JP2007004535A - Ic inlet and ic tag - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To hold an inlet on an IC tag without misalignment and to facilitate detachment of the inlet after use of the IC tag. <P>SOLUTION: The IC tag 1 comprises an inlet body whose circuit elements are formed on a film base, and uses the IC inlet 10 at least either of whose surfaces is exfoliative. A cover base material 3 is attached on a board 2 via an adhesive layer, and at least a part of the exfoliative surfaces of the IC inlet 10 is held being contact with the adhesive layer between the board 2 and the cover base material 3. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an IC inlet and an IC tag including the same.

In recent years, an RFID (Radio Frequency Identification) system using an IC tag has been widespread for managing air baggage, merchandise, and the like. Here, the IC tag has a film (inlet) provided with circuit elements and an appropriate base material to be attached to baggage, products, or the like. The circuit element typically includes a semiconductor (IC) chip, an antenna that is electrically connected to the IC chip, and that transmits and receives information, and a capacitor.
In an RFID system using an IC tag, when a radio wave emitted from a reader is received by the inlet antenna, information stored in the IC chip of the inlet is transmitted to the reader via the antenna according to the radio wave. The In this way, information such as air baggage and merchandise can be read.

In order to prevent tampering and the like, the inlet needs to be held in a state where it cannot be easily detached while using the IC tag. However, in recent years, there is a demand for reusing the inlet after use. It is required that the inlet can be easily removed after the tag is used.
On the other hand, for example, in Patent Document 1 below, the slip body holding the inlet detachably on the back surface is housed in a bag having a transparent front surface and an adhesive layer on the back surface, and the bag is attached to the adhesive layer. The structure fixed to a luggage etc. via is proposed.
JP 2005-55752 A

  However, in the configuration in which the inlet is fixed to the slip and the slip is stored in the bag, there is a problem that the position of the inlet in the bag shifts due to the slip moving in the bag. If the position of the inlet is deviated, for example, there is a disadvantage that an error is likely to occur when data is read from and written to the inlet continuously using a machine.

  The present invention has been made in view of the above circumstances. An IC inlet and an IC tag that can hold the inlet in the IC tag so as not to be displaced and can be easily removed after the IC tag is used. The purpose is to provide.

In order to solve the above-mentioned problems, the IC inlet of the present invention comprises an inlet body in which a circuit element is formed on a film substrate, and at least one surface has peelability. .
The surface having peelability of the IC inlet is preferably formed by sticking a release substrate on the inlet body so that the surface having peelability is on the outside.

In the IC tag of the present invention, a cover base material is attached on a mount through an adhesive layer, and the IC inlet according to claim 1 or 2 is provided between the mount and the cover base. It is characterized in that at least a part of the surface having the property is held in close contact with the adhesive layer.
The cover base material is preferably provided with a cutting portion in a region where the cover base material and the IC inlet overlap.

  Since the IC inlet of the present invention has at least one surface peelable, the IC inlet can be held on the IC tag so as not to be displaced by bringing this surface into close contact with the adhesive layer. Since the IC inlet can be easily peeled off and collected after the tag is used, it can be reused.

  In the IC tag of the present invention, since the IC inlet is held between the backing sheet and the cover base material that are attached to each other, it is difficult to take out the IC inlet in a non-destructive manner, and tampering can be prevented. Further, if the cover base material or the mount is destroyed after the IC tag is used, the IC inlet can be easily peeled off from the cover base material.

1 and 2 show an embodiment of the present invention. FIG. 1 is a perspective view of an IC tag, and FIG. 2 is a cross-sectional view of an IC inlet. In the figure, reference numeral 1 denotes an IC tag, and 10 denotes an IC inlet.
In the IC tag 1 of the present embodiment, a cover base material 3 is attached so as to cover a part of the surface of the mount 2, and the IC inlet 10 is held between the cover base 3 and the mount 2. It is roughly structured.
The IC tag of the present embodiment is an apparel tag used as a tag for clothing goods, for example, but the present invention is not limited to this.

<IC inlet>
In the IC inlet 10 of the present embodiment, a release substrate 12 is adhered on both surfaces of an inlet body 11 in which circuit elements are formed on a film substrate.
[Inlet body]
The inlet body 11 is provided with circuit elements on both sides or one side of a film substrate. Film base materials include polyimide, PET, PEN (polyethylene naphthalate), non-crystalline modified polyester resin obtained by polymerizing three components of ethylene glycol, terephthalic acid and 1,4-cyclohexanedimethanol, polypropylene, polyethylene resin and paper Etc. The thickness of the film substrate is preferably about 10 to 500 μm.

The circuit elements of the inlet body 11 are usually composed of an antenna, an IC chip, a capacitor and the like.
An IC chip having a length and width of 0.5 to 10 mm and a thickness of about 50 to 300 μm is usually used. The IC chip is an IC tag IC chip sold by Infineon, Fujitsu or Philips. Specifically, as an IC chip, (1) an electronic circuit is formed on a silicon wafer using a technique such as lithography and doping, ground to a predetermined thickness, and then a connection terminal is formed to obtain a predetermined chip size. Die processed (bare chip), (2) Bare chip is connected to a metal plate (lead frame) in which a terminal part is formed on a metal plate such as stainless steel or 4,2 alloy by wire bonding, etc. A packaged chip in which an epoxy resin is encapsulated and then heat-cured and molded after being housed therein can be mentioned.
In the bear chip, the terminals are formed by protruding terminals (bumps) by gold plating, solder plating, or the like at the connection terminal portion in the bear chip. In the packaged chip, the terminal of the bare chip and the terminal of the lead frame are connected by a gold wire or the like.
Examples of such IC chips include those sold by Infineon, such as MCC1-1-2 (bear chip) and MCC2-2-1 (packaged chip).

An antenna is connected to the IC chip. As an antenna formation method, (1) an etching method, (2) a winding method, or the like is employed.
(1) Etching method: A method in which a copper foil or aluminum foil having a thickness of 10 to 50 μm is bonded via a hot melt adhesive having a melting point of about 100 ° C. to 150 ° C., and a resist layer having a thickness of several μm is gravure printed It is provided on it. Next, the antenna pattern is exposed with a block film to remove an unnecessary resist layer, and then an unnecessary metal foil layer is removed by etching. Thereafter, the substrate is immersed in an alkaline solution to remove the resist layer, thereby forming an antenna pattern.
(2) Winding method: A copper wire having a diameter of 80 to 200 μm is continuously sent out from a heated nozzle, and at least a part of the copper wire is embedded in the film so as to form a loop-shaped antenna pattern.
By such an antenna forming method, a metal foil or a metal wire is wired on the film substrate to form an antenna.

  When a loop antenna is formed by the above antenna forming method, an antenna terminal to which an IC chip is connected is often arranged inside the loop antenna. In that case, in order to connect the loop antenna and the antenna terminal, a lead wire is provided on the back side of the film (the surface on which the antenna and the antenna terminal are not formed), and the lead wire and the antenna or the antenna terminal are crimped and connected. To do.

As a method of connecting the connection terminal of the IC chip and the terminal of the antenna, when the IC chip is a bare chip, (1) a wire bonding method in which the terminal portion is directly connected by a gold wire, and (2) ACF ( A flip chip bonding method in which an anisotropic conductive film) or ACP (anisotropic conductive paste) is bonded, an IC chip is placed thereon, and heated and pressed at about 200 ° C. to conduct the terminal portion can be adopted. . Here, ACF and ACP are particles in which fine particles of gold and silver are dispersed in a resin, and are not normally conducted, but are conducted when pressed and brought into contact with each other.
The inlet main body 11 may have an IC chip and an antenna exposed.

[Peeling substrate]
As the peeling substrate 12, for example, a film made of an olefin resin such as polyethylene or polypropylene; a resin film having peelability such as a film made of a fluororesin such as polytetrafluoroethylene can be used.
In addition, an emulsion type, solvent type or solventless type silicone resin, fluorine resin, or the like is applied to the surface of a film made of a resin such as an olefin resin, a polyester resin such as polyethylene terephthalate, or a vinyl resin such as polyvinylidene chloride. It is also possible to use a film in which a release agent layer is formed by thermal curing, electron beam curing, ultraviolet curing or the like after coating so as to have a dry weight of about 0.05 to 3 g / m ² .
In addition, so-called polylaminate paper in which a resin film such as polyethylene is laminated on high-density paper such as glassine paper, clay-coated paper, kraft paper, and high-quality paper can also be used. Also, a resin-coated base paper provided with a sealing layer mainly composed of a water-soluble polymer such as polyvinyl alcohol or starch and a pigment can be used for kraft paper or high-quality paper.
The thickness of the release substrate 12 is not particularly limited, but is preferably about 15 to 300 μm.
The peeling substrate 12 is used so that the surface having peelability is on the outside.

[Adhesive layer]
The inlet main body 11 and the peeling base material 12 are stuck via the sticking layer (not shown) which consists of sticking agents, such as an adhesive agent or an adhesive. Here, the adhesive loses its tackiness by being cured after sticking, and the pressure-sensitive adhesive maintains a certain degree of tackiness even after sticking.
Adhesives include natural rubber, synthetic rubber, acrylic, vinyl acetate, cyanoacrylate, silicone, urethane and polyester adhesives, styrene block copolymers, ethylene-vinyl acetate copolymer Various hot-melt adhesives such as coalescence are listed. Among these, a polyester-based adhesive is preferable from the viewpoint of durability and versatility.
Examples of the pressure-sensitive adhesive include rubber-based, acrylic-based, urethane-based, and vinyl ether-based pressure-sensitive adhesives. As the acrylic pressure-sensitive adhesive, there are an emulsion type, a solvent type, a hot melt type and the like, and any type can be used. Among these, emulsion-type acrylic pressure-sensitive adhesives are preferable from the viewpoints of safety, quality, and cost.
When using an adhesive, a tackifier may be added. Examples of the tackifier include rosin resins, terpene resins, aliphatic petroleum resins, aromatic petroleum resins, hydrogenated petroleum resins, styrene resins, alkylphenol resins, and the like.

  The thickness of the adhesive layer in the inlet body 11 is preferably 10 to 100 μm. If the thickness of the adhesive layer is not less than the lower limit of the above range, sufficient adhesive force can be secured, and if it is not more than the upper limit of the above range, it is economical because it is not thicker than necessary.

[IC inlet manufacturing method]
The IC inlet 10 of the present embodiment can be manufactured as follows, for example. First, the circuit element is provided on the film base material to manufacture the inlet body 11. In order to provide a circuit element on a film substrate, for example, a method of attaching a coil made of a wire such as silver or copper on a film substrate, a method of etching a metal such as copper or aluminum, a conductive ink, etc. A method of forming an antenna by adopting a coiled printing method or the like and then attaching an IC chip or a capacitor can be used.
Next, an IC inlet 10 is obtained by providing an adhesive layer on both surfaces of the inlet main body 11 by an appropriate means, and laminating and bonding the release substrate 12 on the adhesive layer.

<IC tag>
[Mount]
The mount 2 in the IC tag 1 of this embodiment is rectangular, and is divided into an inlet holding side 2a and a margin side 2b by a cut line 21 parallel to the short side. Information related to the manufacturing company, size, quality, and the like can be displayed on the blank side 2b as necessary.
The cut line 21 is formed by perforation. In the perforation of the cut line 21, the mount 2 is not completely cut in the thickness direction, and the perforation is preferably formed only on one side.

The material of the mount 2 is not particularly limited, and a general tag mount material can be used. Generally, one having one or both sides having printability such as a laser printer, thermal transfer printing, thermal printing, ink jet printing, laser marking or the like is used.
Specific examples of the material include various papers, films, and synthetic papers. The mount 2 is preferably excellent in strength and design, and paper board for paper containers is particularly preferable among those listed above. The thickness of the mount 2 is not particularly limited, but is generally about 0.05 to 1 mm.

[Cover base material]
The cover base material 3 in the IC tag 1 of the present embodiment is a rectangle larger than the IC inlet 10, and is an area where the cover base material 3 and the IC inlet 10 overlap (shown by a broken line in the figure. Hereinafter, referred to as an inlet holding area 10a). .) Is provided along a line that bisects. In the cutting part 31, the cover base material 3 is completely cut in the thickness direction.
The shape of the cutting part 31 is not particularly limited as long as a part of the cover base material 3 is cut in the inlet holding region 10a. It may be linear, curved, or a combination thereof. Moreover, the cutting part 31 may straddle the inlet holding | maintenance area | region 10a and its surrounding area | region like this embodiment, and may remain in the inlet holding | maintenance area | region 10a. In the present embodiment, the linear cutting portion 31 extends to the outside of the inlet holding region 10a, and substantially perpendicular cuts are provided at both ends so that the whole is substantially U-shaped. This is preferable in that the material 3 is easily turned.
Although the position where the cutting part 31 is provided is not particularly limited, the vicinity of the end in the length direction of the inlet holding region 10a is preferable.
Further, when the IC tag 1 is applied to a machine such as a printing machine, it is preferable that the traveling direction of the IC tag 1 supplied to the machine and the length direction of the cutting portion 31 are parallel.

The material of the cover base material 3 is not particularly limited, and papers and resin films can be used. Specific examples of paper include fine paper, art paper, coated paper, cast coated paper, craft paper, and the like, and specific examples of resin films include polyethylene (PE), polypropylene (PP), polyethylene terephthalate (PET). ) And synthetic paper.
The cover base material 3 is preferably such that at least the outer surface has printability such as a laser printer, thermal transfer printing, thermal printing, ink jet printing, and laser marking. In order to impart printability, a recording layer corresponding to each printing method may be provided on the surface.
The cover base material 3 is preferably one that can be broken by pinching the portion of the cut portion 31 and pulling it by hand.
The thickness of the cover substrate 3 is not particularly limited, but is preferably about 15 to 200 μm, more preferably about 50 to 120 μm from the viewpoint of strength and printability.

[Adhesive layer]
In the present embodiment, an adhesive layer (not shown) is provided on the entire inner surface of the cover base 3, and the inner side surface of the cover base 3 and the mount 2 are disposed around the inlet holding region 10 a. It sticks through this sticking layer. In the inlet holding region 10a, the adhesive layer on the inner side surface of the cover base material 3 and one peeling base material 12 of the IC inlet 10 are in close contact.
For the material of the adhesive layer provided on the inner side surface of the cover base material 3, the same adhesive as that mentioned as the material of the adhesive layer for attaching the inlet body 11 and the release base material 12 may be used. it can.
In particular, the adhesive layer provided on the inner surface of the cover base material 3 is preferably one that can be attached with such a strength that the inner surface of the cover base material 3 and the mount 2 cannot be easily peeled off.

[IC tag manufacturing method]
The IC tag 1 of this embodiment can be manufactured as follows, for example. FIG. 3 is a diagram for explaining an example of the manufacturing method of the IC tag 1. In FIG. 3, the same components as those in FIGS.

First, an adhesive layer (not shown) is provided on the entire surface of the cover base material 3 using an appropriate means. It is preferable to laminate the release paper 4 on the adhesive layer by a known method. The size of the release paper 4 may be the same as that of the cover base material 3 or slightly larger than that of the cover base material 3.
In the cover base material 3, it is preferable that the adhesive layer of the belt-like portion 3 a can be selectively exposed with respect to the belt-like portion 3 a outside the one side of the inlet holding region 10 a. For this purpose, for example, a configuration in which the release paper 4 is laminated on the entire surface of the adhesive layer and the release paper 4 is cut in advance at the boundary line between the belt-like portion 3a and the remaining portion is preferable. Alternatively, the release paper 4 may be laminated only on the remaining part of the adhesive layer formed on the entire surface of the cover substrate 3 except for the belt-like part 3a.

  In addition, a cutting part 31 is provided in the cover base material 3. The step of providing the cutting part 31 is not particularly limited, and may be performed at an appropriate stage, but is preferably after the adhesive layer is formed on the cover base material 3 and after the release paper 4 is laminated on the adhesive layer. Is more preferable. The release paper 4 may or may not be cut at the position of the cutting part 31.

  Separately, the mount 2 is prepared. The mount 2 may be printed in advance, or may be printed after holding the IC inlet 10. The cut line 21 of the mount 2 may be formed in advance or may be formed after holding the IC inlet.

Then, first, the adhesive layer is exposed in the band-like portion 3a outside the inlet holding region 10a of the cover base material 3, and this is applied to a predetermined position of the mount 2 as shown in FIG.
Next, the release paper 4 on the cover base material 3 is peeled off, and the cover base material 3 and the base paper 2 are adhered in a state where the IC inlet 10 is inserted into a predetermined position between the base paper 2 and the cover base material 3. Thus, the IC tag 1 is manufactured.

The IC tag 1 obtained in this way may be printed on the blank side 2b of the mount 2 and / or the surface of the cover base 3 as necessary.
Since the IC inlet 10 held between the cover base 3 and the mount 2 is in close contact with the adhesive layer of the cover base 3, the position does not shift. Therefore, even when data read / write processing to / from the IC inlet 10 is continuously performed using a machine, the position of the IC inlet 10 does not shift, so that an error hardly occurs and the operation is easy. Further, when the IC tag 1 is used in a printing machine to print on the surface of the cover base material 3, the cover base material 3 is hardly wrinkled, and the printing process can be performed satisfactorily.

After the use of the IC tag 1, the IC inlet 10 can be easily taken out from the position of the cut portion 31 of the cover base material 3 by tearing the cover base material 3.
Since both surfaces of the IC inlet 10 have peelability, the surface that is in close contact with the adhesive layer of the cover substrate 3 can be easily peeled off. Therefore, the IC inlet 10 can be collected without applying a large external force to the inlet body 11, which is preferable for reuse.

In the present embodiment, since the cutting base 31 is provided in the cover base 3, the cover base 3 in the vicinity of the cutting base 31 can be easily turned over, and the cover base 3 can be pulled by pinching and pulling the turned-up portion. The material 3 can be easily broken.
In addition, IC inlet 10 can be easily taken out also by the structure which provides the knob part which is not stuck to the base_sheet | mounting_paper 2 in the edge part and corner | angular part of the cover base material 3 instead of providing the cutting part 31. FIG. When the IC tag 1 is used in a machine such as a printing machine, in order to prevent the cover base material 3 from being turned up in the machine, an edge or corner that is behind the IC tag 1 in the traveling direction in the machine. It is preferable to provide the knob portion in the portion.

The IC inlet 10 only needs to have peelability on at least one surface. For example, the IC inlet 10 may have a configuration in which the peeling substrate 12 is attached only on one surface of the inlet body 11. In that case, it is necessary to use it so that the peelable surface is in close contact with the adhesive layer interposed between the cover substrate 3 and the mount 2.
In particular, as in the present embodiment, if both surfaces of the IC inlet 10 are peelable, when reusing the IC inlet 10, which surface is used as the surface to be in close contact with the adhesive layer. Therefore, it is preferable because the work of collecting and reusing the IC inlet is simplified.
Further, the cut line 21 of the IC tag 1 is not essential. However, according to the configuration of the present embodiment, by cutting only the inlet holding side 2a from the cut line 21 with the margin side 2b attached to the product, The inlet 10 can be collected quickly.

In the present embodiment, the adhesive layer is provided on the entire inner surface of the cover base 3, but at least a part of the surface having the peelability of the IC inlet 10 and the adhesive layer in the inlet holding region 10a. And the cover base material 3 and the mount 2 need only be adhered to a portion other than the inlet holding region 10a, and other configurations may be employed. For example, it is good also as a stripe form etc., without providing an adhesion layer in the whole surface. Alternatively, the adhesive layer may be provided on the mount 2 and the cover base material 3 may not be provided with the adhesive layer. In order to prevent the cover base material 3 from wrinkling during printing, a configuration in which the inner surface of the cover base material 3 and the surface having the peelability of the IC inlet 10 are in close contact with each other through the adhesive layer is preferable.
Moreover, when both surfaces of IC inlet 10 have peelability like this embodiment, the inner surface of the cover base material 3 and one surface of IC inlet 10 are stuck in the inlet holding | maintenance area | region 10a. In addition, the other surface of the IC inlet 10 and the mount 2 may be attached in an arbitrary configuration.

Moreover, in order to give peelability to the surface of the inlet main body 11, although the peeling base material 12 was stuck in this embodiment, peelability can also be provided by another structure. For example, a method of heat-sealing the two films around the inlet body 11 in a state where the inlet body 11 is sandwiched between two films having an outer surface having peelability and an inner surface having heat-sealability. Can be used.
Or the structure which coats a release agent on the surface of one or both of the inlet main bodies 11 and forms a release agent layer may be sufficient. As the release agent layer, the same configuration as the release agent layer in the release substrate 12 can be used.

It is a perspective view which shows embodiment of the IC tag of this invention. It is sectional drawing which shows embodiment of the IC inlet of this invention. It is explanatory drawing of the method of manufacturing the IC tag of this invention.

Explanation of symbols

1: IC tag 2: Mount 3: Cover base material 10: IC inlet 11: Inlet body 12: Peeling base material 31: Cutting part

Claims (4)

  An IC inlet comprising an inlet body in which a circuit element is formed on a film substrate, wherein at least one surface has peelability.   2. The IC according to claim 1, wherein the peelable surface of the IC inlet is formed by sticking a peelable substrate on the inlet body so that the peelable surface is on the outside. Inlet.   A cover base material is stuck on the mount via an adhesive layer, and the IC inlet according to claim 1 or 2 is at least one of the surfaces having the peelability between the mount and the cover base. The IC tag is characterized in that the portion is held in close contact with the adhesive layer. 4. The IC tag according to claim 3, wherein the cover base is provided with a cutting portion in a region where the cover base and the IC inlet overlap.

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