JP2007022848A - Scribing apparatus and method of cutting substrate using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To suppress the adhesion of a powder of the material, small material pieces or the like of a substrate generated by cutting onto the surface of a substrate, at a low cost. <P>SOLUTION: The scribe apparatus 10 is provided with a substrate holding stage 20 for holding a glass substrate 60, substrate covers 30 and 31 constituted movably between a standby position which is separated from the glass substrate 60 held at the substrate holding stage 20 and a substrate abutting position where they cover the part of the substrate to be utilized by abutting on the glass substrate 60 held at the substrate holding stage 20, and a substrate cutter 40 for cutting the part of the substrate held by the substrate holding stage 20 not covered by the substrate covers 30 and 31. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a scribing apparatus used for substrate cutting processing and a substrate cutting method using the same.

  In the manufacture of LCP (Liquid Crystal Panel), PDP (Plasma Display Panel) and the like, generally, a process of cutting a large panel formed of a glass substrate into individual panels having a desired size is provided. A scribing device is known for cutting such a glass substrate. Here, as a method for cutting a substrate by a scribe device, a substrate is cut with a cutter after drawing a line with a cutter, or a substrate is cut at once by using a high penetration cutter. There is.

  However, when cutting the substrate, cullet (powder or small pieces of substrate material) is generated and scattered and adhered to the surface of the substrate. The cullet attached to the surface of the substrate in this way is removed by a knife edge, a diamond wheel, or the like, or removed by pure water cleaning or brushing cleaning, but none can be removed sufficiently. For this reason, the substrate is sent to the subsequent process with the cullet attached to the surface thereof, and the manufacturing yield may be significantly reduced due to defects caused by the cullet such as foreign matter defects in the mounting process.

  Here, as a scribing device for preventing the adhesion of cullet to the surface of such a substrate, for example, Patent Document 1 includes a transparent glass substrate that is disposed to face each other through a liquid crystal. A liquid crystal display substrate in which a laminated body having a predetermined pattern is formed by fine processing on the liquid crystal side surface, and after forming the laminated body on the liquid crystal side surface of the transparent glass substrate, the transparent glass substrate itself is processed. A material that forms a uniform liquid flow on the surface of a transparent glass substrate including at least a processing point is disclosed. And according to this, it is described that it is possible to prevent adhesion of glass shards generated in the cutting process of the transparent glass substrate to electrodes, signal lines, active elements, and the like.

  Further, in Patent Document 2, after receiving and cleaning the substrate, a masking material is formed by applying and curing a polyolefin-based resin that decomposes with a solvent on the signal input terminal, for example, a polystyrene or polypropylene masking material. It is disclosed that a substrate is cut after applying an alignment film and rubbed, and finally the substrate is washed. And according to this, it is described that the dirt resulting from the cutting of the substrate or the like can be prevented from adhering to the signal input terminal on the surface of the substrate.

Japanese Unexamined Patent Publication No. 09-105924 Japanese Unexamined Patent Publication No. 2000-039598

  However, in the scribing apparatus as shown in Patent Document 1, a liquid flow such as distilled water must be formed so as to flow over the entire processing surface of the substrate when the substrate is cut. For this reason, the cutting process must be performed in the water tank, and facilities for supplying and discarding water are required, resulting in a problem that the apparatus becomes large and costs are increased accordingly. Furthermore, there is a problem that the material powder and material pieces adhering to the substrate may not be sufficiently removed only by cleaning with distilled water or the like.

  In the scribing apparatus as shown in Patent Document 2, a protective film must be formed on the substrate in advance before the substrate is cut, and after the cutting, the substrate must be washed with distilled water or the like. For this reason, the process of apply | coating a protective film material, the process of hardening, and also the process of wash | cleaning and drying a board | substrate at the end are required, and since there are many manufacturing processes, there exists a problem that manufacturing cost will increase by that.

  The present invention has been made in view of such various points, and the object of the present invention is that the substrate material powder, the material pieces, and the like generated by cutting adhere to the surface of the substrate without enormous manufacturing costs. Is to deter

  A scribing apparatus according to the present invention includes a substrate holding stage for holding a substrate, a standby position provided opposite to the substrate holding surface of the substrate holding stage and spaced from the substrate held on the substrate holding stage, and a substrate holding stage. A substrate cover member configured to be movable between a substrate contact position that contacts the held substrate and covers the use portion, and a portion of the substrate held by the substrate holding stage that is not covered by the substrate cover member And a substrate cutting means for cutting.

  According to such a configuration, the substrate is cut by the substrate cutting means in a state where the used portion of the substrate is covered with the substrate cover member. For this reason, the material powder of the board | substrate generated by cutting | disconnection, a material piece, etc. do not adhere to the utilization part of a board | substrate. Therefore, these foreign substances do not adhere to the used part of the substrate in the subsequent process, and it can be suppressed that the manufacturing yield is lowered due to the defective foreign substances.

  In the scribing apparatus according to the present invention, the substrate contact portion of the substrate cover member may be formed of an elastic material.

  According to such a configuration, when the substrate cover member contacts the substrate, the substrate contact portion of the substrate cover member is formed of an elastic material, so that the substrate surface due to contact between the substrate cover member and the substrate Can prevent damage.

  Furthermore, the scribing apparatus according to the present invention may be configured such that the substrate contact portion of the substrate cover member is tiltable.

  According to such a configuration, even if the substrate held on the substrate holding stage is not horizontal but inclined, the substrate contact portion of the substrate cover member is configured to be tiltable. It can abut against the inclination and cover its use part.

  A substrate cutting method according to the present invention includes a step of holding a substrate on a substrate holding stage, a step of covering a portion of the substrate held on the substrate holding stage with a substrate cover member, and a substrate covering member of the substrate. And a step of cutting off the non-existing portion.

  According to such a configuration, the substrate is cut by the substrate cutting means in a state where the used portion of the substrate is covered with the substrate cover member. For this reason, the material powder of the board | substrate generated by cutting | disconnection, a material piece, etc. do not adhere to the utilization part of a board | substrate. Therefore, these foreign substances do not adhere to the used part of the substrate in the subsequent process, and it can be suppressed that the manufacturing yield is lowered due to the defective foreign substances.

  As described above, according to the present invention, it is possible to prevent the substrate material powder, the material small pieces, and the like generated by cutting from adhering to the surface of the substrate without incurring significant manufacturing costs.

  Hereinafter, as a scribing apparatus according to an embodiment of the present invention, a scribing apparatus 10 that performs a process of cutting a glass substrate formed by bonding a TFT substrate and a CF substrate in an LCD manufacturing process will be described in detail with reference to the drawings.

  The present invention is not limited to the following embodiment.

(Configuration of scribing device 10)
FIG. 1 shows a scribing apparatus 10 according to an embodiment of the present invention. The scribing apparatus 10 includes a substrate holding stage 20, substrate covers 30, 31 (substrate cover member) and substrate cutter 40 (substrate cutting means), alignment cameras 50, 51 provided on both sides of the substrate cutter 40, It is comprised by the control apparatus of illustration.

  The scribe device 10 has a substrate placement area and a scribe area arranged in parallel in the device.

  The substrate holding stage 20 is provided horizontally at the lowermost part of the scribing apparatus 10. The substrate holding stage 20 is provided on a guide rail (not shown) so as to reciprocate linearly in the horizontal direction between the substrate placement area and the scribe area. The substrate holding stage 20 is formed in, for example, a rectangular parallelepiped having a length of 75 to 100 cm, a width of 100 to 150 cm, and a thickness of 20 to 50 cm. The substrate holding stage 20 is made of iron, steel, or stainless steel such as austenite, ferrite, martensite, or precipitation hardening.

  The substrate holding stage 20 is connected to a control unit (not shown), and is configured to rotate around the normal direction of the upper surface thereof.

  The substrate holding stage 20 is configured to suck and fix the glass substrate 60 placed on the upper surface thereof. That is, the inside of the substrate holding stage 20 is formed in the inner space. The substrate holding stage 20 has a plurality of suction holes (not shown) that reach the inner space on the upper surface. The substrate holding stage 20 is formed with a communication hole on its side surface that communicates with a vacuum suction device such as a vacuum pump (not shown). The vacuum suction device is connected to a control device (not shown).

  The substrate holding stage 20 may be configured to suck and fix the substrate more firmly by further forming a suction chuck. That is, in this case, an adsorption chuck made of a polyether ether ketone resin (PEEK resin), a phenol resin (PH resin), a polyimide resin (PI resin) or the like is formed on the upper surface of the substrate holding stage 20. A concentric annular suction groove is formed on the top surface of the suction chuck, and linear suction grooves communicating across all of the annular suction grooves are formed radially. Further, the annular suction groove and the linear suction groove communicate with the inner space of the substrate holding stage 20.

  The substrate holding stage 20 is provided with three pin alignments (not shown) on the upper surface thereof.

  Each pin alignment is formed in a cylindrical shape having a diameter of, for example, 0.5 to 1.5 cm. The pin alignment is made of iron, steel, stainless steel such as austenite, ferrite, martensite, and precipitation hardening, or resin such as PEEK, ceramic, MC nylon, acrylic, unilate, and the like. The pin alignment is formed on the upper surface of the substrate holding stage 20 at a position where it abuts on predetermined three sides of the glass substrate 60 placed on the stage. That is, the pin alignment is formed at a position where the glass substrate 60 can be positioned at a predetermined position on the substrate holding stage 20 by bringing the glass substrate 60 into contact with the pin alignment.

  Further, the shape of the substrate holding stage 20 may not be a rectangle but may be a circle. Furthermore, the substrate holding stage 20 does not have to be plate-shaped, and may be formed in a cubic base.

  Further, the pin alignment does not have to be configured by three, and may be configured by, for example, two pin alignments.

  The substrate covers 30 and 31 are respectively provided above the scribe area. The substrate covers 30 and 31 are each formed in, for example, a rectangular plate shape having a length of 40 to 120 cm, a width of 30 to 80 cm, and a thickness of 0.5 to 2 cm. As shown in FIG. 2, the substrate covers 30 and 31 are selected so as to cover the display area of the glass substrate 60 to be processed placed on the substrate stage. Here, the sizes of the substrate covers 30 and 31 are preferably such that they cover the surfaces of all glass substrates 60 except for a width of 1 mm on both sides from a scribe line 70 by a substrate cutter 40 described later. .

  As shown in FIG. 3, the substrate covers 30 and 31 are each formed to have a two-layer structure in the vertical direction. The upper layer 32 of the substrate covers 30 and 31 is made of stainless steel such as iron, steel, austenite, ferrite, martensite, precipitation hardening, etc., aluminum, aluminum alloy, copper, copper alloy, etc. From this viewpoint, those formed of aluminum or aluminum alloy are preferably used.

  The lower layer 33 (substrate contact portion) of the substrate covers 30 and 31 is made of, for example, silicon rubber, diene rubbers such as acrylonitrile-butadiene rubber (NBR) and styrene-butadiene rubber (SBR), or natural rubber. (NR), and further, phenol-based, epoxy-based, and urethane-based resin materials can be used.

  The lower layer 33 of the substrate covers 30 and 31 may be formed over the entire surface of the upper layer 32 of the substrate covers 30 and 31 as shown in FIG. 5, or the substrate covers 30 and 31 as shown in FIG. For example, it may be formed to have a width of 10 to 15 cm only at the four end portions of the upper layer 32. Moreover, as shown in FIG. 7, it may be formed so as to have a width of, for example, 10 to 15 cm only at both end portions along the cutting direction of the substrate described later.

  The substrate covers 30 and 31 are arranged side by side with a space of 2 to 4 mm, for example.

  The substrate covers 30 and 31 are each attached to the cover arm 34 at the center of the upper surface thereof.

  Each of the cover arms 34 is provided above the scribe area. The cover arms 34 are provided so as to extend vertically from the horizontal plane and vertically. The cover arms 34 are each formed in a columnar shape having a diameter of 20 to 40 cm, for example. Each of the cover arms 34 is made of stainless steel such as iron, steel, austenite, ferrite, martensite, precipitation hardening, or the like, aluminum, aluminum alloy, copper, copper alloy, or the like.

  As shown in FIG. 3, the cover arm 34 is formed with cover arm through holes 80 and 81 penetrating the cover arm 34 laterally at the tip portions below the cover arm 34. The cover arm through holes 80 and 81 of the cover arm 34 are formed to have a diameter of 4 to 8 cm, for example.

  The lower end of the cover arm 34 is sandwiched between two trapezoidal cover arm mounting plates 82 and 83. The cover arms 34 are attached so that the lower ends of the cover arms 34 and the substrate covers 30 and 31 are spaced apart by, for example, 2 to 5 cm.

  The cover arm mounting plates 82 and 83 are fixed to the upper surfaces of the substrate covers 30 and 31 at the bottoms, respectively. The cover arm mounting plates 82 and 83 are respectively formed with mounting plate through holes 84 and 85 having a diameter of, for example, 4 to 8 cm at the center thereof. The cover arm mounting plates 82 and 83 are provided so that the mounting plate through holes 84 and 85 overlap with the cover arm through holes 80 and 81 at the front end portion of the cover arm 34, respectively. A rotating shaft 86 is attached so as to penetrate through 84 and 85.

  The cover arm 34 is connected to a control unit (not shown) and is configured to be movable up and down.

  Further, the cover arm 34 may be integrally formed with the upper layer 32 of the substrate covers 30 and 31, respectively.

  Further, the number of cover arms 34 is not limited to one for the substrate covers 30 and 31, and a plurality of cover arms 34 such as four cover arms 34 as shown in FIG.

  The substrate cutter 40 is provided above the scribe area and between the substrate covers 30 and 31. The substrate cutter 40 includes a cutting edge (cutter wheel chip 71) and a cutter head 72 attached to the upper part of the cutter wheel chip 71.

  The substrate cutter 40 is constituted by a high penetration cutter. That is, the substrate cutter 40 is configured to cut the glass substrate at once by forming deep vertical cracks in the glass substrate by the scribe.

  The cutter wheel chip 71 is formed in a disk shape and is configured to rotate about the center thereof. The cutter wheel chip 71 has, for example, an outer periphery made of cemented carbide or sintered diamond.

  The cutter head 72 is formed in a rectangular parallelepiped extending vertically. The cutter head 72 is provided with a pressure adjusting unit (not shown) that presses the blade edge against the substrate with a spring or gas pressure. The cutter head 72 is attached to a cutter arm (not shown) at the center of the upper surface thereof.

  The cutter arm is provided so as to extend vertically from the horizontal plane and up and down. The cutter arm is connected to a control device (not shown), and the cutter wheel chip 71 and the cutter wheel chip 71 along the scribe line 70 of the glass substrate 60 to be processed provided in the gap between the substrate covers 30 and 31 and the substrate covers 30 and 31. The cutter head 72 is configured to reciprocate linearly. The cutter arm is configured to move up and down in conjunction with the vertical movement of the cover arm 34.

  The cutter arm may be configured to move up and down separately from the cover arm 34.

  A pair of alignment cameras 50 and 51 for reading alignment marks previously attached to the glass substrate 60 are provided on the outer sides of the substrate covers 30 and 31. The alignment cameras 50 and 51 are respectively provided above the outer side portions of the glass substrate 60 placed on the substrate stage. The alignment cameras 50 and 51 are connected to image processing apparatuses that process the read images.

(Substrate cutting method using scribing device 10)
Next, a method for cutting the glass substrate 60 using the scribe device 10 will be described.

  First, the glass substrate 60 with an alignment mark (not shown) at the end is placed on the center of the substrate holding stage 20 in the substrate placement area. At this time, the glass substrate 60 is placed in contact with the three pin alignments on the substrate holding stage 20.

  Next, the vacuum suction device is operated to evacuate the inner space of the substrate holding stage 20, so that the glass substrate 60 is firmly fixed to the substrate holding stage 20 by the suction force from the suction holes.

  Next, the substrate holding stage 20 is conveyed along the guide rail to the camera reading position in the scribe area. At this time, since the glass substrate 60 is fixed by suction, there is no problem that the glass substrate 60 is displaced or dropped from the substrate holding stage 20 during the conveyance. This transfer is performed by a robot or the like connected to the control device.

  Subsequently, the alignment mark of the glass substrate 60 conveyed to the camera reading position in the scribe area is read by a pair of alignment cameras 50 and 51 located above both side ends of the glass substrate 60.

  Next, the image of the alignment mark read by the alignment cameras 50 and 51 is transmitted to the image processing apparatus.

  Next, the image processing apparatus that has received the image calculates the tilt of the glass with respect to the scribe line 70 by the cutter wheel chip 71.

  Subsequently, the control device moves the substrate holding stage 20 so as to correct the tilt in the X direction, the Y direction, and the θ direction based on the calculation result, thereby executing the alignment of the glass substrate 60.

  Next, the substrate holding stage 20 is transported so that the scribe start position on the glass substrate 60, that is, the tip of the scribe line 70 is positioned directly below the cutter wheel chip 71. This transfer is performed by a robot or the like connected to the control device.

  Subsequently, the substrate cutter 40 and the substrate covers 30 and 31 in the upper standby position are simultaneously lowered by controlling the cutter arm and the cover arm 34. At this time, it is possible to eliminate the loss of processing time by lowering them in conjunction with each other at the same time as compared with the case where they are lowered separately. The substrate cutter 40 is lowered to a position where the cutter wheel chip 71 that is the cutting edge contacts the upper surface of the glass substrate 60. The substrate covers 30 and 31 are lowered to a position (substrate contact position) where the contact portion formed of the elastic material of the lower layer 33 contacts the surface of the glass substrate 60. At this time, the substrate covers 30 and 31 press the glass substrate 60 with a pressure of 10 to 20 Pa, for example.

  Here, the mounting plate through holes 84 and 85 of the cover arm mounting plates 82 and 83 are provided so as to overlap with the through holes 80 and 81 at the tip of the cover arm 34, and these through holes 80, 81, 84, Since the rotation shaft 86 is attached so as to penetrate through 85, the substrate covers 30, 31 attached to the cover arm attachment plates 82, 83 are tilted around the rotation shaft 86. Therefore, when the substrate covers 30 and 31 are lowered and come into contact with the glass substrate 60, even if the glass substrate 60 is inclined, the substrate covers 30 and 31 are also inclined according to the inclination, so that the substrate cover is attached to the glass substrate 60. The entire lower surfaces of 30, 31 can be brought into contact with each other.

  In addition, as shown in FIG. 2, the substrate covers 30 and 31 cover portions of the glass substrate 60 that are used, that is, the liquid crystal display scheduled portions 90 and 91 and the periphery thereof.

  Next, the cutter wheel chip 71 is rotated while being pressed against the glass substrate 60 by the pressure (load) adjusting portion of the cutter head 72.

  Subsequently, the rotating cutter wheel chip 71 is moved along a scribe line 70 set in a portion not covered with the substrate covers 30 and 31 to cut the glass substrate 60. At this time, cullet such as glass powder or small glass pieces is generated and scattered by cutting the glass substrate 60, but since the surface of the glass substrate 60 is covered with the substrate covers 30, 31, this cullet is formed on the glass substrate 60. Does not adhere to the surface.

  Next, the substrate cutter 40 and the substrate covers 30 and 31 are simultaneously raised by controlling the cutter arm and the cover arm 34.

  Subsequently, the substrate holding stage 20 is moved so that the tip of the next scribe line 70 is positioned directly below the cutter wheel chip 71.

  Next, similarly to the above, the substrate cutter 40 and the substrate covers 30 and 31 are again lowered simultaneously by controlling the cutter arm and the cover arm 34 to rotate the cutter wheel chip 71, along the scribe line 70. The glass substrate 60 is cut | disconnected by moving.

  Next, the glass substrate 60 is cut along all the scribe lines 70 by sequentially performing the same operation as described above to the next scribe line 70. At this time, the glass substrate 60 is divided into a desired size.

  After cutting the glass substrate 60 along the last scribe line 70, the rotation of the cutter wheel chip 71 of the substrate cutter 40 is stopped.

  Subsequently, the substrate cutter 40 and the substrate covers 30 and 31 are simultaneously raised by controlling the cutter arm and the cover arm 34. The raised substrate cutter 40 and the substrate covers 30 and 31 are moved to the standby positions, respectively.

  Next, the cut glass substrate 60 and the substrate holding stage 20 are transported to the substrate placement area along the guide rail. At this time, since the glass substrate 60 is fixed by suction, there is no problem that the glass substrate 60 is displaced or dropped from the substrate holding stage 20 during the conveyance. This transfer is performed by a robot or the like connected to the control device.

  Next, evacuation from the vacuum suction device connected to the substrate holding stage 20 is stopped. Thereby, the suction fixation of the glass substrate 60 by the substrate holding stage 20 is released.

  Next, the glass substrate 60 whose suction fixation is released is taken out from the substrate holding stage 20.

  Thus, the cutting process of the glass substrate 60 is completed.

  Here, the operations of the substrate holding stage 20, the robot, the vacuum suction device, the cover arm 34, the cutter arm, and the cutter wheel chip 71 are controlled by the control unit.

  Moreover, in order to clarify the difference with the conventional cutting method about the cutting method of the glass substrate 60 which concerns on this embodiment shown above, the flowchart which concerns on each cutting method was shown to FIG.

  As is clear from comparison of these flowcharts, the cutting method according to the present embodiment moves the substrate holding stage 20 on which the glass substrate 60 is placed to the scribe line 70 and then moves the substrate cutter compared to the conventional method. There is a great difference in that the substrate covers 30 and 31 are brought into contact with the surface of the glass substrate 60 before the glass substrate 60 is cut at 40.

  In the above embodiment, the substrate holding stage 20 is horizontal and the substrate covers 30 and 31 and the substrate cutter 40 are positioned above the substrate holding stage 20, but the substrate holding stage 20 is vertical. In addition, the substrate covers 30 and 31 and the substrate cutter 40 may be provided so as to be located on the same side. In this case, the substrate covers 30 and 31 and the substrate cutter 40 are configured to move horizontally from the standby position to the substrate contact position. Moreover, since the board | substrate cover 30 and 31 and the board | substrate cutter 40 press the one side surface with a predetermined pressure, the other side surface is supported by the support stand etc. so that it can endure it.

  In the above embodiment, the substrate cutter 40 is composed of a high penetration cutter, so that a deep vertical crack is formed in the glass substrate 60 with the scribe and is cut at a stroke. It does not have to be. That is, by using a cutter that only cuts the surface of the glass substrate 60 and draws a score line, and further combines a breaker (splitting device) for dividing the glass substrate 60 by applying pressure from the back side, The glass substrate 60 may be cut.

  Even in this case, it is the same that the surface of the glass substrate 60 is covered with the substrate covers 30 and 31 before the engraved line is drawn on the glass substrate by the cutter.

  Furthermore, the substrate subjected to the cutting process by the scribing apparatus 10 may be a substrate made of not only glass but also various other materials. For example, it may be a substrate formed of various semiconductor materials such as quartz, gallium arsenide, or silicon, or ceramics such as sapphire or boron nitride.

  In the present embodiment, the scribing apparatus 10 and the cutting method related to the cutting of the glass substrate 60 in the manufacturing process of the LCD (liquid crystal display) have been described. However, a plasma display panel (PDP), Related to cutting of glass substrates and the like performed in the manufacturing process of organic EL (organic electroluminescence), FED (field emission display), or SED (surface-conduction electron-emitter display) It may be.

(Function and effect)
Next, the function and effect will be described.

  The scribing apparatus 10 according to the present embodiment is provided facing the substrate holding stage 20 that holds the glass substrate 60 and the substrate holding surface of the substrate holding stage 20, and is separated from the glass substrate 60 held by the substrate holding stage 20. The substrate holding stage 20 and the substrate covers 30 and 31 configured to be movable between the standby position and the substrate contact position that contacts the glass substrate 60 held on the substrate holding stage 20 and covers the use portion. And a substrate cutter 40 that cuts a portion of the glass substrate 60 that is not covered by the substrate covers 30 and 31.

  According to such a configuration, the glass substrate 60 is cut by the substrate cutter 40 in a state where the used portion of the glass substrate 60 is covered with the substrate covers 30 and 31. For this reason, the glass powder of the glass substrate 60, the small glass piece, etc. which were generated by cutting do not adhere to the utilization part of the glass substrate 60. Therefore, these foreign substances do not adhere to the utilization part of the glass substrate 60 in the subsequent process, and it can be suppressed that the manufacturing yield is lowered due to the defective foreign substances.

  In the scribing apparatus 10 according to the present invention, the lower layer 33 (substrate contact portion) of the substrate covers 30 and 31 may be formed of an elastic material.

  According to such a configuration, when the substrate covers 30 and 31 come into contact with the glass substrate 60, the lower layer 33 of the substrate covers 30 and 31 is formed of an elastic material. Damage to the substrate surface due to contact with the substrate 60 can be suppressed.

  Furthermore, the scribing apparatus 10 according to the present invention may be configured such that the lower layer 33 (substrate contact portion) of the substrate covers 30 and 31 can tilt.

  According to such a configuration, even if the glass substrate 60 held on the substrate holding stage 20 is not horizontal but inclined, the lower layer 33 of the substrate covers 30 and 31 is configured to be tiltable. The glass substrate 60 can be brought into contact with the inclination of the glass substrate 60 to cover the use portion.

  The method for cutting the glass substrate 60 according to the present invention includes a step of holding the glass substrate 60 on the substrate holding stage 20, and a step of covering the use portions of the glass substrate 60 held on the substrate holding stage 20 with substrate covers 30 and 31. And a step of cutting portions of the glass substrate 60 that are not covered with the substrate covers 30 and 31.

  According to such a configuration, the glass substrate 60 is cut by the substrate cutter 40 in a state where the used portion of the glass substrate 60 is covered with the substrate covers 30 and 31. For this reason, the glass powder of the glass substrate 60, the small glass piece, etc. which were generated by cutting do not adhere to the utilization part of the glass substrate 60. Therefore, these foreign substances do not adhere to the utilization part of the glass substrate 60 in the subsequent process, and it can be suppressed that the manufacturing yield is lowered due to the defective foreign substances.

  As described above, the present invention is useful for a scribing apparatus used for substrate cutting processing and a substrate cutting method using the scribing device.

1 is a schematic view of a scribe device 10 according to an embodiment of the present invention. It is the schematic which shows the scribe line 70 set to the glass substrate 60 covered with the substrate covers 30 and 31. FIG. FIG. 3 is a perspective view of substrate covers 30 and 31 and a cover arm 34 according to an embodiment of the present invention. It is the schematic of the board | substrate covers 30 and 31 to which the cover arm 34 comprised by four was attached. It is the schematic which shows the back surface of the lower layer 33 of the board | substrate covers 30 and 31 which concern on embodiment of this invention. It is the schematic which shows the back surface of the substrate covers 30 and 31 in which the lower layer 33 was formed only in the edge part of the back surface. It is the schematic which shows the back surface of the substrate covers 30 and 31 in which the lower layer 33 was formed only in the edge part of the both sides of a back surface. It is a side view of the board | substrate covers 30 and 31 in which the lower layer 33 was formed only in the edge part of the back surface. It is a side view of the board | substrate covers 30 and 31 in which the lower layer 33 was formed only in the edge part of the both sides of a back surface. It is a flowchart which shows the outline of the cutting method of the glass substrate 60 by the conventional scribe apparatus. It is a flowchart which shows the outline of the cutting method of the glass substrate 60 by the scribing apparatus 10 which concerns on embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Scribing apparatus 20 Substrate holding stage 30, 31 Substrate cover 32 Upper layer 33 Lower layer 34 Cover arm 40 Substrate cutter 80, 81 Cover arm through hole 84, 85 Mounting plate through hole 86 Rotating shaft

Claims (4)

A substrate holding stage for holding the substrate;
A standby position provided opposite to the substrate holding surface of the substrate holding stage, separated from the substrate held on the substrate holding stage, and a substrate that abuts on the substrate held on the substrate holding stage and covers the use portion A substrate cover member configured to be movable between contact positions;
Substrate cutting means for cutting a portion of the substrate held by the substrate holding stage that is not covered by the substrate cover member;
A scribing device with The scribing device according to claim 1, wherein
The substrate cover member is a scribing device in which a substrate contact portion is formed of an elastic material. The scribing device according to claim 1, wherein
The substrate cover member is a scribe device in which a substrate contact portion is configured to be tiltable. Holding the substrate on a substrate holding stage;
Covering the used portion of the substrate held by the substrate holding stage with a substrate cover member;
Cutting a portion of the substrate not covered with the substrate cover member;
A method for cutting a substrate comprising:

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