JP2007087223A - Non-contact data carrier inlet and manufacturing method thereof, non-contact data carrier inlet roll and manufacturing method thereof, and non-contact data carrier and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a non-contact data carrier inlet that has a module substrate having an antenna coil and an IC chip on each surface of the non-contact data carrier, and achieves improved usability by providing functions of two non-contact data carriers and manufacturing method thereof, non-contact data carrier inlet roll and manufacturing method thereof, and non-contact data carrier and manufacturing method thereof. <P>SOLUTION: The non-contact data carrier 40 is configured by stacking module substrates 20 in which an antenna coil A and an IC chip C for transmitting/receiving information through the antenna coil A are disposed on an electric insulating substrate, on both sides of a magnetic body layer 30 in an integrated manner and has functions of two non-contact data carriers. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a non-contact type data carrier that communicates information in a non-contact manner, a non-contact type data carrier inlet that is a component of the non-contact type data carrier, and a base material in which a plurality of non-contact type data carrier inlets are roll-shaped The present invention relates to a non-contact type data carrier inlet roll provided in the above and a manufacturing method thereof.

A conventional non-contact type data carrier includes a non-contact type data carrier inlet having an antenna coil capable of communicating in a predetermined frequency band (see, for example, Patent Document 1). When using this conventional non-contact type data carrier, the user has a non-contact type data carrier for each application.
JP 2000-137777 A

  As described above, when using a conventional non-contact type data carrier, the user has to have a non-contact type data carrier for each application, which is inconvenient.

  In a conventional non-contact type data carrier, for example, two non-contact type data carrier inlets having antenna coils communicating in different frequency bands are arranged side by side, or the other is arranged in one antenna coil. Thus, a non-contact type data carrier can be considered.

  However, in the non-contact type data carrier, for example, since the size of the card-shaped one is determined, as described above, when the non-contact type data carriers of different frequency bands are arranged side by side, etc. There are restrictions on the layout area. Furthermore, since the non-contact type data carriers are arranged side by side in a predetermined installation area, the coil diameter of the non-contact type data carrier is reduced, and the operating distance may be shortened depending on conditions.

  Therefore, the present invention has been made to solve the above problems, and includes a module substrate having an individual antenna coil and an IC chip on both surfaces of a non-contact type data carrier, for arranging the antenna coil and the like. A non-contact type data carrier inlet, a non-contact type data carrier inlet roll, and a non-contact type data carrier that can effectively secure an area and can improve usability by providing two non-contact type data carrier functions. An object of the present invention is to provide a method for producing a non-contact type data carrier inlet, a method for producing a non-contact type data carrier inlet roll, and a method for producing a non-contact type data carrier.

  In order to achieve the above object, a non-contact type data carrier inlet according to the present invention includes an antenna coil and an IC chip that transmits and receives information via the antenna coil on an electrically insulating substrate. The module substrate is integrally laminated on both surfaces of the magnetic layer.

  According to this non-contact type data carrier inlet, since the two module substrates are arranged via the magnetic layer, the magnetic field for transmission / reception of the reader / writer introduced from one side passes through the magnetic layer, It is guided to the side where the gas is introduced, and the influence on the other side can be suppressed.

  In addition, the non-contact type data carrier inlet according to the present invention includes a module substrate in which an antenna coil and an IC chip that transmits and receives information are arranged on an electrically insulating substrate. It is characterized by being integrally laminated on both sides of a magnetic layer module in which a magnetic layer is formed on both sides of a substrate.

  According to this non-contact type data carrier inlet, the two module substrates are arranged via the magnetic layer module in which the magnetic layer is formed on both surfaces of the metal substrate, so that the reader / writer introduced from one side The transmission / reception magnetic field is guided to the introduced side through the magnetic layer, and is blocked by the metal substrate, so that the influence on the other side can be prevented.

  Alternatively, a non-contact type data carrier inlet roll may be configured by winding a sheet in a state where a plurality of the above non-contact type data carrier inlets are provided in a roll shape. Furthermore, you may comprise a non-contact-type data carrier by covering the above-mentioned non-contact-type data carrier inlet with an exterior.

  A method for manufacturing a non-contact type data carrier inlet according to the present invention includes a first module substrate in which an antenna coil and an IC chip that transmits and receives information via the antenna coil are disposed on an electrically insulating substrate. A first magnetic layer forming step of forming a first magnetic layer on one surface of the substrate, an antenna coil on the electrically insulating substrate on the first magnetic layer, and the antenna coil And a second module substrate stacking step of stacking and integrating a second module substrate having an IC chip for transmitting and receiving information.

  According to this method for manufacturing a non-contact type data carrier inlet, a non-contact type data carrier inlet in which two module substrates are arranged via a magnetic layer can be produced. As a result, the transmission / reception magnetic field of the reader / writer introduced from one side is guided to the introduced side through the magnetic layer, and the influence on the other side can be suppressed.

  The method for manufacturing a non-contact type data carrier inlet according to the present invention includes a first magnetic layer forming step of forming a first magnetic layer on one surface of a metal substrate, and the first magnetic layer. A first module substrate on which an antenna coil and an IC chip that transmits and receives information via the antenna coil are stacked and integrated on an electrically insulating substrate. A lamination step, a second magnetic layer forming step of forming a second magnetic layer on the other surface of the metal substrate, an antenna coil on the electrically insulating substrate on the second magnetic layer And a second module substrate laminating step for laminating and integrating a second module substrate having an IC chip for transmitting and receiving information via the antenna coil.

  According to this non-contact type data carrier inlet manufacturing method, a non-contact type data carrier inlet in which two module substrates are arranged via a magnetic layer module in which a magnetic layer is formed on both surfaces of a metal substrate is produced. be able to. Accordingly, the transmission / reception magnetic field of the reader / writer introduced from one side is guided to the introduced side through the magnetic layer and is blocked by the metal substrate, thereby preventing the influence on the other side. be able to.

  Also, a non-contact type data carrier inlet roll is produced by winding a sheet with a plurality of non-contact type data carrier inlets manufactured by the above-described non-contact type data carrier inlet manufacturing method into a roll. May be. Further, the non-contact type data carrier may be manufactured by covering the non-contact type data carrier inlet manufactured by the above-described non-contact type data carrier inlet manufacturing method with an exterior.

  Non-contact type data carrier inlet, non-contact type data carrier inlet roll, non-contact type data carrier, non-contact type data carrier inlet manufacturing method, non-contact type data carrier inlet roll manufacturing method, and non-contact type data carrier According to this manufacturing method, the module substrate having the individual antenna coils and the IC chip is provided on both surfaces of the non-contact type data carrier, and an area for arranging the antenna coils can be effectively secured. Usability can be improved by providing the functions of two non-contact data carriers.

  The best mode for carrying out the present invention will be described below with reference to the drawings.

(First embodiment)
FIG. 1 is a plan view showing one side surface side of a non-contact type data carrier inlet 10 according to the first embodiment of the present invention. 2 is a plan view showing one surface side of the module substrate 20 provided with the antenna coil A and the IC chip C constituting the non-contact type data carrier inlet 10, and FIG. 3 is one side surface of the module substrate 20. FIG. 4 is a plan view showing the other surface side of the module substrate 20 including the antenna coil A and the IC chip C constituting the non-contact type data carrier inlet 10. FIG. 5 is a block diagram functionally showing the configuration of the non-contact data carrier inlet 10. Furthermore, FIG. 6 is a plan view showing one surface side of a non-contact type data carrier 40 configured by covering the non-contact type data carrier inlet 10 according to the first embodiment with an exterior, and FIG. 6 is a cross-sectional view from one side of the non-contact data carrier 40 of FIG.

  2 and 4, the conductor pattern including the antenna coil A is shown by hatching, and the hatching inclination direction between the conductor pattern formed on the front surface and the conductor pattern formed on the back surface thereof is shown. Change and distinguish.

  As shown in FIG. 1, the non-contact type data carrier inlet 10 is configured by integrally stacking a module substrate 20 on both surfaces of a magnetic layer 30.

  2 to 5, the module substrate 20 is connected in parallel to the antenna coil A on the base film P1, the antenna coil A formed on the base film P1, and the base film P1. A plurality of static patterns are connected to the pair of connection patterns 21a and 21b, the IC chip C mounted on the base film P1, and the pair of connection patterns 21a and 21b, respectively, and are paired via the base film P1. The capacitance adjustment patterns 22a, 22b, 23a, 23b, 24a, 24b, 25a, and 25b are mainly provided.

  The base film P1 is a base material having electrical insulating properties, and is made of, for example, PET (polyethylene terephthalate). In addition to this, for example, phenol resin, urea resin, melamine resin, polytetrafluoro It can also be composed of ethylene, polyethylene, polypropylene, polystyrene, polyethersulfone, polyphenylene sulfide, PBT, polyarylate, silicon resin, diallyl phthalate, polyimide, and the like. Here, although the base film P1 is formed in the rectangle, it is not restricted to this shape.

  The antenna coil A is formed by making multiple turns on one surface 26a of the base film P1. Further, the pair of connection patterns 21a and 21b are respectively connected to the antenna coil A on the base film P1, and are respectively extended on one surface 26a and the other surface 26b of the base film P1. Specifically, one end portion 27a of the antenna coil A is connected to the proximal end portion of one connection pattern 21a, and one of the connection bumps 28 of the IC chip C is further connected to this portion.

  On the other hand, the other end portion 27b of the antenna coil A is connected to one end portion of a jumper wire (inter-terminal connection pattern) Y wired on the other surface 26b of the base film P1 through the crimping portion 29a. The other end portion of the jumper wire Y is connected to the base end portion of the wiring pattern 29c wired on the one surface 26a of the base film P1 through the crimping portion 29b. The other end of the connection bump 28 of the IC chip C is connected to the tip of the wiring pattern 29c. Further, the other end of the jumper wire Y is connected to the base end of the connection pattern 21b on the other surface 26b of the base film P1.

  The capacitance adjustment patterns 22a, 22b, 23a, 23b, 24a, 24b, 25a, and 25b are paired so as to face the one surface 26a and the other surface 26b with the base film P1 interposed therebetween. , Formed at each tip of the connection patterns 21a, 21b. Each of the pair of capacitance adjustment patterns 22a, 22b, 23a, 23b, 24a, 24b, 25a, and 25b is formed in a substantially circular shape, and functions as a capacitor pattern. 23, 24 and 25 function. Here, the shape of each pair of capacitance adjustment patterns 22a, 22b, 23a, 23b, 24a, 24b, 25a, and 25b is substantially circular, but this shape is not particularly limited and is rectangular. (Rectangle) shape etc. may be formed.

  In addition, the above-described IC chip C is mounted with a capacitor 15 and the like in addition to a rewritable nonvolatile memory and an RF circuit for wireless communication that do not require power supply backup (see FIG. 5). As described above, the antenna coil A, the capacitor 15 in the IC chip C, and the capacitance adjustment patterns 22a, 22b, 23a, 23b, 24a, 24b, 25a, and 25b, which are respectively connected on the base film P1, are shown in FIG. As shown in FIG. 4, the resonance circuit of the entire antenna is configured.

  Here, by removing at least one of the capacitance adjustment patterns 22a, 22b, 23a, 23b, 24a, 24b, 25a, 25b, the capacitance adjustment patterns 22a, 22b, 23a, 23b, 24a, The functions of the capacitors 24b, 25a, and 25b can be removed, and the capacitance can be adjusted. Also, for example, the capacitance can be adjusted by removing a part of the connection patterns 21a and 21b and disconnecting them. In this case, the same effect as that obtained when all of the capacitance adjustment patterns 22a, 22b, 23a, 23b, 24a, 24b, 25a, and 25b are removed can be obtained. In the present embodiment, a mode in which a frequency approximate to 13.56 MHz, which is an example of the target value of the resonance frequency, is obtained without removing any set of capacitance adjustment patterns. Moreover, the set value of the resonance frequency is not limited to 13.56 MHz.

  Here, the module substrate 20 including the capacitance adjustment patterns 22a, 22b, 23a, 23b, 24a, 24b, 25a, and 25b has been described as an example of the module substrate. However, the present invention is not limited to this configuration. . For example, it may have a configuration including an antenna coil and an IC chip C that transmits and receives information via the antenna coil on the base film without having the capacitance adjustment pattern. That is, the configuration of the module substrate is not particularly limited, and includes a configuration that includes at least an antenna coil and an IC chip C that transmits and receives information via the antenna coil and can communicate in a predetermined frequency band. What is necessary is just to have.

  Further, the module substrate 20 laminated on both surfaces of the magnetic layer 30 may be configured with an antenna coil or the like so as to be able to communicate with each other in different frequency bands. A coil etc. may be comprised and it sets suitably so that it may suit a use. Further, in the module substrate 20, the side on which the magnetic layer 30 is formed is not particularly limited, but considering the attenuation of the electromagnetic wave in the base film P1, the base is such that the electromagnetic wave is introduced from the antenna side. The magnetic layer 30 is preferably formed on the other surface 26b of the material film P1.

  The magnetic layer 30 is made of a magnetic material having a high magnetic permeability. Specifically, as the magnetic material, Mn—Mg—Zn ferrite, Mn—Zn ferrite, Ni—Zn ferrite, hexagonal ferrite, and the like are suitable. is there. Further, in the formation of the magnetic layer 30, a paste in which a magnetic powder such as ferrite described above and a resin binder are mixed may be used. This resin binder is mainly composed of a thermoplastic resin, and if necessary, coupling agents such as silane, titanate and aluminum which improve the affinity between the magnetic powder and the resin, phthalic acid and sulfone which improve the fluidity of the resin. Acidic, phosphoric acid and epoxy plasticizers, stearic acid, stearates, fatty acid amides, waxes and other lubricants that increase the fluidity of the mixture, and hindered phenols to prevent oxidation of fillers, sulfur Those to which antioxidants such as those based on phosphorus and phosphorus are appropriately added are suitable.

  Here, among the magnetic materials described above, for example, when a magnetic material having a high electrical resistance such as Ni—Zn ferrite is used, it can be made to act as an insulating member. A structure in which the layer 30 is directly laminated can be employed. On the other hand, when using a magnetic material having a relatively low electrical resistance, such as Mn—Zn ferrite, for example, the module substrate 20 is laminated on both surfaces of the magnetic material layer 30 via an electrical insulating layer, for example. .

  As shown in FIGS. 6 and 7, the non-contact type data carrier 40 is configured by covering the non-contact type data carrier inlet 10 with an exterior. In this embodiment, by using a pair of protective films 41a and 41b made of a rectangular vinyl chloride resin, a non-contact type data carrier inlet 10 is laminated (card) so as to be sandwiched from both sides, whereby a card-type non-sticking is performed. A contact data carrier 40 is configured.

  In FIG. 7, the jumper lines Y of the module substrate 20 face each other with the magnetic layer 30 interposed therebetween. However, the present invention is not limited to this configuration. You may comprise so that the line Y may not oppose.

  Here, in addition to the card-type form, for example, a pouch-type non-contact data carrier obtained by pouching, a label type provided with an adhesive layer obtained by labeling or a release paper covering it Non-contact type data carrier of high temperature resistance obtained by processing molded products using so-called engineering plastics such as PPS (polyphenylene sulfide) and PSF (polysulfone) Can also be configured.

  Next, a manufacturing method of the above-described non-contact type data carrier inlet 10 will be described with reference to the drawings. Here, a method of manufacturing the non-contact type data carrier inlet 10 that does not form the capacitance adjustment patterns 22a, 22b, 23a, 23b, 24a, 24b, 25a, and 25b will be described.

  First, a method for manufacturing the module substrate 20 which is a component of the non-contact type data carrier inlet 10 will be described with reference to FIGS. 8a to 8g, FIGS. 9a and 9b.

  FIGS. 8a to 8g schematically show basic manufacturing steps of the module substrate 20, and FIGS. 9a and 9b schematically show a manufacturing apparatus used in the manufacturing steps of FIGS. 8a to 8g. .

  First, as shown in FIG. 8a and FIG. 9a, for example, a PET film R1 made of PET having a thickness of about 30 to 40 [mu] m is rolled out from a PET roll R1 by a roll-off roller 50, and the base film P1 Starts continuous delivery.

  Subsequently, as shown in FIG. 8b and FIG. 9a, rolls 52a, 52b in which adhesive sheets S1, S2 are wound on both side surfaces of the fed base film P1 using adhesive rollers 51a, 51b and The adhesive sheet and the metal sheet are pulled out from the rolls 53a and 53b around which the metal sheets K1 and K2 such as copper are wound, and the metal sheets K1 and K2 are attached via the adhesive sheets S1 and S2.

  Further, as shown in FIGS. 8c and 9a, a resist T is printed using rollers 54a and 54b at predetermined positions on the metal sheets K1 and K2 respectively attached to both surfaces of the base film P1.

  Subsequently, as shown in FIGS. 8d and 9a, the base film P1 on which the resist T is printed on the metal sheets K1 and K2 is guided to the etching tank 55 and subjected to an etching process.

  Subsequently, as shown in FIGS. 8E and 9A, the resist T is cleaned and removed in the resist cleaning / drying chamber 56. As a result, as shown in FIG. 8e, the antenna coil A is formed on one surface 26a, and the jumper line Y is formed on the other surface 26b.

  Subsequently, as shown in FIG. 8f and FIG. 9a, the other end portion 27b of the antenna coil A of the base film P1 on which the antenna coil A and the jumper wire Y are formed by the caulking machine 57 is passed through the caulking portion 29a. Then, it is connected to one end of a jumper wire (inter-terminal connection pattern) Y wired on the other surface 26b of the base film P1. Further, the base end portion of the wiring pattern 29c of the base film P1 is connected to the other end portion of the jumper wire Y through the crimping portion 29b.

  In this manner, the base film P1 in which the jumper wire Y is connected to a predetermined part of the antenna coil A is wound up by the winding roller 58 to form the antenna roll R2.

  Subsequently, as shown in FIGS. 8g and 9b, continuous feeding of the base film P1 in which the antenna coil A and the jumper wire Y are conducted by the unwinding roller 59 from the antenna roll R2 is started. Then, the IC chip C is disposed on the formed surface side of the antenna coil A on the fed base film P1 by the mounting device 60, and the IC chip C is crimped and mounted by the crimping device 61.

  Further, as shown in FIG. 9b, the base film P1 on which the IC chip C is mounted is taken up by the take-up roller 62 to form a module substrate roll R3 in which a plurality of module substrates 20 are arranged vertically and horizontally.

  The method for manufacturing the module substrate roll R3 described above is an example, and is not limited to this. For example, in the manufacturing method described above, the metal sheets K1 and K2 for forming the antenna coil A and the jumper wire Y are attached to the base film P1 via the adhesive sheets S1 and S2. Metal sheets K1 and K2 may be bonded to P1, or after forming a base by sputtering, a metal layer may be formed using a plating tank. Furthermore, when forming the antenna coil A and the jumper wire Y, for example, a screen printing method in which the antenna coil A and the jumper wire Y are formed on the base film P1 with a silver paste by silk printing may be employed.

  Next, a method for manufacturing the non-contact type data carrier inlet 10 using the module substrate roll R3 in a state where a plurality of the module substrates 20 are arranged vertically and horizontally will be described with reference to FIGS. 10a, 10b, 11a, 11b and FIG. This will be described with reference to FIG.

  FIGS. 10a and 10b schematically show a basic manufacturing process of the non-contact type data carrier inlet 10, and FIGS. 11a and 11b schematically show a manufacturing apparatus used in the manufacturing process of FIGS. 10a and 10b. FIG. FIG. 12 is a view showing a state in which a plurality of non-contact type data carrier inlets 10 in the non-contact type data carrier inlet roll R4 are arranged vertically and horizontally.

  As shown in FIGS. 10a and 11a, the module substrate 20 is continuously fed out by the unwinding roller 70 from the module substrate roll R3.

  Subsequently, the magnetic material layer 30 is formed on one surface of the delivered module substrate 20 by the magnetic material coating device 71 provided with calendar rollers 71a and 71b.

  Subsequently, as shown in FIG. 11 a, the thickness of the magnetic layer 30 is adjusted to, for example, about 100 to 250 μm by the pressure device 72.

  Subsequently, as shown in FIGS. 10b and 11a, the module substrate 20 is continuously fed from the module substrate roll R3 by the unwinding roller 73, and the module is placed on the magnetic layer 30 whose thickness is adjusted by the roller 74. The substrate 20 is guided and laminated.

  Subsequently, the stacked body in which the two module substrates 20 are stacked through the magnetic layer 30 is guided to the drying furnace 75, and the magnetic layer 30 is dried.

  As shown in FIG. 11a, the laminate obtained by drying the magnetic layer 30, that is, the non-contact type data carrier inlet 10 is wound up by a winding roller 76 to form a non-contact type data carrier inlet roll R4. . At this time, the roll length of the formed non-contact type data carrier inlet roll R4 is, for example, about 5 to 500 m. In this way, a non-contact type data carrier inlet roll R4 in a state where a plurality of non-contact type data carrier inlets 10 are arranged vertically and horizontally as shown in FIG. 12 is formed.

  Next, as shown in FIG. 11b, continuous feeding of sheets in a state in which a plurality of non-contact data carrier inlets 10 are arranged vertically and horizontally is started by the unwinding roller 80 from the non-contact data carrier inlet roll R4. .

  Subsequently, the fed sheet is cut into a predetermined size by using a cutting device 81 with a predetermined position as a reference, and the non-contact type data carrier inlet 10 is manufactured. The sheet after the non-contact type data carrier inlet 10 has been punched is wound up by the collection roller 82 and becomes the collection roll R5.

  Here, the manufacturing method of the non-contact type data carrier inlet 10 of the type that does not form the capacitance adjustment patterns 22a, 22b, 23a, 23b, 24a, 24b, 25a, 25b has been described. 22b, 23a, 23b, 24a, 24b, 25a, 25b and connection patterns 21a, 21b can be formed by the same method in the process of forming the antenna coil A and the jumper wire Y.

  As described above, according to the non-contact type data carrier inlet 10 and the non-contact type data carrier 40 of the first embodiment, the module substrate 20 having the individual antenna coils A and IC chips C on both sides is provided, An area for arranging the antenna coil A and the like can be effectively secured. Further, by providing the functions of two non-contact data carriers, for example, it is possible to change the usage of information on the front side and the back side and to improve usability.

  Furthermore, since the two module substrates 20 are arranged via the magnetic layer 30, the transmission / reception magnetic field of the reader / writer introduced from one side passes through the magnetic layer 30 to the introduced side. Will be guided and will have little effect on the other side. As a result, the functions as two independent non-contact data carriers can be used effectively.

(Second Embodiment)
FIG. 13 is a plan view showing one side surface side of the non-contact type data carrier inlet 100 according to the second embodiment of the present invention. FIG. 14 is a cross-sectional view from one side of a non-contact type data carrier 130 configured by covering the non-contact type data carrier inlet 100 according to the second embodiment with an exterior. In addition, the same code | symbol is attached | subjected to the component same as the non-contact-type data carrier inlet 10 and the non-contact-type data carrier 40 which concern on 1st Embodiment, and the overlapping description is simplified or abbreviate | omitted.

  As shown in FIG. 13, the non-contact type data carrier inlet 100 is configured by integrally laminating a module substrate 20 on both surfaces of a magnetic layer module 120 in which a magnetic layer 30 is formed on both surfaces of a metal sheet 110. Has been.

  The metal sheet 110 functions as a metal substrate and is made of, for example, a conductive material such as iron, aluminum, and stainless steel, and has a thickness of about 10 to 100 μm.

  Further, as shown in FIG. 14, the non-contact type data carrier 130 is configured by covering the non-contact type data carrier inlet 100 with an exterior. In the present embodiment, by using a pair of protective films 131a, 131b made of rectangular vinyl chloride resin, a non-contact type data carrier inlet 100 is laminated (card) so as to be sandwiched from both sides, whereby a card-type non-stick A contact data carrier 130 is configured.

  In FIG. 14, the jumper lines Y of the module substrate 20 are opposed to each other through the magnetic layer module 120. However, the present invention is not limited to this configuration. You may comprise so that the jumper line Y may not oppose.

  Here, in addition to the card-type form, for example, a pouch-type non-contact data carrier obtained by pouching, a label type provided with an adhesive layer obtained by labeling or a release paper covering it Non-contact type data carrier of high temperature resistance obtained by processing molded products using so-called engineering plastics such as PPS (polyphenylene sulfide) and PSF (polysulfone) Can also be configured.

  Next, a method for manufacturing the non-contact type data carrier inlet 100 using the module substrate roll R3 in which a plurality of module substrates 20 are arranged vertically and horizontally will be described with reference to FIGS. 15a to 15d, FIGS. 16a and 16b. I will explain. The method for manufacturing the module substrate 20 is as described in the first embodiment. In addition, here, the module substrate roll R3 shows a case where the non-contact type data carrier inlet 10 of the type in which the capacitance adjustment patterns 22a, 22b, 23a, 23b, 24a, 24b, 25a, and 25b are formed is used. ing.

  15a to 15d are diagrams schematically showing a basic manufacturing process of the non-contact type data carrier inlet 100, and FIGS. 16a and 16b schematically show a manufacturing apparatus used in the manufacturing process of FIGS. 15a to 15d. FIG.

  As shown in FIG. 16a, continuous feeding of the metal sheet 110 is started by the unwinding roller 150 from the metal sheet roll R6 around which the metal sheet 110 is wound.

  Subsequently, as shown in FIGS. 15a and 16a, a magnetic layer 30 is formed on one surface of the fed metal sheet 110 by a magnetic body coating apparatus 151 provided with calendar rollers 151a and 151b.

  Subsequently, as shown in FIG. 16 a, the thickness of the magnetic layer 30 is adjusted to, for example, about 100 to 250 μm by the pressurizing device 152.

  Subsequently, as shown in FIGS. 15b and 16a, the module substrate 20 is continuously fed from the module substrate roll R3 by the unwinding roller 153, and the module is placed on the magnetic layer 30 whose thickness is adjusted by the roller 154. The substrate 20 is guided and laminated.

  Subsequently, the laminate in which the metal sheet 110 and the module substrate 20 are laminated via the magnetic layer 30 is guided to the drying furnace 155, and the magnetic layer 30 is dried.

  As shown in FIG. 16a, the laminated body from which the magnetic layer 30 has been dried is wound up by a winding roller 156 to form a non-contact type data carrier inlet constituting member roll R7. In addition, when winding a laminated body with the winding roller 156, it winds up so that the metal sheet 110 side may become an outer side.

  Next, as shown in FIG. 16 b, a continuous layered structure in which the metal sheet 110 and the module substrate 20 are laminated via the magnetic layer 30 by the unwinding roller 160 from the non-contact type data carrier inlet constituting member roll R <b> 7. Start a typical delivery. Since the non-contact type data carrier inlet constituting member roll R7 is wound so that the metal sheet 110 side is on the outer side, the upper side becomes the metal sheet 110 when the laminate is fed by the unwinding roller 160.

  Subsequently, as shown in FIGS. 15 c and 16 b, the magnetic layer 30 is formed on the fed metal sheet 110 of the laminated body by the magnetic body coating device 161 provided with calendar rollers 161 a and 161 b.

  Subsequently, as shown in FIG. 16 b, the thickness of the magnetic layer 30 is adjusted to, for example, about 100 to 250 μm by the pressure device 162.

  Subsequently, as shown in FIG. 15d and FIG. 16b, the module substrate 20 is continuously fed out from the module substrate roll R3 by the unwinding roller 163, and the module is placed on the magnetic layer 30 whose thickness is adjusted by the roller 164. The substrate 20 is guided and laminated.

  Subsequently, the laminate in which the module substrate 20 is further laminated via the magnetic layer 30 is guided to the drying furnace 165, and the magnetic layer 30 is dried.

  As shown in FIG. 16b, the laminate from which the magnetic layer 30 has been dried, that is, the non-contact type data carrier inlet 100 is wound up by a take-up roller 166 to form a non-contact type data carrier inlet roll R8. To do. Under the present circumstances, the roll length of the non-contact-type data carrier inlet structural member roll R7 formed is about 5-500 m, for example. In addition, the non-contact type data carrier inlet roll R8 formed in this way has a plurality of non-contact type data carrier inlets 100 vertically and horizontally as shown in FIG. 12, as in the case of the non-contact type data carrier inlet 10. It is in a state of being arranged.

  In the subsequent steps, each non-contact type data carrier inlet 100 described in the first embodiment with reference to FIG. 11b is cut by the cutting device 51 into a predetermined size with reference to a predetermined position. Is done. As a result, a single contactless data carrier inlet 100 is produced.

  As described above, according to the non-contact type data carrier inlet 100 and the non-contact type data carrier 130 of the second embodiment, the module substrate 20 having the individual antenna coils A and IC chips C on both sides is provided, An area for arranging the antenna coil A and the like can be effectively secured. Further, by providing the functions of two non-contact data carriers, for example, it is possible to change the usage of information on the front side and the back side and to improve usability.

  Further, since the two module substrates 20 are arranged via the magnetic layer module 120 in which the magnetic layer 30 is formed on both surfaces of the metal sheet 110, the magnetic field for transmission / reception of the reader / writer introduced from one side is In addition to being guided to the introduced side through the magnetic layer 30, it is blocked by the metal sheet 110 and does not affect the other side. As a result, the functions as two independent non-contact data carriers can be used effectively.

  Further, the transmission / reception magnetic field of the reader / writer introduced from one side is guided to the introduced side through the magnetic layer 30, so that even if the metal sheet 110 as a conductor is provided, the metal sheet 110 is provided. Generation of eddy currents inside can be suppressed. As a result, problems such as poor response to the reader / writer caused by the generation of eddy current can be avoided.

  Although the present invention has been specifically described with reference to the first and second embodiments, the present invention is not limited to these embodiments, and various modifications can be made without departing from the scope of the present invention. .

  For example, in the above-described embodiment, the calender roll is used to form the magnetic layer, but instead, the magnetic layer may be formed using a coating apparatus that can drop the magnetic material. The magnetic layer may be formed using electrostatic coating or the like.

  Further, a jumper wire (inter-terminal connection pattern) in which the other end portion 27b of the antenna coil A of the base film P1 on which the antenna coil A and the jumper wire Y are formed is wired on the other surface 26b of the base film P1. When connecting to one end of Y or when connecting the base end of the wiring pattern 29c of the base film P1 to the other end of the jumper wire Y, it is not limited to conducting by caulking. For example, a through hole is formed, and a conductive layer is formed on the inner wall surface of the through hole by sputtering or the like so that the one surface 26a side and the other surface 26b side of the base film P1 are electrically connected. Also good.

  Furthermore, in the first and second embodiments described above, an example in which the electromagnetic induction method including the antenna coil A is adopted for the non-contact type data carrier inlet and the non-contact type data carrier is shown. You may employ | adopt the radio wave system provided with the dipole antenna etc. for the non-contact-type data carrier inlet or the non-contact-type data carrier.

The top view which shows one side surface side of the non-contact-type data carrier inlet which concerns on the 1st Embodiment of this invention. The top view which shows the one surface side of the module board provided with the antenna coil and IC chip which comprise the non-contact-type data carrier inlet of FIG. Sectional drawing from the one side surface in the module board of FIG. The top view which shows the other surface side of the module board provided with the antenna coil and IC chip which comprise the non-contact-type data carrier inlet of FIG. The block diagram which shows the structure of a non-contact-type data carrier inlet functionally. The top view which shows the one surface side of the non-contact-type data carrier comprised by covering the non-contact-type data carrier inlet of FIG. 1 with an exterior. Sectional drawing from the one side surface side in the non-contact-type data carrier of FIG. Sectional drawing for demonstrating the process for manufacturing a module board | substrate. Sectional drawing for demonstrating the process for manufacturing a module board | substrate. Sectional drawing for demonstrating the process for manufacturing a module board | substrate. Sectional drawing for demonstrating the process for manufacturing a module board | substrate. Sectional drawing for demonstrating the process for manufacturing a module board | substrate. Sectional drawing for demonstrating the process for manufacturing a module board | substrate. Sectional drawing for demonstrating the process for manufacturing a module board | substrate. FIG. 9 is a diagram schematically showing an apparatus for carrying out the manufacturing process shown in FIGS. 8a to 8f. FIG. 8 is a diagram schematically showing an apparatus for performing the manufacturing process shown in FIG. 8g. Sectional drawing for demonstrating the process for manufacturing the non-contact-type data carrier inlet of FIG. Sectional drawing for demonstrating the process for manufacturing the non-contact-type data carrier inlet of FIG. FIG. 10 is a diagram schematically showing an apparatus for performing the manufacturing process shown in FIGS. 10 a and 10 b. FIG. 10 is a diagram schematically showing an apparatus for performing the manufacturing process shown in FIGS. 10 a and 10 b. The top view which shows the produced non-contact-type data carrier inlet roll. The top view which shows one side surface side of the non-contact-type data carrier inlet which concerns on the 2nd Embodiment of this invention. The top view which shows the one surface side of the non-contact-type data carrier comprised by covering the non-contact-type data carrier inlet of FIG. 13 with an exterior. Sectional drawing for demonstrating the process for manufacturing the non-contact-type data carrier inlet of FIG. Sectional drawing for demonstrating the process for manufacturing the non-contact-type data carrier inlet of FIG. Sectional drawing for demonstrating the process for manufacturing the non-contact-type data carrier inlet of FIG. Sectional drawing for demonstrating the process for manufacturing the non-contact-type data carrier inlet of FIG. The figure for showing roughly the device for carrying out the manufacturing process shown in Drawing 15a-Drawing 15d. The figure for showing roughly the device for carrying out the manufacturing process shown in Drawing 15a-Drawing 15d.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 ... Non-contact-type data carrier inlet, 20 ... Module board | substrate, 21a, 21b ... Connection pattern, 22, 23, 24, 25 ... Capacitor, 22a, 22b, 23a, 23b, 24a, 24b, 25a, 25b ... Electrostatic capacity Adjustment pattern, 26a ... one surface, 26b ... the other surface, 27a ... one end, 28 ... connection bump, 29a ... caulking portion, 30 ... magnetic layer, 40 ... non-contact data carrier, 41a, 41b ... protective film A ... Antenna coil, C ... Chip, 30 ... Magnetic layer, P1 ... Base film, Y ... Jumper wire.

Claims (11)

  A module substrate in which an antenna coil and an IC chip for transmitting / receiving information via the antenna coil are disposed on an electrically insulating substrate is integrally laminated on both surfaces of a magnetic layer. Non-contact data carrier inlet.   A module substrate comprising an antenna coil and an IC chip that transmits and receives information via the antenna coil on an electrically insulating substrate, and a magnetic layer in which a magnetic layer is formed on both surfaces of a metal substrate A non-contact type data carrier inlet characterized by being integrally laminated on both sides of a module. The module substrate is
A pair of antennas connected to the antenna coil and extending on one main surface of the substrate on which the antenna coil and the IC chip are disposed and on the other main surface opposite to the one main surface Connection pattern,
At least a part of the pattern formed on the one or the other main surface, respectively connected to the pair of connection patterns on the one and the other main surfaces and provided to face each other via the module substrate, or The non-contact type data carrier inlet according to claim 1, further comprising a capacitance adjustment pattern capable of adjusting capacitance adjustment by removing a part of the connection pattern. The module substrate is
A pair of antennas connected to the antenna coil and extending on one main surface of the substrate on which the antenna coil and the IC chip are disposed and on the other main surface opposite to the one main surface Connection pattern,
At least a part of the capacitance adjustment pattern that is connected to the pair of connection patterns on the one and other main surfaces and is opposed to each other through the module substrate, or a part of the connection pattern is deleted. The non-contact type data carrier inlet according to claim 1, further comprising a tuning unit.   The non-contact type data carrier inlet according to any one of claims 1 to 4, wherein the non-contact type data carrier inlet is configured to be able to communicate in different frequency bands via an antenna coil provided on each module substrate.   A non-contact type data carrier comprising: a sheet in which a plurality of the non-contact type data carrier inlets according to any one of claims 1 to 5 are disposed; Inlet roll.   A non-contact type data carrier comprising the non-contact type data carrier inlet according to any one of claims 1 to 5 covered with an exterior. A first magnetic layer is formed on one surface of a first module substrate in which an antenna coil and an IC chip that transmits and receives information via the antenna coil are disposed on an electrically insulating substrate. 1 magnetic layer forming step;
On the first magnetic layer, a second module substrate in which an antenna coil and an IC chip that transmits / receives information via the antenna coil are disposed on an electrically insulating substrate is laminated and integrated. A non-contact type data carrier inlet manufacturing method, comprising: a second module substrate stacking step. A first magnetic layer forming step of forming a first magnetic layer on one surface of the metal substrate;
On the first magnetic layer, a first module substrate is integrally formed by stacking an antenna coil and an IC chip that transmits and receives information via the antenna coil on an electrically insulating substrate. A first module substrate stacking step to be
A second magnetic layer forming step of forming a second magnetic layer on the other surface of the metal substrate;
On the second magnetic layer, a second module substrate in which an antenna coil and an IC chip that transmits and receives information are arranged on an electrically insulating substrate is laminated and integrated. A non-contact type data carrier inlet manufacturing method, comprising: a second module substrate stacking step.   A non-contact type data carrier inlet roll produced by winding a sheet having a plurality of non-contact type data carrier inlets manufactured by the method according to claim 8 in a roll shape. Production method.   A method for manufacturing a non-contact type data carrier, wherein the non-contact type data carrier inlet manufactured by the method according to claim 8 or 9 is covered with an exterior.

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