceramic substrate mainly composed of a ceramic sintered body is preferable. When a ceramic substrate having a higher thermal conductivity than that of the resin substrate is used, the substrate is less likely to be deformed due to thermal expansion, so that the optical element and the optical waveguide can be held in an aligned state. In addition, since the generated heat is efficiently dissipated, for example, when applied to a substrate on which an optical element can be mounted, deviation of the emission wavelength due to deterioration of heat dissipation is avoided, and operational stability and reliability are improved. An excellent substrate can be realized. Preferable examples of such ceramic substrates include substrates made of alumina, aluminum nitride, silicon nitride, boron nitride, beryllia, mullite, low-temperature fired glass ceramic, glass ceramic, and the like. Among these, it is particularly preferable to select a substrate made of alumina or aluminum nitride.

  Moreover, as a suitable example of a resin substrate, the board | substrate which consists of EP resin (epoxy resin), PI resin (polyimide resin), BT resin (bismaleide-triazine resin), PPE resin (polyphenylene ether resin) etc. is mentioned, for example. it can. In addition, a substrate made of a composite material of these resins and organic fibers such as glass fibers (glass woven fabric or glass nonwoven fabric) or polyamide fibers may be used. Preferable examples of the metal substrate include a copper substrate, a substrate made of a copper alloy, a substrate made of a single metal other than copper, and a substrate made of an alloy other than copper.

  The substrate constituting the optical package is preferably a wiring substrate including an insulating layer and a conductor layer (metal wiring layer), and particularly preferably a multilayer wiring substrate. The conductor layer may be formed on the substrate surface or may be formed inside the substrate. In order to achieve interlayer connection between these conductor layers, via hole conductors may be formed inside the substrate. For the conductor layer and via hole conductor, for example, a conductive metal paste made of gold (Au), silver (Ag), copper (Cu), platinum (Pt), tungsten (W), molybdenum (Mo), etc. is printed. Or it is formed by filling. An electric signal flows through such a conductor layer. In addition to such a wiring board, for example, it is allowed to use a build-up wiring board provided with a build-up layer formed by alternately laminating resin insulating layers and conductor layers on the board.

  The optical package of the means 2 and 3 includes an optical element mounted on the mounting area of the substrate. For example, one or more optical elements are mounted in the mounting area. As the mounting method, for example, a method such as wire bonding or flip chip bonding, a method using an anisotropic conductive material, or the like can be employed. The optical element may be directly mounted on the mounting region, or may be indirectly mounted via some member. As an optical element having a light emitting part (that is, a light emitting element), for example, a light emitting diode (LED), a semiconductor laser diode (LD), a surface emitting laser (Vertical Cavity Surface Emitting Laser; VCSEL), etc. Can be mentioned. These light emitting elements have a function of converting an inputted electric signal into an optical signal and then emitting the optical signal from a light emitting portion toward a predetermined portion. On the other hand, examples of an optical element having a light receiving portion (that is, a light receiving element) include a pin photodiode (pin PD) and an avalanche photodiode (APD). These light receiving elements have a function of causing an optical signal to be incident on the light receiving unit, converting the incident optical signal into an electric signal, and outputting the electric signal. The optical element may have both a light emitting part and a light receiving part. Suitable materials used for the optical element include, for example, Si, Ge, InGaAs, GaAsP, GaAlAs and the like. Such an optical element (particularly a light emitting element) is operated by an operation circuit. The optical element and the operation circuit are electrically connected through, for example, a conductor layer (metal wiring layer) formed on the substrate.

  For example, the resin substrate, the ceramic substrate, the glass substrate, or the metal substrate can be used as the substrate with an optical waveguide of the means 3, but a resin substrate is preferable in consideration of cost. The substrate with an optical waveguide is preferably a wiring substrate with an optical waveguide provided with an insulating layer and a conductor layer (metal wiring layer), and particularly preferably a multilayer wiring substrate. In addition to such a wiring board, for example, it is allowed to use a build-up wiring board provided with a build-up layer formed by alternately laminating resin insulating layers and conductor layers on the board.

  The substrate with an optical waveguide includes the optical waveguide. Note that only one optical waveguide may be supported on the substrate with optical waveguides, or two or more optical waveguides may be supported. An optical waveguide refers to a plate-like or film-like member having a core that is an optical path through which an optical signal propagates and a clad surrounding the core. For example, an organic optical waveguide made of a polymer material, quartz glass, or a compound There are inorganic optical waveguides made of semiconductors and the like. As the polymer material, a photosensitive resin, a thermosetting resin, a thermoplastic resin, or the like can be selected. Specifically, a polyimide resin such as a fluorinated polyimide, an epoxy resin, a UV curable epoxy resin, a PMMA ( Polymethyl methacrylate), acrylic resins such as deuterated PMMA, deuterated fluorinated PMMA, polyolefin resins, and the like are suitable.

  The alignment stud is formed on the substrate so as to protrude from the back surface side of the substrate, and has a tip surface capable of contacting the main surface side of the substrate with the optical waveguide. The alignment stud is preferably mainly composed of a material having high rigidity, and for example, is preferably composed mainly of a ceramic sintered body. In this way, the alignment stud is not easily deformed, so that the optical element and the optical waveguide can be aligned more accurately. The alignment stud is preferably formed of the same material as the substrate. In this way, since the types of materials for forming the substrate and the alignment stud can be reduced, an increase in manufacturing cost can be avoided. Further, the alignment stud is preferably formed integrally with the substrate. In this way, it is not necessary to form the alignment stud separately from the substrate, so that the optical package can be easily manufactured. In addition, since it is not necessary to consider the mounting accuracy of the alignment stud with respect to the substrate, the alignment accuracy between the optical element and the optical waveguide is higher than when the alignment stud is a separate body. The alignment stud may be formed separately from the substrate and attached to the back surface of the substrate.

  In addition, it is preferable that the protruding amount of the alignment stud with respect to the back surface is set to be larger than the thickness of the plurality of external connection terminals and larger than the thickness of the optical element. In this way, the front end surface of the alignment stud can be reliably brought into contact with the main surface side of the substrate with the optical waveguide. The leading end surface of the alignment stud may be brought into direct contact with the main surface of the substrate with the optical waveguide, or may be brought into contact with the surface of a structure (for example, a pad) formed on the main surface. Good. Furthermore, it is preferable that the front end surface of the stud is merely in pressure contact with the main surface side of the substrate with an optical waveguide. In this way, since there is no inclusion such as solder between the front end surface of the stud and the main surface side, the front end surface can be reliably brought into contact with the main surface side, and the alignment accuracy is increased. . In addition, the front end surface of the stud may be connected to the main surface side of the substrate with the optical waveguide via solder or the like. When it does in this way, the front end surface of a stud and the said main surface side can be connected more reliably.

  In addition, it is preferable that the said alignment stud is arrange | positioned in the several place spaced apart in the back surface side of the said board | substrate. In this way, the substrate can be easily held parallel to the substrate with the optical waveguide, so that the alignment accuracy can be improved and the substrate can be stably held. Furthermore, the alignment stud is preferably disposed in the vicinity of the optical element. In this way, the alignment accuracy in the height direction of the optical element is increased. The alignment stud may be disposed so as to surround the alignment guide portion. In this case, not only the alignment guide member is supported by the alignment guide portion of the substrate provided in the optical package or the alignment hole of the substrate provided in the substrate with the optical waveguide, but also alignment is performed by the alignment stud. Since the guide member can be supported, the optical element and the optical waveguide can be positioned with high accuracy.

  Moreover, it is preferable that a stud-side conductor portion that can be electrically connected to a ground layer and / or a power supply layer of the substrate with an optical waveguide is formed on the tip surface of the alignment stud. By the way, since the stud-side conductor portion can be electrically connected to the ground layer and the power supply layer, a larger current tends to flow than other conductor portions. Therefore, the stud-side conductor part preferably has a larger area than other conductor parts in order to smoothly flow a large current. Then, the area of a stud side conductor part can be enlarged by forming a stud side conductor part in the front end surface of the alignment stud with a small area restriction. Therefore, a suitable circuit that is electrically connected to the ground layer or the power supply layer can be formed by the stud-side conductor portion.

  The stud side conductor is preferably a metal layer. The thickness of the metal layer is not particularly limited, but is preferably at least 30 μm or less, and more preferably 2 μm or more and 30 μm or less. For example, when the metal layer is a normal thin film, the thickness of the metal layer is desirably 2 μm or more and 10 μm or less. In the case of co-fire (simultaneous firing), the thickness of the metal layer is preferably 10 μm or more and 20 μm or less. If the thickness of the metal layer is reduced in this way, the amount of material used to form the metal layer can be reduced, so that variations in the thickness (height) of the metal layer can be reduced and the manufacturing cost can be increased. It can also be avoided.

  When the alignment stud is mainly composed of a ceramic sintered body, the metal layer is preferably made of a metal material having a melting point lower than the firing temperature of the ceramic constituting the alignment stud. If a metal material having a melting point higher than the firing temperature of the ceramic constituting the alignment stud is used, it will be necessary to heat the metal layer to a high temperature exceeding a few hundred degrees Celsius, making it difficult to manufacture. This leads to an increase in manufacturing costs and manufacturing costs.

  The stud side conductor part, the connection terminal, and the external connection terminal are made of, for example, a conductive metal. Although it does not specifically limit as said conductive metal, For example, 1 type, or 2 or more types of metals selected from copper, gold | metal | money, silver, platinum, palladium, nickel, tin, lead, titanium, tungsten, molybdenum, tantalum, niobium etc. Can be mentioned. Examples of the conductive metal composed of two or more metals include solder that is an alloy of tin and lead. Lead-free solder (for example, Sn-Ag solder, Sn-Ag-Cu solder, Sn-Ag-Bi solder, Sn-Ag-Bi-Cu solder) as a conductive metal composed of two or more metals Of course, Sn—Zn solder, Sn—Zn—Bi solder, etc.) may be used.

  As the alignment guide portion constituting the optical package, an alignment guide hole that is open on the back surface of the substrate and can be fitted with an alignment guide member protruding from the substrate with the optical waveguide, An alignment mark or the like that is disposed on the back surface of the substrate and can be collated with the alignment reference portion of the substrate with an optical waveguide is preferable, and the alignment guide hole is preferable. If it does in this way, the outer peripheral surface of the protrusion location of the alignment guide member contacts the inner surface of the alignment guide hole, so that the optical element and the optical waveguide can be held in alignment. In addition, other parts (specifically, an optical waveguide or the like) can be supported at the protruding portion of the alignment guide member. The shape of the alignment guide member is not particularly limited. For example, a pin-shaped member (guide pin) is preferable, and the material thereof may be a metal that is hard to some extent, such as stainless steel. Further, the diameter of the alignment guide member (particularly the diameter of the protruding portion) is substantially the same as that of the alignment guide hole so that it can be fitted into the alignment guide hole opened on the back surface of the substrate. Need to be.

  The number of alignment guide portions is not particularly limited, but from the viewpoint of improving alignment accuracy and fixing strength, a plurality of alignment guide portions is preferable to a single alignment guide portion. When there are a plurality of alignment guide portions, the alignment guide portions are preferably arranged so as to sandwich the mounting area from both sides thereof. In this way, since the alignment guide portion can be disposed in the vicinity of the optical element, the state where the optical element and the optical waveguide are aligned in the planar direction can be more stably maintained.

[First Embodiment]

  Hereinafter, an optical waveguide module according to a first embodiment embodying the present invention will be described in detail with reference to FIGS.

  As shown in FIGS. 1 to 4, the optical waveguide module 1 of the present embodiment includes two optical packages 41 with optical elements on an upper surface 62 (main surface) of a wiring substrate 61 with an optical waveguide (substrate with an optical waveguide). It is configured by mounting.

  As shown in FIG. 1, the wiring board 61 with an optical waveguide of the present embodiment is a plate member having a substantially rectangular shape in plan view, having an upper surface 62 and a lower surface 63. The wiring substrate 61 with an optical waveguide includes a substrate body 69, the optical waveguide 31, and the like. As shown in FIGS. 3 to 5, the substrate body 69 is constituted by a resin insulating layer 64 and a metal conductor layer 65. The resin insulating layer 64 is, for example, about 30 μm thick, and is made of a resin-resin composite material obtained by impregnating continuous porous PTFE with an epoxy resin, or a glass cloth base epoxy resin having a thickness of about 100 μm.

  Through holes 66 for internal conduction penetrating in the thickness direction of the resin insulation layer 64 are formed at a plurality of locations in the resin insulation layer 64. These through-hole portions 66 serve to electrically connect metal conductor layers 65 of different layers. Further, pads 67 (connection terminals) are arranged at positions where the upper end surfaces of the respective through-hole portions 66 are present on the upper surface 62 of the wiring substrate 61 with an optical waveguide.

  As shown in FIGS. 3 to 5, a plurality of locations (here, four locations) in the wiring substrate 61 with an optical waveguide are filled at both the upper surface 62 and the lower surface 63 of the wiring substrate 61 with an optical waveguide. A hole 81 is formed. A resin filling portion 82 is provided inside these filling holes 81, and an alignment hole 83 is provided at a substantially central portion of the resin filling portion 82. The alignment hole 83 has a circular cross section and opens on both the upper surface 62 and the lower surface 63 of the wiring substrate 61 with an optical waveguide. In the present embodiment, the diameter of the alignment hole 83 is smaller than the inner diameter of the filling hole 81 and is set to about 0.7 mm. Inside the four alignment holes 83, a guide pin 24 (alignment guide member) made of stainless steel and having a circular cross section is fitted with one end protruding toward the upper surface 62 side. Specifically, in this embodiment, a guide pin “CNF125A-21” (diameter 0.699 mm) defined in JIS C 5981 is used.

  As shown in FIGS. 1 to 5, the optical waveguide 31 is disposed substantially at the center of the upper surface 62 of the wiring substrate 61 with an optical waveguide. The base material 32 constituting the optical waveguide 31 has a core 33 and a clad 34 surrounding the core 33 from above, below, left and right. The core 33 substantially becomes an optical path through which the optical signal propagates. In the case of the present embodiment, the core 33 and the clad 34 are formed of transparent polymer materials having different refractive indexes, specifically, PMMA (polymethyl methacrylate) having different refractive indexes. The number of the cores 33 used as the optical path is 12, which are linear or gently curved, and are formed to extend in parallel to each other.

  A V-shaped groove 35 opened at the lower surface of the optical waveguide 31 is formed at a predetermined location in the optical waveguide 31. The tip of the V-shaped groove 35 extends to a certain depth of the core 33. The inner surface of the V-shaped groove 35 is an inclined surface having an angle of about 45 ° with respect to the upper surface 62 of the wiring substrate 61 with an optical waveguide, and a thin film 37 made of a metal capable of totally reflecting light is formed on the inclined surface. It may be vapor deposited. As a result, an optical path changing mirror that reflects light at an angle of 90 ° is configured.

  As shown in FIGS. 3 to 5, circular alignment holes 36 are formed through the four corners of the optical waveguide 31. These alignment holes 36 have a diameter of about 0.7 mm corresponding to the size of the guide pin 24. And each guide pin 24 which protrudes from the wiring board 61 with an optical waveguide is penetrated by each alignment hole 36 which the optical waveguide 31 has.

  As shown in FIGS. 1 to 5, the optical package 42 constituting the optical package 41 with each optical element includes a ceramic substrate 11. The ceramic substrate 11 is a member having a front surface 12 and a back surface 13 and having a substantially rectangular shape when viewed from the thickness direction (see FIG. 2). The ceramic substrate 11 is a so-called ceramic multilayer wiring board composed of a plurality of ceramic layers 51, and includes a metal wiring layer 52 as an inner layer. The ceramic layer 51 is mainly composed of a ceramic sintered body obtained by firing a green sheet mainly composed of alumina, and the metal wiring layer 52 is formed of tungsten. The ceramic substrate 11 also includes a via conductor 53, and metal wiring layers 52 having different layers are connected to each other via the via conductor 53. A pad 56 is formed at the lower end of some of the via conductors 53. A plurality of solder bumps 68 (external connection terminals) are provided on the surface of each pad 56. These solder bumps 68 are soldered to the pads 67 of the wiring board 61 with an optical waveguide.

  In the right side portion of the surface 12 of the ceramic substrate 11 on the left side in FIG. 1, a plurality of surface side conductor layers 55 (see FIGS. 3 and 4) serving as flip chip connection pads are formed of tungsten. A driver IC 18 having a rectangular flat plate shape is flip-chip mounted on these surface-side conductor layers 55. Circuit elements (not shown) are formed on the lower surface layer of the driver IC 18.

  In addition, a back-side conductor layer 54 (see FIGS. 3 and 5) serving as a mounting region is formed of tungsten at the right end of the back surface 13 of the ceramic substrate 11 on the left side in FIG. The back side conductor layer 54 is electrically connected to the driver IC 18 through the via conductor 53 and the front side conductor layer 55. On the back-side conductor layer 54, a VCSEL 14 which is a kind of light emitting element is bonded with the light emitting surface facing downward. The light emitting surface of the VCSEL 14 has a plurality of light emitting portions 15 arranged in a line, and is in close contact with the upper surface of the optical waveguide 31 (the upper surface of the upper clad 34). Note that the number of the light emitting portions 15 is 12, which is the same as the number of the cores 33 of the optical waveguide 31. These light emitting portions 15 emit laser light having a predetermined wavelength in a direction orthogonal to the back surface 13 of the ceramic substrate 11 (that is, the downward direction in FIG. 1).

  On the other hand, a plurality of surface-side conductor layers 55 are also formed on the left side of the surface 12 of the ceramic substrate 11 on the right side in FIG. A receiver IC 19 having a rectangular flat plate shape is flip-chip mounted on these surface-side conductor layers 55. A circuit element (not shown) is formed on the lower surface layer of the receiver IC 19.

  In addition, a back-side conductor layer 54 serving as a mounting region is also formed at the left end portion of the back surface 13 of the ceramic substrate 11 on the right side in FIG. The back side conductor layer 54 is electrically connected to the receiver IC 19 through the via conductor 53 and the front side conductor layer 55. On the back-side conductor layer 54, a photodiode 16 which is a kind of light receiving element is bonded with the light receiving surface facing downward. The light receiving surface of the photodiode 16 has a plurality of light receiving portions 17 arranged in a line, and is in close contact with the upper surface of the optical waveguide 31. Note that the number of light receiving portions 17 is twelve, which is the same as the number of cores 33 of the optical waveguide 31. Accordingly, these light receiving portions 17 are configured to easily receive laser light from the lower side to the upper side in FIG.

  As shown in FIGS. 2 to 5, filling holes 21 opened at both the front surface 12 and the back surface 13 of the ceramic substrate 11 are provided at a plurality of locations (two locations per ceramic substrate 11) in the ceramic substrate 11. Is formed. A resin filling portion 22 is provided inside these filling holes 21, and an alignment guide hole 23 (positioning guide portion) is provided at a substantially central portion of the resin filling portion 22. The alignment guide hole 23 has a circular cross section and opens at both the front surface 12 and the back surface 13 of the ceramic substrate 11. In the present embodiment, the diameter of the alignment guide hole 23 is smaller than the inner diameter of the filling hole 21 and is set to about 0.7 mm. The upper end portion of the guide pin 24 is fitted into the alignment guide hole 23.

  As a result, the VCSEL 14 (or the photodiode 16) and the optical waveguide 31 are fixed while being aligned in the planar direction. Here, the “aligned state in the plane direction” specifically means that the optical path conversion mirror located on the left end side in FIG. 1 is directly under the light emitting units 15 and each core 33 and each light emitting element. 1 and the optical path changing mirror located on the right end side in FIG. 1 is directly below each light receiving portion 17 so that the optical axes of each core 33 and each light receiving portion 17 are aligned. State.

  In this embodiment, two of the four guide pins 24 are arranged close to the VCSEL 14 and the remaining two are arranged close to the photodiode 16. The pair of guide pins 24 arranged in proximity to the VCSEL 14 are substantially collinear with the row of the light emitting portions 15 and are arranged so as to sandwich the row of the light emitting portions 15 and the back side conductor layer 54 from both ends thereof. It is installed. Similarly, the pair of guide pins 24 arranged in the vicinity of the photodiode 16 is substantially collinear with the row of the light receiving portions 17, and the row of the light receiving portions 17 and the back surface side conductor layer 54 are formed from both ends thereof. It is arrange | positioned so that it may pinch | interpose.

  As shown in FIGS. 1 to 5, alignment studs 71 protrude from a plurality of locations (four locations per ceramic substrate 11) on the back surface 13 side of the ceramic substrate 11. Each alignment stud 71 is disposed so as to surround a region where the solder bump 68 is disposed on the back surface 13 side. Two of the four alignment studs 71 are disposed between the region where the solder bumps 68 are disposed and the mounting region where the back-side conductor layer 54 is formed on the back surface 13 side. The alignment stud 71 is formed in a substantially rectangular parallelepiped shape by laminating the ceramic layers 51, and is integrally formed on the ceramic substrate 11. That is, the alignment stud 71 is mainly composed of the same ceramic sintered body as the ceramic substrate 11.

  As shown in FIGS. 3 and 4, the protruding amount of the alignment stud 71 with respect to the back surface 13 is set to be larger than the thickness of the VCSEL 14 or the photodiode 16. The protruding amount of the alignment stud 71 is set to such a size that the VCSEL 14 and the photodiode 16 are in contact with the upper surface of the optical waveguide 31. Further, the protruding amount of the alignment stud 71 is set to be larger than the height of the solder bump 68, and is approximately the size obtained by adding the thickness of the single ceramic layer 51 to the height of the solder bump 68. Are equal. That is, the number of ceramic layers 51 in the region where the solder bumps 68 are disposed is one larger than the number of ceramic layers 51 in the mounting region where the back-side conductor layer 54 is formed.

  Further, the alignment stud 71 has a front end surface 72, and the front end surface 72 is in contact with the upper surface 62 of the wiring substrate 61 with an optical waveguide. As a result, the VCSEL 14 (or the photodiode 16) and the optical waveguide 31 are fixed while being aligned in the height direction. Here, the “aligned state in the height direction” specifically means that the VCSEL 14 is in contact with the upper surface of the optical waveguide 31 and the optical axes of the cores 33 and the light emitting portions 15 of the VCSEL 14 are the same. A state where the photodiodes 16 are in contact with the upper surface of the optical waveguide 31 and the optical axes of the cores 33 and the light receiving portions 17 of the photodiodes 16 are aligned.

  A general operation of the optical waveguide module 1 configured as described above will be briefly described.

  The VCSEL 14 and the photodiode 16 become operable by supplying power through the metal conductor layer 65 of the wiring substrate 61 with an optical waveguide, the metal wiring layer 52 of the ceramic substrate 11, and the like. When an electrical signal is output from the driver IC 18 on the ceramic substrate 11 to the VCSEL 14, the VCSEL 14 converts the input electrical signal into an optical signal (laser light), and then the optical signal is converted to an optical path conversion mirror at the left end of the core 33. The light is emitted from the light-emitting unit 15 toward. The laser light emitted from the light emitting unit 15 enters from the upper surface side of the optical waveguide 31 and enters the optical path changing mirror of the core 33. The laser beam incident on the optical path changing mirror changes its traveling direction by 90 °. For this reason, the laser light is emitted from the upper surface side of the optical waveguide 31 and is incident on the light receiving portion 17 of the photodiode 16. The photodiode 16 converts the received laser light into an electrical signal, and outputs the converted electrical signal to the receiver IC 19.

  Next, a method for manufacturing the optical waveguide module 1 having the above configuration will be described with reference to FIGS.

  First, the ceramic substrate 11 is produced by the following procedure. A raw material slurry is prepared by uniformly mixing and kneading alumina powder, organic binder solvent, plasticizer, etc., and this raw material slurry is used to form a sheet with a doctor blade device. Body) is formed in a plurality of layers. Next, a predetermined portion of each green sheet is punched to form a through hole that forms part of the filling hole 21 and a via hole. Since it is still unsintered at this stage, drilling can be performed relatively easily and at low cost. Thereafter, the via hole is filled with the metal paste, and the metal paste is printed on the surface of the green sheet.

  In the subsequent laminating and crimping step, a plurality of green sheets are stacked and arranged, and they are crimped and integrated using a press device, thereby producing a ceramic laminate having the filling holes 21. At this time, a portion to be the alignment stud 71 in the ceramic laminate is also produced at the same time. Next, after performing a drying process, a degreasing process, etc. according to a well-known method, a baking process is further performed at the heating temperature (1650 degreeC-1950 degreeC) which an alumina can sinter. Thereby, the ceramic laminate is sintered to form a ceramic substrate 11 (see FIG. 6). At this point, the ceramic hardens and shrinks. Also, the metal paste filled in the via hole becomes the via conductor 53, and the metal paste printed on the surface of the green sheet becomes the metal wiring layer 52, the back-side conductor layer 54, the front-side conductor layer 55 and the pad 56. .

  In the subsequent first resin filling step, the resin filling portion 22 is formed in the filling hole 21 as follows. First, a resin material for filling is prepared by kneading a mixture in which a curing agent is mixed with an epoxy resin with three rolls. In the present embodiment, an uncured resin material containing an inorganic filler in the thermosetting resin is used.

  Next, the ceramic substrate 11 is set in a printing apparatus, and a predetermined metal mask (not shown) is placed in close contact with the surface 12 thereof. In the metal mask, an opening is formed in advance at a location corresponding to the filling hole 21. The resin material is filled in each filling hole 21 by printing the resin material through such a metal mask. Then, after the printed ceramic substrate 11 is removed from the printing apparatus, it is heated at 120 ° C. for 1 hour, and the filled resin material is semi-cured to form the resin filling portion 22. Here, the reason why the resin filling portion 22 is not completely cured is to perform the hole processing in the next first fitting hole forming step more easily.

  In the subsequent first fitting hole forming step, precision hole machining using a precision drill is performed to form the alignment guide hole 23 in the resin filling portion 22. According to such a processing method, the guide pin 24 serving as a reference for optical axis alignment can be the alignment guide hole 23 that can be supported at a desired correct position. Here, the ceramic substrate 11 is set in a surface polishing apparatus, and the front surface 12 and the back surface 13 are polished. By this polishing, the excess resin protruding from the opening of the filling hole 21 and the resin adhering to the substrate surface are removed. When this polishing step is performed, the unevenness on the surface 12 of the ceramic substrate 11 is eliminated and the surface is flattened.

  Next, a main curing process is performed in which the ceramic substrate 11 is heated at 150 ° C. for 5 hours to completely cure the resin filling portion 22. Further, finishing is performed by a well-known method, and fine adjustment is performed so that the hole diameter of the alignment guide hole 23 becomes 0.700 mm. Specifically, the accuracy required for processing at this time is ± 0.001 mm. Thereafter, solder bumps 68 are provided by applying a solder paste to the pads 56 on the back surface 13 side of the ceramic substrate 11 and performing reflow.

  Also, a substrate body 69 constituting the optical waveguide-equipped wiring substrate 61 is prepared and prepared by a conventionally known method. As a specific example, a copper-clad laminate is used as a starting material, and copper foil etching, electroless copper plating, or the like is performed to form a resin insulating layer 64 having a metal conductor layer 65 and a through-hole portion 66. Next, a resin insulating layer 64 is further laminated on the surface layer of the resin insulating layer 64, and a pad 67 is formed on the upper surface 62 of the uppermost resin insulating layer 64.

  Next, a hole 81 for filling is formed by drilling the prepared substrate body 69 using a drill. In the subsequent second resin filling step, the resin filling portion 82 is formed in the filling hole 81 by performing the same step as the first resin filling step. Further, in the second fitting hole forming step, a precision hole processing using a precision drill is performed to form the alignment hole 83 in the resin filling portion 82. Further, finishing is performed by a well-known method, and the hole diameter of the alignment hole 83 is finely adjusted to be 0.700 mm. Specifically, the accuracy required for processing at this time is ± 0.001 mm.

  Further, according to a conventionally known method, the clad 34 and the core 33 are sequentially laminated on the upper surface 62 of the substrate body 69 to form the optical waveguide 31. Further, precision hole processing using a precision drill is performed on the position directly above the alignment hole 83 in the optical waveguide 31 to form alignment holes 36 at the four corners (see FIG. 7).

  In the subsequent guide pin mounting step, the guide pin 24 is press-fitted into the alignment hole 36 and the alignment hole 83 of the wiring board 61 with the optical waveguide by using a dedicated jig or the like (see FIG. 8). .

  Next, the driver IC 18 is mounted on the front surface 12 of the ceramic substrate 11 on the left side in FIG. 1, and the VCSEL 14 is mounted on the back surface 13 (see FIG. 9). In addition, a receiver IC 19 is mounted on the front surface 12 of the ceramic substrate 11 on the right side in FIG. 1 and a photodiode 16 is mounted on the back surface 13. The VCSEL 14 and the photodiode 16 are aligned with the alignment guide hole 23 as a reference. For example, the VCSEL 14 and the photodiode 16 are aligned on a virtual line connecting the two alignment guide holes 23. Further, since the back surface 13 at this time is a flat surface without unevenness, the VCSEL 14 and the photodiode 16 are parallel to the back surface 13.

  In the subsequent alignment step, the guide pins 24 included in the wiring substrate 61 with the optical waveguide are fitted into the alignment guide holes 23 included in the ceramic substrate 11 (see FIG. 10). Thereby, the optical axis alignment of the optical waveguide 31 and the VCSEL 14 is performed, and the optical axis alignment of the optical waveguide 31 and the photodiode 16 is performed. Next, each solder bump 68 is reflowed in a state in which the front end surface 72 of the alignment stud 71 is in close contact with the upper surface 62 of the wiring substrate 61 with an optical waveguide. At this time, a part of the solder bump 68 melts and falls and adheres to the pad 67 of the wiring substrate 61 with an optical waveguide. As a result, the pad 56 of the ceramic substrate 11 and the pad 67 of the wiring substrate 61 with the optical waveguide are electrically connected via the solder bumps 68, and the optical package 41 with the optical element is soldered to the wiring substrate 61 with the optical waveguide. The As described above, the optical package 41 with an optical element of this embodiment shown in FIGS. 1 to 4 is completed.

  Therefore, according to the present embodiment, the following effects can be obtained.

  (1) In the optical waveguide module 1 of the present embodiment, the lower end portion of the guide pin 24 is fitted into the alignment hole 83 of the wiring substrate 61 with an optical waveguide, and the upper end portion is aligned with the alignment guide hole 23 of the ceramic substrate 11. It is mated. Thereby, the optical element (VCSEL14, photodiode 16) mounted on the ceramic substrate 11 and the optical waveguide 31 included in the wiring substrate 61 with the optical waveguide can be easily aligned in the planar direction, and are in an aligned state. Can hold. In addition, since the alignment stud 71 on the ceramic substrate 11 abuts on the wiring substrate 61 with the optical waveguide, the optical element (VCSEL 14, photodiode 16) can be raised with respect to the optical waveguide 31 without any particular adjustment. It can be easily aligned in the direction and can be held in the aligned state. As a result, the optical axis of the optical element (VCSEL 14, photodiode 16) and the optical waveguide 31 can be accurately adjusted. Therefore, it is possible to realize the optical waveguide module 1 that has a small light transmission loss and can sufficiently cope with high speed and high density.

  (2) In this embodiment, the optical pin (VCSEL 14, photodiode 16) and the optical waveguide 31 are aligned by fitting the guide pin 24 into the alignment guide hole 23 or the alignment hole 83. Is called. For this reason, when the outer peripheral surface of the guide pin 24 contacts the inner surface of the alignment guide hole 23 or the inner surface of the alignment hole 83, the optical element (VCSEL14, photodiode 16) and the optical waveguide 31 are positioned in the planar direction. It is kept in a combined state. Therefore, the ceramic substrate 11 excellent in dimensional stability and reliability can be realized. Moreover, since the guide pin 24 is inserted through the alignment hole 36, the outer peripheral surface of the guide pin 24 contacts the inner surface of the alignment hole 36, so that the optical waveguide 31 is aligned in the planar direction. Retained. Therefore, the ceramic substrate 11 with more excellent dimensional stability and reliability can be realized.

  (3) In the present embodiment, the ceramic substrate 11 is used as the substrate constituting the optical package 42. Since the ceramic substrate 11 has higher thermal conductivity than other substrates such as a resin substrate, the ceramic substrate 11 is less likely to be deformed by thermal expansion. Therefore, it is possible to prevent a positional shift between the optical element (VCSEL 14, photodiode 16) and the optical waveguide 31 due to thermal expansion. In addition, since the generated heat is efficiently dissipated from the ceramic substrate 11, it is possible to avoid the deviation of the emission wavelength due to the deterioration of the heat dissipation property, and to realize the ceramic substrate 11 excellent in operational stability and reliability. it can.

  (4) In this embodiment, the VCSEL 14 and the photodiode 16 are in close contact with the upper surface of the optical waveguide 31. For this reason, a lens for allowing laser light to pass from the light emitting portion 15 of the VCSEL 14 toward the core 33 of the optical waveguide 31 and a lens for allowing laser light to pass from the core 33 toward the light receiving portion 17 of the photodiode 16 are provided. It becomes unnecessary.

(5) Since the optical waveguide 31 of the present embodiment is disposed on the upper surface 62 of the substrate body 69, when attaching the optical waveguide 31, an attachment recess for the optical waveguide 31 is provided on the upper surface 62 of the wiring substrate 61 with an optical waveguide. It is not necessary to form. Therefore, an increase in manufacturing cost of the optical waveguide module 1 can be avoided.
[Second Embodiment]

  Hereinafter, an optical waveguide module 1 according to a second embodiment embodying the present invention will be described in detail with reference to FIGS. Here, the points different from the first embodiment will be mainly described, and the same points will be assigned to the common points.

  As shown in FIGS. 11 and 12, the optical waveguide module 1 of the present embodiment has a stud-side conductor layer 73 (stud-side conductor portion) on the entire distal end surface 72 of the alignment stud 71. The stud side conductor layer 73 is connected to the driver IC 18 and the like via the metal wiring layer 52 and the via conductor 53. The stud-side conductor layer 73 is in surface contact with the substrate-side conductor layer 70 formed on the upper surface 62 of the wiring substrate 61 with an optical waveguide in a state where the optical package 41 with an optical element is mounted on the wiring substrate 61 with an optical waveguide. (See FIG. 12). The board-side conductor layer 70 is electrically connected to a ground layer (not shown) and a power supply layer (not shown) of the wiring board 61 with an optical waveguide through the metal conductor layer 65 and the through hole portion 66. Thereby, the stud side conductor layer 73 is electrically connected to the ground layer and the power supply layer via the substrate side conductor layer 70, the metal conductor layer 65, and the through hole portion 66.

By the way, since the stud side conductor layer 73 can be electrically connected to the ground layer and the power supply layer, a large current flows compared to other conductor portions (for example, the via conductor 53 connecting the driver IC 18 and the VCSEL 14). There is a tendency. Therefore, the stud-side conductor layer 73 preferably has a larger area than other conductor portions in order to smoothly flow a large current. Therefore, in the present embodiment, the stud-side conductor layer 73 is formed on the entire front end surface 72 of the alignment stud 71 with a small area restriction. As a result, since the area of the stud side conductor layer 73 is increased, a suitable circuit electrically connected to the ground layer and the power supply layer can be formed by the stud side conductor layer 73.
[Third Embodiment]

  Hereinafter, an optical waveguide module 1 according to a third embodiment embodying the present invention will be described in detail with reference to FIGS. Here, the points different from the first embodiment will be mainly described, and the same points will be assigned to the common points.

  As shown in FIGS. 13 and 14, in the optical waveguide module 1 of the present embodiment, the position of the alignment stud 71 is different from that in the first embodiment. That is, the alignment studs 71 are disposed at the four corners on the back surface 13 side of the ceramic substrate 11.

  Further, in the present embodiment, the alignment of the optical element (VCSEL 14, photodiode 16) and the optical waveguide 31 is performed using the alignment mark 74 (positioning guide portion) shown in FIG. 14 instead of the guide pin 24. Is going. Specifically, when mounting the optical package 41 with an optical element on the wiring substrate 61 with an optical waveguide, the alignment mark 74 is collated (matched) with an alignment reference mark (not shown) of the wiring substrate 61 with an optical waveguide. Thus, alignment is performed. The alignment mark 74 is attached to the alignment stud 71 arranged so as to sandwich the mounting region where the back-side conductor layer 54 is formed from both sides. The alignment mark 74 is provided on the lower end surface of the alignment stud 71.

Therefore, according to this embodiment, since the alignment mark 74 is used instead of the guide pin 24, the alignment guide hole 23 and the alignment holes 36 and 83 for fitting and inserting the guide pin 24 are formed. The process to do becomes unnecessary. Therefore, an increase in manufacturing cost of the optical waveguide module 1 can be avoided.
[Fourth Embodiment]

  Hereinafter, an optical waveguide module 1 according to a fourth embodiment embodying the present invention will be described in detail with reference to FIG. Here, the points different from the first embodiment will be mainly described, and the same points will be assigned to the common points.

  As shown in FIG. 15, in the optical waveguide module 1 of the present embodiment, the configuration of the wiring board 61 with an optical waveguide is different from that of the first embodiment. That is, the optical waveguide 31 of this embodiment is disposed on the entire upper surface 62 of the wiring substrate 61 with an optical waveguide. Further, the upper surface of the optical waveguide 31 is almost entirely covered with an insulating resin layer 91. The insulating resin layer 91 is formed of a copper clad laminate, and a pad 67 and the like are formed on the upper surface of the insulating resin layer 91 by etching the copper foil. In the insulating resin layer 91, an opening 92 for exposing a part of the optical waveguide 31 is formed at a location above the V-shaped groove 35 of the optical waveguide 31.

  Furthermore, in the present embodiment, a protruding portion 93 protrudes on the back surface 13 side of the ceramic substrate 11, and the VCSEL 14 is bonded to the tip surface of the protruding portion 93. The tip of the protrusion 93 and the VCSEL 14 are located in the opening 92, and the VCSEL 14 is in close contact with the upper surface of the optical waveguide 31. The protrusion amount of the protrusion 93 with respect to the back surface 13 is set so as to be larger than the alignment stud 71 protruding on the back surface 13 side. The alignment stud 71 is in contact with the upper surface of the insulating resin layer 91, not the upper surface of the optical waveguide 31. That is, the protruding amount of the alignment stud 71 is substantially equal to the height of the solder bump 68.

  In addition, you may change embodiment of this invention as follows.

  The alignment mark 74 of the third embodiment may be changed to the guide pin 24. In this case, the alignment stud 71 is disposed so as to surround the guide pin 24. Therefore, the guide pin 24 is supported not only by the alignment guide hole 23 of the ceramic substrate 11 and the alignment hole 83 of the substrate body 69 but also by the alignment stud 71, so that the inclination of the guide pin 24 is Can be prevented more reliably. Therefore, the optical element (VCSEL14, photodiode 16) and the optical waveguide 31 can be positioned with high accuracy.

  -You may apply the structure of the said 2nd Embodiment to the said 3rd Embodiment. That is, in the third embodiment, the stud-side conductor layer 73 is formed on the distal end surface 72 of the alignment stud 71, and the stud-side conductor layer 73 is connected to the substrate-side conductor layer 70, the metal conductor layer 65, and the through-hole portion 66. Thus, it may be electrically connected to the ground layer or the power supply layer. If it does in this way, it will have an effect similar to the said 2nd Embodiment.

  In each of the above embodiments, if the driver IC 18 (or receiver IC 19) is thinner than the VCSEL 14 (or photodiode 16), the driver IC 18 (or receiver IC 19) may be mounted on the back surface 13 side of the ceramic substrate 11. . In this case, the driver IC 18 and the VCSEL 14 (or the receiver IC 19 and the photodiode 16) may be integrated.

  Next, the technical ideas grasped by the embodiment described above are listed below.

  (1) A first mounting area having a front surface and a back surface, on which the optical element can be mounted is set on the back surface side, and a second mounting area on which the semiconductor element for driving the optical element can be mounted is set on the front surface side. A substrate, a plurality of external connection terminals arranged on the back side of the substrate and connectable to a plurality of connection terminals of the substrate with an optical waveguide, and the substrate protruding from the back side of the substrate And an alignment stud having a tip surface that can be brought into contact with the main surface side of the substrate with the optical waveguide, and an alignment guide portion disposed on the back surface side of the substrate. Features an optical package.

  (2) A substrate having a front surface and a back surface, on which a mounting region in which an optical element can be mounted is set on the back surface side, and a plurality of connection terminals disposed on the back surface side of the substrate and included in the substrate with an optical waveguide A plurality of external connection terminals connectable to the alignment stud, and an alignment stud formed on the substrate so as to protrude from the back surface side of the substrate and having a tip surface that can contact the main surface side of the substrate with the optical waveguide And an alignment guide portion disposed on the back side of the substrate, and the tip end surface of the alignment stud is electrically connected to a ground layer and / or a power supply layer of the substrate with the optical waveguide. A connectable stud-side conductor portion is formed, and the stud-side conductor portion can abut on a substrate-side conductor portion formed on the main surface.

1 is a schematic cross-sectional view showing an optical waveguide module according to a first embodiment embodying the present invention. Similarly, the schematic plan view which shows an optical waveguide module. FIG. 3 is a cross-sectional view taken along line AA in FIG. 2. BB sectional drawing of FIG. FIG. 3 is an exploded cross-sectional view showing the optical waveguide module according to the first embodiment. Similarly, explanatory drawing which shows the manufacturing method of an optical waveguide module. Similarly, explanatory drawing which shows the manufacturing method of an optical waveguide module. Similarly, explanatory drawing which shows the manufacturing method of an optical waveguide module. Similarly, explanatory drawing which shows the manufacturing method of an optical waveguide module. Similarly, explanatory drawing which shows the manufacturing method of an optical waveguide module. Explanatory drawing which shows the manufacturing method of the optical waveguide module of 2nd Embodiment. Similarly, the schematic sectional drawing which shows the principal part of an optical waveguide module. The schematic sectional drawing which shows the principal part of the optical waveguide module of 3rd Embodiment. Similarly, the schematic plan view which shows an optical waveguide module. The schematic sectional drawing which shows the principal part of the optical waveguide module of 4th Embodiment. The schematic sectional drawing which shows the conventional optical waveguide module.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Optical waveguide module 11 ... Ceramic substrate 12 as a substrate ... Front surface 13 of a substrate ... Back surface 14 of a substrate ... VCSEL as an optical element
16 ... Photodiode 23 as optical element ... Positioning guide hole 24 as positioning guide part ... Guide pin 31 as positioning guide member ... Optical waveguide 41 ... Optical package 42 with optical element ... Optical package 54 ... Back surface side conductor layer 61 as mounting region ... Wiring substrate with optical waveguide as substrate with optical waveguide 62 ... Main surface of substrate with optical waveguide and upper surface 67 as main surface of substrate body ... As connection terminal of substrate with optical waveguide Pad 68 ... Solder bump 69 as external connection terminal ... Substrate body 71 ... Alignment stud 72 ... Tip end surface 73 of alignment stud ... Stud side conductor layer 74 as stud side conductor part ... Alignment mark as alignment guide part 83 ... Board body alignment holes

Claims (8)

A substrate having a front surface and a back surface, and a mounting region in which an optical element can be mounted on the back surface side;
A plurality of external connection terminals arranged on the back side of the substrate and connectable to a plurality of connection terminals of the substrate with the optical waveguide;
An alignment stud formed on the substrate so as to protrude from the back surface side of the substrate and having a tip surface capable of contacting the main surface side of the substrate with the optical waveguide;
An optical package comprising: an alignment guide portion disposed on the back side of the substrate. The alignment guide portion is an alignment guide hole opened on the back surface of the substrate,
The optical package according to claim 1, wherein an alignment guide member protruding from the substrate with an optical waveguide can be fitted into the alignment guide hole.   The optical package according to claim 1, wherein the alignment guide portion is disposed so as to sandwich the mounting region from both sides thereof.   4. The optical package according to claim 1, wherein the alignment stud is disposed so as to surround the alignment guide portion. 5.   The optical package according to any one of claims 1 to 4, wherein the substrate and the alignment stud are mainly made of a ceramic sintered body.   The stud-side conductor portion that can be electrically connected to a ground layer and / or a power supply layer of the substrate with an optical waveguide is formed on the tip surface of the alignment stud. The optical package according to any one of 5. An optical package with an optical element including an optical package and an optical element,
The optical package is:
A front surface, a back surface, and a substrate having a mounting region set on the back surface side on which the optical element is mounted;
A plurality of external connection terminals arranged on the back side of the substrate and connectable to a plurality of connection terminals of the substrate with the optical waveguide;
An alignment stud formed on the substrate so as to protrude from the back surface side of the substrate and having a tip surface capable of contacting the main surface side of the substrate with the optical waveguide;
An optical package with an optical element, comprising: an alignment guide portion disposed on the back side of the substrate. An optical waveguide module in which an optical package with an optical element including an optical package and an optical element is mounted on a main surface of a substrate with an optical waveguide,
The substrate with an optical waveguide is:
A substrate body having a main surface and an alignment hole opening in the main surface;
A plurality of connection terminals arranged on the main surface;
An optical waveguide disposed on the main surface side,
The optical package is:
A front surface, a back surface, a substrate having a mounting region set on the back surface side on which the optical element is mounted;
A plurality of external connection terminals disposed on the back side of the substrate and connected to the plurality of connection terminals;
An alignment stud formed integrally with the substrate so as to protrude from the back surface side of the substrate, and having a tip surface abutting on the main surface side;
A positioning guide member that protrudes from the back surface side of the substrate and fits into the positioning hole, the fitting of the positioning guide member into the positioning hole, and the position with respect to the main surface An optical waveguide module, wherein the optical element and the optical waveguide are aligned with each other by contact of a matching stud.

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