JP2007099956A - Thermosetting resin composition, resin film and structure - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an interlayer insulation material high in thermal resistance, low in expansion coefficient, superior in peeling strength at a position where the roughness is small after roughening, suitable for additive or semi-additive engineering method, and balanced in resin physical properties such as elastic modulus, breaking strength and breaking elongation. <P>SOLUTION: The thermosetting resin composition contains an epoxy resin (a), an aromatic amine-based hardening agent (b), and at least one of a siloxane-modified polyamideimide resin and a polyamideimide resin (c); also, when the total amount of the epoxy resin (a) and the aromatic amine-based hardening agent (b) is assumed to be 100 pts.wt. , the total amount of the siloxane-modified polyamideimide resin and the polyamideimide resin (c) is 2-65 pts.wt. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention is a thermosetting resin composition that can be used for adhesives, prepregs, paints, etc., and can also produce printed wiring boards produced by a semi-additive or full additive method, and a B-staged resin produced using the same A film, a resin film containing a base film coated on a single side or both sides of a heat-resistant film, and a copper foil with an adhesive coated on a single side of a metal foil to form a B-stage, with high heat resistance, Used for high-density build-up printed wiring boards with low expansion coefficient, high adhesive strength, and high reliability, and the obtained printed wiring boards are used for semiconductor plastic packages and the like. In addition, said B stage means the hardening stage in an intermediate stage of reaction.

  In recent years, for example, package substrates for MPUs and ASICs are required to have fine lines, small-diameter and narrow pad pitches, multiple layers, shortest connections, low transmission loss, and the like. For this purpose, a high-density build-up substrate or a high-density batch-molded substrate is required for the substrate structure (including rigid substrates, flexible substrates, and rigid-flexible substrates). (Or the semi-additive method), it is necessary to make a laser via with a small diameter in order to cope with a small pitch and a narrow pad pitch. For this reason, the main characteristics required of the substrate material are high peel strength with low roughness, laser processability and improved reliability with small diameter, and dimensional accuracy corresponding to the additive method (or semi-additive method) for thinning. In addition, there is a demand from the market for a resin property having a balanced low expansion coefficient and elastic modulus, breaking strength, breaking elongation and the like for improving the positional accuracy. As such a film, the thing of patent documents 1-10 is known, for example.

JP 11-1547 JP-A-11-87927 JP2000-17148 JP2000-198907 JP2003-238772 JP2001-181375 JP2002-241590 JP2002-309200 JP2003-127313 JP2003-321607

Furthermore, the applicant of the present application in Patent Document 11 discloses a thermosetting resin composition containing (a) an epoxy resin, (b) a novolak phenol resin and a benzoxazine compound as a curing agent, and (c) a siloxane-modified polyamideimide resin. Disclosed.
JP-A-2005-248164

  However, the conventional thermosetting resin compositions disclosed in Patent Documents 1 to 10 cannot satisfy the various requirements as described above, and are particularly remarkable for the interlayer insulating material for build-up substrates. It is. In other words, it has high heat resistance, low expansion coefficient, excellent peeling strength when the surface roughness after roughening is small and suitable for additive method (or semi-additive method), and has elastic modulus, breaking strength, breaking elongation, etc. This is not a thermosetting resin composition having balanced resin properties.

  The thermosetting resin composition described in Patent Document 11 is not an epoxy resin thermosetting resin composition using an aromatic amine curing agent having excellent physical properties.

  The main problems of the present invention are high heat resistance and low expansion coefficient, excellent peeling strength when the surface roughness after roughening suitable for additive method (or semi-additive method) is small, and elastic modulus, An object of the present invention is to provide an interlayer insulating material having a resin physical property in which breaking strength and breaking elongation are balanced.

  Moreover, the subject of this invention is providing the high-density buildup printed wiring board manufactured using such a thermosetting resin composition as an interlayer insulation material.

The present invention includes (a) an epoxy resin, (b) an aromatic amine-based curing agent, and (c) at least one of a siloxane-modified polyamideimide resin and a polyamideimide resin, and (a) an epoxy resin and (b) an aromatic (C) when the total amount of the aromatic amine curing agent is 100 parts by weight
A thermosetting resin composition is provided, wherein the total amount of the siloxane-modified polyamideimide resin and the polyamideimide resin is 2 parts by weight or more and 65 parts by weight or less.

  The present invention further includes (d) a filler, (a) an epoxy resin, (b) an aromatic amine-based curing agent, and (c) at least one of a siloxane-modified polyamideimide resin and a polyamideimide resin. The amount of the filler (d) when the total amount is 100 parts by weight is 150 parts by weight or less. The thermosetting resin composition is provided.

  The present invention also provides that (b) the aromatic amine-based curing agent is 2,2-bis [4- (4-aminophenoxy) phenyl] propane, 1,3-bis (4-aminophenoxy) benzene, bis [ The thermosetting resin composition is provided, which is selected from the group consisting of 4- (4-aminophenoxy) phenyl] sulfone and trimethylenebis (4-aminobenzoate).

The present invention also includes (c) a siloxane-modified polyamideimide resin comprising a mixture of a diamine having 3 or more aromatic rings and a mixture of siloxane diamine and diimide dicarboxylic acid obtained by reacting trimellitic anhydride with an aromatic. The thermosetting resin composition is a siloxane-modified polyamideimide resin obtained by reacting diisocyanate.
The present invention also provides the thermosetting resin composition, wherein (d) the filler is silica.

The present invention also provides a B-staged resin film prepared from the thermosetting resin composition.
Moreover, this invention provides the base material containing the said resin film and a heat resistant film or metal foil, and provides the structure characterized by the above-mentioned.
In addition, the present invention provides the structure, wherein the heat resistant film is a polyimide film, a wholly aromatic polyamide film or a wholly aromatic polyester film.

  It succeeded in remarkably reducing the thermal expansion coefficient of a thermosetting resin composition by using together an aromatic amine type hardening | curing agent, a siloxane modified polyamide imide resin, and a polyamide imide resin with respect to an epoxy resin. In addition, it has also been found that film properties can be improved without imparting flexibility to the cured product of the thermosetting resin composition and reducing Tg. In addition to this, it has also been found that, by improving the adhesive strength of the thermosetting resin composition itself, rough surface formation with a low profile by the additive method (or semi-additive method) can also be realized, and the present invention Reached.

  That is, according to the present invention, it is possible to provide a resin composition for a high-density build-up printed wiring board having a low expansion coefficient, high adhesive strength, high heat resistance, and high reliability. A printed wiring board having such various characteristics can be used for a semiconductor plastic package.

  In the present invention, the (a) epoxy resin can be used as long as it is an epoxy resin having two or more glycidyl groups. Preferably, a bis A type epoxy resin, a bis F type epoxy resin, a novolac phenol is used. Type epoxy resin, biphenyl type epoxy resin, naphthalene type epoxy resin, dicyclopentadiene type epoxy resin, etc., which can be used alone or in combination of two or more.

  In the present invention, (b) the aromatic amine-based curing agent is not particularly limited as long as (a) the curing of the epoxy resin proceeds, but 4,4′-diaminodiphenylsulfone, 4,4′-bis (4- Aminophenoxy) biphenyl, 2,2-bis [4- (4-aminophenoxy) phenyl] propane, 1,3-bis (4-aminophenoxy) benzene, 1,4-bis (4-aminophenoxy) benzene, tri Methylenebis (4-aminobenzoate), 3,3'-dimethyl-4,4'-diaminobiphenyl, 2,2'-dimethyl-4,4'-diaminobiphenyl, 4,4'-diaminodiphenyl ether, 3,4 '-Diaminodiphenyl ether, bis [4- (4-aminophenoxy) phenyl] sulfone, bis [4- (3-aminophenoxy) phenyl] sulfone, 9,9'-bis (4-aminophenyl) fluorene, 2,2 -Bis [4- (4-aminophenoxy) phenyl] hexafluoropropane etc. Can be used alone or in combination of two or more.

(a) When the number of moles of epoxy resin is 1, (b)
Although the usage-amount of an aromatic amine type hardening | curing agent is not limited, 0.3-1.5 mol is optimal with an aromatic amine compound. (b) By setting the amount (total number of moles) of the aromatic amine curing agent used to be 0.3 or more, it is easy to obtain an appropriate thermal expansion coefficient. From this point of view, (b)
More preferably, the amount of aromatic amine curing agent used (total number of moles) is 0.4 or more. Further, by setting the amount (total number of moles) of the aromatic amine curing agent (b) to 1.5 or less, it is easy to obtain an appropriate Tg and thermal expansion coefficient. From this viewpoint, it is more preferable that the amount (total number of moles) of the (b) aromatic amine curing agent used is 1.2 or less.

  The thermosetting resin composition of the present invention contains one or both of (c) a siloxane-modified polyamideimide resin and (c) a polyamideimide resin.

  (c) Siloxane-modified polyamideimide resin is a polyamide-imide resin modified with various siloxane chain lengths and modification amounts, and reacts a mixture of diamine having 3 or more aromatic rings and siloxane diamine with trimellitic anhydride. Those obtained by reacting the obtained diimidecarboxylic acid and aromatic diisocyanate are particularly preferred. Examples of commercially available (c) siloxane-modified polyamideimide resins include “KS9100” and “KS9300” manufactured by Hitachi Chemical Co., Ltd.

  (c) Polyamideimide resin is unmodified polyamideimide resin, but synthesized by isocyanate method (reaction of trimellitic anhydride and diisocyanate) or acid chloride method (reaction of trimellitic anhydride chloride and diamine). The thing which was done is mentioned.

  Examples of the commercially available polyamideimide resin (c) include Toyobo's “Bilomax HR11NN”, “Bilomax“ HR12N2 ”,“ Bilomax HR16NN ”, and the like.

  (C) Use amount (total amount) of siloxane-modified polyamideimide resin and polyamideimide resin is 2 parts by weight when the total amount of (a) epoxy resin and (b) aromatic amine curing agent is 100 parts by weight. The amount is 65 parts by weight or less. By setting this to 2 parts by weight or more, the adhesive strength and flexibility are improved. From this viewpoint, the amount (total amount) of (c) siloxane-modified polyamideimide resin and polyamideimide resin is more preferably 10 parts by weight or more, and particularly preferably 20 parts by weight or more. Moreover, the breaking strength as a film improves by making this 65 parts weight or less. From this viewpoint, the amount (total amount) of (c) siloxane-modified polyamideimide resin and polyamideimide resin is more preferably 50 parts by weight or less.

A filler (d) can be added to the thermosetting resin composition of the present invention. Specifically, the filler (d) is preferably silica, alumina, aluminum hydroxide, magnesium hydroxide or the like. (A) epoxy resin, (b) curing agent, (c)
When the total amount of solvent-soluble polyimide resin is 100 parts by weight, the amount of (d) filler is preferably 0 parts by weight or more and 150 parts by weight or less. (D) By adding the filler, film physical properties such as peel strength and breaking strength of the resin are improved. From this viewpoint, the amount of (d) filler is more preferably 5 parts by weight or more, and particularly preferably 10 parts by weight or more. Moreover, the thermal expansion coefficient of resin can be improved by making the quantity of (d) filler into 150 weight part or less. From this viewpoint, the amount of (d) filler is more preferably 120 parts by weight or less, and particularly preferably 100 parts by weight or less.

  (D) The filler is preferably composed mainly of silica when considering a low expansion coefficient. In this case, silica that has been surface-treated (epoxysilane treatment, aminosilane treatment, vinylsilane treatment, etc.) may be used. In addition, the particle size is narrow pitch compatible (pitch 100 μm compatible L / S ≦ 50 μm / 50 μm, where L indicates the line width and S indicates the space between the lines) and the surface roughness is reduced. From the viewpoint of (Ra ≦ 0.5 μm), those having an average particle size of 0.5 μm or less are desirable. In order to obtain a peel strength of 0.5 kN / m or more with Ra ≦ 0.5 μm, it is preferable to add 10 parts by weight or more of silica. Further, if it is added in excess of 150 parts by weight, the workability such as laser processability is deteriorated.

  Moreover, the thermosetting resin composition of this invention can use a hardening accelerator together as needed. As the curing accelerator, common ones such as various imidazoles can be used. Select mainly from the viewpoint of reaction speed and pot life.

  Furthermore, a flame retardant can be added to the thermosetting resin composition of the present invention to impart flame retardancy. Examples of halogen-free flame retardants include condensed phosphate esters, phosphazenes, polyphosphates, and HCA (9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide) derivatives.

  Although the solvent which can be used for the thermosetting resin composition of the present invention is not particularly limited, it is particularly preferable to combine a high boiling point solvent such as NMP and γ-butyrolactone and a low boiling point solvent among cyclohexanone and MEK.

A resin film can be obtained by converting the thermosetting resin composition of the present invention into a B-stage. That is, the resin composition of the present invention described above is diluted with a suitable mixed organic solvent such as NMP, (γ-butyrolactone) / MEK, (cyclohexanone) to form a varnish, which is separated as necessary. A thermosetting resin film in a B state can be produced by a usual method of applying a die coater or the like on a polyethylene terephthalate film (PET film) that has been subjected to a mold treatment and heating.
The thermosetting resin film in the B state is a semi-cured film between the A state (uncured) and the C state (completely cured).

In addition, by applying and heating the thermosetting resin composition of the present invention to both surfaces or one surface of a surface-treated wholly aromatic amide film or wholly aromatic polyester film, a base in a B state having a lower expansion coefficient can be obtained. A material film base thermosetting resin film can be produced. Examples of the wholly aromatic amide polymer include polyparaphenylene terephthalamide (PPTA), and examples of the wholly aromatic polyester-based polymer include 2-hydroxy-6-naphthoic acid (2-Hydroxy-6-Naphthoic acid).
Acid) and p-hydroxybenzoic acid (p-Hydroxy Benzoic Acid) structure.

  Moreover, the metal foil with an adhesive agent can be manufactured by applying the thermosetting resin composition of the present invention to a metal foil. Examples of the metal foil include a roughened copper foil and an aluminum foil, and a copper foil is particularly preferable.

The product with a film of the present invention can be used for a printed wiring board having a non-through via hole such as a laser via as an HDI (High Density Interconnection) material of a build-up multilayer board having a rigid core or an FPC core.
[Example]

Hereinafter, the present invention will be described by way of examples.
(Example 1)
453 parts by weight of bisphenol A type epoxy resin “Epicron 850-S” (Dainippon Ink & Chemicals, epoxy equivalent 188), 247 parts by weight of “BAPP” (2,2-bis [4- (4-aminophenoxy ) Phenyl] propane manufactured by Wakayama Seika Kogyo Co., Ltd.), 968 parts by weight of siloxane-modified polyamideimide resin “KS9100” (manufactured by Hitachi Chemical Co., Ltd., resin solid content 31% by weight), 0.7 parts by weight of 2-ethyl-4 methylimidazole A resin varnish having a resin solid content of 60% by weight was prepared.

(Example 2)
453 parts by weight of bisphenol A type epoxy resin `` Epicron 850-S '' (Dainippon Ink Chemical Co., Ltd., epoxy equivalent 188), 247 parts by weight of `` BAPP '' (2,2-bis [4- (4-aminophenoxy ) Phenyl] propane manufactured by Wakayama Seika Kogyo Co., Ltd.), 968 parts by weight of siloxane-modified polyamideimide resin “KS9100” (manufactured by Hitachi Chemical Co., Ltd., resin solid content 31% by weight), 0.7 parts by weight of 2-ethyl-4 methylimidazole 429 parts by weight of epoxysilane-treated silica (average particle size
0.3 μm) was prepared, and a resin varnish having a resin solid content of 68% by weight was prepared.

(Example 3)
494 parts by weight of bisphenol A type epoxy resin "Epicron 850-S" (Dainippon Ink Chemical Co., Ltd., epoxy equivalent 188), 206 parts by weight of "CUA-4" (trimethylenebis (4-aminobenzoate)
Prepared by Ihara Chemical Co., Ltd.), 968 parts by weight of siloxane-modified polyamideimide resin `` KS9100 '' (manufactured by Hitachi Chemical Co., Ltd., resin solid content 31% by weight) and 0.7 parts by weight of 2-ethyl-4methylimidazole. Then, a resin varnish having a resin solid content of 60% by weight was prepared.

(Example 4)
494 parts by weight of bisphenol A type epoxy resin "Epicron 850-S" (Dainippon Ink Chemical Co., Ltd., epoxy equivalent 188), 206 parts by weight of "CUA-4" (trimethylenebis (4-aminobenzoate)
Manufactured by Ihara Chemical Co., Ltd.), 968 parts by weight of siloxane-modified polyamideimide resin "KS9100" (manufactured by Hitachi Chemical Co., Ltd., resin solid content 31% by weight), 0.7 parts by weight of 2-ethyl-4methylimidazole, 429 parts by weight of epoxy Silane-treated silica (average particle size
0.3 μm) was prepared, and a resin varnish having a resin solid content of 68% by weight was prepared.

(Example 5)
453 parts by weight of bisphenol A type epoxy resin `` Epicron 850-S '' (Dainippon Ink & Chemicals, epoxy equivalent 188), 247 parts by weight of `` BAPP '' (2,2-bis [4- (4-aminophenoxy) ) Phenyl] propane Wakayama Seika Kogyo Co., Ltd.), 1000 parts by weight of polyamide-imide resin “Vilomax HR12N2” (Toyobo, resin solid content 30% by weight), 0.7 parts by weight of 2-ethyl-4methylimidazole A mixture was prepared and a resin varnish having a resin solid content of 60% by weight was prepared.

(Example 6)
453 parts by weight of bisphenol A type epoxy resin `` Epicron 850-S '' (Dainippon Ink & Chemicals, epoxy equivalent 188), 247 parts by weight of `` BAPP '' (2,2-bis [4- (4-aminophenoxy) ) Phenyl] propane Wakayama Seika Kogyo Co., Ltd.), 1000 parts by weight of polyamideimide resin “Vilomax HR12N2” (Toyobo Co., Ltd., resin solid content 30% by weight), 0.7 parts by weight of 2-ethyl-4methylimidazole, 429 Part by weight of epoxysilane-treated silica (average particle size
0.3 μm) was prepared, and a resin varnish having a resin solid content of 68% by weight was prepared.

(Example 7)
494 parts by weight of bisphenol A type epoxy resin "Epicron 850-S" (Dainippon Ink Chemical Co., Ltd., epoxy equivalent 188), 206 parts by weight of "CUA-4" (trimethylenebis (4-aminobenzoate)
Ihara Chemical Co., Ltd.), 1000 parts by weight polyamideimide resin `` Vilomax HR12N2 '' (Toyobo Co., Ltd., resin solid content 30% by weight), 0.7 parts by weight of 2-ethyl-4methylimidazole, A resin varnish having a solid content of 60% by weight was prepared.

(Example 8)
494 parts by weight of bisphenol A type epoxy resin "Epicron 850-S" (Dainippon Ink Chemical Co., Ltd., epoxy equivalent 188), 206 parts by weight of "CUA-4" (trimethylenebis (4-aminobenzoate)
Ihara Chemical Co., Ltd.), 1000 parts by weight of polyamideimide resin `` Vilomax HR12N2 '' (Toyobo Co., Ltd., resin solid content 30% by weight), 0.7 parts by weight of 2-ethyl-4methylimidazole, 429 parts by weight of epoxysilane treatment Silica (average particle size
0.3 μm) was prepared, and a resin varnish having a resin solid content of 68% by weight was prepared.

(Comparative Example 1)
1300 parts by weight of cresol novolac type epoxy resin `` YDCN-704P '' (manufactured by Tohto Kasei Co., Ltd., epoxy equivalent 210, resin solid content 70% by weight), 140 parts by weight of bisphenol A type epoxy resin `` Epicoat 1001 '' (manufactured by JER, Epoxy equivalent 456, resin solid content 70% by weight), 327 parts by weight of phenoxy resin `` YP-55 '' (manufactured by Tohto Kasei Co., Ltd.), 925 parts by weight of melamine-modified phenol novolac resin `` LA-7054 '' (Dainippon Ink Chemical Co., Ltd.) Manufactured by the company, hydroxyl value 125, resin solid content 60% by weight), 240 parts by weight of condensed phosphate ester “PX-200” (manufactured by Daihachi Chemical Co., Ltd.), 0.7 parts by weight of 2-ethyl-4methylimidazole, 320 Part by weight of epoxidized polybutadiene resin `` E-1800-6.5 '' (manufactured by Nippon Petrochemical Co., Ltd.), 1050 parts by weight of epoxysilane-treated silica (average particle size
Propylene glycol monomethyl ether (PGM) as a solvent was added to a mixture of 0.3 μm) to prepare an epoxy resin varnish having a resin solid content of 65% by weight.

(Comparative Example 2)
600 parts by weight of brominated epoxy resin epicoat `` 5045 '' (manufactured by JER, epoxy equivalent 480 resin solid content 80% by weight), 85 parts by weight of phenoxy resin `` YP-55 '' (manufactured by Toto Kasei), 13 parts by weight Dicyandiamide and 0.5 parts by weight of 2-ethyl-4methylimidazole, 100 parts by weight of epoxidized polybutadiene resin “E-1800-6.5” (manufactured by Nippon Petrochemical Co., Ltd.), 291 parts by weight of epoxysilane-treated silica (average particle size)
Propylene glycol monomethyl ether (PGM) and dimethylformamide were added to a mixture of 0.3 μm) as a solvent to prepare an epoxy resin varnish having a resin solid content of 65% by weight.

  The resin varnish of each example was well dispersed with three rolls. This was coated with a die coater on a 25 μm polyethylene terephthalate film (PET film) subjected to a release treatment, and dried at a temperature of 120 ° C. to produce a thermosetting resin film (A) in a B state having a thickness of 40 μm. . Volatiles were adjusted to 0.5 wt%. Further, a polyethylene film (PE film) was laminated as a protective film to obtain a laminate.

This laminate was overlapped with a 18 μm surface-treated copper foil, placed in a vacuum press, and molded at 180 ° C. for 120 minutes and heated and pressurized (vacuum degree 5 torr) at 4 MPa (molded product (1)).
In the same way, this laminate was overlapped with a copper foil with processing feet, charged in a vacuum press, and heated and pressurized at 180 ° C. for 120 minutes at 4 Mpa (degree of vacuum 5 torr) (molded product (2)). .

On the other hand, a circuit was formed on a high-Tg halogen-free FR-4 double-sided copper-clad laminate (copper foil 12μm) [trade name TLC-W-552Y, manufactured by Kyocera Chemical Co., Ltd.] with a thickness of 0.2 mm, and the conductor was treated with black copper oxide Thereafter, the protective film is peeled off from the film A on this surface, and lamination is performed on both surfaces. This is charged into a vacuum press and molded at 180 ° C for 40 minutes at 4MPa with heating and pressure (vacuum degree 1torr). After cooling out, a blind via having a predetermined hole diameter was formed with a CO ₂ laser.

 Surface roughening was performed with a permanganate desmear solution, and at the same time, residual resin at the bottom of the hole was dissolved and removed. Electroless copper plating 0.8 μm and electrolytic copper plating 20 μm were applied thereto, and after baking was performed at 180 ° C. for 90 minutes. By repeating this, a six-layer build-up multilayer printed wiring board (I) having two build-up layers on one side was produced.

  Also, a thermosetting resin film (B) in a B state having a thickness of 40 μm in a B state was produced by applying both sides to a 16 μm wholly aromatic polyamide film with a die coater and drying at a temperature of 120 ° C. Then, in the same manner as film A, a molded product (3) made of untreated copper foil and a 6-layer build-up multilayer printed wiring board (II) having two layers on one side were produced.

  Table 1 and Table 2 summarize the parameters of the above examples. In addition, Table 3 shows the characteristic evaluation results of each example. PWB (III) and PWB (IV) in Table 3 are JPCA-HD01 test pattern substrates manufactured in accordance with the manufacturing method of PWB (I) and PWB (II).

The following are the test conditions.
Reliability: According to JPCA-BU01.
(a) Thermal shock test:
One cycle consists of holding at 150 ° C for 30 minutes and then holding at -65 ° C for 30 minutes. Table 3 shows the number of thermal cycles.
(b) High-temperature, high-humidity bias test: 85 ° C, 85% RH, DC = 30V (however, measured in the tank)

  As described above, according to the present invention, it is possible to provide a resin composition for a high-density build-up printed wiring board having a low expansion coefficient, high adhesive strength, high heat resistance, and high reliability. A printed wiring board having such various characteristics can be used for a semiconductor plastic package.

Industrial application fields

The present invention can be used for a high-density build-up wiring board having a low expansion coefficient, high adhesive strength, high heat resistance, and high reliability, and can also be applied to a semiconductor plastic package.

Claims (8)

  (a) an epoxy resin, (b) an aromatic amine curing agent, and (c) at least one of a siloxane-modified polyamideimide resin and a polyamideimide resin, the (a) epoxy resin and the (b) aromatic amine When the total amount of the system curing agent is 100 parts by weight, the total amount of the (c) siloxane-modified polyamideimide resin and the polyamideimide resin is 2 parts by weight or more and 65 parts by weight or less. Resin composition.   Further, (d) contains a filler, the total amount of (a) epoxy resin, (b) aromatic amine curing agent, and (c) at least one of siloxane-modified polyamideimide resin and polyamideimide resin 2. The thermosetting resin composition according to claim 1, wherein the amount of the filler (d) is 150 parts by weight or less when the amount is 100 parts by weight.   The (b) aromatic amine curing agent is 2,2-bis [4- (4-aminophenoxy) phenyl] propane, 1,3-bis (4-aminophenoxy) benzene, bis [4- (4- The thermosetting resin composition according to claim 1 or 2, wherein the thermosetting resin composition is selected from the group consisting of (aminophenoxy) phenyl] sulfone and trimethylenebis (4-aminobenzoate).   (C) Siloxane modified polyamideimide resin is a siloxane obtained by reacting diimide dicarboxylic acid obtained by reacting a mixture of diamine having 3 or more aromatic rings and siloxane diamine with trimellitic anhydride and aromatic diisocyanate. The thermosetting resin composition according to any one of claims 1 to 3, wherein the thermosetting resin composition is a modified polyamideimide resin.   The thermosetting resin composition according to any one of claims 2 to 4, wherein the filler (d) is silica.   A B-staged resin film prepared from the thermosetting resin composition according to any one of claims 1 to 5.   A structure comprising a resin film according to claim 6 and a base material comprising a heat-resistant film or a metal foil.   The structure according to claim 7, wherein the heat-resistant film is a polyimide film, a wholly aromatic polyamide film or a wholly aromatic polyester film.