JP2007027684A - Electronic parts module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a compact electronic parts module which is excellent in heat dissipation. <P>SOLUTION: This electronic parts module is equipped with a wiring board 1 formed with a cavity 2, a first semiconductor element 10 mounted on the wiring board 1, and a second semiconductor element 11 with heating property. The first semiconductor element 10 is housed in the cavity, and the second semiconductor element 11 is mounted on a heat dissipation substrate 7. The heat dissipation substrate 7 is mounted on the wiring board 1 so as to be positioned in a region just above the cavity 2. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an electronic component module mainly used for mobile communication equipment.

  In recent years, electronic component modules in which a plurality of electronic component elements including semiconductor elements and passive elements are mounted on a wiring board have been rapidly spread.

  Such an electronic component module includes a plurality of electronic component elements, a structure in which the plurality of electronic component elements are arranged and placed on the upper surface of the wiring board, and the electronic component elements are covered with a metal shield case. Are known.

  For the electronic component module, a semiconductor element having exothermic property that generates Joule heat or the like when used (for example, a semiconductor element incorporating a power amplifier) is used.

  If the heat generated from the heat-generating semiconductor element is accumulated in the semiconductor element itself without being dissipated to the outside, the semiconductor element becomes excessively hot and the electrical characteristics of the semiconductor element greatly fluctuate. The operation of the electronic component module becomes unstable. In addition, the heat generated from the semiconductor element may affect the surrounding electronic component elements, thereby changing the characteristics thereof. This also causes unstable operation of the electronic component module.

Therefore, as means for releasing the heat generated from the semiconductor element to the outside of the electronic component module, a plurality of thermal via conductors that penetrate the wiring board in the thickness direction inside the wiring board on which the semiconductor element is mounted, immediately below the semiconductor element. And a method of connecting the thermal via conductor to an exothermic semiconductor element is known. Thus, heat generated in the semiconductor element has been conventionally released to the outside of the electronic component module through the thermal via conductor (for example, Patent Document 1).
Japanese Patent Laid-Open No. 2003-204013

  However, since the conventional electronic component module having the above-described structure has a plurality of electronic component elements arranged and placed on the same plane, the size of the wiring board is increased, thereby increasing the overall structure of the electronic component module. There was a drawback of becoming.

  The present invention has been devised in view of the above drawbacks, and a main object thereof is to provide an electronic component module that is small in size and excellent in heat dissipation.

  The electronic component module according to the present invention is an electronic component module comprising: a wiring board provided with a cavity; and a first semiconductor element mounted on the wiring board and a second semiconductor element having heat generation. 1 semiconductor element is accommodated in the cavity, the second semiconductor element is mounted on a heat radiating board, and the heat radiating board is mounted on the wiring board so as to be located in a region immediately above the cavity. It is characterized by.

  In the electronic component module of the present invention, the heat dissipating board is mounted on a connection pad provided on the upper surface of the wiring board and outside the cavity opening via a conductive bonding material. The external terminal provided on the lower surface of the wiring board is connected by a plurality of first thermal via conductors that penetrate the thickness direction of the wiring board.

  In the electronic component module of the present invention, a heat transfer bonding material is interposed between the heat dissipating substrate and the mounting surface of the second semiconductor element.

  The electronic component module of the present invention is characterized in that a metal heat sink layer is provided on the main surface opposite to the main surface on which the second semiconductor element is mounted on the heat dissipation substrate. .

  In the electronic component module of the present invention, a heat transfer bonding material is interposed between the heat dissipating substrate and the mounting surface of the second semiconductor element, and the second semiconductor element of the heat dissipating substrate is mounted. A heat sink layer made of metal is provided on the main surface opposite to the main surface, and the heat transfer bonding material and the heat sink layer are connected by a plurality of second thermal via conductors that penetrate the heat dissipation substrate. It is characterized by this.

  The electronic component module according to the present invention is characterized in that a heat dissipating conductor pattern connected to the second thermal via conductor and extending to a side surface of the heat dissipating substrate is provided inside the heat dissipating substrate. It is what.

  In the electronic component module of the present invention, a mounting pad connected to the connection pad via the conductive bonding material is provided on the mounting surface of the heat dissipation board to the wiring board. The first thermal via conductor and the second thermal via conductor are thermally connected by connecting the heat radiating conductor pattern via a conductor.

  The electronic component module of the present invention is characterized in that the second semiconductor element is mounted on a surface opposite to the mounting surface of the heat dissipating substrate on the wiring substrate.

  The electronic component module of the present invention is characterized in that a resin material for covering the heat-radiating substrate and the second semiconductor element is provided.

  The electronic component module of the present invention is characterized in that a shield layer for covering the outer surface of the resin material is provided.

  According to the electronic component module of the present invention, the first semiconductor element is accommodated in the cavity provided on the wiring board, the second semiconductor element is mounted on the heat dissipation board, and the heat dissipation board is directly above the cavity. Since it is mounted on the wiring board so as to be located in the region, it is effective that the heat generated from the second semiconductor element is conducted to the heat dissipating board and the heat is accumulated in the second semiconductor element. Can be prevented. As a result, the second semiconductor element does not become excessively high in temperature, and fluctuations in the electrical characteristics of the second semiconductor element due to the influence of heat can be suppressed. Moreover, since the first semiconductor element and the second semiconductor element are arranged so as to overlap in the stacking direction, the overall structure of the electronic component module can be reduced in size.

  In the electronic component module of the present invention, the heat dissipating board is mounted on a connection pad provided on the upper surface of the wiring board and outside the cavity opening via a conductive bonding material. External terminals provided on the lower surface of the wiring board are connected by a plurality of first thermal via conductors that penetrate the thickness direction of the wiring board. Thereby, the heat conducted to the heat radiating substrate can be efficiently conducted to the outside through the first thermal via conductor, the external terminal, etc., and the heat radiation action can be further enhanced.

  In the electronic component module of the present invention, a heat transfer bonding material is interposed between the heat dissipating substrate and the mounting surface of the second semiconductor element. Thereby, the heat generated from the second semiconductor element can be efficiently conducted to the heat radiating substrate side. In addition, there is an advantage that the bonding strength of the second semiconductor element to the heat dissipation substrate can be increased by the heat transfer bonding material.

  In the electronic component module of the present invention, a metal heat sink layer is provided on the main surface opposite to the main surface on which the second semiconductor element of the heat dissipating substrate is mounted. Thereby, the heat conducted to the heat dissipation substrate from the second semiconductor element can be efficiently released to the outside, and the heat dissipation action can be further enhanced.

  In the electronic component module of the present invention, a heat transfer bonding material is interposed between the heat dissipation substrate and the mounting surface of the second semiconductor element, and the second semiconductor element of the heat dissipation substrate is mounted. A heat sink layer made of metal is provided on the main surface opposite to the main surface, and the heat transfer bonding material and the heat sink layer are connected by a plurality of second thermal via conductors that penetrate the heat dissipation substrate. You may do it. Thereby, the heat generated from the second semiconductor element can be efficiently released to the outside through the heat transfer bonding material, the second thermal via conductor, and the heat sink layer, and the heat dissipation action is further enhanced. Is possible.

  In the electronic component module of the present invention, a heat radiating conductor pattern connected to the second thermal via conductor and extending to the side surface of the heat radiating substrate is provided inside the heat radiating substrate. Thereby, the heat conducted to the heat-radiating substrate is efficiently released to the outside through the heat-dissipating conductor pattern, and the heat-dissipating action can be further enhanced.

  In the electronic component module of the present invention, a mounting pad connected to the connection pad via the conductive bonding material is provided on the mounting surface of the heat dissipation board to the wiring board. The heat dissipating conductor pattern is connected via a conductor. As a result, the first thermal via conductor and the second thermal via conductor are thermally connected, and the heat generated from the second semiconductor element can be radiated to the outside very efficiently.

  Hereinafter, an electronic component module of the present invention will be described in detail with reference to the drawings. In the present embodiment, an electronic component module as a high-frequency module used in a wireless communication device using a baseband IC (BBIC) as a first semiconductor element and an RFIC as a second semiconductor element will be described.

  1A is a perspective view of an electronic component module according to an embodiment of the present invention (however, the resin material 9 is omitted), and FIG. 1B is an exploded perspective view of the electronic component module shown in FIG. 2 is a cross-sectional view of the electronic component module shown in FIG. 1A provided with a resin material 9, FIG. 3 is a top view of the electronic component module shown in FIG. 1A, and FIG. FIG. 5 is a block diagram of a circuit incorporated in the electronic component module shown in FIG. 1. FIG. 5 is a plan perspective view of the heat dissipating substrate 7 used in the electronic component module shown in a).

  The electronic component module shown in the figure is mainly composed of a wiring board 1, a first semiconductor element 10, a heat dissipating board 7, and a second semiconductor element 11, and is a full module surrounded by an alternate long and short dash line in FIG. Circuit.

  The wiring board 1 has a substantially rectangular parallelepiped shape, and a cavity 2 is formed on the upper surface side. The wiring board 1 is mounted with a first semiconductor element 10, a second semiconductor element 11, a SAW filter 12, a crystal oscillator 13, and a chip-shaped electronic component 14. The chip-shaped electronic component 14 is mainly an electronic component element for RF, such as a capacitor, a resistor, and an inductor. In addition, as shown in FIG. 2, a passive element 15 such as a band pass filter (BPF) or a balun is formed inside the wiring board 1, and a wiring conductor 16a and a via-hole conductor 16b are used to connect the elements. An internal wiring 16 is formed. Further, a first thermal via conductor 8 to be described later is formed inside the wiring board 1. In addition, a resin material 9 that covers the second semiconductor element 11, the SAW filter 12, the crystal oscillator 13, and the like mounted on the wiring board is formed on the upper surface side of the wiring board 1.

  Such a wiring board 1 is formed, for example, by laminating a plurality of insulator layers mainly composed of a ceramic material such as glass-ceramics, alumina, and mullite. In particular, when the electronic component module is used in a high-frequency device, it is preferable to use a glass-ceramic material for the wiring board 1. By using a glass-ceramic material, Cu and Ag which are low resistance conductors can be easily used as wiring. If a glass-ceramic material having a relatively low thermal conductivity is used, it is possible to effectively prevent the heat generated from the second semiconductor element 11 from being transmitted to the first semiconductor element 10 as will be described later.

  In addition, for the wiring substrate 1, for example, a conductive paste serving as a circuit wiring or a connection pad is conventionally known on the surface of a ceramic green sheet obtained by adding and mixing an appropriate organic solvent to a ceramic material powder such as a glass-ceramic material. It is manufactured by applying a screen printing method or the like, laminating a plurality of these and press-molding them, followed by baking at a high temperature.

  Internal wiring 16a, via-hole conductors 16b, and the like are formed inside such a wiring board 1, and external terminals 3 are formed on the lower surface. On the upper surface, electrode pads 4 and surface wiring patterns (not shown) for mounting various electronic component elements are formed.

  The internal wiring 16, the external terminal 3, the electrode pad 5, etc. are made of a material mainly containing a metal such as Ag, Cu, W, and Mo. For example, Ag-based powder, borosilicate-based low-melting glass frit, ethyl cellulose, etc. A conductive paste containing an organic binder, an organic solvent, and the like is formed by applying and baking on a ceramic green sheet serving as each insulator layer constituting the wiring substrate 1 by a conventionally known screen printing or the like. The

  The cavity 2 provided in the wiring board 1 has a recessed cross-sectional shape and a rectangular opening surface, and accommodates the first semiconductor element 10. The depth from the opening surface to the bottom surface of the cavity 2 is set so that the upper surface of the accommodated first semiconductor element 10 does not protrude from the upper surface of the wiring substrate 1. The planar dimension of the cavity 2 is set to be slightly larger than the planar dimension of the first semiconductor element 10. That is, a space for accommodating at least one first semiconductor element 10 is secured by the cavity 2.

  The first semiconductor element 10 accommodated in the cavity 2 has a structure in which circuit wiring such as Al is formed on the surface of a semiconductor element substrate such as Si or GaAs. The first semiconductor element 10 is a flip-chip type IC. The surface on which the circuit wiring is formed is used as the lower surface, and the pad provided on the lower surface and the pad provided on the bottom surface of the cavity 2 are electrically conductive such as solder. It is designed to be electrically and mechanically connected with a bonding material. The first semiconductor element 10 is a BBIC shown in FIG. 5, and has a function of modulating / demodulating an audio signal or an RF signal, for example.

  A heat dissipating substrate 7 is disposed immediately above the first semiconductor element 10, and a second semiconductor element 11 having heat generation is mounted on the upper surface of the heat dissipating substrate 7. Thereby, since the first semiconductor element 10 and the second semiconductor element 11 are arranged so as to overlap in the stacking direction, the entire structure of the electronic component module can be reduced in size. Moreover, by arranging all the electronic component elements on the upper surface side of the wiring board 1, the mounting operation of the electronic component elements is simplified as compared with the case where the electronic component elements are also disposed on the lower surface side of the wiring board 1, The production efficiency of electronic component modules is good.

  The second semiconductor element 11 is, for example, a flip-chip type IC like the first semiconductor element 10 described above, and circuit wiring such as Al is provided on the surface of a semiconductor element substrate such as Si or GaAs. It has a formed structure. Further, the second semiconductor element 11 has the surface on which the circuit wiring is formed as the lower surface, and the pad provided on the lower surface and the pad provided on the upper surface of the heat-dissipating substrate 7 are connected by a conductive bonding material such as solder. Electrically and mechanically connected. The second semiconductor element 11 is the RFIC shown in FIG. 5, which amplifies the signal received by the antenna (ANT), converts the frequency and outputs a demodulated signal to the BBIC, and amplifies the signal from the BBIC. An RF transmission circuit that converts the frequency and outputs it to the antenna is provided.

  The second semiconductor element 11 has a heat generating property and incorporates an element with relatively large power consumption, such as a power amplifier, in the inside thereof, and tends to generate Joule heat when the electronic component module is used. Here, having exothermic property means that heat is easily generated as compared with the first semiconductor element. For example, the second semiconductor element 11 as an RFIC incorporates a power amplifier therein, and its power consumption is larger than the power consumption of the first semiconductor element 10 that is a baseband IC.

  The heat generated in the second semiconductor element 11 is mainly conducted to the heat-dissipating substrate 7 and effectively prevents the heat generated from the second semiconductor element 11 from being accumulated in the second semiconductor element 11. ing.

  In order to make it difficult for the heat generated from the second semiconductor element 11 to be transmitted to the first semiconductor element 10, the passive element 15 formed inside the wiring substrate 1, etc. It is formed of a material having a thermal conductivity higher than that of 1. For example, when the wiring substrate 1 is formed of an insulator layer mainly composed of glass-ceramics, the heat-radiating substrate 7 may be formed of an insulator layer mainly composed of alumina. The difference in thermal conductivity λ [W / mK] between the main component of the heat dissipation substrate 7 and the main component of the wiring substrate 1 is preferably 10 or more, more preferably 15 or more.

  In this way, by forming the heat dissipating substrate 7 using an insulating material having a higher thermal conductivity than the main component of the wiring substrate 1, the heat conducted from the second semiconductor element 11 to the heat dissipating substrate 7 is It becomes difficult to be transmitted to the wiring board 1. This reduces the influence of heat on the first semiconductor element 10 accommodated in the cavity of the wiring board 1 and the passive element 15 provided inside the wiring board 1 and stabilizes the operation of the electronic component module. It becomes possible to make it.

  For example, the heat dissipating substrate 7 has conventionally known a conductive paste that becomes a circuit wiring or a connection pad on the surface of a ceramic green sheet obtained by adding and mixing a suitable organic solvent to a ceramic material powder such as alumina or aluminum nitride. These are applied by the screen printing method, etc., and a plurality of these are laminated and press-molded, followed by firing at a high temperature.

  The heat dissipating substrate 7 has a substantially rectangular parallelepiped shape and is disposed on the wiring substrate 1 so as to straddle a pair of opposing sides of the opening of the cavity 2. Then, the wiring board 1 is electrically and mechanically connected to the mounting pad 4 provided on the lower surface and the connection pad 21 provided on the upper surface of the wiring board 1 around the opening of the cavity 2 by the conductive bonding material 6. It is mounted on the top surface.

  The connection pads 21 provided around the opening of the cavity 2 and the external terminals 3 provided on the lower surface of the wiring board 1 are connected by a plurality of first thermal via conductors 8 penetrating in the thickness direction of the wiring board 1. ing. As a result, the heat conducted from the second semiconductor element 11 to the heat-radiating substrate 7 is conducted to the outside of the electronic component module via the first thermal via conductor 8, the external terminal 3, etc. It is possible to more effectively prevent heat from being accumulated in 11. In addition, the influence of heat on the first semiconductor element 10 and the passive element 15 can be reduced. Further, if the first thermal via conductor 8 is formed at the outer position of each of the four side surfaces of the cavity 2 so as to surround the first semiconductor element 10, electromagnetic waves from the outside with respect to the first semiconductor element 10 can be obtained. Noise can be reduced.

  A heat transfer bonding material 16 is interposed between the heat dissipation substrate 7 and the mounting surface of the second semiconductor element 11. Further, a metal heat sink layer 17 is provided on the main surface 7b opposite to the main surface 7a on which the second semiconductor element 11 of the heat dissipation substrate 7 is mounted. The heat transfer bonding material 16 and the heat sink layer 17 are connected by a plurality of second thermal via conductors 18 penetrating the heat dissipation substrate 7. As a result, the heat generated from the second semiconductor element 11 can be efficiently conducted to the heat-radiating substrate 7 by the heat transfer bonding material 16, and further through the second thermal via conductor 18 and the heat sink layer 17. It becomes easy to dissipate heat to the outside.

  The heat transfer bonding material 16 is made of solder or the like, and is formed in the central region of the lower surface of the second semiconductor element 11. The heat transfer bonding material 16 also has an advantage that the bonding strength of the second semiconductor element 11 to the heat dissipation substrate 7 can be increased.

  The plurality of second thermal via conductors 18 are provided so as to penetrate the heat-radiating substrate 2 at locations corresponding to the application regions of the heat transfer bonding material 16, and the plurality of second thermal via conductors 18 are provided. For example, the via conductors 18 are arranged in a matrix so as to be uniformly distributed.

  The heat sink layer 17 is made of a metal material such as W or Mo, and is formed in a rectangular shape at least in a region facing the heat transfer bonding material 16 on the lower surface 7 b of the heat dissipation substrate 7.

  Furthermore, as shown in the plan perspective view of the heat dissipation substrate 7 in FIG. 4, the heat dissipation substrate 7 is connected to the second thermal via conductor 18 and extends to the side surface 7 c of the heat dissipation substrate 7. A heat dissipating conductor pattern 19 is formed. In FIG. 4, the heat dissipating conductor pattern 19 and the conductor 20 formed in the heat dissipating substrate 7 are indicated by dotted lines. The heat dissipating conductor pattern 19 makes it possible to more efficiently release the heat conducted from the second semiconductor element 11 to the heat dissipating substrate 2 to the outside. The heat dissipating conductor pattern 19 is made of a material mainly containing a metal such as Ag, Cu, or W, and has a central portion 19a and a central portion formed in the central region of the heat dissipating substrate 7 so as to form a substantially rectangular shape. It consists of the extending part 19b extended from 19a to the side surface of the heat-radiating substrate 7. The extending portion 19b of the heat dissipating conductor pattern 19 is connected to the mounting pad 4 provided on the lower surface 7b of the heat dissipating substrate 7 through a conductor 20 such as a via-hole conductor. As a result, the first thermal via conductor 8 and the second thermal via conductor 18 are thermally connected via the heat radiation conductor pattern 19, the conductor 20, and the like. The generated heat can be dissipated more effectively to the outside, and the operation of the electronic component module can be stabilized.

  Further, if the planar dimension of the central portion 19a of the heat radiating conductor pattern 19 is set to be larger than the planar dimension of the first semiconductor element 10 or the second semiconductor element 11, the central portion 19a of the radiating conductor pattern 19 is set. Is interposed between the first semiconductor element 10 and the second semiconductor element 11. Thereby, it is possible to effectively prevent signal interference between the first semiconductor element 10 and the second semiconductor element 11. Further, when the electronic component module is used, signal interference occurs between the first semiconductor element 10 and the second semiconductor element 11 if the heat dissipating conductor pattern 19 is held at the ground potential. Can be prevented more effectively. Therefore, it is preferable that the heat radiating conductor pattern 19 is connected to the ground external terminal 3.

  A resin material 9 is formed on the upper surface side of the wiring substrate 1 so as to cover the second semiconductor element 11, the SAW filter 12, the crystal oscillator 13, and the chip-shaped electronic component 14 described above. For example, a resin material such as epoxy is used as the resin material 9 to reinforce the bonding strength of the second semiconductor element 11, the SAW filter 12, the crystal oscillator 13, and the chip-shaped electronic component 14.

  The resin material 9 is also filled in the cavity 2. Thereby, the bonding strength of the first semiconductor element 10 to the wiring board 1 can be reinforced.

  Further, as shown in FIG. 8, a shield layer 21 having an electromagnetic wave shielding function may be formed on the upper surface of the resin material 9. For example, when the electronic component module is incorporated in a high-frequency circuit such as a mobile phone that handles a radio frequency of 800 MHz or higher, the shield layer 21 is preferably formed of a metal sintered layer made only of sintered metal particles. Here, the metal sintered layer is one obtained by sintering metal fine particles without containing a resin component such as a binder. This metal sintered layer is a paste in which metal nanoparticles having an average particle diameter of 1 nm to 100 nm, more preferably an average particle diameter of 10 nm to 50 nm are dispersed with an organic dispersion solvent such as toluene, terpineol, xylene, tetradecane, etc. After forming, it is formed by applying on the upper surface of the resin material 9 and heat-treating it at 130 to 300 ° C. By using a paste made of nano-order metal particles in this way, a dense metal layer is formed, and electromagnetic noise from the outside can be effectively shielded. In addition, Ag, Cu, Ni etc. can be illustrated as a metal material of a metal sintered layer. Moreover, the thickness of a metal sintered layer is set to 5-10 micrometers, for example.

  Examples of the shield layer 21 include a conductive resin material in which metal powders such as Ag, Al, Ni, and Fe are dispersed in a resin material such as epoxy in addition to the metal sintered layer.

  FIG. 6 is a sectional view showing another embodiment of the electronic component module according to the present invention. The electronic component module shown in the figure is different from the electronic component module shown in FIG. 1 in that the second semiconductor element 11 is mounted on the lower surface 7 b of the heat-radiating substrate 7. The heat sink layer 17 is provided on the upper surface 7 a side of the heat dissipation substrate 7. In the case of the electronic component module shown in FIG. 6, since the heat sink layer 17 is provided on the upper surface 7a side of the heat dissipation substrate, the heat conducted from the second semiconductor element 11 to the heat sink layer 17 is easily released to the outside. It has become. Moreover, if the resin material 9 is formed so that the heat sink layer 17 is exposed, the heat dissipation effect of the heat sink layer 17 can be further enhanced.

  FIG. 7 is a sectional view showing still another embodiment of the electronic component module according to the present invention. The electronic component module shown in the figure is different from the electronic component module shown in FIG. 1 in that the cavity 2 is provided on the lower surface side of the wiring board 1.

  In addition, this invention is not limited to the above-mentioned embodiment, A various change and improvement are possible in the range which does not deviate from the summary of this invention.

  For example, in the above-described embodiment, the resin material 9 is provided so as to cover the second semiconductor element 11, the SAW filter 12, the crystal oscillator 13, and the like on the wiring board, but instead of the resin material 9, the wiring board is provided. A metal shield case that covers the second semiconductor element 11, the SAW filter 12, the crystal oscillator 13, and the like may be attached to the upper surface of 1.

(A) is the external appearance perspective view of the state which abbreviate | omitted the resin material of the electronic component module which concerns on one Embodiment of this invention, (b) is a disassembled perspective view of the electronic component module shown to (a). It is sectional drawing of the state which formed the resin material in the electronic component module shown to Fig.1 (a). It is a top view of the electronic component module shown to Fig.1 (a). It is a plane perspective view of the heat dissipation board | substrate used for the electronic component module shown to Fig.1 (a). It is a block diagram of the circuit integrated in the electronic component module shown to Fig.1 (a). It is sectional drawing of the electronic component module which concerns on other embodiment of this invention. It is sectional drawing of the electronic component module which concerns on other embodiment of this invention. It is sectional drawing which shows the modification of the electronic component module shown in FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Wiring board 2 ... Cavity 3 ... External terminal 4 ... Mounting pad 5 ... Electrode pad 6 ... Conductive joining material 7 ... Heat dissipation board 8 ... 1st Thermal via conductor 9 ... Resin material 10 ... First semiconductor element (RFIC)
11: Second semiconductor element (baseband IC)
DESCRIPTION OF SYMBOLS 12 ... SAW filter 13 ... Crystal oscillator 14 ... Chip-shaped electronic component 15 ... Passive element 16 ... Heat transfer bonding material 17 ... Heat sink layer 18 ... 2nd thermal via Conductor 19 ... Heat dissipation conductor pattern

Claims (10)

In an electronic component module comprising a wiring board provided with a cavity, and a first semiconductor element mounted on the wiring board and a second semiconductor element having heat generation,
The first semiconductor element is accommodated in the cavity, the second semiconductor element is mounted on a heat radiating board, and the heat radiating board is mounted on the wiring board so as to be located in a region immediately above the cavity. An electronic component module characterized by that. The heat dissipating board is mounted on a connection pad provided on the upper surface of the wiring board and outside the cavity opening portion through a conductive bonding material, and an external surface provided on the lower surface of the connection pad and the wiring board. 2. The electronic component module according to claim 1, wherein the terminal is connected by a plurality of first thermal via conductors penetrating in a thickness direction of the wiring board. The electronic component module according to claim 1, wherein a heat transfer bonding material is interposed between the heat dissipating substrate and the mounting surface of the second semiconductor element. The electronic component module according to claim 1, wherein a metal heat sink layer is provided on a main surface opposite to a main surface on which the second semiconductor element of the heat dissipating substrate is mounted. A heat transfer bonding material is interposed between the heat dissipating substrate and the mounting surface of the second semiconductor element, and the heat dissipating substrate is opposite to the main surface on which the second semiconductor element is mounted. 2. A metal heat sink layer is provided on a main surface, and the heat transfer bonding material and the heat sink layer are connected by a plurality of second thermal via conductors penetrating the heat dissipation substrate. The electronic component module described. 6. The electron according to claim 5, wherein a heat radiating conductor pattern connected to the second thermal via conductor and extending to a side surface of the heat radiating substrate is provided inside the heat radiating substrate. Parts module. A mounting pad connected to the connection pad via the conductive bonding material is provided on the mounting surface of the heat dissipation board to the wiring board, and a conductor is connected between the mounting pad and the heat dissipating conductor pattern. The electronic component module according to claim 6, wherein the first thermal via conductor and the second thermal via conductor are thermally connected by being connected to each other. 2. The electronic component module according to claim 1, wherein the second semiconductor element is mounted on a surface opposite to a mounting surface of the heat dissipation substrate on the wiring substrate. The electronic component module according to claim 1, wherein a resin material that covers the heat-radiating substrate and the second semiconductor element is provided. The electronic component module according to claim 9, further comprising a shield layer that covers an outer surface of the resin material.

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