JP2007005587A - Electronic component, manufacturing method thereof, mounting structure, electro-optical device and electronic apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component easy to manufacture and having superior electrical conduction reliability of bumps with a reduced pitch, a manufacturing method thereof, a mounting structure, an electro-optical device and an electronic apparatus that is equipped therewith. <P>SOLUTION: The process for forming bumps 17 comprises the steps of forming (S3) an exposure portion 36 in a resist 35 by removing the resist 35 applied to the regions, wherein the bumps 17 are to be formed in the resist 35 applied to a silicon chip 14; arranging (S4) resin grains 23 in the exposing portions 36; and filling (S5) the exposure portions 36, wherein the resin grains 23 are arranged with conductive members 24, etc. Accordingly, the conductive members 24 exist only in the bumps 17 and conductive grains etc. can be made not to exist in an adhesive 45, and a liquid crystal device 1 can be manufactured, capable of preventing the electrical contact between the counterpart bumps 17 via e.g. conductive grains etc. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an electronic device such as a personal computer or a cellular phone, and an electronic component, a mounting structure, an electro-optical device, and an electronic component manufacturing method used in these electronic devices.

  Conventionally, for example, a liquid crystal device or the like as an electro-optical device has been used as a display device of an electronic apparatus such as a personal computer or a mobile phone. For example, a driver IC (Integrated Circuit) is mounted on a glass substrate side of a liquid crystal panel via an ACF (Anisotropic Conductive Film) containing conductive particles such as gold and silver. However, since the conductive particles are connected while maintaining the original shape even when pressed during thermocompression bonding, for example, it is difficult to ensure a sufficient contact area between the conductive particles and the connection terminals of the driver IC. was there.

In order to solve this problem, for example, by mixing conductive particles made of conductive rubber containing metal in rubber or the like into an insulating adhesive, the driver IC is pressed against the glass substrate to elastically deform the conductive particles. Thus, a technique for increasing the contact area and preventing the occurrence of defective conduction is disclosed. (For example, refer to Patent Document 1).
JP-A-5-182516 (paragraph [0007], FIG. 1).

  However, in the above-described technology, for example, conductive particles are mixed in ACF or the like, so that leakage between terminals via the conductive particles occurs with the narrowing of the pitch of terminals such as electronic components. There is a problem.

  The present invention has been made in view of the above-described problems, and is easy to manufacture. The electronic component is excellent in the conductive reliability of bumps with a narrow pitch, the manufacturing method of the electronic component, the mounting structure, and the electro-optical device. And an electronic apparatus including the electro-optical device.

  In order to achieve the above object, an electronic component according to a main aspect of the present invention is electrically connected to a bump having elastic particles and a conductive member provided so as to cover the elastic particles, and the conductive member. Wiring.

  In the present invention, since a bump having an elastic particle and a conductive member provided so as to cover the elastic particle is provided, for example, when an electronic component is mounted on a substrate via an adhesive that does not include the conductive particle. In order to prevent leakage when an electronic component is mounted on a substrate using an anisotropic conductive film containing conductive particles, for example, a conductive member is present only in the bump and no conductive particles are present in the adhesive. Even when the pitch is narrower than the necessary pitch between the bumps, electrical contact between the bumps can be prevented. Therefore, it is possible to obtain an electronic component that is excellent in the conductive reliability of bumps with a narrow pitch.

  Further, for example, since the spherical elastic particles are arranged at positions where the bumps are formed and the conductive member is provided around the elastic particles, the bumps can be formed.

  Furthermore, since the conductive member is provided only at the position where the bump is formed, for example, the amount of the conductive member used is reduced, or an inexpensive adhesive that does not contain conductive particles or the like is used as an adhesive. Can be achieved. Since elastic particles are contained in the bumps, the bumps are elastically deformed when the electronic component is pressure-bonded to the substrate, and the conductive area of the bumps and the wiring side on the substrate side are secured, for example. Sex can be secured.

  According to an aspect of the present invention, the bump has a connection surface connected to a mounted member on which the electronic component is mounted, and at least a part of the connection surface and the wiring are electrically connected. It is connected. Accordingly, the bump has a connection surface connected to the mounted member on which the electronic component is mounted, and at least a part of the connection surface and the wiring are electrically connected. When crimped and mounted on the mounting member, the elastic particles can be effectively elastically deformed to achieve electrical connection between the connection surface and the wiring.

  A mounting structure according to another aspect of the present invention includes a bump having elastic particles and a conductive member provided so as to cover the elastic particles, and a wiring electrically connected to the conductive member. An electronic component and a substrate on which the electronic component is mounted are provided.

  In the present invention, since a bump having an elastic particle and a conductive member provided so as to cover the elastic particle is provided, for example, when an electronic component is mounted on a substrate via an adhesive that does not include the conductive particle. In order to prevent leakage when an electronic component is mounted on a substrate using an anisotropic conductive film containing conductive particles, for example, a conductive member is present only in the bump and no conductive particles are present in the adhesive. Even when the pitch is narrower than the necessary pitch between the bumps, electrical contact between the bumps can be prevented. Therefore, it is possible to obtain a mounting structure excellent in the conductive reliability of the narrowed bumps. In addition, for example, a mounting structure in which small and high-performance electronic components are mounted on a substrate can be obtained.

  Further, for example, since the spherical elastic particles are arranged at positions where the bumps are formed and the conductive member is provided around the elastic particles, the bumps can be formed.

  Furthermore, since the conductive member is provided only at the position where the bump is formed, for example, the amount of the conductive member used is reduced, or an inexpensive adhesive that does not contain conductive particles or the like is used as an adhesive. Can be achieved. Since elastic particles are contained in the bumps, the bumps are elastically deformed when the electronic component is pressure-bonded to the substrate, and the conductive area of the bumps and the wiring side on the substrate side are secured, for example. Sex can be secured. Therefore, it is possible to obtain a mounting structure excellent in the conductive reliability of the narrowed bumps. For example, even if an external force that causes connection failure between the conductive member of the bump and the wiring on the substrate side, for example, acts on the substrate or electronic component of the mounting structure, the conductive member of the bump contacts the wiring on the substrate side, for example Since the area is secured, it is possible to provide a mounting structure capable of preventing the occurrence of connection failure.

  An electro-optical device according to another aspect of the present invention includes a bump having elastic particles and a conductive member provided so as to cover the elastic particles, and a wiring electrically connected to the conductive member. An electronic component and an electro-optical panel having a substrate on which the electronic component is mounted are provided.

  In the present invention, since a bump having an elastic particle and a conductive member provided so as to cover the elastic particle is provided, for example, when an electronic component is mounted on a substrate via an adhesive that does not include the conductive particle. In order to prevent leakage when an electronic component is mounted on a substrate using an anisotropic conductive film containing conductive particles, for example, a conductive member is present only in the bump and no conductive particles are present in the adhesive. Even when the pitch is narrower than the necessary pitch between the bumps, electrical contact between the bumps can be prevented. Therefore, it is possible to obtain an electro-optical device that is excellent in the conductive reliability of bumps with a narrow pitch. In addition, since the electro-optical device includes, for example, an electro-optical panel in which small and high-performance electronic components are mounted on a substrate, the display quality of the electro-optical device can be improved, for example.

  Further, for example, since the spherical elastic particles are arranged at positions where the bumps are formed and the conductive member is provided around the elastic particles, the bumps can be formed.

  Furthermore, since the conductive member is provided only at the position where the bump is formed, for example, the amount of the conductive member used is reduced, or an inexpensive adhesive that does not contain conductive particles or the like is used as an adhesive. Can be achieved. Since elastic particles are contained in the bumps, the bumps are elastically deformed when the electronic component is pressure-bonded to the substrate, and the conductive area of the bumps and the wiring side on the substrate side are secured, for example. Sex can be secured. Therefore, it is possible to obtain an electro-optical device that is excellent in the conductive reliability of bumps with a narrow pitch. For example, even if an external force that causes a connection failure between the conductive member of the bump and the substrate side of the electro-optical panel, for example, the wiring acts on the substrate of the electro-optical panel, the conductive member of the bump and the wiring on the substrate side, for example, Since the contact area is secured, the occurrence of poor connection can be prevented, and the display quality of the electro-optical device can be secured.

  An electronic apparatus according to another aspect of the invention includes the above-described electro-optical device.

  In the present invention, since an electro-optical device including an electronic component that is easy to manufacture and has excellent conductive reliability of bumps with a narrow pitch is provided, for example, an electronic device having excellent display performance can be obtained. .

  A method for manufacturing an electronic component according to another aspect of the present invention is a method for manufacturing an electronic component having a bump provided on a base material, wherein the step of forming the bump includes elastic particles in a region where the bump is formed. And a step of covering the elastic particles with a conductive member.

  In the present invention, the step of forming the bump includes a step of arranging the elastic particles in the region where the bump is formed and a step of covering the elastic particle with the conductive member. For example, the elastic particle is formed in the region where the bump is formed. Can be manufactured by covering the elastic particles with the conductive member and, for example, when mounting an electronic component on the substrate via an adhesive that does not contain conductive particles, The pitch between bumps necessary to prevent leakage when mounting electronic components on a substrate using an anisotropic conductive film containing conductive particles, for example, can be present to prevent the presence of conductive particles in the adhesive. Even when the pitch is narrower, for example, it is possible to manufacture an electronic component by preventing electrical contact between bumps.

  The method for manufacturing an electronic component according to another aspect of the present invention is a method for manufacturing an electronic component having a bump provided on a base material, wherein the step of forming the bump is a step of applying a resist to the base material. And removing the resist applied to the region where the bump is to be formed from the resist applied to the base material, thereby forming an exposed portion of the base material on the resist, and elastic particles on the exposed portion. , A step of filling the exposed portion where the elastic particles are arranged with a conductive member, and a step of removing the resist applied to the base material.

  In the present invention, the step of forming the bump includes the step of forming the exposed portion of the base material on the resist by removing the resist applied to the region where the bump is to be formed from the resist applied to the base material. Including a step of placing elastic particles in the portion, a step of filling the exposed portion where the elastic particles are arranged with a conductive member, and a step of removing the resist applied to the base material. When an electronic component is mounted on a substrate via a non-adhesive, the conductive member can be present only in the bumps and the conductive particles can be prevented from being present in the adhesive. For example, an anisotropic conductive film containing conductive particles Even when the pitch is narrower than the pitch required between the bumps necessary for preventing leakage when mounting the electronic component on the substrate using, for example, the electronic component can be manufactured by preventing electrical contact between the bumps. so That.

  Further, for example, since the spherical elastic particles are arranged at positions where the bumps are formed and the conductive member is provided around the elastic particles, the bumps can be formed.

  Furthermore, since the conductive member is disposed only at the position where the bump is formed, for example, the amount of the conductive member used is reduced, or an inexpensive adhesive that does not contain conductive particles or the like is used as an adhesive to reduce the cost. Can be planned. In addition, since elastic particles can be included in the bump, for example, when the electronic component is pressure-bonded to the substrate, the bump is elastically deformed to secure a contact area between the conductive member of the bump and the wiring of the electronic component. Sex can be secured.

  According to one aspect of the present invention, before the step of applying a resist to the base material, the method further includes a step of forming a conductive portion in a region where the bump of the base material is formed, and the exposed portion is elastic. The step of arranging the particles is characterized in that the elastic particles are electrostatically adsorbed to the conductive portion by charging the conductive portion and the elastic particles to opposite charges. Thus, before the step of applying the resist to the base material, the method further includes the step of forming the conductive portion in the region where the bumps of the base material are formed, and the step of arranging the elastic particles in the exposed portion is elastic with the conductive portion. By charging the particles to the opposite charge, the elastic particles are electrostatically adsorbed to the conductive portion, so that the elastic particles can be easily and selectively disposed in the exposed portion of the resist using, for example, a force due to static electricity.

  According to one form of this invention, the process of arrange | positioning an elastic particle to the said exposed part inject | emits the said elastic particle to the said exposed part, It is characterized by the above-mentioned. As a result, the step of disposing the elastic particles in the exposed portion injects the elastic particles into the exposed portion, so that it is possible to eliminate the manufacturing process of forming the conductive portion in order to use an electric force, for example, and the cost is low. In addition, the elastic particles can be selectively arranged on the exposed portion by injecting the elastic particles so as to aim at the exposed portion.

  According to one aspect of the present invention, the step of filling the exposed portion with the conductive member is performed by immersing the conductive portion provided on the base material and connected to the conductive member in a plating solution in a plating tank. It is characterized by performing by. Thus, the step of filling the exposed portion with the conductive member is performed by plating by immersing the conductive portion provided on the base material and connected to the conductive member in the plating solution in the plating tank. The conductive portion used when arranging the conductive member can be used as an electrode for plating, and the conductive member can be reliably filled in the exposed portion while suppressing an increase in manufacturing cost.

  According to one aspect of the present invention, the step of filling the exposed portion with the conductive member uses the resist remaining without being removed on the substrate in the step of forming the exposed portion in the resist as a mask. The conductive member is printed. As a result, the step of filling the exposed portion with the conductive member prints the conductive member using the resist remaining without being removed from the base material in the step of forming the exposed portion in the resist, so a new mask is formed. It is not necessary to reduce the manufacturing time and cost, and for example, the exposed portion can be directly and surely filled with the conductive member. Can be planned.

  According to an aspect of the present invention, the step of filling the exposed portion with the conductive member injects the conductive member into the exposed portion where the elastic particles are disposed. Thus, the step of filling the exposed portion with the conductive member injects the conductive member into the exposed portion where the elastic particles are arranged. For example, the conductive member can be injected so as to aim at the exposed portion, which is useless. Cost reduction can be achieved by reducing the amount of the conductive member.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following description of the embodiments, a liquid crystal device as an electro-optical device, specifically, a reflective transflective TFT (Thin Film Transistor) active matrix liquid crystal device, and an electronic device using the liquid crystal device Although the electronic component mounted in the apparatus and the liquid crystal device will be described, the present invention is not limited to this. Moreover, in the following drawings, in order to make each structure easy to understand, the actual structure and the scale and number of each structure are different.

  (First embodiment)

  1 is a schematic perspective view of a liquid crystal device according to a first embodiment of the present invention, FIG. 2 is a cross-sectional view taken along line AA of the liquid crystal device of FIG. 1, and FIG. 3 is a partially enlarged plan view of a driver IC of the liquid crystal device of FIG. FIG.

  (Configuration of liquid crystal device)

  The liquid crystal device 1 includes a liquid crystal panel 2 and a circuit board 3 connected to the liquid crystal panel 2. The liquid crystal device 1 is provided with other auxiliary mechanisms such as a frame (not shown) that supports the liquid crystal panel 2 as necessary.

  The liquid crystal panel 2 includes a substrate 4, a substrate 5 provided to face the substrate 4, a sealing material 6 provided between the substrates 4 and 5, and a liquid crystal (not shown) sealed by the substrates 4 and 5. It has. For example, TN (Twisted Nematic) is used for the liquid crystal.

  The substrate 4 and the substrate 5 are plate-shaped members made of a light-transmitting material such as glass or synthetic resin. A gate electrode 7, a source electrode 8, a thin film transistor element T and a pixel electrode 9 are formed on the liquid crystal side of the substrate 4, and a common electrode 5 a is formed on the liquid crystal side of the substrate 5.

  The gate electrode 7 is formed in the X direction, and the source electrode 8 is formed in the Y direction, for example, by a metal material such as aluminum. The source electrode 8 is formed, for example, as shown in FIG. 1, with the upper half routed to the left side and the lower half routed to the right side. Note that the number of the gate electrodes 7 and the source electrodes 8 can be appropriately changed according to the resolution of the liquid crystal device 1 and the size of the display area.

  The thin film transistor element T includes three terminals that are electrically connected to the gate electrode 7, the source electrode 8, and the pixel electrode 9, respectively. The thin film transistor element T is electrically connected to the pixel electrode 9, the gate electrode 7, and the source electrode 8. Thus, a current flows from the source electrode 8 to the pixel electrode 9 or vice versa when a voltage is applied to the gate electrode 7.

  In addition, the substrate 4 includes a region (hereinafter referred to as “projected portion”) 4 a that projects from the outer edge of the substrate 5. On the surface of the projecting portion 4a, for example, a Y driver IC 11 and X driver ICs 12 and 13 are mounted as electronic components for driving the liquid crystal.

  As shown in FIG. 2, the Y driver IC 11 includes a silicon chip 14 and, for example, an aluminum input terminal 15, an output terminal 16, an input terminal 15, and an output provided on the surface of the silicon chip 14 facing the substrate 4. A bump 17 is provided which is electrically connected to the terminal 16 and protrudes from the mounting surface side of the Y driver IC 11, and wirings 55 and 56 each having one end connected to the input terminal 15 and the output terminal 16.

  The silicon chip 14 is, for example, a substantially rectangular chip, and a plurality of input terminals 15 and output terminals 16 are arranged in the Y direction at intervals a, for example, as shown in FIG. ing. The interval a is set to 10 μm, for example. As shown in FIG. 2, the surface of the silicon chip 14 facing the substrate 4 is covered with a passivation 18 except for the central portion of the input terminal 15 and the output terminal 16, for example.

  The input terminal 15 and the output terminal 16 have, for example, a substantially rectangular shape, and are provided at substantially equal intervals in the Y direction. A seed layer 20 in which a TiW layer 21 and an Au layer 22 are laminated is formed on the substrate 4 side of the input terminal 15 and the output terminal 16 as shown in FIG. The TiW layer 21 and the Au layer 22 are provided, for example, with the outer edge portion overlapping the passivation 18.

  As shown in FIG. 3, the bump 17 has a width b in the Y direction of 20 μm, for example. As shown in FIG. 2, the bump 17 includes, for example, resin particles 23 as substantially spherical elastic particles, and a conductive member 24 provided so as to cover the resin particles 23.

  The resin particles 23 have elasticity, and can be elastically deformed, for example, when the Y driver IC 11 is mounted on the substrate 4. For example, the resin particles 23 are provided in a state of being crushed in the Z direction. If the silicon chip 14 of the Y driver IC 11 and the substrate 4 are separated for some reason after mounting, the resin particles 23 follow the change in the distance between the silicon chip 14 and the substrate 4 and attempt to return to the original shape. Therefore, the electrical connection between the Y driver IC 11 and the substrate 4 can be maintained. The diameter of the resin particle 23 before being crushed is, for example, 15 μm. As shown in FIG. 2, the width c in the X direction of the opening of the passivation 18 corresponding to the input terminal 15 and the output terminal 16, the TiW layer 21, and the Au layer 22 The width d and width e in the X direction overlapping the passivation 18 can be changed as appropriate. For example, the lengths of the width c, the width d, and the width e are set to about 7 μm, 6 μm, and 6 μm, for example. Each bump 17 includes, for example, one resin particle 23. Note that the number of resin particles 23 included in the bump 17 is not limited to one, and may be included, for example.

  The conductive member 24 is connected to the input terminal 15 and the output terminal 16 through the Au layer 22 and the TiW layer 21, respectively, and is connected to the wirings 25 and 26, respectively. As a constituent material of the conductive member 24, for example, a metal material such as gold, silver, copper, or nickel is used. In this way, the wiring 25 provided on the substrate 4 is connected to the input terminal 15 via the bump 17 on the input side of the Y driver IC 11, and provided on the substrate 4 via the bump 17 on the output side of the Y driver IC 11. The connected wiring 26 is connected to the output terminal 16. In the present embodiment, the conductive member 24 is connected to the input terminal 25 over substantially the entire connection surface 24a. However, at least a part of the connection surface 24a of the bump 17 is electrically connected to the wiring 55. What should I do?

  For example, the other ends of the wires 55 and 56 are connected to an electronic circuit such as a transistor (not shown) provided in the silicon chip 14. The wirings 55 and 56 are electrically connected to the bumps 17.

  The Y driver IC 11 is bonded to the substrate 4 with an adhesive 45 made of, for example, an epoxy resin provided between the Y driver IC 11 and the substrate 4. The Y driver IC 11 is sealed with an adhesive 45.

  Note that wirings 27 and 28 provided on the substrate 4 as shown in FIG. 1 are connected to input / output terminals (not shown) of the X driver IC 12 via input / output bumps (not shown) of the X driver IC 12, respectively. Wirings 29 and 30 provided on the substrate 4 are connected to input / output terminals (not shown) of the X driver IC 13 via input / output bumps (not shown). The wiring 26 is electrically connected to the gate electrode 7, and the wirings 28 and 30 are electrically connected to the source electrode 8.

  As shown in FIG. 1, the circuit board 3 is connected to the overhanging portion 4a via an adhesive or the like, for example. The circuit board 3 is mounted on the flexible base material 31 in order to control the flexible base material 31, the output wiring 32 provided on the flexible base material 31, the input wiring 33, the Y driver IC 11, and the like. And a semiconductor IC 34.

  For example, a semiconductor IC 34 is mounted on the flexible base 31, and a semiconductor IC for power supply and the like that are not shown are also mounted.

  As shown in FIG. 1, the output wiring 32 is routed in the X direction, for example, and one end of a connection member provided in a through hole formed in the flexible base 31 and not shown. And connected to the end of the wiring 25 by ACF or the like. The other end of the output wiring 32 is connected to an output terminal (not shown) of the semiconductor IC 34 via an ACF or the like.

  As shown in FIG. 1, the input wiring 33 is routed, for example, in the X direction. As shown in FIG. 1, one end of the input wiring 33 is connected to, for example, an input terminal (not shown) of the semiconductor IC 34 via an ACF or the like. The other end of the input wiring 33 is connected to an external device (not shown), for example.

  (Manufacturing method of liquid crystal device)

  Next, a method for manufacturing the liquid crystal device 1 will be described with reference to the drawings.

  FIG. 4 is a flowchart showing a manufacturing process of the liquid crystal device 1 of the first embodiment. In the present embodiment, the process of manufacturing the silicon chip 14 in which the central portions of the input / output terminals 15 and 16 shown in FIG. 5 are exposed from the opening of the passivation 18 and the process of manufacturing the liquid crystal panel 2 in step 8 are described. Since this is the same as the known technique, its description is omitted.

  First, a seed layer 20 made of a TiW layer 21 and an Au layer 22 is formed by sputtering, for example, by sputtering so as to cover the surface of the silicon chip 14 shown in FIG. 5 where the input / output terminals 15 and 16 are exposed. Form (S1). At this time, for example, the TiW layer 21 covers the surface of the silicon chip 14 on the input terminal 15 and output terminal 16 side, and the Au layer 22 covers the TiW layer 21. As a result, steps along the steps formed by the input terminal 15, the output terminal 16, and the passivation 18 are formed in the TiW layer 21 and the Au layer 22.

  Next, the Au layer 22 is covered with a resist 35 as shown in FIG. 7 (S2). At this time, the thickness of the resist 35 in the Z direction is appropriately changed according to, for example, the diameter of the resin particles 23.

  Next, the resist 35 applied to the region where the bumps 17 are formed is removed from the resist 35 applied to the Au layer 22 of the silicon chip 14 as the base material, thereby exposing the resist 35 as shown in FIG. The part 36 is formed (S3). As a result, the Au layer 22 is exposed from the exposed portion 36. The exposed portion 36 has a shape in which at least one resin particle 23 can be disposed.

  Subsequently, as shown in FIG. 9, the seed layer 20 is connected to the negative electrode (not shown) via the wiring 37, the cylindrical member 38 is connected to the positive electrode, and the voltage is applied to the resin particles 23 passing through the cylindrical member 38, for example. Is applied, and the positively charged resin particles 23 are selectively arranged (spread) from the tubular member 38 to the exposed portion 36 by electrostatic force (S4). Thereby, for example, one resin particle 23 is arranged in each exposed portion 36.

  Next, for example, by performing a gold plating process using the electrolytic plating apparatus 40 shown in FIG. 10, the exposed portion 36 where the resin particles 23 are arranged is filled with the conductive member 24 as shown in FIG. 11 (S5). For example, the silicon chip 14 shown in FIG. 9 is immersed in the plating solution 43 in the plating tank 41 of the electroplating apparatus 40, and the plating anode 42 of the electroplating apparatus 40 is used as the positive electrode via the wiring 44. Is plated as a negative electrode through the wiring 37, for example. At this time, at least a part of the connection surface 24 a of the bump 17 shown in FIG. 2 may be electrically connected to the wiring 55.

  Subsequently, as shown in FIG. 12, the applied resist 35 is removed (S6). As a result, the seed layer 20 provided in a region other than the bump 17 is exposed.

  Next, as shown in FIG. 13, the exposed seed layer 20 is removed (S7).

  On the other hand, after manufacturing the liquid crystal panel 2 (S8), the Y driver IC 11 is pressure-bonded to the liquid crystal panel 2 and mounted (S9). At this time, for example, the Y driver IC 11 and the substrate 4 of the liquid crystal panel 2 are bonded by an adhesive 45 made of an epoxy resin or the like not including conductive particles without using an adhesive film such as ACF including conductive particles. Thereby, the Y driver IC 11 is sealed with the adhesive 45.

  Then, the liquid crystal device 1 is manufactured by connecting the substrate 4 of the liquid crystal panel 2 and the circuit board 3 on which the semiconductor IC 13 is mounted with an adhesive or the like and providing a polarizing plate, a backlight unit, or the like (S10).

  This is the end of the description of the method for manufacturing the liquid crystal device 1.

  As described above, according to the present embodiment, the step of forming the bump 17 is performed by removing the resist 35 applied to the region where the bump 17 is formed from the resist 35 applied to the silicon chip 14. A step (S3) of forming the exposed portion 36, a step (S4) of placing the resin particles 23 on the exposed portion 36, a step of filling the exposed portion 36 in which the resin particles 23 are placed with the conductive member 24 (S5), and And the step (S6) of removing the resist 35 applied to the silicon chip 14, the conductive member 24 can be present only in the bump 17 and the conductive particles and the like can be prevented from being present in the adhesive 45. For example, when the Y driver IC 11 is mounted on the substrate 4 using an anisotropic conductive film containing conductive particles, the pitch is narrower than the pitch between bumps necessary to prevent leakage. Also, it is possible to manufacture the liquid crystal device 1, for example a bump 17 electrically contact each other through the conductive particles or the like can be prevented.

  In addition, the bumps 17 can be formed simply by placing the spherical resin particles 23 on the exposed portion 36 and filling the conductive member 24 around the resin particles 23 in the exposed portion 36, so that manufacturing is easy. It becomes.

  Further, since the conductive member 24 is formed only at the position where the bump 17 is formed, for example, the amount of the conductive member 24 used can be reduced or the conductive particles 24 can be reduced as compared with the case where the ACF is used as in the prior art. The cost can be reduced by using a simple adhesive 45.

  Further, since the resin particles 23 are contained in the bumps 17, for example, when the Y driver IC 11 is pressure-bonded to the substrate 4, the bumps 17 are elastically deformed, and the conductive members 24 of the bumps 17 and the wirings 25 of the Y driver ICs 11 are It is possible to ensure the conductivity by securing the contact area with the.

  Furthermore, before the step (S2) of applying the resist 35 to the silicon chip 14, a step (S1) of forming the seed layer 20 connected to the conductive member 24 on the silicon chip 14 is provided. In the step (S4) of disposing 23, the seed layer 20 and the resin particles 23 are charged to opposite charges, so that the resin particles 23 are placed in the exposed portions 36 of the resist 35 by electrostatic adsorption using, for example, electrostatic force. Can be arranged.

  Further, the step (S5) of filling the exposed portion 36 with the conductive member 24 is performed by plating by immersing the seed layer 20 in the plating solution 43 in the plating tank 41. For example, the resin particles 23 are disposed on the exposed portion 36. The seed layer 20 used in this process can be used as an electrode for plating, and the conductive member 23 can be reliably filled in the exposed portion 36 while suppressing an increase in manufacturing cost.

  Furthermore, since the bump 17 is large enough to contain one resin particle 23, the resin particle 23 can be efficiently elastically deformed when the Y driver IC 11 is pressure-bonded to the wiring 25 of the substrate 4, for example. In addition, the connection reliability between the bumps 17 and the wirings 25 can be further improved, and the cost can be reduced by reducing the amount of resin particles 23 used. It should be noted that a wide variety of bumps such as a bump in which a large number of resin particles are covered with a conductive member may be formed by making the bumps large enough to contain a plurality of resin particles. Further, a driver IC is used in which at least a part of the connection surface 24a of the bump 17 shown in FIG. 2 is electrically connected to the wiring 55 (the resin particles 23 are exposed from the connection surface 24a of the bump 17). Even in this case, for example, the wiring 25 and the wiring 55 can be electrically connected in the same manner.

  (First modification)

  Next, a manufacturing method of the liquid crystal device 1 of the first modification according to the present invention will be described. In addition, after this modification, the same code | symbol is attached | subjected to the same component as the said embodiment, the description is abbreviate | omitted, and it demonstrates centering on a different location.

  As for the manufacturing process of this modification example, only step 5 is different from the first embodiment, and therefore step 5 will be described.

  In the first embodiment, the conductive member 24 is formed in the exposed portion 36 by performing gold plating using the electrolytic plating apparatus 40 in Step 5. However, in this modified example, in step 5, for example, the ink jet type injection device 50 shown in FIG. 14 capable of injecting a liquid material including the conductive member 24 is used.

  As shown in FIG. 14, the ink jet type injection device 50 includes an injection head 51 for injecting a liquid material, a supply line 52 for supplying the liquid material to the injection head 51, and the like.

  The ejection head 51 is composed of a storage chamber 53 that stores the liquid material supplied from the supply line 52, an injection chamber 54 that communicates with the storage chamber 53, and a piezoelectric body that is operatively provided in the injection chamber 54. And a piezoelectric portion 57. In the injection chamber 54, an injection port 58 for injecting the liquid material is formed. The piezoelectric unit 57 is configured to be deformed by an external driving voltage to increase or decrease the volume in the injection chamber 54.

  For example, a liquid material including the conductive member 24 is injected onto the exposed portion 36 of the resist 35 using the ink jet type injection device 50. The liquid material is manufactured by mixing Ag coated on an organic film, for example, with a solvent such as water or pyrrolidone. The liquid material injected into the exposed portion 36 by the ink jet type injection device 50 is heated to, for example, 150 ° C. to 200 ° C. to volatilize the solvent and burn out the organic film. Thus, the exposed portion 36 is filled with the conductive member 24 so that the resin particles 23 in the exposed portion 36 are covered with the conductive member 24 made of Ag.

  As described above, according to this modification, in the step of filling the exposed portion 36 with the conductive member 24 (S5), the conductive member 24 is applied to the exposed portion 36 where the resin particles 23 are disposed by the ink jet type injection device 50. Since the contained liquid material is injected, for example, the liquid material containing the conductive member 24 can be injected so as to aim at the exposed portion 36, and the amount of the unnecessary conductive member 24 is reduced, thereby reducing the cost. be able to.

  (Second modification)

  Next, a method for manufacturing the liquid crystal device 1 according to the second modification of the present invention will be described.

  As for the manufacturing process of this modification example, only step 5 is different from the first embodiment, and therefore step 5 will be described.

  In this modification, instead of Step 5 of the first embodiment, the resist 35 that remains without being removed on the silicon chip 14 when the exposed portion 36 is formed on the resist 35 is used as a mask for screen printing. As shown in FIG. 15, for example, by moving a resin plate 60 or the like substantially parallel to the surface of the resist 35, the paste 61 including the conductive member 24 is filled (printed) in the exposed portion 36. Thereby, the conductive member 24 is filled in the exposed portion 36.

  As described above, in this modification, in the step (S5) of filling the exposed portion 36 with the conductive member 24, the resist remaining without being removed on the silicon chip 14 side in the step (S3) of forming the exposed portion 36 on the resist 35. 35 is used as a mask, and the paste 61 including the conductive member 24 is filled (printed) in the exposed portion 36. Therefore, it is not necessary to prepare a mask separately, and the manufacturing cost can be reduced. In addition, the exposed portion 36 can be reliably filled, and the amount of the conductive member 24 that is wasted can be reduced to reduce the cost.

  (Third Modification)

  Next, a method for manufacturing the liquid crystal device 1 according to the third modification of the present invention will be described. Note that the manufacturing process of the present modification example is different from the first embodiment only in step 4, and therefore step 4 will be described.

  In this modification, in step 4, the resin particles 23 are injected to the exposed portions 36 of the resist 35 using, for example, an ink jet type injection device that can inject the resin particles 23 having substantially the same structure as the injection device 50. May be. According to such a modification, the resin particles 23 can be selectively disposed on the exposed portion 36 by ejecting the resin particles 23 so as to aim at the exposed portion 36.

  Further, the step (S5) of filling the exposed portion 36 with the conductive member 24 is performed by plating by immersing the seed layer 20 in the plating solution 43 in the plating tank 41, so that the seed layer 20 is used as an electrode for plating. By using the conductive member 24, the exposed portion 36 can be filled by plating.

  Note that step 5 of the third modification may be ejected onto the exposed portion 36 of the resist 35 using, for example, an ink jet ejection device 50 capable of ejecting a liquid material including the conductive member 24. In this case, it is not necessary to use the seed layer 20 in the step (S4) of placing the resin particles 23 on the exposed portion 36 and the step (S5) of filling the exposed portion 36 of the resist 35 with the conductive member 24. Steps 1 and 7 shown in FIG. 4 are not necessary, and the manufacturing time can be shortened, and it is not necessary to use a metal material such as Au or TiW, so that the cost can be reduced.

  Further, in step 5 of the third modification, the exposed portion 36 is filled (printed) with the paste 61 including the conductive member 24 by moving, for example, the resin plate 60 or the like substantially parallel to the surface of the resist 35. May be. In this case, it is not necessary to use the seed layer 20 in the step (S4) of placing the resin particles 23 on the exposed portion 36 and the step (S5) of filling the exposed portion 36 of the resist 35 with the conductive member 24. Steps 1 and 7 shown in FIG. 4 are not necessary, and the manufacturing time can be shortened, and it is not necessary to use a metal material such as Au or TiW, so that the cost can be reduced.

  Furthermore, in the said embodiment and modification, the liquid crystal device showed the example provided with driver IC11 etc. which provide the bump 17 directly under the input / output terminals 15 and 16 of the Z direction. However, for example, as shown in FIG. 16, the liquid crystal device may include a driver IC provided with bumps 70 at a position shifted from the input terminal 15 in the Y direction.

  The bump 70 includes resin particles 23 having elasticity and conductive members 72 provided so as to cover the resin particles 23. The conductive member 72 includes a protruding portion 72 a provided so as to protrude from the silicon chip 14 in the Z direction, and a connecting portion 72 b that connects the protruding portion 72 a and the input terminal 15. The projecting portion 72 a is connected to the wiring 25. For example, the bump 70 may be formed by using, for example, a photolithography technique as in the above embodiment. For the adhesive 45, for example, epoxy resin or the like may be used instead of ACF.

  Thereby, for example, the bump 70 can be formed by using the photolithography technique in the same manner as in the above-described embodiment and the like, so that the manufacture is easy. Further, since the conductive member 72 can be present only in the bump 70 without the presence of conductive particles or the like in the adhesive 45, a short circuit between the bumps 70 due to the conductive particles contained in the adhesive 45 can be prevented, The conductive reliability of the bumps 70 with a narrow pitch can be improved, and the cost can be reduced by using an inexpensive adhesive 45.

  In the present embodiment, an example in which the resist 35 in which the exposed portion 36 is formed is used to provide the resin particles 23 at positions corresponding to the input terminal 15 and the output terminal 16 is not limited thereto. A mask member having the same shape as the resist 35 in which the exposed portion 36 shown in FIG. 8 is formed may be used. In this case, for example, after setting the mask member so that the input terminal 15 and the output terminal 16 of the silicon chip 14 correspond to the opening of the mask member, the resin particles 23 are removed from the cylindrical member by electrostatic force. It is only necessary to selectively arrange (spread) from 38 to openings (not shown) of the mask member (see FIG. 9). Subsequently, the inside of the opening of the mask member in which the resin particles 23 are arranged is filled with the conductive member 24 by performing, for example, gold plating using the electrolytic plating apparatus 40 shown in FIG. Then, the bump 17 may be formed by peeling the mask member from the silicon chip 14 side and removing the exposed seed layer 20.

  Second Embodiment Electronic Device

  Next, an electronic apparatus according to the second embodiment of the present invention including the above-described liquid crystal device 1 will be described.

  FIG. 17 is a schematic configuration diagram of the overall configuration of a display control system of an electronic apparatus according to the second embodiment of the present invention.

  The electronic device 300 includes, for example, a liquid crystal panel 2 and a display control circuit 390 as a display control system, as shown in FIG. 17, and the display control circuit 390 includes a display information output source 391, a display information processing circuit 392, a power supply circuit 393, and the like. A timing generator 394 and the like are included.

  Further, the liquid crystal panel 2 has a drive circuit 361 including a Y driver IC 11 for driving the display area I and the like.

  The display information output source 391 includes a memory such as a ROM (Read Only Memory) or a RAM (Random Access Memory), a storage unit such as a magnetic recording disk or an optical recording disk, and a tuning circuit that tunes and outputs a digital image signal. It has. Further, the display information output source 391 is configured to supply display information to the display information processing circuit 392 in the form of a predetermined format image signal or the like based on various clock signals generated by the timing generator 394.

  The display information processing circuit 392 includes various well-known circuits such as a serial-parallel conversion circuit, an amplification / inversion circuit, a rotation circuit, a gamma correction circuit, and a clamp circuit, and executes processing of input display information to display the image. Information is supplied to the drive circuit 361 together with the clock signal CLK. The power supply circuit 393 supplies a predetermined voltage to each component described above.

  As described above, according to the present embodiment, the liquid crystal device 1 on which the Y driver IC 11 which is easy to manufacture and has excellent conductive reliability of the narrowed bumps is mounted is provided, so that the display quality is excellent. An electronic device can be obtained.

  Specific electronic devices include touch panels equipped with liquid crystal devices in addition to mobile phones and personal computers, projectors, liquid crystal televisions and viewfinder types, video tape recorders with direct view of monitors, car navigation systems, pagers, electronic notebooks, A calculator, a word processor, a workstation, a video phone, a POS terminal, etc. are mentioned. Needless to say, for example, the above-described liquid crystal device 1 or the like can be applied as a display unit of these various electronic devices.

  The X and Y driver ICs 12, 13, and 11, the liquid crystal panel 2, and the electronic device of the present invention are not limited to the above-described examples, and various modifications can be made without departing from the scope of the present invention. Of course.

  For example, in the above-described embodiment, the TFT type liquid crystal device 1 and the like have been described. However, the present invention is not limited to this. For example, a TFD (Thin Film Diode) type active matrix type or passive matrix type liquid crystal device may be used. Further, the present invention may be applied to various electro-optical devices such as a plasma display device, an electrophoretic display device, and a device using an electron-emitting device (Field Emission Display, Surface-Condition Electron-Emitter Display, etc.).

  Moreover, in the said embodiment and modification, the bump (not shown) of semiconductor IC34 showed the example connected to the output wiring 32 provided in the flexible base material 31, and the input wiring 33 via ACF. However, for example, the output wiring 32 and the input wiring 33 of the flexible substrate 31 are provided with bumps having the same structure as the bumps 17 of the driver IC 11 using, for example, an adhesive that does not include conductive particles without using the ACF. A semiconductor IC may be mounted.

1 is a schematic perspective view of a liquid crystal device according to a first embodiment of the present invention. It is AA sectional drawing of the liquid crystal device of FIG. FIG. 2 is a partially enlarged plan view of a driver IC of the liquid crystal device of FIG. 1. 4 is a flowchart illustrating a manufacturing process of the liquid crystal device according to the first embodiment. It is sectional drawing of the driver IC before seed layer formation. It is sectional drawing of driver IC (S1) in the state in which the seed layer was formed. It is sectional drawing of driver IC (S2) in the state where the resist was apply | coated. It is sectional drawing of driver IC (S3) in the state where the exposed part was formed in the resist. It is sectional drawing of driver IC (S4) of the state by which the resin particle is arrange | positioned at the exposed part. It is explanatory drawing of the gold plating process (S5) of driver IC. It is sectional drawing of driver IC (S5) in the state where the exposed part was filled with the electrically-conductive member. It is sectional drawing of driver IC (S6) in the state where the resist was removed. It is sectional drawing of driver IC (S7) in the state where the seed layer was removed. It is explanatory drawing explaining the manufacturing process of bump using the injection device of the 1st modification. It is explanatory drawing for demonstrating the manufacturing process of the bump by screen printing. It is sectional drawing of driver IC provided with the bump which shifted | deviated from the input-output terminal. It is a schematic block diagram of the display control system of the electronic device of 3rd Embodiment which concerns on this invention.

Explanation of symbols

  T ... Thin film transistor element, a ... Space, I ... Display area, 1 ... Liquid crystal device, 2 ... Liquid crystal panel, 3 ... Circuit board, 4, 5 ... Substrate, 4a ... Overhang part, 5a ... Common electrode, 6 ... Sealing material, DESCRIPTION OF SYMBOLS 7 ... Gate electrode, 8 ... Source electrode, 9 ... Pixel electrode, 11, 12, 13, 34 ... Semiconductor device, 14 ... Silicon chip, 15 ... Input terminal, 16 ... Output terminal, 17, 70 ... Bump, 18 ... Passivation 20 ... Seed layer, 21 ... TiW layer, 22 ... Au layer, 23 ... Resin particles, 24, 72 ... Conductive member, 24a ... Connection surface, 25, 26, 27, 28, 29, 30, 37, 44, 55 , 56 ... wiring, 31 ... flexible substrate, 32 ... output wiring, 33 ... input wiring, 35 ... resist, 36 ... exposed part, 38 ... cylindrical member, 40 ... electrolytic plating apparatus, 4 DESCRIPTION OF SYMBOLS ... Plating tank 42 ... Plating anode 43 ... Plating liquid 45 ... Adhesive 50 ... Injection device 51 ... Discharge head 52 ... Supply line 53 ... Storage chamber 54 ... Injection chamber 57 ... Piezoelectric part 58 ... Injection port, 60 ... Resin plate, 61 ... Paste, 72a ... Projection part, 72b ... Connection part, 300 ... Electronic device, 361 ... Drive circuit, 390 ... Display control circuit

Claims (12)

A bump having elastic particles and a conductive member provided to cover the elastic particles;
An electronic component comprising: a wiring electrically connected to the conductive member.   The bump has a connection surface connected to a mounted member on which the electronic component is mounted, and at least a part of the connection surface and the wiring are electrically connected. Item 2. The electronic component according to Item 1. An electronic component comprising a bump having elastic particles and a conductive member provided so as to cover the elastic particles, and a wiring electrically connected to the conductive member;
A mounting structure comprising: a substrate on which the electronic component is mounted. An electronic component comprising a bump having elastic particles and a conductive member provided so as to cover the elastic particles, and a wiring electrically connected to the conductive member;
An electro-optical device comprising: an electro-optical panel having a substrate on which the electronic component is mounted.   An electronic apparatus comprising the electro-optical device according to claim 4. A method for producing an electronic component having a bump provided on a substrate,
The step of forming the bump includes
Arranging elastic particles in a region where the bump is formed;
And a step of coating the elastic particles with a conductive member. A method for producing an electronic component having a bump provided on a substrate,
The step of forming the bump includes
Applying a resist to the substrate;
Removing the resist applied to the region for forming the bumps of the resist applied to the base material, thereby forming an exposed portion of the base material on the resist; and
Disposing elastic particles in the exposed portion;
Filling the exposed portion where the elastic particles are disposed with a conductive member;
And a step of removing the resist applied to the base material. Before the step of applying a resist to the substrate, further comprising the step of forming a conductive portion in the region where the bump of the substrate is formed,
8. The step of disposing elastic particles in the exposed portion includes electrostatically adsorbing the elastic particles to the conductive portion by charging the conductive portion and the elastic particles to opposite charges. The manufacturing method of the electronic component of description.   The method of manufacturing an electronic component according to claim 7, wherein the step of disposing the elastic particles in the exposed portion includes injecting the elastic particles to the exposed portion.   9. The step of filling the exposed portion with a conductive member is performed by plating by immersing a conductive portion provided on the base material and connected to the conductive member in a plating solution in a plating tank. Or the manufacturing method of the electronic component of Claim 9.   The step of filling the exposed portion with the conductive member is characterized in that the conductive member is printed by using the resist remaining without being removed on the base material in the step of forming the exposed portion in the resist as a mask. The manufacturing method of the electronic component of Claim 8 or Claim 9 to do.   10. The method of manufacturing an electronic component according to claim 8, wherein the step of filling the exposed portion with a conductive member injects the conductive member into the exposed portion where the elastic particles are arranged.

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